JPH08148825A - Manufacture of wiring board - Google Patents
Manufacture of wiring boardInfo
- Publication number
- JPH08148825A JPH08148825A JP28183694A JP28183694A JPH08148825A JP H08148825 A JPH08148825 A JP H08148825A JP 28183694 A JP28183694 A JP 28183694A JP 28183694 A JP28183694 A JP 28183694A JP H08148825 A JPH08148825 A JP H08148825A
- Authority
- JP
- Japan
- Prior art keywords
- forming
- hole
- wiring
- insulating sheet
- holes
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3452—Solder masks
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3457—Solder materials or compositions; Methods of application thereof
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/4007—Surface contacts, e.g. bumps
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は、接続用半田ボールまた
は導電性ペースト突起付きプリント配線板の製造方法に
関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for manufacturing a solder ball for connection or a printed wiring board with a conductive paste protrusion.
【０００２】[0002]
【従来の技術】配線板の両面を他の電気回路との接続に
使用するには、一般的に片面多層板を除いた両面板以上
の層数の多層板を使用する必要があった。特殊な例とし
て、片面金属箔張り積層板の断面構造でありながら両面
を他の電気回路との接続に使用できる配線板の製造方法
が、特開平６−２２４５２８号公報に開示されている。
この製造方法では、図１（ａ）に示すようなフィルム基
板に図２（ｂ）に示すような貫通穴が開けられ、図１
（ｃ）に示すように、フィルム基板の片側に金属箔が被
着される。ここで、フィルム基板は一般に使用されてい
るものと同等のものと説明されているが、金属箔とフィ
ルムの接着性付与の条件は、開示されていない。次に、
図１（ｄ）に示すように、この金属箔に配線パターンが
形成され、片面のみに金属箔を使用して両面構造の配線
板が得られている。2. Description of the Related Art In order to connect both sides of a wiring board to other electric circuits, it is generally necessary to use a multi-layer board having more layers than the double-sided board excluding the single-sided multi-layer board. As a special example, Japanese Patent Application Laid-Open No. 6-224528 discloses a method of manufacturing a wiring board which has a cross-sectional structure of a single-sided metal foil-clad laminate and can be used to connect both sides to other electric circuits.
In this manufacturing method, a film substrate as shown in FIG. 1A is provided with through holes as shown in FIG.
As shown in (c), a metal foil is attached to one side of the film substrate. Here, the film substrate is described as being equivalent to a commonly used one, but the conditions for providing the adhesiveness between the metal foil and the film are not disclosed. next,
As shown in FIG. 1D, a wiring pattern is formed on this metal foil, and a wiring board having a double-sided structure is obtained by using the metal foil only on one side.
【０００３】[0003]
【発明が解決しようとする課題】一層の金属層で両面板
構造が得られる従来の方法では、一般に剛性の低いフィ
ルム基板に穴あけして金属箔を被着させるため、金属箔
の被着時の加熱と圧力によって寸法が変わりやすいため
に微細な配線板の製造には不利であった。In the conventional method in which a double-sided plate structure is obtained with a single metal layer, the metal foil is generally deposited by punching on a film substrate having low rigidity. It is disadvantageous in the manufacture of fine wiring boards because the dimensions are easily changed by heating and pressure.
【０００４】本発明は、寸法精度の優れた配線板の製造
法を提供することを目的とする。An object of the present invention is to provide a method for manufacturing a wiring board having excellent dimensional accuracy.
