JPH08172145A - Semiconductor device and heat dissipating parts - Google Patents

Abstract

PURPOSE: To provide a semiconductor device which does not require any additional device by preventing a heat sink from being eliminated and falling off and improving the heat dissipating performance and reliability of a package and at the same time improving working efficiency when assembling a package or manufacturing the heat sink. CONSTITUTION: A semiconductor chip 2 and a sheet-shaped heat sink 21 consist of a package 40 which is sealed by a sealing material 3, the heat sink 21 has a first main surface, a second main surface, and a side surface between both main surfaces, a first cut-out group with a specific pattern is provided at the boundary line part between the first main surface and the side surface, a second group of cut-out 29B with a specific pattern is provided at the boundary line part between the second main surface and the side surface, and each cut-out of the first cut-out group and each cut-out 29B of the second cut-out group are provided while they are shifted by half pitch.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor chip and a heat radiating component (for example, a heat radiating plate as a heat sink: hereinafter referred to as a heat radiating plate) and a sealing material (for example, a resin having insulation and moisture resistance). The present invention relates to a semiconductor device and a heat-radiating component that are formed by a package sealed by.

[0002]

2. Description of the Related Art Conventionally, in order to improve the heat dissipation of a package of this type, a metal having good heat conductivity, such as copper or aluminum, is used as a heat dissipation plate and is sealed with a resin inside the package. This metal heat sink is called a heat sink or a heat spreader.

22 to 24 show such a heat sink 1
A semiconductor integrated circuit chip (semiconductor chip) 2 and an epoxy resin 3 etc.
(T Package) type almost rectangular package structure
10 (mold thickness is 2.7 mm) is shown.

That is, the semiconductor chip 2 mounted on the die pad 4 is wire-bonded to the inner leads 7 of the lead frame 6 (here, they are provided so as to face the four sides of the chip) by the wires 5, and the die pad 4 is heat-sunk. The whole is sealed with the resin 3 in a state of being adhered to. It should be noted that reference numeral 8 in the figure is a trace of the ejector pin at the time of resin molding.

In such a package structure, if the semiconductor chip 2 contains a self-heating device such as a linear IC for a drive, it is not enough to dissipate the heat through the lead frame 6, and the package 10 It is necessary to radiate heat directly from the die pad 4 to the outside of the package by using the heat sink 1 exposed on the outer surface of the die.

25 to 27 show a resin molding process of the package 10. The lower mold 11A of the mold 11 is provided with a recess 13 forming a part of the cavity 12 formed with the upper mold 11B, and the heat sink 1 is first set in a predetermined position in the recess 13.

Then, the die pad 4, on which the semiconductor chip 2 is mounted, the inner lead 7, and the outer lead are mounted on the upper surface of the heat sink 1 with an adhesive if necessary.
A lead frame 6 (for example, 42 alloy or the like) integrally supporting 17 is set on the lower mold 11A.

Next, the upper mold 11B is joined to the lower mold 11A, and the lead frame 6 is fixed between these two molds. In this state, a molding resin is injected into the cavity 12 under pressure from an injection port (gate) (not shown) provided in the mold 11,
A resin is transfer-molded into a shape corresponding to the cavity 12, and a semiconductor chip is molded with the resin 3 as shown in FIG. In addition, 15 and 16 in FIG. 25 are molded products (packages) after separating the upper mold 11B during this transfer molding.
Is an ejector pin used to take out from the lower mold 11A.

After this transfer molding, unnecessary portions of the lead frame 6 are removed by trimming work, and the outer leads 17 are bent as shown in FIG.
A so-called gull wing type package 10 is completed.

In the package 10 thus manufactured, the heat sink 1 in the vicinity of or in contact with the die pad 4 of the semiconductor chip 2 is exposed on the surface of the package 10, and the heat generated by the heat generation of the semiconductor chip 2 is dissipated to the outside of the package. .

The shape of the heat sink 1 is as shown in FIGS.
As illustrated in FIG. 27, the four corners of a rectangular metal plate made of copper or the like are cut into arc shapes. All the cutout portions 18 have the same shape and are used for positioning the heat sink 1 when the heat sink 1 is set in the mold.

