JPH08131971A - Apparatus for washing end edge of substrate - Google Patents

Abstract

PURPOSE: To effectively eliminate the swelling caused by the infiltration of a solvent. CONSTITUTION: A nozzle 11a for emitting a solvent is moved to the position near to the center above the end edge part 10a of a substrate 10 and the membrane 3 in the vicinity of the position near to the center of the end edge part 10a is gradually dissolved by the solvent to form a washing boundary line 20 (b). Next, the nozzle 11a for emitting the solvent is moved to the position above the vicinity of the central part of the end edge part 10a and the membrane 3 of the end edge part 10a is gradually dissolved by the solvent to expose the surface of the substrate 10 in the vicinity of the central part of the end edge part 10a (d). Finally, the nozzle 11a emitting the solvent is moved to the position near to the outside above the end edge part 10a of the substrate 10 and the membrane 3 of the end edge part 10a is gradually dissolved and the surface of the substrate 10 in the vicinity of the position near to the outside of the end edge part 10a is exposed to perfectly remove the unnecessary membrane.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a glass substrate for a liquid crystal display device or a glass substrate for a photomask, on the surface of which a thin film such as a photoresist coating solution, a photosensitive polyimide resin or a dyeing agent for a color filter is formed. The present invention relates to a substrate edge cleaning device that removes an unnecessary thin film on a substrate edge by discharging a solvent to an edge of the substrate after a thin film is formed on a semiconductor wafer for semiconductor manufacturing or a substrate such as a ceramic substrate for a thermal head. .

[0002]

2. Description of the Related Art A thin film formed on the edge of a substrate is peeled off by mechanical friction or the like in a later process to become a dust source,
In order to prevent the thin film formed around the back surface of the edge of the substrate from contaminating the processing device in the subsequent process or obstructing the focusing during exposure and causing a decrease in yield,
A substrate edge cleaning device that removes an unnecessary thin film on the edge of the substrate is used.

As such a substrate edge cleaning device, for example, the device disclosed in Japanese Patent Laid-Open No. 3-78777 supplies a solvent from the first and second pipes to the upper and lower surfaces of the peripheral portion of the substrate, Drain the solvent and lysate from the third tube.

However, such a method has a drawback that the thin film material once dissolved in the solvent rises. 12
[Fig. 4] is a diagram for explaining the rise of such a thin film material. FIG. 12A shows an end portion of the substrate 2 after the thin film 3 is formed, and FIG. 12B shows a state where the edge cleaning is started by discharging the solvent 6 from the nozzle 4. (C)
Is the thin film 3 on the cleaning boundary line 2a of the substrate 2 after the edge cleaning.
The manner in which the raised portion 3a is formed is shown. In such a raised portion 3a, the solvent 6 supplied from the nozzle 4 to the substrate 2 permeates the thin film 3 at the cleaning boundary line 2a, and in the portion adjacent to the cleaning boundary line 2a, the thin film 3 once dissolved by the solvent 6 is formed. Is formed by being raised.

The height h of such a raised portion 3a
Increases as the cleaning time increases, and therefore tends to increase as the width of the edge cleaning (“cleaning width” shown in FIG. 12) increases. For example, even if the thin film 3 has a thickness of 2 μm,
If it is more than m, and it goes to the subsequent process as it is, it becomes difficult to remove the raised portion 3a.
For example, a special process for removing the raised portion 3a, such as exposing the raised portion 3a particularly, is required, resulting in a decrease in productivity. Since the height h of the raised portion 3a increases with the cleaning time, it tends to increase as the width of the edge cleaning increases.

Further, the present applicant has previously proposed the following substrate edge cleaning device for cleaning and removing the unnecessary thin film on the edge of the substrate (Japanese Patent Laid-Open No. 5-175117).

According to the substrate edge cleaning apparatus according to this proposal, the solvent nozzle for ejecting the solvent toward the front and back surfaces of the edge of the substrate held by the substrate holding means, and the solvent nozzle for ejecting the gas A gas nozzle that blows away the melted substance dissolved by the solvent discharged from the outside is provided, the solvent nozzle and the gas nozzle are moved along the edge of the substrate, and the solvent and the melted substance are blown off by the gas nozzle.

[0008]

However, even in the above-mentioned substrate edge cleaning device, a raised portion as shown in FIG. 11 may occur as in the previous case. Further, in such a device, it has been attempted to increase the flow rate of gas blown from the gas nozzle and increase the flow velocity to reduce the occurrence of a swelling part. As a result, the uniformity of the thin film formed on the center side of the substrate deteriorates. Further, in the above apparatus, the solvent nozzle and the gas nozzle are provided at the same position with respect to the direction along the edge of the substrate. Therefore, when gas is strongly blown out from the gas nozzle, the solvent causes the flow of solvent to the outside. It moves by pushing to the substrate, the position where the solvent hits the substrate moves closer to the edge of the substrate, and the unnecessary thin film on the edge to be cleaned and removed becomes insufficient,
In addition, the prevention of the raised portion was insufficient.

