JPH08130047A - Connection structure for liquid crystal display element - Google Patents
Connection structure for liquid crystal display elementInfo
- Publication number
- JPH08130047A JPH08130047A JP6265625A JP26562594A JPH08130047A JP H08130047 A JPH08130047 A JP H08130047A JP 6265625 A JP6265625 A JP 6265625A JP 26562594 A JP26562594 A JP 26562594A JP H08130047 A JPH08130047 A JP H08130047A
- Authority
- JP
- Japan
- Prior art keywords
- liquid crystal
- crystal display
- electrode
- display element
- resin film
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/36—Assembling printed circuits with other printed circuits
- H05K3/361—Assembling flexible printed circuits with other printed circuits
Landscapes
- Coupling Device And Connection With Printed Circuit (AREA)
- Combinations Of Printed Boards (AREA)
- Liquid Crystal (AREA)
- Multi-Conductor Connections (AREA)
- Connections Effected By Soldering, Adhesion, Or Permanent Deformation (AREA)
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は、液晶表示素子に関し、
特に、液晶表示素子の外部素子へ電気的に接続する構造
に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a liquid crystal display device,
In particular, it relates to a structure for electrically connecting to an external element of a liquid crystal display element.
【０００２】[0002]
【従来の技術】液晶表示素子は比較的小さな電力で文字
や図形等の画像を簡易に表示できるため、近年パーソナ
ルコンピューターやファクシミリ等のＯＡ機器をはじめ
として、家電製品、時計等に広く使用されている。液晶
表示素子は、一般に、内面に透明電極が形成されたガラ
ス等の２枚の基板と、基板間にシール材を介して収容保
持された液晶と、から成っており、透明電極上には液晶
の分子を一定の方向に配向させるための配向膜が形成さ
れている。基板上には、更に、上述の透明電極に電圧を
供給するために基板の一端縁に向けて透明電極から引出
された引出し電極が形成されている。2. Description of the Related Art Liquid crystal display devices can easily display images such as characters and figures with a relatively small amount of electric power, and thus have been widely used in home appliances, watches and the like, including OA devices such as personal computers and facsimiles. There is. A liquid crystal display element is generally composed of two substrates such as glass having a transparent electrode formed on the inner surface thereof, and a liquid crystal housed and held between the substrates via a sealing material. An alignment film for orienting the molecules of (1) in a certain direction is formed. Further, on the substrate, there is formed a lead-out electrode led out from the transparent electrode toward one end edge of the substrate for supplying a voltage to the above-mentioned transparent electrode.
【０００３】この種の液晶表示素子の外部の電気信号源
への接続は、一般に、可撓性の樹脂フイルムの表面にＣ
ｕ等の導電体によりパターン形成された回路配線と、回
路配線の所要の箇所に電気的に接続されて搭載された駆
動用ＩＣから成る、いわゆる、ＴＣＰ（Ｔａｐｅ Ｃａ
ｒｒｉｅｒ Ｐａｃｋａｇｅ）を介して接続されてい
る。図４に示すように、ＴＣＰ２１の回路配線の一端を
液晶表示素子２２の引出し電極に電気的に接続すること
により、ＴＣＰ２１の他端側から入力された外部からの
電気信号は駆動用ＩＣ２４、出力側電極、液晶表示素子
２２の引出し電極を介してその透明電極に供給されて表
示媒体としての液晶分子を駆動している。The connection of this type of liquid crystal display element to an external electric signal source is generally C on the surface of a flexible resin film.
A so-called TCP (Tape Ca), which is composed of a circuit wiring pattern-formed by a conductor such as u and a driving IC electrically connected to and mounted at a required portion of the circuit wiring.
connected via a tier package). As shown in FIG. 4, by electrically connecting one end of the circuit wiring of the TCP 21 to the extraction electrode of the liquid crystal display element 22, an electric signal from the outside inputted from the other end side of the TCP 21 is output to the driving IC 24. The liquid crystal molecules as a display medium are driven by being supplied to the transparent electrode via the side electrode and the extraction electrode of the liquid crystal display element 22.