The shape of the heat sink 1 can take various shapes depending on the structure of the package 10. But,
Since the resin sealing material 3 (generally an epoxy resin) and the heat sink 1 have different thermal expansion coefficients due to the difference in their material characteristics, the interface between the resin 3 and the heat sink 1 is affected by various thermal stresses that the package receives. Peeling (minimum gap) occurs on the surface.

For example, as shown in FIG. 28, due to the heat generated when the tip ends of the outer leads 17 of the gull wing type package 10 are connected to a printed wiring board (not shown) by solder reflow under infrared irradiation, Resin 3 and heat sink 1
The interface between the heat sink 1 and the heat sink 1 may be peeled off, the heat dissipation may be deteriorated at this peeled portion, the moisture resistance may be poor, and a crack may be generated. In some cases, the heat sink 1 may fall off from the package like a virtual line. . With this, the heat radiation performance of the package cannot be obtained, and the reliability is significantly lowered.

FIG. 29 shows an ultrasonic probe image of the package 10 (mold thickness is 2.7 mm) after soldering by the solder reflow described above. Here, the sample was as follows:

Package 10: 128-pin QFP (14.0
Semiconductor chip 2: Thermal resistance measurement chip (6.0 × 6.0 mm, 11 × 20.0 × 2.7 (t) mm)
(t) mil) Lead frame 6: Made of copper alloy (size of die pad 4:
13.50 × 9.50mm) Mount material: Epoxy resin containing silver filler (adhesive between semiconductor chip 2 and die pad 4) Mold resin 3: Epoxy type mold resin Heat sink 1: Made of copper alloy (0.5 (t) mm, Ni plating 1) ~
5 μm)

In FIG. 29, the measurement conditions A, B and C are as follows. Condition A: Thermal resistance Rθja measurement after resin molding. Condition B: 85 ° C, 60% RH (relative humidity) after resin molding
After 72 hours of moisture absorption + 215 ° C for 60 seconds, vapor phase reflow treatment is repeated 3 times (stress I) before thermal resistance R
θja measurement. Condition C: After condition B, at 85 ° C, 60% RH (relative humidity)
Heat resistance R after repeating 168 hours moisture absorption + 215 ° C for 60 seconds vapor phase reflow treatment 3 times (stress II)
θja measurement.

FIG. 29 shows ultrasonic probe images for two samples. The numbers above each image represent the thermal resistance Rθja and are defined as follows (VLSI
Packaging technology (above) "Measurement of thermal resistance", P180 ~ 19
0, see Nikkei BP), the smaller the value, the easier it is to radiate heat.

Rθja = (Tj−Ta) / Q [Unit: ° C / W] Here, Tj (° C) is the junction temperature of the semiconductor chip (measured by a thermocouple). Ta (° C) is the ambient temperature of the package (measured using electrical parameters: TSP method (Temper
ature sensitive parameter method)). Q (W) is the total power consumed in the package.

Further, the numbers shown at the bottom of each image in FIG. 29 represent the increasing rate of the thermal resistance when processed from condition A to condition B and condition C. Represents the area ratio. However, the part where the interface peeling occurs is a part that looks whitish on the image.

As is clear from the results, when the heat sink 1 is peeled off by the treatment of water absorption + heat stress (accelerated deterioration test), the heat resistance value is increased and the peeling is further promoted. is there.

[0021]

Process leading to the invention From the above, the heat sink 1
It is important to devise the shape of the heat sink so as to minimize the mechanical stress applied to the bonding interface with the mold resin 3 when repeatedly expanding and contracting due to heat during solder reflow.

The heat sink 1 is generally manufactured by punching with a die or etching. By these manufacturing methods, a heat sink for suppressing thermal stress can be realized by devising its shape and structure.

For example, as shown in FIGS. 30 and 31, when the notches 19 are formed on the four side edges of the heat sink 1 along the respective side edges and the eave-shaped ridges 20 are formed respectively, the resin mold is formed. Even if the heat sink 1 is peeled off from the resin 3 in the package, the ridge portion 20 acts as a stopper (prevention of coming off) to reduce the peeling of the heat sink 1 and prevent the heat sink 1 from falling off.

However, the heat sink 1
When changing the shape of, for example, because the symmetry of the shape in the thickness direction is lost, when the front and back are mistakenly set when set in the mold as shown in FIG. It will be molded like.

