JPH08139449A - Bonding agent for additive mode printed-wiring board - Google Patents
Bonding agent for additive mode printed-wiring boardInfo
- Publication number
- JPH08139449A JPH08139449A JP27651294A JP27651294A JPH08139449A JP H08139449 A JPH08139449 A JP H08139449A JP 27651294 A JP27651294 A JP 27651294A JP 27651294 A JP27651294 A JP 27651294A JP H08139449 A JPH08139449 A JP H08139449A
- Authority
- JP
- Japan
- Prior art keywords
- adhesive
- bonding agent
- butadiene rubber
- insulating substrate
- rubber particles
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
- H05K2203/0756—Uses of liquids, e.g. rinsing, coating, dissolving
- H05K2203/0773—Dissolving the filler without dissolving the matrix material; Dissolving the matrix material without dissolving the filler
Landscapes
- Adhesives Or Adhesive Processes (AREA)
- Manufacturing Of Printed Wiring (AREA)
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は、アディティブ法プリン
ト配線板用接着剤に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an adhesive for an additive method printed wiring board.
【０００２】[0002]
【従来の技術】周知のように、アディティブ法プリント
配線板は、接着剤付き絶縁基材に無電解めっきで必要な
配線パターンを形成するものである。例えば、めっき触
媒等を含有する絶縁基材上にめっき触媒を含有する接着
剤層を形成し、１４０〜１９０℃の温度で２０〜９０分
加熱して硬化させる。次いで、回路形成部以外をめっき
レジストでマスクし、無電解めっき銅との接着力を向上
するための前処理として、クロム−硫酸等の酸化性エッ
チング液で回路形成部の接着剤表面を選択的に化学粗化
する。その後、中和及び水洗工程を経て無電解めっき液
に浸漬し、回路部に銅を析出させて配線パターンを形成
する。このようなアディティブ法プリント配線板用接着
剤としては、一般にめっき銅との接着性が良いアクリロ
ニトリルブタジエンゴムを主成分とし、かつ耐熱性を確
保するためにアルキルフェノール樹脂でアクリロニトリ
ルブタジエンゴムを架橋し、また電気特性を確保するた
めにエポキシ樹脂を配合する。さらに、接着剤塗膜の補
強や化学粗化時の接着剤凹凸増加のために、無機充填剤
等を配合した接着剤が提案されてきた。このような接着
剤に関する技術を開示するものとしては、特公昭４８−
２４２５０号公報、特公昭４５−９８４３号公報、特公
昭５５−１６３９１号公報、特公平１−５３９１０号公
報等がある。2. Description of the Related Art As is well known, an additive method printed wiring board forms a necessary wiring pattern on an insulating base material with an adhesive by electroless plating. For example, an adhesive layer containing a plating catalyst is formed on an insulating base material containing a plating catalyst and the like, and heated at a temperature of 140 to 190 ° C. for 20 to 90 minutes to be cured. Next, mask the parts other than the circuit forming part with a plating resist, and as a pretreatment to improve the adhesive strength with the electroless plated copper, selectively select the adhesive surface of the circuit forming part with an oxidizing etching solution such as chromium-sulfuric acid. Chemical roughening. Then, after undergoing a neutralization and washing process, it is immersed in an electroless plating solution to deposit copper on the circuit portion to form a wiring pattern. Such an additive method printed wiring board adhesive generally contains acrylonitrile butadiene rubber as a main component, which generally has good adhesion to plated copper, and crosslinks the acrylonitrile butadiene rubber with an alkylphenol resin to ensure heat resistance, and Epoxy resin is compounded to ensure electrical characteristics. Furthermore, in order to reinforce the adhesive coating film and increase the unevenness of the adhesive during chemical roughening, an adhesive containing an inorganic filler or the like has been proposed. Japanese Patent Publication No. Sho 48-
24250, Japanese Patent Publication No. 45-9843, Japanese Patent Publication No. 55-16391, Japanese Patent Publication No. 1-53910.
【０００３】[0003]
【発明が解決しようとする課題】ところで、近年、電子
機器の小型化、多機能化に伴い、プリント配線板はより
配線密度を増す必要が生じており、配線幅の細線化が急
激に進行している。このような背景から、回路導体を支
える接着剤は、絶縁性が重要な特性となりつつある。こ
の為、一般的には、絶縁性がエポキシ樹脂等より劣るア
クリロニトリルブタジエンゴムの配合量を減らし、エポ
キシ樹脂の配合量を増すことが行われる。しかしなが
ら、この場合、粗化液溶解性がアクリロニトリルブタジ
エンゴムより著しく低いエポキシ樹脂を増加するため
に、粗化凹凸が小さくなり、この為、めっき銅との接着
力は実用上使用できないレベルまで低下してしまう。ま
た、細線化になるほどめっき銅との接着力が高いことが
有利になることは言うまでもない。By the way, in recent years, with the miniaturization and multi-functionalization of electronic devices, it has become necessary to increase the wiring density of printed wiring boards, and the wiring width has rapidly become thinner. ing. From such a background, the adhesive property for supporting the circuit conductor is becoming an important property of the insulating property. Therefore, generally, the compounding amount of the acrylonitrile-butadiene rubber, which is inferior to the epoxy resin in insulating property, is reduced and the compounding amount of the epoxy resin is increased. However, in this case, since the roughening solution solubility is significantly lower than that of the acrylonitrile-butadiene rubber, the roughening unevenness becomes small, and therefore the adhesive force with the plated copper is reduced to a level that cannot be practically used. Will end up. Needless to say, the thinner the wire, the higher the adhesive strength with the plated copper.
【０００４】本発明は、絶縁性を損なうことなく、めっ
き銅との接着力に優れたアディティブ法配線板用接着剤
の組成物を提供することを目的とする。An object of the present invention is to provide a composition of an adhesive for an additive-type wiring board, which has an excellent adhesive force to plated copper without impairing the insulating property.
【０００５】[0005]
【課題を解決するための手段】本発明のアディティブ法
配線板用接着剤は、絶縁基板表面に塗布する接着剤であ
って、その組成が架橋したアクリロニトリルブタジエン
ゴム粒子を含有したことを特徴とする。The adhesive for an additive method wiring board of the present invention is an adhesive to be applied to the surface of an insulating substrate and is characterized in that it contains acrylonitrile butadiene rubber particles whose composition is crosslinked. .
【０００６】本発明に用いる架橋したアクリロニトリル
ブタジエンゴム粒子は、乳化重合後のエマルジョン状態
でアクリロニトリルブタジエンゴムを架橋した一次平均
粒子径約５００〜１０００ の微小高分子粒子架橋ゴム
粒子であり、カルボキシル基変成または未変成のアクリ
ロニトリルブタジエンゴム何れも使用できる。その配合
量は、接着剤組成中に２〜４０重量％含有することが好
ましい。その理由は、２重量％以下では、めっき銅との
接着力向上に効果がなく、４０重量％以上では、接着剤
表面の粘着性が増し、後工程でのごみの付着等の問題が
生じてくるためである。この架橋ＮＢＲを含有する基本
となる樹脂組成は、特に限定するものではなく、アディ
ティブ法配線板に用いられる一般的な樹脂組成が適用で
き、好ましくは、耐めっき液性、塗膜形成性、粗化性等
を考慮して、エポキシ樹脂、アクリロニトリルブタジエ
ンゴム、レゾール型フェノール樹脂、無機充填剤等の混
合物が良い。The cross-linked acrylonitrile-butadiene rubber particles used in the present invention are fine polymer cross-linked rubber particles having a primary average particle diameter of about 500 to 1000 obtained by cross-linking acrylonitrile-butadiene rubber in an emulsion state after emulsion polymerization. Alternatively, any unmodified acrylonitrile butadiene rubber can be used. The compounding amount is preferably 2 to 40% by weight in the adhesive composition. The reason is that if it is 2% by weight or less, there is no effect in improving the adhesive strength with the plated copper, and if it is 40% by weight or more, the adhesiveness of the adhesive surface increases and problems such as adhesion of dust in the subsequent process occur. This is because of The basic resin composition containing the crosslinked NBR is not particularly limited, and a general resin composition used for an additive method wiring board can be applied, and preferably the plating solution resistance, the coating film forming property, and the roughening property. A mixture of epoxy resin, acrylonitrile butadiene rubber, resol-type phenol resin, inorganic filler, etc. is preferable in consideration of the chemical conversion property.
【０００７】本発明において、接着剤中に無電解めっき
の析出核となるめっき触媒を含有することができる。め
っき触媒としては、元素周期率表の８、１Ｂ及び２Ｂ属
の金属の塩あるいは酸化物が使用できる。例えば、白
金、バラジウム、錫等の化合物が用いられ、固体粒子あ
るいは有機溶剤に溶解又は他の樹脂とともに溶解分散さ
せた溶液状態として接着剤中に混合することができる。
めっき触媒の接着剤中の配合量は、２〜１５重量％の範
囲であれば無電解めっきによって銅が析出する。上記接
着剤の各成分は、有機溶媒中で混練り混合された溶液状
混合物に調整されるが、用いる有機溶媒としては、トル
エン、メチルエチルケトン、アセトン、メチルイソブチ
ルケトン、キシレン、ジエチレングリコールモノメチル
エーテル、ジエチレングリコールモノメチルエーテルア
セテート、エチルエトキシプロピオレート、プロピレン
グリコールモノメチルエーテル等の単独又は混合系を用
いることができる。In the present invention, the adhesive may contain a plating catalyst which becomes a precipitation nucleus of electroless plating. As the plating catalyst, salts or oxides of metals belonging to Group 8B, 1B and 2B of the Periodic Table of Elements can be used. For example, a compound such as platinum, palladium, tin or the like is used and can be mixed in the adhesive in the form of a solution in which it is dissolved in solid particles or an organic solvent or is dissolved and dispersed together with another resin.
If the content of the plating catalyst in the adhesive is in the range of 2 to 15% by weight, copper will be deposited by electroless plating. Each component of the adhesive is adjusted to a solution mixture that is kneaded and mixed in an organic solvent, and as the organic solvent to be used, toluene, methyl ethyl ketone, acetone, methyl isobutyl ketone, xylene, diethylene glycol monomethyl ether, diethylene glycol monomethyl is used. A single or mixed system of ether acetate, ethyl ethoxy propiolate, propylene glycol monomethyl ether and the like can be used.
【０００８】本発明に係る接着剤を使用する絶縁基板と
しては、フェノール樹脂系又はエポキシ樹脂系あるいは
無機系又は有機複合物からなる基材等を用いることがで
きる。前記接着剤は、絶縁基板に１０μｍ〜５０μｍ塗
布され、１４０〜１９０℃の温度で３０〜９０分加熱硬
化が行われる。無電解めっきを析出させるに際しては、
接着剤表面を化学的に粗化して接着に適した形状にす
る。化学的粗化に用いる粗化液は、クロム−硫酸系、ク
ロム−硫酸−フッ化ナトリウム系、アルカリ−過マンガ
ン酸系、ホウフッ化水素酸−重クロム酸系等が使用でき
る。また、パターン形成は、めっきレジストをスクリー
ン印刷、あるいはフォトマスクを紫外線硬化し現像して
形成する。これらのめっきレジストは、化学的粗化処理
工程の前あるいは処理した後で行われる。As the insulating substrate using the adhesive according to the present invention, a base material or the like made of a phenol resin type, an epoxy resin type, an inorganic type or an organic compound can be used. The adhesive is applied to the insulating substrate in an amount of 10 μm to 50 μm, and is heat-cured at a temperature of 140 to 190 ° C. for 30 to 90 minutes. When depositing electroless plating,
The surface of the adhesive is chemically roughened into a shape suitable for bonding. As the roughening liquid used for the chemical roughening, chromium-sulfuric acid system, chromium-sulfuric acid-sodium fluoride system, alkali-permanganate system, borofluoric acid-dichromic acid system and the like can be used. The pattern is formed by screen-printing a plating resist, or curing a photomask with ultraviolet rays and developing it. These plating resists are applied before or after the chemical roughening treatment step.
【０００９】[0009]
【作用】本発明の架橋ＮＢＲは、微小な粒子状であり、
この架橋ＮＢＲが粗化液に溶解することで接着剤表面に
接着に適した微小凹凸形状を形成することができる。ま
た、架橋したＮＢＲであるため、配合量に比例した絶縁
性の低下が全くない。The crosslinked NBR of the present invention is in the form of fine particles,
By dissolving this cross-linked NBR in the roughening liquid, it is possible to form fine irregularities suitable for adhesion on the surface of the adhesive. Further, since it is a cross-linked NBR, there is no reduction in the insulating property in proportion to the blended amount.
【００１０】[0010]
実施例１ 以下に示す接着剤成分を、ガラス布エポキシ積層板であ
るＬＥ−１６８（日立化成工業株式会社製、商品名）に
ディプコート法で塗布し、膜厚２５μｍの接着剤層を両
面に形成した。 （接着剤組成） ・架橋ＮＢＲ、 ＸＥＲ−９１（日本合成ゴム株式会社製、商品名）・・・・・２０重量部 ・ビスフェノールＡ型エポキシ樹脂、 エピコート１００１（油化シェル株式会社製、商品名）・・・２０重量部 ・アクリロニトリルブタジエンゴム、 ニポール１０３１（日本ゼオン株式会社製、商品名）・・・・５０重量部 ・アルキルフェノール樹脂、 ヒタノール２４００（日立化成工業株式会社製、商品名）・・・５重量部 ・熱硬化剤、 ２Ｅ４ＭＺ（四国化成株式会社製、商品名）・・・・・・・０．１重量部 ・充填剤（ケイ酸ジルコニウム） ミクロパックス（白水化学株式会社製、商品名）・・・・・・１０重量部 ・無電解めっき用触媒（塩化パラジウムの樹脂混合物） ＰＥＣ−８（日立化成工業株式会社製、商品名）・・・・・・・４重量部 次に、接着剤付き絶縁基板を、１７０℃−６０分間加熱
して硬化させる。さらに、めっき用レジストであるＳＲ
−３０００（日立化成工業株式会社製、商品名）をラミ
ネートして、回路形成用フォトマスクを介して紫外線露
光し、現像した。次に、クロム−硫酸−フッ化ナトリウ
ム（クロム酸４０ｇ／ｌ、濃硫酸３００ｍｌ／ｌ、フッ
化ナトリウム１０ｇ／ｌ）の粗化液に４０℃−５分間浸
漬して、接着剤露出部のみ選択的に化学粗化し、その後
中和、水洗した。さらに、無電解銅めっき浴であるＣＣ
−４１液（日立化成工業株式会社製、商品名）に投入し
て、３５μｍのめっき銅を析出させた後、１６０℃−６
０分間アニーリングして、アディティブ法プリント配線
板を作製した。Example 1 The following adhesive components were applied to a glass cloth epoxy laminate, LE-168 (trade name, manufactured by Hitachi Chemical Co., Ltd.) by the dip coating method to form an adhesive layer having a thickness of 25 μm on both sides. did. (Adhesive composition) Cross-linked NBR, XER-91 (manufactured by Japan Synthetic Rubber Co., Ltd., trade name) 20 parts by weight Bisphenol A type epoxy resin, Epicoat 1001 (manufactured by Yuka Shell Co., Ltd., trade name) ) 20 parts by weight Acrylonitrile butadiene rubber, Nipol 1031 (manufactured by Nippon Zeon Co., Ltd.) 50 parts by weight Alkylphenol resin, Hitanol 2400 (manufactured by Hitachi Chemical Co., Ltd.)・ 5 parts by weight ・ Thermal curing agent, 2E4MZ (manufactured by Shikoku Kasei Co., Ltd.) ・ ・ 0.1 parts by weight ・ Filler (zirconium silicate) Micropax (manufactured by Shiramizu Chemical Co., Ltd., product) Name) ... 10 parts by weight-Catalyst for electroless plating (palladium chloride resin mixture) PEC-8 (Hitachi Chemical Co., Ltd., trade name)- ..... 4 parts by weight Subsequently, an adhesive with an insulating substrate, is cured by heating 170 ° C. -60 min. Furthermore, SR which is a resist for plating
-3000 (manufactured by Hitachi Chemical Co., Ltd., trade name) was laminated, exposed to ultraviolet light through a photomask for forming a circuit, and developed. Next, immerse in a roughening solution of chromium-sulfuric acid-sodium fluoride (chromic acid 40 g / l, concentrated sulfuric acid 300 ml / l, sodium fluoride 10 g / l) at 40 ° C for 5 minutes to select only the exposed portion of the adhesive. Chemically roughened, then neutralized and washed with water. Furthermore, CC which is an electroless copper plating bath
-41 liquid (manufactured by Hitachi Chemical Co., Ltd., trade name) to deposit 35 μm of plated copper, and then 160 ° C.-6
Annealing was performed for 0 minutes to prepare an additive method printed wiring board.
【００１１】実施例２ 接着剤組成として、実施例１と比較して絶縁性を向上し
た組成、すなわちエポキシ樹脂を増量した配合系として
以下の成分とした。その他は、実施例１と同ようにし
た。 （接着剤組成） ・架橋ＮＢＲ、 ＸＥＲ−９１（日本合成ゴム株式会社製、商品名）・・・・・２０重量部 ・ビスフェノールＡ型エポキシ樹脂、 エピコート１００１（油化シェル株式会社製、商品名）・・・５０重量部 ・アクリロニトリルブタジエンゴム、 ニポール１０３１（日本ゼオン株式会社製、商品名）・・・・２０重量部 ・アルキルフェノール樹脂、 ヒタノール２４００（日立化成工業株式会社製、商品名）・・・５重量部 ・熱硬化剤、 ２Ｅ４ＭＺ（四国化成株式会社製、商品名）・・・・・・・０．１重量部 ・充填剤（ケイ酸ジルコニウム） ミクロパックス（白水化学株式会社製、商品名）・・・・・・１０重量部 ・無電解めっき用触媒（塩化パラジウムの樹脂混合物） ＰＥＣ−８（日立化成工業株式会社製、商品名）・・・・・・・４重量部Example 2 As an adhesive composition, the following components were used as a composition having improved insulation properties as compared with Example 1, that is, a compounding system containing an increased amount of epoxy resin. Others were the same as in Example 1. (Adhesive composition) Cross-linked NBR, XER-91 (manufactured by Japan Synthetic Rubber Co., Ltd., trade name) 20 parts by weight Bisphenol A type epoxy resin, Epicoat 1001 (manufactured by Yuka Shell Co., Ltd., trade name) ) 50 parts by weight Acrylonitrile butadiene rubber, Nipol 1031 (manufactured by Nippon Zeon Co., Ltd.) 20 parts by weight Alkylphenol resin, Hitanol 2400 (manufactured by Hitachi Chemical Co., Ltd.)・ 5 parts by weight ・ Thermal curing agent, 2E4MZ (manufactured by Shikoku Kasei Co., Ltd.) ・ ・ 0.1 parts by weight ・ Filler (zirconium silicate) Micropax (manufactured by Shiramizu Chemical Co., Ltd., product) Name) ... 10 parts by weight-Catalyst for electroless plating (palladium chloride resin mixture) PEC-8 (Hitachi Chemical Co., Ltd., trade name)- ..... 4 parts by weight
【００１２】実施例３ 実施例２の接着剤組成において、架橋ＮＢＲの配合量を
増加した。その他は、実施例２と同ようにした。 （接着剤組成） ・架橋ＮＢＲ、 ＸＥＲ−９１（日本合成ゴム株式会社製、商品名）・・・・・３５重量部 ・ビスフェノールＡ型エポキシ樹脂、 エピコート１００１（油化シェル株式会社製、商品名）・・・５０重量部 ・アクリロニトリルブタジエンゴム、 ニポール１０３１（日本ゼオン株式会社製、商品名）・・・・１５重量部 ・アルキルフェノール樹脂、 ヒタノール２４００（日立化成工業株式会社製、商品名）・・・５重量部 ・熱硬化剤、 ２Ｅ４ＭＺ（四国化成株式会社製、商品名）・・・・・・・０．１重量部 ・充填剤（ケイ酸ジルコニウム） ミクロパックス（白水化学株式会社製、商品名）・・・・・・１０重量部Example 3 In the adhesive composition of Example 2, the content of crosslinked NBR was increased. Others were the same as in Example 2. (Adhesive composition) -Crosslinked NBR, XER-91 (manufactured by Japan Synthetic Rubber Co., Ltd., trade name) 35 parts by weight-Bisphenol A type epoxy resin, Epicoat 1001 (manufactured by Yuka Shell Co., Ltd., trade name) ): 50 parts by weight-Acrylonitrile butadiene rubber, Nipol 1031 (manufactured by Nippon Zeon Co., Ltd.) ... 15 parts by weight-Alkylphenol resin, Hitanol 2400 (manufactured by Hitachi Chemical Co., Ltd.) ...・ 5 parts by weight ・ Thermal curing agent, 2E4MZ (manufactured by Shikoku Kasei Co., Ltd.) ・ ・ 0.1 parts by weight ・ Filler (zirconium silicate) Micropax (manufactured by Shiramizu Chemical Co., Ltd., product) Name) ... 10 parts by weight
【００１３】比較例１〜２ 実施例１と実施例２において、接着剤中の架橋ＮＢＲを
用いない組成とした。その他は、各実施例と同ようにし
た。以上のようにして作製したアディティブ法プリント
配線板の特性結果を表１に示した。Comparative Examples 1 and 2 In Examples 1 and 2, the composition was such that the crosslinked NBR in the adhesive was not used. Others were the same as those in each example. Table 1 shows the characteristic results of the additive method printed wiring board manufactured as described above.
【００１４】[0014]
【表１】 [Table 1]
【００１５】[0015]
【発明の効果】以上に説明したように、接着剤組成中に
架橋したアクリロニトリルブタジエンゴム粒子を用いる
ことで、絶縁性、耐熱性を損なうことなくめっき銅との
接着力を向上できるアディティブ法プリント配線板用接
着剤を提供することができる。As described above, by using the crosslinked acrylonitrile butadiene rubber particles in the adhesive composition, it is possible to improve the adhesive strength with plated copper without impairing the insulating property and heat resistance. An adhesive for boards can be provided.
Claims (2)
化学的に粗化し、必要な箇所のみ無電解めっきによって
回路形成するアディティブ法プリント配線板において、
接着剤が、架橋したアクリロニトリルブタジエンゴム粒
子を含有することを特徴とするアディティブ法プリント
配線板用接着剤。1. An additive-type printed wiring board in which an adhesive is applied to an insulating substrate, the surface of the adhesive is chemically roughened, and circuits are formed only by electroless plating at required portions,
An adhesive for an additive-type printed wiring board, wherein the adhesive contains crosslinked acrylonitrile-butadiene rubber particles.
粒子が、接着剤組成中に２〜４０重量％含有することを
特徴とする請求項１に記載のアディティブ法プリント配
線板用接着剤。2. The adhesive for additive-type printed wiring boards according to claim 1, wherein the adhesive composition contains 2 to 40% by weight of crosslinked acrylonitrile-butadiene rubber particles.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP27651294A JP3517996B2 (en) | 1994-11-10 | 1994-11-10 | Additive adhesive for printed circuit boards |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP27651294A JP3517996B2 (en) | 1994-11-10 | 1994-11-10 | Additive adhesive for printed circuit boards |
Related Child Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2003291586A Division JP2004091781A (en) | 2003-08-11 | 2003-08-11 | Adhesive coating film |
| JP2003291585A Division JP3975984B2 (en) | 2003-08-11 | 2003-08-11 | Insulating substrate in adhesive state with copper |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH08139449A true JPH08139449A (en) | 1996-05-31 |
| JP3517996B2 JP3517996B2 (en) | 2004-04-12 |
Family
ID=17570509
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP27651294A Expired - Fee Related JP3517996B2 (en) | 1994-11-10 | 1994-11-10 | Additive adhesive for printed circuit boards |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3517996B2 (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1999065991A1 (en) * | 1998-06-17 | 1999-12-23 | Bayer Corporation | Thermoplastic molding compositions having improved plateability |
| EP0909119A3 (en) * | 1997-10-06 | 2000-08-23 | Ford Motor Company | Method for adhering a metallization to a substrate |
-
1994
- 1994-11-10 JP JP27651294A patent/JP3517996B2/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0909119A3 (en) * | 1997-10-06 | 2000-08-23 | Ford Motor Company | Method for adhering a metallization to a substrate |
| WO1999065991A1 (en) * | 1998-06-17 | 1999-12-23 | Bayer Corporation | Thermoplastic molding compositions having improved plateability |
Also Published As
| Publication number | Publication date |
|---|---|
| JP3517996B2 (en) | 2004-04-12 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US5053280A (en) | Adhesive composition for printed wiring boards with acrylonitrile-butadiene rubber having carboxyl groups and 20 ppm or less metal ionic impurities; an alkyl phenol resin; an epoxy resin; palladium catalyst, and coupling agent | |
| JPS6259681A (en) | Adhesive for additive printed circuit board | |
| JP4556260B2 (en) | Additive insulation film for printed wiring boards | |
| JP3517996B2 (en) | Additive adhesive for printed circuit boards | |
| JP3975984B2 (en) | Insulating substrate in adhesive state with copper | |
| JP4556261B2 (en) | Additive adhesive for printed wiring boards | |
| JPH0818239A (en) | Method for manufacturing multi-layer printing wiring board | |
| JPH05198909A (en) | High density printed board and manufacture thereof | |
| JP3637613B2 (en) | Manufacturing method of multilayer wiring board | |
| JPH04314391A (en) | Adhesive for fabricating printed circuit board by additive process | |
| JP3697726B2 (en) | Manufacturing method of multilayer wiring board | |
| JPH03255185A (en) | Adhesive for printed wiring board made by the additive process | |
| JP3775824B2 (en) | Additive adhesive for printed wiring board, adhesive sheet and multilayer printed wiring board | |
| JP2004091781A (en) | Adhesive coating film | |
| JP4189699B2 (en) | Additive adhesive for printed wiring board and printed wiring board using the same | |
| JPH0521932A (en) | Manufacture of printed-wiring board | |
| JP2621504B2 (en) | Adhesive composition for printed wiring boards | |
| JP2605423B2 (en) | Adhesive for printed wiring boards | |
| JPH09121086A (en) | Manufacturing method for flexible printed wiring board | |
| JP4759883B2 (en) | Insulating resin composition and method for producing multilayer wiring board using the same | |
| JPH0826290B2 (en) | Adhesives for additive printed wiring boards | |
| JPS6386494A (en) | Manufacture of printed wiring board | |
| JP2004137478A (en) | Adhesive | |
| JP2006165094A (en) | Insulating adhesive sheet for printed wiring board and method of manufacturing printed wiring board | |
| JP2002134655A (en) | Board for semiconductor package, its manufacturing method, the semiconductor package and its manufacturing method |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A01 | Written decision to grant a patent or to grant a registration (utility model) |
Effective date: 20040106 Free format text: JAPANESE INTERMEDIATE CODE: A01 |
|
| A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20040119 |
|
| FPAY | Renewal fee payment (prs date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20080206 Year of fee payment: 4 |
|
| FPAY | Renewal fee payment (prs date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20090206 Year of fee payment: 5 |
|
| FPAY | Renewal fee payment (prs date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20100206 Year of fee payment: 6 |
|
| FPAY | Renewal fee payment (prs date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20100206 Year of fee payment: 6 |
|
| FPAY | Renewal fee payment (prs date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20110206 Year of fee payment: 7 |
|
| FPAY | Renewal fee payment (prs date is renewal date of database) |
Year of fee payment: 8 Free format text: PAYMENT UNTIL: 20120206 |
|
| FPAY | Renewal fee payment (prs date is renewal date of database) |
Year of fee payment: 8 Free format text: PAYMENT UNTIL: 20120206 |
|
| FPAY | Renewal fee payment (prs date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20130206 Year of fee payment: 9 |
|
| LAPS | Cancellation because of no payment of annual fees |