In view of the above, the present invention effectively removes unnecessary thin films, and effectively prevents swelling due to solvent penetration without disturbing the uniformity of the thin film formed on the center side of the substrate. The purpose is to lose.

[0010]

A substrate edge cleaning device according to claim 1 is a substrate edge cleaning device for cleaning and removing an unnecessary thin film formed on an edge of a rectangular substrate. The substrate holding means for holding the rectangular substrate that has been formed, the solvent ejecting means for ejecting the solvent toward the edge of the surface of the rectangular substrate held by the substrate holding means, and the solvent ejected from the solvent ejecting means And a moving unit that moves a position acting on the edge of the surface of the mold substrate in a direction perpendicular to the edge of the substrate.

Further, in the substrate edge cleaning apparatus of the second aspect, the moving means moves the solvent discharging means along one side of the rectangular substrate while the solvent is being discharged from the solvent discharging means, and the solvent is discharged. It is characterized in that it includes a scanning means for moving the ejection means to the outside of the substrate.

Further, in the substrate edge cleaning device of the third aspect, the solvent discharging means includes at least one solvent discharging nozzle for discharging the solvent toward the edge of the surface of the rectangular substrate held by the substrate holding means. The moving means includes a scanning means for moving the solvent discharging nozzle along one side of the rectangular substrate and moving the solvent discharging nozzle to the outside of the substrate when the solvent is being discharged from the solvent discharging means. It is characterized by

Further, the substrate edge cleaning device according to a fourth aspect is characterized in that the solvent discharging means has a plurality of solvent discharging nozzles arranged along one side of the rectangular substrate.

According to a fifth aspect of the present invention, there is provided a substrate edge cleaning device in which the solvent discharging means has different distances from one side of the rectangular substrate held by the substrate holding means and is integrated along one side of the rectangular substrate. In addition to having a plurality of solvent discharge nozzles that can be moved to, the moving means selects one of the plurality of solvent discharge nozzles to discharge the solvent and move the solvent along one side of the rectangular substrate. And

According to a sixth aspect of the present invention, in the substrate edge cleaning device, the solvent discharging means has at least one solvent discharging nozzle capable of adjusting an angle with respect to the rectangular substrate held by the substrate holding means, and the moving means is provided. By adjusting the angle of the solvent discharge nozzle while the solvent is being discharged from the solvent discharge nozzle, the position where the solvent discharged from the solvent discharge nozzle acts on the edge of the surface of the square substrate is set to the square substrate. Of 1
It is characterized by moving along the side.

According to a seventh aspect of the present invention, there is provided a substrate edge cleaning device, wherein the solvent ejecting means ejects the solvent toward the edge of the surface of the rectangular substrate held by the substrate holding means. And a solvent suction port that is fixed relatively to a position on the outer side of the substrate with respect to the solvent discharge nozzle, and the moving means discharges the solvent from the solvent discharge means. It is characterized by including a scanning means for moving to.

[0017]

In the substrate edge cleaning device of the first aspect, the moving means moves the position where the solvent discharged from the solvent discharging means acts on the edge of the surface of the rectangular substrate in a direction perpendicular to the substrate edge. Therefore, it is possible to move the position where the solvent acts along with the removal of the unnecessary thin film, and prevent the solvent from being continuously supplied to the cleaning boundary line at the edge of the rectangular substrate surface. It is possible to prevent formation of a raised portion.

According to another aspect of the substrate edge cleaning apparatus of the present invention, the moving means moves the solvent discharging means along one side of the rectangular substrate and the solvent discharging means while the solvent is being discharged from the solvent discharging means. Since the scanning means for moving the substrate to the outside of the substrate is included, the solvent discharging means can be shortened in the direction in which one side of the rectangular substrate extends, and the device can be downsized.

According to another aspect of the substrate edge cleaning device of the present invention, the moving means moves the solvent discharge nozzle along one side of the rectangular substrate and the solvent discharge nozzle while the solvent is being discharged from the solvent discharge means. Since the scanning means for moving the substrate to the outside of the substrate is included, uniform edge cleaning can be performed with a small number of solvent ejection nozzles, and the apparatus can be downsized.

In the substrate edge cleaning device of the fourth aspect, the solvent discharging means has a plurality of solvent discharging nozzles arranged along one side of the rectangular substrate, so that the edge cleaning can be performed quickly.

According to another aspect of the substrate edge cleaning device of the present invention, the solvent discharging means is different in distance from one side of the rectangular substrate held by the substrate holding means and is integrally moved along one side of the rectangular substrate. It has a plurality of possible solvent discharge nozzles, and the moving means is one of the plurality of solvent discharge nozzles.
Since one is selected and the solvent is ejected and is moved along one side of the rectangular substrate, a special mechanism for mechanically moving the solvent ejecting means to the outside of the substrate is unnecessary.