That is, the above-mentioned ridge portion 20 of the heat sink 1
Since the notch (recess) 19 is located inside the package 10 on the outer surface side thereof, the protrusion 20 does not function as the stopper described above, and the heat sink 1 is separated from the resin 3. It will be easier.

Therefore, in order to avoid this, it is necessary to set the heat sink 1 in the mold while selecting the front side and the back side, which reduces workability or detects the directionality of the front side and the back side. It is necessary to add the device. With this,
Since the number of man-hours is increased and the detection error cannot be eliminated, the generation of defective products cannot be prevented.

In addition, even at the stage of manufacturing the heat sink 1, it is necessary to specify and process the side on which the above-mentioned ridge portion 20 or the notch portion 19 is provided. This is also the same drawback as the above in terms of workability. There is.

[0028]

SUMMARY OF THE INVENTION An object of the present invention is to improve the reliability of a package by eliminating the peeling and dropping of the heat dissipation component such as the heat sink described above, and also in the assembly of the package and the production of the heat dissipation component. (EN) A semiconductor device which improves workability and does not require an additional device, and a heat dissipation component used for the same.

[0029]

That is, the present invention comprises a package in which a semiconductor chip and a heat-dissipating component (particularly a plate-shaped heat-dissipating component) are both sealed by a sealing material, and the heat-dissipating component is a first package. A first notch group having a first pattern, a second main surface, and a side surface between the two main surfaces, and having a predetermined pattern at a boundary part between the first main surface and the side surface. And a second notch group having a predetermined pattern is provided at a boundary line portion between the second main surface and the side surface, and each notch of the first notch group and the second notch group. Each of the notches relates to a semiconductor device that is arranged separately from each other.

According to the semiconductor device of the present invention, since the heat radiating component (for example, heat sink) having the first and second notch groups separated from each other on the side surface is used, this heat radiating property is used. Whichever side of each major surface of the component is facing (for example, even if the heat-dissipating component is mistakenly set on the front side and the back side and sealed), that is, set regardless of the directionality The stopper action by any of the first and second notch groups can be reliably and sufficiently exerted.

Therefore, peeling of the heat radiation component from the sealing material is surely prevented, and the heat radiation component does not fall off.
As a result, the heat radiation components can be set without selecting the front and back sides, improving the workability of the package assembly and adding a device to detect the front and back sides of the heat radiation components. You don't even have to.

Also, when manufacturing the heat-dissipating component, it is not necessary to select the front and back sides of the heat-dissipating component, and it is easy to process the unevenness by etching, stamping or the like.

Thus, when the heat radiation component is subjected to heat stress, the heat stress (mechanical stress due to heat) is alleviated by the notch group, and the heat radiation component is surely prevented from peeling and dropping. The reliability of the package can be maintained.

In the semiconductor device of the present invention, the notches of the first notch group and the notches of the second notch group of the heat-dissipating component are arranged so as to be positionally offset from each other. Is good.

Further, the first cutout group and the second cutout group of the heat radiation component are
It is preferable that the notch group and the notch group have substantially the same pattern.

Further, the first notch group and the second
It is desirable that the pattern with the group of notches is wavy and deviated from each other by a half pitch.

The first and second cutout groups of the heat-dissipating component may be formed over substantially the entire side surface of the heat-dissipating component.

It is preferable that at least one of the first cutout group and the second cutout group of the heat-dissipating component is buried inside the sealing material and fitted with this sealing material. .

The present invention also comprises a package in which a semiconductor chip and a heat-dissipating component (particularly a plate-shaped heat-dissipating component) are both sealed with a sealing material, and the heat-dissipating component has a first main surface and a second main surface. The present invention also provides a semiconductor device having a main surface and a side surface between the two main surfaces, and a concave line portion and a convex line portion extending along the side edge of the side face. With these concave and convex portions, a stopper action equivalent to that of the above-described cutout group can be obtained.

In each of the above semiconductor devices of the present invention,
It is desirable that the planar shape of the main surface of the heat dissipation component is at least line-symmetric.

Further, it is preferable that a cutting portion for positioning be provided on the side surface of the heat radiating component.