【０００５】[0005]
【課題を解決するための手段】本発明の配線板の製造方
法は、以下の工程を以下の順に含むことを特徴とする。 Ａ．絶縁性シートの片面に半硬化の絶縁性接着層を設け
る工程 Ｂ．貫通穴を開ける工程 Ｃ．絶縁性接着層の面に金属箔を貼り付けることによっ
て貫通穴を非貫通穴にする工程 Ｄ．エッチング法によって配線を形成する工程 Ｅ．ソルダレジストを形成する工程 Ｆ．非貫通穴の開いた面に接続用半田ボールまたは導電
性ペースト突起を形成する工程A method of manufacturing a wiring board according to the present invention is characterized by including the following steps in the following order. A. Step of providing a semi-cured insulating adhesive layer on one surface of the insulating sheet B. Process of drilling through holes C. Step of making through holes non-through holes by attaching metal foil to the surface of the insulating adhesive layer D. Process of forming wiring by etching method E. Step of forming solder resist F. Process of forming connection solder balls or conductive paste protrusions on the surface with non-through holes
【０００６】即ち、絶縁性シートの片面に半硬化状態の
絶縁性接着層を設けた後、貫通穴をあけ、絶縁性接着層
の面に金属箔を貼り付けることによって貫通穴を非貫通
穴にし、エッチング法によって金属層の配線を形成しソ
ルダレジストを形成した後、非貫通穴の開いた面に接続
用半田ボールまたは導電性ペースト突起を形成すること
によって、一層の金属配線層でありながら両面板の電気
的接続機能をもった配線板の製造方法である。That is, after providing a semi-cured insulating adhesive layer on one surface of the insulating sheet, a through hole is opened, and a metal foil is attached to the surface of the insulating adhesive layer to make the through hole a non-through hole. After forming the wiring of the metal layer by the etching method and forming the solder resist, the solder balls for connection or the conductive paste protrusions are formed on the surface where the non-through holes are formed, so that the metal wiring layer has a single surface A method for manufacturing a wiring board having a function of electrically connecting the boards.
【０００７】本発明に用いる絶縁性シートは、硬化反応
後の寸法変化率の低い材料である。この絶縁性シートに
は、紙、不織布あるいはガラス布等の強化繊維に樹脂を
含浸した有機材料や強化しない樹脂製品、あるいは、こ
のような材料とセラミックスとの複合化された材料が使
用できる。樹脂としては、フェノール樹脂、エポキシ樹
脂、ポリイミド樹脂、ポリエステル樹脂、フッ素含有樹
脂等が使用できる。The insulating sheet used in the present invention is a material having a low dimensional change rate after the curing reaction. For the insulating sheet, an organic material obtained by impregnating a reinforcing fiber such as paper, non-woven fabric or glass cloth with a resin, a non-reinforced resin product, or a composite material of such a material and ceramics can be used. As the resin, phenol resin, epoxy resin, polyimide resin, polyester resin, fluorine-containing resin or the like can be used.
【０００８】絶縁性接着層としては、エポキシ樹脂系接
着剤、アクリル変性樹脂系、あるいはポリイミド樹脂系
接着剤等が使用できる。これらを絶縁性シートの片面に
ロールコーティング、ディップコーティングあるいはカ
ーテンコーティング法等によって塗布することができ
る。また、さらにこれらの接着剤をフィルム化したもの
をラミネートすることもできる。このような接着フィル
ムの例としては、エポキシ接着フィルムＡＳ−３０００
（日立化成工業株式会社製、商品名）があり、接着剤付
き銅箔の例としては、エポキシ接着フィルムＭＣＦ−３
０００Ｅ（日立化成工業株式会社製、商品名）がある。
絶縁性シートに設けられたこれらの接着剤層は、半硬化
状態となっている必要がある。本発明でいう半硬化状態
とは、４０℃以下では粘着性をもたず、金属箔との加圧
加熱接着によって接着強さが０．６kgf/cm以上を与える
ことができる半硬化状態をいう。このような半硬化状態
にする方法は、通常の樹脂のように完全には硬化しない
温度と時間、加熱して行う。このような条件は、通常実
験的に求められる。このような接着剤付き絶縁性シート
に貫通穴を開ける手段は、パンチング、ドリル等が使用
できる。金属箔としては、銅、ニッケル等の金属が使用
される。また、金属箔の片面は、樹脂との接着力を向上
させるために粗面化処理の施されたものが望ましい。As the insulating adhesive layer, an epoxy resin adhesive, an acrylic modified resin adhesive, a polyimide resin adhesive or the like can be used. These can be applied to one surface of the insulating sheet by roll coating, dip coating, curtain coating or the like. Further, it is also possible to laminate a film of these adhesives. Examples of such an adhesive film include epoxy adhesive film AS-3000.
