JPH08153744A - Bonding apparatus, and substrate pressure fixing mechanism - Google Patents

Abstract

PURPOSE: To provide a substrate pressure-fixing mechanism capable of always certainly pressure-fixing a substrate with a uniform pressure distribution over the entire pressure face even if bonding areas of the substrate are divided into very small sections corresponding to many pins of a semiconductor device to be produced. CONSTITUTION: A push member 176 to contact with and push a bonding area of a substrate L/F or a bonding stage 255 or only the member 176 is mounted on a support mechanism 101 tiltably in a plane contg. in the moving direction to and from the push member 176 and bonding stage 255. The mechanism 101 supports the member 176 and stage 255 so as to move one to the other relatively whereby the member 176 automatrcally profiles the surface of the bonding stage to closely contact with the substrate. The push member or bonding stage or only the push member is secured to four or two points on the support mechanism.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a bonding apparatus to be used in a semiconductor device manufacturing process and a substrate pressing / fixing mechanism to be equipped in the apparatus.

[0002]

2. Description of the Related Art As an example of this type of apparatus, there is a wire bonding apparatus shown in FIG. The detailed structure of the wire bonding apparatus is, for example, 4-2.
Since it is disclosed in Japanese Laid-Open Patent Publication No. 0232, the description of the entire apparatus will be briefly described here, and only a main part will be described in detail.

As shown in FIG. 20, in the wire bonding apparatus, a magazine M in which a plurality of lead frames L \ F as substrates to be handled are arranged and accommodated (arranged in a direction perpendicular to the paper surface) is a loader. 25
1 is loaded. As shown in FIGS. 21 and 22, a plurality of islands 249 are formed in this lead frame L \ F at equal pitches along the longitudinal direction thereof, and a large number of islands 249 are formed so as to surround each island 249. Lead 2
50 are formed. And each of the islands 249
An IC chip 253 is attached to each of them. The wire bonding apparatus, as shown in FIG.
The pad 253a on the chip 253 and each lead 250 corresponding to these are connected by bonding using a conductive wire 248 made of gold, aluminum or the like.

Of the respective lead frames L \ F in the magazine M loaded as described above, for example, the lowermost one of the lead frames L \ F is pushed out by the pushing means 254 and further moved by the frame transferring means (not shown) to serve as a bonding stage. It is loaded onto a functional heater plate 255. The lead frame L \ F transferred by the frame transfer means has a pair of guide rails 257 and 258 as guide members arranged so as to correspond to both sides thereof.
And is brought onto the heater plate 255. As indicated by an arrow N in the figure, the guide rails 257 and 258 are adjustable in distance from each other, and are driven to be relatively moved toward and away from each other by a guide member driving means (not shown), so that various width dimensions are different. Compatible with lead frames.

When the lead frame L \ F reaches above the heater plate 255 as described above, the frame transfer means intermittently feeds the lead frame L \ F by the arrangement pitch of each IC chip 253, and the lead frame L \ F. The F bonding target portion is sequentially positioned at the bonding work position 259. Along with this, the pads 253a of each IC chip 253 and the leads 250 formed on the lead frame are bonded and connected by the bonding means 260 using the wires 248. During this bonding, the bonding target portion is pressed and fixed to the heater plate 255 by the pressing and fixing means 261 as a substrate pressing and fixing mechanism. Thus, the lead frame L \ F which has completed the bonding is further fed by the frame transfer means, and is housed in the empty magazine M loaded in the unloader 262 having the same configuration as the loader 251.

Next, the positioning means (described later) included in the loader 251 is actuated to lower the magazine M by one pitch of the arrangement pitch of the lead frames L \ F housed therein, and the series of operations described above. Is 2 from the bottom
This is performed for the first lead frame. The same is repeated thereafter for each lead frame L \ F in the magazine M until the bonding is completed.

Now, the loader 251 will be described in detail. Note that, as described above, the unloader 262 has the same configuration as the loader 251, and therefore the description thereof will be omitted.

As shown schematically in FIG. 20, the loader 2
The reference numeral 51 lowers or raises the lead frames L \ F arranged and accommodated in the magazine M by the pitch of arrangement of the lead frames L \ F in order to push the lead frames L \ F one by one by the pushing means 254 described above. Positioning means 265 for positioning by moving the magazine M in a direction perpendicular to the paper surface, a movable base 266 on which the positioning means 265 is mounted, and a movable base 266 provided on the movable base 266 to move the magazine M downward (or upward). And a regulating means 267 for regulating in a vertical horizontal plane. However, the regulation of the magazine M by the regulation means 267 does not mean that the magazine M is completely fixed, but a regulation with a proper gap between the magazine M and the positioning means 265.
It is possible to lower (or raise) the magazine M by the operation of. The above-mentioned positioning means 265
And pushing means 254 and both guide rails 257 and 258.
And the frame transfer means (not shown) described above,
A frame transfer means is configured.

The movable base 266 is mounted on a pedestal 270, which is the main body of the wire bonding apparatus, via a guide mechanism (not shown), and is in the direction indicated by the arrow O, that is, the movable direction of the guide rails 257 and 258 described above. The position can be adjusted in the direction parallel to N.

Next, the structure of the bonding stage on which the bonding work is performed on the lead frame L \ F by the bonding means 260 (see FIG. 20) and its peripheral structure will be described in detail.

As described above, this bonding stage is a heater plate 255 which functions as a stage.
Is called. As shown in FIGS. 20 and 23, the heater plate 255 is a heater block 27.
It is mounted on the 3. As shown in the figure, the heater block 273 contains a heater 274 as a heat generating means. These heater plates 25
5, the heater block 273 and the heater 274 constitute a heating unit that heats the lead frame L \ F. That is, the heater plate 255 acts as a contact member for contacting the lower surface of the lead frame L \ F and heating it, and the heater block 273 is interposed between the heater 274 and the heater plate 255 to transfer heat. Acts as a heat transfer member. The lead frame L \ F is heated to a predetermined temperature by this heating means, and the bonding work is performed in the heated state.

Next, the structure of the pressing fixing means 261 for pressing and fixing the bonding target portion of the lead frame L \ F to the heater plate 255 will be described in detail.

As shown in FIGS. 20 and 23, the pressing and fixing means 261 has a frame pressing member 277 which is a pressing member for abutting and pressing the bonding target portion of the lead frame L \ F. . As is clear from FIG. 23, the frame retainer 277 has an opening 277a facing the bonding target portion. The frame retainer 277 directly abuts and presses each pad 253a of the IC chip 253 (see FIG. 22).
The leads 250 are formed on the lead frame L \ F in correspondence with each of the leads 250.

As shown in FIG. 23, the frame retainer 2
A support base 279 that supports 77 is provided. The support base 279 includes a track rail 280a and a slider 28.
It is guided in the vertical direction (the arrow Z direction and the opposite direction) by the linear motion guide unit 0b and is movable. The track rail 280a is fixed to the pedestal 270 (see FIG. 20) described above.

Similarly, as shown in FIG. 23, a ball bearing 281 as a cam follower is attached to the slider 280b, and a disc-shaped cam member 282 which is in sliding contact with the ball bearing 281 is provided. The cam member 282 is rotationally driven by the pulse motor 283, whereby the support base 279, that is, the frame retainer 277 is moved up and down at a predetermined timing based on the action of the cam surface of the cam member 282.

On the other hand, the heater plate 255, that is, the bonding stage, on which the bonding target portion of the lead frame L \ F should be pressed and fixed by the frame retainer 277, can also be raised and lowered by the following structure.