In the semiconductor device of the present invention, specifically, the semiconductor chip is mounted on the die pad, and the entire die is sealed with resin in the state where the radiator plate is close to or in contact with the die pad. A heat sink and / or the die pad.

Further, the present invention has a heat-dissipating component having the above-mentioned remarkable effect, that is, it has the above-mentioned first and second cutout groups on its side surface, or has the above-mentioned concave stripes and convex stripes. It also provides a heat-dissipating component having the same.

[0044]

Embodiments of the present invention will be described below.

1 to 14 show an embodiment in which the present invention is applied to a QFP type package (however,
22 to 32, parts common to those of the conventional example are denoted by common reference numerals, and description thereof may be omitted: the same applies to other embodiments described below).

According to the package 40 of the present embodiment, the heat sink (radiating plate or heat spreader) 21 used for radiating the resin-sealed semiconductor chip 2 is arranged so as to be exposed on the outer surface of the package 40. On the side surface of the, the group of the wavy cutouts 29A on the front side and the group of the wavy cutouts 29B on the back side are alternately (that is, positionally shifted by half pitch) separated in the thickness direction. It is characteristic that it has. The groups of notches 29A and 29B have the same pattern. The notch 29A causes a convex portion 30B on the back side, and the notch 29B causes a convex portion on the front side.
The 30A are also arranged alternately along the side edge 31.

The heat sink 21 is formed by punching or etching a nickel-plated copper plate into a shape as clearly shown in FIGS. 2 and 3. Protrusions 41 are provided on both sides of the front and rear opposite sides, which are connected to the cutout portion 18 for positioning. The cutouts 29A and 29B and the protrusions 30A and 30B are also alternately formed on the side surfaces of these protrusions. Is formed in. As shown in FIG. 4, these notches and protrusions may be provided over the entire side surface of the heat sink.

Due to the above-described shape, the heat sink 21 has substantially no directivity in any of the thickness direction, the front-rear direction, and the left-right direction, and even if the directions in each direction are reversed, they are substantially equivalent. It has a shape. That is, in the thickness direction, the shape of the side surface is the same whether facing the front or the back, and in the front-rear direction and the left-right direction, the shapes are substantially line-symmetrical.

Regarding the notches on the side surface, as shown by A'in FIG. 3, the notch 29A on the front side and the notch 29 on the back side are provided.
Even if B and B overlap each other in position and the ridge portion 30 is provided between them, the stopper action described later can be achieved similarly to A in FIG.

The thickness direction will be described in more detail with reference to FIGS. 3 to 7. The notches 29A and 29B are formed in an arc shape at a depth approximately half the thickness of the heat sink. It is possible by half etching with an etching solution containing ferric chloride as a main component. The size of each part of the heat sink 21 is as follows.

Thickness t: 0.08 to 3.0 mm (This is the same for the lead frame 6) Size of notches 29A and 29B (radius R of arc): 0.5t
-3t (If this is too small, the effect of unevenness is weakened, and if it is too large, the equality of the shape deteriorates and the handling is easy to be impaired.) Pitch of the notches 29A and 29B: 0.2 to 0.6mm (this is also too small And the effect of the unevenness becomes weak, and if it is too large, the equality of the shape is deteriorated and the handling property is likely to be impaired.)

As described above, by alternately providing the notches 29A and 29B on the side surface of the heat sink 21, even if the surface of the heat sink 21 faces either the front side or the back side, the side surface shape becomes equivalent in the thickness direction. . This will be described with reference to FIGS. 6 and 7.

That is, when the heat sink 21 is set so that the notch 29B faces the outer surface side of the package when resin-molded as shown in FIG. 6, the outer lead 17 is connected to the circuit pattern 43 of the printed wiring board 42 by infrared rays. When connected by soldering 44 by solder reflow under irradiation (however, in the figure,
Regarding the other outer leads, the soldering state is omitted in the drawings: the same shall apply hereinafter), and the convex portion 30A formed by the notch 29B is located inside the resin 3 to serve as a stopper.
As a result, the mechanical stress generated between the resin 3 and the heat sink 21 can be relaxed, and the heat sink 21 can be prevented from peeling off from the resin 3, falling off, and cracking.

