JPH08168889A - Joining method for metallic member, insert material for au-sn brazing and injection printer - Google Patents

Abstract

PURPOSE: To form a joint part having excellent corrosion resistance and high strength while suppressing the deformation of members by heat and to suppress the cost of forming brazing filler metal layers to a low level. CONSTITUTION: The brazing filler metal to be used for joining is formed of an Au-Sn alloy. This Au-Sn alloy is formed of laminated structures of Au plating and Sn plating which are fused by heating and pressurizing to form a joining material. For example, the plating is executed to form, successively from the base metal 101 side, Ni plating 102 of <=0.5μm, Au plating 103 of <=5μm, Sn plating 104 of <=5μm and Au plating 105 of <=5μm in a laminar form. The compsn. in the system of the Au plating and the Sn plating is specified to over 20mass% to 40mass% or under in SA over the entire part of the plating combinations to be laminated. The wet process plating including at least either of hydrogen and water of >=1/2 times the plating volume in terms of 0 deg.C and 1atm in the plating films is used.

Description

Detailed Description of the Invention

[0001]

The present invention relates to an Au--Sn alloy (N
Au-Sn-Ni alloy, Au-Sn-C containing a base plating component such as i and Cu and having a small content ratio
a method of joining metal members to each other by brazing using (including a u component), and an Au-Sn brazing insert material,
The present invention relates to an inkjet printer that uses these joining techniques.

[0002]

2. Description of the Related Art Conventionally, when brazing metal members with each other using an Au--Sn alloy, an Au--Sn alloy foil and a flux having an action of removing an oxide film on the joint surface are inserted into the joint, Brazing was performed by heating and pressing. As another joining method, the parts of the print head of the ink jet printer are adhered to each other with an organic adhesive, or as shown in JP-A-2-107451, Ni-
The joining was performed using a high melting point brazing material such as P brazing or Au—Ni brazing.

[0003]

When the Au-Sn alloy foil and the flux are inserted into the joint during Au-Sn brazing, the flux is corrosive, so that the step of cleaning and removing the residual flux must be performed. Was needed. further,
There is a problem that the flux that is caught in the solder and remains in the joint corrodes the joint. Also Au-S
Since the n alloy has almost no ductility, it cannot be rolled, and it was necessary to grind a thin plate-shaped ingot to form a foil.

On the other hand, when an organic adhesive is used for joining the print heads, the adhesive strength is deteriorated due to the deterioration of the adhesive over time, and it is difficult to increase the reliability of the joint.
Further, when a high melting point brazing material is used, it is difficult to improve the joining accuracy because the members to be joined are plastically deformed due to a decrease in yield strength due to high temperature and thermal strain.

The present invention has been made in view of the above points, and an object thereof is to replace Au-Sn alloy foils, fluxes, organic adhesives, and high melting point brazing materials in order to solve the problems described above. Using Sn alloy bonding technique, and by devising the bonding conditions, high bonding strength, corrosion resistance,
It is to provide a highly reliable joining technique with excellent joining accuracy.

[0006]

The present invention first proposes the following joining method.

That is, the thickness is 0.5 μm in order from the base metal side.
The following base plating (for example, Ni plating), Au plating having a thickness of 5 μm or less, Sn plating having a thickness of 5 μm or less, and thickness 5
Metal members that are Au-plated with a thickness of μm or less in layers are
Alternatively, the layer-plated metal member, the base metal layer having a thickness of 0.5 μm or less and the thickness of 0.5 μm in this order from the base metal side.
The following metal member plated with Au in a layered state is heated and pressurized in a vacuum or in an inert gas to bond, and the bonding conditions are Au plating excluding the undercoat and S.
The composition in the system of n plating is such that Sn is more than 20 mass% and less than 40 mass% in the entire plating combination to be stacked, and the Au plating and the Sn plating have a plating volume of 0 ° C. and 1 atm equivalent in the plating film. It is characterized by using wet plating containing at least one-half or more of hydrogen and water (this is the first invention).

In addition, in a method of joining members to be joined together through a brazing insert material, a base plating is applied to the surface of a base material of the insert material, and Au plating and Sn plating are applied in layers on the base plating. Therefore, we propose an Au-Sn brazing insert material in which at least one kind of these plating layers contains hydrogen or water at ½ times the plating volume in terms of 0 ° C and 1 atm. (This is the second invention).

[0009]

According to the first aspect of the present invention, in the joining step, when the members to be joined are heated while being pressurized, Au and Sn cause a eutectic reaction to melt (melt). In this case, at least Au plating and Sn plating contain a large amount of H ₂ gas and water, and upon heating, these gases form bubbles and are released from the Au—Sn melt into the heating atmosphere. During this gas release, bubbles agitate the Au-Sn melt and
Since the contaminant layer remaining in the melt is broken and broken, Au
-The Sn melt is completely integrated.

In the joining process, a Ni-Au-Sn compound, which is a reaction product of the two, is formed at the interface between the Au-Sn melt and the undercoat (here, Ni plating). This intermetallic compound has a low strength and becomes a factor for lowering the bonding strength. However, when heating is further continued in the thickness setting (quantitative setting) of each plating described above, Ni as the base plating is used.
By setting the plating thickness to 0.5 μm or less, Ni
Plating and Ni-Au-Sn intermetallic compound is Au-Sn
By completely dissolving in the melt to eliminate the above-described bonding strength lowering element, the members to be bonded come into direct contact with the Au-Sn melt. Then, if cooled, the joint portion is Au containing a small amount of Ni.
-Sn alloy is formed, whereby members to be joined (metal members) are firmly joined.