(Hitachi Chemical Co., Ltd., trade name) is available, and an example of an adhesive-attached copper foil is an epoxy adhesive film MCF-3.
000E (trade name, manufactured by Hitachi Chemical Co., Ltd.) is available.
These adhesive layers provided on the insulating sheet need to be in a semi-cured state. The semi-cured state referred to in the present invention means a semi-cured state which has no tackiness at 40 ° C. or lower and which can give an adhesive strength of 0.6 kgf / cm or more by pressure heating adhesion with a metal foil. . Such a semi-cured state is performed by heating at a temperature and for a time at which it does not completely cure like a normal resin. Such conditions are usually experimentally determined. Punching, drilling or the like can be used as a means for forming a through hole in such an insulating sheet with an adhesive. As the metal foil, a metal such as copper or nickel is used. Further, one surface of the metal foil is preferably subjected to a roughening treatment in order to improve the adhesive force with the resin.
【０００９】[0009]
【作用】硬化反応後の寸法変化率の低い絶縁性シートを
使用することによって、この絶縁性シートに開けられた
貫通穴の位置ずれや変形が抑制されるために、一層の金
属配線で両面板の機能をもった微細な配線板の製造が可
能になる。[Function] By using an insulating sheet having a low dimensional change rate after the curing reaction, the displacement and deformation of the through holes formed in the insulating sheet are suppressed, so that the double-sided board has a single layer of metal wiring. It is possible to manufacture a fine wiring board having the function of.
【００１０】[0010]
【実施例】 実施例１ 図２（ａ）に示すような厚さ０．１mmのガラスエポキシ
積層板の絶縁性シートの片面に、図２（ｂ）に示すよう
に、厚さ５０ミクロンのエポキシ接着フィルムＡＳ−３
０００（日立化成工業株式会社製、商品名）を貼り付
け、図２（ｃ）に示すように、ドリルで直径０．２mmの
貫通穴を開け、図２（ｄ）示すように、接着剤層の面
に、厚さ１８μｍの銅箔を重ね、加圧加熱して一体化さ
せ、貫通穴を非貫通化させ、図２（ｅ）に示すように、
エッチング法で配線を形成し、さらにソルダレジストを
形成し、図２（ｆ）に示すように、非貫通穴が銅箔によ
って閉じられた面に半田ボールを形成した。Example 1 As shown in FIG. 2 (b), an epoxy sheet having a thickness of 50 μm was formed on one surface of an insulating sheet of a glass epoxy laminate having a thickness of 0.1 mm as shown in FIG. Adhesive film AS-3
000 (manufactured by Hitachi Chemical Co., Ltd.) is pasted, a through hole having a diameter of 0.2 mm is drilled as shown in FIG. 2 (c), and an adhesive layer is provided as shown in FIG. 2 (d). 18 μm thick copper foil is laid on the surface of No. 2, and is pressed and heated to be integrated to make the through holes non-penetrating, as shown in FIG.
Wiring was formed by an etching method, a solder resist was further formed, and as shown in FIG. 2F, solder balls were formed on the surface where the non-through holes were closed by the copper foil.
【００１１】[0011]
【発明の効果】以上に説明したように、本発明によって
一層の金属配線で両面板の機能をもった微細な配線板の
製造が可能になる。As described above, according to the present invention, it is possible to manufacture a fine wiring board having a double-sided board function with a single layer of metal wiring.
【図１】従来例を示す断面図である。FIG. 1 is a cross-sectional view showing a conventional example.
【図２】本発明の一実施例を説明するための各工程にお
ける断面図である。FIG. 2 is a sectional view in each step for explaining an embodiment of the present invention.