On the other hand, at the time of resin molding, when the heat sink 21 is set upside down as shown in FIG. 7 contrary to FIG. 6, the above-mentioned convex portion 30A faces the outer surface side of the package and its stopper action is However, this time, the convex portion 30B formed by the notch 29A is located inside the resin 3 and functions as a stopper. As a result, the mechanical stress generated between the resin 3 and the heat sink 21 can be relieved, and the heat sink 21 can be prevented from peeling off from the resin 3, falling off, and cracking.

In this way, even if the heat sink 21 is set with its front side facing, or with its back side facing,
Since the stopper function is obtained by the convex portion generated by the notch, the shape of the side surface of the heat sink 21 in the thickness direction is equivalent whether the front surface or the back surface is oriented.

As a result, the work can be performed in the set of the heat sink 21 without considering the orientation of the front and back sides, so that the assembly of the package 40 becomes easy,
Further, a device for detecting the front and back sides is completely unnecessary. Also,
Even in the work of processing the side surface of the heat sink 21 to form the above-mentioned notch, it is possible to carry out processing such as half etching and stamping without the need to select the front and back.

As shown in FIGS. 2 and 4, the plane shape of the heat sink 21 is substantially line-symmetrical in the front-rear direction and the left-right direction, so that the heat sink 21 has the same symmetrical shape. Since the shapes are the same, there is no need to consider the directionality when setting them, and there is no positional restriction, and workability can be improved.

Particularly, in the package of the type in which the heat sink 21 is exposed on the surface of the package as in this embodiment,
Since the symmetry of the front and back of the heat sink is an important factor,
The uneven shape of the side surface is extremely effective. As described above, the uneven shape of the side surface is effective in preventing the heat sink from falling off.

In the case of a thin package, it is necessary to select a thin heat sink. In this case, the side surface is more convenient for forming the unevenness than the front and back surfaces, and when the unevenness is formed by etching, there is not much freedom in the thickness direction, and therefore processing on the side surface is effective.

The heat sink 21 has a rectangular planar shape corresponding to the package 40, and arc-shaped cutout portions 18 for positioning at the time of setting are provided at four corners thereof.

Various materials can be used for the heat sink 21, but a Ni-plated or CuO-treated copper plate,
Examples thereof include an aluminum plate, an alumite plate, an aluminum plate with an alumite coating, and a beryllia plate.

FIG. 8 and FIG. 9 (and further FIG. 10) respectively show a cross section and a back surface of a completed product of the package 40 according to this embodiment. The manufacturing process of this package, particularly the resin molding process is shown in FIG. ~ FIG. 13 will be described.

As shown in FIGS. 11 and 12, the lower mold of the mold 11
A recess 13 which forms a part of a cavity 12 formed with the upper mold 11B is provided in 11A, and a heat sink 21 is first set at a predetermined position in the recess 13.

Then, on the upper surface of the heat sink 21, a die pad 4, on which the semiconductor chip 2 is mounted, an inner lead 7, and an outer lead are mounted with an adhesive if necessary.
The lead frame 6 that integrally supports 17 is set on the lower mold 11A.

Next, the upper mold 11B is joined to the lower mold 11A, and the lead frame 6 is fixed between these two molds. In this state, a molding resin is injected into the cavity 12 under pressure from an injection port (gate) (not shown) provided in the mold 11,
A resin is transfer-molded into a shape corresponding to the cavity 12, and a semiconductor chip is molded with the resin 3 as shown in FIG. 12 and 15 are molded products (packages) after separating the upper mold 11B during this transfer molding.
Is an ejector pin used to take out from the lower mold 11A.

At the time of this transfer molding, a heat sink
21 and the die pad 4 are in close contact with each other when the upper and lower molds are closed and the lead frame 6 is clamped, so it is difficult for the resin to enter between them, but it should invade and solidify. There is also (the former has better heat dissipation efficiency).

After this transfer molding, unnecessary parts of the lead frame 6 are removed by trimming work, and the outer leads 17 are bent as shown in FIG.
A so-called gull wing type package 40 is completed.

FIG. 14 shows an ultrasonic probe image of three samples of the package 40 (mold thickness is 2.7 mm) after soldering by the above-mentioned solder reflow. The sample and the measurement conditions A, B, and C used here were the same as those described above (however, the heat sink had the shape shown in FIGS. 2 to 9).