The eutectic point of the Au-Sn binary system is Au.
-20 mass% Sn, but N in the Au-Sn melt
In the process of dissolution of i, Ni and Sn react with each other to form an intermetallic compound, and the Sn content in the Au—Sn melt is reduced accordingly. If Sn decreases below the eutectic point, Au-Sn
The melting point of the alloy increases rapidly.

For example, when the Au-Sn melt at the initial stage of bonding has a eutectic composition, it is completely in a liquid state when heated to 633 K. However, when Sn is consumed by the reaction with Ni, Au-Sn melt is generated. The Sn concentration in the melt decreases and the melting point rises. When the Sn concentration decreases, the melting point of the Au-Sn melt becomes equal to the heating temperature, and isothermal solidification occurs. Once solidified, the dissolution rate of Ni in the Au-Sn alloy is extremely reduced, and it takes an extremely long time to completely dissolve Ni in the Au-Sn alloy. Therefore, in order to continue to melt the Au—Sn alloy until Ni is completely dissolved, the Sn concentration of the initial Au—Sn melt should be set to more than 20 mass% and 30 mass% or less in consideration of the reaction with Ni. Good, preferably 22 mass% to 29 ma
ss%, more preferably 24 mass% to 28 ma
It is good to set it to ss%.

When the members to be joined are joined together using the Au--Sn brazing insert material of the second invention, the following process is carried out.

An Au-Sn brazing insert material is inserted between the members to be joined, and the joining surfaces are brought into close contact with each other and heated. The Au plating and Sn plating on the insert material side cause a eutectic reaction to melt (in this case, Au on the surface of the base material on the joined member side as well).
After plating, the Au plating and the insert material side A
u plating and Sn plating may be melted together.

Also in the present invention, the H ₂ gas and the gas (bubbles) derived from the water agitate the Au—Sn melt, and the joint finally contains an Au—Sn alloy containing a small amount of Ni or The Au-Sn-Ni alloy has a small Ni content ratio. Therefore, the members to be joined are firmly joined together by using this brazing insert material.

[0016]

【Example】

[First Embodiment] A first embodiment of the present invention will be described with reference to FIG.

FIG. 1 shows N having a thickness of 0.3 μm in order from the base metal side.
i plating, 3 μm thick Au plating, 3 μm thick Sn
By overlapping metal members to each other forming the Au plating in the plating and thickness 0.5 [mu] m, it is a diagram showing a laminated bonding method of bonding by heating and pressing at a N ₂ gas.

Reference numeral 101 is a SUS304 plate (base material) having a thickness of 50 μm, 102 is Ni plating having a thickness of 0.3 μm (base plating for achieving corrosion resistance of the base material), and 103 is a thickness of 3 μm.
m Au plating, 104 is 3 μm thick Sn plating, 1
Reference numeral 05 denotes Au plating having a thickness of 0.5 μm, reference numeral 106a denotes Au-Sn combined financial liquid produced by eutectic reaction of Au and Sn, 1
06b is an Au—Sn alloy in which the above melt is solidified, 107
Is a Ni—Au—Sn intermetallic compound produced by the reaction of Au—Sn combined financial liquid 106a and Ni. In this example,
The above four layers of plating are formed on both surfaces of the base material 101.

Next, the joining process will be described.

First, as the bonding conditions, Au plating 103, 105 excluding Ni plating 102 is used.
The composition of the Sn plating 104 and the Sn plating 104 is such that Sn is 20mass in the entire plating combination to be stacked with respect to Au plating.
It is more than s% and less than 40 mass%, and each plating 102 to 105 has 0 in the plating film.
Wet plating containing at least one of hydrogen and water, which is ½ of the plating volume at 1 ° C. and 1 atm, is used.

Under the above conditions, (1) SU having the above-mentioned four layers of plating 102 to 105 applied
The S304 plates (metal members to be joined) 101 are placed facing each other, and the atmosphere is replaced with N ₂ gas [FIG. 1 (a)].

(2) 360 while pressing the metal members to be joined
When heated to 0 ° C., Au and Sn in the plating layer undergo a eutectic reaction and are melted to form an Au—Sn melt 106a [FIG. 1 (b)]. Each plating film contains a large amount of H ₂ gas and water, and these gases are released by heating. The released gas becomes bubbles 108 and is released from the Au-Sn melt 106a into the atmosphere. At this time, the gas bubble 108 stirs the Au—Sn melt 106 a, and Au—S
Since the contaminant layer 109 remaining in the n-melt 106a is divided and destroyed, the Au-Sn melt layer 106a is completely integrated. At the interface between the Au-Sn melt 106a and the Ni plating 102, a Ni-Au-Sn intermetallic compound 107, which is a reaction product of the two, is formed. This intermetallic compound 10
7 is brittle, and the adhesion strength with the Ni plating 102 is low, so that the bonding strength is lowered. However, if the heating is continued, the Ni plating 102 and the Ni-Au-Sn intermetallic compound 107 are contained in the Au-Sn melt 106a. Completely dissolved, A
The u-Sn melt directly contacts the base material (SUS304 plate) 101. Next, when the joint is cooled, the Au—Sn melt becomes the Au—Sn alloy 106b containing a small amount of Ni, whereby the SUS304 plates 101 are firmly joined (FIG. 1 (c)).

The relationship between the peel strength and the thickness of the Ni-Au-Sn intermetallic compound in the joining of SUS304 plates will be described with reference to FIG. In Fig. 2, the horizontal axis represents the intermetallic compound and Ni.
The total thickness d of the plating is shown, and the vertical axis shows the peel strength. The peel strength tends to increase as d decreases. The highest intensity is when d is 0, that is, Au-Sn.
It can be seen that this is the case where Ni is completely dissolved in the melt.

