JPH0946041A - Manufacture of printed wiring board - Google Patents

Abstract

PROBLEM TO BE SOLVED: To adopt constitution that a rigid laminated unitary body is formed and the tip part of a conductor bum is directly connected to a conductive metal foil, by achieving no-oxidation of the entire surface of the conductive metal foil in contact with the tip part of the conductor bump penetrating a synthetic-resin-based sheet, and roughening the surface. SOLUTION: A printed wiring board comprises a laminated element 7 wherein the tip part of a conductor bump 2 is protruding from the surface of a synthetic-resin- based sheet 3. One main surface is reduced and processed beforehand at the protruding surface. The rouphened surface is made to face, and a copper foil 8 is laminated and arranged. A polyimide-resin-based film as a protecting film 9 is laminated and arranged on the copper foil 8 and heated. With the film being compressed, the protecting film 9 is cooled and released. A double-surface copper-foil laminate layer 10, whose both surfaces are electrically connected, is formed. The copper foil 8 is minutely bonded to the surface of the synthetic-resin-based sheet 3 so as to form a unitary body. At the same time, the tip part of the conductor bump 2 penetrated into the synthetic-resin-based sheet 3 in contact with the surface of the copper foil 8 undergoes plastic deformation, and the same plane is formed. Therefore, the constitution that the tip part of the conductor bump is directly connected to the conductive metal foil can be adopted.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method of manufacturing a printed wiring board, and more particularly, to a printed wiring board in which wiring layers are connected by a highly reliable conductor wiring portion with good yield while reducing the number of steps. About possible ways.

[0002]

2. Description of the Related Art In a double-sided printed wiring board or a multi-layered printed wiring board, electrical connection between wiring layers such as double-sided conductive patterns is made as follows. For example, in the case of a double-sided printed wiring board, perforation processing (perforation processing) is performed at a predetermined position on the double-sided copper foil-clad substrate, and chemical plating treatment is performed on the entire surface including the inner wall surface of the perforated hole, The metal layer on the inner wall surface of the hole is thickened by electroplating to improve reliability and electrically connect the wiring layers.

Further, in the case of a multilayer printed wiring board, after patterning copper foils stretched on both sides of the substrate respectively, an insulating sheet (for example, prepreg) is formed on the patterned surface.
After stacking and arranging the copper foil via the, and integrating by heating and pressing, as in the case of the above-mentioned double-sided printed wiring board, electrical connection between wiring layers by drilling and plating,
A multilayer printed wiring board is obtained by patterning the surface copper foil. In the case of a multilayer printed wiring board having more wiring layers, it can be manufactured by a method of increasing the number of double-sided printed wiring boards inserted in the middle.

Further, the following means are known as a method of manufacturing a printed wiring board which can simplify the manufacturing process. That is, a synthetic resin sheet and a conductor foil are laminated and arranged on the surface of a support substrate on which conductor bumps having a conical shape are formed, and the laminate is heated and pressed. By this heating and pressing, the tip of the conductor bump is inserted and contacted with a synthetic resin sheet on the conductor foil surface to form an electrical connection, and then the conductor foil is subjected to wiring patterning. In the case of this means, not only the drilling process for interlayer connection and the conduction process by plating can be omitted, but also the wiring region and the mounting region accompanying the omission of the drilling can be omitted, and therefore, attention is paid.

[0005]

As described above, in a method of manufacturing a printed wiring board that utilizes a plating method for electrical connection between wiring layers, holes for electrical connection between wiring layers are formed in a substrate. It has the drawbacks that it requires drilling (drilling) processing, plating processing including the hole inner wall surface, and the manufacturing process of the printed wiring board is redundant and process management is complicated.

On the other hand, (a) insertion of an insulator layer (synthetic resin sheet) at the tip of the conductor bump, (b) contact with the opposing conductor layer (conductor foil or wiring pattern) surface, (c) In the case of a method for manufacturing a printed wiring board, which has the skeleton of close contact / pressure contact due to plastic deformation on the contact surface, and electrical connection, the following problems are feared. That is, in the case of this manufacturing method, in general,
A conductor foil (for example, a copper foil) as a material, which has a blackened surface, is used to secure the adhesiveness between the wiring layer and the insulating layer or a required adhesive force. This is because the copper foil having its surface blackened has its surface roughened by the blackening treatment, in other words, the formation of a thin oxide layer, so that the adhesion can be secured.

