JPH08130362A - Printed board - Google Patents

Printed board

Info

Publication number
JPH08130362A
JPH08130362A JP6292383A JP29238394A JPH08130362A JP H08130362 A JPH08130362 A JP H08130362A JP 6292383 A JP6292383 A JP 6292383A JP 29238394 A JP29238394 A JP 29238394A JP H08130362 A JPH08130362 A JP H08130362A
Authority
JP
Japan
Prior art keywords
pad
molten solder
pattern
self
center
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP6292383A
Other languages
Japanese (ja)
Inventor
Masami Nakane
正見 中根
Shiro Okamoto
志郎 岡本
Kuniaki Azuma
邦秋 東
Toshio Kagawa
敏男 香川
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Horiba Ltd
Original Assignee
Horiba Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Horiba Ltd filed Critical Horiba Ltd
Priority to JP6292383A priority Critical patent/JPH08130362A/en
Publication of JPH08130362A publication Critical patent/JPH08130362A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3431—Leadless components

Abstract

PURPOSE: To obtain a printed board where a chip is restrained from rising up and capable of displaying an enough self-aligning effect by a method wherein a pad is so shaped as to be tapered off towards a pattern. CONSTITUTION: When cream solder applied onto a metal part and mounted with a mounting part 3 is heated, molten solder is kept maximal in area occupied by it on the surface of the metal part surrounded with a smooth curve, and the center of gravity G1 of the molten solder is located off on the outside of the center P of a part of the mounting part 3 bonded to a pad 1. Therefore, the surface tension of the molten solder acts towards the center of gravity G1 so as to pull the mounting part 3 its both ends. Moreover, the metal part is set larger than usual in area, so that the surface tension is large also, and a strong self-aligning effect is obtained. A chip is prevented from rising up by a strong self-aligning effect, and a printed board is capable of being enhanced in mounting density.

Description

【発明の詳細な説明】Detailed Description of the Invention

【０００１】[0001]

【産業上の利用分野】本発明はプリント基板のパッド部
分の形状に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to the shape of a pad portion of a printed circuit board.

【０００２】[0002]

【従来の技術】プリント基板に配列されたパッド上に、
実装部品をリフロー半田により取り付ける場合に、左右
の表面張力の差によって、チップ立ち（マンハッタン現
象）が生じることがあり、その対策として、例えば、図
４に示すように、パッド１の幅ａを実装部品３よりも小
さく形成する方法が提案されている。なお、図４中、符
号２はレジスト処理されたパターン部分である。2. Description of the Related Art On pads arranged on a printed circuit board,
When mounting components are mounted by reflow soldering, chip standing (Manhattan phenomenon) may occur due to the difference in surface tension between the left and right. As a countermeasure against this, for example, as shown in FIG. A method of making the component smaller than the component 3 has been proposed. In FIG. 4, reference numeral 2 is a resist-processed pattern portion.

【０００３】[0003]

【発明が解決しようとする課題】しかし、パッド１の形
状を小さくした場合には、半田による表面張力が小さく
なるため、セルフアライメント効果を充分に得ることが
できず、実装部品のアライメントが低下するという難点
があった。セルフアライメント効果を得るために、パッ
ドを大きく形成すると、前述のように、チップ立ちを防
ぐことができなくなるだけでなく、部品の実装密度が低
下してしまう。However, when the shape of the pad 1 is made small, the surface tension due to the solder becomes small, so that the self-alignment effect cannot be sufficiently obtained, and the alignment of the mounted parts deteriorates. There was a difficulty. If the pads are formed to be large in order to obtain the self-alignment effect, it becomes impossible to prevent the chips from standing up as described above, and the mounting density of components is reduced.

【０００４】本発明はこのような実情に鑑みてなされ、
チップ立ちを防止して充分なセルフアライメント効果が
得られ、かつ高い実装密度が得られるプリント基板を提
供することを目的としている。The present invention has been made in view of such circumstances.
It is an object of the present invention to provide a printed circuit board which can prevent a chip from standing and can obtain a sufficient self-alignment effect and a high mounting density.

【０００５】[0005]

【課題を解決するための手段】本発明は、上述の課題を
解決するための手段を以下のように構成している。すな
わち、請求項１に記載の発明では、パッド部分の形状を
パターン部分側に向けて先細り状に形成してなることを
特徴としている。The present invention has means for solving the above-mentioned problems as follows. That is, the invention according to claim 1 is characterized in that the shape of the pad portion is tapered toward the pattern portion side.