FIG. 3 shows a state diagram of the Au-Sn binary system.
The eutectic point of the Au-Sn binary system is Au-20mass% Sn.
And is shown as point A in the figure. Au-Sn
In the process in which Ni is dissolved in the melt, Ni and Sn react with each other to form an intermetallic compound, and S in the Au-Sn melt is correspondingly formed.
The n content is reduced. When Sn decreases below the eutectic point,
The phase diagram shows that the melting point of the Au-Sn alloy increases sharply.

For example, when the Au-Sn melt at the initial stage of bonding has a eutectic composition, when heated to 633 K, the position in the phase diagram becomes point A, indicating that it is completely in the liquid phase. Here, when Sn is consumed by the reaction with Ni, the Sn concentration in the Au—Sn melt decreases and the melting point rises. When the Sn concentration decreases and reaches the point A ′, the melting point of the Au—Sn melt becomes equal to the heating temperature, and isothermal solidification occurs. Once solidified, the dissolution rate of Ni in the Au-Sn alloy is extremely reduced, and it takes an extremely long time to completely dissolve Ni in the Au-Sn alloy. Therefore, in order to continue to melt the Au—Sn alloy until Ni is completely dissolved, the Sn concentration of the initial Au—Sn melt should be set to more than 20 mass% and 30 mass% or less in consideration of the reaction with Ni. Good, preferably 22 mass% to 29 ma
ss%, more preferably 24 mass% to 28 ma
It is good to set it to ss%.

According to this embodiment, the following effects are obtained. (B) As described above, in the bonding process, Au-S
The n-alloy can be agitated, and the weight distribution of Au-Sn can be adjusted by the N plating of the underlayer and the N generated during the process.
Since it is determined in consideration of the reaction with the i-Au-Sn compound, it is possible to provide a bonding method having high bonding strength in the process. (B) Since the Au—Sn alloy is supplied not in the form of foil but in the form of a plating film, the
It is possible to reduce the manufacturing cost by eliminating the step of manufacturing the u-Sn foil. (C) The joint surface before joining is Au, and since Au does not oxidize, it is possible to integrate the joints without using flux, and eliminate the conventional flux removal work and improve work efficiency. The problem of corrosion of the joint due to residual flux can be eliminated, and the corrosion resistance of the joint can be improved.

[Second Embodiment] A second embodiment of the present invention will be described with reference to FIG.

In this embodiment, the thickness is 0.3 in order from the base metal side.
μm Ni plating, thickness 3 μm Au plating, thickness 2.
A metal member on which Sn plating of 5 μm and Au plating of 0.5 μm thickness are formed and a metal member on which Ni plating of 0.3 μm thickness and Au plating of 0.5 μm thickness are formed are laminated to form N ₂ It is a figure which shows the lamination joining method which heat-pressurizes in gas and joins.

Numerals 401a and 401b are SUS304 plates having a thickness of 50 μm to serve as a base material (members to be joined), 402
a and 402b are 0.3 μm thick Ni plating (base plating), 403a are 2.5 μm thick Au plating, 40
4a is Sn plating with a thickness of 3 μm, 405a and 405b
Is 0.5 μm thick Au plating, 406a is Au and Sn
Au-Sn combined financial liquid produced by eutectic reaction with and 406
b is a solidified Au-Sn alloy, 407a is a Ni-Au-Sn intermetallic compound produced by the reaction of the Au-Sn synthetic financial liquid 406 and the Ni plating 402a, and 407b is Au-S.
It is a Ni-Au-Sn intermetallic compound produced by the reaction of the n-financing liquid 406 and the Ni plating 402b.

Next, the joining process will be described.

Also in this example, the bonding conditions are the same as those in the first example, that is, the Au platings 403a and 403 excluding the Ni plating are used.
5a, 405b and Sn plating 404a, the composition of Sn is 20 mass in the whole plating combination to be laminated.
% And less than 40 mass%, and each plating 40
2a to 405a, 402b, and 405b use wet plating in which at least one of hydrogen and water, which is 1/2 times or more the plating volume in terms of 1 atm at 0 ° C., is used in the plating film.

Under the above-mentioned joining conditions, (1) the members to be joined that have been plated as described above (SUS3
04 plates 401a and 401b) are placed facing each other, and the atmosphere is replaced with N ₂ gas [FIG. 4 (a)]. (2) The metal members to be joined are heated to 360 ° C. while slightly applying pressure. Au and Sn cause a eutectic reaction and dissolve. In this case, unlike the case of the embodiment described with reference to FIG. 1, Au plating 405b on the base material 401b side.
Melts only after reacting with Sn on the base material 401a.
Therefore, although there is a slight time difference, the base material 401a
The upper platings 403a, 404a and 405a are first melted to form an Au-Sn melt, in which the Au plating 40
5b will dissolve [FIG.4 (b)].

Each plating film contains a large amount of H ₂ gas and water, and these gases are released by heating. The released gas becomes bubbles and is released from the Au-Sn melt 406a into the atmosphere. At this time, gas bubbles 408 are Au.
-Sn melt 406a is stirred, and Au-Sn melt 406a is stirred.
Since the contaminant layer 409 remaining therein is divided and destroyed,
The Au-Sn melt 406a is completely integrated.