However, the blackening = the formation of a thin oxide layer is
As a result, it means the interposition of an insulating layer, and a problem remains in the electrical connection in the contacting / plastic deformation of the conductor bump tips. That is, in general, the thin oxide layer is damaged in the process of pressing and contacting by heating and pressing to form the required electrical connection, but the damage of the thin oxide layer is partially insufficient. There is also a possibility that it will occur, and there is concern about reliability.

The present invention has been made in view of the above circumstances, and provides a printed wiring board having a more reliable interlayer conductor wiring portion, which enables a higher density wiring and mounting by a simple process. The purpose is to provide a manufacturing method.

[0009]

According to a first aspect of the present invention, there is provided a step of forming a conductor bump at a predetermined position on a conductor layer surface, and a step of laminating a synthetic resin sheet on the conductor bump formation surface. On the surface of the synthetic resin sheet, a step of laminating a roughened conductive metal foil whose surface facing the synthetic resin sheet is non-oxidized and roughened, and pressing the laminated body A step of inserting the conductor bump in the thickness direction of the synthetic resin sheet and connecting the tip end of the conductor bump to the opposing conductive metal foil surface by plastic deformation to form a through-type conductor wiring portion. And a step of subjecting the conductive metal foil to wiring patterning, which is a method for manufacturing a printed wiring board.

According to a second aspect of the present invention, a step of forming a conductor bump at a predetermined position on the surface of the conductor layer, a step of laminating a synthetic resin sheet on the conductor bump forming surface, and a step of forming the synthetic resin sheet. A step of laminating and placing a conductive metal foil whose surface facing the synthetic resin sheet is blackened / reduced on the sheet surface, and pressing the laminated body to increase the thickness of the synthetic resin sheet. In the depth direction, the step of inserting the conductor bump and connecting the tip of the conductor bump to the opposite conductive metal foil surface by plastic deformation to form a through-type conductor wiring portion; and wiring the conductive metal foil. And a step of patterning the printed wiring board.

According to a third aspect of the present invention, a step of forming a conductor bump at a predetermined position on the surface of the conductor layer, a step of laminating a synthetic resin sheet on the surface of the conductor bump formation, and a step of forming the synthetic resin sheet. A step of laminating and placing a conductive metal foil whose surface facing the synthetic resin sheet is roughened by a plating treatment on the sheet surface, and pressing the laminated body to press the synthetic resin sheet. In the thickness direction, a step of inserting the conductor bump, connecting the tip of the conductor bump to the opposing conductive metal foil surface by plastic deformation to form a through-type conductor wiring portion, and the conductive metal foil, A method of manufacturing a printed wiring board, comprising: a wiring patterning step.

In the present invention, the conductor layer forming the conductor bump may be a conductive metal foil or a conductor pattern, and its shape is not particularly limited.
Further, the conductor bumps may be formed not only on one main surface but also on both main surfaces. On the other hand, the conductive metal foil laminated via the insulating layer may also be a single sheet or patterned one. However, in the case of a conductive metal foil, it is necessary that the main surface in contact with the insulator layer (the main surface with which the tip of the conductor bump that penetrates the insulator layer contacts) is non-oxidized and roughened. is there.

This non-oxidized state / roughening is performed, for example, by a reduction treatment after fine groove formation processing or a fine uneven surface treatment, a reduction treatment after blackening treatment, or a plating treatment on the reduction treated surface ( The electroless plating process and the electrolytic plating process are at least one of the two).

In the present invention, the conductor bump is made of a conductive powder prepared by mixing conductive powder such as silver, gold, copper and solder powder, an alloy powder or a composite (mixed) metal powder of these with a binder resin component. Formed of a sex composition. As the binder resin component, for example, polycarbonate resin, polysulfone resin, polyester resin,
Examples include phenoxy resin, phenol resin, and polyimide resin. Further, methyl methacrylate, diethyl methyl acrylate, trimethylol propane triacrylate, diethylene glycol diethyl acrylate.
UV ray-curable resin or electron beam such as acrylic acid ester, methacrylic acid ester, methyl acrylate, ethyl acrylate, acrylic acid diethylene glycol ethoxylate, ε-caprolactone modified dipentaerythritol acrylate, etc. A resin that cures upon irradiation can also be used. The bump group can be formed by, for example, a printing method using a relatively thick metal mask to form a bump having a high aspect ratio, and the height of the bump group is generally preferably 100 to 400 μm. Furthermore, the height of the bump group is such that it can penetrate one layer of synthetic resin sheet,
Alternatively, the height that can penetrate a plurality of layers of the synthetic resin sheet may be appropriately mixed.

