JPH08148771A - Divided printed circuit board - Google Patents

Abstract

PURPOSE: To prevent irregular division in a divided printed circuit board to reduce failure rate by division of a wiring pattern. CONSTITUTION: Reinforcing patterns 8a, 8b and 9a, 9b are formed along cutting lines 2a, 2b, 2c and 3a, 3b of the printed circuit board 1. Moreover, the cutting line is formed of slit portions 2a, 2b, 2c and scored portions 3a, 3b and the reinforcing patterns 8a, 8b and 9a, 9b are formed only corresponding to its scored portions 3a, 3b.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a divided printed board for dividing a single printed board into a plurality of pieces.

[0002]

2. Description of the Related Art There is known a divided printed board in which a cut is formed in a printed board and the printed board is divided into a plurality of cuts. In this divided printed circuit board, as shown in Japanese Utility Model Publication No. 63-28617, the cuts are formed by perforations and V-shaped grooves arranged in a perforated line.

[0003]

By the way, in such a divided printed circuit board, there is a case where an abnormal division is performed without being properly broken at a cut during the dividing work, and the divided printed circuit board is formed on the divided printed circuit board. Sometimes the wiring pattern was cut. In particular, if the formation position of the wiring pattern cannot be secured a sufficient distance from the cut, the incidence of defects due to the cutting of the wiring pattern increases,
I can't ignore it.

An object of the present invention is to prevent abnormal division from occurring in a divided printed circuit board and reduce the occurrence rate of defects due to cutting of wiring patterns.

[0005]

According to the present invention, a reinforcing pattern different from the wiring pattern is formed along the cut line of the printed circuit board.

Further, the cut line is composed of a slit portion formed of a linear through hole and a perforation portion formed by arranging dot-like through holes in a row and in a row, and the reinforcing pattern is formed by the perforation pattern. It is formed corresponding to only the part.

[0007]

According to the present invention, the reinforcing pattern formed along the cut line of the printed circuit board prevents the abnormal division of the printed circuit board when the cut pattern does not crack correctly.

Further, when the cut is composed of the slit portion and the perforated portion, paying attention to the fact that the abnormal division of the printed circuit board is the perforated portion, the reinforcement pattern is unnecessarily extended. In addition, the formation of the reinforcing pattern prevents the formation area of the wiring pattern from being unnecessarily reduced.

[0009]

1 shows an embodiment of the present invention. FIG.
In the printed circuit board 1, slits 2a, 2b, 2c formed by linear through holes and perforations 3a, 3b formed by dot-like through holes arranged in a line in a scattered manner are formed. The printed circuit board 1 is divided into a first substrate portion 1a and a second substrate portion 1b by the cuts.

Wiring patterns 4, 5 and 6 are provided on the first substrate portion 1a, and wiring patterns 7 are provided on the second substrate portion 1b.
Are formed of copper foil, respectively. In addition, reinforcing patterns 8a, 8b and 9 are provided on both sides of the cut perforations 3a and 3b along the perforations 3a and 3b, respectively.
a and 9b are formed of copper foil, and the reinforcing patterns 8a and 8b and 9a and 9b are the wiring patterns 4 and
It is formed at the same time when forming 5, 6, and 7.

The reinforcing patterns 8a, 8b and 9a,
9b is formed at a position adjacent to the perforated portions 3a, 3b from the corresponding wiring patterns 4, 5, 6 and 7. Therefore, when the printed circuit board 1 is divided from the cut line, a crack is generated inside the first substrate part 1a or depending on the degree of breakage of the connection part between the first substrate part 1a and the second substrate part 1b of the perforation parts 3a and 3b. The cracks may enter the inside of the second substrate portion 1b, but the cracks may be reinforced by the reinforcing patterns 8a, 8b,
It is dammed by 9a or 9b.

Therefore, the portions of the wiring patterns 4, 5, 6 and 7 adjacent to the perforations 3a and 3b are protected from cracks by the reinforcing patterns 8a, 8b and 9a and 9b, and the wiring patterns 4, 5 are abnormally divided. , 6 and 7 are prevented from being cut.

By the way, the reinforcing patterns 8a, 8b and 9a, 9b are formed only along the perforations 3a, 3b as described above, and are not formed over the entire area of the cut. Therefore, the reinforcing patterns 8a and 8b
And 9a and 9b need not be unnecessarily extended, and the edges of the first and second substrate portions 1a and 1b that reach cuts are formed in the portions where the reinforcing patterns 8a, 8b and 9a, 9b are not formed. You can effectively use up to the department,
Like the wiring patterns 4, 5 and 7, a part can be brought close to the cut line (slit portions 2a, 2b, 2c) without being obstructed by the reinforcing patterns 8a, 8b and 9a, 9b.

Incidentally, in FIG. 1, the first substrate portion 1a of the perforated portion 3a in which the wiring patterns are not formed adjacent to each other.
Although the reinforcing pattern 8a is also formed on the side, the reinforcing pattern (in the case of FIG. 1, the reinforcing pattern 8a in FIG. 1) is omitted at a place where there is little possibility that the wiring pattern is cut when the printed board 1 is divided. You may.

Further, in FIG. 1, cut lines of the printed circuit board 1 are formed by slits 2a, 2b, 2c and perforations 3.
Although it is constituted by a and 3b, it is not limited to this and all the cuts may be formed by perforations or may be formed by V-shaped grooves. In these cases, the reinforcing pattern is formed over the entire cut area. It should be formed.

[0016]

As described above, according to the present invention, since the reinforcing pattern is formed along the cut line of the printed circuit board, cracks due to abnormal division can be stopped by the reinforcing pattern, and the wiring pattern is cut. The occurrence rate of defects due to can be significantly reduced.

Further, according to the present invention, since the notch is composed of the slit portion and the perforation portion and the reinforcing pattern is formed corresponding to only the perforation portion, a crack due to abnormal division may occur. In the portion corresponding to the slit portion of the printed circuit board having almost no property, the area for forming the wiring pattern can be secured, and the printed circuit board can be effectively utilized.

[Brief description of drawings]

FIG. 1 is a diagram showing an embodiment of the present invention.

[Explanation of symbols]

 1 Printed circuit board 2a, 2b, 2c Slit part 3a, 3b Perforation part 4, 5, 6, 7 Wiring pattern 8a, 8b, 9a, 9b Reinforcing pattern

Claims (2)

[Claims] 1. A divided printed circuit board in which a cut is formed on a printed circuit board and the cut circuit is divided into a plurality of divisions, and a reinforcing pattern different from a wiring pattern is formed along the cut. Characteristic divided printed circuit board. 2. The cut line is composed of a slit portion formed of a linear through hole and a perforation portion formed by arranging dot-like through holes in a row and in a row, and the reinforcing pattern is provided with the perforation line. The divided printed circuit board according to claim 1, wherein the divided printed circuit board is formed so as to correspond to only the portion.