Au-Sn melt 406a and Ni plating 40
Ni-Au-Sn intermetallic compounds 407a and 407b, which are reaction products of both, are formed at the interfaces with 2a and 402b. This intermetallic compound has low strength and causes a decrease in bonding strength, but if the heating is further continued, Ni plating 402a, 402b, Ni-Au-Sn intermetallic compound 4 will be obtained.
07a and 407b are completely dissolved in the Au-Sn melt 406a, and the Au-Sn melt 406a and the SUS304 plate 4
01a and 401b are in direct contact. Then, when cooled, the Au—Sn alloy 406b containing a small amount of Ni is formed, and the SUS304 plates 401a and 401b are firmly bonded to each other [FIG. 4 (c)].

When the Au—Sn melt 406a at the initial stage of joining has a eutectic composition, the Sn concentration in the Au—Sn melt 406a decreases and the melting point rises due to the reaction between Sn and Ni as described above. As a result, the Au-Sn melt 406a is isothermally solidified. Once solidified, Ni Au-S
The dissolution rate into the n-alloy is extremely reduced, and Ni plating 40
It takes an extremely long time to completely dissolve 2a and 402b in the Au—Sn alloy. Therefore N
A until i platings 402a and 402b are completely dissolved
To continue melting the u-Sn alloy, the initial Au-Sn
The Sn concentration of the melt 406a is set to 20 in consideration of the reaction with Ni.
The content is preferably more than 30 mass% and 30 mass% or less, preferably 22 mass% to 29 mass%, and more preferably 24 mass% to 28 mass%. In the case of this embodiment, the initial Au-Sn melt 4 was used.
The Sn concentration of 06a needs to be calculated by adding the amount of Au plating 405b to the plating films 403a, 404a, and 405a.

According to this embodiment, the same effect as the first embodiment can be obtained.

[Third Embodiment] A third embodiment of the present invention will be described with reference to FIGS.

This embodiment is different from the above-mentioned embodiments and is an example of joining members to be joined together via an Au-Sn brazing insert material. FIG. 5 is a vertical sectional view of the insert material. 6 shows the joining process.

501 is a SUS30 having a uniform thickness without holes.
4 plates (insert material), 502 is a brazing plating layer formed on both sides of the insert material 501, for example, the brazing layer 502 is SUS304 in order from the insert material side.
0.3 μm thick Ni plating formed on the plate, thickness 3
.mu.m Au plating, thickness 3 .mu.m Sn plating, thickness 0.
It is a brazing material layer consisting of four layers of 5 μm Au plating.

The present embodiment is the most basic embodiment of the Au-Sn brazing insert material. This embodiment is suitable for brazing a minute portion. Uniform SUS with no hole thickness
By using the 304 plate 501, it is easy to make the thickness of each plating layer formed on the SUS 304 plate uniform, and it is possible to perform bonding with high finished dimensional accuracy.

The joining process of this embodiment will be described with reference to FIG.

Reference numerals 503 and 504 denote minute joined members made of SUS304. These joined members (base materials) 503, 50.
On the surface to be the bonding surface of No. 4, Ni plating (base plating) 505 having a thickness of 0.3 μm and Au plating 506 having a thickness of 0.5 μm are formed.

As the bonding conditions, the present embodiment also uses
At least one kind of plating film of the above-mentioned plating layer contains hydrogen or water at ½ of the plating volume in terms of 0 ° C. and 1 atm.

The joining process is as follows. (1) First, between the members to be joined 503 and 504, the SUS304 plate 50 with the brazing material layer 502 shown in detail in FIG.
The Au-Sn brazing insert material No. 1 is inserted [Fig. 6 (a)]. (2) Next, the joint surfaces of the members 503 and 504 to be joined and the insert material are brought into close contact with each other and heated to 360 ° C. in an N ₂ atmosphere. The brazing material layer 502, the Ni plating 505, and the Au plating 506 cause a eutectic reaction to melt and form an Au-Sn-Ni combined financial solution 507a having a small Ni content ratio. During this process, Au gas generated by the brazing material layer 502 causes Au
Bubbles 508 are formed in the -Sn-Ni combined financial liquid 507a, but since the joint is minute, most of the bubbles can be released outside the joint during heating [Fig. 6].
(B)]. By cooling the joint, Au-Sn-N
The i combined financial liquid is solidified as indicated by reference numeral 507b, and the members to be joined 503 and 504 are made of Au—Sn—Ni alloy 507.
It is firmly joined by b (FIG. 6 (c)). SUS30
The size of the 4 plate 501 needs to be 5 mm or less, preferably 3 mm or less, and more preferably 2 mm or less. When the width of the joint is large, it becomes difficult to discharge the bubbles 508 to the outside of the joint, and as a result, large bubbles remain in the joint and extremely reduce the joint strength. It is necessary to apply this embodiment. The thickness can be arbitrarily selected according to the application. A typical example is a thickness of 50 μm.

According to this embodiment, in addition to the effects similar to those of the first and second embodiments, most of the plating layer for joining is formed on the insert material side, so that the members to be joined can be applied. Can be extended.

[Fourth Embodiment] A fourth embodiment of the present invention will be described with reference to FIGS.

FIG. 7 is a sectional view of an Au-Sn brazing insert material according to this embodiment. In the figure, 701 is a SU having a uniform thickness in which a large number of gas reservoir holes (through holes) 702 are formed.
S304 plate (insert material), this insert material 70
A brazing material layer 502 is formed on the surface of No. 1. Brazing material layer 5
02 is a base material (SUS304 plate) 701 of insert material
0.3 μm thick Ni plating (undercoating), 3 μm thick Au plating, and 3 μm thick S stacked in order from the side
It consists of four layers of n plating and Au plating with a thickness of 0.5 μm.