【０００４】他方、液晶表示素子は、近年における各種
の電子技術の発達や電子部品の小型化に伴い配線の高密
度化が進んでおり、上述の引出し電極においてもその電
極幅や電極間ピッチがますます微細化する傾向にある。
このような状況下で、１００μを超える高密度の電極間
ピッチの素子も今やめずらしくはなくなっている。On the other hand, in the liquid crystal display element, the density of wiring has been increasing with the development of various electronic technologies and the miniaturization of electronic parts in recent years. There is a tendency toward ever smaller sizes.
Under such circumstances, a device having a high inter-electrode pitch exceeding 100 μ is no longer uncommon.
【０００５】[0005]
【発明が解決しようとする課題】従来の液晶表示素子２
２とＴＣＰ２１との間の接続は、一般に、導電性の粒子
が分散された樹脂フイルムから成る異方導電性樹脂フイ
ルム（ＡＣＦ）２３を両者間に挟んだ状態で熱及び圧力
を加えることにより、液晶表示素子２２の引出し電極と
ＴＣＰ２１の出力電極間の電気的接続を導電性粒子を介
して可能にすると共に、熱によるＡＣＦ２３の硬化によ
り両者間、従って液晶表示素子２２とＴＣＰ２１との
間、の機械的な接続及び保持を可能にしている。Conventional liquid crystal display device 2
The connection between 2 and the TCP 21 is generally performed by applying heat and pressure with an anisotropic conductive resin film (ACF) 23 made of a resin film in which conductive particles are dispersed sandwiched between the two. Electrical connection between the extraction electrode of the liquid crystal display element 22 and the output electrode of the TCP 21 is made possible through the conductive particles, and the ACF 23 is cured by heat so that the two electrodes, and thus the liquid crystal display element 22 and the TCP 21 are electrically connected. It enables mechanical connection and retention.
【０００６】しかし、このような熱及び圧力を加える熱
圧着に際して、液晶表示素子２２の基板とＴＣＰ２１の
樹脂フイルムには３００℃程度に加熱された熱圧着用の
部材により押圧されるため、これらの基板や樹脂フイル
ムには熱による膨張が生じる。具体的には、一般に使用
されているガラス基板はその熱膨張率が９×１０ー6／℃
程度であり、他方、ポリイミドから形成されたＴＣＰ樹
脂フイルムの熱膨張率は２×１０ー5／℃程度であること
が知られているが、これら両者を熱圧着する場合、熱膨
張率の相違により基板上の引出し電極とＴＣＰの出力電
極との間にはそれぞれの電極間ピッチの熱膨張による位
置上のズレが発生し、電極間の接続不良の原因となる。However, during thermocompression applying such heat and pressure, the substrate of the liquid crystal display element 22 and the resin film of the TCP 21 are pressed by the thermocompression bonding member heated to about 300.degree. The substrate and the resin film are expanded by heat. Specifically, a glass substrate that is generally used has a coefficient of thermal expansion of 9 × 10 −6 / ° C.
On the other hand, it is known that the thermal expansion coefficient of the TCP resin film formed of polyimide is about 2 × 10 −5 / ° C., but when the two are thermocompression bonded, the thermal expansion coefficient is different. As a result, a positional shift occurs between the lead-out electrode on the substrate and the output electrode of the TCP due to thermal expansion of the pitch between the electrodes, which causes connection failure between the electrodes.
【０００７】このような熱膨張に起因する電極間ピッチ
のズレによる接続不良を回避するために、従来では、基
板の引出し電極やＴＣＰの出力電極を設計または形成す
る際に、その都度、予め予測される熱膨張率若しくはズ
レ量を考慮してこれらの引出し電極や出力電極を設けな
ければならず、製造工程を煩雑なものにしていた。従っ
て、本発明はの目的は、液晶表示素子の接続構造におい
て簡易な手段により電極間の接続の信頼性の確実化を図
ることである。In order to avoid the connection failure due to the displacement of the inter-electrode pitch due to such thermal expansion, conventionally, when designing or forming the extraction electrode of the substrate or the output electrode of the TCP, it is predicted in advance each time. These extraction electrodes and output electrodes must be provided in consideration of the coefficient of thermal expansion or the amount of deviation, which complicates the manufacturing process. Therefore, an object of the present invention is to ensure the reliability of the connection between the electrodes by a simple means in the connection structure of the liquid crystal display element.