───────────────────────────────────────────────────── フロントページの続き (72)発明者 大塚 和久 茨城県下館市大字小川1500番地 日立化成 工業株式会社下館研究所内 ─────────────────────────────────────────────────── ─── Continuation of front page (72) Inventor Kazuhisa Otsuka 1500 Ogawa, Shimodate City, Ibaraki Prefecture Hitachi Chemical Co., Ltd. Shimodate Research Center
Claims (1)
する配線板の製造方法。 Ａ．絶縁性シートの片面に半硬化の絶縁性接着層を設け
る工程 Ｂ．貫通穴を開ける工程 Ｃ．絶縁性接着層の面に金属箔を貼り付けることによっ
て貫通穴を非貫通穴にする工程 Ｄ．エッチング法によって配線を形成する工程 Ｅ．ソルダレジストを形成する工程 Ｆ．非貫通穴の開いた面に接続用半田ボールまたは導電
性ペースト突起を形成する工程1. A method of manufacturing a wiring board, comprising the following steps in the following order. A. Step of providing a semi-cured insulating adhesive layer on one surface of the insulating sheet B. Process of drilling through holes C. Step of making through holes non-through holes by attaching metal foil to the surface of the insulating adhesive layer D. Process of forming wiring by etching method E. Step of forming solder resist F. Process of forming connection solder balls or conductive paste protrusions on the surface with non-through holes
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP28183694A JPH08148825A (en) | 1994-11-16 | 1994-11-16 | Manufacture of wiring board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP28183694A JPH08148825A (en) | 1994-11-16 | 1994-11-16 | Manufacture of wiring board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH08148825A true JPH08148825A (en) | 1996-06-07 |
Family
ID=17644692
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP28183694A Pending JPH08148825A (en) | 1994-11-16 | 1994-11-16 | Manufacture of wiring board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH08148825A (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6643923B1 (en) * | 1998-07-29 | 2003-11-11 | Sony Chemicals Corp. | Processes for manufacturing flexible wiring boards |
| JP2004336072A (en) * | 1998-07-29 | 2004-11-25 | Sony Chem Corp | Manufacturing method for flexible substrate |
| KR101156854B1 (en) * | 2010-05-03 | 2012-06-20 | 삼성전기주식회사 | Substrate for a semiconductor package and manufacturing method thereof |
| US8482133B2 (en) | 2010-08-25 | 2013-07-09 | Samsung Electronics Co., Ltd. | Semiconductor package |
| US8801279B2 (en) | 2010-12-28 | 2014-08-12 | Samsung Electronics Co., Ltd. | Semiconductor device with stacked structure having through electrode, semiconductor memory device, semiconductor memory system, and operating method thereof |
| US9780049B2 (en) | 2013-05-16 | 2017-10-03 | Samsung Electronics Co., Ltd. | Semiconductor package |
-
1994
- 1994-11-16 JP JP28183694A patent/JPH08148825A/en active Pending
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6643923B1 (en) * | 1998-07-29 | 2003-11-11 | Sony Chemicals Corp. | Processes for manufacturing flexible wiring boards |
| JP2004336072A (en) * | 1998-07-29 | 2004-11-25 | Sony Chem Corp | Manufacturing method for flexible substrate |
| US6848176B2 (en) | 1998-07-29 | 2005-02-01 | Sony Chemicals Corporation | Process for manufacturing flexible wiring boards |
| US7053312B2 (en) | 1998-07-29 | 2006-05-30 | Sony Corporation | Flexible wiring boards |
| KR101156854B1 (en) * | 2010-05-03 | 2012-06-20 | 삼성전기주식회사 | Substrate for a semiconductor package and manufacturing method thereof |
| US8482133B2 (en) | 2010-08-25 | 2013-07-09 | Samsung Electronics Co., Ltd. | Semiconductor package |
| US8801279B2 (en) | 2010-12-28 | 2014-08-12 | Samsung Electronics Co., Ltd. | Semiconductor device with stacked structure having through electrode, semiconductor memory device, semiconductor memory system, and operating method thereof |
| US9780049B2 (en) | 2013-05-16 | 2017-10-03 | Samsung Electronics Co., Ltd. | Semiconductor package |
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