JPH0815135B2 - Semiconductor device manufacturing control system - Google Patents

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor device manufacturing control system, and more particularly to a manufacturing control system relating to quality control in the process of manufacturing semiconductor devices.

[0002]

2. Description of the Related Art In a conventional manufacturing control system relating to quality control of semiconductor devices, means for collecting and accumulating inspection results including a good / defective determination in an inspection process and a measurement value for each inspection item,
It has a failure management table that defines the standard management method of the measured values to be managed, and it periodically sets the failure rate for each collection of inspection results or if the inspection results exceed the management limit of the failure management table, it remains constant in the past. A quality control system (Japanese Patent Application Laid-Open No. 2-98632) that outputs a graph showing the time transition of the measured value of the inspection item that exceeds the defective rate of the period and the control limit, and the defective item of the inspection process in the quality control system. If a defect factor table indicating the correspondence of manufacturing processes that cause defects is added and the defect rate or inspection result exceeds the control limit of the defect management table, the factor process of the defect item that is the most frequent cause of defects There is a quality control system (Japanese Unexamined Patent Publication No. 2-98631) that outputs a graph showing the manufacturing conditions and manufacturing results and the time transition and correlation of the defective rate.

[0003]

In the conventional manufacturing control system for quality control of semiconductor devices, when the defect rate or the inspection result exceeds the control limit of the defect management table, the defect rate or the inspection item changes with time. When a defect occurs, it is only necessary to output a graph that shows the There is no need to manually perform the primary analysis of. However, the condition control for manufacturing the semiconductor device is a multivariable control system, and the control targets almost always interfere with each other, and simply represent the manufacturing conditions and manufacturing results of the factorial process and the time transition and correlation of the defect rate. Even if the graph is output, there is a problem that the cause cannot be determined in many cases.

[0004]

A semiconductor device manufacturing management system according to the present invention comprises means for collecting and accumulating manufacturing conditions in a semiconductor device manufacturing process and conditions executed in actual processing for each process, and an inspection process. A means for collecting and accumulating measurement results for each measurement item including a measurement value, a means for registering a standard and a determination method for determining the quality of the measurement value for each measurement item in the inspection process,
Measures the measured values of each measurement item in the inspection process according to the registered standards and determination methods, and displays a method if a defect occurs as a result of the determination, and if a defect occurs in the inspection process, automatically Means for performing analysis automatically and registering analysis data, means for automatically executing analysis based on the registered analysis procedure / analysis data and limiting the cause, and if the specific equipment is the cause, the cause equipment Judge the possibility of dealing with the condition correction, and if possible cause the means to correct the condition of the subsequent lot to be operated in the facility, and if the condition modification of the cause facility is not possible, stop the work in the cause facility. And if the specific lot is the cause, determine the possibility of dealing with the condition modification in the post process of the relevant lot,
If possible, it has means for correcting the conditions of the post-process of the lot, and means for stopping the work in the post-process of the lot if it is impossible to correct the conditions of the lot.

[0005]

Next, the present invention will be described with reference to the drawings.

FIG. 1 is a system configuration diagram showing an embodiment of the present invention. A semiconductor device is normally completed by a process of hundreds of tens to hundreds of processes. The process of manufacturing a semiconductor device is
Manufacturing process A (21) for processing semiconductor devices
1), manufacturing process B (212) ... Manufacturing process Z (213) and inspection process a (221) ... Inspection process z (222) for inspecting each manufacturing process.

The manufacturing conditions / actual results of each manufacturing process and the inspection result of each inspection item of each inspection process are collected by the process / condition management unit 15 in real time and stored in the process / condition management database 14 as process management data. Accumulated. Every time the quality data monitoring unit 12 writes the measurement result for each inspection item of the inspection process in the process / condition management database 14, the judgment standard registered for the monitoring master 16 is the standard judgment or trend judgment for each inspection item. Automatically based on the judgment method. As shown in FIG. 2, the judgment method is not limited to the standard judgment 21.
The tendency of the measurement result on one side or the like is also judged.

When the quality data monitoring unit 12 finishes the judgment and as a result, a defect occurs, the contents of the defect (out of specification, continuous increase, etc.) with respect to the inspection item at the monitoring unit terminal 19 and the transition of the inspection item for a certain period. At the same time, the defect content is transmitted to the quality data statistical analysis unit 13.