【０００６】請求項２に記載の発明では、請求項１に記
載の発明における前記パターン部分側に向けて先細り状
に形成されるパッド部分の周縁部の形状を角のないなめ
らかな曲率に形成してなることを特徴としている。According to a second aspect of the present invention, the peripheral portion of the pad portion, which is tapered toward the pattern portion side in the first aspect of the invention, is formed to have a smooth curvature without corners. It is characterized by

【０００７】請求項３に記載の発明では、パッド部分の
形状をパターン部分側に向けて一部分突出させた横突部
分を有する矩形状に形成してなることを特徴としてい
る。The invention according to claim 3 is characterized in that the shape of the pad portion is formed in a rectangular shape having a lateral projecting portion which is partially projected toward the pattern portion side.

【０００８】請求項４に記載の発明では、パターン部分
におけるパッド近傍部分をレジスト抜きしてなることを
特徴としている。The invention according to claim 4 is characterized in that the resist is removed from the portion near the pad in the pattern portion.

【０００９】[0009]

【作用】請求項１に記載の発明では、パッド部分の形状
がパターン部分側に向けて先細り状に形成されているこ
とにより、パッド部分の幅ａ（図１参照）を大きくする
ことなく、溶融半田を載せる金属部分の面積をより大き
く確保することができ、実装部品に対して大きな表面張
力を作用させることができ、強力なセルフアライメント
効果が得られる。これにより、チップ立ちを防ぐことも
できる。また、その強力なセルフアライメント効果によ
って、パッド部分の幅ａを小さくすることも可能とな
り、高い実装密度を得ることができる。In the invention described in claim 1, since the shape of the pad portion is tapered toward the pattern portion side, the width a of the pad portion (see FIG. 1) is not increased and melting A larger area of the metal portion on which the solder is placed can be secured, a large surface tension can be applied to the mounted component, and a strong self-alignment effect can be obtained. As a result, chip standing can be prevented. Further, due to the strong self-alignment effect, it is possible to reduce the width a of the pad portion, so that high packaging density can be obtained.

【００１０】請求項２に記載の発明では、パッド部分の
周縁部の形状を角のないなめらかな曲率に形成したこと
により、溶融半田の占める面積を最大限確保することが
でき、より一層良好なセルフアライメント効果が得られ
る。According to the second aspect of the present invention, the shape of the peripheral portion of the pad portion is formed to have a smooth curvature without corners, so that the area occupied by the molten solder can be secured to the maximum, which is even better. A self-alignment effect can be obtained.

【００１１】請求項３に記載の発明では、パッド部分を
パターン部分側に向けて一部分突出させることによっ
て、また、請求項４に記載の発明では、パターン部分の
一部をレジスト抜きすることによって、パッド部分の大
きさ（幅）を変化させずに、溶融半田を載せる金属部分
の面積を広くとれ、セルフアライメント効果を向上させ
ることができ、かつチップ立ちを効果的に防ぐことがで
きる。According to the third aspect of the invention, the pad portion is partially projected toward the pattern portion side, and in the fourth aspect of the invention, the pattern portion is partially resist-extracted. The area of the metal portion on which the molten solder is placed can be increased without changing the size (width) of the pad portion, the self-alignment effect can be improved, and chip standing can be effectively prevented.

【００１２】[0012]

【実施例】以下に、本発明のプリント基板の実施例を図
面に基づいて詳細に説明する。図１はパッド部分１，１
の平面図で、そのパッド部分１，１はパターン部分２，
２に向けて先細り状に形成され、そのパッド部分１の周
縁部が角のないなめらかな曲率に形成されている。一点
鎖線で示す符号３はそのパッド部分１，１に半田付けさ
れる例えばチップセラミックコンデンサ等よりなる実装
部品である。Embodiments of the printed circuit board of the present invention will be described below in detail with reference to the drawings. Figure 1 shows the pad parts 1,1
In the plan view of FIG.
It is formed in a taper shape toward 2, and the peripheral portion of the pad portion 1 is formed to have a smooth curvature without corners. Reference numeral 3 shown by a one-dot chain line is a mounting component made of, for example, a chip ceramic capacitor or the like, which is soldered to the pad portions 1 and 1.