In the present invention, a conductor bump is inserted,
Examples of the insulator layer (synthetic resin sheet) forming the through-type conductor wiring portion include a thermoplastic resin film (sheet), and the thickness thereof is preferably about 50 to 800 μm. Here, examples of the thermoplastic resin sheet include sheets such as polycarbonate resin, polysulfone resin, thermoplastic polyimide resin, polyethylene tetrafluoride resin, polypropylene hexafluoride resin, and polyether ether ketone resin. Further, a thermosetting resin sheet that is kept in a state before curing can also be used, and examples of such a thermosetting resin sheet include epoxy resin, bismaleimide triazine resin, polyimide resin, phenol resin, polyester resin, melamine resin, etc. ,
Furthermore, raw rubber sheets such as butadiene rubber, butyl rubber, natural rubber, neoprene rubber, and silicone rubber may be used. These synthetic resins may be used alone or may contain an insulating inorganic or organic filler, and further, glass cloth or mat, organic synthetic fiber cloth or mat,
Alternatively, it may be a sheet formed by combining with a reinforcing material such as paper.

In the present invention, when a conductor layer having conductor bumps formed thereon, for example, a main surface of a conductive metal foil, is laminated with an insulator layer and the like to heat and press, a press or the like is used. A metal film with little size or deformation, or a heat-resistant resin plate sheet may be inserted between the pressure body and the resin component of the synthetic resin sheet when heated to press the laminate. When the conductor bumps are pressed in a softened state to insert the conductor bumps, it is possible to more easily achieve interlayer connection by inserting the conductor bumps.

According to the first aspect of the present invention, since the entire surface of the conductive metal foil, which is in contact with the tip of the conductor bump and which penetrates the synthetic resin sheet, is non-oxidized and roughened, a required adhesion is obtained. Not only can a strong laminated unity be formed by force, but
The tip portion of the conductor bump also surely adopts a configuration in which it is directly connected (without an insulating layer) to the surface of the conductive metal foil. That is, it is possible to provide a printed wiring board that is firmly integrated as a whole and that has a highly reliable electrical connection between wiring layers with high yield.

According to the second aspect of the present invention, the entire surface of the conductive metal foil, which is in contact with the tip of the conductor bump and which penetrates the synthetic resin sheet, is non-oxidized and roughened by the blackening / reduction treatment. Therefore, not only can you easily form a strong laminated integration with the required adhesion, but also ensure that the tip of the conductor bump is directly connected (without an insulating layer) to the conductive metal foil surface. Will be taken. That is, it is possible to provide a printed wiring board that is firmly integrated as a whole and that has highly reliable electrical connection between wiring layers more easily and with high yield.

According to the third aspect of the invention, the entire surface of the conductive metal foil, which is in contact with the tip of the conductor bump and which penetrates the synthetic resin sheet, is non-oxidized and roughened by plating. , In addition to easily forming a strong laminated integration with the required adhesion, the tip of the conductor bump is connected directly to the plated surface of the conductive metal foil (without interposing an insulating layer). It will be. That is, it is possible to provide a printed wiring board that is firmly integrated as a whole and that has highly reliable electrical connection between wiring layers more easily and with high yield.

[0020]

BEST MODE FOR CARRYING OUT THE INVENTION Hereinafter, FIGS. 1 (a) to (c) and 2 (a) to
An embodiment of the present invention will be described with reference to (e) and FIGS. 3 (a) to 3 (c).

Example 1 FIGS. 1 (a) to 1 (c) and 2 (a) to 2 (d) schematically show an embodiment of this example.

First, an electrolytic copper foil (conductive metal foil) having a thickness of 35 μm, which is generally used in the production of printed wiring boards, is used as the conductive layer 1, and a polyether sulfone is used as a binder as a conductive paste. Silver-based conductive paste (trade name,
Unimec H9141, made by Hokuriku Paint KK) and thickness 200
Metal masks with holes of 0.3 mm in diameter were prepared at predetermined locations on a μm stainless steel plate.

