JPH08144094A - Plating device - Google Patents

Abstract

PURPOSE: To form a plating film uniform in thickness over the whole region by watertightly sealing the gap between a supporting member and a substrate and providing a conductor member to electrically connect the member to the substrate. CONSTITUTION: A current is applied to a substrate D to plate a substrate film 2. The substrate D is attached to the holder C of a plating device. The substrate D is pressed down against the spring force of an arm 57 in a conductor member C23, hence the arm 57 is elastically flexed, a contactor 58 is pressed on the substrate D, and a good electrical continuity is attained. The upper face C22a of a packing C22 is firmly attached to the substrate D, and a plating soln. never intrudes into the conductor part. The substrate is inserted into the plating soln. and electroplated. A minute object forming pattern formed on the substrate D including the part close to the periphery of the substrate is plated at the current density as expected.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention is used when a large number of minute objects are formed by forming a plating film on a substrate on which a large number of various minute patterns are formed with a masking agent. The present invention relates to a plating device that can be used. For example, by forming a pattern of a large number of minute objects such as a thin-film coil for a thin-film magnetic head or a thin-film magnetic layer with the masking agent, and plating a metal for forming them on the coil or the magnetic layer. The present invention relates to a plating apparatus that can be used when forming a metal.

[0002]

2. Description of the Related Art As shown in FIG. 11, a substrate D is generally made of silicon or AlTiC (AlTiC) substrate body 1 (for example, a diameter of 75 to 150 mm and a thickness of 1 to 4 mm). A film, for example, copper is formed to a thickness of several nm. The surface on which the base film 2 is formed becomes the conductive surface 2a, and the surface is used for plating (also referred to as a plated surface). Since the substrate D supports the supporting region 4 around the substrate D by the supporting member during plating, the central portion inside the supporting region 4 (supported portion) becomes the plating region 3 (also referred to as an effective surface). In the case of forming a minute object using such a substrate D, the conductive film 5 having a width of about 1.8 mm is left on the base film 2 on the base film 2 at the outer peripheral edge portion of the supporting region 4. A wider area than the plating area 3 is covered with a resist mask 6. The mask 6 in the plating region 3 has a pattern 7 of a minute object to be formed,
For example, a large number of fine patterns 7 having the shape shown in the drawing are formed. Reference numeral 7a denotes a portion of the pattern 7 where the base film 2 is exposed, and indicates a portion where a plating film is to be formed. The size of each pattern 7 is about 50 μm across,
For example, tens of thousands of such patterns 7 are formed over the entire surface of the plating region 3 of the one substrate D.

The substrate D as described above is held by a holder Cf as shown in FIG. 12, and immersed in the plating solution 16f in the plating tank Af. 46f of the holder Cf is a support member for supporting the substrate and is formed in an annular shape, and the inside thereof is an opening 48f for exposing the plating area 3. The supporting member 46f is also a connecting member for making an electrical connection to the current-carrying portion 5 of the substrate D, and is made of a conductive material. C2f is a retainer for pressing the substrate D against the support member 46f. The anode Bf in the plating tank Af and the supporting member 46f are connected to a power source 20f.

In the above state, the current from the power source 20f flows from the anode Bf to the plating solution 16f, and further the current flows from the plating solution 16f to the exposed portion 7a of the underlying film in the pattern 7 and passes through the underlying film 2. The current-carrying section 5 is reached. From the current-carrying part 5, it reaches the support member 46f through contact with the support member 46f, and returns to the power source 20f through the support member 46f. By the current flowing in this way, a plating film is formed on each of the portions 7a of the large number of patterns 7 on the substrate D. In this way, a large number of minute objects can be formed at once in the predetermined plating region 3 on the substrate D.

