JPH08162581A - Semiconductor manufacturing apparatus and burr removing device used therein - Google Patents

Abstract

PURPOSE: To enable down-sizing to thoroughly execute a post-treatment process by executing a burr removing process with grinding by a grind stone and using a brush and a punch. CONSTITUTION: A semiconductor manufacturing apparatus comprises a loader 6 to supply a work, a pushing station 9, a first burr removing means 12 to remove burs with grinding by a grind stone, a second burr removing means 19 with a brushing and a punch means operating as a third bur removing means 25. Moreover, a turn-over machine 29, a flux means 30, an arranging and drying machine 31, a solder dip tank 33, an ordering machine 34 and a transfer robot 32 are also comprised. Moreover, a separator means 36 for cutting the part coupling each lead at the end part of lead of the work having completed the solder dipping pushed out from the ordering machine and a cleaning tank 43 for cleaning the work separated by the separator 36 are also provided.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor device manufacturing apparatus, and more particularly to a technique effective when applied to a resin-sealed semiconductor device having external leads in one direction.

[0002]

2. Description of the Related Art In the manufacture of a resin-sealed semiconductor device, a lead frame is used to mount a semiconductor chip on the lead frame, the semiconductor chip is sealed by transfer molding or the like, and then soldered to external leads. Then, each step such as cutting is performed to complete the semiconductor device.

The post-treatment process, which is a process after the sealing of these semiconductor chips, is generally a process in which a large amount is collectively processed by using an independent device for each process. For example, Japanese Patent Laid-Open No. 61-5975 discloses a deburring device.
No. 9 and a soldering device are disclosed in JP-A-59-16386, and a separate device is JP-A-55-1669.
There is number 46.

[0004]

However, although there is no particular description in the above-mentioned documents, when each device is independent and a large amount of processing is performed, the size of each device is large. It is generally the one. Further, there is a problem in that the transportation between the devices is often performed manually. Especially in deburring to remove burrs formed on the lead frame during semiconductor chip encapsulation, equipment such as sandblasting and deflashing is often used, and walnut powder or polishing powder is sprayed to remove the resin to remove burrs. Therefore, there is a problem that downsizing is difficult in terms of the size of equipment.

An object of the present invention is to solve the above-mentioned problems and provide a miniaturized semiconductor device manufacturing apparatus.

[0006]

Means for representing a typical one of the inventions disclosed in the present application will be described as follows.

That is, in a semiconductor manufacturing apparatus for manufacturing a semiconductor device, a loader section which prepares and supplies a work consisting of a lead frame having a plurality of sealing sections in which semiconductor chips are sealed at desired positions, and a loader section attached to the work A first deburring section for removing burrs with a grindstone, a second deburring section for removing with burrs, a third deburring section for pushing down with a punch, and the first, second and third deburring A flux portion for applying the flux to the lead frame deburred by the portion, a solder bath for dipping the lead frame coated with the flux in the flux portion into a solder bath to form a solder layer, and the flux applying portion. A transport means for transporting between the solder baths and a separator portion for removing a connecting portion of the lead frame which has been soldered in the solder bath A semiconductor manufacturing apparatus for manufacturing a finished washed resin-sealed semiconductor device of the semiconductor device was said separate.

[0008]

As described in the above means, the deburring process, which has been a problem in downsizing in the present invention, can be downsized by using a grinding wheel, a brush and a punch. With an appropriate layout configuration, it is possible to provide a semiconductor manufacturing apparatus capable of consistently performing post-processing steps in manufacturing a resin-sealed semiconductor device.

