JPH0817288B2 - Manufacturing method of mobile communication antenna - Google Patents

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for manufacturing a mobile communication antenna mounted on a mobile body such as a mobile phone or a car phone.

[0002]

2. Description of the Related Art Mobile phones, car phones, and GPS
(Global Positioning System
m) An antenna used in a receiving system or the like is required to be compact and thin so as to be mounted on a moving body such as an automobile. Therefore, a printed antenna formed as a microstrip antenna is provided. This printed antenna is manufactured by using a laminated plate on which a metal foil is stretched. For example, as shown in FIG.
Through the steps shown in FIG.

That is, first, as shown in FIG. 3 (a), a laminated plate 3 in which metal foils 1 and 2 are laminated on both upper and lower surfaces is used.
The via hole 8 is provided by drilling as shown in (b). Next, this laminated plate 3 is immersed in an electroless plating bath to perform plating, thereby providing a plating layer 9 on the inner periphery of the via hole 8 as shown in FIG. , 2 are connected. Thereafter, a dry film photoresist 23 is pressed and laminated on the outer surfaces of the metal foils 1 and 2 and exposed and developed to obtain the structure shown in FIG.
As shown in (d), the dry film photoresist 23
The dry film photoresist 23 covering the portions of the metal foils 1 and 2 to be etched is dissolved and removed. Then, by etching this, as shown in FIG. 3E, the portions of the metal foils 1 and 2 not covered with the dry film photoresist 23 are dissolved and removed, and patterning is performed. In this way, the ground pattern layer 4 can be provided on the upper surface of the laminated plate 3 and the circuit pattern layer 10 can be provided on the lower surface thereof. Next, the ground pattern layer 4
A plurality of prepregs 5 and metal foils 6 are placed on the top of FIG. 4 (a).
As shown in FIG. 4B, the multi-layer laminated plate 7 in which the metal foils 6 are laminated with the insulating adhesive layer 12 by the prepreg 5 can be prepared by stacking and heating and pressurizing as described above. Thereafter, a dry film photoresist (not shown) is laminated on the surface of the metal foil 6 in the same manner as described above, and is exposed and developed.
Patterning is performed by subjecting the patch antenna element layer 11 to a pattern as shown in FIG.
To form. At this time, a dry film resist (not shown) is laminated on the entire surface of the circuit pattern layer 10 so as not to be subjected to the etching action. Then, as shown in FIG. 4D, a power feed pin hole 25 is provided in the central portion so as to vertically penetrate therethrough, and the power feed pin is attached to the power feed pin hole 25 and the semiconductor is formed on the circuit pattern layer 10. A mobile communication antenna can be finished by mounting a circuit component such as a chip.

[0004]

However, in manufacturing the antenna for mobile communication as described above, the close contact between the earth pattern layer 4 formed of the metal foil 1 and the insulating adhesive layer 12 formed by the prepreg 5. There is a problem that the force is low and delamination is likely to occur at this portion. The reason for this is considered as follows. That is, the copper foil generally used as the metal foil 1 is subjected to a copper-zinc alloy treatment or the like to have an uneven surface treatment for enhancing the adhesion to the resin. After forming the plating layer 9 as shown in FIG. 3C after the dawn, the surface of the metal foil 1 is also plated and the surface of the metal foil 1 is covered with the plating layer. It is considered that the surface of the metal sheet becomes smooth and the adhesive force to the resin is reduced, so that peeling between the ground pattern layer 4 and the insulating adhesive layer 12 due to the metal foil 1 easily occurs.

The present invention has been made in view of the above points, and a mobile communication antenna capable of preventing the peeling from occurring by preventing a decrease in the adhesion between the ground pattern layer and the insulating adhesive layer. It is an object of the present invention to provide a manufacturing method of.

[0006]

A method for manufacturing an antenna for mobile communication according to the present invention comprises a first laminated plate 3 formed by laminating a first metal foil 1 and a second metal foil 2 on both sides. The metal foil 1 of is processed by etching to form the earth pattern layer 4,
The third metal foil 6 is laminated on the ground pattern layer 4 of the laminate 3 with the prepreg 5 interposed therebetween and laminated to form a multilayer laminate 7 in which the third metal foil 6 is laminated with the insulating adhesive layer 12 formed by the prepreg 5. And drilling is performed to form a via hole 8 from the second metal foil 2 to the ground pattern layer 4.
After the formation, the plated layer 9 is formed on the inner circumference of the via hole 8 by etching, the second metal foil 2 is etched to form the circuit pattern layer 10, and the third metal foil 6 is etched. The patch antenna element layer 11 is formed as a result.

[0007]

The third metal foil 6 is laminated on the ground pattern layer 4 with the prepreg 5 interposed therebetween and laminated to form a multi-layer laminate 7 in which the third metal foil 6 is laminated with the insulating adhesive layer 12 by the prepreg 5. After that, a hole is processed to form a via hole 8 extending from the second metal foil 2 to the ground pattern layer 4, and then a plating process is performed to form a plated layer 9 on the inner periphery of the via hole 8. In addition, it is possible to prevent the plating solution from acting on the first metal foil 1 forming the ground pattern layer 4 during the plating process, and to prevent the adhesion of the first metal foil 1 to the resin from being lowered. it can.