[0005]

In this conventional plating apparatus, the support member 46 is used when the plating is being performed.
There has been a problem that the plating solution permeates between f and the supporting region 4 of the substrate D which is placed on the f. When such impregnation occurred and reached the conducting part 5 where the base film 2 was exposed, in addition to the current flow from the plating solution to the exposed portion 7a, the impregnation occurred from the plating solution. A current also flows to the current-carrying portion 5 of the portion, and as a result, the current density to the entire exposed portion 7a in the large number of patterns 7 in the plating area 3 of the substrate decreases, and the plating area 3 has a predetermined thickness. However, there is a problem that the time required to form the plating film becomes long. In particular, the soaking occurs in some places and in some places as shown by the presence or absence of the arrow 91 in FIG. 13, and the current density is reduced in the pattern 7 in the portion having the soaking, that is, the portion 92 close to the supporting region 4. Is large, and the film thickness of the portion 92 becomes particularly thin as compared with the film thickness of the pattern of other portions, resulting in a large variation in the film thickness of the plated film of each pattern 7 in the entire plating region 3. There was a point.

The plating apparatus of the present invention is provided to solve the above-mentioned problems (technical problems) of the prior art. The first purpose is to perform plating between the anode for plating and the current-carrying part of the substrate when forming a large number of minute objects using a substrate having a large number of patterns for forming minute objects in the plating area. By supplying the electric current of, the electric current for plating is made to flow from the plating solution to each of the numerous patterns in the above-mentioned plating area, and the plating film can be simultaneously formed on all of these patterns. Another object of the present invention is to provide a plating apparatus capable of efficiently forming a large number of minute objects. The second purpose is to prevent the current from flowing from the plating solution to the current-carrying part by using the packing to prevent the plating solution from soaking into the current-carrying part and the back side of the conductive surface of the substrate in the case of the above-mentioned plating. The purpose is to allow a predetermined current density to be applied to the openings of the large number of patterns as planned. And by that,
It is to be able to form a plating film having a predetermined thickness on the above-mentioned many patterns without increasing the plating time. A third object is to allow the plating current to flow at a predetermined current density even in a pattern near the current-carrying portion on the periphery of the substrate. By doing so, it is possible to prevent a large variation in the film thickness near the periphery of the substrate. A fourth object is that even if the packing is provided, it is possible to supply the plating current to the current-carrying portion of the substrate without any trouble, so that a large number of patterns can be simultaneously processed.
Moreover, it is possible to perform plating in a state where the thickness of the plating film is uniform even up to the peripheral pattern. Other objects and advantages will be readily apparent from the drawings and the following description related thereto.

[0007]

To achieve the above object, a plating apparatus according to the present invention comprises a plating tank for storing a plating solution, a plating anode provided in the plating tank, and A holder for holding a substrate for plating in a plating tank, the holder having an opening for exposing a plating region at a central portion of a conductive surface of the substrate to a plating liquid, The plating area exposed in the opening is immersed in the plating solution stored in the plating bath, and a plating current is passed between the anode and the conductive surface of the substrate to form the plating area. In the plating device for plating the area, the support member around the opening in the holder is
An annular packing for water-tightly sealing between the supporting member and a supporting area around the conductive surface of the substrate to prevent the plating solution from seeping into the current-carrying portion at the periphery of the conductive surface. And a current-carrying member for electrically connecting to the current-carrying portion of the substrate.

[0008]

A holder holds a substrate having a large number of patterns for forming minute objects in the plating region, and the plating region of the substrate is immersed in a plating solution stored in a plating bath. Then, a plating current is passed between the anode and the substrate. The energization on the substrate side can be performed through the connecting member because the energizing member is connected to the energizing portion provided on the peripheral edge of the substrate. When energized as described above, a current flows from the anode to the plating solution, and further the current flows from the plating solution to the openings of a large number of patterns on the substrate in the plating area. As a result, a plating film is formed on each pattern. In the above case, the packing prevents the plating liquid from permeating toward the current-carrying portion at the peripheral edge of the substrate.
Therefore, the flow of current from the plating solution to the substrate is performed only on the pattern portion. As a result, the current densities to a large number of pattern portions have predetermined values, and it is possible to obtain a plated film having a predetermined film thickness in any pattern.