Also in the present embodiment, at least one kind of plating film among the above-mentioned plating layers contains hydrogen or water at ½ of the plating volume at 0 ° C. and 1 atm.

The joining process of this embodiment will be described with reference to FIG.

FIG. 8 shows a method of joining two members using the Au-Sn brazing insert material in this embodiment. In the figure, 803 and 804 are members to be joined made of SUS304, and 805 is a thick member. 0.3 μm Ni plating, 8
Reference numeral 06 is Au plating with a thickness of 0.5 μm, 807a is an Au—Sn—Ni financial solution in the middle of the joining process, 807b is a solidified Au—Sn—Ni alloy, and 808 is a bubble.

The bonding process is as follows. (1) First, the Au-Sn brazing insert material 701 shown in detail in FIG. 7 between the members to be joined 803 and 804.
Is inserted [FIG. 8 (a)]. (2) Next, the bonding surfaces are brought into close contact with each other, and the temperature is 360 ° C. in N ₂ atmosphere
Heat to. Brazing material layer 502 and Ni plating 805 and A
The u plating 806 causes a eutectic reaction and melts, and Au-Sn
-Ni alloy financial liquid 807a is formed [FIG.8 (b)]. At this time, Au-S is generated by the outgas from the brazing material layer 502.
Bubbles 808 are formed in the n-Ni alloy financial liquid 807a. Of these bubbles 808, those close to the outer periphery of the joint are discharged as they are, but those close to the outer periphery of the joint are the insert material (SUS304 plate) 70.
By being captured in the gas reservoir hole 702 provided in No. 1, it is released to the outside of the Au—Sn—Ni alloy financial liquid. By this action, it is possible to remove the bubbles 808 from the joint portion even if the joined members are not minute. By cooling the joint, Au-Sn as indicated by reference numeral 807b.
The —Ni composite financial liquid is solidified [FIG.
03 and 804 are strongly joined by the Au-Sn-Ni alloy 807b.

S applied to the fourth embodiment described above with reference to FIG.
An example of the size and arrangement of the holes formed in the US304 plate will be described. 901 is an insert material for Au-Sn brazing, 9
Reference numerals 02, 903 and 904 are holes for storing gas.

In the example shown in FIG. 9A, the hole 902 is circular,
In the embodiment shown in (b), the hole 903 has a rectangular shape, and in the embodiment shown in (c), the hole 904 has an irregular shape. As shown therein, the holes can be of any shape. The diameter of these holes is 1/2 times or more, preferably 1 time or more, more preferably 2 times or more, further preferably 3 times or more the thickness of the Au-Sn brazing insert material 901. The hole pitch is 5 mm or less, preferably 3 mm or less,
More preferably, the value is such that one or more holes are located within a circle of 2 mm or less. By arranging the holes in this way,
Bubbles due to the gas generated from the brazing material layer 502 can be effectively captured, and a strong joint can be obtained.

[Fifth Embodiment] FIG. 10 shows a fifth embodiment of the present invention.
And FIG. 11 will be described.

FIG. 10 is a sectional view of an Au-Sn brazing insert material according to the present embodiment. In the figure, 1001 is a SUS304 plate (insert material) having a uniform thickness without holes, 11
Reference numeral 02 denotes a brazing material layer partially formed on the insert material 1001. The brazing material layer 1102 has a Ni plating with a thickness of 0.3 μm, an Au plating with a thickness of 3 μm, and a thickness of 3 μm in this order from the base metal 1001 side. Sn plating, Au 0.5 μm thick
Partially formed brazing material layer 1 consisting of four layers of plating
A large number of 102 are formed in a striped pattern or a grid pattern at intervals 1109.

Also in this embodiment, at least one kind of plating film has a volume of 1/2 of the plating volume at 0 ° C. and 1 atm.
Contains more than double the amount of hydrogen or water.

Referring to FIG. 11, the Au-S in this embodiment is
A process of joining two members using an n-brazing insert material will be described.

In FIG. 11, 1103 and 1104
Is a joined member made of SUS304, 1105 is Ni plating with a thickness of 0.3 μm partially applied, 1106 is Ni
Au plating with a thickness of 0.5 μm formed on the plating 1105, 1107a is Au—Sn—Ni compound financial liquid, 110
7b is a solidified Au-Sn-Ni alloy, and 1108 is a bubble.

The joining process is as follows. (1) First, the Au-Sn brazing insert material shown in FIG. 10 is inserted between the members to be joined 1103 and 1104 [FIG. 11 (a)]. (2) Next, the bonding surfaces are brought into close contact with each other, and the temperature is 360 ° C. in N ₂ atmosphere
Heat to. The brazing material layer 1102 reacts with the Ni plating 1105 and the Au plating 1106 to melt, and Au—S
Form n-Ni combined financial liquid 1107a [FIG.
(B)]. At this time, bubbles 1 are generated in the Au—Sn—Ni composite financial liquid 1107a due to the outgas from the brazing material layer 1102.
108 is formed. These bubbles 1108 are portions (gap) 110 around which the brazing material layer 502 is not formed.
It is discharged to the outside of the joint through 9. Due to this effect, the bubbles 1108 can be removed from the joint portion even if the joined members are not minute.

Next, by cooling the joint, Au--
The Sn-Ni synthetic financial liquid is solidified as indicated by reference numeral 1107b, and the members 1103 and 1104 to be joined are made of Au-Sn-N.
It is firmly joined by the i alloy 1107b.