Next, a metal mask was positioned and arranged on the surface of the copper foil 1, and a conductive paste was screen-printed.
After the printed conductive paste is dried, the steps of positioning the metal mask at the same position, screen-printing the conductive paste, and drying are repeated three times, and as shown in a sectional view in FIG. A conductor bump 2 of about 200 μm was formed on one surface of the copper foil.

Thereafter, a thickness of 200 μm prepared in advance
The synthetic resin sheet 3 (glass cloth impregnated with epoxy resin) 3 was positioned on the conductor bump 2 forming surface of the copper foil 1. Then, as shown in a sectional view in FIG. 1 (b), a thickness of 15 μm is formed on the surface of the synthetic resin sheet 3.
An aluminum foil of m 4, a silicone rubber plate (pressed plate) 5 with a thickness of about 3 mm, and a contact plate 6a are sequentially arranged, while a copper foil 1
The backing plate 6b was placed on the back surface side of, and set in a press device with a heating / pressurizing / cooling mechanism to heat without pressurizing. 120
When the temperature was raised to ℃, a resin pressure of 2 MPa was applied, and the product was cooled with the primary pressure applied and then taken out. As shown in the cross-sectional view in FIG. 1 (c), it was formed on one surface of the copper foil. A laminated material with an aluminum foil was obtained by inserting the synthetic resin sheet 3 and the aluminum foil 4 in the same shape as the tip of the conductor bump 2 without causing positional deviation.

Next, the aluminum foil 4 was peeled off from the laminated material with the aluminum foil to obtain a laminated material 7 in which the tips of the conductor bumps 2 were projected from the surface of the synthetic resin sheet 3. On the surface of the laminated material 7 where the tip of the conductor bump 2 is projected, as shown in FIG.
As shown in a sectional view in FIG. 1, one main surface is subjected to reduction treatment in advance and the roughened surfaces are opposed to each other, and a copper foil 8 having a thickness of 35 μm is laminated and arranged, and a protective film is further provided on the copper foil 8. As shown in Fig. 9, polyimide resin film is laminated and set, heated and pressed in a press machine, and a resin pressure of 2 MPa is applied. Then, it is kept at 170 ° C for 1 hour, cooled while being taken out, and taken out. The protective film 9 is peeled off, and a double-sided copper foil laminated plate 10 is electrically connected between both sides as shown in a sectional view in FIG. 2 (b).
I got Observation of the cross section of the double-sided copper foil laminate 10 shows that the copper foil 8 is closely adhered and integrated with the surface of the synthetic resin sheet 3 and the copper of the conductor bump 2 having the synthetic resin sheet 3 inserted therethrough. The tip end portion which was in contact with the foil 8 surface was plastically deformed (crushed) to form the same plane and was connected to the copper foil 8 surface.

On both sides of the double-sided copper foil laminate 10, as shown in FIG.
As shown in the cross-section in Fig. 1, ordinary etching resist ink (trade name, PSR-4000 H, manufacturer: Taiyo Ink KK) is screen-printed, the conductor pattern is masked 11, and then the cupric chloride etching solution is used. As a result, the wiring patterning 12a and 12b were performed, and the resist mask was peeled off to obtain a double-sided printed wiring board 12 as shown in cross section in FIG. 2 (d).

When the double-sided printed wiring board 12 was subjected to a normal electrical check, no problems such as defects or reliability were found in all the connections. Also, when the flow soldering heat resistance test (288 ° C, 10 seconds) was performed, delamination was not observed, and the change in resistivity of the conductor was 10% or less.

Example 2 FIGS. 3 (a) to 3 (d) schematically show an embodiment of this example.

In the same manner as in Example 1, first, the double-sided printed wiring board 12 is manufactured, and the wiring patterns 12a and 12b of the double-sided printed wiring board 12 are subjected to the blackening treatment liquid (trade name, Propond).
After the oxidation treatment with 80, Shipley First kk), blackening treatment reducing solution (trade name, HIST-100B, Hitachi Chemical Co., Ltd. kk)
The reduction process is performed at
The wiring patterns 12a and 12b are non-oxidized and roughened.