【０００８】[0008]
【課題を解決するための手段】上記課題を達成するた
め、本発明によれば、内面に透明電極が形成され対向配
置された基板と、基板間に収容された液晶と、透明電極
から基板の一端側に引出されされた引出し電極とを備え
た液晶表示素子と、樹脂フイルム上に引出し電極に電気
的に接続可能に設けられた出力電極を有する接続素子
と、から成り、樹脂フイルム上には前記出力電極に直行
する方向に金属パターンが設けられていることを特徴と
する液晶表示素子の接続構造が提供される。In order to achieve the above object, according to the present invention, a substrate having transparent electrodes formed on its inner surface and arranged to face each other, a liquid crystal housed between the substrates, and the transparent electrode to the substrate. A liquid crystal display element having a lead-out electrode pulled out to one end side, and a connecting element having an output electrode electrically connectable to the lead-out electrode on the resin film, and a resin film on the resin film. A connection structure of a liquid crystal display device is provided, wherein a metal pattern is provided in a direction perpendicular to the output electrode.
【０００９】[0009]
【作用および効果】液晶表示素子の基板と接続素子との
間の熱圧着に際して、液晶表示素子の下側基板とＴＣＰ
の樹脂フイルムは高温に加熱された熱圧着部材により押
圧状態で熱が加えられるため、これらの基板や樹脂フイ
ルムにはそれぞれの熱膨張率に応じて熱膨張を発生させ
る内部応力が発生する。しかし、接続素子の樹脂フイル
ム上に出力電極に直行する方向に金属パターンが設けら
られているので、これが樹脂フイルムの熱膨張を阻止す
るように作用し、両者の熱膨張による伸びの差異を減少
させる。[Operation and effect] When thermocompression bonding between the substrate of the liquid crystal display element and the connection element, the lower substrate of the liquid crystal display element and the TCP
Since the resin film is heated by the thermocompression-bonding member heated to a high temperature in a pressed state, internal stress that causes thermal expansion is generated in these substrates and the resin film according to their respective thermal expansion coefficients. However, since a metal pattern is provided on the resin film of the connecting element in a direction perpendicular to the output electrode, this acts to prevent thermal expansion of the resin film, reducing the difference in elongation due to thermal expansion of the two. Let
【００１０】従って、液晶表示素子とＴＣＰとの間を熱
圧着により接続させるに際しても、両者の接続部におけ
る熱膨張による伸びの差異が減少されるので、従来のよ
うな熱膨張に起因する接続不良のような問題を簡易な手
段により有効に防止することができる。Therefore, even when the liquid crystal display element and the TCP are connected by thermocompression bonding, the difference in elongation due to the thermal expansion at the connection portion between the two is reduced, so that the conventional connection failure due to the thermal expansion is caused. Such a problem can be effectively prevented by a simple means.