[0009]

BRIEF DESCRIPTION OF THE DRAWINGS FIG. In FIG. 1, which shows a plating apparatus, A indicates a well-known plating tank. Reference numeral 11 denotes a bath main body for storing the plating solution in the plating bath A. As for the plating tank A, a rectangular one in which the planar shape of the internal space of the tank main body 11 is larger by about 1 inch per side than the size of the substrate D which is the object to be plated is used. Reference numeral 12 is an inlet for the plating solution, 13 is an overflow opening for the plating solution, 14 is an overflow receiver, and 15 is an outlet for the overflowing plating solution. Reference numeral 16 denotes a plating solution in the tank body 11, and a normal electrolytic solution is used according to the metal to be plated. Reference numeral 18 denotes a paddle for stirring the plating liquid on the lower surface of the substrate, which is reciprocated in the direction of the arrow along the lower surface of the substrate D by a driving device (not shown). Next, B is an anode, and a plate metal such as a plate material is used.
It is fixedly held in 11 as is well known. Next, C is a holder for holding the substrate D to be plated in a state of being immersed in the plating solution 16 in the plating tank A. Then E
Indicates a current-carrying means for plating, 20 is a DC power supply, and 21 and 22 are electric current wires. Next, F represents a mechanism for circulating the plating solution in the plating tank A, 23 is a reservoir tank, and 28 is a pump for circulating the plating solution.

Next, FIG. 2 showing the holder C will be described. The holder C is a main body C1 for accommodating the substrate D.
And a presser body C2 for pressing the substrate D in the main body C1.
And a pressing mechanism C3 for applying a pressing force to the pressing body C2.

First, FIG. 3 showing the main body C1 will be described.
The main body C1 includes a base frame C11 serving as a base, a cathode ring C12 for holding the substrate D and energizing the substrate D, and a fastener C13 for fastening the cathode ring C12 to the base frame C11. There is. First, the base frame C11 will be described. The base frame C11 is made of an electrically insulating material such as heat-resistant vinyl chloride.
33 is a hollow portion in the base frame C11, and has an inner diameter D1 capable of accommodating the pressing body C2. Numerals 34 and 35 are stopper pieces for the tank body 11, and receiving pieces 36 and 37 provided in the tank body 11 as shown in FIG.
It is intended to be mounted on and is fixed to the receiving pieces 36 and 37 with screws. Reference numerals 34a and 35a indicate through holes for inserting the bolts for screwing. Reference numeral 38 indicates a recess for mounting the cathode ring, and 39 indicates a through hole for inserting the electrode body.
Reference numerals 41 and 42 in FIG. 2 are members for connecting the holding mechanism C3, and exemplify bolts in which the base portions 41a and 42a are embedded and fixed in the base frame C11.

Next, FIGS. 4 to 7 showing the cathode ring C12 will be described. The cathode ring C12 is a ring body C21 shown in FIG. 4, an annular packing C22 for preventing the plating solution from seeping into the current-carrying part 5 of the substrate D during plating, and the substrate regardless of the presence of the packing C22. And a current-carrying member C23 for electrically connecting to the current-carrying portion 5 of D. The current-carrying member C23 supplies the current necessary for plating the entire pattern 7 of the plating region 3 on the substrate D,
It is provided at a plurality of locations, for example, eight locations in this example, so that the current can be made to flow in a uniform state in the entire plating area 3.