Next, as shown in a sectional view in FIG. 3B, the wiring patterns 12a and 12b of the double-sided printed wiring board 12 are non-oxidized and roughened, and a 200 μm thick epoxy prepreg layer 3 is provided on the roughened surface side. Through the above, the laminated material 7 in which the tip of the conductor bump 2 previously formed protrudes from the surface of the synthetic resin sheet 3 is laminated and arranged. This laminated body is pressed, heated and integrated as shown in a sectional view in FIG. 3 (c) by a method similar to that of Example 1, and then wiring patterning of the double-sided copper foil 1 is further performed. Multilayer printed wiring board as shown in cross section in Figure 3 (d)
13 were manufactured.

When the above-mentioned multi-layered printed wiring board 13 was subjected to an electrical check which is usually carried out, no problems such as defects or reliability were found in all the connections.
In addition, even when a flow soldering heat resistance test (288 ° C, 10 seconds) was performed, delamination was not observed and the change in resistivity of the conductor was 10%.
It was below. Furthermore, in order to evaluate the reliability of the connection between the wiring patterns, a hot oil test (one cycle of immersion in 260 ° C. oil for 10 seconds and 20 ° C. oil for 20 seconds) was performed 500 times. However, no defect was found and the connection reliability between the wiring pattern layers was excellent.

Example 3 In the same manner as in Example 1, a laminated material was first prepared in which the tip end portions of the conductor bumps were projected from the synthetic resin sheet surface.
The thickness of 200 μm on the protruding surface of the conductor bump tip of this laminated material
A m 3 epoxy prepreg layer and a roughened 37 μm-thick copper foil were laminated and arranged according to each other. Here, in the copper foil, the surface facing the epoxy prepreg layer is an electroless plating solution (trade name, CUPO
SIT250, Shipley First kk) treatment, a rough plating film with a thickness of about 2 μm was formed.

The laminated body was pressed, heated and integrated by a means similar to that of Example 1, and then the double-sided copper foil was subjected to wiring patterning to manufacture a double-sided printed wiring board. When the double-sided printed wiring board was subjected to a normal electrical check, no problems such as defects or reliability were found in all the connections.

After the wiring pattern surface of the double-sided printed wiring board is non-oxidized and roughened, the wiring pattern surface of the double-sided printed wiring board has a thickness of 200 μm on the non-oxidized and roughened surface side.
Through the epoxy prepreg layer, the laminated material in which the tips of the conductor bumps, which were prepared in advance, protruded from the synthetic resin sheet surface, was laminated and arranged. This laminated body was pressed, heated, and integrated by a means similar to that of Example 1, and then wiring patterning of the double-sided copper foil was further performed to manufacture a multilayer printed wiring board.

When the above-mentioned multi-layered printed wiring board was subjected to an electrical check which is usually carried out, no problems such as defects or reliability were found in all the connections. Also, when the flow soldering heat resistance test (288 ° C, 10 seconds) was performed, delamination was not observed, and the change in resistivity of the conductor was 10% or less. In addition, in order to evaluate the reliability of the connection between the wiring patterns, a hot oil test (a cycle of dipping in oil at 260 ° C for 10 seconds and dipping in oil at 20 ° C for 20 seconds was used.
No defect was found even after 500 cycles (for one cycle), and the connection reliability between the wiring pattern layers was excellent.

In the above, instead of using the copper foil whose surface facing the epoxy prepreg layer is roughened by electroless plating, a copper plating solution (copper sulfate 200 g / l) is used,
A double-sided printed wiring board and a multi-layered printed wiring board were manufactured under the same conditions, except that copper foil with a rough plating film of about 2 μm thickness was used at a cathode current density of 5 A / dm ^2. did. Then, when the same test evaluation was performed on these printed wiring boards, similar results were observed.

Although an example of manufacturing a double-sided type and a four-layer type printed wiring board has been described above, the present invention is not limited to this example, and is a three-layer type or a five-layer type without departing from the spirit of the invention. It is also possible to manufacture the multilayer printed wiring board described above. Further, the synthetic resin sheet and the conductor bumps may be made of materials other than those exemplified above.

[0038]

As can be seen from the above description, according to the present invention, the entire surface of the conductive metal foil which is in contact with the tips of the conductor bumps which penetrate the synthetic resin sheet is non-oxidized and roughened. Therefore, a strong laminated integration is formed by the required adhesion force, and the tip end portion of the conductor bump forming the interlayer connection portion is surely connected without interposing the insulating layer. Therefore, it is possible to provide a printed wiring board that is firmly integrated as a whole and that has a highly reliable electrical connection between wiring layers with high yield. In other words, by adopting a simplified process, it is possible to contribute to mass productivity and cost while making it compact (improving wiring density and mounting density by omitting through holes), and also in terms of performance. It is possible to easily provide a printed wiring board having high performance.