The quality data statistical analysis unit 13 that has received the content of defect / data retrieves the analysis procedure from the analysis master 17 based on the received defect item name / content of defect / defect data,
Automatically analyze defective data and its causal equipment and causal lot. The result is output to the statistical analysis unit terminal 18, and at the same time, the cause of the defect is divided into the equipment cause and the lot cause based on the result of the further analysis. If the processing condition can be corrected, the correction condition is corrected. If it is not possible, the cause equipment / cause lot treatment is written in the process / condition management database 14. That is, if the condition cannot be corrected, the process / condition management unit 15 stops the work in the equipment when the cause of the failure is the specific equipment, and stops the work of the lot when the cause of the failure is the specific lot. Control each manufacturing process. The semiconductor device manufacturing management system 11 of the present invention is configured by combining these functional blocks.

Next, the cause analysis process and the process / condition control process will be described in detail with reference to FIGS. 3, 4, 5, 5, 6, 7, 8 and 9.

The results measured in the semiconductor device inspection process are recorded in the process / condition management data base 14 (FIG. 1) via the process / condition management unit 15 (FIG. 1) (31).
(Figure 3). The quality data monitoring unit 12 (FIG. 1) measures by the monitoring table 40 in the monitoring master 16 having the inspection item 41, the unit 42, the central value 43, the control limit value 44, the determination content 45, etc. as shown in FIG. A value standard judgment and a tendency judgment are performed (32) (FIG. 3). Based on the result of the judgment, the presence or absence of a defect is identified (33) (FIG. 3), and if there is no defect, the measured value is recorded as a result in the process / condition management database 14 (FIG. 1) (34a) (FIG. 3), If there is a defect, the content of the defect and its information are displayed on the monitoring unit terminal 19 of the quality data monitoring unit 12 (FIG. 1) using a control chart graph as shown in FIG. 2 (34b) (FIG. 3).

Next, the quality data monitoring unit 12 (FIG. 1) transmits the defect inspection item / inspection data and the content of the defect to the quality data statistical analysis unit 13 (FIG. 1) (35) (FIG. 3).

The quality data statistical analysis unit 13 (FIG. 1) that has received the defect inspection item / defective data and the defect content determines the analysis master 1 based on the defect inspection item / defective data and the defect content.
7 (FIG. 1) registered as shown in FIG. 7, inspection item 51, defect content 52, defect value 53, analysis procedure file 5
4. The analysis table 50 including the analysis data file 55 is searched to determine the analysis procedure file 60 of FIG. 8 and the analysis data file 70 of FIG. 9 (36) (FIG. 3). The analysis procedure file 60 shown in FIG. 8 includes an analysis procedure file name 61, an analysis method 62, an analysis range 63, when the defect occurs.
The treatment 65 according to the analysis result is described, and the analysis data file 70 of FIG. 9 includes the process name 72, the process code 73, the equipment name 74, and the equipment code 75 for performing the analysis registered in the analysis procedure file 60. , Analysis item name 76,
A list of analysis data 71 such as item codes 77 is described.

When the analysis table 50 of FIG. 7 is searched and the analysis procedure and analysis data are determined, the quality data statistical analysis unit 13
(Figure 1) automatically performs the analysis (37) (Figure 3),
The accuracy (accuracy) of the result is calculated. (38) (FIG. 3). According to the accuracy, it is judged whether or not the specific equipment / unit is the cause (39) (Fig. 3), and if the specific equipment / unit is the cause, it is determined whether the condition of the defective process can be corrected or not in the analysis procedure of Fig. 8. It is read from the process 65 of the file 60 (39a) (FIG. 4). If the accuracy is correctable,
The conditions for feeding back to the causative equipment / machine are calculated using the Taguchi method or the like (39a1) (FIG. 4), and the corrected conditions are recorded in the process / condition management database 14 (39a2) (FIG. 4). When the subsequent lot of the defective lot is operated by the facility, the process / condition management unit 15 (FIG. 1) transmits the corrected condition to the facility (39a3) (FIG. 4). If the accuracy is such that the condition cannot be corrected, the cause equipment / unit data is sent to the process / condition management unit 15 (Fig. 1) (3
9a4) (Fig. 4), implement work stoppage of the equipment / unit to prevent subsequent lot work at the causative equipment / unit (3)
9a5) (Fig. 4).