First, the ring body C21 will be described. The body C
The reference numeral 21 is formed of a material having sufficient strength for holding the substrate D, corrosion resistance against a plating solution, and conductivity for energization, such as stainless steel. Reference numeral 43 denotes an annular base portion which is sized so as to fit snugly in the recess 38 as shown in FIG. Reference numeral 44 denotes a substrate introduction portion, which is formed to have a diameter D2, for example, 150.5 mm, which is slightly larger than the diameter of the substrate, for example, 150 mm so that the substrate can be easily introduced. Reference numeral 45 denotes a positioning portion of the substrate D, which has a diameter D3 which is slightly larger than the diameter (150 mm) of the substrate D which is designed to accurately position the substrate D in the radial direction with respect to the ring body C21.
For example, it is formed to 150.3 mm. Reference numeral 46 is an annular supporting member for supporting the supporting area 4 on the substrate D.
The thickness T1 of the supporting member 46 improves the flow of the plating solution to the plating region 3 (which is the lower surface during plating) of the substrate D during plating, and the thickness T1 of the substrate on the inner peripheral side of the supporting member 46 is increased. It should be as thin as possible to prevent air bubbles from collecting on the bottom surface. For example, 0.6mm in this example
Is. The inner peripheral edge 47 of the support member 46 is inclined as shown in order to smooth the flow of the plating solution to the plating region 3 and to prevent the electric field concentration. The angle θ1 is, for example, 30
It is about ゜. 48 indicates an opening inside the support member 46,
A diameter corresponding to the diameter of the plating area 3 for exposing the plating area 3 of the substrate D to the plating solution, for example, 143.3 mm
Is formed. 49 is a fitting groove for fitting the peripheral portion of the packing C22, which is formed on the entire circumference of the base portion 43. Reference numeral 50 shown in FIG. 3 is a fitting portion for fitting the holding plate of the fastener C13, which is formed over the entire circumference of the base portion 43. Reference numeral 51 is a screw hole exemplified as a connecting portion of the electrode rod.

Next, the packing C22 will be described. The packing C22 is made of a material having high watertightness. For example, Viton is used in this example. C22a is an upper surface for adhering to the substrate D in the packing C22, C
Reference numeral 22b denotes a lower surface for closely contacting with the support member 46, and each is configured to be watertightly adhered to each member. For example, the elastic deformation of the packing is used to enable close contact with them. The lower surface C22b may be adhered to the support member 46 in a watertight manner by adhesion. The inner diameter of the packing C22 exposes the plating area 3 of the substrate D without blocking the plating solution, and the inner peripheral portion C22a 'on the upper surface of the packing C22 is covered by the mask 6 in the supporting area 4 of the substrate D. It is formed to have a size that allows it to overlap with the existing portion 4a, for example, the same size as the diameter of the opening 48. Note that the width W1 in FIG. 7 is about 4 mm, and the thickness T2 is sandwiched between the substrate D and the support member 46 so as to exhibit elasticity such that watertightness can be maintained therebetween, for example, 1.1 mm. ing. Reference numeral 52 is a fitting portion for the groove 49, and 53 is a through hole for positioning the current-carrying member C23, and the location thereof is defined at a location facing the current-carrying portion 5 on the substrate D. Through hole 53
Has a width W2 and a length L1 which are sufficiently larger than the plane dimension of the current-carrying member C23 in order to prevent interference with the current-carrying member C23. For example, the width W2 is 2 mm and the length L1 is about 7.5 mm. .
The gap G1 shown in FIG. 6 with the current-carrying member C23 is, for example, 0.
It is about 5 mm. The packing C22 may be fixed to the ring body C21 by fitting the fitting portion 52 into the groove 49. However, the lower surface of the packing C22 is adhered to the upper surface of the support member 46 with an adhesive to form the support member 46. At the same time that the packing C22 is fixed to the above, watertightness may be maintained between both surfaces.

Next, the energizing member C23 will be described. The current-carrying member C23 is preferably made of a material having good conductivity and spring properties. Inconel is used in this example. Reference numeral 56 is a fixing portion for the supporting member 46, which is mechanically sufficiently strong and electrically fixed so that a good conduction state can be obtained. For example, it is welded by spot welding means.
Reference numeral 57 denotes an arm portion, which is provided with a spring property enough to press the contact piece 58 against the substrate D in a state where good conduction is obtained.
The contact piece 58 is provided at a position where it overlaps with the current-carrying portion 5 of the substrate D. An example of the dimensions of the current-carrying member C23 is that the thickness is 0.1 m.
m, width W3 1mm, length L2 2mm, L3 1.5mm, L4 1m
m, the angle θ2 is 30 °. The height H1 from the upper surface of the support member 46 to the upper surface of the contact piece 58 is such that the lower surface of the substrate D is in contact with the upper surface of the packing C22, and the current-carrying portion 5 of the substrate D is 5.
In order to obtain a sufficient contact pressure of the contact piece 58 with respect to the contact piece 58, the thickness is larger than the thickness T2 of the packing C22, for example, about 1.3 mm. The planar positional relationship between the current-carrying member C23 and the packing C22 is such that the packing C22 is in close contact with the supporting area to prevent the plating solution from seeping into the current-carrying portion 5, and in that state, the current-carrying member C23 is Pack the conductive member C23 with the packing C so that the conductive member 5 is electrically connected.
It is located in the through hole 53 of 22. In this state, in the packing C22, the portion 54 on the inner peripheral side of the through hole 53 prevents the plating liquid from soaking into the conducting portion 5.