As in FIG. 29, the numbers shown at the bottom of each image in FIG. 14 indicate the increase rate of the thermal resistance (Rθja described above) when processing from condition A to condition B and condition C. Represents
In the parentheses, the area ratio of the above-mentioned interface peeling portion is shown. However, the part where the interface peeling occurs is a part that looks whitish on the image.

As is clear from this result, peeling of the heat sink 21 is observed from the beginning as shown in FIG. 29 after the molding (A), but no peeling occurs in this embodiment. Further, in the treatment of water absorption + heat stress (accelerated deterioration test), under the condition B, peeling of the heat sink 21 is about
It is 10% and the variation between packages is small. The rate of increase in the thermal resistance value is also smaller than that in FIG. 29 (this is the same for condition C).

As described above, in the package 40 of the present embodiment, peeling of the heat sink 21 is not seen or is significantly reduced. Therefore, the unevenness of the side surface of the heat sink 21 is peeled by thermal stress during solder reflow. It turns out that it is effective in prevention.

FIG. 15 shows another embodiment in which the present invention is applied to a QFP type package.

FIG. 15 shows a package in which the package 40 is substantially square (the mold thickness is 1.4 mm).

Observation of an ultrasonic probe image (not shown) after performing the same processing as above on this package revealed that the same tendency as in FIG. 14 was exhibited.

16 and 17 show another embodiment in which the present invention is applied to a QFP type package.

According to this embodiment, unlike the above-mentioned embodiment, the above-mentioned unevenness is provided on the side surface of the die pad to exert the effect of preventing the die pad from peeling. Others are the same as the above-mentioned embodiment (however, the heat sink is not used).

That is, the die pad 54 of the present embodiment is provided with notches 29A and 29B (projections 30A and 30B) similar to those shown in FIGS. 3 to 5 on the side surface alternately along the side edges, and The plane shape of the die pad 54 is also substantially line-symmetrical in the front-rear direction and the left-right direction (for example, a square). An enlarged view of part A in FIG. 16 is the same as FIG. The size of the die pad 54 is 8.0
The material is the same as that described above.

As described above, by providing the side surface of the die pad 54 with irregularities, the convex portion 30A or 30B relieves the mechanical stress due to heating during solder reflow or the like, and prevents the die pad from being separated from the resin 3. Since it is effective and has the effect of suppressing the generation of package cracks, the reliability of the package is improved. Since this package does not have the heat sink 21 (or 1) as described above, it is used for a semiconductor chip that generates a small amount of heat.

FIG. 18 shows another embodiment in which the present invention is applied to a QFP type package.

In this embodiment, the die pad 54 having the unevenness on the side surface is used similarly to the embodiment of FIGS. 16 and 17, and the heat sink 21 described in the embodiment of FIGS. 1 to 14 is used. It is arranged close to or in contact with the die pad 54 (50 in the figure is an adhesive).

Therefore, the die pad 54 and the heat sink 21
Due to the unevenness provided on each side surface, the effect described in the embodiment of FIGS. 16 and 17 described above (the effect of preventing peeling of the die pad),
The effect (prevention of peeling of the heat sink and improvement of its workability) described in the embodiments of FIGS. 1 to 14 can be obtained together.

FIG. 19 shows another embodiment in which the present invention is applied to a QFP type package.

In this embodiment, rectangular through holes 51 and 52 are provided inside the heat sink 21, and the above-mentioned unevenness is also provided on the side surfaces of these through holes. This also makes it possible to prevent the heat sink 21 from peeling off inside. It is desirable that the die pad 4 be located between the through holes 51-52.

FIG. 20 shows another embodiment in which the present invention is applied to a QFP type package.

In this embodiment, the unevenness provided on the side surface of the heat sink 21 is, for example, a plurality of convex portions 30 in the thickness direction.
A ', 30B', 30C 'and concave portions 29A' between these convex portions,
29B 'are provided in parallel lines along the side edges. That is, the protrusions 30A ', 30B', and 30C 'are the protrusions and the recesses 29, respectively.
Reference numerals A'and 29B 'are provided as recessed portions over the unevenness forming region shown in FIG.