【００１１】[0011]
【実施例】次に、本発明による液晶表示素子の配線構造
について実施例に従い図面を参照しながら詳細に説明す
る。図１は、本発明の実施例による液晶表示素子の接続
構造の要部の断面を示し、液晶表示素子１は、内表面に
ＩＴＯから成る図示しない複数の帯状の透明電極が平行
に形成されたガラスの上側及び下側の基板２ａ、２ｂ
と、これらの基板２ａ、２ｂ間の外周縁に沿うように形
成されたシール部材３と、シール材３により画成された
基板間の内部に収容された表示媒体としての液晶４と、
から成っている。上側基板２ａ上の透明電極は図１の紙
面に対して直角な方向に延びるように形成され、他方、
下側基板２ｂ上の透明電極は同図中左右方向に延びるよ
うに形成されると共に、下側基板２ｂの透明電極はシー
ル材３に対して外方に延在する基板の端辺に向けて引出
された図示しない引出し電極が形成されている。Next, a wiring structure of a liquid crystal display device according to the present invention will be described in detail according to embodiments with reference to the drawings. FIG. 1 shows a cross section of a main part of a connection structure of a liquid crystal display element according to an embodiment of the present invention. In the liquid crystal display element 1, a plurality of strip-shaped transparent electrodes (not shown) made of ITO are formed in parallel on the inner surface. Substrates 2a, 2b above and below the glass
A sealing member 3 formed along the outer peripheral edge between the substrates 2a and 2b, and a liquid crystal 4 as a display medium housed inside the substrate defined by the sealing material 3.
Made of. The transparent electrode on the upper substrate 2a is formed so as to extend in a direction perpendicular to the paper surface of FIG.
The transparent electrodes on the lower substrate 2b are formed so as to extend in the left-right direction in the figure, and the transparent electrodes on the lower substrate 2b are directed toward the edges of the substrate extending outward with respect to the sealing material 3. A drawn-out extraction electrode (not shown) is formed.
【００１２】他方、液晶表示素子１の下側基板２ｂは、
外部からの電気信号源等に電気的に接続可能とするため
の接続素子としてのテープキャリアパッケージ（ＴＣ
Ｐ）５に接続されている。このＴＣＰ５は、図２に示す
ように、ポリイミドから成る樹脂フイルム６と、樹脂フ
イルム６上にＣｕ等の導電体により平行状に形成された
複数の出力側電極７とこれと反対の側に形成された複数
の入力側電極８と、これらの両電極７及び８間に搭載さ
れた駆動用ＩＣ９と、から成っている。出力側及び入力
側の電極７、８は樹脂フイルム６上に形成された図示し
ない配線パターンを介して駆動用ＩＣに電気的に接続さ
れ、入力側電極８を介して入力された外部からの電気信
号は駆動用ＩＣにより信号処理を施された後、出力側電
極７、を介して液晶表示素子１の引出し電極供給され
る。On the other hand, the lower substrate 2b of the liquid crystal display element 1 is
A tape carrier package (TC) as a connecting element for electrically connecting to an external electric signal source or the like.
P) 5. As shown in FIG. 2, the TCP 5 is formed on a resin film 6 made of polyimide, a plurality of output electrodes 7 formed in parallel on the resin film 6 by a conductor such as Cu, and the opposite side. The plurality of input side electrodes 8 and the driving IC 9 mounted between the electrodes 7 and 8 are provided. The electrodes 7 and 8 on the output side and the input side are electrically connected to the driving IC via a wiring pattern (not shown) formed on the resin film 6, and electricity from the outside input via the electrode 8 on the input side. The signal is subjected to signal processing by the driving IC and then supplied to the extraction electrode of the liquid crystal display element 1 via the output side electrode 7.
【００１３】液晶表示素子１とＴＣＰ５との間の接続
は、図３に示すように、液晶表示素子の引出し電極１２
がＴＣＰの樹脂フイルム６上のの出力側電極７に重なる
ように位置決めした状態で異方性導電樹脂（ＡＣＦ）１
１を両者間に挟んで下側基板２ｂと樹脂フイルム６側か
ら図示しない熱圧着部材により圧力を加えた状態で加熱
がされる。ＡＣＦ１１は導電性の粒子が分散された、例
えば熱硬化性の、フイルム状樹脂から成るもので、液晶
表示素子１の引出し電極とＴＣＰ５の出力側電極７との
間に挿入した状態で下側基板２ｂとＴＣＰ５が密着する
ように加圧しながら加熱することにより、引出し電極と
出力側電極７の対応するもの同士間に電気的接続を付与
すると共に液晶表示素子１とＴＣＰ５とを機械的に接続
保持を可能ならしめている。The connection between the liquid crystal display element 1 and the TCP 5 is, as shown in FIG. 3, a lead electrode 12 of the liquid crystal display element.