That is, as shown in FIG. 23, the heater block 273 to which the heater plate 255 is attached is mounted on the movable table 285. The movable base 285 includes a track rail 286a and a slider 286.
By the linear motion guide unit consisting of b, the vertical direction (arrow Z
Direction and the opposite direction) and is movable. The track rail 286a is fixed to the mount 270 (see FIG. 20) described above.

A ball bearing 288 as a cam follower is attached to the slider 286b, and a disk-shaped cam member 289 which is in sliding contact with the ball bearing 288 is provided. Then, the cam member 2
89 is rotationally driven by a pulse motor 283 together with a cam member 282 for raising and lowering the frame retainer 277. As a result, the movable base 285, that is, the heater plate 255 and the heater block 273 are vertically moved at a predetermined timing based on the action of the cam surface of the cam member 289.

By the support 279, the track rail 280a and the slider 286b, the movable base 285, the track rail 286a and the slider 286b described above, the frame retainer 277 and the heater plate 25 are provided.
5, that is, a supporting mechanism for supporting the bonding stage so as to be relatively close to and away from each other.

Further, the above-mentioned ball bearing 281
The cam member 282, the pulse motor 283, the ball bearing 288, and the cam member 289 constitute a driving unit that drives the frame retainer 277 and the heater plate 255 to come into contact with and separate from each other and applies a pressing force when they approach each other. Has been done. The drive means, the support mechanism, and the frame retainer 277 constitute the above-mentioned pressure fixing means 261. That is, the bonding target portion of the lead frame L / F is pressed and fixed to the heater plate 255 by the mutual proximity operation of the frame retainer 277 and the heater plate 255 based on the rotation of the pulse motor 283, and also the mutual separation operation. The fixed state is released.

[0021]

As described above, in a bonding apparatus such as a wire bonding apparatus,
During the bonding work by the bonding means 260,
The bonding target portion of the lead frame L \ F is pressed and fixed to the heater plate 255 as a bonding stage. This is to ensure the bondability of bonding, the accuracy of bonding position, and the like.

Conventionally, in order to surely press the bonding target portion, specifically each lead 250 (see FIG. 22), the surface of the frame retainer 277 facing the lead frame L \ F is manually ground and polished. The lead frame L \ F has been processed with extremely high precision
It is being done to increase closeness with.

However, in recent years, it has been desired to increase the number of pins of semiconductor devices to be manufactured, and in order to meet this demand, the number of leads is increasing and the width dimension of the leads is narrowing, and the above means is sufficient. It is becoming difficult to retain such leads. In particular, it is difficult to deal with this manually by the worker as described above. Further, in the above-mentioned configuration, even if the frame retainer has secured close contact once, it cannot be used repeatedly due to aging or deformation due to handling reasons, and it is necessary to replace it relatively early, so if Even if it can be used, it takes time to check and adjust the closeness, which is a problem to be solved in order to improve workability in combination with the necessity of the above-mentioned manual work.

Further, the frame retainer is exchanged according to a change in the type of the lead frame L \ F which is the bonding target to be pressed and fixed. The adjustment time is high in the total work, and productivity cannot be improved.

Further, when the same frame retainer is diverted among a plurality of bonding apparatuses, any apparatus can be used under the same conditions, that is, in order to eliminate the machine difference, the assembly error of each apparatus itself is minimized. It is necessary to make it small, productivity is not increased due to restrictions on processing accuracy and assembly accuracy,
It is an obstacle to cost reduction.

The present invention has been made in view of the above-mentioned drawbacks of the prior art. The object of the present invention is to make the bonding target portion of the substrate compatible with the increase in the number of pins of the semiconductor device to be manufactured. Even if it is miniaturized, it can always be reliably and pressure-fixed with an even pressure distribution over the entire pressing surface, while improving workability and productivity, and further reducing costs. It is an object of the present invention to provide a bonding device that can produce an effect.

Another object of the present invention is to provide a substrate pressing and fixing mechanism that contributes to the achievement of the above effects.

[0028]

SUMMARY OF THE INVENTION The present invention is a bonding method in which bonding target portions of a substrate positioned on a bonding stage are pressed and fixed to the bonding stage by the pressing and fixing means to perform bonding connection by the bonding means. In the apparatus, the pressing and fixing means includes a pressing member for abutting and pressing the bonding target portion, a support mechanism for supporting the pressing member and the bonding stage so as to be relatively close to and away from each other, and the pressing member. A driving means for driving the member and the bonding stage so as to contact and separate and applying a pressing force when the members are close to each other, and one of the pressing member and the bonding stage includes a direction of the proximity and separation with respect to the support mechanism. Can be tilted in the plane and is almost perpendicular to the direction of proximity and separation. Mounted at four points in the plane, the respective four points are those that are arranged substantially symmetrically with respect to the two imaginary straight lines each perpendicular to each other at the center of the bonding target portion. Further, the present invention provides a bonding apparatus for performing bonding connection by the bonding means in a state where the bonding target portion of the substrate positioned on the bonding stage is pressed and fixed to the bonding stage by the pressing and fixing means. Is a pressing member for abutting against and pressing the bonding target portion, a support mechanism for supporting the pressing member and the bonding stage so that they can be moved toward and away from each other, and the pressing member and the bonding stage are brought into contact with and separated from each other. And a drive means for applying a pressing force when approaching, and any one of the pressing member and the bonding stage is tiltable in a plane including the approaching and separating direction with respect to the support mechanism, and Mounted at two points in a plane that is almost perpendicular to the direction of proximity and separation Is, the two points are those that are arranged substantially symmetrically with respect to said central and on a virtual straight line passing through the center of the bonding target portion. Further, the substrate pressing / fixing mechanism according to the present invention allows a pressing member for contacting a bonding target portion of the substrate and pressing the bonding target portion with respect to the bonding stage, and the pressing member and the bonding stage to be relatively close to and separated from each other. A supporting mechanism for supporting the pressing member and a bonding stage, and a driving means for applying a pressing force when the pressing member and the bonding stage are brought into contact with each other. Mounted at four points in a plane that is tiltable in a plane that includes and is substantially perpendicular to the direction of proximity and separation, and the four points are two virtual straight lines that are orthogonal to each other at the center of the bonding target portion. They are arranged substantially symmetrically with respect to each other. Further, the substrate pressing / fixing mechanism according to the present invention allows a pressing member for contacting a bonding target portion of the substrate and pressing the bonding target portion with respect to the bonding stage, and the pressing member and the bonding stage to be relatively close to and separated from each other. A supporting mechanism for supporting the pressing member and a bonding stage, and a driving means for applying a pressing force when the pressing member and the bonding stage are brought into contact with each other. It is mounted at two points in a plane that is tiltable in a plane that includes and is substantially perpendicular to the direction of the approaching / separating, and these two points are on a virtual straight line that passes through the center of the bonding target portion, and are substantially with respect to the center. They are arranged symmetrically.

[0029]

In the above structure, the pressing member and the bonding stage automatically move along the surface of the bonding stage and come into close contact with the substrate by the relative approaching motion of the bonding member. Further, because of the above-mentioned four-point or two-point support structure, the pressing state of the pressing member with respect to the bonding target portion can obtain a uniform pressure distribution over the entire pressing surface.