Next, C24 in FIG. 3 shows an electrode body for energizing the ring body C21. Reference numeral 61 denotes a bolt exemplified as an electrode rod, which is inserted into the through hole 39 and screwed into the screw hole 51 so as to establish electrical connection with the ring body C21. Reference numeral 62 is a connection terminal for connecting the electric wire 22, which is fixed to the bolt 61 by a pair of nuts 63.

Next, the fastener C13 will be described with reference to FIG. A pressing plate 66 presses the base portion 43 of the ring body C21 against the recess 38, and is fixed to the base frame C11 by a known structure. Reference numeral 70 denotes a ring body for preventing the plating solution from entering between the recess 38 of the base frame C11 and the base portion 43 of the ring body C21 and for insulating the base portion 43 and the holding plate 66 from each other. Is.

The assembly of the main body C1 having the above structure is as follows. First, the packing C22 and the current-carrying member C23 are fixed to the ring body C21 to assemble the cathode ring C12. Next, the base portion 43 of the cathode ring C12 is positioned in the recess 38, then the insulating ring 70 and the holding plate 66 are assembled in this order, and the holding plate 66 is attached to the base frame C.
Fix to 11. Next, the bolt 61 with the connection terminal 62 attached beforehand
Is screwed into the screw hole 51 through the through hole 39. Main body C1
Is completed.

Next, the pressing body C2 will be described with reference to FIGS. The retainer C2 is made of a resin material such as heat-resistant vinyl chloride, and the upper half 72 shown in FIG. 3 has an outer diameter D4 corresponding to the inner diameter of the base frame C11 so that it can be inserted into the base frame C11.
The lower half 73 is formed to have an outer diameter D5 corresponding to the inner diameter thereof, for example, 150.2 mm so that the lower half 73 can be inserted into the introduction portion 44 of the body C21 of the cathode ring C12. Reference numeral 74 denotes a pressing portion for pressing the substrate D, which is pressed through the cushion member 76. 75
Shows a step portion for preventing lateral displacement of the cushion member 76.
The cushion member 76 is a member for preventing the substrate D from being excessively pressed and being damaged, and is made of an elastic material such as an O-ring made of rubber. Reference numeral 79 shown in FIG. 2 is a pressing force receiving portion provided at the center position of the pressing body C2.

Next, the pressing mechanism C3 will be described with reference to FIGS. Reference numeral 82 is a holding arm, and 83 is a holding portion for holding the receiving portion 79, which is constituted by one surface of the arm 82.
Reference numerals 84 and 86 denote connecting portions with the main body C1 provided at one end and the other end of the arm 82, and through holes 84 for passing the bolts 41 and 42, respectively.
a and 86a are formed. 87,87 is a connecting part 84,86 main body
Fasteners for fastening to C1, bolts 41, 42 respectively
It is configured so that it can be screwed in and is formed in a size that is easy to grasp for manual operation.