Of the anisotropic conductive resin (ACF) 1 in a state of being positioned so as to overlap the output side electrode 7 on the resin film 6 of TCP.
1 is sandwiched between the two, and the lower substrate 2b and the resin film 6 are heated while pressure is applied thereto by a thermocompression bonding member (not shown). The ACF 11 is made of, for example, a thermosetting film resin in which conductive particles are dispersed, and is a lower substrate in a state of being inserted between the extraction electrode of the liquid crystal display element 1 and the output side electrode 7 of the TCP 5. By heating while pressurizing so that the 2b and the TCP 5 come into close contact with each other, electrical connection is provided between the corresponding ones of the extraction electrode and the output side electrode 7, and the liquid crystal display element 1 and the TCP 5 are mechanically connected and held. Is possible.
【００１４】ここでＴＣＰ５には、図２に最良に示すよ
うに、樹脂フイルム６上の出力側電極７が設けられた側
の端辺に沿って出力側電極７と直行する方向に、金属に
より形成された金属パターン１０が形成されている。こ
の金属パターン１０は、表面にＣｕの箔が形成された樹
脂フイルム６からエッチングにより、例えば、０．３乃
至１ｍｍのパターン幅で約１／２オンスの断面寸法で形
成できる。このようなエッチングによる形成に代えて、
一定幅に形成された線状のＣｕを樹脂フイルム上に貼着
して設けてもよい。Here, as best shown in FIG. 2, the TCP 5 is made of metal in a direction perpendicular to the output side electrode 7 along an edge of the resin film 6 on which the output side electrode 7 is provided. The formed metal pattern 10 is formed. The metal pattern 10 can be formed from a resin film 6 having a Cu foil formed on the surface thereof by etching, for example, with a pattern width of 0.3 to 1 mm and a sectional size of about 1/2 ounce. Instead of forming by such etching,
The linear Cu formed to have a constant width may be attached and provided on the resin film.
【００１５】上述した熱圧着に際して、液晶表示素子の
下側基板２ｂとＴＣＰ５の樹脂フイルム６は約３００℃
程度に加熱された熱圧着部材により押圧状態で熱が加え
られるため、これらの下側基板２ｂや樹脂フイルム６に
はそれぞれの熱膨張率、即ち下側基板２ｂについて熱膨
張率約９×１０ー6／℃及びポリイミド製樹脂フイルム６
について熱膨張率約２×１０ー5／℃、に応じて熱膨張が
生じるようにそれぞれの内部に応力が発生するのだが、
樹脂フイルム６上には金属パターン１０が設けられてい
るのでこれが樹脂フイルム６の熱膨張を阻止するように
作用し、両者の熱膨張による伸びの差異を減少させる。At the time of the above-mentioned thermocompression bonding, the lower substrate 2b of the liquid crystal display element and the resin film 6 of the TCP 5 are about 300.degree.
Because heat is applied in a pressed state by thermocompression member heated to a degree, their respective thermal expansion coefficients in the lower substrate 2b and the resin film 6, i.e., the thermal expansion coefficient of about 9 × 10 over the lower substrate 2b 6 / ° C and polyimide resin film 6
About the thermal expansion coefficient of about 2 × 10 -5 / ° C, stress is generated inside each of them so that the thermal expansion occurs.
Since the metal pattern 10 is provided on the resin film 6, this acts to prevent thermal expansion of the resin film 6 and reduces the difference in elongation due to the thermal expansion of the two.