[0030]

DESCRIPTION OF THE PREFERRED EMBODIMENTS Next, a wire bonding apparatus as an embodiment of the present invention will be described with reference to the accompanying drawings. The wire bonding apparatus is configured in the same manner as the conventional wire bonding apparatus shown in FIG. 20 except for the parts described below, and therefore the description of the wire bonding apparatus as a whole will be omitted and only the essential parts will be described. Stay on. The lead frame treated as a bonding target in the wire bonding apparatus according to the present invention is as shown in FIGS. Moreover, in the following description, the same reference numerals are given to the same components as those of the conventional wire bonding apparatus. Further, although the wire bonding apparatus is shown in this embodiment, the present invention is also applicable to die bonding and the like.

As shown in FIG. 1, on a frame 270 of the wire bonding apparatus, a bonding stage (this bonding stage is the lead frame L \ F, that is, the IC chip to be connected by bonding in the entire length of the substrate). 253 and a heater plate 255 acting as a stage portion for supporting a portion where a plurality of IC chips before and after it are mounted)
And a bonding means 260 for performing a bonding connection work on the lead frame L \ F brought onto the bonding stage, and a lead frame extruded by the pushing means 254 from the magazine M loaded in the loader 251 at the preceding stage. L \ F is brought to the bonding stage, and the lead frame L \ F after completion of the bonding connection is placed in the magazine M on the unloader 262 at the subsequent stage.
A frame transfer means (not shown) as a substrate transfer means for transferring toward the substrate and the lead frames L \ F which are arranged in parallel with each other on both sides of the lead frame L \ F transferred by the frame transfer means. Guide rails 257 and 258 are provided as guide members for guiding F along a predetermined path passing through the bonding stage.

In each of the drawings, the direction indicated by the arrow X and the opposite direction are defined as the left and right direction of the wire bonding apparatus, the direction indicated by the arrow Y and the opposite direction are defined as the front and rear direction, and the arrow Z is defined. The direction indicated by and the opposite direction will be described as the vertical direction.

First, the bonding stage in which the bonding means 260 carries out the bonding connection work to the lead frame L \ F and the structure related to the bonding stage will be described in detail.

As described above, this bonding stage is a heater plate 25 that functions as a stage for carrying the bonding target portion of the lead frame L \ F.
5 is called. As shown in FIGS. 1, 2, 4, and 5, the heater plate 255 is mounted on a heater block 64 containing a heater (not shown) as a heat generating means. These heaters,
The heater block 64 and the heater plate 255 constitute heating means for heating the lead frame L \ F. While the lead frame L \ F is heated by the heating means, the bonding means 260 shown in FIG.
Then, the thermocompression bonding connection work is performed.

The heating means including the heater plate 255 as the bonding stage is supported by the support mechanism 101 shown in FIGS. 2 to 6.

The support mechanism 101 has a frame 102 (see FIGS. 2, 4 and 5) as a fixed portion, and the frame 102 is fixed to the mount 270 described above. The frame 102 has a movable support member A104.
The movable support member B105 is reciprocally attached in the up-down direction (the arrow Z direction and the opposite direction). Specifically, as to one movable support member A104, as shown in FIGS. 2 and 6, a guide rail 107a fixed to the frame 102 side and the guide rail 1 are provided.
The movable support member A104 is slidable with respect to 07a.
It is guided by a linear motion guide unit composed of a pair of sliders 107b coupled to the. The other movable support member B105 is vertically guided by the following configuration.

As shown in FIGS. 2 to 4, the movable support member B105 is formed in a relatively long rectangular plate shape and is provided so as to extend in the front-rear direction (the arrow Y direction and the opposite direction). There is. Then, as is apparent from FIG. 3, the movable support member B105 has the intermediate member 109 at the rear end thereof.
Are fastened by bolts 105a. Similarly FIG.
6, a pair of left and right slide shafts 110 are fixed to the intermediate member 109 in a suspended state. As shown in FIG. 6, the slide shafts 110 are attached to the frame 102 via linear ball bearings 111. It is slidably attached. Further, as shown in FIGS. 2 to 5, another slide shaft 113 is fixed in the vicinity of the front end portion of the movable support member B105 in a suspended state. As is particularly clear from FIG. The linear ball bearing 11 is attached to the bracket portion 102b provided integrally with the frame 102.
It is attached slidably via 4.

With the above structure, the movable supporting member B105
Can be moved up and down.

As shown in FIGS. 2 to 5, the heating means including the heater plate 255 and the heater block 64 described above is mounted on the movable support member A104. Specifically, a pair of left and right support portions 104a are formed on the upper end side of the movable support member A104, and as is clear from FIG. 2, the intermediate plate 11 is provided between the both support portions 104a.
6, the heater block 64 is attached to the intermediate plate 116 via a heat insulating member 117. As a result, the heating means moves up and down together with the movable support member A104.

As shown in FIGS. 2 to 6, ball bearings 119 and 120 as cam followers are attached to the movable supporting member A104 and the movable supporting member B105, respectively. Specifically, as shown in FIGS. 2, 3 and 5, one ball bearing 119 is attached to the relay member 122 fixed to the left side of the upper end of the movable support member A104. Further, as is clear from FIGS. 3 and 4, the other ball bearing 120 is attached to the right end portion of the intermediate member 109 to which the movable support member B105 is coupled.

As shown in FIGS. 2 to 5, there are provided a pair of disc-shaped cam members 124 and 125 which are in sliding contact with the ball bearings 119 and 120, respectively, which serve as cam followers. As is apparent from FIG. 6, the cam members 124 and 125 are fitted to the same spindle 127, can rotate in synchronization with each other, and are rotationally driven by the pulse motor 129. Further, as shown in FIGS. 2 and 4 to 6, coil springs 131 and 132 for urging the movable support member A 104 and the movable support member B 105 downward (in the direction opposite to the arrow Z direction) are provided. Has been. In such a configuration, these cam members 12
The movable support member A104 and the movable support member B105 are vertically moved at a predetermined timing based on the action of the cam surfaces of Nos. 4 and 125 and the urging action of the coil springs 131 and 132. The drive force transmission mechanism for contacting the pulse motor 129 to the spindle 127, that is, the cam members 124 and 125 is as follows.

As shown in FIG. 6, the spindle 127 is
A toothed belt wheel 134 with a large diameter is fitted to the end of
Further, as shown in FIGS. 2 to 4, a small diameter toothed pulley 135 is fitted to the output shaft of the pulse motor 129. A toothed belt 136 is wound around the toothed belt wheels 134 and 135. As a result, the driving force from the pulse motor 129 is transmitted to the spindle 127. The movable support member A104 and the movable support member B1 are formed by the power transmission mechanism, the spindle 127, the cam members 124 and 125, the ball bearings 119 and 120 serving as cam followers, and the peripheral members related thereto.
The drive means for driving 05 is configured.

A detecting means for detecting the vertical position of the movable supporting member A104 and the movable supporting member B105 is provided, and the detecting means is constructed as follows.

As is especially clear from FIG. 6, a disc-shaped address plate 138 is fitted to one end 127a of the spindle 127. An optical sensor 139 is provided on the fixed frame 102 (see FIG. 3 etc.) corresponding to the address plate 138. As shown in FIG. 4, the address plate 138
A light transmission hole 138a is formed in the. Optical sensor 13
Reference numeral 9 denotes, for example, a photocoupler, which includes a light emitting element and a light receiving element, and the light emitted from the light emitting element is transmitted through the light transmitting hole 13
A detection signal is emitted by reaching the light receiving element through 8a.