Since the materials to be joined 1103 and 1104 made of SUS304 do not get wet with the Au-Sn-Ni combined financial solution 1107a, the Au-Sn-Ni combined financial solution 1107a is applied to the outside of the Ni plating 1105 partially applied. It does not spread. Therefore, Au-Sn-Ni combined financial liquid 1107
A space 1109 is secured in the portion where a is not wet.
This space can be used as a flow path for guiding the fluid.

Further, a material to be joined 1103 made of SUS304
And 1104 are solidified Au-Sn-by forming a substrate or an electronic device on which an electric circuit is formed.
The Ni alloy 1107b can be used as a structural material for fixing an electrode and an electronic device.

[Embodiment 6] A sixth embodiment of the present invention is shown in FIG.
2, and FIG. 13 and FIG. In this embodiment,
As an example of the joining method of each of the above-described embodiments, an application example to an inkjet printer is shown.

FIG. 12 is a cross section of the ink jet printer of this embodiment. Reference numeral 1201 is a housing, 1202 is a memory card, 1203 is a control board, 1204 is a paper feed belt, 1205 is paper, 1206 is paper receiver, 1207 is a print head, 1208 is an ink loader, 1209 is an ink cassette, 1210 is a paper cassette, 1211 is a head feed motor, 1212 is a paper pickup roller, 1213 is a head carriage, 1214 is a paper feed motor, 1215 is a power supply, 1216 is liquid ink, 121
7 is solid ink, 1218 is a heater for melting ink, 1
Reference numeral 219 is a print nozzle.

The operation of the ink jet printer of this example will be described.

First, the sheet 1205 is placed in the sheet cassette 1210.
Set. Up to 200 sheets can be set.
When a print signal is sent from a computer (not shown), the print signal is temporarily stored in the memory card 1202 and developed into a print image by the microcomputer mounted on the control board. When the print image is completed, the paper 1205 is picked up by the paper pick-up roller 1212 and is fed to a predetermined printing position by the paper feed motor 1214 and the paper feed belt 1204. Next, the position of the paper 1205 is controlled by the paper feed belt 1204, the position of the print head is controlled by the head feed motor 1211 via the head carriage 1213, and ink is ejected from the print nozzle attached to the tip of the print head 1207. And print. When the amount of ink in the print head becomes a certain amount or less, the ink loader automatically supplies the solid ink 1217 stored in the ink cassette 1209. Solid ink 12
17 is melted by the heat supplied by the heater 1218 in the print head to become liquid ink 1216. All the operations described above are controlled by the control board 1203. Further, the power source 1215 supplies all the electric power necessary for the printing operation.

FIG. 13 shows details of the print nozzle 1219.

Of these, 1310 is N having a thickness of 0.3 μm.
The aluminum housing holder 1310 is i-plated and Au-plated with a thickness of 0.5 μm.
1 and 1312, and a PZT actuator 1313 are provided.

1320 is SUS30 as an insert material
The bonding plate 1320 is made of four layers, and the bonding plate 1320 includes a Ni plating layer having a thickness of 0.3 μm, an Au plating layer having a thickness of 2.5 μm, and a Sn plating layer having a thickness of 3 μm in order from the base material side.
A brazing material layer composed of four layers of plating and Au plating having a thickness of 0.5 μm is formed.

This bonding plate 1320 has
A PZT actuator hole 1322 is provided.

Reference numeral 1330 is a Ni alloy diaframe filter plate. The surface of the diaframe filter plate 1330 is plated with Ni having a thickness of 0.3 μm and Au plating having a thickness of 0.5 μm.

A filter mesh 1331 is formed on the diaframe filter plate 1330.

Numeral 1340 is a SUS304 restrictor plate, the surface of which has a thickness of 0.3 μm Ni plating, a thickness of 2.5 μm Au plating, a thickness of 3 μm Sn plating, and a thickness of 0.5 μm Au plating. A brazing filler metal layer is applied.

A restrictor 1341 is provided on the restrictor plate 1340.

Reference numeral 1350 is a Ni alloy orifice plate, the surface of which is plated with Ni having a thickness of 0.3 μm and Au plating having a thickness of 0.5 μm. An orifice 1351 is arranged in the orifice plate 1350.

Reference numeral 1360 denotes an ink passage path, 1370 denotes ink, 1314, 1323, 1332, 1342 and 1.
352 is a positioning hole at the time of assembly, 1315, 132
4, 1333, 1343 and 1353 are through holes for mounting bolts to the print head, 1325 and 1344.
Is a hole having a diameter of 0.15 mm.

Using these positioning holes and positioning pins, as shown in FIG. 14, an aluminum housing holder 1310, a bonding plate 1320, a diaframe filter plate 1330, a restrictor plate 1340 and an orifice plate 1350 are positioned and overlapped. Together, in an N ₂ atmosphere for 60 seconds at 360 ° C
And the pressure of 120 kgf are applied to join.

The bonding plate 1320 and the restrictor plate 1340 have holes 1325 and 1344 through which the gas released from the Au--Sn alloy at the time of bonding escapes.
Since it is opened on one side, each part can be firmly joined.

Fine ink flow paths are formed in the joined nozzles. The ink supplied from the print head flows into the ink flow path 1311, and the ink passage path 1360.
Of the restrictor 1 formed on the restrictor plate 1340 by filtering the foreign matters through the filter mesh 1331 formed on the diaframe filter plate 1330 after passing through the bonding plate 3120.
341. Next, the PZT actuator 1313
Applies pressure to the ink 1370 stored in the restrictor portion by displacing the diaframe filter plate 1330 through the PZT actuator hole formed in the bonding plate 1320. The ink 1370 is vigorously ejected from the orifice 1351 formed on the orifice plate by the reaction, and participates in printing.