【００１６】このため、本発明の接続構造によれば、液
晶表示素子とＴＣＰとの間を熱圧着により接続させるに
際しても、両者の接続部における熱膨張による伸びの差
異が減少されるので、従来のような熱膨張に起因する接
続不良のような問題を簡易な手段により有効に防止する
ことができる。上述の実施例では、金属パターン１０を
樹脂フイルム６の出力側電極７側の端辺に沿うように設
けた例を示したが、本発明はこれに限定されることな
く、金属パターンを間に絶縁材としての、例えば、ホト
レジストの層を介在させて出力側電極上に設けるように
構成することもできる。この場合も、金属パターンは、
やはり、出力側電極の側の端辺に沿うように、即ちこれ
らの電極に直行するように、形成すればよい。Therefore, according to the connection structure of the present invention, even when the liquid crystal display element and the TCP are connected by thermocompression bonding, the difference in elongation due to the thermal expansion in the connection portion between the two is reduced, and thus the conventional structure is adopted. Problems such as poor connection due to thermal expansion can be effectively prevented by simple means. In the above-described embodiment, the example in which the metal pattern 10 is provided along the end side of the resin film 6 on the output side electrode 7 side is shown, but the present invention is not limited to this, and the metal pattern may be provided between them. For example, a layer of photoresist, which is an insulating material, may be provided on the output-side electrode with an intervening layer. Again, the metal pattern is
After all, it may be formed so as to be along the end side on the output side electrode side, that is, so as to be orthogonal to these electrodes.
【図１】本発明の接続構造の要部を示す断面図である。FIG. 1 is a cross-sectional view showing a main part of a connection structure of the present invention.
【図２】図１のＴＣＰの構成を示す平面図である。FIG. 2 is a plan view showing a configuration of TCP of FIG.
【図３】熱圧着が施される部分の要部拡大断面図であ
る。FIG. 3 is an enlarged cross-sectional view of a main part of a portion to which thermocompression bonding is applied.
【図４】従来の液晶表示素子のＴＣＰとの接続を示す側
面図である。FIG. 4 is a side view showing a connection of a conventional liquid crystal display element with a TCP.
１ 液晶表示素子 ２ａ 上側き基板 ２ｂ 下側基板 ４ 液晶 ５ ＴＣＰ ６ 樹脂フイルム ７ 出力側電極 ８ 入力側電極 ９ 駆動用ＩＣ １０ 金属パターン １１ ＡＣＦ １２ 引出し電極 1 Liquid Crystal Display Element 2a Upper Substrate 2b Lower Substrate 4 Liquid Crystal 5 TCP 6 Resin Film 7 Output Side Electrode 8 Input Side Electrode 9 Driving IC 10 Metal Pattern 11 ACF 12 Extraction Electrode
─────────────────────────────────────────────────────
─────────────────────────────────────────────────── ───
【手続補正書】[Procedure amendment]
【提出日】平成６年１２月１６日[Submission date] December 16, 1994
【手続補正１】[Procedure Amendment 1]
【補正対象書類名】明細書[Document name to be amended] Statement
【補正対象項目名】００１１[Correction target item name] 0011
【補正方法】変更[Correction method] Change
【補正内容】[Correction content]
【００１１】[0011]
【実施例】次に、本発明による液晶表示素子の配線構造
について実施例に従い図面を参照しながら詳細に説明す
る。図１は、本発明の実施例による液晶表示素子の配線
構造の要部の断面を示し、液晶表示素子１は、内表面に
ＩＴＯから成る図示しない複数の帯状の透明電極が平行
に形成されたガラスの上側及び下側の基板２ａ、２ｂ
と、これらの基板２ａ、２ｂ間の外周縁に沿うように形
成されたシール部材３と、シール部材３により画成され
た基板間の内部に収容された表示媒体としての液晶４
と、から成っている。Next, a wiring structure of a liquid crystal display device according to the present invention will be described in detail according to embodiments with reference to the drawings. FIG. 1 shows a cross section of a main part of a wiring structure of a liquid crystal display element according to an embodiment of the present invention. In the liquid crystal display element 1, a plurality of strip-shaped transparent electrodes (not shown) made of ITO are formed in parallel on the inner surface. Substrates 2a, 2b above and below the glass
And a sealing member 3 formed along the outer peripheral edge between the substrates 2a and 2b, and a liquid crystal 4 as a display medium housed inside the substrate defined by the sealing member 3.