【００１３】そのパッド部分１，１の幅ａは、実装部品
３の幅ｘよりも若干広く設定されており、そのパッド部
分１，１の相対向する端縁から０．０５ｍｍ程度内側に
示す破線ｄと、パターン部分２との境界線ｓとの間のパ
ッド部分１が金属部分で、半田で接合可能な部分であ
る。なお、図示の各符号の寸法については、例えば、ａ
＝１．０、ｂ＝１．１、ｃ＝０．８、ｔ＝０．０５、ｈ
＝０．３、Ｒ1 ＝０．２５、Ｒ2 ＝０．６２５で最適と
なる。なお、単位はｍｍである。The width a of the pad portions 1 and 1 is set to be slightly larger than the width x of the mounting component 3, and the broken line shown inward by about 0.05 mm from the opposite edges of the pad portions 1 and 1. The pad portion 1 between the d and the boundary line s between the pattern portion 2 is a metal portion, which is a portion that can be joined by soldering. The dimensions of the reference numerals shown in the figure are, for example, a
= 1.0, b = 1.1, c = 0.8, t = 0.05, h
= 0.3, R 1 = 0.25, R 2 = 0.625, which is optimum. The unit is mm.

【００１４】このように、両パッド部分１，１の外側部
分をなだらかな先細り状に形成したことによって、パッ
ド部分１の幅ａを大きくすることなく、金属部分の面積
を大にすることができ、良好なセルフアライメント効果
を得ることができる。Since the outer portions of both pad portions 1 and 1 are formed in a gentle tapered shape, the area of the metal portion can be increased without increasing the width a of the pad portion 1. A good self-alignment effect can be obtained.

【００１５】より詳しくは、金属部分に塗着されたクリ
ーム半田が、その上に実装部品３を載せて加熱される際
（リフロー時）には、その金属部分のなめらかな曲線に
囲まれた面上に溶融半田の占める面積を最大限確保する
ことができ、かつ、その溶融半田の重心点Ｇは実装部品
３のパッド部分１に対する接合部分の中心点Ｐよりも外
方寄りに位置している。従って、その溶融半田の表面張
力は重心点Ｇに向かうために、実装部品３を両方から引
っ張るように作用する。しかも、金属部分の面積が従来
よりも大きくなっていることから、その表面張力は大き
く、強力なセルフアライメント効果が得られるのであ
る。また、その強力なセルフアライメント効果によって
チップ立ち現象の発生を防ぐことができ、従来、チップ
立ちにより歩留が８０％程度であったものが、ほぼ１０
０％に近い歩留を確保できるようになった。More specifically, when the cream solder applied to the metal portion is heated with the mounting component 3 placed thereon (at the time of reflow), the surface surrounded by the smooth curve of the metal portion. The area occupied by the molten solder can be secured to the maximum, and the center of gravity G of the molten solder is located outside the center point P of the joint portion of the mounting component 3 to the pad portion 1. . Therefore, the surface tension of the molten solder moves toward the center of gravity G, so that the mounted component 3 acts to pull it from both sides. Moreover, since the area of the metal portion is larger than before, the surface tension is large and a strong self-alignment effect can be obtained. Further, due to the strong self-alignment effect, the occurrence of the chip rising phenomenon can be prevented. Conventionally, the yield of about 80% was about 10% due to the chip standing.
It has become possible to secure a yield close to 0%.

【００１６】なお、従来よりも金属部分の面積を大きく
とれることから、両パッド部分１，１の幅ａを小さく設
定して実装密度の向上を図ることができるのはいうまで
もない。Since the area of the metal portion can be made larger than in the conventional case, it goes without saying that the width a of both pad portions 1 and 1 can be set small to improve the mounting density.

【００１７】また、より簡略には、図２に示すように、
両パッド部分１，１を直線状の先細り形状としても前実
施例と略同様の作用効果を得ることができる。あるい
は、図３に示すように、パッド部分１の形状をパターン
部分２側に向けて一部分突出させた横突部分を有する矩
形状としてもよい。Further, more simply, as shown in FIG.
Even if both pad portions 1 and 1 are formed in a linear tapered shape, it is possible to obtain substantially the same action and effect as the previous embodiment. Alternatively, as shown in FIG. 3, the shape of the pad portion 1 may be a rectangular shape having a lateral projecting portion that is partially projected toward the pattern portion 2 side.