Further, as shown in FIGS. 2, 3 and 6,
A light shielding plate 141 is attached to an end of the intermediate member 109 integrally connected to the movable supporting member B105. As shown in FIGS. 3 and 6, the light shielding plate 14
The optical sensor 142 is provided corresponding to No. 1 and is fixed to the frame 102 on the fixed side. The optical sensor 142 also includes, for example, a photocoupler, and includes a light emitting element and a light receiving element, and the light from the light emitting element enters the light receiving element, or the light shielding plate 141.
A detection signal is emitted by being blocked by.

The positions of the movable supporting member A104 and the movable supporting member B105 are detected by the detecting means as described above.

As is apparent from FIG. 2, the light shielding plate 141 has the support pin 14 at one end (left end) thereof.
It is swingably supported via 1a, and a light shielding portion is provided at the other end. As shown in the figure, the light blocking plate 141
An eccentric pin 141b is provided so as to correspond to a substantially central portion of the above, and the position of the light shielding portion can be adjusted by rotating the eccentric pin 141b using a driver or the like.

Next, the pressing fixing means for pressing and fixing the bonding target portion of the lead frame L \ F to the heater plate 255 during the bonding work on the bonding stage, that is, the heater plate 255 will be described with reference to FIGS. 7 to 17. Explain. It should be noted that the bonding target portion mentioned here is the IC chip 253 and each lead 250 shown in FIGS. 21 and 22.

This pressing and fixing means has a frame pressing member 176 shown in FIGS. 7 to 11. The frame retainer 176 acts as a pressing member for abutting and pressing the bonding target portion of the lead frame L \ F.

Details of the frame retainer 176 are shown in FIGS. As is clear from each of the drawings, the frame retainer 176 includes a substantially flat plate-shaped horizontal portion 176a, a vertical portion 176b continuously extending upward at both ends of the horizontal portion 176a, and both the vertical portions 176b. Has an extending portion 176c continuously extending horizontally from the tip of each of them, and these are integrally formed with each other. As shown, the horizontal portion 17
A substantially rectangular opening 176d is formed at the center of 6a so as to face the bonding target portion of the lead frame L \ F. As is clear from FIG. 14, the opening 176d is formed.
Abutting member 17 made of rubber or the like over the entire circumference of the lower edge of
6e is fixed. The contact member 176e directly contacts the bonding target portion of the lead frame L \ F. Note that the corresponding contact member 176e directly abuts and presses on each lead formed on the lead frame L \ F corresponding to each pad 253a of the IC chip 253 as shown in FIG.

As shown in FIGS. 7 and 8 and FIGS. 10 and 11, the frame retainer 176 has a relay member 178.
It is attached to. As shown in FIG. 8, this relay member 1
78 is formed to have a substantially U shape in a plan view, and has a flat plate shape as a whole.

The relay member 178 is attached to the support mechanism 101 as follows. The support mechanism 101 has already been described with reference to FIGS. 2 to 6.

As shown in FIGS. 7, 9 and 10, the brackets 181 and 18 are provided for the rectangular plate-shaped movable support member B105 which is provided in the support mechanism 101 and extends substantially horizontally.
The movable base 180 (also shown in FIG. 8) is fixed to the movable base 180 via the second base member 178.
Is attached to. As is clear from FIG. 8, the movable base 180 is formed in a U shape as a whole, and more specifically, a base portion 180a extending in the left-right direction (the arrow X direction and the opposite direction) and the base portion 180a. Bolt 180b at one end with respect to both ends of portion 180a
A pair of arm portions 1 fastened together (only shown in FIG. 8) and extending rearward (direction opposite to the arrow Y direction) in parallel.
80c and. Then, the base portion 180a is connected to the movable support member B105 via the bracket 181.
And the both arm portions 180c are connected to the rear end portion of the movable support member B105 via the bracket 182. As is clear from FIGS. 1 to 3, the small bracket 181 is formed in a shaft shape, and is fitted at the upper end portion to the fixing block 180d provided at the central portion in the longitudinal direction of the base portion 180a. It is worn. As for the large bracket 182, as shown in FIGS. 7, 8 and 10, it extends in the left-right direction (the arrow X direction and the opposite direction) and the rear end of the movable support member B105 at the center thereof. And a pair of pillars 182b connected to both ends of the base 182a at one end (lower end) and extending upward (in the arrow Z direction). Then
The upper ends of the pillars 182b are fitted to the rear ends of the arms 180c.

Both the brackets 181 and 182 and the movable base 180 are the support mechanism 101 shown in FIG.
It is included as a constituent member of.

As described above, the movable supporting member B105 having the relay member 178, and thus the frame retainer 176, is movable up and down (in the direction of arrow Z and in the opposite direction) by the above-described structure, and includes the pulse motor 129 and the like. It is moved up and down by the operation of the driving means. On the other hand, the support mechanism 101 includes another movable support member A104 carrying a heater plate 255 as a bonding stage, and the movable support member A104 is also vertically movable and moved up and down by the operation of the drive means. That is, the support mechanism 101 supports the frame retainer 176 and the heater plate 255 so as to be relatively close to and away from each other in the vertical direction (the arrow Z direction and the opposite direction), and the drive means is the frame. The presser foot 176 and the heater plate 255 are driven so as to come into contact with and separate from each other, and a pressing force is applied when they are close to each other.

The frame retainer 176 is provided so as to be tiltable with respect to the support mechanism 101. The structure for this tilting will be described below. However, specifically, the relay member 178 to which the frame retainer 176 is attached.
Tilts with respect to the support mechanism 101. This tilting is caused by the frame retainer 176 and the heater plate 2
55 is performed in a plane including the vertical direction (arrow Z direction and the opposite direction), which is a direction in which they approach and separate from each other.

As shown in FIGS. 8 and 10, the tilting motion is provided between the movable base 180, which is a component of the support mechanism 101 and is fixed on the tilting motion, and the relay member 178, which is the tilting motion. Tilting mechanism 18 for enabling
4 are provided at 4 places. Since the tilting mechanisms 184 at these four positions are configured in the same manner, one tilting mechanism 184 will be described in detail.

FIG. 15 is an enlarged view of the portion F in FIG. 10, that is, the tilting mechanism 184. As shown in FIG. 15 and FIG. 8 and FIG. Is also formed with a thin portion 178a. On the other hand, a stopper 185 is provided on the arm portion 180c of the movable base 180. The stopper 185
Specifically, the plane shape thereof is substantially L-shaped, and the arm portion 18 is provided at one side portion thereof shown by a broken line in FIG.
It is fastened to 0c with a bolt 185a. FIG.
As shown in FIGS. 0 and 15, a slit 185b cut horizontally is formed in the other side portion of the stopper 185, that is, a portion extending at a right angle to the one side portion, and the slit 185b has the thin wall portion. The portion 178a is inserted. Then, as shown in FIG. 15, a predetermined gap e is provided between the thin portion 178a and the extending portion 185c that defines the upper surface of the slit 185b.

As is apparent from FIG. 15, a circular hole 185d vertically penetrating the extending portion 185c is formed in the vicinity of the tip of the extending portion 185c provided on the stopper 185. A steel ball 186 is inserted through 185d. A circular hole 178b having a slightly smaller diameter is formed in the thin portion 178a provided on the relay member 178 so that the vicinity of the lower end portion of the steel ball 186 can engage with the edge portion.

A leaf spring 191 is fastened to the upper surface of the arm portion 180c by a screw 192 at its end portion, and the free end portion of the leaf spring 191 engages with the upper end of the steel ball 186. ing.

In the above description, the tilting mechanism 184 at one location is used.
Regarding the remaining three tilting mechanisms 184, the same reference numerals are given to the constituent parts corresponding to the respective constituent parts of the tilting mechanism 184 described above.