According to another aspect of the substrate edge cleaning apparatus of the present invention, the solvent ejecting means has at least one solvent ejecting nozzle capable of adjusting an angle with respect to the rectangular substrate held by the substrate holding means, and the moving means comprises the solvent. By adjusting the angle of the solvent discharge nozzle while the solvent is being discharged from the discharge nozzle, the position where the solvent discharged from the solvent discharge nozzle acts on the edge of the surface of the square substrate is set to 1 Since the solvent is moved along the side, a stream of solvent can be formed toward the outside of the substrate, and the solvent can be effectively prevented from acting on the cleaning boundary side.

According to a seventh aspect of the present invention, there is provided a substrate edge cleaning apparatus, wherein the solvent ejecting means ejects the solvent toward the edge of the surface of the rectangular substrate held by the substrate holding means and at least one solvent ejecting nozzle. It has a solvent suction port fixed relatively to a position on the outer side of the substrate with respect to the nozzle, and moves the solvent discharge means to the outside of the substrate when the moving means discharges the solvent from the solvent discharge means. Since the scanning means is included, the solvent suction port also moves to the outside of the substrate together with the solvent ejection means, and the time during which the thin film formed on the surface of the rectangular substrate is affected by the exhaust from the solvent suction port is shortened. .

[0024]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS FIG. 1 shows the structure of a substrate edge cleaning apparatus of the first embodiment, FIG. 1 (a) is a plan view thereof, and FIG.
Shows its side view.

The substrate edge cleaning apparatus of the first embodiment comprises a nozzle block 11 arranged so as to sandwich the edge 10a of the substrate 10 horizontally supported by holding means (not shown) from above and below. The nozzle block 11 functions as a solvent discharging unit and is supported by the arm 12 and the base 13. The base 13 includes a pair of sliders 13a and 1a.
3b, one slider 13a is a motor M
The slider 13b is driven by a ball screw 14 connected to and is moved in the AB direction shown in the figure, and the other slider 13b is guided by a slide guide 15 to be movable in the AB direction shown in the figure. Therefore, by appropriately rotating the motor M, the nozzle block 11, the arm 12, and the base 13 can be moved to the position A in the drawing.
It can be appropriately reciprocated in the B direction. That is, the pair of sliders 13a and 13b, the ball screw 14, the slide guide 15, and the motor M constitute a moving unit. The stage 16 that horizontally supports the base 13 is moved by a moving unit (not shown) by the nozzle block 11 and the arm 12.
While the base 13 remains mounted, the base 13 and the base 13 move smoothly in the CD direction shown in the figure. Therefore, the nozzle block 11 is two-dimensionally movable in the illustrated AB and CD directions, and is appropriately scanned in a plane parallel to the AB and CD directions.

The nozzle block 11 includes an upper nozzle 11a which faces the upper surface of the edge portion 10a of the substrate 10 and discharges the solvent onto it, and a lower nozzle 11b which faces the lower surface and discharges the solvent onto it. Prepare Each nozzle 11a, 11b
Is composed of a large number of nozzles arranged along the longitudinal direction (CD direction in the drawing) of the edge portion 10a of the substrate 10, and these large number of nozzles are connected to the solvent relay portion 17 through pipes (not shown). ing. The solvent stored in the solvent relay portion 17 is supplied to the respective nozzles 11a and 11b or the supply thereof is stopped in accordance with the opening / closing operation of a solenoid valve (not shown).

By scanning the nozzle block 11 while ejecting the solvent from each of the nozzles 11a and 11b, the upper and lower surfaces of the edge portion 10a of the substrate 10 are exposed to the solvent, and unnecessary thin films adhering thereto are removed. To be removed. The nozzle block 11 is scanned by setting the illustrated CD direction as the main scanning direction and the illustrated AB direction as the sub scanning direction. That is, the nozzle block 11 is set at a desired position in the illustrated AB direction, and each nozzle 11a, 11b causes the cleaning boundary line of the edge portion 10a of the substrate 10 (the cleaning boundary line is an unnecessary thin film to be removed by cleaning). It is arranged at a position facing the necessary edge position of the thin film remaining at the time. Next, while moving the nozzle block 11 back and forth in the illustrated CD direction at a relatively high speed, the illustrated AB direction (the substrate 10
The outer side of the substrate which is separated from the center side of the substrate is also moved in stages at a relatively low speed. As a result, the edge portion 1 of the substrate 10
The unnecessary thin film adhering to the upper and lower surfaces of 0a is uniformly removed by the solvent.

The solvent discharged onto the upper and lower surfaces of the edge portion 10a of the substrate 10 and the dissolved material separated from the upper and lower surfaces by way of the exhaust duct 11c formed in the nozzle block 11 are used. It is sucked and exhausted.