[0009]

1 is a front view showing an overall schematic view of a semiconductor manufacturing apparatus according to an embodiment of the present invention, FIG. 2 is a schematic partial sectional view showing a loader portion of this embodiment, and FIG. FIG. 4 is a side view and a front view showing a device for grinding and removing with a grindstone in the section.
Is a side view and a front view showing what is removed by brushing with a brush in a deburring portion, FIG. 5 is a top view showing the shape of a punch of a cutting die for a target work, and FIG. 6 is a diagram of a soldering device. FIG. 7 is a side view showing an outline, FIG. 7 is a side view showing a cutting device for removing an unnecessary portion of a work according to the present embodiment, and FIG. 8 is a partial cross-sectional side view showing a cleaning tank according to the present embodiment. 9 is a front view showing a work to be processed in the present application, FIG. 10 is a front view showing a work after deburring the work shown in FIG. 9, and FIG. 11 is an apparatus according to this embodiment. FIG. 4 is a front view showing a work for which processing has been completed.

As shown in FIG. 9, a work 6 which is a target in this embodiment uses, for example, a lead frame, and a lead 2 formed by connecting to a connecting portion 1 of the lead frame and an end portion of the lead. It has a sealed portion 4 of a semiconductor element. The work has burrs 5c attached to the lead frame, burrs 5b formed in a portion surrounded by the leads 2, the tie bar 3, and the sealing portion 4, and burrs formed between the sealing portion 4 and the tie bar. 5a and the like are formed.

The manufacturing apparatus in this embodiment will be described.

As shown in FIG. 1, the apparatus according to the present embodiment has a loader 6 for supplying a target work, an extrusion station 9 for carrying the work transferred from the loader 6, and a discharge station for carrying out the work. A first burr removing section 12 for removing resin adhering to the surface of the lead frame of the work by grinding wheel grinding, and a burring for removing burr formed around the sealing section after burr removal by grinding wheel grinding. The burr removal unit 19 of 2,
A punch unit that becomes a third deburring unit 25 that removes burrs of a work conveyed from the deburring unit by brushing and that is surrounded by leads and a sealing unit, and a reversing machine 29 that erects the work. And a flux unit 30 that conveys the upright work while it is upright and applies flux, an aligning and drying unit 31 that aligns and dries the work to which the flux has been applied, and the drying unit 31.
A solder dip tank 33 formed side by side, an aligning machine 34 for arranging the work in which the solder layer is formed on the lead in the solder dip tank 33, and a transport for transporting between the aligning and drying section, the solder dip tank and the aligning machine The robot 32, a separator part 36 for cutting the part where the leads of the work extruded from the aligner are connected to each other, and a cleaning process for cleaning the work separated by the separator 36. It consists of a tank 43.

Next, the operation of the apparatus in this embodiment will be described.

As shown in FIG. 2, the jig containing the work 6 is set in the loader. The works 6 are alternately arranged on this jig. The work 6 is pushed up from below the jig by the push-up device 7, and the work 6 is set in the work pushing-out station 9 from the jig by the vacuum handling 8.
In the extrusion station 9, the individual work pieces 6 are extruded from the station 9 by the extrusion device 10. After the work 6 is pushed out, the lead end portion of the work is pinched by the transfer rail 11 and transferred. At the time of this conveyance, the first deburring unit 12
Then, the lead frame surface having the burrs 5c adhered thereto is ground by a grindstone to remove the burrs 5c adhered to the leads 2 surface.

Next, the first deburring portion 12 will be described with reference to FIG. For the first deburring unit 12, a luter attached to a support 14 is used, a grindstone 15 is attached to a head that rotates at a high speed, and the bur is driven by a drive mechanism such as an air motor. A plurality of these are arranged and can be driven freely. The grindstone 15 is an elastic member 1 composed of a compression spring and a spring stopper at the base of the support base 14.
It is elastically attached by means of 3, and is configured so as to contact the work 2 so as not to damage the work 2 more than necessary by the grinding of the grindstone and grind away the burr 5c on the work surface. Also, the grindstone part wears away, but using a screw nut enables adjustment of the overall height, which can be solved. The work 6 is conveyed between the rails by an upper belt 18 and a lower belt 17 which are conveyor belts.