According to the above structure, the lead frame L \ F
When the area to be bonded is pressed against the heater plate 255 by the frame presser 176 and fixed,
As shown in FIG. 16, the thin portion 178 a of the relay member 178.
Is a stopper 185 against the biasing force of the leaf spring 191.
Is disengaged from the downward extending portion 185e, and is not engaged with the upward extending portion 185c, and is in a state of being supported by a point through the steel ball 186. Thereby, the relay member 17
8. Therefore, the frame retainer 176 automatically tilts following the flat upper surface of the heater plate 255, which is the bonding stage, to bring the bonding target portion into close contact with the bonding stage.

In this embodiment, the heater plate 255 as the bonding stage is used as described above.
Is fixed, and the frame presser 176 as a pressing member is configured to tilt along the surface of the heater plate 255. On the contrary, the frame presser 176 is fixed and the heater plate 255 is a frame of the frame presser 176. It may be configured to tilt along the pressing surface.

Further, in this embodiment, the structure shown in FIG. 15 is adopted in order to make the relay member 178 tiltable, but in addition to this, the movable base 180 which supports the relay member 178 is required. The tilting can be made possible by various configurations such as simply attaching to (the arm portion 180c) through a leaf spring.

As is clear from the above, in the wire bonding apparatus, either the frame retainer 176 for contacting and pressing the bonding target portion of the lead frame L \ F or the heater plate 255 as the bonding stage is used. One is the frame presser 17
6 and the heater plate 255 are supported to the support mechanism 101 that supports the heater plate 255 so as to be relatively close to and away from each other. On the other hand, it is designed so as to closely follow the lead frame L \ F by automatically copying.

According to such a structure, even if the bonding target portion of the lead frame L \ F is miniaturized due to the increase in the number of leads and the narrowing of the lead width accompanying the increase in the number of pins of the semiconductor device to be manufactured, etc. Frame retainer 176
Corresponding to this, it can always be surely brought into close contact and pressed and fixed.

Further, in this structure, manual grinding and polishing which are conventionally performed in order to enhance the close contact with the lead frame L \ F are unnecessary, and the frame retainer 176 for the lead frame L \ F is not required. The closeness is permanently maintained, replacement is not necessary for a long time, and repeated use is possible, and moreover, confirmation of closeness at the time of replacement of the frame retainer 176 due to change of lead frame type,
Since adjustment work is unnecessary, workability and productivity are improved.

When the same frame retainer 176 is used between a plurality of bonding apparatuses, there is no machine difference between the apparatuses even if the processing accuracy and the assembly error of each apparatus itself are not increased so much. Since the apparatus can be used under the same conditions, the productivity is improved and the cost is reduced from this point as well.

In the wire bonding apparatus, as is clear from FIG. 8, the relay member 178,
Therefore, the frame retainer 176 has four tilting mechanisms 18 with respect to the left and right arm portions 180c of the movable base 180.
4, that is, the frame retainer 176 and the heater plate 255 are mounted at four points in a horizontal plane perpendicular to the vertical direction which is the direction of mutual proximity.
As shown in FIG. 8, these four points, that is, each tilting mechanism 1
The steel balls 186 each of which 84 has are provided with a center 197 (I) of a bonding target portion (previously: the IC chip 253 shown in FIG. 22 and each lead 250 provided so as to surround the same).
The C chip and the lead are not shown and are shown as black dots) and are arranged symmetrically or substantially symmetrically with respect to two virtual straight lines 199 and 200 orthogonal to each other. In this case, one virtual straight line 199 is aligned with the left-right direction (the arrow X direction and the opposite direction) which is the transport direction of the lead frame L \ F in the wire bonding apparatus, and the other virtual straight line 200 is the front-back direction ( The arrow Y direction and the opposite direction).

In this embodiment, as described above,
Although it is configured to be supported at two points, the frame retainer 176 may be configured to be supported at two points as shown in FIG. In the case of this two-point support, the tilting mechanism 184 is provided at two positions, and the two points, that is, the steel balls 186 respectively provided in both tilting mechanisms 184, are on the virtual straight line 199 passing through the center 197 of the bonding target portion. Are arranged symmetrically or substantially symmetrically with respect to the center 197. However, these two points may be similarly arranged on the other virtual straight line 200.

As described above, in the wire bonding apparatus according to the present invention, only one of the frame retainer 176 as the pressing member and the heater plate 255 as the bonding stage or only the frame retainer 176 has the movable base 180. Support mechanism 1 including
On the other hand, with respect to 01, the frame retainer 176 and the heater plate 255 are attached at four points or two points in a plane (horizontal direction) substantially perpendicular to the direction (vertical direction: arrow Z direction and the opposite direction) of mutual proximity. The four points are arranged substantially symmetrically with respect to two virtual straight lines 199 and 200 orthogonal to each other at the center 197 of the bonding target site, and the two points are virtual lines passing through the center 197 of the bonding target site. Center on the straight line 199 19
7 are arranged substantially symmetrically. In such a configuration, for example, regarding wire bonding connection, each bonding point (pad 253a of IC chip 253 and lead 250: see FIGS. 21 and 22) is connected to the IC chip (2).
Since the virtual lines 199 and 200 are parallel to the respective sides (four sides) of the rectangle, since the lines are arranged along the outer periphery of 53), that is, as if drawing a rectangle, In the case of a device with four points, a state in which pressing force is evenly applied corresponding to the four corners of this rectangle can be obtained.
In point-wise mounting, a uniform pressing force is applied to each half of the rectangle. Therefore, it is possible to press and fix with a uniform pressure distribution over the entire area of the pressing surface defined between the frame pressing member 176 and the heater plate 255, which is extremely effective in improving the accuracy of the bonding work. Note that these effects are similarly exhibited even when the configuration of the present invention is applied to die bonding.

Incidentally, it is conceivable that the supporting points are not 4 or 2 points as described above, but 3 points, 5 points, 6 points, ... I examined the distribution of pressing force. These three points are concretely described in 4 above.
As in the case of the point support and the two-point support, they were arranged concentrically around the center 197 of the bonding symmetrical portion in the horizontal plane and at equal intervals. Then, the pressure sensitive film was sandwiched between the frame retainer 176 and the heater plate 255 to bring them into a mutually pressed state, and the traces appearing on the pressure sensitive film due to the pressure were observed. 18A is a trace of pressure obtained based on the four-point support structure shown in this embodiment, and FIG.
Is a trace obtained in the case of the above three-point support structure. As is clear from a comparison of these traces, when the four-point support structure is used as in this embodiment, the pressing surface, specifically, the entire rectangular pressing surface of the contact member 176e shown in FIG. 14 is covered. A uniform pressure distribution is obtained, and the pressure distribution is not uniform in the three-point support structure. It is clear that this is due to the above-mentioned reason regarding the four-point support structure, and the unfavorable results obtained as the three-point support structure are considered to be due to the following reasons.

That is, since the bonding points are arranged in a rectangular shape as described above, the pressing surface of the contact member 176e is also rectangular in order to accommodate this, whereas in the three-point support structure This is because the conformity to the rectangular shape is not always good.

On the other hand, with respect to increasing the number of supporting points to 5 points, 6 points, ..., And 4 points, there are the following problems.

