JPH0817195B2 - Method for manufacturing hoop-shaped electronic component assembly - Google Patents

Description

Detailed Description of the Invention [Industrial applications]

The present invention relates to a method for manufacturing a hoop-shaped electronic component assembly.

[Prior art]

For example, in a small electronic component such as a transistor, generally, a lead frame is subjected to a series of steps such as chip bonding, wire bonding, resin mounting, and soldering to leads. Further, recently, in order to improve production efficiency, a hoop-shaped frame having a form in which this lead frame is elongated is adopted instead of the above-mentioned lead frame, and the hoop-shaped frames are arranged in series. 2. Description of the Related Art A method for manufacturing an electronic component by continuously passing each process device and sequentially performing the above-described manufacturing processes on the hoop-shaped frame is widely used. In the electronic component manufactured by the lead frame or the hoop-shaped frame, a large number of electronic components are connected to the side frame portion such as the lead frame in a row through one or more lead portions forming a part of the frame. It has a morphology. Conventionally, when the above manufacturing process is completed, each electronic component is separated from the lead frame or the hoop-shaped frame,
It is sent to the product inspection process. In this product inspection process, each electronic component is inserted into a socket, and open / short inspection, characteristic inspection, rank inspection, etc. are performed, and defective products are excluded in the product inspection process. Then, each electronic component that has undergone the product inspection process is rolled into a roll through a taping process in which a band-shaped hoop member formed of paper or the like is arranged and attached at predetermined intervals so that the electronic component can be loaded into a user's automatic insertion machine. It is wound and shipped.

[Problems to be Solved by the Invention]

The taping step is a step of re-aligning the electronic components separated from the hoop-shaped frame or the like and attaching and holding the electronic components to the band-shaped hoop member at predetermined intervals. Usually, the taping process is automated by a parts feeder, an electronic component attachment device, etc., but there is a problem that the equipment cost is high because an automatic taping device corresponding to many kinds of electronic components must be prepared. . In addition, it is difficult to automate the taping process with a parts feeder or the like for a transistor, a light emitting diode or the like that has a relatively long lead portion and has a polarity, and the taping process is manually performed, Alternatively, the above electronic parts may be shipped in loose states. Moreover, since the lead portion of the transistor or the like having polarity has taping directionality, taping may occur in the opposite direction. Therefore, an inspection process for inspecting a mistake in the taping process is required. Further, inconvenience such as need arises. Further, the band-shaped hoop member used for taping is expensive even though it is discarded by each user, which causes a problem of increasing the manufacturing cost of electronic parts. The present invention eliminates the taping step in the case of manufacturing a hoop-shaped electronic component assembly manufactured using a hoop-shaped frame, thereby eliminating various inconveniences occurring in the taping step and improving production efficiency. It is an object of the present invention to provide a method for manufacturing a hoop-shaped electronic component assembly that can reduce the manufacturing cost of the product while significantly reducing the cost.

Means for Solving the Problems In order to solve the above problems, the present invention takes the following technical means. That is, the present invention uses the side frame portion of the hoop-shaped frame that holds and conveys the electronic component or the semi-finished product thereof at a predetermined interval between the respective steps of manufacturing the electronic component as a band-shaped hoop member, and a large number of electronic components A method for manufacturing a hoop-shaped electronic component assembly held in a row by the band-shaped hoop member via a lead part, wherein at least one lead part among the lead parts connected to the side frame parts of each electronic component. And a lead part cutting step of cutting between the other lead part and the side frame part, and a lead part of the electronic part cut from the side frame part using the side frame part as a common electrode for each electronic part. The inspection process of performing the characteristic inspection by bringing the measuring probe into contact with the Includes a defective excision step of ablating, the electronic component non-defective only characterized by Shipment of this while being held in the belt-shaped hoop member.

[Operation and effect of the invention]