FIG. 2 is a diagram for explaining the operation of the substrate edge cleaning device of FIG. In the drawing, the nozzle block 11 and the upper nozzle 11a are represented by being compressed and omitted in the vertical direction of the drawing for the sake of explanation. 2A to 2I show the scanning procedure of the nozzle block 11 in that order.

First, FIG. 2 (a), FIG. 2 (b) and FIG.
At the stage shown in (c), the nozzle block 11 is arranged at the position Pos1 which is closest to the center side of the substrate 10 in the AB direction shown in FIG. To be done. And the nozzle block 1
1 is reciprocated from one end of the substrate 10 to the other end in the CD direction shown in FIG. As a result, the thin film near the cleaning boundary line is removed. 3A and 3B are views for explaining the removal of the thin film in this step. As shown,
The thin film 3 on the edge portion 10a of the substrate 10 is gradually dissolved by the solvent 13 to form the cleaning boundary line 20. In addition,
In the figure, only the upper nozzle 11a is shown and the lower nozzle 11b is not shown.

Next, FIG. 2 (d), FIG. 2 (e) and FIG.
At the stage shown in (f), the nozzle block 11 is arranged at the position Pos2 which has moved away from the center side of the substrate 10 toward the substrate outer side in the AB direction shown in FIG. As a result, it is possible to prevent the solvent from being continuously supplied to the vicinity of the cleaning boundary line of the edge portion 10a of the substrate 10 and to prevent the formation of a raised portion in the vicinity of the cleaning boundary line. Then, the nozzle block 11 is reciprocated once in the CD direction shown in FIG. 3C and 3D are diagrams for explaining the removal of the thin film in this step. As shown in the drawing, the thin film 3 on the edge portion 10a of the substrate 10 is gradually dissolved by the solvent 13, and the surface of the substrate 10 near the position Pos2 is exposed. At this time, since the solvent 13 is not supplied in the vicinity of the cleaning boundary line 20, a raised portion is not formed in the vicinity of the cleaning boundary line 20.

Finally, FIG. 2 (g), FIG. 2 (h) and FIG.
At the stage shown in (i), the nozzle block 11 is arranged at the position Pos3 which is the farthest from the center side of the substrate 10 and has moved to the substrate outer side in the AB direction shown in FIG. Then, the nozzle block 11 is reciprocated once in the CD direction shown in FIG. 3E and 3F are views for explaining the removal of the thin film in this step. As shown, the substrate 10
The thin film 3 of the edge portion 10a of the is gradually dissolved by the solvent 13, and the surface of the substrate 10 near the position Pos3 is exposed,
The unnecessary thin film 3 is completely removed. Note that FIG. 3 (g)
Shows a state where the unnecessary thin film is completed and the nozzle 11a of the nozzle block 11 is retracted.

The edge cleaning as described above is performed on the substrate 10
Is performed for each of the four edge portions 10a.

Further, in the above embodiment, the position of the nozzle 11a is moved in three steps of positions Pos1, Pos2 and Pos3 to carry out the edge cleaning, but this is moved in four steps or more to move the end. Edge cleaning may be performed, or this may be continuously moved without dividing into stages.

FIG. 4 shows the structure of the substrate edge cleaning device of the second embodiment. The substrate edge cleaning device according to the second embodiment is a modification of the device according to the first embodiment, and does not use the pair of sliders 13a and 13b, the motor M, the ball screw 14 and the slide guide 15 shown in FIG. Are directly fixed to the stage 16. As a result, the nozzle block 11
Cannot scan in the AB direction shown in the figure, but the upper and lower nozzles of the nozzle block 11 are arranged in three rows to move the position where the solvent acts on the edge portion 10a of the substrate 10 in the AB direction shown in the figure. Let

The first nozzle 31a arranged to face the cleaning boundary line is connected to the solvent relay portion 17 via the air valve V3 constituting the moving means, and the second nozzle 31a arranged to face the central side. The nozzle 41a is an air valve V4 which constitutes a moving means.
The third nozzle 51a, which is connected to the solvent relay unit 17 via the, and is arranged to face the vicinity of the edge of the substrate 10, is connected to the solvent relay unit 17 via the air valve V5 which constitutes the moving means. The opening / closing timing of each air valve V3, V4, V5 is controlled by a solenoid valve control circuit 30 which controls the solenoid valve connected to each air valve V3, V4, V5.

FIG. 5 is a diagram for explaining the operation of the substrate edge cleaning device of FIG. In the drawings, the nozzle block 11 and the nozzles 31a, 41a, 51a are represented by being compressed and omitted in the vertical direction of the drawing. And FIG.
5A to 5I show a method of scanning the solvent ejection position by the nozzle block 11 in that order.