That is, as described above, the frame retainer 1
In order to tilt 76 so as to follow the heater plate 255, it is ideal to support at two points, three points and four points, and it is ideal that each point is arranged as described above. It becomes meaningless or inconvenient for the tilting motion. In addition, since the structural portion of the wire bonding apparatus originally performs fine work, the structure itself is also fine, and it is difficult to take many supporting points because it causes complication, and cost is low. It is not preferable from the aspect.

In the bonding apparatus according to the present invention, in order to obtain a uniform pressure distribution over the entire pressing surface, the minimum necessary four-point support structure or two-point support structure effective in actual work was found and adopted. It is a thing.

By the way, in the bonding apparatus, the mutual mounting portion of the frame retainer 176 and the support mechanism 101 serves as a convex portion formed to project in the direction of approaching and separating the frame retainer 176 from the heater plate 255. A steel ball 186 and a circular hole 178 as a recess formed in the relay member 178 so as to engage with the projection.
b. According to the configuration in which the convex portion and the concave portion are engaged with each other in this way, due to the copying operation of the frame retainer 176 with respect to the heater plate 255, that is, tilting,
The frame retainer 176 is prevented from being displaced, that is, the positional displacement in the horizontal direction perpendicular to the approaching / separating direction with respect to the heater plate 255 is prevented, and the bonding target portion of the lead frame L \ F is pressed and fixed with high accuracy. It

In the bonding apparatus,
The frame retainer 176 is elastically attached to the support mechanism 101 via a leaf spring 191. Therefore, the pressing force of the lead frame L \ F with respect to the heater plate 255, that is, the bonding stage becomes substantially constant based on this elasticity, and a stable pressing state is obtained, and the assembly error between the members and the thermal expansion of the members, etc. The effect that is absorbed by this elasticity is obtained.

Furthermore, in the bonding apparatus,
A relay member 178 is interposed between the frame retainer 176 and the support mechanism 101, the frame retainer 176 is fixed to the relay member 178, and the relay member 178 is tiltably attached to the support mechanism 101. ing. As described above, by interposing the relay member 178 between the frame retainer 176 and the support mechanism 101 without directly connecting them, for example, the above-mentioned four points or two points can be freely set. The design is facilitated and the degree of freedom is improved.

In this embodiment, as described above, the relay member 178 is provided and the frame retainer 176 is attached thereto.
However, the frame pressing member 176 may be directly tiltably attached to the support mechanism 101 without providing the relay member 178.

Further, in the present embodiment, the frame retainer 176 and the heater plate 255 are both configured to be vertically movable by the support mechanism 101 so as to be closely spaced from each other.
Alternatively, one of the heater plates 255 may be fixed and the other may be movable.

Next, the structure relating to the replacement of the frame retainer 176 will be described.

That is, in the bonding apparatus,
Depending on the type of semiconductor device to be produced, the bonding range of the lead frame L \ F, the shape and size of the island (249: see FIGS. 21 and 22) and the like change. Therefore, the frame retainer 176 having the opening 176d (see FIG. 12 to FIG. 14) that should face these islands is positioned as a component to be replaced when the type of semiconductor device is changed.

Therefore, in the actual work, when the product type of the semiconductor device to be manufactured is changed, the frame retainer 176 is replaced, and when the product type is frequently changed, such as in the case of small lot production of a large number of products, this replacement work is performed. This is a factor that causes a great number of man-hours, which is an obstacle to improving workability and productivity.

Therefore, in the wire bonding apparatus, in order to improve workability and productivity, the frame holder 1
The following configuration is adopted so that the replacement of 76 can be performed very quickly and easily.

The frame retainer 176 is detachably attached to the relay member 178 that supports the frame retainer 176, that is, the support mechanism 101, by the following locking means. In addition,
In this embodiment, the frame retainer 176 is attached to the relay member 1.
Although it is attached to the support mechanism 101 via 78, the frame retainer 176 may be directly attached to the support mechanism 101 by the locking means without providing the relay member 178.

The locking means is shown in FIGS. 7 to 13.

As is particularly clear from FIGS. 12 and 13, extending portions 176c are formed at both ends of the frame retainer 176, and these extending portions 176c form the first engaged portion and the second engaged portion. The relay member 178 is locked as a locked portion.

On the other hand, as shown in FIGS. 7 to 11, the frame retainer 176 is provided on the lower surface side of the relay member 178.
Corresponding to both extending portions 176c (see FIG. 12 and FIG. 13), two piece members 201 and 202 respectively acting as locking portions are provided. Specifically, these piece members 201 and 202 are provided in contact with the mounting reference surface 178j formed in the relay member 178 so that the reference surface 176g formed in the frame retainer 176 contacts. For details on the attachment of the two piece members 201 and 202, see FIG.
As is clear from FIG. 11, the left piece member 201 is fastened to the relay member 178 by the two screws 204. Regarding the right side piece member 202,
It is attached via two steel balls 205 at its right end. These steel balls 205 have through holes 202e and 17e formed coaxially in the piece member 202 and the relay member 178.
It is positioned by engaging the 8k edge. With this configuration, the piece member 202 is made of the steel ball 205.
Is the center of vibration, and the left end is a free end and can be swung up and down. As shown in FIGS. 7 and 8, a holding member 204 is provided to hold the steel balls 205 so as to prevent the steel balls 205 from falling off.
It is fastened to the relay member 178 by 04a. Further, through-holes (not denoted by reference numerals) communicating with each other are formed in the right side piece member 202 and an end portion of the relay member 178 corresponding to the piece member 202, and a coil spring is provided in the through-hole. 206 is inserted, and both ends of the coil spring 206 are connected to the bridge member 20 by pins 206a.
2 and the relay member 178. The coil spring 206 acts as a tension spring.

As shown in FIGS. 9 and 11, both of the piece members 201 and 202 are made of block-shaped members, and inclined surfaces 201a and 202a are formed on the mutually opposing surface sides. These inclined surfaces 201a and 202a are formed so as to gradually approach the mounting reference surface 178j of the relay member 178 in the direction away from the opposing piece member. Further, both extending portions 176c of the frame retainer 176 to be locked by the both piece members 201 and 202 (see FIGS. 12 and 1).
3) That is, in the locked portion, both piece members 201, 201
02, an inclined contact surface 176i is formed to contact each of the inclined surfaces 201a and 202a.

The locking means for detachably mounting the frame retainer 176 to the relay member 178 is constructed as described above. In the locking means having such a configuration, the right-side piece member 202 has the relay member 1 via the steel ball 205.
Since it is swingably attached to 78, the inclined surface 202a that the piece member 202 has as a direct locking portion with respect to (the contact surface 176i of) the frame retainer 176 is
By swinging the piece member 202, it is possible to approach and separate from the other piece member 201. The coil spring 206 has the inclined surface 202a which is the direct locking portion.
Acts as a biasing means for biasing the other piece member 201 in a direction closer to the other piece member 201. Therefore, the frame retainer 176
Is biased by the biasing force between the inclined surfaces 201a and 202a of the two piece members 201 and 202 and the mounting reference surface 178j of the relay member 178.

Now, the operation of mounting the frame retainer 176 to the relay member 178 based on the locking means having the above construction will be described with reference to FIG.