Next, the brushing portion which is the second deburring portion 19 will be described. After the burr removal on the surface of the lead 2 is completed by the first burr removing part 12 by the grinding wheel grinding, the burr 5a, 5b formed between the sealing part and the tie bar is sent while being held by the belt and removed. Then, it is sent to the brushing section which becomes the second burr removing section 19. The brush 20 of the brushing portion has a drive source at the rear portion of the support rod 21 via an elastic body 22 and is configured to move with an appropriate strength in the front-rear direction. The brush 20 brushes and removes burrs around the sealing portion of the work 6 held and conveyed between the belts. For removing these burrs, the deburring conditions can be appropriately set by adjusting the material of the brush and the driving force.

Then, after being conveyed by the belt and extruded by the pushing mechanism 23, the tie bar 3 and burrs of the individual works 6 serving as a third deburring portion are provided by the work feed 24 arranged at the next predetermined pitch. Third to remove
It is sent to the punch which will be the burr removing unit 25.

In this punch, a burr 5b formed in a portion surrounded by the lead 2, the tie bar 3 and the sealing portion 4 and a burr 5 formed between the sealing portion 4 and the tie bar.
The tie bar 3 is removed while a is pushed down by the corresponding dies 27 and 28.

FIG. 10 shows the work 2 which has completed these processes.
8 is shown.

After the burr removal and the tie bar cutting are completed, in order to perform a solder dip which is the next step, those which are conveyed and processed in a flat state at the reversing section 29 are rearranged upright.

At the reversing portion 29, the flat work 28, which has been subjected to burr removal and tie bar cutting, is raised by 90 °,
Insert into the flux applying section 30. Flux application part 3
0 is performed in order to apply the flux to the external leads 2 of the work 28 to be soldered, and the flux is supplied during the transportation to apply the flux. Along with that, it is conveyed by a belt.

Next, the soldering device will be described. Figure 6
As shown in FIG. 3, the soldering portion is composed of a drying unit 31, a solder dip tank 33 and an alignment unit 34 provided on the opposite surface of the drying unit 31 in an upright state for performing flux drying. The work 28 to which the flux has been applied is sent to the drying unit 31 and is provided in a concave alignment portion for drying. When a certain time has elapsed, the work is chucked by the arm 35 by the transfer mechanism of the XZ robot 32 in order from the previously dried work, and the external lead portion of the work 28 is dipped in the solder dip bath 33 to external lead 2 Apply solder to. After the solder dip, the solder dip is transferred to the aligner 34 provided on the opposite surface of the solder dip bath 33.

Next, from the aligner, a feed mechanism 35 is fed to the separator mold 36 to complete the work 28.
To be transported.

As shown in FIG. 7, the molds are constructed in parallel, and the cutting molds are the central mold 37 and the molds on both sides thereof and a cutting blade 40 having a drive mechanism 39 attached to the rear part thereof. The work 28 is arranged between the central mold 37 and the molds arranged on both sides thereof. The driving mechanism 39 moves the cutting blade 40 to cut the connecting portion 1 formed at the tip of the work 28 and separate the cutting portions.

The connecting die 1 of the work 28 is cut by the separate die 36, as shown in FIG. Next, it is sent to the cleaning tank 43 through the transport path 42, and the excess solder and the excess flux are cleaned. FIG. 8 shows a cleaning tank. The cleaning liquid enters through the injection hole 47 and is discharged through the discharge hole 48. 45 and 46 are baskets containing the work to be cleaned.

After the cleaning, the work becomes a completed semiconductor device.

According to this embodiment, it becomes possible to remove the burrs adhering to the work by means suitable for each part by the first, second and third deburring parts, and in comparison with the conventional deburring device. , It is possible to make a large size reduction. In addition, since the transporting means is provided between the respective parts, it is possible to simplify the entire apparatus.

In particular, since it is possible to remove burrs by using a grindstone and a brush, it is possible to downsize the apparatus and to realize an integrated apparatus in a space that is significantly smaller than conventional equipment. can get.

Although the present invention has been described above based on the technology which is the background of the present application, it is needless to say that the present invention is not limited to the above-mentioned embodiments and various modifications can be made without departing from the technology. Absent.

[0030]

The effects of the invention obtained by the invention disclosed in the present application will be described below.