Loading of the substrate D into the holder C having the above structure will be described. Remove the fastener 87 from the state of FIG.
82 is removed, and the presser body C2 is removed from the inside of the main body C1. In this state, the substrate D on which the pattern has been formed by the mask 6 is loaded into the main body C1 and the plate D is positioned inside the positioning section 45. In this state, the energizing portion 5 is in a state of resting on the contact piece 58 of the energizing member C23. In the case of loading the above-mentioned substrate D, holding the main body C1 upside down, loading the substrate D into the main body C1 from bottom to top, and then reversing the main body C1 makes the work easier. Good. Next, the presser body C2 to which the cushion member 76 is previously attached is loaded into the main body C1 as shown in FIG. Next, the arm 82 is mounted in the state shown in FIG. 2, the fasteners 87, 87 are screwed onto the bolts 41, 42, and the fastener 87 is tightened to fix the arm 82 to the main body C1. As a result, the holding portion 83 of the arm 82 presses the receiving portion 79. The holding force is the holding part
The board 74 is applied to the board D through the cushion member 76, and the board D is pushed down against the spring force of the arm portion 57 of the current-carrying member C23. As a result, the arm portion 57 elastically bends, and the contact piece 58 is brought into pressure contact with the current-carrying portion 5 of the substrate D to achieve a good electrical conduction state between the two. In addition, the upper surface C22a of the packing C22 is in close contact with the support area 4 from the current-carrying portion 5 to the portion 4a covered with the mask 6 inside the support area 4 to prevent the plating solution from entering the current-carrying portion 5. Become. In the case of pressing the substrate D as described above, since the receiving portion 79 is at the center of the pressing body C2, the pressing portion 74 presses the substrate D with the uniform force through the cushion member 76 over the entire peripheral portion thereof. as a result,
Adhesion between the upper surface of the packing C22 and the lower surface of the supporting region 4 on the substrate D is favorably performed over the entire circumference.

Next, the operation of plating the substrate D will be described. The holder C loaded with the substrate D is preliminarily plated with the plating solution 16
Is loaded into the prepared plating tank A. That is, the stopper pieces 34, 35
Place on the receiving pieces 36, 37 and fix with the set screw. In this state, the plating area exposed at the opening 48 is immersed in the plating solution. Next, the circulation mechanism F is operated so that the plating solution having a predetermined temperature circulates at a predetermined flow rate. Paddle again
Reciprocate 18 as specified. Next, a current for plating of a predetermined value is applied from the power source 20 between the anode B and the conductive surface of the substrate. As a result, in the plating area of the substrate D, film formation is sequentially performed on the portion 7a in which the base film 2 is exposed in the openings of the numerous fine patterns 7. When a predetermined time for forming a plating film of a predetermined thickness has passed in the above state, the energization is stopped, the holder C is pulled up from the plating tank A, the substrate D is removed from the holder C, and a predetermined post-treatment is performed. Complete the plating operation.

Next, the state of energization in the above plating will be described. The current output from the positive terminal of the power source 20 reaches the anode B through the electric wire 21. The current flows from the anode B to the plating solution 16 via the ions, and further from the plating solution 16 to the portion 7a where the underlying film 2 in the many patterns 7 in the plating region of the substrate D is exposed. Then, it flows to the base film 2 through the portion 7a and reaches the conducting portion 5. From the current-carrying part 5 through the current-carrying member C23 to the ring main body C21, and further from the ring main body C21 through the electrode rod 61 of the electrode body C24 to the connection terminal.
It flows to 62. Then, it returns to the negative terminal of the power source 20 through the electric wire 22.

In the above case, the upper surface of the support member 46 and the substrate D
A packing C is provided between the lower surface of the support area 4 and the portion 4a of the energizing portion 5 on the inner peripheral side covered with the mask 6.
The plating liquid 16 does not soak into the current-carrying portion 5 where the undercoat film 2 is exposed because 22 is closely attached. Therefore, the current does not directly flow from the plating solution 16 to the current-carrying portion 5, and the current density flowing in the portion 7a in which the underlying film 2 in the many patterns 7 is exposed becomes the current density as originally planned, The plating film is formed on the film as scheduled, and the plating film having the expected thickness can be obtained.