【００１８】なお、図３の場合、パッド部分１，１の近
傍のパターン部分２，２の一部（幅ｅ）をレジスト抜き
することによっても形成できる。このように、パッド部
分１，１に横突部分を設けることにより、パッド部分
１，１の幅はそのままで金属部分の表面積をより大きく
確保できる。その幅ｅは０．２〜１．０ｍｍ程度が好ま
しい。また、図示は省略するが、図１または図２の実施
例においても、パターン部分２，２の一部をレジスト抜
きしてもよいことはいうまでもない。In the case of FIG. 3, the pattern portions 2 and 2 near the pad portions 1 and 1 (width e) can be formed by removing the resist. In this way, by providing the laterally projecting portions on the pad portions 1 and 1, it is possible to secure a larger surface area of the metal portion while keeping the width of the pad portions 1 and 1 unchanged. The width e is preferably about 0.2 to 1.0 mm. Although illustration is omitted, it goes without saying that a part of the pattern portions 2 and 2 may be removed from the resist in the embodiment of FIG. 1 or FIG.

【００１９】[0019]

【発明の効果】以上説明したように、請求項１に記載の
発明では、パッド部分の形状をパターン部分側に向けて
先細り状に形成したので、パッド部分の幅を大きくする
ことなく、溶融半田を載せる金属部分の面積をより大き
く確保することができ、実装部品に対して大きな表面張
力を作用させることができ、強力なセルフアライメント
効果を得られるとともに、高い部品実装密度を得られ
る。As described above, according to the first aspect of the invention, since the shape of the pad portion is tapered toward the pattern portion side, the molten solder can be formed without increasing the width of the pad portion. It is possible to secure a larger area of the metal part on which the component is mounted, a large surface tension can be applied to the mounted component, a strong self-alignment effect can be obtained, and a high component mounting density can be obtained.

【００２０】請求項２に記載の発明では、パッド部分の
周縁部の形状を角のないなめらかな曲率に形成したの
で、溶融半田の占める面積を最大限確保することがで
き、より一層良好なセルフアライメント効果が得られ
る。According to the second aspect of the present invention, the shape of the peripheral portion of the pad portion is formed to have a smooth curvature with no corners, so that the area occupied by the molten solder can be secured to the maximum and a better self Alignment effect can be obtained.

【００２１】請求項３に記載の発明では、パッド部分を
パターン部分側に向けて一部分突出させることによっ
て、また、請求項４に記載の発明では、パターン部分の
一部をレジスト抜きすることによって、パッド部分の大
きさ（幅）を変化させずに溶融半田を載せる金属部分の
面積を広くとれ、セルフアライメント効果を向上させる
ことができ、かつチップ立ちを効果的に防ぐことができ
る。In the invention described in claim 3, the pad part is partially projected toward the pattern part side, and in the invention described in claim 4, part of the pattern part is resist-extracted. The area of the metal portion on which the molten solder is placed can be widened without changing the size (width) of the pad portion, the self-alignment effect can be improved, and chip standing can be effectively prevented.

【図面の簡単な説明】[Brief description of drawings]

【図１】本発明のプリント基板の一実施例を示す平面図
である。FIG. 1 is a plan view showing an embodiment of a printed circuit board of the present invention.

【図２】同別の実施例を示す平面図である。FIG. 2 is a plan view showing another embodiment.

【図３】同異なる実施例を示す平面図である。FIG. 3 is a plan view showing the different embodiment.

【図４】従来のプリント基板の一例を示す平面図であ
る。FIG. 4 is a plan view showing an example of a conventional printed circuit board.

【符号の説明】[Explanation of symbols]

１…パッド部分、２…パターン部分。 1 ... Pad part, 2 ... Pattern part.