[0008]

EXAMPLES The present invention will be described in detail below with reference to examples. FIG.
1 shows an example of manufacturing the antenna according to the present invention. As shown in FIG. 1 (a), a laminated plate 3 in which a first metal foil 1 is laminated on the upper surface and a second metal foil 2 is laminated on the lower surface is shown. create. As the laminated plate 3 in which the metal foils 1 and 2 are laminated,
For example, both sides prepared by laminating and molding a plurality of prepregs prepared by impregnating and drying a thermosetting resin such as epoxy resin, polyphenylene oxide, or fluororesin with glass cloth as a base material and metal foils 1, 2. A metal-clad laminate can be used. Copper foil is generally used as the metal foils 1 and 2, and it is preferable that the surface of the metal foil 1 and 2 is subjected to a concavo-convex treatment for enhancing the adhesion to the resin by, for example, copper-zinc alloy treatment. Then, a dry film photoresist 23 is pressed and laminated on the outer surface of each of the metal foils 1 and 2 of the laminated plate 3, exposed, and developed with a developing solution such as a sodium carbonate solution .
As shown in FIG. 1C, the central portion of the dry film photoresist 23 covering the first metal foil 1 is removed by dissolution,
The first metal foil 1 is etched as shown in FIG.
The ground pattern layer 4 is formed on the upper surface of the. Since the entire surface of the second metal foil 2 is covered with the dry film photoresist 23, it is not etched.

Next, a plurality of prepregs 5 and a third metal foil 6 such as a copper foil are stacked on the ground pattern layer 4 provided on the laminated plate 3 as described above as shown in FIG. 1 (d). , For example, heating and pressurizing lamination molding by two-stage formation by vacuum press at 120 ° C., 5 kg / cm ² , 10 minutes first stage condition and 185 ° C., 40 kg / cm ² , 200 minutes second stage condition. By doing so, as shown in FIG. 1 (e), a multilayer laminated plate 7 in which the third metal foil 6 is laminated by the insulating adhesive layer 12 formed by the laminated cured body of the prepreg 5 is created. As the prepreg 5, for example, one prepared by impregnating and drying a thermosetting resin such as polyphenylene oxide using a glass cloth as a base material can be used. In this way, when the multilayer laminated plate 7 is produced, since the plating process has not been performed up to this step, the plating solution does not act on the ground pattern layer 4 formed by the first metal foil 1, The adhesion of the metal foil 1 to the resin is not lowered. Therefore, the adhesion between the ground pattern layer 4 and the insulating adhesive layer 12 can be secured and the occurrence of delamination can be prevented.

After making the multi-layer laminate 7 as described above,
A via hole 8 is provided from the second metal foil 2 to the ground pattern layer 4. This via hole 8 is formed as a blind via hole that does not penetrate, and can be provided by drilling with a Z-axis control drill machine. After that, the multi-layer laminate 7 is immersed in an electroless plating bath to perform electroless plating, and a plating layer 9 such as copper plating is provided on the inner surface of the via hole 8 as shown in FIG. After that, a dry film photoresist (not shown) is laminated on the surfaces of the third metal foil 6 and the second metal foil 2 in the same manner as above, exposed and developed, and the respective metal foils 2 and 6 are exposed. Patterning is performed by etching to provide the patch antenna element layer 11 and the circuit pattern layer 10 as shown in FIG. Then, as shown in FIG. 1 (h), a hole 25 for a power feeding pin is provided by drilling or the like so as to penetrate vertically in the central portion, and the power feeding pin 16 is inserted into the hole 25 for a power feeding pin to attach the solder 27. By mounting a circuit component 28 such as a semiconductor chip on the circuit pattern layer 10, a mobile communication antenna as shown in FIG. 2 can be created.

[0011]

As described above, according to the present invention, the first metal foil of the laminated plate formed by laminating the first metal foil and the second metal foil on both sides is etched to form the ground pattern layer. Then, a third metal foil is laminated on the ground pattern layer of this laminate through a prepreg and laminated to form a multi-layer laminate in which the third metal foil is laminated with an insulating adhesive layer by the prepreg, and a hole is punched. After processing and providing a via hole from the second metal foil to the ground pattern layer, plating is performed to provide a plating layer on the inner circumference of the via hole, and the second metal foil is etched to form a circuit pattern layer. At the same time, the third metal foil was etched to form the patch antenna element layer.Therefore, the ground pattern layer was formed with an insulating adhesive layer using prepreg in the process before plating the via hole. It is possible to create a multi-layer laminated plate by laminating the metal foil of, the plating solution does not act on the first metal foil forming the ground pattern layer during the plating process, and the resin of the first metal foil It is possible to prevent the peeling from occurring by preventing the decrease in the adhesion between the ground pattern layer and the insulating adhesive layer without decreasing the adhesion.

[Brief description of drawings]

FIG. 1 shows an embodiment of the present invention, in which (a) to (h) are sectional views of respective steps.

FIG. 2 is a cross-sectional view of an antenna manufactured by the same as above.

FIG. 3 shows an example of conventional manufacturing, and (a) to (e) are cross-sectional views of respective steps of the first half.

FIG. 4 shows an example of conventional manufacturing, and FIGS. 4A to 4D are cross-sectional views of respective steps in the latter half.

[Explanation of symbols]

 1 First Metal Foil 2 Second Metal Foil 3 Laminated Plate 4 Ground Pattern Layer 5 Prepreg 6 Third Metal Foil 7 Multilayer Laminated Plate 8 Bayer Hole 9 Plating Layer 10 Circuit Pattern Layer 11 Patch Antenna Element Layer 12 Insulating Adhesive Layer

Claims (1)

[Claims] 1. A ground pattern layer is formed by etching a first metal foil of a laminate formed by laminating a first metal foil and a second metal foil on both sides to form an earth pattern layer. The third metal foil is laminated on the layer through the prepreg and laminated to form a multi-layer laminate in which the third metal foil is laminated with the insulating adhesive layer by the prepreg, and the second metal foil is punched. From the ground pattern layer to the ground pattern layer is plated and then the plating layer is formed on the inner circumference of the via hole, and the second metal foil is etched to form the circuit pattern layer and the third metal foil. A method of manufacturing an antenna for mobile communication, comprising etching to form a patch antenna element layer.