First, FIG. 5 (a), FIG. 5 (b) and FIG.
At the stage shown in (c), the nozzle 31 of the nozzle block 11 is
Among a, 41a, 51a, the position Pos1 near the center of the edge portion 10a of the substrate 10 in the AB direction shown in FIG.
The solvent is ejected from the first nozzle 31a facing the. Then, the nozzle block 11 is reciprocated once in the CD direction shown in FIG. As a result, the thin film near the cleaning boundary line is removed.

Next, FIG. 5 (d), FIG. 5 (e) and FIG.
At the stage shown in (f), the nozzles 31 of the nozzle block 11 are
a, 41a, 51a, the central position P of the edge portion 10a
The solvent is discharged from the second nozzle 41a facing os2. Then, the nozzle block 11 is reciprocated once in the CD direction shown in FIG. As a result, the substrate 1 near the position Pos2
0 Surface is exposed.

Finally, FIG. 5 (g), FIG. 5 (h) and FIG.
At the stage shown in (i), the nozzle 31 of the nozzle block 11 is
Of a, 41a, 51a, the solvent is ejected from the third nozzle 51a facing the outer side position Pos3 of the edge portion 10a. Then, the nozzle block 11 is replaced with the CD shown in FIG.
Make one round trip in the direction. As a result, the surface of the substrate 10 near the position Pos3 is exposed and the unnecessary thin film is removed.

FIG. 6 shows the structure of the substrate edge cleaning device of the third embodiment. FIG. 6A is a plan view of the nozzle block 11 of the substrate edge cleaning apparatus of the third embodiment, and FIG. 6B is a side view of the nozzle block 11 of FIG. . The apparatus according to the third embodiment is a modification of the apparatus according to the second embodiment. Instead of the nozzles 31a, 41a, 51a arranged in three rows above and below the nozzle block 11, nozzles 61a, 61b in one row above and below are arranged. Then, these are moved in a direction perpendicular to the arrangement direction. As a result, the position where the solvent acts on the edge portion 10a of the substrate 10 can be moved in the AB direction shown in the figure.

A row of upper and lower nozzles 61a for discharging the solvent,
Each of the 61b is inserted into a plurality of long grooves 11d formed in the exhaust duct 11c, and the exhaust duct 11c
It faces the edge portion 10 a of the substrate 10 guided inside. The upper nozzle 61a is fixed to the liquid reservoir 71a, and the liquid reservoir 71a is fixed to the arm 72a. The arm 72a is a support member 7 fixed to the exhaust duct 11c side.
Slide guide 74a and ball screw 7 fixed to 3a
It is supported by 5a. The ball screw 75a is connected to the motor Ma, and by appropriately rotating the motor Ma, the upper nozzle 61a can be appropriately reciprocated in the AB direction shown in the drawing. The lower nozzle 61b is fixed to the liquid reservoir 71b, and the liquid reservoir 71b is fixed to the arm 72b. The arm 72b is supported by a slide guide 74b fixed to a support member 73b fixed to the exhaust duct 11c side and a ball screw 75b. The ball screw 75a is connected to a motor (not shown), and by appropriately rotating this motor, the lower nozzle 61b can be appropriately reciprocated in the AB direction shown while facing the upper nozzle 61a.

FIG. 7 is a diagram for explaining the operation of the substrate edge cleaning device of FIG. In the figure, the nozzle block 11 and the nozzle 61a are represented by being compressed and omitted in the vertical direction of the figure. 7 (a) to 7 (i)
Shows the scanning procedure of the solvent ejection position by the nozzle block 11 in that order.

First, FIGS. 7 (a), 7 (b) and 7
At the stage shown in (c), the nozzle 61 of the nozzle block 11 is
a is the end edge portion 10 of the substrate 10 in the AB direction shown in FIG.
The solvent is ejected from the nozzle 61a toward the end edge portion 10a of the substrate 10 by moving to a position facing the center side position Pos1 of a. The nozzle block 11 is shown in FIG.
Make one round trip in the CD direction. As a result, the thin film near the cleaning boundary line is removed.

Next, FIG. 7 (d), FIG. 7 (e) and FIG.
At the stage shown in (f), the nozzle 61 of the nozzle block 11 is
a is moved to a position facing the central position Pos2 of the edge portion 10a of the substrate 10, and the solvent is discharged from the nozzle 61a toward the edge portion 10a of the substrate 10. Then, the nozzle block 11 is reciprocated once in the CD direction shown in FIG. As a result, the thin film near the position Pos2 is removed, and the surface of the substrate 10 there is exposed.

Finally, FIG. 7 (g), FIG. 7 (h) and FIG.
At the stage shown in (i), the nozzle 61 of the nozzle block 11 is
a is moved to a position facing the outer side position Pos3 of the edge portion 10a of the substrate 10, and the nozzle 61a moves the substrate
The solvent is discharged toward the edge portion 10a of the. Then, the nozzle block 11 is reciprocated once in the CD direction shown in FIG. As a result, the surface of the substrate 10 near the position Pos3 is exposed and the unnecessary thin film is removed.