First, as shown in the figure, the frame retainer 176
An extended portion 176c provided as a second locked portion on the
(See also FIG. 12 and FIG. 13 for the reference numeral of the extending portion 176c).
While pressing the free end of 2, press (shown by arrow a),
The piece member 202 is attached to the coil spring 206 as shown.
Rock downward to resist the urging force of the. As a result, the inclined surface 202a serving as the direct locking portion is moved by this swing. When the piece member 202 is swung in this manner, the extending portion 176c provided at the left end portion of the frame retainer 176 as the second locked portion as shown in the drawing causes the piece member 201 as another locking portion. To the position where it can be locked. In this state, if the other end of the frame retainer 176 is lowered as shown by the arrow b and the hand is released, the frame member 201 is engaged with the extending portion 176c of the frame retainer 176 and at the same time the frame retainer 176 is released. Coil spring 206
By the urging force of the frame, the frame is returned to the state shown in FIG. The same applies when the frame retainer 176 is removed from the relay member 178.

In the present embodiment, the piece members 201 and 202 as the locking portions are provided on the relay member 178 side, and the locked portions to be locked by the respective piece members are provided on the frame retainer 176 side. However, it is self-evident that which of the relay member 178 and the frame retainer 176 is provided with the locked portion and the locking portion for locking the locked portion can be freely set in consideration of workability and the like. Further, the shapes and the number of the locking portions and the locked portions are not limited to the above-described configurations, and various configurations can be adopted.

As described above, in the wire bonding apparatus, the frame retainer 176 for pressing and fixing the bonding target portion of the lead frame L \ F,
The relay member 178, and thus the support mechanism 101, is detachably mounted by the locking means, and the locking means is provided at a plurality of locked portions of the frame retainer 176 (2 in this embodiment).
Corresponding to the two extending portions 176c), the frame retainer 176
And a plurality of locking portions provided on at least one of the relay members 178 and at least one of which is capable of approaching and separating from the other (in the present embodiment, the bridge members 201 and 2).
02) and this movable locking portion (in this embodiment, the piece member 20
Biasing means (in this embodiment, the coil spring 20) for urging (2) the other locking portion (piece member 201) toward or away from it (in this embodiment, toward).
6) consists of

In this structure, as described in detail above, the frame retainer 176 is attached to the relay member 178.
Of the frame retainer 176, the movable retainer provided corresponding to one of the engaged portions of the frame retainer 176 is moved against the urging force of the urging means. When the other locking portion provided corresponding to the other locked portion is engaged, the frame retainer 176 is returned by the urging force of the urging means, so that the two retainers of the frame retainer 176 are engaged. The stop part is locked. The same applies when the frame retainer 176 is removed from the relay member 178.

Due to this structure, the frame retainer 176 is
Can be quickly and easily attached and detached without any tools or the like, and workability and productivity can be improved.

Further, in the wire bonding apparatus, as described above, each of the engaging portions is connected to the relay member 178 on the supporting mechanism side so that the reference surface 176g formed on the frame retainer 176 is brought into contact. The mounting reference surface 178j is formed, or is composed of piece members 201 and 202 attached in the vicinity thereof, and each of the piece members has a mounting reference surface 178j that faces away from a piece member other than itself.
Inclined surfaces 201a and 202 formed so as to gradually approach
a is provided, and the inclined surface 201 is provided on the frame retainer 176.
A contact surface 176i for contacting the a and 202a is formed, and the frame retainer 176 is biased by a coil spring 206 serving as a biasing means.
It is sandwiched between 1a and 202a and the mounting reference surface 178j. In this way, the frame retainer 176 is attached with the reference face 176g of itself attached to the attachment reference face 178j formed on the support mechanism side, and moreover, the contact state of the frame retainer 176 with the two piece members 201, 202. Since the surface contact is made by the inclined surfaces, there is no mounting error and reliability is improved. Further, based on this configuration, the surface pressing of the frame retainer 176 with respect to the heater plate 255 described above is performed without error, which leads to improvement in quality.

The mounting of the frame retainer 176 to the relay member 178 is as described above, but the following structure is further added.

That is, a regulation means for regulating the mounting position deviation of the frame retainer 176 with respect to the relay member 178 is provided. However, the deviation regulation in this case is performed in the front-rear direction (arrow Y) which is perpendicular to the left-right direction (the arrow X direction and the opposite direction) which is the locking direction of the frame retainer 176 made by the both piece members 201 and 202 described above. Direction and vice versa). Specifically, the regulation means has the following configuration.

As shown in FIGS. 12 and 13, both extending portions 176c of the frame retainer 176 are formed with notches 176j to be extended in the left-right direction (the arrow X direction and the opposite direction). On the other hand, for example, in FIG.
As shown in FIG.
01c and 202c are planted, and each pin 201
The notch 176j is engaged with c and 202c. Here, the pins 201c, 2 in the front-rear direction (the arrow Y direction and the opposite direction) in which the displacement regulation should be performed.
02c and each notch 176j have almost the same dimensions (however,
The dimensions of the pins 201c and 202c are set to be slightly smaller), whereby the displacement of the frame retainer 176 is restricted, and the bonding target portion of the lead frame L \ F is pressed and identified with high accuracy.

[0102]

As described above, according to the present invention,
One of the pressing member (176) and the bonding stage (255) for contacting and pressing the bonding target portion of the substrate (L \ F), or only the pressing member is the pressing member and the bonding stage. Is mounted so as to be tiltable in a plane including the direction of the proximity, and the pressing member automatically follows the surface of the bonding stage. It is designed to be in close contact with the substrate. With such a configuration, the pressing member can cope with the miniaturization of the bonding target portion of the substrate such as an increase in the number of leads and a reduction in the lead width due to the increase in the number of pins of the semiconductor device to be manufactured. Always close together,
It can be fixed by pressing. Further, in this configuration, the manual grinding and polishing which are conventionally performed to enhance the close contact with the substrate are unnecessary, and the close contact of the pressing member with the substrate is permanently maintained, so that the replacement can be performed for a long time. It is possible to use it repeatedly over a period of time without needing it, and since it is unnecessary to confirm the closeness and to adjust the pressure member when changing the type of board, workability and productivity are improved. is there. Further, when the same pressing member is diverted among a plurality of bonding apparatuses, there is no machine difference between the respective apparatuses even if the processing accuracy, the assembly accuracy, etc. of each apparatus itself are not so improved, and the same applies to any of the apparatuses. Since it can be used under the conditions, the productivity is improved and the cost is reduced also from this point. Further, according to the present invention, either one of the pressing member and the bonding stage, or only the pressing member has four points in a plane substantially perpendicular to the supporting mechanism (see FIG. 8). ) Or two points (see FIG. 17), and the four points are orthogonal to each other at the center (197) of the bonding target portion.
The virtual straight lines (199, 200) of the book are arranged substantially symmetrically, and the two points are arranged substantially symmetrically with respect to the virtual straight line (199) passing through the center (197) of the bonding target portion. There is. In such a configuration, for example, regarding wire bonding connection, each bonding point (pad 253a of IC chip 253 and lead 250) is along the outer periphery of the IC chip (253).
That is, since the rectangles are arranged as if they were drawn, if the device structure is set in advance so that the virtual straight lines are parallel to the sides (four sides) of the rectangle, the four corners of the rectangle can be mounted in the case of mounting by the above four points. A state in which the pressing force is uniformly applied is obtained corresponding to the above, and in the mounting by the above two points, the uniform pressing force is accurately applied to each half of the rectangle. Therefore,
It is possible to press and fix with a uniform pressure distribution over the entire pressing surface defined between the pressing member and the bonding stage, which is extremely effective in improving the accuracy of the bonding work. Note that these effects are similarly exhibited even when the configuration of the present invention is applied to die bonding. In addition, in the bonding apparatus according to the present invention, the mutual mounting portion of the pressing member or the bonding stage and the supporting mechanism engages with the convex portion (186) formed to project in the direction of the proximity and separation. It is composed of a combined concave portion (178b). According to the configuration in which the convex portion and the concave portion are engaged with each other as described above, relative displacement of both the pressing member and the bonding stage, that is, relative tilting causes displacement of the pressing member and the bonding stage, that is, in the approaching / separating direction. On the other hand, relative displacement in the vertical direction is prevented, and the bonding target portion of the substrate is pressed and fixed with high accuracy. Further, in the bonding apparatus according to the present invention, the pressing member or the bonding stage is elastically (leaf spring 191) attached to the support mechanism. Therefore, the pressing force of the substrate with respect to the bonding stage becomes substantially constant based on this elasticity, and a stable pressing state is obtained, and assembling error between members and thermal expansion of members are absorbed by this elasticity. The effect is obtained. Next, in the bonding apparatus according to the present invention, a relay member (17) is provided between the pressing member or the bonding stage and the support mechanism.
8) is interposed, the pressing member or the bonding stage is fixed to the relay member, and the relay member is tiltably attached to the support mechanism. In this way, by interposing a relay member between the pressing member or the bonding stage and the support mechanism without directly connecting them, it is possible to freely set, for example, the above-mentioned four points or two points. The design is facilitated and the degree of freedom is improved.