It consists of
【手続補正２】[Procedure Amendment 2]
【補正対象書類名】明細書[Document name to be amended] Statement
【補正対象項目名】００１２[Correction target item name] 0012
【補正方法】変更[Correction method] Change
【補正内容】[Correction content]
【００１２】上側基板２ａ及び下側基板２ｂの引出し電
極は、外部からの電気信号源等に電気的に接続可能とす
るための接続素子としてのテープキャリアパッケージ
（ＴＣＰ）５に接続されている。このＴＣＰ５は、図２
に示すように、ポリイミドから成る樹脂フイルム６と、
樹脂フイルム６上にＣｕ等の導電体により平行状に形成
された複数の出力側電極７とこれと反対の側に形成され
た複数の入力側電極８と、これらの両電極７及び８間に
搭載された駆動用ＩＣ９と、から成っている。出力側及
び入力側の電極７、８は樹脂フイルム６上に形成された
図示しない配線パターンを介して駆動用ＩＣに電気的に
接続され、入力側電極８を介して入力された外部からの
電気信号は駆動用ＩＣにより信号処理を施された後、出
力側電極７を介して液晶表示素子１の引出し電極に供給
される。The lead-out electrodes of the upper substrate 2a and the lower substrate 2b are connected to a tape carrier package (TCP) 5 as a connecting element for electrically connecting to an external electric signal source or the like. This TCP5 is shown in FIG.
As shown in, a resin film 6 made of polyimide,
A plurality of output side electrodes 7 formed in parallel on the resin film 6 by a conductor such as Cu, a plurality of input side electrodes 8 formed on the opposite side, and between these two electrodes 7 and 8 It is composed of a driving IC 9 mounted thereon. The electrodes 7 and 8 on the output side and the input side are electrically connected to the driving IC via a wiring pattern (not shown) formed on the resin film 6, and electricity from the outside input via the electrode 8 on the input side. The signal is subjected to signal processing by the driving IC and then supplied to the extraction electrode of the liquid crystal display element 1 via the output side electrode 7.
【手続補正３】[Procedure 3]
【補正対象書類名】明細書[Document name to be amended] Statement
【補正対象項目名】００１３[Correction target item name] 0013
【補正方法】変更[Correction method] Change
【補正内容】[Correction content]
【００１３】液晶表示素子１とＴＣＰ５との間の接続
は、図３に示すように、液晶表示素子の引出し電極１２
がＴＣＰの樹脂フイルム６上の出力側電極７に重なるよ
うに位置決めした状態で異方性導電樹脂（ＡＣＦ）１１
を両者間に挟んで下側基板２ｂと樹脂フイルム６側から
図示しない熱圧着部材により圧力を加えた状態で加熱が
される。ＡＣＦ１１は導電性の粒子が分散された、例え
ば熱硬化性の、フイルム状樹脂から成るもので、液晶表
示素子１の引出し電極とＴＣＰ５の出力側電極７との間
に介在させた状態で下側基板２ｂとＴＣＰ５が密着する
ように加圧しながら加熱することにより、引出し電極と
出力側電極７の対応するもの同士間に電気的接続を付与
すると共に液晶表示素子１とＴＣＰ５とを機械的に接続
保持を可能ならしめている。The connection between the liquid crystal display element 1 and the TCP 5 is, as shown in FIG. 3, a lead electrode 12 of the liquid crystal display element.
Of the anisotropic conductive resin (ACF) 11 in a state of being positioned so as to overlap the output side electrode 7 on the TCP resin film 6
Is sandwiched between the two and is heated from the lower substrate 2b and the resin film 6 side under a pressure applied by a thermocompression bonding member (not shown). The ACF 11 is made of, for example, a thermosetting film resin in which conductive particles are dispersed. The ACF 11 is located below the extraction electrode of the liquid crystal display element 1 and the output side electrode 7 of the TCP 5 and is located on the lower side. By heating while pressurizing so that the substrate 2b and the TCP 5 come into close contact with each other, electrical connection is provided between the corresponding ones of the extraction electrode and the output side electrode 7, and the liquid crystal display element 1 and the TCP 5 are mechanically connected. If it is possible to hold.