The substrate edge cleaning device of the fourth embodiment will be described below. The fourth embodiment is a modification of the device of the first embodiment, in which the nozzle block 11 is longer than the long side of the substrate 10 and is formed over the entire nozzle block 11. The solvent from the upper and lower nozzles is the substrate 1
It is discharged to the entire edge portion 10a of 0. Therefore, a mechanism for moving the stage 16 in the CD direction is unnecessary.

FIG. 8 is a diagram for explaining the operation of the substrate edge cleaning device of the fourth embodiment. Then, FIG. 8A to FIG.
(F) shows a method of changing the solvent discharge position by the nozzle block 11 in that order.

First, at the stage shown in FIG. 8A, the nozzles 11 a of the pair of nozzle blocks 11 are connected to the edge portion 1 of the substrate 10.
The solvent is discharged from each nozzle 11a toward the edge portion 10a of the substrate 10 by moving the nozzle 11a to a position facing the center-side position Pos1. Then, the pair of nozzle blocks 11 are swung in the longitudinal direction for a certain period of time and at a certain period. As a result, the thin film near Pos1 adjacent to the cleaning boundary line is removed.

Next, at the stage shown in FIG. 8B, the nozzles 11a of the pair of nozzle blocks 11 are connected to the edge portion 1 of the substrate 10.
0a to a position facing the central position Pos2,
The solvent is discharged from each nozzle 11a toward the edge portion 10a of the substrate 10. Then, the pair of nozzle blocks 11 are swung in the longitudinal direction for a certain period of time and at a certain period. As a result, the thin film near the position Pos2 is removed, and the surface of the substrate 10 there is exposed.

Next, at the stage shown in FIG. 8C, the nozzles 11a of the pair of nozzle blocks 11 are connected to the edge portion 1 of the substrate 10.
The solvent is discharged from each nozzle 11a toward the edge portion 10a of the substrate 10 by moving the nozzle 11a to a position facing the outer side position Pos3. And a pair of nozzle blocks 1
1 is oscillated in its longitudinal direction for a certain period of time and at a certain period.
As a result, the surface of the substrate 10 near the position Pos3 is exposed and the unnecessary thin film is removed.

First, at the stage shown in FIG. 8D, the orientation of the substrate 10 is once rotated by 90 °. Then, the nozzles 11 a of the pair of nozzle blocks 11 are connected to the edge portion 10 a of the substrate 10.
Then, the solvent is ejected from each nozzle 11a toward the edge 10a of the substrate 10 by moving the nozzle 11a to a position facing the center-side position Pos11. And a pair of nozzle blocks 1
1 is swung in its longitudinal direction. As a result, the thin film near the cleaning boundary line is removed.

Next, at the stage shown in FIG. 8E, the nozzles 11a of the pair of nozzle blocks 11 are connected to the edge portion 1 of the substrate 10.
The solvent is ejected from each nozzle 11a toward the edge portion 10a of the substrate 10 by moving to a position facing the central position Pos12 of 0a. And a pair of nozzle blocks 1
1 is swung in its longitudinal direction. As a result, the position Pos
The thin film near 12 is removed to expose the surface of the substrate 10 there.

Next, at the stage shown in FIG. 8F, the nozzles 11a of the pair of nozzle blocks 11 are connected to the edge portion 1 of the substrate 10.
The solvent is ejected from each nozzle 11a toward the edge portion 10a of the substrate 10 by moving the nozzle 11a to a position facing the outer side position Pos13. Then, the pair of nozzle blocks 11 are swung in the longitudinal direction. As a result, the position Po
The surface of the substrate 10 near s3 is exposed, and unnecessary thin films are removed.

9 and 10 show the structure of the substrate edge cleaning device of the fifth embodiment. 9 is a partial front cross-sectional view of the nozzle block 11 of the substrate edge cleaning device, and FIG. 10 is a side view of the nozzle block 11 of FIG. Fifth
The device of the embodiment is a modification of the device of the third embodiment,
Nozzles 3 arranged in three rows above and below the nozzle block 11
Instead of 1a, 41a, 51a, nozzles 8 in a row above and below
1a and 81b, and the rotation axis Z parallel to the arrangement direction
Rotate around a and Zb. As a result, the solvent is
The position acting on the edge portion 10a of 0 can be moved in the AB direction in FIG.

Upper and lower rows of nozzles 81a for discharging the solvent,
Each of the 81b is inserted into each of a plurality of openings 11e formed in the exhaust duct 11c, and the exhaust duct 11c
It faces the edge portion 10 a of the substrate 10 guided inside.