When the specific lot is the cause, it is read from the process 65 of the analysis procedure file 60 in FIG. 8 whether the condition of the post-process of the lot where the defect has occurred can be corrected (39).
b) (Fig. 5). If the accuracy is such that the condition can be corrected, a correction condition for field-back to the subsequent process of the defective lot is calculated (39b1) (FIG. 5), and the corrected condition is processed.
Record in the condition management database 14 (FIG. 1) (39b)
2) (Fig. 5). The process / condition management unit 15 (FIG. 1) transmits the new condition corrected during the post-process work of the defective lot to the equipment (39b3) (FIG. 5). If the accuracy is such that the condition cannot be corrected, the data of the defective lot is used as the process / condition management unit 1.
5 (FIG. 1) (39b4) (FIG. 5), and the next process work of the defective lot is stopped (39b5) (FIG. 5).

[0016]

According to the semiconductor device manufacturing management system of the present invention, it is possible to automatically analyze whether a certain equipment / unit is the cause or the defective lot is the cause, and to determine the treatment automatically. It is possible to significantly reduce the analysis man-hours and analysis time. Further, when attempting to perform such management / control manually, it is impossible to perform many inspection items, but the system of the present invention manages the measurement items as long as the computer capability allows. -It becomes possible to control, and more precise quality control and condition control become possible.

In addition, since the analysis result is fed back to the manufacturing conditions and the operation of the equipment causing the failure, the machine, and the lot in which the failure has occurred are automatically stopped, it is possible to stabilize the yield steadily. There is an effect that.

[Brief description of drawings]

FIG. 1 is a system configuration diagram showing an embodiment of the present invention.

FIG. 2 is a graph showing an example of data output of a quality data monitoring unit.

FIG. 3 is a flowchart showing a cause analysis / process after analysis.

FIG. 4 is a flowchart showing a cause analysis / process after analysis.

FIG. 5 is a flowchart showing a cause analysis / process after analysis.

FIG. 6 is a diagram illustrating an example of a monitoring master of a quality data monitoring unit.

FIG. 7 is a diagram showing an example of an analysis table in the analysis master of the quality data statistical analysis unit.

FIG. 8 is a diagram showing an example of an analysis procedure file retrieved from an analysis table.

FIG. 9 is a diagram showing an example of an analysis data file retrieved from an analysis table.

[Explanation of symbols]

 11 semiconductor device manufacturing management system 12 quality data monitoring unit 13 quality data statistical analysis unit 14 process / condition management database 15 process / condition management unit 16 monitoring master 17 analysis master 18 statistical analysis unit terminal 19 monitoring unit terminal 20 process / condition management unit Terminal 40 Monitoring table 50 Analysis table 60 Analysis procedure file 70 Analysis data file

Claims (1)

[Claims] 1. A means for collecting and accumulating manufacturing conditions in a semiconductor device manufacturing process and conditions executed in actual processing for each process, and collecting measurement results for each measurement item including measurement values in an inspection process.
A means for accumulating, a means for registering a standard and a determination method for determining the quality of the measurement value for each measurement item in the inspection step, a standard for registering the measurement value for each measurement item measured in the inspection step, and It is determined according to the determination method, and means for displaying a defect if it occurs as a result of the determination, and a means for registering an analysis procedure and analysis data for automatically performing an analysis if a defect occurs in the inspection step, registered. Based on the analysis data and analysis procedure, the means to limit the cause equipment / cause process / cause lot, and if the cause is a specific equipment, determine the possibility of response by modifying the condition of the cause equipment. However, if possible, means for correcting the condition of the subsequent lot to be worked in the causal facility, and a means for stopping the work in the causative facility if it is not possible to respond by modifying the condition of the causal facility. When a specific lot is the cause, the possibility of response by modifying the conditions in the post-process of the causative lot is judged, and if possible, means for correcting the conditions in the post-process, and A semiconductor device manufacturing management system having means for stopping the work of the subsequent process of the causative lot when the correspondence is impossible.