The present invention, the side frame portion of the hoop-shaped frame used in the manufacturing process of the hoop-shaped electronic component assembly,
By using as a band-shaped hoop member in the product shipping stage, to configure a hoop-shaped electronic component assembly,
It is intended to omit the strip-shaped hoop member and the taping process. In order to use the side frame portion as a strip-shaped hoop member, it is necessary to inspect each electronic component in a state where each electronic component is connected to the side frame through the lead portion. In the present invention, a lead portion cutting step of cutting at least one lead portion among the lead portions connected to the side frame portion of each electronic component, and cutting the other lead portion and the side frame is provided. In the lead section cutting step, the common electrode section necessary for inspecting each electronic component, for example, in the transistor, the collector lead section is not cut and left in a state of being connected to the side frame, while the emitter lead section and the base section are connected. The lead portion and the side frame portion are cut off. Therefore, each of the electronic components is held in a row on the side frame by the at least one uncut lead portion. Next, for each of the electronic components, an inspection step is provided in which the lead portion left uncut is used as a common electrode and another measuring probe is brought into contact with the other lead portions to inspect the characteristics of each electronic component. Since each of the electronic parts is arranged at a predetermined interval by the side frame part, similar to the manufacturing process, while sequentially sending each electronic part using the side frame part on the measuring device equipped with the measuring probe. Product inspection can be performed automatically. Therefore, the inspection process can be continuously connected to the manufacturing process, and it is possible to save the labor of inserting each electronic component separated from the hoop-shaped frame into a measurement socket or the like as in the conventional case. Workability is dramatically improved. Further, after the inspection step, there is provided a defective product excision step of excising the defective electronic component found in the inspection step at the lead portion, which is sent from the inspection step using the side frame portion. Only a defective electronic component can be easily and continuously excluded from a series of electronic components. After completing the above steps, the hoop-shaped electronic component assembly in which only the non-defective electronic components are held in a row on the side frame portion is wound into a roll, packaged, and shipped to the user. As described above, in the present invention, since each electronic component is held and conveyed by the side frame portion consistently from the manufacturing stage to the packaging stage, the conventional taping process can be omitted and the manufacturing time can be greatly reduced. Is shortened to.
In addition, since it is not necessary to separately provide a strip-shaped hoop member for taping and a taping device or the like is not necessary, the manufacturing cost can be significantly reduced. Further, since the side frame portion is originally provided to hold and convey each electronic component in each manufacturing process of the electronic component, the arrangement interval between the electronic components is set extremely accurately and the It is possible to obtain a high feed pitch, and even when loaded in an automatic loading machine or the like of a user, there is almost no possibility of causing a defect due to the pitch error between the electronic components. Further, since each electronic component is shipped in the aligned state in which it is held and conveyed in the manufacturing process, even in the electronic component having the polarities of the lead portions, an error may occur in the arrangement direction during taping as in the conventional case. Disappear. As a result, it is possible to supply a hoop-shaped electronic component assembly with stable quality, without the need for an inspection for checking misalignment. In addition, in the hoop-shaped electronic component assembly manufactured by the manufacturing method according to the present invention, only the side frame part remains in the part where the defective electronic component is cut off, but it is automatically loaded by each user. Since it can be easily detected by the machine and can be easily dealt with by idling or the like, no problem occurs. As described above, in the present invention, all the processes from the manufacturing process of electronic parts to the packaging process for shipping to users can be continuously performed by using the side frame part, and the productivity is remarkably improved. Can be done,
It is possible to significantly reduce the manufacturing cost.

[Explanation of the embodiment]