The upper nozzle 81a is fixed to the liquid reservoir 91a, and the liquid reservoir 91a is supported by the first and second arms 92a and 93a. First arm 92a
Is supported by a support member 96a fixed to the exhaust duct 11c side via a bearing 95a that rotatably supports a rotary shaft 94a provided around the rotary shaft Za. The second arm 93a is supported by a support member 99a fixed to the exhaust duct 11c side via a bearing 98a that rotatably supports a rotary shaft 97a provided on the second arm 93a around a rotation axis Za. . The rotating shaft 97a is connected to the motor Ma, and the motor M
By appropriately rotating a, the upper nozzle 81a can be rotated about the rotation axis Za within a predetermined angular range 2α.

The lower nozzle 81b is fixed to the liquid reservoir 91b, and the liquid reservoir 91b is supported by the third and fourth arms 92b and 93b. Third arm 92b
Is supported by a support member 96b fixed to the exhaust duct 11c side via a bearing 95b that rotatably supports a rotary shaft 94b provided around the rotary shaft 94b. In addition, the fourth arm 93b is supported by a support member 99b fixed to the exhaust duct 11c side via a bearing 98b that rotatably supports a rotary shaft 97b provided on the fourth arm 93b around a rotation axis Zb. . The rotating shaft 97b is connected to the motor Mb.
By appropriately rotating b, it is possible to rotate the lower nozzle 81b around the rotation axis Zb within a predetermined angular range 2α.

FIG. 11 is a diagram for explaining the operation of the substrate edge cleaning device of FIGS. 9 and 10. In addition, FIG.
FIG. 11D shows the change of the action position of the solvent by the nozzle block 11 in that order.

First, at the stage shown in FIG. 11 (a), the solvent 13 is discharged from the nozzle 81a toward the edge 10a of the substrate 10 with the nozzle 81a directed vertically downward. And
The nozzle block 11 is reciprocated once in the CD direction shown in FIG. As a result, as shown in FIG.
The thin film 3 at the position closer to the center of the edge portion 10a is removed. In the figure, only the upper nozzle 81a is shown,
The lower nozzle 81b is not shown.

Next, at the stage shown in FIG. 11 (c), the nozzle 81a is tilted by a predetermined angle and the substrate 81 is moved from the nozzle 81a.
The solvent 13 is discharged toward the edge portion 10a of the. Then, the nozzle block 11 is reciprocated once in the CD direction shown in FIG. As a result, the thin film 3 near the center of the edge 10a of the substrate 10 is removed and the surface of the substrate 10 is exposed.

Finally, at the stage shown in FIG. 11D, the nozzle 81a is further tilted by a predetermined angle, and the solvent 13 is ejected from the nozzle 81a toward the edge portion 10a of the substrate 10. Then, the nozzle block 11 is reciprocated once in the CD direction shown in FIG. As a result, the edge portion 10a of the substrate 10
The thin film 3 on the outer side of is removed.

[0063]

As described above, in the substrate edge cleaning apparatus according to the first aspect, the moving means sets the position where the solvent discharged from the solvent discharging means acts on the edge of the surface of the rectangular substrate. Since it is moved in a direction perpendicular to the edge, it is possible to prevent the solvent from being continuously supplied to the cleaning boundary line at the edge of the rectangular substrate surface.
It is possible to prevent the raised portion of the thin film from being formed at a position adjacent to the cleaning boundary line.

In the substrate edge cleaning device of the second aspect, the moving means moves the solvent discharging means along one side of the rectangular substrate while the solvent is being discharged from the solvent discharging means, and at the same time, the solvent discharging means. Since the scanning means for moving the substrate to the outside of the substrate is included, the solvent discharging means can be shortened in the direction in which one side of the rectangular substrate extends, and the device can be downsized.

In the substrate edge cleaning device of the third aspect, the moving means moves the solvent discharge nozzle along one side of the rectangular substrate while the solvent is being discharged from the solvent discharge means, and at the same time, the solvent discharge nozzle. Since the scanning means for moving the substrate to the outside of the substrate is included, uniform edge cleaning can be performed with a small number of solvent ejection nozzles, and the apparatus can be downsized.

In the substrate edge cleaning device of the fourth aspect, the solvent discharging means has a plurality of solvent discharging nozzles arranged along one side of the rectangular substrate, so that the edge cleaning can be performed quickly.

According to another aspect of the substrate edge cleaning apparatus of the present invention, the solvent discharging means has different distances from one side of the rectangular substrate held by the substrate holding means and is integrally moved along one side of the rectangular substrate. It has a plurality of possible solvent discharge nozzles, and the moving means is one of the plurality of solvent discharge nozzles.
Since one is selected and the solvent is ejected and is moved along one side of the rectangular substrate, a special mechanism for mechanically moving the solvent ejecting means to the outside of the substrate is unnecessary.

In the substrate edge cleaning apparatus of the sixth aspect, the solvent discharging means has at least one solvent discharging nozzle capable of adjusting the angle with respect to the rectangular substrate held by the substrate holding means, and the moving means comprises the solvent. By adjusting the angle of the solvent discharge nozzle while the solvent is being discharged from the discharge nozzle, the position where the solvent discharged from the solvent discharge nozzle acts on the edge of the surface of the square substrate is set to 1 Since the solvent is moved along the side, a stream of solvent can be formed toward the outside of the substrate, and the solvent can be effectively prevented from acting on the cleaning boundary side.