───────────────────────────────────────────────────── フロントページの続き (72)発明者 香川 敏男 京都府京都市南区吉祥院宮の東町２番地 株式会社堀場製作所内 ─────────────────────────────────────────────────── ─── Continuation of the front page (72) Inventor Toshio Kagawa 2 Higashicho, Kichijoin Miya, Minami-ku, Kyoto-shi, Kyoto

Claims (4)

【特許請求の範囲】[Claims] 【請求項１】 パッド部分の形状をパターン部分側に向
けて先細り状に形成してなることを特徴とするプリント
基板。1. A printed circuit board, characterized in that the shape of a pad portion is tapered toward the pattern portion side. 【請求項２】 前記パターン部分側に向けて先細り状に
形成されるパッド部分の周縁部の形状を角のないなめら
かな曲率に形成してなることを特徴とする請求項１に記
載のプリント基板。2. The printed circuit board according to claim 1, wherein the pad portion formed in a taper shape toward the pattern portion side has a peripheral edge portion formed to have a smooth curvature without corners. . 【請求項３】 パッド部分の形状をパターン部分側に向
けて一部分突出させた横突部分を有する矩形状に形成し
てなることを特徴とするプリント基板。3. A printed circuit board, characterized in that the pad portion is formed in a rectangular shape having a laterally projecting portion which is partially projected toward the pattern portion side. 【請求項４】 パターン部分におけるパッド近傍部分を
レジスト抜きしてなることを特徴とするプリント基板。4. A printed circuit board, characterized in that the resist is removed from the portion near the pad in the pattern portion.
JP6292383A 1994-10-31 1994-10-31 Printed board Pending JPH08130362A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP6292383A JPH08130362A (en) 1994-10-31 1994-10-31 Printed board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP6292383A JPH08130362A (en) 1994-10-31 1994-10-31 Printed board

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2005068600A Division JP2005167287A (en) 2005-03-11 2005-03-11 Printed board

Publications (1)

Publication Number Publication Date
JPH08130362A true JPH08130362A (en) 1996-05-21

Family

ID=17781087

Family Applications (1)

Application Number Title Priority Date Filing Date
JP6292383A Pending JPH08130362A (en) 1994-10-31 1994-10-31 Printed board

Country Status (1)

Country Link
JP (1) JPH08130362A (en)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH10200246A (en) * 1997-01-14 1998-07-31 Nissan Motor Co Ltd Wiring circuit board
JP2001057467A (en) * 1999-08-18 2001-02-27 Sony Corp Printed wiring board
JP2001237481A (en) * 2000-02-24 2001-08-31 Citizen Electronics Co Ltd Mounting structure for laser diode and mounting method thereof
JP2003347713A (en) * 2002-05-28 2003-12-05 Toa Corp Board for electronic circuit
JP2012094768A (en) * 2010-10-28 2012-05-17 Kyocera Corp Wiring board and mounting structure with electronic component mounting on the wiring board
JP2015082328A (en) * 2013-10-21 2015-04-27 大日本印刷株式会社 Substrate for suspension, suspension, suspension having head and hard disk drive

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* Cited by examiner, † Cited by third party
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JPS57166377U (en) * 1981-04-13 1982-10-20
JPS59127266U (en) * 1983-02-15 1984-08-27 三菱電機株式会社 printed wiring board
JPH0323965U (en) * 1989-07-15 1991-03-12
JPH0485986A (en) * 1990-07-30 1992-03-18 Rohm Co Ltd Printed circuit board
JPH04114493A (en) * 1990-09-04 1992-04-15 Ibiden Co Ltd Printed wiring board

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57166377U (en) * 1981-04-13 1982-10-20
JPS59127266U (en) * 1983-02-15 1984-08-27 三菱電機株式会社 printed wiring board
JPH0323965U (en) * 1989-07-15 1991-03-12
JPH0485986A (en) * 1990-07-30 1992-03-18 Rohm Co Ltd Printed circuit board
JPH04114493A (en) * 1990-09-04 1992-04-15 Ibiden Co Ltd Printed wiring board

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH10200246A (en) * 1997-01-14 1998-07-31 Nissan Motor Co Ltd Wiring circuit board
JP2001057467A (en) * 1999-08-18 2001-02-27 Sony Corp Printed wiring board
JP2001237481A (en) * 2000-02-24 2001-08-31 Citizen Electronics Co Ltd Mounting structure for laser diode and mounting method thereof
JP2003347713A (en) * 2002-05-28 2003-12-05 Toa Corp Board for electronic circuit
JP2012094768A (en) * 2010-10-28 2012-05-17 Kyocera Corp Wiring board and mounting structure with electronic component mounting on the wiring board
JP2015082328A (en) * 2013-10-21 2015-04-27 大日本印刷株式会社 Substrate for suspension, suspension, suspension having head and hard disk drive

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