That is, it is possible to provide a small integrated device capable of resin removal, dam cutting, soldering, separation, etc. in the manufacture of semiconductor devices.

[Brief description of drawings]

FIG. 1 is a front view showing an overall schematic view of a semiconductor manufacturing apparatus that is an embodiment of the present invention.

FIG. 2 is a schematic partial cross-sectional view showing a loader portion of this embodiment.

FIG. 3 is a side view and a front view showing an apparatus for grinding and removing with a grindstone in a deburring section.

4A and 4B are a side view and a front view showing what is removed by brushing with a brush in a deburring portion.

FIG. 5 is a top view showing a shape of a punch of a cutting die for a target work.

FIG. 6 is a side view schematically showing a soldering device.

FIG. 7 is a side view showing a cutting device for removing an unnecessary portion of the work according to the present embodiment.

FIG. 8 is a schematic side view of a partial cross section showing a cleaning tank in the present embodiment.

FIG. 9 is a front view showing a work to be processed in the present application.

FIG. 10 is a front view showing a work after the work shown in FIG. 9 has been subjected to deburring processing.

FIG. 11 is a front view showing a work which has been processed by the apparatus according to the present embodiment.

[Explanation of symbols]

1. ． Connection part, 2. ． Reed, 3. ． Tie bar, 4. ．
Sealing portion, 5. ． Bali, 6. ． Work, 7. ． Lifting device, 8. ． Vacuum handling device, 9. ． Extrusion station, 10. ． Extruder, 11. ． Conveyor belt, 1
2. ． Deburring section, 13. ． Elastic material, 14. ． Support,
15. ． Whetstone, 16. ． Transport rail, 17. ． Conveyor belt, 18. ． Conveyor belt, 19. ． Deburring device, 2
0. ． Brush, 21. ． Support rods, 22. ． Elastic material, 2
3. ． Extruder, 24. ． Lead frame feed, 2
5. ． Punch, 26, 27. ． Punch kana type, 28. ．
Work, 29. ． Reversing machine, 30. ． Flux application part,
31. ． Alignment dryer, 32. ． Transport machine, 33. ． Solder bath, 34. ． Aligning machine, 35. ． Extruder, 36. ． Separator, 37. ． Mold, 38. ． Work, 39. ． Drive device, 40. ． Cutting blade, 42. ． Transport path, 43. ． Cleaning unit, 44. ． Cleaning tank, 45, 46. ． Basket, 47. ． Cleaning solution (entrance), 48. ． Cleaning liquid (drainage path)

Claims (3)

[Claims] 1. A semiconductor manufacturing apparatus for manufacturing a semiconductor device, wherein a loader which prepares and supplies a work composed of a continuously formed lead frame having a plurality of sealing portions in which semiconductor chips are sealed at desired positions. Section, a first burr removing section that removes burrs adhering to the workpiece with a grindstone, a second burr removing section that removes the burr with a brush, and a third burr removing section that pushes down the burr with a punch. And a flux portion for applying flux to the lead frame of the work deburred by the first, second, and third deburring portions, and a solder layer on the lead frame to which flux has been applied in the flux portion. A solder bath to be formed, a separator portion for removing a connecting portion of the lead frame which has been soldered in the solder bath, and a semiconductor device in which the separation is finished. And a cleaning apparatus for cleaning a semiconductor fabrication apparatus characterized by comprising with means for conveying between the various parts. 2. An apparatus for removing burrs adhering to a work, which comprises a lead frame having a sealing portion in which a semiconductor chip is sealed at a desired position, in which a rotating grindstone and a drive section for driving the grindstone. The burr removal device is characterized in that the burr is removed by rotating a grindstone in contact with the resin adhesion part. 3. An apparatus for removing burrs formed on a work consisting of a lead frame having a sealing portion in which a semiconductor chip is sealed at a desired position, and a brush and a driving mechanism for driving the brush back and forth. The deburring device is characterized in that the deburring is performed by bringing the brush into contact with the deburring portion and driving the brush.