[Brief description of drawings]

FIG. 1 schematically shows an embodiment of the present invention.
(a) is a sectional view showing a state where conductive bumps are formed on the conductor metal foil surface, and (b) is a sectional view showing a state where conductor metal foils having conductor bumps formed and insulating resin sheet layers are laminated and arranged. ,
(c) is a cross-sectional view showing a state in which the laminated body is pressed into a single-sided copper-clad laminated material.

FIG. 2 schematically shows an embodiment of the present invention,
(a) is a cross-sectional view showing a state in which an insulating resin sheet layer and a conductor metal foil are laminated and arranged on the surface of a laminated material, (b) is a cross-sectional view showing a state in which a laminate is pressed to form a double-sided copper-clad laminate, ( c)
Is a cross-sectional view showing a state where a resist mask is applied to the surface of the double-sided copper-clad laminate, and (d) is a cross-sectional view showing a state where wiring is patterned on both sides of the double-sided copper-clad laminate.

FIG. 3 schematically shows an embodiment example of the present invention,
(a) is a cross-sectional view showing a state where the wiring pattern surface of the double-sided wiring board is non-oxidized and roughened, and (b) is a synthetic resin on both sides of the double-sided wiring board whose wiring pattern surface is non-oxidized and roughened. A cross-sectional view showing a state in which sheets and laminated materials are laminated and arranged, (c) a cross-sectional view showing a state where a laminate is pressed to form a double-sided copper-clad laminate, and (d) a wiring pattern on both sides of the double-sided copper-clad laminate Sectional drawing which shows the state.

[Explanation of symbols]

1 ... Conductor metal foil (layer) 2 ... Conductive bump 3 ... Insulating resin sheet layer 4 ... Aluminum foil 5 ... Pressed body 6a, 6b ... Applied 7 ... Laminated material 8 ... Insulating resin Copper foil whose surface facing the sheet layer is non-oxidized and roughened 9 Protective film 10 Double-sided copper foil-clad laminated plate 11 Etching resist film 12 Double-sided printed wiring board 13 Multilayer Mold printed wiring board

Claims (3)

[Claims] 1. A step of forming a conductor bump at a predetermined position on a conductor layer surface, a step of laminating a synthetic resin sheet on the conductor bump forming surface, and a step of stacking a synthetic resin sheet on the conductor bump forming surface. A step of laminating and arranging a roughened conductive metal foil whose surface facing the synthetic resin sheet is non-oxidized, and pressurizing the laminated body so that the thickness direction of the synthetic resin sheet is increased. To
A step of inserting the conductor bump, connecting the tip of the conductor bump to the opposing conductive metal foil surface by plastic deformation to form a through-type conductor wiring portion; and a step of wiring patterning the conductive metal foil. A method for manufacturing a printed wiring board, comprising: 2. A step of forming a conductor bump at a predetermined position on a conductor layer surface, a step of laminating a synthetic resin sheet on the conductor bump forming surface, and a step of stacking a synthetic resin sheet on the conductor bump surface. A step of stacking and arranging a conductive metal foil whose surface facing the synthetic resin sheet is blackened / reduced, and pressing the laminated body in the thickness direction of the synthetic resin sheet,
A step of inserting the conductor bump, connecting the tip of the conductor bump to the opposing conductive metal foil surface by plastic deformation to form a through-type conductor wiring portion; and a step of wiring patterning the conductive metal foil. A method for manufacturing a printed wiring board, comprising: 3. A step of forming a conductor bump at a predetermined position on a conductor layer surface, a step of stacking a synthetic resin sheet on the conductor bump forming surface, and a step of stacking a synthetic resin sheet on the conductor bump surface. A step of laminating and disposing a conductive metal foil whose surface facing the synthetic resin sheet is roughened by plating, and pressing the laminated body in the thickness direction of the synthetic resin sheet,
A step of inserting the conductor bump, connecting the tip of the conductor bump to the opposing conductive metal foil surface by plastic deformation to form a through-type conductor wiring portion; and a step of wiring patterning the conductive metal foil. A method for manufacturing a printed wiring board, comprising: