JPH08138553A - Pipe connecting method and manufacture of image display device using it - Google Patents

Abstract

PURPOSE: To provide connectability for pipes where alignment is easy and no risk of dislocation exists resulting from vibration, etc., in the baking process by providing a columnar insert bar penetrating a pipe to reach a through hole in a vacuum vessel, aligning the pipe with the through hole using the insert bar when the pipe is to be fixed to the vacuum vessel, and thereupon securing the pipe. CONSTITUTION: A mixture of frit glass and vehicle (binder and solvent) is provisionally baked and preformed in the form of a ring so that five bits of frit glass 5 are provided, which are laid around a through hole 109 in a back base board 101. An insert bar 107 is inserted into a pipe 4, and the tip is inserted into the through hole 109. The diameter of the bar 107 is a little smaller than that of the through hole 109, and the end on the side opposite the through hole is shaped in an overhung from the outside diameter of the pipe. In this condition, the whole construction is heated to the frit baking temp., and the insert bar 107 is removed in the condition that the pipe 4 is attached to the back board 101, and thus the pipe fixing process is completed. At this time, a frame to which the back board 101 and a front base board 102 as structural members is also attached sealedly with frit glass 108, and an image display device in the form of a vacuum vessel is achieved.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for connecting a pipe mainly used for exhausting a gas or exchanging a gas, and further to a method for manufacturing an image display device using the method for connecting a pipe. is there.

[0002]

2. Description of the Related Art Conventionally, the inside of a vacuum container mainly made of a glass member is connected to a vacuum exhaust line, and a glass tube is fixedly attached by a glass frit to exhaust the inside. A typical example of an image display device using this tube is a fluorescent display tube. FIG. 15 shows a conventional example in which a tube is fixed to a fluorescent display tube, 1 is a substrate, 2 is a cover glass, 3 is a frit glass, 4 is a tube, and 5 is a frit glass. The connection method of this pipe is Japanese Patent Publication No. 63-61741.
Is disclosed in.

FIG. 16 shows this method. 1 is a substrate, 2 is a cover glass, 3 is a frit glass, 4 is a tube,
6 is a clip jig, 7 is a holding jig, and 8 is a tablet glass for fixing the tube. The tube is fixed by holding the part near the end on the opposite side to the fixed part of the tube with a holding jig 7 and heating the whole to melt the tablet glass 8 set in the fixed part in advance, It is manufactured by fixing the tube.

[0004] In various image display devices and plasma image display devices using other electron-emitting devices and the like, exhaust pipes and pipes for introducing gas are generally fixed and fixed by frit glass. ing.

Conventionally, two types of electron emitters, a thermoelectron source and a cold cathode electron source, are known. The cold cathode electron source includes a field emission type (hereinafter abbreviated as FE type), a metal / insulating layer / metal type (hereinafter abbreviated as MIM type), a surface conduction type electron emitting device, and the like. As an example of the FE type, W. P. Dyke & W.D.
W. Dolan, "Field mission",
Advance in Electron Physi
cs, 8 89 (1956) or C.I. A. Spin
dt, "Physical Properties o
f thin-film field emissio
n cathodes with mollybdeni
um ", J. Appl. Phys., 47 5248.
(1976) and the like are known.

An example of the MIM type is C.I. A. Mea
d, "The tunnel-emission am
plier, J. et al. Appl. Phys. , 32 6
46 (1961) and the like are known.

As an example of the surface conduction electron-emitting device type,
M. I. Elinson, Radio Eng. Ele
ctron Phys. 10 (1965) and so on.
The surface conduction electron-emitting device utilizes a phenomenon in which electron emission occurs when a current is applied to a thin film having a small area formed on a substrate in parallel with the film surface. As the surface conduction electron-emitting device, SnO by Elinson et al.
₂ using a thin film, using an Au thin film [G. Dit
tmer: "Thin Solid Films", 9
317 (1972)], by In ₂ O ₃ / SnO ₂ thin film [M. Hartwell and C.I. G. F
onstad: "IEEE Trans.ED Con
f. , 519 (1975)], by a carbon thin film [Hiraki Araki et al .: Vacuum, Vol. 26, No. 1, page 22 (19).
83)] etc. have been reported. As a typical device configuration of these surface conduction electron-emitting devices, the above-mentioned M. A conventional Hartwell device structure is shown in FIG. 40 in the figure
1 is a substrate. Reference numeral 404 is a conductive thin film, which is made of a metal oxide thin film or the like formed by sputtering on an H-shaped pattern, and the electron emission portion 405 is formed by an energization process called energization forming described later. The element electrode interval L in the figure is set to 0.5 to 1 mm, and W'is set to 0.1 mm. The position and shape of the electron emitting portion 55 are not clear, and are therefore shown as a schematic diagram.

Conventionally, in these surface conduction electron-emitting devices, it has been general that the electron-emitting portion 405 is formed in advance on the conductive thin film 404 by an energization process called energization forming before electron emission. That is, the energization forming is performed by applying a direct current voltage or a very slow rising voltage, for example, about 1 V / min to both ends of the conductive thin film 404 to locally energize the conductive thin film, electrically or electrically deform it. That is, the electron emitting portion 405 having a high resistance is formed. The electron emission unit 405
A crack is generated in a part of the conductive thin film 404, and electrons are emitted from the vicinity of the crack. The surface conduction electron-emitting device that has been subjected to the energization forming process has the above-mentioned conductive thin film 404.
Electrons are emitted from the electron emission portion 405 by applying a voltage to the element and passing a current through the element.

Since the surface conduction electron-emitting device described above has a simple structure and is easy to manufacture, it has an advantage that a large number of devices can be arrayed over a large area. Therefore, various applications that can make full use of this feature are being researched. For example, a charged beam source, a display device such as an image display device may be used.

[0010]

However, in the above-mentioned conventional example in which the tube is fixed by using the holding jig, (1) the tube is communicated with the through hole of the substrate in advance when arranging the tube. Must be aligned as shown. (2) Since the holding jig holds the vicinity of the end portion on the opposite side to the fixed portion of the pipe, the pipe faces the fixed portion with the portion of the holding jig holding the pipe as the center. Since it wobbles, there is a possibility that it may be displaced with respect to the communicating portion of the substrate. (3) Since the load cannot be applied to the pipe,
There is a possibility that the substrate is displaced with respect to the communicating portion due to vibration or the like during firing. (4) For convenience of manufacturing, when the substrate must be stood upright to fix the pipe, or when the pipe must be fixed from below, the pipe slips or falls due to its own weight. Can not be fixed.

There are drawbacks such as the above.

That is, the object of the present invention is to
It is an object of the present invention to provide a tube connecting method capable of solving the above-mentioned problems, and to provide an image display device manufacturing method using such a tube connecting method.

[0013]

The feature of the present invention resides in that at least a back plate on which an electron-emitting device is mounted, and a phosphor as an image forming portion are provided on a facing surface arranged so as to face the back plate. A component member of the image display device including a front plate having the same, a frame surrounding the outer periphery between the back plate and the front plate, and an image display device that hermetically seals the component member with a sealing material such as frit glass. In order to evacuate the inside of the image display device to a vacuum, to introduce gas from the outside, to introduce gas by exhausting, or to use exhaust and gas introduction depending on necessity when manufacturing the display device. Alternatively, a single tube may be connected to any one of the back plate, the frame, the front plate, or some of the members by a sealing material when connecting the tube to the image display device. Modulo, columnar rod inside the tube, i.e. to insert the inner 挿棒, by projecting the communicating hole provided with internal 挿棒 the component from the fixed end face side of the tube,
This is a connection method in which the pipe and the through-hole are not displaced and the constituent members are fired together with the frit glass arranged in the fixing portion of the pipe to fix the pipe.

The frit glass arranged at this time is prepared by firing the tablet glass preformed in a ring shape in advance to a fixing temperature, or by coating the frit glass in a paste form with a solvent and a binder. There are cases in which calcination and calcination are performed, or calcination is performed up to the fixing temperature without calcination.

As for the size of the insertion rod, in the portion installed in the through hole of the insertion rod, the size of the through hole of the constituent member is made to be approximately the same, and the portion inserted in the pipe portion is used. In, it is desirable that the size is approximately equal to the inner diameter of the tube. Therefore, when the inner diameter of the pipe is larger than that of the through hole, it is possible to use the interpolating rod whose size is changed stepwise as a means for improving the fixing accuracy of the pipe.

Further, it is also possible to use a structure in which the end portion on the opposite side to the fixing portion side of the insertion rod has a structure projecting outside the pipe. For the overhang, use one that has been machined at least larger than the inner diameter of the pipe, and insert this insertion rod into the pipe that is arranged perpendicular to the component members so that the pipe and the through hole do not shift. In addition, while holding the end opposite to the fixed part of the pipe by the protruding part of the insertion rod, along with the frit glass arranged in the fixed part of the pipe,
The components are fired to secure the tube. In this connection method for fixing the pipe, if the pipe is above the constituent members, the pipe can be held down by the weight of the insertion rod, and the weight of the insertion rod can be adjusted to keep the pipe under a constant load. It is a manufacturing method that can be fixed while pressing.

In addition, when the pipe is thin and long, it is possible to use a jig for assisting the fall of the protruding portion of the insertion rod or the outer peripheral portion of the pipe for the purpose of improving the verticality after fixing. Further, when it is desired to apply a load more than the self-weight of the insertion rod, an additional weight may be placed on the protruding portion of the insertion rod to obtain a stronger adhesive surface. It is a method included in the range of the connection method.

Further, when the pipe must be fixed to the constituent member in a state where the pipe is on the side or below the constituent member, a spring or the like is interposed between one of the ends of the insertion rod and the constituent member. Then, while the spring part and the insertion rod are fixed with screws or the like, together with the frit glass placed in the fixing part of the tube, the constituent members are baked to fix the tube, while pressing the tube with a constant force. Also included in the invention is a method of connecting the tubes using an intercalating rod so that they can be secured.

This method of assembling a tube with an inserting rod can be used as a tube of a flat image display device.

A flat panel image display device to which the tube connection method using the insertion rod can be applied has a structure in which electrons are accelerated to cause the phosphor to emit light, that is, at least the electron-emitting device and the phosphor are images. It can be used in an image display device that is arranged in a display device and requires a vacuum to emit electrons into a space.

As an example of the electron-emitting device, the electron-emitting device can be used in an image display device using a surface conduction type, FE-type cold electrode electron-emitting device, a wire-shaped thermoelectron source, or the like.

Needless to say, the present invention can be applied to other types of image display devices and the like having a tube.

Further, the cold cathode electron source used in the present invention is preferably a surface conduction electron-emitting device which has a simple structure and is easy to manufacture.

There are basically two types of surface conduction electron-emitting devices that can be used in the present invention: a planar surface conduction electron-emitting device and a vertical surface conduction electron-emitting device.

FIG. 5 is a schematic plan view and a sectional view showing the structure of a basic surface conduction electron-emitting device.

In FIG. 5, reference numeral 501 is a substrate, and 502 and 50.
Reference numeral 3 is a device electrode, 504 is a conductive thin film, and 505 is an electron emitting portion.

As the substrate 501, quartz glass, glass containing a small amount of impurities such as Na, soda lime glass, SiO ₂
A glass substrate and a ceramics substrate made of alumina or the like, on the surface of which are used.

A general conductor is used as a material for the device electrodes 502 and 503. For example, Ni, Cr, Au and M are used.
a printed conductor composed of a metal or alloy such as o, W, Pt, Ti, Al, Cu, Pd and a metal or metal oxide such as Pd, Ag, Au, RuO ₂ , Pd-Ag, and glass;
It is appropriately selected from a transparent conductor such as In ₂ O ₃ —SnO ₂ and a semiconductor material such as polysilicon.

The device electrode spacing L is preferably several hundreds of angstroms to several hundreds of micrometers.

Further, it is desirable that the voltage applied between the device electrodes is low, and since it is required to produce it with good reproducibility, the preferred device electrode interval is several micrometers to several tens of micrometers.

The device electrode length W is preferably several micrometers to several hundreds of micrometers in view of the resistance value of the electrodes and electron emission characteristics, and the film thickness of the device electrodes 502 and 503 is preferably several micrometers to several micrometers.

In addition to the structure shown in FIG. 5, it is appropriately set depending on the conductive thin film 504 on the substrate 1 and the resistance value between the device electrodes 502 and 503, and the energization forming conditions described later, but preferably several angstroms. More than 500 Angstroms. The sheet resistance value is 10 3 to 10 7 ohm / □.

The material forming the conductive thin film 504 is
Pd, Pt, Ru, Ag, Au, Ti, In, Cr, F
e, Zn, Sn, Ta, W, Pd and other metals, PdO, S
oxides such as nO2, In203, PbO, Sb203,
HfB2, ZrB2, LaB6, CeB6, YB4, G
Compounds such as dB4, TiC, ZrC, HfC, SiC,
Carbides such as WC, nitrides such as TiN, ZrN, HfN,
Examples include semiconductors such as Si and Ge, carbon, and the like.

The fine particle film described here is a film in which a plurality of fine particles are aggregated, and its fine structure is not only in a state where the fine particles are dispersed and arranged but also in a state where the fine particles are adjacent to each other or overlap each other (island). The particle size of the fine particles is several angstroms to several thousand angstroms, preferably 10 angstroms to 200 angstroms.

The electron emitting portion 505 is a high resistance crack formed in a part of the conductive thin film 504, and is formed by energization forming or the like. In some cases, conductive particles having a particle diameter of several angstroms to several hundred angstroms may be contained in the cracks. The conductive fine particles are conductive thin films 504.
It contains at least a part of the elements constituting the.
In addition, the electron emitting portion 505 and the conductive thin film 504 in the vicinity thereof
May have carbon or carbon compounds.

FIG. 6 is a schematic view showing the structure of a basic vertical surface conduction electron-emitting device.

In FIG. 6, the same members as those in FIG. 5 are designated by the same reference numerals. 621 is a step forming portion.

The substrate 501, the device electrodes 502 and 503, the conductive thin film 504, and the electron-emitting portion 505 can be made of the same material as that of the above-mentioned planar surface conduction electron-emitting device, and the step forming portion 621 has an insulating property. The film thickness of the step forming portion 621 made of a material corresponds to the device electrode distance L of the flat surface conduction electron-emitting device described above. The spacing is tens of micrometers rather than hundreds of angstroms. The distance can be controlled by the manufacturing method of the step forming portion and the voltage applied between the device electrodes, but it is preferably several hundred angstroms to several micrometers.

The conductive thin film 504 is the device electrodes 502, 50.
3 and the step forming portion 621 are formed, so that they are laminated on the device electrodes 502 and 503. In FIG. 6, the electron emitting portion 505 is shown to be linearly formed in the step forming portion 621, but the shape and position are not limited to this, depending on the preparation conditions, energization forming conditions, and the like. Absent.

Hereinafter, a method of manufacturing the electron source substrate will be described with reference to FIGS. The same members as those in FIG. 5 are designated by the same reference numerals.

1) After thoroughly washing the substrate with a detergent, pure water and an organic solvent, a device electrode material is deposited by a vacuum deposition method, a sputtering method or the like. After that, the device electrodes 502 and 503 are formed on the substrate by the photolithography technique (FIG. 7A).

2) An organic metal solution is applied to the substrate 501 on which the device electrodes 502 and 503 are provided and left to stand to form an organic metal thin film. The organometallic solution referred to here is a solution of an organometallic compound containing a metal forming the conductive thin film 504 as a main element. After that, the organometallic thin film is heated and baked, and is patterned by lift-off, etching or the like to form a conductive thin film 504 (FIG. 7).
(B)). Although the description has been given here by using the coating method of the organic metal solution, the present invention is not limited to this, and the vacuum deposition method, the sputtering method, the chemical vapor deposition method, the dispersion coating method, the dipping method,
It may be formed by a spinner method or the like.

3) Subsequently, an energization process called energization forming is performed. Energization forming is performed by device electrodes 502, 5
Power is supplied from a power source (not shown) between
4 is locally destroyed, deformed or altered to form a site having a changed structure. This locally changed structure is called an electron emission portion 505 (FIG. 7).
(C)). FIG. 8 shows an example of the voltage waveform of energization forming. A pulse waveform is particularly preferable as the voltage waveform, and when a voltage pulse having a constant pulse peak value is continuously applied (see FIG. 8).
a) and the case of applying a voltage pulse while increasing the pulse crest value (FIG. 8b). First, the case where the pulse peak value is a constant voltage (FIG. 8A) will be described.

In FIG. 8a, T1 and T2 are the pulse width and pulse interval of the voltage waveform, and T1 is 1 microsecond to 1
0 milliseconds, T2 is 10 microseconds to 100 milliseconds,
The peak value of the triangular wave (peak voltage at the time of energization forming) is appropriately selected according to the form of the surface conduction electron-emitting device, and for several seconds in an appropriate vacuum degree, for example, in a vacuum atmosphere of about 10 −5 torr. Apply several tens of minutes. The waveform applied between the electrodes of the element is not limited to the triangular wave, and a desired waveform such as a rectangular wave may be used.

T1 and T2 in FIG. 8b are the same as those in FIG. 8a, and the crest value of the triangular wave (peak voltage during energization forming) is increased by, for example, about 0.1 V step and applied in an appropriate vacuum atmosphere.

In the energization forming process in this case, the conductive thin film 504 is locally destroyed during the pulse interval T2.
With a voltage that does not deform, for example, a voltage of about 0.1 V,
The device current is measured and the resistance value is obtained. For example, the energization forming is completed when the resistance is 1 M ohm or more.

4) Next, it is desirable to perform a process called an activation process on the element which has completed the energization forming. The activation step is, for example, 10 −4 to 10 −5 tor.
Similar to energization forming, this is a process of repeatedly applying a voltage pulse with a constant pulse peak value at a vacuum degree of about r. Carbon and carbon compounds derived from organic substances existing in vacuum are deposited on a conductive thin film. This is a process of remarkably changing the device current If and the emission current Ie. The activation process is completed, for example, when the emission current Ie is saturated while measuring the device current If and the emission current Ie. Further, it is preferable that the applied voltage pulse is an operation drive voltage.

Here, carbon and carbon compound are graphite (single and polycrystalline) and amorphous carbon (mixture of amorphous carbon and polycrystalline graphite), and their film thicknesses are It is preferably 500 angstroms or less, more preferably 300 angstroms or less.

5) It is preferable that the electron-emitting device thus prepared is placed in an atmosphere having a vacuum degree higher than the vacuum degree in the forming step and the activation step and driven. In addition, it is desirable to operate after heating at 80 ° C. to 150 ° C. in an atmosphere of a higher degree of vacuum.

The degree of vacuum higher than the degree of vacuum after the forming step and activation is, for example, a degree of vacuum of about −10 −6 or higher, more preferably an ultra-high vacuum system, and newly added carbon and carbon. The degree of vacuum is such that the compound is hardly deposited on the conductive thin film. By doing so, the device current If,
It becomes possible to stabilize the emission current Ie.

Various methods are conceivable as a method for manufacturing the above-mentioned surface conduction electron-emitting device, one example of which is shown in FIG.

Next, the image forming apparatus of the present invention will be described.

The electron source substrate used in the image forming apparatus is formed by arranging a plurality of surface conduction electron-emitting devices on the substrate.

In the arrangement method of the surface conduction electron-emitting devices, the surface conduction electron-emitting devices are arranged in parallel, and both ends of each device are connected by a ladder arrangement (hereinafter referred to as a ladder arrangement electron source substrate). ) Or a simple matrix arrangement (hereinafter referred to as a matrix-type arrangement electron source substrate) in which a pair of element electrodes of the surface conduction electron-emitting device are respectively connected with X-direction wiring and Y-direction wiring. An image forming apparatus having a ladder type electron source substrate requires a control electrode (grid electrode) which is an electrode for controlling the flight of electrons from the electron-emitting device.

The configuration of the electron source constructed based on this principle will be described below with reference to FIG. 871 is an electron source substrate, 872 is an X direction wiring, 873 is a Y direction wiring, 874
Is a surface conduction electron-emitting device, and 875 is a connection. still,
The surface conduction electron-emitting device 874 may be either the flat type or the vertical type described above.

In the figure, the substrate used for the electron source substrate 871 is the above-mentioned glass substrate or the like, and its shape is appropriately set according to the application.

The m X-direction wirings 872 are DX1 and DX.
2, ... DXm, and the Y-direction wiring 873 is DY
1, DY2, ..., DYn, and n wirings.

Further, the material, the film thickness, and the wiring width are appropriately set so that a substantially uniform voltage is supplied to a large number of surface conduction type elements. The m number of X-direction wirings 872 and the n number of Y-direction wirings 873 are electrically separated by an interlayer insulating layer (not shown) to form a matrix wiring. (M and n are both positive integers).

An interlayer insulating layer (not shown) is formed in a desired region on the entire surface or a part of the substrate 871 on which the X-direction wiring 872 is formed. The X-direction wiring 872 and the Y-direction wiring 873 are drawn out as external terminals.

Further, the device electrodes (not shown) of the surface conduction electron-emitting device 874 are electrically connected to the m X-direction wirings 872 and the n Y-direction wirings 873 by the connection wires 875.

The surface conduction electron-emitting device may be formed either on the substrate or on an interlayer insulating layer (not shown).

The X-direction wiring 8 will be described later in detail.
72 is electrically connected to a scanning signal generating means (not shown) for applying a scanning signal for scanning a row of surface conduction electron-emitting devices 874 arranged in the X direction according to an input signal.

On the other hand, a modulation signal (not shown) for applying a modulation signal for modulating each row of the surface conduction electron-emitting devices 874 arranged in the Y direction according to the input signal to the Y-direction wiring 873. It is electrically connected to the generating means.

Further, the drive voltage applied to each element of the surface conduction electron-emitting device is supplied as a difference voltage between the scanning signal and the modulation signal applied to the element.

In the above structure, individual elements can be selected and driven independently by using only simple matrix wiring.

Next, an image forming apparatus using the electron source of the simple matrix arrangement created as described above will be described with reference to FIGS. 10, 11 and 12. 12 is a basic configuration diagram of the image forming apparatus, FIG. 11 is a fluorescent film, and FIG.
Reference numeral 2 denotes a block diagram of a drive circuit for displaying in accordance with an NTSC television signal, and represents an image forming apparatus including the drive circuit.

In FIG. 10, 71 is an electron source substrate on which an electron-emitting device is formed, 81 is a rear plate on which the electron source substrate 71 is fixed, and 86 is the fluorescent film 8 on the inner surface of the glass 83.
4 is a face plate on which the metal back 85 and the like are formed, 82 is a support frame, 81 is a rear plate, and these members constitute an envelope 88.

In FIG. 10, 74 corresponds to the electron emitting portion in FIG. Reference numerals 72 and 73 denote an X-direction wiring and a Y-direction wiring connected to a pair of device electrodes of the surface conduction electron-emitting device.

The envelope 88 comprises the face plate 86, the support frame 82 and the rear plate 81 as described above, but the rear plate 81 is mainly for the purpose of reinforcing the strength of the electron source substrate 71. Since it is provided, the electron source substrate 71
Separate rear plate 81 if it has sufficient strength
Is unnecessary, the support frame 82 is directly provided on the electron source substrate 71, and the face plate 86, the support frame 82, and the electron source substrate 7 are provided.
The envelope 88 may be configured by 1.

Reference numeral 1092 in FIG. 11 is a phosphor. In the case of monochrome, the phosphor 1092 is composed of only the phosphor, but in the case of a color phosphor film, it is composed of a black conductive material 1091 called a black stripe or a black matrix depending on the arrangement of the phosphor and a phosphor 1092. In the case of color display, the purpose of providing the black stripes and the black matrix is to make brown or the like inconspicuous by blackening the separately applied portions between the phosphors 1092 of the three primary color phosphors and to prevent external light in the phosphor film 84. This is to suppress a decrease in contrast due to reflection. The material of the black stripe is not limited to the commonly used material containing graphite as a main component, but is not limited to this as long as it is a material having conductivity and little light transmission and reflection. As a method of applying the phosphor to the glass substrate 93, a precipitation method or a printing method is used regardless of monochrome or color.

A metal back 85 (FIG. 10) is usually provided on the inner surface side of the fluorescent film 84 (FIG. 10). The purpose of the metal back is to improve the brightness by specularly reflecting the light toward the inner surface side of the light emission of the phosphor to the face plate 86 side, to act as an electrode for applying an electron beam acceleration voltage, This is to protect the phosphor from the damage caused by the collision of negative ions generated inside the container. The metal back can be produced by performing a smoothing process (usually called filming) on the inner surface of the fluorescent film after producing the fluorescent film, and then depositing Al by vacuum evaporation or the like.

On the face plate 86, the fluorescent film 8 is further provided.
A transparent electrode (not shown) may be provided on the outer surface side of the fluorescent film 84 in order to enhance the conductivity of No. 4.

The envelope 88 is 10 ⁻⁷ torr through 4 tubes.
The degree of vacuum is set to about r and sealing is performed. Further, a getter process may be performed to maintain the degree of vacuum after the envelope 88 is sealed. This is performed by heating the getter placed at a predetermined position (not shown) in the envelope 88 by a heating method such as resistance heating or high frequency heating immediately before or after the envelope 88 is sealed and vapor deposition. This is a process for forming a film. The getter usually has Ba as a main component, and due to the adsorption action of the deposited film, for example, 1 × 10 ⁻⁵ torr or 1 ×.
The degree of vacuum is maintained at 10 ⁻⁷ torr. The steps after forming the surface conduction electron-emitting device are appropriately set.

Next, FIG. 12 is a block diagram showing a schematic configuration of a drive circuit for performing television display on an image forming apparatus constructed by using an electron source having a simple matrix arrangement type substrate based on a television signal of the NTSC system. Will be explained. 1101 is the display panel, 1102 is a scanning circuit, 1103 is a control circuit, 1104 is a shift register, 1105 is a line memory, 1106 is a sync signal separation circuit, 1107 is a modulation signal generator, and Vx and Va are DC voltage sources. Is.

The functions of the respective parts will be described below. First, the display panel 1101 is connected to an external electric circuit via the terminals Dox1 to Doxm, the terminals Doy1 to Doyn and the high voltage terminal Hv. Among them, the terminals Dox1 to Doxm sequentially drive electron sources provided in the display panel, that is, surface conduction electron-emitting device groups arranged in a matrix of M rows and N columns matrix by row (N elements). A scanning signal for application is applied.

On the other hand, a modulation signal for controlling the output electron beam of each element of the surface conduction electron-emitting devices of one row selected by the scanning signal is applied to the terminals Dy1 to Dyn. Further, from the DC voltage source Va to the high voltage terminal Hv,
For example, a DC voltage of 10 K [V] is supplied, which is an accelerating voltage for giving enough energy to excite the phosphor to the electron beam output from the surface conduction electron-emitting device.

Next, the scanning circuit 1102 will be described.
The circuit is provided with M switching elements therein (schematically shown by S1 to Sm in the figure), and each switching element is an output voltage of the DC voltage source Vx or 0.
One of [V] (ground level) is selected and electrically connected to the terminals Dx1 to Dxm of the display panel 1101. Each of the switching elements S1 to Sm has a control signal Tscan output from the control circuit 1103.
However, in practice, it can be constructed by combining switching elements such as FETs.

The DC voltage source Vx is such that the driving voltage applied to an unscanned element is equal to or lower than the electron emission threshold voltage based on the characteristics (electron emission threshold voltage) of the surface conduction electron-emitting element. It is set to output a constant voltage such that

The control circuit 1103 also has a function of matching the operation of each part so that an appropriate display is performed based on an image signal input from the outside. The synchronization signal Ts sent from the synchronization signal separation circuit 1106 described below
The control signals of Tscan, Tsft, and Tmry are generated for each unit based on the sync.

The sync signal separation circuit 1106 is a circuit for separating the sync signal component and the luminance signal component from the NTSC system television signal input from the outside, and can be constructed by using a frequency separation (filter) circuit. The sync signal separated by the sync signal separation circuit 1106 is composed of a vertical sync signal and a horizontal sync signal, as is well known, but it is shown here as a Tsync signal for convenience of description. On the other hand, the luminance signal component of the image separated from the television signal is referred to as a DATA signal for convenience, but the signal is input to the shift register 1104.

The shift register 1104 is for serially / parallel-converting the DATA signal serially input in time series for each line of the image, and operates based on the control signal Tsft sent from the control circuit 1103. . (That is, the control signal Tsft may be rephrased as a shift clock of the shift register 1104.) Data of one line of the serial / parallel converted image (corresponding to drive data for N electron-emitting devices) is Id1. To Idn are output from the shift register 1104 as N parallel signals.

The line memory 1105 is a storage device for storing data for one line of the image for a required time, and stores the contents of Id1 to Idn as appropriate in accordance with the control signal Tmry sent from the control circuit 1103.
The stored contents are output as Id1 to Idn and input to the modulation signal generator 1107.

The modulation signal generator 1107 is a signal source for appropriately driving and modulating each of the surface conduction electron-emitting devices according to each of the image data Id1 to Idn, and its output signal is displayed through the terminals Doy1 to Doyn. It is applied to the surface conduction electron-emitting device of the panel 1101.

As described above, the electron-emitting device according to the present invention has the following basic characteristics with respect to the emission current Ie. That is, as described above, electron emission has a clear threshold voltage Vth, and electron emission occurs only when a voltage equal to or higher than Vth is applied.

For a voltage above the electron emission threshold value, the emission current also changes according to the change in the voltage applied to the device. The value of the electron emission threshold voltage Vth and the degree of change of the emission current with respect to the applied voltage may be changed by changing the material, configuration, and manufacturing method of the electron emitting element. I can say things.

That is, when a pulsed voltage is applied to this element, for example, electron emission does not occur even if a voltage below the electron emission threshold is applied, but when a voltage above the electron emission threshold is applied, the electron beam is emitted. Is output. At that time, first, it is possible to control the intensity of the output electron beam by changing the peak value Vm of the pulse. Second, it is possible to control the total amount of charges of the electron beam output by changing the pulse width Pw.

Therefore, as a method of modulating the electron-emitting device according to the input signal, there are a voltage modulation method, a pulse width modulation method and the like. To implement the voltage modulation method, the modulation signal generator 1107 is fixed. A circuit of a voltage modulation system is used that generates a voltage pulse of a length but appropriately modulates the peak value of the pulse according to the input data.

In order to implement the pulse width modulation method, the modulation signal generator 1107 generates a voltage pulse having a constant peak value, but a pulse for appropriately modulating the width of the voltage pulse according to the input data. A width modulation type circuit is used.

Through the series of operations described above, the image display device of the present invention can display a television using the display panel 1101. Although not particularly described in the above description, the shift register 1104 and the line memory 1105 may be digital signal type or analog signal type, and the point is that serial / parallel conversion and storage of image signals are performed at a predetermined speed. It should be done.

When the digital signal type is used, it is necessary to convert the output signal DATA of the sync signal separation circuit 1106 into a digital signal, which is possible if the output section of 1106 is equipped with an A / D converter. Further, in connection with this, the circuit used for the modulation signal generator 1107 is slightly different depending on whether the output signal of the line memory 1105 is a digital signal or an analog signal.

First, the case of digital signals will be described.
In the voltage modulation method, the modulation signal generator 1107 has
For example, a well-known D / A conversion circuit may be used, and an amplification circuit or the like may be added if necessary.

In the case of the pulse width modulation method, the modulation signal generator 1107 compares the output value of the counter with the counter (counter) for counting the number of waves output from the high speed oscillator and the oscillator and the output value of the memory. It can be configured by using a circuit in which comparators (comparators) are combined. If necessary, an amplifier for voltage-amplifying the pulse-width-modulated modulation signal output from the comparator up to the drive voltage of the surface conduction electron-emitting device may be added.

Next, the case of an analog signal will be described.
In the voltage modulation method, the modulation signal generator 1107 has
For example, a well-known amplifier circuit using an operational amplifier may be used, and a level shift circuit or the like may be added if necessary. In the case of the pulse width modulation method, for example, a well-known voltage controlled oscillation circuit (VCO) may be used, and an amplifier for amplifying the voltage to the drive voltage of the surface conduction electron-emitting device may be added if necessary. May be.

In the image display device completed as described above, electrons are emitted to the electron-emitting device by applying voltage through the terminals outside the container Dox1 to Doxm, Doy1 to Doyn, and the metal is supplied through the high voltage terminal Hv. An image can be displayed by applying a high voltage to the back 85 or a transparent electrode (not shown), accelerating the electron beam, causing the electron beam to collide with the fluorescent film 84, and exciting and emitting light.

The structure described above is a schematic structure necessary for producing a suitable image forming apparatus used for display and the like, and the detailed parts such as the material of each member are not limited to the above contents. , Is appropriately selected to suit the application of the image forming apparatus. Further, although the NTSC system is given as an example of the input signal, the input signal is not limited to this, and PAL, SECA
Various methods such as the M method may be used, or a TV signal (for example, a high-definition TV such as the MUSE method) including a number of scanning lines may be used.

Next, the ladder type electron source substrate and the image display device using the same will be described with reference to FIGS. 13 and 14.

In FIG. 13, 1210 is an electron source substrate,
Reference numeral 1211 denotes an electron-emitting device, and 1212 Dx1 to Dx10.
Is a common wire connected to the electron-emitting device. A plurality of electron-emitting devices 1211 are arranged on the substrate 1210 in parallel in the X direction. (This is called an element row). A plurality of this element row is arranged on the substrate to form a ladder type electron source substrate. By appropriately applying a drive voltage between the common wirings of each element row, each element row can be independently driven. That is, a voltage equal to or higher than the electron emission threshold value may be applied to the element row that emits the electron beam, and a voltage equal to or lower than the electron emission threshold value may be applied to the element row that does not emit the electron beam. In addition, the common wirings Dx2 to Dx9 between the respective element rows are, for example, D
It is also possible to use the same wiring for x2 and Dx3.

FIG. 14 is a diagram showing the structure of an image forming apparatus provided with a ladder-type electron source. 1320 is a grid electrode, 1321 is a hole through which electrons pass, 1
322 is an outer terminal of the container made of Dox1, Dox2 ... Doxm, 1323 is an outer terminal of the container made of G1, G2, ... Gn connected to the grid electrode 1320, 132
Reference numeral 4 is an electron source substrate in which the common wiring between each element row is the same wiring as described above. The difference from the image forming apparatus having the simple matrix arrangement (FIG. 10) described above is that a grid electrode 1320 is provided between the electron source substrate 1210 and the face plate 86.

A grid electrode 1320 is provided between the substrate 1210 and the face plate 86. The grid electrode 1320 is capable of modulating the electron beam emitted from the surface conduction electron-emitting device, and passes the electron beam through a striped electrode provided orthogonally to the ladder-shaped element rows. A circular opening 1321 is provided for each element. The shape and installation position of the grid are not necessarily as shown in FIG. 14, and a large number of passage openings may be provided in the form of a mesh as openings. For example, they may be provided around or near the surface conduction electron-emitting device. .

The external terminal 1322 and the grid external terminal 1323 are electrically connected to a control circuit (not shown).

In this image forming apparatus, the modulation signals for one image line are simultaneously applied to the grid electrode columns in synchronization with the sequential driving (scanning) of the element rows one column at a time.
The irradiation of each electron beam to the phosphor can be controlled to display an image line by line.

Further, according to the present invention, it is possible to provide an image forming apparatus suitable for not only a display device for television broadcasting but also a display device such as a video conference system and a computer. Further, it can be used as an image forming apparatus as an optical printer including a photosensitive drum or the like.
Further, not only the surface conduction electron-emitting devices but also cold cathode electron sources such as MIM-type electron-emitting devices and field emission-type electron-emitting devices can be applied as the electron-emitting devices. Further, it can be applied to an image display device using an electron source.

[0103]

That is, according to the connection method of fixing the pipe by using the insertion rod of the present invention, the alignment between the pipe and the through hole is made possible by the insertion rod inserted in the pipe. further,
By using an insertion rod having a structure in which one end of the insertion rod projects, a load can be applied when the pipe is fixed.

[0104]

The present invention will be described below in detail with reference to examples. <Embodiment 1> FIG. 1 is a diagram showing a method of connecting pipes according to the present invention. 102 is a front plate on which a phosphor (not shown) is arranged,
105 and 5 are frit glass, 103 is a frame, 101
Is a back plate having the surface conduction electron-emitting devices (not shown) described in the embodiment arranged in a plane, 4 is a tube, 107 is an insertion rod, 200 is a protruding portion of the insertion rod, and 109 is a through hole. Is.

In the figure, the rear plate is placed on the frit glass 108 that has been calcined on the sealing surface between the frame that has been previously fixed to the front plate with frit glass and the rear plate of the frame. Each constituent member of the image display device of No. 1 was prepared.

The front plate, the rear plate, the frame, the tube, and the like are made of soda-lime glass.
The low-melting point sealing glass whose frit glass had a coefficient of expansion close to that of the constituent member and whose working temperature was around 410 ° C. (hereinafter referred to as firing temperature) was used.

Next, as a method for connecting the tubes of the present invention, five frits obtained by pre-baking a mixture of frit glass and vehicle (binder + solvent) (hereinafter referred to as “frit paste”) into a ring shape are prepared. Glass was placed around the through hole (109) on the back substrate. Then, the insertion rod (107) is inserted into the pipe (4) to insert the through hole (10
The tip was inserted in 9). The diameter of the insertion rod was slightly smaller than the diameter of the penetrating portion, and the end opposite to the penetrating hole had a shape (protruding portion 200) protruding from the outer diameter of the tube and was inserted in advance. In this state, after the whole was baked to the frit baking temperature, the temperature was lowered and the tube was fixed to the back plate, and the insertion rod was removed to complete the tube fixing process. At this time, the frame to which the rear substrate and the front substrate, which are structural members, are fixed is also sealed by the frit glass 108, and the image display device, which is a vacuum container, is completed.

In the unlikely event that the frit may stick out from the fixed portion of the pipe and come into contact with the insertion rod, the material of the insertion rod is aluminum which is difficult to weld to the frit glass. It was possible to fix the tube without welding. Further, since the aluminum of the insertion rod used in this example has a coefficient of thermal expansion more than twice that of glass, even if the tip diameter of the insertion rod reaches the firing temperature, it is smaller than the glass diameter of the penetrating portion. It was produced in consideration of the above.

By manufacturing using the insertion rod in this way, the pipe could be fixed to the through hole without displacement. In addition, since the weight of the insertion rod can be used to hold down the tube by providing the overhanging part, it is possible to hold down the preformed glass that has been previously placed at the tip of the tube and push out the bubbles in the frit glass. The tube was completely fixed. <Embodiment 2> FIG. 2 relates to a tube connecting method of the present invention, in which 101 is a back plate having the surface conduction electron-emitting devices (not shown) described in the embodiment arranged in a plane. Tube, 107 is an insertion rod, 200 is a protruding portion of the insertion rod, 1
Reference numeral 09 is a through hole, and 5 is a preformed frit glass.

An image of a state in which the rear plate is placed on a frame which has been previously fixed to the front plate with frit glass and the sealing surface between the rear plate of the frame and frit paste which has been calcined. Each component of the display device was prepared (not shown because it is similar to FIG. 1).

In this embodiment, since the pipe used was larger than the diameter of the through hole, the insertion rod used had a diameter changed at the tip and in the center according to the inner diameter of the pipe.

The subsequent tube connection method was the same as in Example 1.

By manufacturing using the insertion rod as described above, the pipe could be fixed to the through hole without displacement. In addition, since the weight of the insertion rod can be used to hold down the tube by providing the overhanging part, it is possible to hold down the preformed glass that has been previously placed at the tip of the tube and push out the bubbles in the frit glass. The tube was completely fixed.

Furthermore, by adjusting the inner rod to the inner diameter of the pipe, it is possible to further suppress the eccentricity of the pipe with respect to the through-hole and to improve the positional accuracy of the pipe when it is subjected to vibration during manufacturing. . <Embodiment 3> FIG. 3 relates to a tube connecting method of the present invention, in which 101 is a back plate having the surface conduction electron-emitting devices (not shown) described in the embodiment arranged in a plane. Tube, 107 is an insertion rod, 200 is a protruding portion of the insertion rod, 1
Reference numeral 09 is a through hole, 5 is a preformed frit glass, 110 is an upright assistant jig, and 111 is an auxiliary weight.

An image of a state in which the rear plate is placed on a frame which is previously fixed to the front plate with frit glass and the sealing surface between the rear plate of the frame and frit paste applied and pre-baked. Each component of the display device was prepared (not shown because it is similar to FIG. 1).

At this time, the tube has an outer diameter of 8 mm and a length of 200 mm.
A long tube having a length of mm was used, and an upright auxiliary jig was placed after placing an insertion rod. Furthermore, an auxiliary weight was placed on the protruding portion of the insertion rod.

The subsequent tube connection method was the same as in Example 1.

As described above, by using the insertion rod and the upright assisting jig, it is possible to fix the pipe with respect to the through hole without displacement even when manufacturing a relatively thin and long pipe. Was able to maintain the uprightness. Also, by placing an auxiliary weight on the overhanging part, it could be used as a means to adjust the self-weight of the insertion rod, so that it is possible to sufficiently hold the preformed glass pre-arranged at the tip of the pipe. , The bubbles in the frit glass were pushed out, and the tube was completely fixed. <Embodiment 4> FIG. 4 relates to a method for manufacturing a pipe according to the present invention, in which 4 is a pipe, 107 is an insertion rod, 200 is a protruding portion of the insertion rod, 109 is a through hole, and 5 is a preform. Frit glass, 112 is an integrated jig, 113 is a spring, 1
14 is a connecting screw.

Next, as a method of manufacturing the pipe of the present invention, FIG.
This will be described below.

In this embodiment, the pipe is connected to the frame as shown in FIG. 10. First, the insertion rod 107 is inserted into the pipe 4,
Five frit glasses, which were pre-fired from the frit paste and preformed into a ring shape, were placed on the tips of the insertion rods so as to come between the tube and the frame, and the tips were inserted into the through holes 109 on the side surfaces of the frame. The diameter of the insertion rod was a little smaller than the diameter of the through hole, and the end opposite to the through hole had a shape protruding from the outer diameter of the tube and was inserted in advance. After that, the integrated jig 112 with the spring 113 was connected to the insertion rod from the opposite side of the tube with a connecting screw 114.

Further, the front plate under the frame is provided with the frit glass 108 in which the frit paste is preliminarily fired, and after the whole is fired up to the frit firing temperature, the temperature is lowered and the tube is moved to the back. With the surface plate fixed, the insertion rod was removed to complete the tube fixing process. At this time, the frame and the front plate were also fixed by the frit glass of 108, and the tube, the frame and the front plate were integrated.

After that, the back plate is placed on the frame of the front plate integrated in advance and sealed with frit glass.
Was completed as an image display device.

By manufacturing using the insertion rod and the integrated jig with spring in this manner, the pipe can be fixed to the through hole without being displaced even when the pipe is arranged sideways or downward. . Further, the tube was sufficiently pressed by the overhanging portion and the spring, the bubbles in the frit glass were pushed out, and the tube was completely fixed.

[0124]

As described above, the following effects are obtained by this pipe connecting method.

1) It is no longer necessary to use a jig in advance to position the tubes.

2) The tube can be fixed to the through hole without being displaced.

3) Since the weight or load can be applied to the tube, the positional deviation of the tube with respect to the through hole was reduced even if vibration or the like occurred during firing.

4) Since the pipe can be fixed to the fixing portion from the side surface or the lower surface, the degree of freedom of the manufacturing method is increased and the optimum manufacturing process can be selected.

Therefore, the pipe connecting method of the present invention is particularly suitable as a pipe connecting method for an image display device.

[Brief description of drawings]

FIG. 1 is a sectional view of a first embodiment showing a pipe connecting method of the present invention.

FIG. 2 is a sectional view showing a pipe connecting method according to a second embodiment of the present invention.

FIG. 3 is a sectional view showing a method of connecting pipes according to a third embodiment of the present invention.

4 (a) and 4 (b) are a top view and a side view showing a method of connecting pipes according to a fourth embodiment of the present invention.

5 (a) and 5 (b) are a schematic plan view and a sectional view showing the structure of a basic surface conduction electron-emitting device of the present invention.

FIG. 6 is a schematic diagram showing the configuration of a basic vertical surface conduction electron-emitting device of the present invention.

7 (a), (b), and (c) are process drawings showing an example of a method of manufacturing a surface conduction electron-emitting device of the present invention.

8A and 8B are diagrams showing an example of voltage waveforms in energization forming.

FIG. 9 is a diagram showing an electron source having a simple matrix arrangement.

FIG. 10 is a perspective view showing a schematic configuration of an image forming apparatus.

11 (a) and 11 (b) are a side view and a plan view of a fluorescent film.

FIG. 12 is a block diagram of a drive circuit for performing display according to an NTSC television signal.

FIG. 13 is a diagram showing an electron source arranged in a ladder.

FIG. 14 is a schematic configuration diagram of an image forming apparatus.

FIG. 15 is a view showing a conventional example in which a tube is fixed to a fluorescent display plate.

FIG. 16 is a view showing a method of fixing a tube to a conventional fluorescent display plate.

FIG. 17 is a plan view of a conventional surface conduction electron-emitting device.

[Explanation of symbols]

1 substrate 2 cover glass 3, 5, 105, 108 frit glass 4 tube 6 clip jig for sealing 7 exhaust pipe holding jig 8 tablet glass 101 back plate 102 front plate 103 frame 107 insertion rod 109 through hole 110 upright assistant Jig 111 Auxiliary weight 112 Integrated jig 113 Spring 114 Screw 200 Overhanging part 401, 501 Substrate 402, 503 Element electrode 404, 504 Conductive thin film 405, 505 Electron emitting part 621 Step difference forming part 71 Electron source substrate 72 X direction wiring 73 Y direction wiring 74 Surface conduction electron-emitting device 75,875 Connection 81 Rear plate 82 Support frame 83 Glass substrate 84,984 Fluorescent film 85 Metal back 86,986 Face plate 87,987 High voltage terminal 88 Envelope 871 Electron source substrate 872 X-direction wiring 873 Y Directional wiring 874 Surface conduction electron-emitting device 1101 Display panel 1102 Scanning circuit 1103 Control circuit 1104 Shift register 1105 Line memory 1106 Synchronous signal separation circuit 1107 Modulation signal generator 1211 Electron-emitting device 1212 Common wiring 1320 Grid electrode 1321 Void 1322 Dox1, Dox2. ． ． ． Outer container terminal 1323 G1, G2. ． ． ． Outer terminal made of Gn

Claims (4)

[Claims] 1. A through hole is provided in a vacuum container, and a pipe connecting the inside and outside of the vacuum container is communicated with the through hole,
In a method for manufacturing a vacuum container in which the tube is fixed by a glass frit, when the tube is fixed, a tube is inserted using a columnar insertion rod that penetrates the inside of the tube and reaches at least a part of a through hole of the vacuum container. A method of connecting pipes, wherein the pipe is fixed to the through hole, and the pipe is fixed. 2. The method of connecting pipes according to claim 1, wherein at least one end of the insertion rod projects outward from the pipe, and the pipe is fixed while applying a load to the pipe. 3. An image display device comprising a back plate provided with at least planar electron-emitting devices and a front plate having a fluorescent portion that emits light when irradiated with an electron beam emitted from the electron-emitting devices. An image display characterized by having a connecting method for fixing a tube so as to communicate with a through hole provided in at least one of the image display devices by using the interpolating rod according to claim 1 or 2. Device manufacturing method. 4. The method for manufacturing an image display device according to claim 3, wherein a surface conduction electron-emitting device is used as the electron-emitting device.