With these convex portions, the heat sink 21 is
Also in the thickness direction, it becomes almost line symmetric, and the shape symmetry is further improved as compared with the above-mentioned first embodiment,
Since there is no directionality on the front and back sides, it is excellent in the effect of preventing the heat sink 21 from peeling and preventing the package from cracking.

FIG. 21 shows still another embodiment in which the present invention is applied to a QFP type package.

In this embodiment, the heat sink 21 is made of resin 3
It is completely embedded therein and is not exposed on the outer surface of the package 40. Also in this case, since the unevenness as a stopper is provided on the side surface of the heat sink 21 as in the above-described embodiment, the heat sink 21 has a different coefficient of thermal expansion from the resin 3, and therefore even if it is peeled from the resin 3 by heating, Effectively prevented. In addition, the same effects as those of the above-described embodiment can be obtained.

Although the embodiments of the present invention have been described above, the above-mentioned embodiments can be variously modified based on the technical idea of the present invention.

For example, the unevenness provided on the side surface of the heat sink 21 can be variously modified in shape, number, etc., and similarly, the planar shape of the heat sink 21 may be variously modified. Further, etching, stamping, or the like can be adopted as the method of manufacturing the heat sink 21 and the method of forming the unevenness.

Further, the shape and material of the components of the package 40 are not limited to the above examples. For example, not only the QFP type, but also a dual-in type package may be used, and the bending direction of the outer lead may be opposite to the above-mentioned example. The semiconductor chip and the lead may be connected by a method other than wire bonding.

Further, the heat dissipation component to which the present invention is applied is
Lead frame lead (depending on the package structure,
For example, a LOC (Lead on chip) type lead may be used. ), And other components having a heat dissipation effect.

[0093]

According to the semiconductor device of the present invention, since the heat dissipating component (for example, heat sink) having the first and second notch groups separated from each other on the side surface is used,
Whichever side of each main surface of this heat-dissipating component is facing (for example, even when the heat-dissipating component is incorrectly set on the front and back sides and sealed), that is, set regardless of the directionality Even if it does, the stopper action by either of the first and second notch groups can be reliably and sufficiently exerted.

Therefore, peeling of the heat radiation component from the encapsulating material is surely prevented, and the heat radiation component does not fall off.
As a result, the heat radiation components can be set without selecting the front and back sides, improving the workability of the package assembly and adding a device to detect the front and back sides of the heat radiation components. You don't even have to.

Also, when manufacturing the heat-dissipating component, it is not necessary to select the front and back of the heat-dissipating component, and it is easy to process the unevenness by etching, stamping or the like.

Thus, when the heat radiation component is subjected to heat stress, the heat stress (mechanical stress due to heat) is alleviated by the notch group, and the heat radiation component is surely prevented from peeling and dropping. The reliability of the package can be maintained.

[Brief description of drawings]

FIG. 1 is a partially cutaway perspective view of a QFP type package according to an embodiment of the present invention.

FIG. 2 is an enlarged plan view and a front view of a heat sink used in the package.

FIG. 3 is a perspective view of the heat sink.

FIG. 4 is an enlarged plan view and another front view of another heat sink used in the package.

FIG. 5 is an enlarged plan view of a part of the heat sink and a sectional view thereof.

FIG. 6 is a half cross-sectional view showing a state where the same package is soldered to a printed wiring board.

FIG. 7 is a half cross-sectional view similar to FIG. 6 of a resin-molded package in which the heat sink is set upside down.

8 is a half cross-sectional view of the package of FIG. 6 (see FIGS. 9 and 10).
VIII-VIII line half sectional view).

FIG. 9 is a back view of the package.

FIG. 10 is a back view of another similar package.

FIG. 11 is a perspective view showing the respective parts separated in a process of resin-molding the package.

FIG. 12 is a cross-sectional view showing a state where the package is set in a mold.

FIG. 13 is a perspective view of the package back surface side after the resin molding.

FIG. 14 is a sketch diagram of an ultrasonic probe image showing the peeling state of the heat sink for each condition in the same package.

FIG. 15 is a back view of a QFP type package according to another embodiment of the present invention.

FIG. 16 is an enlarged plan view of a die pad and an inner lead of a lead frame used in a QFP type package according to another embodiment of the present invention.