An embodiment of the present invention will be specifically described below with reference to FIG. FIG. 1 is a drawing schematically showing an outline of a manufacturing process when the present invention is applied to a method for manufacturing a single in-line type transistor. A relatively small single-in-line type electronic component 1 such as a transistor has a hoop-shaped frame 2 that is an elongated version of a conventional lead frame in order to improve manufacturing efficiency.
The hoop-shaped electronic component assembly 3 is manufactured by holding a large number of electronic components or semi-finished products at predetermined intervals and passing the hoop-shaped frame 2 through each manufacturing process arranged in series. In the case of the transistor 1a according to the present embodiment, in the main body manufacturing process 4 shown in FIG. 1, the processes such as dun bonding, wire bonding, resin mounting, register coating, and marking are performed, and as shown in this figure, A large number of transistors 1a, whose main body 1b is completed, are formed into a hoop-shaped frame 2
It is fed out in a state of being arranged at a predetermined interval on the side frame portion 2a. As shown in FIG. 1, the hoop-shaped electronic component assembly 3 for which the main body manufacturing process 4 has been completed has a collector lead portion 5, a collector lead portion 5, and a side frame portion 2a of the hoop-shaped frame 2, as shown in FIG.
Through the three lead parts of the emitter lead part 6 and the base lead part 7, the respective transistor bodies 1b are arranged and held in a row at regular intervals. In this embodiment, the hoop-shaped transistor assembly 3a is manufactured by continuously passing through the steps described below while holding the respective transistors 1a in the side frame portion 2a. First, for each transistor 1a fed from the main body manufacturing process 4, in the lead part cutting process 8, the emitter lead part 6, the base lead part 7, and the side frame part 2a are cut. By this lead section cutting step 8, each transistor body 1b is held and arranged on the side frame 2a via the collector lead section 5. The collector lead portion 5 is also electrically connected to the side frame portion 2a and is used as the common electrode 10 in the inspection step 9 described below. In the lead portion cutting step 8, the other lead portions 6 and 7 are cut from the side frame portion 2a while leaving the collector lead portion 5, and then in the inspection step 9, the characteristics of each transistor 1a are inspected. In this embodiment, as shown in FIG. 1, the positioning roller 11 is configured to apply a potential to the side frame portion 2a, and the collector lead portion 5 is formed.
Is used as the common electrode 10, a voltage is applied from the collector lead portion 5 to the transistor body 1b, while the measuring probes 12 and 13 are brought into contact with the emitter lead portion 6 and the base lead portion 7, respectively, and between the leads. A voltage is applied to inspect the characteristics of the transistor 1a. In the inspection step 9, the characteristics can be continuously measured without disconnecting each transistor 1a from the side frame 2a and as a series of continuous steps from the main body manufacturing step 4, so that the work efficiency is remarkably high. improves. As a result of the above characteristic inspection, the next defective product cutting step 14 is operated via a control circuit (not shown). The defective product excision process 14 provided as a process subsequent to the inspection process 9 is a process for eliminating defective products found in the inspection process 9, and based on the inspection result output from the inspection process 9. Then, a transistor having a characteristic deviating from the reference is cut off from the side frame portion 2a. The portion where the defective product is cut off is in a state in which only the side frame portion 2a is connected in a strip shape as shown in FIG. 1, and the transistor 1a is not arrayed and held in that portion. The hoop-shaped transistor assembly 3a from which defective products have been removed in the defective product removing step 14 is wound into a roll shape in the winding and packaging step 15 as it is, packaged, and shipped to the user. As described above, in this embodiment, each transistor is
Since 1a is consistently held and conveyed by the side frame portion 2a of the hoop-shaped frame 2 from the main body manufacturing process 4 to the winding and packaging process 15, the taping process which is conventionally required can be omitted. As a result, the number of steps is reduced, the manufacturing time is significantly shortened, it is not necessary to separately prepare a band-shaped hoop member, and a taping device or the like is not required, so that the manufacturing cost can be significantly reduced. Further, since the side frame portion 2a is originally provided for holding and carrying each transistor 1a in each main body manufacturing process 4 of the transistor 1a, the intervals between the transistors 1a are set to be extremely uniform. It is possible to obtain a highly accurate feed pitch, and there is no fear of causing inconvenience due to the pitch error between the transistors 1a even when the feed pitch is loaded in a user's automatic loading machine or the like. Furthermore, the lead portion of the transistor 1a in this embodiment
There are polarities in 5, 6 and 7, and there was a risk of arranging the polarities by mistake in the conventional taping process. However, in the present embodiment, the lead parts 5, 6, 7 are shipped in the aligned state in which they are held and conveyed in the main body manufacturing process 4.
Also, the hoop-shaped transistor assembly 3a with stable quality can be manufactured without misaligning the direction of the
Can be supplied. In the hoop-shaped electronic component assembly 3 manufactured by the manufacturing method according to the present invention, only the side frame portion 2a remains in the part where the defective electronic component is cut off, and the electronic component 1 is missing. However, there is no problem because it can be easily discriminated by the automatic loading machine of each user and can be dealt with by idling or the like. As described above, in the present invention, all steps from the main body manufacturing step 4 of the electronic component 1 to the winding and packaging step 15 for shipping to the user can be continuously performed by using the side frame portion 2a. Therefore, it is possible to significantly improve productivity. The scope of the present invention is not limited to the above embodiments. Although the present invention is applied to the method for manufacturing the single-in-line type transistor 1a in the embodiments, the present invention can also be applied to the method for manufacturing other electronic components manufactured by using the hoop-shaped frame 2. Further, in the embodiment, the thickness of each lead portion 5, 6, 7 connected to the side frame portion 2a is the same, but if necessary to hold each electronic component in the side frame portion 2a, the above The lead portion left in the lead portion cutting step 8 can be thickened. Further, in order to hold each electronic component 1 in the side frame portion 2a, an auxiliary lead portion which is not electrically connected to the inside of each electronic component, or a connecting portion connected to the side frame portion 2a may be provided.

[Brief description of drawings]

FIG. 1 is a diagram schematically showing the outline of the manufacturing method of the present invention. 1 ... Electronic component, 2 ... Hoop-shaped frame, 2a ... Side frame part, 3 ... Hoop-shaped electronic component assembly, 5,6,7
...... Lead part, 8 ...... Lead part cutting process, 9 …… Inspection process, 10 …… Common electrode, 12,13 …… Measuring probe, 14 …… Defective product cutting process.

Claims (1)

[Claims] 1. A side frame portion of a hoop-shaped frame for holding and transporting the electronic component or a semi-finished product thereof at predetermined intervals between respective steps of manufacturing an electronic component is utilized as a band-shaped hoop member, and a large number of electronic components are leads thereof. A method for manufacturing a hoop-shaped electronic component assembly held in a row by the band-shaped hoop member via a portion, wherein at least one lead portion among lead portions connected to the side frame portions of each electronic component is Leaving, the lead portion cutting step of cutting between the other lead portion and the side frame portion, and for each electronic component, the side frame portion is used as a common electrode for the lead portion of the electronic component cut from the side frame portion. By touching the measuring probe, the inspection process to perform the characteristic inspection and the defective electronic parts found in the product inspection process are cut off with the lead part. Includes a defective excision step, the electronic component of non-defective only characterized by Shipment of this while being held in the belt-shaped hoop member, the manufacturing method of the hoop-like electronic component assembly.