Next, FIGS. 8 to 10 show an example in which the positional relationship between the current-carrying member and the packing is different and where the current-carrying member electrically connects the current-carrying portion 5 of the substrate D.
In this example, the energizing member C23e is provided on the outer peripheral side of the packing C22e, and the energizing portion 5 of the substrate D is connected to the base portion 43e of the ring body C21e.
In the figure, reference numeral 94 denotes a mounting portion of the conductive member on the base portion 43e, which is provided with a screw hole 94a for mounting. The fixing portion 56e of the current-carrying member C23e is for the mounting portion 94 and has a fixing through hole. Reference numeral 95 denotes a screw as an example of a fastener for performing the above fastening. See also FIG.
Reference numeral 97 denotes a notch formed in the packing C22e to avoid the contact piece 58e of the current-carrying member C23e. With such a structure, when the substrate D is loaded,
The lower surface of the supporting region 4 of the substrate D first contacts the upper surface of the packing C22e, and the substrate D is further pushed down toward the supporting member 46e, whereby the packing C22e is compressed and the lower surface of the current-carrying portion 5 is the upper surface of the contact piece 58e. To contact. Therefore, in the loaded state, the packing C22 is provided between the lower surface of the mask 6 covering the supporting area 4 of the substrate D and the upper surface of the supporting member 46e.
The e is closely attached to prevent the plating solution from soaking into the current-carrying portion 5 of the substrate D. Also, the energizing part 5 and the contact piece 58e
By contacting with the base portion 43e of the ring body C21e, it becomes possible to energize from the conducting portion 5 through the conducting member C23e. In addition, for the parts which are functionally the same as or equivalent to those in the previous figure and are considered to be redundant, the same reference numerals as those in the previous figure are appended with the letter e, and the redundant description is omitted.

[0026]

As described above, according to the present invention, the plating is performed on the plating area 3 by using the substrate D in which the numerous patterns 7 for forming minute objects are formed in the plating area 3. As a result, a plating film is simultaneously formed on each of the large number of patterns 7 to effectively form a large number of minute objects. In addition, in that case, the current density for a large number of patterns 7 can be made as planned, so that there is an effect that it is possible to obtain a minute object having a predetermined thickness within a predetermined time without extending the plating time. Further, in the above case, the pattern 7 in the vicinity of the periphery of the substrate can be plated with the current density as planned, so that the entire plating region 3 has a predetermined uniform thickness. There is an effect that you can get things.

[Brief description of drawings]

FIG. 1 is a schematic diagram of a plating apparatus.

FIG. 2 is a partially cutaway front view showing a relationship between a plating tank, a holder and a substrate.

3A is a vertical cross-sectional view showing a relationship between a holder and a substrate in a portion where an electrode body is provided, and FIG. 3B is a vertical cross-sectional view showing a similar relationship to that of FIG.

FIG. 4 is a plan view of the cathode ring.

5 is a cross-sectional view taken along the line VV in FIG.

6 is a sectional view taken along the line VI-VI in FIG.

FIG. 7 is a partially cutaway perspective view showing the relationship between the ring body, the packing, the conducting member and the substrate.

FIG. 8 is a vertical cross-sectional view showing another embodiment of the current-carrying member.

9 is a diagram showing the relationship between the ring body and the current-carrying member as viewed from the right side of FIG.

FIG. 10 is a plan view showing the relationship between the packing and the contact piece of the current-carrying member.

11A is a perspective view (partial view) of the substrate, and FIG. 11B is an enlarged view of one pattern in FIG.

FIG. 12 is a vertical sectional view schematically showing a conventional plating apparatus.

FIG. 13 is a bottom view for explaining the penetration of the plating solution.

[Explanation of symbols]

 A plating tank C holder D substrate 3 plating area 5 energizing part 46 support member 48 opening C22 packing C23 energizing member

Claims (2)

[Claims] 1. A plating tank for storing a plating solution, a plating anode provided in the plating tank, and a holder for holding a plating substrate in the plating tank. The holder has an opening for exposing the plating area at the center of the conductive surface of the substrate to the plating solution, and the plating area exposed in the opening is stored in the plating bath. In the plating apparatus, which is soaked in the inside of the holder, the plating area is plated by passing a current for plating between the anode and the conductive surface of the substrate. The surrounding support member is water-tightly sealed between the support member and the supporting region around the conductive surface of the substrate, and the plating solution is impregnated toward the current-carrying portion at the periphery of the conductive surface. Hindrance A plating apparatus comprising an annular packing for stopping and an energizing member for electrically connecting to an energizing portion of the substrate. 2. The plating apparatus according to claim 1, wherein the current-carrying member is provided on the outer peripheral side of the packing.