FIG. 17 is an enlarged cross-sectional view of a part of the package resin-molded using the lead frame of FIG. 16 along the line XVII-XVII.

18 is an enlarged cross-sectional view similar to FIG. 17 of a QFP type package according to another embodiment of the present invention.

FIG. 19 is an enlarged plan view of a heat sink used in a QFP type package according to another embodiment of the present invention.

FIG. 20 is a half cross-sectional view of a QFP type package according to another embodiment of the present invention.

FIG. 21 is a half cross-sectional view of a QFP type package according to still another embodiment of the present invention.

FIG. 22 is a partially cutaway perspective view of a QFP type package according to a conventional example.

FIG. 23 is a half sectional view of the package (XXIII-XXII in FIG. 24)
It is the I line half sectional view).

FIG. 24 is a back view of the package.

FIG. 25 is a perspective view showing the individual parts separated in a step of resin-molding the package.

FIG. 26 is a cross-sectional view showing a state where the same package is set in a mold.

FIG. 27 is a perspective view of the package back surface side after the resin molding.

FIG. 28 is a half cross-sectional view for explaining peeling of the heat sink in the same package.

[Fig. 29] Fig. 29 is a sketch diagram of an ultrasonic probe image showing the peeling condition of the heat sink in each of the packages under each condition.

FIG. 30 is an enlarged plan view of a heat sink used in a QFP type package according to another conventional example.

FIG. 31 is a half cross-sectional view of the same package.

32 is a half cross-sectional view similar to FIG. 31 of the package in which the front and back of the heat sink are set upside down and resin-molded.

[Explanation of symbols]

 2 ... Semiconductor chip 3 ... Mold resin 4, 54 ... Die pad 5 ... Wire 6 ... Lead frame 7 ... Inner lead 17 ... Outer lead 18 ... Cutting for positioning Part 21 ... Heat sink (heat sink) 29A, 29B, 29 '... Notch 30A, 30B ... Convex part 31 ... Side edge 40 ... Package 42 ... Printed wiring board 43 ...・ Circuit pattern 44 ・ ・ ・ Solder

Claims (12)

[Claims] 1. A semiconductor chip and a heat-dissipating component are both packaged with a sealing material, and the heat-dissipating component has a first main surface, a second main surface, and a side surface between these main surfaces. And a first cutout group having a predetermined pattern is provided at a boundary line portion between the first main surface and the side surface, and a predetermined notch group is provided at a boundary line portion between the second main surface and the side surface. A second notch group of the pattern, and each notch of the first notch group and each notch of the second notch group are arranged separately from each other. . 2. The cutouts of the first cutout group and the cutouts of the second cutout group of the heat-dissipating component are arranged to be displaced from each other in terms of position. The semiconductor device described. 3. The semiconductor device according to claim 1, wherein the first cutout group and the second cutout group of the heat dissipation component have substantially the same pattern. 4. The semiconductor device according to claim 2, wherein the patterns of the first notch group and the second notch group of the heat dissipation component are wavy and are displaced from each other by a half pitch. 5. The semiconductor according to claim 1, wherein the first and second cutout groups of the heat dissipation component are formed over substantially the entire side surface of the heat dissipation component. apparatus. 6. The heat-dissipating component, wherein at least one of the first notch group and the second notch group is buried inside the encapsulating material and fitted with the encapsulating material. The semiconductor device according to any one of 1 to 5. 7. A package in which a semiconductor chip and a heat dissipation component are both sealed with a sealing material, and the heat dissipation component is a first main surface, a second main surface, and a side surface between these main surfaces. And a grooved portion and a grooved portion extending along the side edge of the semiconductor device. 8. The semiconductor device according to claim 1, wherein the planar shape of the main surface of the heat dissipation component is at least line-symmetrical. 9. The semiconductor device according to claim 1, wherein a cutout portion for positioning is provided on a side surface of the heat dissipation component. 10. The heat-dissipating component has a plate-like shape.
The semiconductor device according to any one of 1. 11. The semiconductor chip is mounted on a die pad, and the die pad is entirely resin-sealed in a state where a heat-dissipating component is in proximity to or in contact with the die pad, and the heat-dissipating component is a heat sink and / or the die pad. Claims 1-10
The semiconductor device according to any one of 1. 12. The heat dissipating component according to claim 1.