The joint structure of the print nozzle 1219 will be described with reference to FIG. 1410 is Ni having a thickness of 0.3 μm.
Plating layer consisting of plating and 0.5 μm Au plating, 1
420 is Ni plating of thickness 0.3 μm, thickness 2.5 μ
m Au plating, thickness 3 μm Sn plating and thickness 0.5
a brazing filler metal layer made of Au plating of 14 μm, a gas reservoir 1421, a brazing filler metal 1430 made of an Au—Sn—Ni alloy,
1450 is an epoxy adhesive.

The joining process is as follows. First, the members to be joined 1310, 1320, 1330, 1340 and 1350 are superposed. Next, the joint surfaces are brought into close contact with each other and heated to 360 ° C. in an N ₂ atmosphere. The brazing material layer 1420 and the plating layer 1410 react with each other to melt, and Au--Sn--Ni
Form a synergistic liquid. At this time, bubbles are formed in the Au—Sn—Ni alloy financial liquid by the outgas from the brazing material layer 1420. These bubbles are formed in the surrounding gas reservoir 1421.
Absorbed and removed from the joint. By cooling the joint portion, the Au—Sn—Ni alloy financial liquid is solidified to become the solid phase brazing material 1430, and the respective members are firmly joined. The PZT 1440 is then adhered to the diaframe plate 1330 using epoxy adhesive 1450.

The ink supplied from the print head is
It flows into the ink channel 1311, and passes through the ink passage 1360.
Along with the bonding plate 1320, foreign matter is filtered by the filter mesh 1331 formed on the diaframe filter plate 1330, and the restrictor 1341 formed on the restrictor plate.
Flows into. Next, the PZT actuator 1313 displaces the diaframe filter plate 1330 through the PZT actuator hole formed in the bonding plate 1320 to apply pressure to the ink 1370 stored in the restrictor portion. Ink 1
The reaction 370 ejects vigorously from the orifice 1351 formed in the orifice plate to participate in printing.

When the members to be joined are joined together, the plating thickness thereof is not limited to that in the above embodiment, and for example, the thickness is 0.5 μm in order from the base material side.
m or less Ni plating, thickness 5 μm or less Au plating, thickness 5 μm or less Sn plating, thickness 5 μm or less Au plating layered, or a metal member plated as described above If the target of connection is a layered Ni plating having a thickness of 0.5 μm or less and an Au plating having a thickness of 0.5 μm or less in order from the base material side, the intended effect of the present invention can be obtained. it can.

According to the present embodiment, since each component forming the ink jet nozzle is connected by the Au--Sn alloy, it is less deteriorated with time and more reliable than the case where the organic adhesive is used for joining. It is possible to perform high-quality joining.

Further, the Au--Sn alloy has excellent corrosion resistance to acids and alkalis, and can be used even in inks that are corrosive at high temperatures, increasing the degree of freedom in ink design. As a result, there is an effect that development of an ink having good printing characteristics is facilitated.

In the above embodiment, the material of each component is SU.
S304, Ni alloy, and aluminum are used, but general steel, copper alloy, etc. have an Au—Sn eutectic temperature of 280 ° C.
Any material can be used as long as it can withstand the above heating. Further, although Ni plating is used as the base plating of Au plating, the same effect can be obtained by Cu plating. In addition, the bonding atmosphere is not limited to N ₂ , and the bonding can be similarly performed in a non-oxidizing atmosphere such as Ar.

[0087]

EFFECTS OF THE INVENTION According to the present invention, (a) In the bonding process, by containing hydrogen or water in the plating film, hydrogen or water is gasified by heating during bonding, and this gas (bubble ) Stirs the molten Au-Sn alloy when it flows out of the joint.
u-Sn alloy can be agitated, and Au-S
Since the weight distribution of n is determined in consideration of the Ni plating of the base and the reaction with the Ni-Au-Sn compound generated during the process, it is possible to provide a bonding method having high bonding strength in the process. Further, Ni plating is applied as a base plating of the members to be joined in consideration of corrosion resistance.
By setting the thickness of the plating to 0.5 μm or less, the Ni plating is completely dissolved in the Au—Sn alloy financial solution during the bonding and does not remain at the bonding interface, so that the strong bonding is further promoted.

(B) Since the Au—Sn alloy is supplied in the form of a plating film, not as a foil, the conventional manufacturing process of the Au—Sn foil can be eliminated and the manufacturing cost can be reduced. .

(C) The bonding surface before bonding is Au,
Since u does not oxidize, it becomes possible to integrate the joint without using flux, eliminating the conventional flux removal work and improving work efficiency, and eliminating the problem of corrosion of the joint due to residual flux,
The corrosion resistance of the joint can be improved.

(D) Further, in the joining method of the present invention, since the heating temperature of the joining material can be made lower than that of the high melting point brazing material, deformation of the members due to heat is small. Since the Au—Sn alloy has excellent corrosion resistance, it is not corroded even by highly corrosive ink. In particular, when each component forming the jet nozzle of the inkjet is connected with Au-Sn alloy, the deterioration with time is less than that in the case of bonding with an organic adhesive, and the bonding with high reliability is performed. You can

Further, the Au--Sn alloy has excellent corrosion resistance to acids and alkalis and can be used even in inks that are corrosive at high temperatures, increasing the degree of freedom in ink design. As a result, there is an effect that it becomes easy to develop an ink having good printing characteristics.

[Brief description of drawings]

FIG. 1 is a sectional view showing a joining process according to a first embodiment of the present invention.