[Brief description of drawings]

FIG. 1 is a plan view of a wire bonding apparatus according to the present invention.

FIG. 2 is a front view of a support mechanism included in the wire bonding apparatus shown in FIG.

FIG. 3 is a plan view of the support mechanism shown in FIG.

FIG. 4 is a right side view of the support mechanism shown in FIG.

FIG. 5 is a left side view of the support mechanism shown in FIG.

FIG. 6 is a cross-sectional view taken along the line AA in FIG.

FIG. 7 is a right side view of a part of the wire bonding apparatus shown in FIG. 1, including a partial cross section.

8 is a BB arrow view of FIG. 7. FIG.

9 is a view taken along the line CC of FIG.

10 is a rear view including a partial cross section taken along the line D-D in FIG.

FIG. 11 is a view on arrow EE relating to FIG. 8;

FIG. 12 is a plan view of a frame retainer included in the wire bonding apparatus shown in FIG.

13 is a vertical cross-sectional view of the frame retainer shown in FIG.

FIG. 14 is an enlarged view of a portion G in FIG.

15 is an enlarged view of a portion F in FIG.

16 is an operation explanatory diagram relating to the configuration shown in FIG. 15;

FIG. 17 is a plan view showing a modification of a part of the wire bonding apparatus shown in FIGS. 1 to 16.

FIG. 18 is a diagram showing the results of examining the pressure distribution using the pressure sensitive film in the wire bonding apparatus according to the present invention and another wire bonding apparatus.

FIG. 19 is an operation explanatory diagram of the configuration shown in FIG. 11;

FIG. 20 is a plan view of a conventional wire bonding apparatus.

FIG. 21 is a plan view of a lead frame to be handled.

22 is an enlarged view of a portion P in FIG.

FIG. 23 is a perspective view of a part of the wire bonding apparatus shown in FIG.

[Explanation of symbols]

64 heater block 101 support mechanism 129 pulse motor 176 frame retainer 178 relay member 180 movable base 180a (base of movable base 180) base portion 180c (arm portion of movable base 180) arms 181 and 182 bracket 184 tilting mechanism 185 stopper 185a bolt 185b slit 185c Extending portion 185d Hole 185e (lower) extending portion 186 Steel ball 191 Leaf spring 192 Screw 197 Center of bonding target portion 199, 200 Virtual straight line 201, 202 Piece member 204 Holding member 205 Steel ball 206 Coil spring 248 Wire 249 Island 250 lead 251 loader 253 IC chip 253a pad 254 extrusion means 255 heater plate (bonding stage) 257, 258 guide tray 259 Bonding work position 260 Bonding means 262 Unloader 270 (equipment) stand

Claims (7)

[Claims] 1. In a bonding apparatus, wherein a bonding target portion of a substrate positioned on a bonding stage is pressed and fixed to the bonding stage by the pressing and fixing means, the bonding and bonding are performed by the bonding means. A pressing member for contacting and pressing the bonding target portion, a support mechanism for supporting the pressing member and the bonding stage so that they can be moved toward and away from each other, and the pressing member and the bonding stage are separated from each other. And a drive means for applying a pressing force when approaching, and any one of the pressing member and the bonding stage is tiltable in a plane including the approaching and separating direction with respect to the support mechanism, and Mounted at 4 points in a plane that is almost perpendicular to the direction of proximity and separation The bonding device is characterized in that each of the four points is arranged substantially symmetrically with respect to each of two virtual straight lines orthogonal to each other at the center of the bonding target portion. 2. A bonding apparatus for performing bonding connection by a bonding means in a state where a bonding target portion of a substrate positioned on a bonding stage is pressed and fixed to the bonding stage by the pressing and fixing means, the pressing and fixing means A pressing member for contacting and pressing the bonding target portion, a support mechanism for supporting the pressing member and the bonding stage so that they can be moved toward and away from each other, and the pressing member and the bonding stage are separated from each other. And a drive means for applying a pressing force when approaching, and any one of the pressing member and the bonding stage is tiltable in a plane including the approaching and separating direction with respect to the support mechanism, and Mounted at two points in a plane that is almost perpendicular to the direction of proximity and separation The bonding device is characterized in that the two points are arranged substantially symmetrically with respect to the center on a virtual straight line passing through the center of the bonding target portion. 3. The mutual mounting part of the pressing member or the bonding stage and the support mechanism is composed of a convex part formed to project in the direction of the approaching and separating and a concave part engaged with the convex part. The bonding apparatus according to claim 1 or 2. 4. The bonding apparatus according to claim 1, wherein the pressing member or the bonding stage is elastically attached to the support mechanism. 5. A relay member is interposed between the pressing member or the bonding stage and the support mechanism, the pressing member or the bonding stage is fixed to the relay member, and the relay member is attached to the support mechanism. The bonding apparatus according to any one of claims 1 to 4, wherein the bonding apparatus is mounted so as to be tiltable in a plane that includes the direction of approaching and separating. 6. A pressing member for abutting against a bonding target portion of a substrate to press the bonding target portion against a bonding stage, and a support mechanism for supporting the pressing member and the bonding stage so as to be relatively close to and away from each other. The pressing member and the bonding stage are driven so as to be brought into contact with and separated from each other, and a driving unit that applies a pressing force when the pressing stage is close to each other, and the pressing member is tiltable in a plane including the approaching and separating direction with respect to the support mechanism. And are attached at four points in a plane substantially perpendicular to the direction of proximity and separation, and the four points are arranged substantially symmetrically with respect to each of two virtual straight lines orthogonal to each other at the center of the bonding target portion. A substrate pressing and fixing mechanism characterized by being provided. 7. A pressing member for contacting a bonding target portion of a substrate to press the bonding target portion against a bonding stage, and a support mechanism for supporting the pressing member and the bonding stage so as to be relatively close to and away from each other. The pressing member and the bonding stage are driven so as to be brought into contact with and separated from each other, and a driving unit that applies a pressing force when the pressing stage is close to each other, and the pressing member is tiltable in a plane including the approaching and separating direction with respect to the support mechanism. And are attached at two points in a plane substantially perpendicular to the direction of closeness and separation, and the two points are arranged substantially symmetrically with respect to the center on a virtual straight line passing through the center of the bonding target portion. A substrate pressing and fixing mechanism characterized by the above.