According to a seventh aspect of the present invention, there is provided a substrate edge cleaning device, wherein the solvent ejecting means ejects the solvent toward the edge of the surface of the rectangular substrate held by the substrate holding means and at least one solvent ejecting nozzle. It has a solvent suction port fixed relatively to a position on the outer side of the substrate with respect to the nozzle, and moves the solvent discharge means to the outside of the substrate when the moving means discharges the solvent from the solvent discharge means. Since the scanning means is included, the solvent suction port also moves to the outside of the substrate together with the solvent ejection means, and the time during which the thin film formed on the surface of the rectangular substrate is affected by the exhaust from the solvent suction port is shortened. .

[Brief description of drawings]

FIG. 1 is a plan view and a side view showing a substrate edge cleaning device according to a first embodiment of the present invention.

FIG. 2 is a diagram explaining the operation of the apparatus of FIG.

FIG. 3 is a diagram illustrating the operation of the apparatus of FIG.

FIG. 4 is a diagram showing a substrate edge cleaning device of a second embodiment.

5 is a diagram illustrating the operation of the apparatus of FIG.

FIG. 6 is a diagram showing a substrate edge cleaning device according to a third embodiment.

FIG. 7 is a diagram illustrating the operation of the apparatus of FIG.

FIG. 8 is a diagram showing a substrate edge cleaning device according to a fourth embodiment.

FIG. 9 is a diagram showing a substrate edge cleaning device of a fifth embodiment.

FIG. 10 is a diagram showing a substrate edge cleaning device according to a fifth embodiment.

FIG. 11 is a diagram illustrating the operation of the apparatus of FIGS. 9 and 10.

FIG. 12 is a diagram illustrating a problem of a conventional substrate edge cleaning device.

[Explanation of symbols]

 10 Substrate 10a Edge Edge 11 Nozzle Block 11a Upper Nozzle 11b Lower Nozzle 14 Ball Screw 15 Slide Guide M Motor

Claims (7)

[Claims] 1. A substrate edge cleaning device for cleaning and removing an unnecessary thin film formed on an edge of a rectangular substrate, comprising: substrate holding means for holding a rectangular substrate having a thin film formed on its surface; and substrate holding The solvent ejecting means for ejecting the solvent toward the edge of the surface of the rectangular substrate held by the means, and the position where the solvent ejected from the solvent ejecting means acts on the edge of the surface of the rectangular substrate, A substrate edge cleaning device, comprising: a moving unit that moves in a direction perpendicular to the edge. 2. A scanning means for moving the solvent discharging means along one side of the rectangular substrate and moving the solvent discharging means to the outside of the substrate while the solvent is being discharged from the solvent discharging means. The substrate edge cleaning device according to claim 1, further comprising: 3. The solvent ejecting means has at least one solvent ejecting nozzle for ejecting the solvent toward the edge of the surface of the rectangular substrate held by the substrate holding means, and the moving means comprises the solvent ejecting means. 2. The substrate according to claim 1, further comprising scanning means for moving the solvent discharge nozzle along one side of the rectangular substrate and moving the solvent discharge nozzle outward of the substrate when the solvent is being discharged. Edge cleaning device. 4. The substrate edge cleaning apparatus according to claim 3, wherein the solvent discharging means has a plurality of solvent discharging nozzles arranged along one side of the rectangular substrate. 5. The solvent ejecting means has a plurality of solvent ejecting nozzles which are different in distance from one side of the rectangular substrate held by the substrate holding means and are movable integrally along one side of the rectangular substrate. The substrate edge cleaning according to claim 1, wherein the moving means selects one of the plurality of solvent discharge nozzles and moves the solvent along one side of the rectangular substrate while discharging the solvent. apparatus. 6. The solvent discharging means has at least one solvent discharging nozzle capable of adjusting an angle with respect to the rectangular substrate held by the substrate holding means, and the moving means discharges the solvent from the solvent discharging nozzle. At this time, by adjusting the angle of the solvent discharge nozzle, the position where the solvent discharged from the solvent discharge nozzle acts on the edge of the surface of the square substrate is moved along one side of the square substrate. The substrate edge cleaning device according to claim 1. 7. The solvent discharging means comprises at least one solvent discharging nozzle for discharging the solvent toward an edge of the surface of the rectangular substrate held by the substrate holding means, and a substrate outside the solvent discharging nozzle. A solvent suction port fixed relatively to the position, and the moving means includes a scanning means for moving the solvent discharging means to the outside of the substrate when the solvent is being discharged from the solvent discharging means. The substrate edge cleaning device according to claim 1.