【手続補正４】[Procedure amendment 4]
【補正対象書類名】明細書[Document name to be amended] Statement
【補正対象項目名】００１４[Correction target item name] 0014
【補正方法】変更[Correction method] Change
【補正内容】[Correction content]
【００１４】ここで、ＴＣＰ５には、図２に最良に示す
ように、樹脂フイルム６上の出力側電極７が設けられた
側の端辺に沿って出力側電極７と直行する方向に、金属
により形成された金属パターン１０が形成されている。
この金属パターン１０は、表面にＣｕの箔が形成された
樹脂フイルム６からエッチングにより、例えば、０．３
乃至１ｍｍのパターン幅で約１／２〜１オンスの断面寸
法で形成できる。このようなエッチングによる形成に代
えて、一定幅に形成された線状のＣｕを樹脂フイルム上
に貼着して設けてもよい。Here, in the TCP 5, as best shown in FIG. 2, a metal is formed in a direction perpendicular to the output side electrode 7 along an edge of the resin film 6 on which the output side electrode 7 is provided. The metal pattern 10 formed by is formed.
The metal pattern 10 is formed, for example, by etching from a resin film 6 having a Cu foil formed on the surface by etching.
It can be formed with a pattern width of 1 to 1 mm and a cross-sectional dimension of about 1/2 to 1 ounce. Instead of such formation by etching, linear Cu formed to have a constant width may be attached and provided on the resin film.
Claims (1)
基板と、前記基板間に収容された液晶と、前記透明電極
から前記基板の一端側に引出されされた引出し電極とを
備えた液晶表示素子と、樹脂フイルム上に前記引き出し
電極に電気的に接続可能に設けられた出力側電極を有す
る接続素子と、から成り、前記樹脂フイルム上には前記
出力側電極に直行する方向に金属パターンが設けられて
いることを特徴とする液晶表示素子の接続構造。1. A liquid crystal comprising a substrate having a transparent electrode formed on an inner surface thereof and facing each other, a liquid crystal housed between the substrates, and a lead-out electrode led out from the transparent electrode to one end side of the substrate. A display element and a connecting element having an output side electrode provided on the resin film so as to be electrically connectable to the extraction electrode, and a metal pattern on the resin film in a direction perpendicular to the output side electrode. A connection structure for a liquid crystal display device, wherein:
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6265625A JP2804894B2 (en) | 1994-10-28 | 1994-10-28 | Connection structure of liquid crystal display element |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6265625A JP2804894B2 (en) | 1994-10-28 | 1994-10-28 | Connection structure of liquid crystal display element |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH08130047A true JPH08130047A (en) | 1996-05-21 |
| JP2804894B2 JP2804894B2 (en) | 1998-09-30 |
Family
ID=17419737
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6265625A Expired - Fee Related JP2804894B2 (en) | 1994-10-28 | 1994-10-28 | Connection structure of liquid crystal display element |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2804894B2 (en) |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5750025A (en) * | 1980-09-10 | 1982-03-24 | Yamatake Honeywell Co Ltd | Temperature and humidity controller |
| JPS61183880A (en) * | 1985-02-08 | 1986-08-16 | 沖電気工業株式会社 | Thermo compression bonding connection between flexible substrate and other substrates or the like |
-
1994
- 1994-10-28 JP JP6265625A patent/JP2804894B2/en not_active Expired - Fee Related
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5750025A (en) * | 1980-09-10 | 1982-03-24 | Yamatake Honeywell Co Ltd | Temperature and humidity controller |
| JPS61183880A (en) * | 1985-02-08 | 1986-08-16 | 沖電気工業株式会社 | Thermo compression bonding connection between flexible substrate and other substrates or the like |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2804894B2 (en) | 1998-09-30 |
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