FIG. 2 is a diagram showing the relationship between peel strength and the thickness of a Ni—Au—Sn intermetallic compound.

FIG. 3 is a state explanatory diagram of an Au-Sn binary system.

FIG. 4 is a sectional view showing a joining process according to the second embodiment of the present invention.

FIG. 5 is a sectional view of an Au—Sn brazing insert material according to a third embodiment of the present invention.

FIG. 6 is a cross-sectional view showing a process of joining two members by using the Au-Sn brazing insert material.

FIG. 7 is a sectional view of an Au—Sn brazing insert material according to a fourth embodiment of the present invention.

FIG. 8 is a sectional view showing a process of joining two members by using the Au-Sn brazing insert material of the fourth embodiment.

FIG. 9 is a plan view showing an example of dimensions and arrangement of holes formed in the insert material used in the fourth embodiment.

FIG. 10 is a sectional view of an Au—Sn brazing insert material according to a fifth embodiment of the present invention.

FIG. 11 is a sectional view showing a process of joining two members by using the Au-Sn brazing insert material of the fifth embodiment.

FIG. 12 is a sectional view of an inkjet printer (sixth embodiment) to which the present invention is applied.

FIG. 13 is an exploded perspective view showing a detailed structure of a print nozzle used in the inkjet printer.

FIG. 14 is an explanatory diagram showing a joining process of the print nozzle.

[Explanation of symbols]

101 ... SUS304 plate (base material), 102 ... Ni plating, 103 ... Au plating, 104 ... Sn plating, 105
... Au plating, 106a ... Au-Sn combined financial liquid, 106
b ... Au-Sn alloy, 107 ... Ni-Au-Sn intermetallic compound, 401a, 401b ... SUS304 plate, 402
a, 402b ... Ni plating, 403a ... Au plating, 4
04a ... Sn plating, 405a, 405b ... Au plating, 406a ... Au-Sn combined financial liquid, 406b ... Au-
Sn alloy, 407a ... Ni-Au-Sn intermetallic compound,
407b ... Ni-Au-Sn intermetallic compound, 501 ... S
US 304 plate, 502 ... Brazing material layer (Ni plating, Au plating, Sn plating, Au plating), 503 and 504 ...
Member to be joined, 505 ... Ni plating, 506 ... Au plating, 507a ... Au-Sn-Ni compound financial liquid, 507b ...
Au-Sn-Ni alloy, 508 ... Bubbles, 701 ... SUS304 plate with holes, 702 ... Gas reservoir hole, 502 ... Brazing material layer (Ni plating, Au plating, Sn plating, Au plating), 803, 804 ... Joined Member, 805 ... Ni plating, 806 ... Au plating, 807a ... Au-Sn-Ni
Synthetic financial fluid, 807b ... Solidified Au-Sn-Ni alloy,
808 ... Bubbles, 901 ... Au-Sn brazing insert material, 902, 903 and 904 ... Hole, 1001 ... SU
S304 plate, 502 ... Brazing material layer (Ni plating, Au plating, Sn plating, Au plating) 1103, 1104 ...
SUS304 (joined members), 1105 ... Ni plating,
1106 ... Au plating, 1107a ... Au-Sn-Ni
Synthetic finance liquid, 1107b ... Au-Sn-Ni alloy, 808
... Bubbles, 1207 ... Print head, 1410 ... Ni plating / Au plating layer), 1420 ... Brazing material layer (Ni plating / Au plating / Sn plating / Au plating layer), 1
421 ... Gas reservoir, 1430 ... Brazing material made of Au-Sn-Ni alloy, 1450 ... Epoxy adhesive.

 ─────────────────────────────────────────────────── ─── Continuation of the front page (72) Masaya Horino, Masaya Horino, 502 Jinritsucho, Tsuchiura-shi, Ibaraki Hiritsu Seisakusho Co., Ltd.Mechanical Research Institute (72) Akemi Kono, 502, Jinritsucho, Tsuchiura-shi, Ibaraki Japan Tate Seisakusho Mechanical Research Center

Claims (4)

[Claims] 1. A metal member in which a base plating having a thickness of 0.5 μm or less, an Au plating having a thickness of 5 μm or less, an Sn plating having a thickness of 5 μm or less, and an Au plating having a thickness of 5 μm or less are layered in order from the base material side. Or a metal member that has been subjected to the layered plating, and a base plating layer having a thickness of 0.5 μm or less in order from the base metal side, and a thickness of 0.5 μm.
The following metal member that has been layered with Au plating is heated and pressed in a vacuum or in an inert gas to be bonded, and the bonding condition is a system of Au plating and Sn plating excluding the undercoat. In the composition of No. 2, Sn is 20 in the whole plating combination to be laminated.
The content of the Au plating and the Sn plating is more than 0% and less than 40% by mass.
A method for joining metal members, characterized in that wet plating containing at least one of hydrogen and water, which is 1/2 times or more the plating volume in terms of 1 ° C. at 1 ° C., is used. 2. A brazing insert material to be inserted between members to be joined, wherein a surface of a base material of the insert material is underplated, and Au plating and Sn plating are layered on the base plating. An insert material for Au-Sn brazing, characterized in that at least one kind of plating film among the plating layers contains hydrogen or water at ½ times the plating volume in terms of 0 ° C and 1 atm. 3. The insert material for Au—Sn brazing according to claim 2, wherein the base material is provided with a plurality of through holes. 4. An ink jet printer, comprising an ink jet printer comprising a print head formed by laminating and joining metal members having ink flow paths using Au—Sn alloy.