JPH08129570A - Automatic arranging and wiring device - Google Patents

Abstract

PURPOSE: To perform a layout operation so that the origin of a contact cell meets a grid. CONSTITUTION: Center lines AC and BC are the center lines of wires extending in both different wire layers and the paths of the wires are so determined as to passing the grid G. The contact cell CC which connects the wires in the different wire layers is installed so that the center point CP is on the grid at the intersection of the center line AC and center line BC. At this time, when at least one side of the contract cell CC is an odd multiple of a grid interval (g), the origin GP shifts from the grid G. The contact cell CC whose at least one side is an odd multiple of the grid interval (g) is so moved and corrected that the origin GP meets a nearby grid G. The layout result where the origin GP of the contact cell CC meets the grid G is obtained without manual movement and correction.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an automatic placement and routing apparatus for automatically designing a layout of a semiconductor device such as an LSI.

[0002]

2. Description of the Related Art An automatic placement and routing apparatus is an apparatus for automatically performing a layout design of a semiconductor device such as an LSI (Large Scale Integrated Circuit), that is, a work of creating a layout drawing of a desired circuit. FIG. 31 is a block diagram showing the configuration of a conventional automatic placement and routing apparatus for designing the layout of a logic circuit. The automatic placement and routing apparatus 600 includes a placement unit 1, a wiring unit 4, and a compaction unit 5. The automatic placement and routing apparatus 600 includes a netlist 2,
With reference to the layout cell data 3, the contact rule 20, and the design rule 6, the layout work is performed and the layout data 7 is output. The layout data 7 is data representing a layout drawing and is substantially equivalent to the layout drawing.

A netlist 2 and layout cell data 3 are attached to the placement unit 1. Netlist 2 is
It is data extracted from a logic circuit diagram expressing a desired logic circuit to be laid out. In the logic schematic,
A logic circuit is represented as a combination of structural units (functional elements) having a predetermined logic operation function called a logic block. For example, logic gate elements, aggregates thereof, flip-flops, counters, etc. are treated as logic blocks.

FIG. 32 shows an example of a logic circuit diagram of a logic circuit to be laid out. The logic circuit diagram 610 of FIG.
Then, the logic circuits are logic blocks (functional elements) BL1 to B.
It is expressed by a combination of L3, and the connection relationship between these input pins and output pins is expressed by wirings W1 to W6. The netlist 2 obtained by extracting from the logic circuit diagram 610 shows the types of the logic blocks BL1 to BL3 forming the logic circuit and the connection relationships of the logic blocks BL1 to BL3 represented by the wirings W1 to W6. Describe.

On the other hand, the layout cell data 3 contains layout information regarding the structure of a layout cell which is a counterpart of each logic block on the layout drawing (in other words, a layout image of each logic block), that is, the shape of each layout cell, / The position of the output pin and the like are described.

FIG. 33 is a schematic diagram showing the result of the work performed by the placement unit 1 and the wiring unit 4 when the logic circuit shown in FIG. 32 is the layout target. The arranging unit 1 determines each logical block BL1 described by the netlist 2.
Based on the types of BL3 to BL3 and their connection relationships, the layout cells LC1 to LC3 corresponding to each of the logic blocks BL1 to BL3 are selected from the layout cells prepared by the layout cell data 3 to obtain an image (that is, a virtual cell). ) In the layout area 620. Note that in FIG. 33, the layout cells LC1 to LC1
LC3 is represented by the symbols of the logic blocks BL1 to BL3.

The arranging unit 1 previously generates a large number of rectangular or arbitrary-shaped arranging regions LR (shown by dotted lines in FIG. 33) in the layout region 620, and then arranges layout cells LC1 to LC3 in the arranging region LR. It is arranged appropriately.

The wiring unit 4 arranges the layout cells LC1 to LC3 determined by the arranging unit 1 as shown in FIG.
The wirings W1 to W6 are arranged with reference to FIG. That is,
Input of the layout cells LC1 to LC3 already arranged,
Layout cell data 3 for information about output pin positions
And the information regarding the connection relationship of the layout cells LC1 to LC3 from the netlist 2, the routes of the wirings W1 to W6 are determined on the layout area 620.

The wiring section 4 determines the paths of the wirings W1 to W6 and the widths of the wirings.
The interval from W6 to W6 is determined by the compaction unit 5 described later. When the path of one wiring is determined to extend over different wiring layers, contact holes for connecting between different layers must be provided. In the contact rule 20, the shape of the contact cell, which is the layout image of the contact hole, is described in advance. And the wiring section 4
According to the contact rule 20, the contact cells are arranged in the paths of the wirings W1 to W6 as required.

Since the width of the wiring is usually different for each layer,
In the contact rule 20, contact cells having different shapes are prepared for each contact cell that connects different layers. Further, the contact rule 20 further describes the size of the grid interval which is a unit of the size of the contact cell and other various layout cells.
The grid is a reference point for a layout arranged in a matrix in the layout area, and various layout cells and wirings are laid out on this grid. The dimensions of various layout cells are given in the layout cell data 3 and the contact rule 20 as integral multiples of the grid spacing.

The compaction section 5 refers to the netlist 2, the layout cell data 3, and the design rule 6 for the routes of the wirings W1 to W6 determined by the wiring section 4 and refers to the actual wirings of the wirings W1 to W6. I do. The design rule 6 describes design rules relating to the minimum wiring width, minimum spacing, and the like.

The compaction section 5 obtains information on the wiring layers and wiring prohibited areas of the already arranged layout cells LC1 to LC3 from the layout cell data 3, and the design rule from the design rule 6. Then, the layout of the wirings W1 to W6 is completed, and the layout data 7 is output. At this time, the intervals between the wirings W1 to W6 are also determined. The layout of the target circuit is completed by obtaining the layout data 7. In the subsequent process, the layout data 7 is used to generate a required diffusion pattern or the like.

[0013]

By the way, in the conventional automatic placement and routing apparatus 600, when the contact cells are placed, the contact cells are arranged at the points where the center lines (center lines) of the wirings on the respective layers intersect. The contact cells were arranged so that the centers of the cells coincided with each other. FIG. 34
[Fig. 6] is an operation explanatory view explaining this operation. As shown in FIG. 34, the contact cell CC has a hole image HI and a land image LI. The contact cell CC includes a wiring AW on the layer A and a wiring B on the layer B.
It is arranged at a position where W and W intersect.

The wirings AW and BW are arranged such that their center lines AC and BC are located on the grid G. Then, the contact cell CC has these center lines A
On the grid G where C and BC intersect, the center points CP thereof are arranged to coincide with each other. As a result, as illustrated in FIG. 34, when the size of the contact cell CC, that is, the length of one side is an odd multiple of the grid spacing (in FIG. 34, an example of 3 times is shown), the four corners of the contact cell CC are Origin GP of contact cell CC defined as one
Is located off the grid G.

However, the origin GP functions as a reference point for designating the position of the contact cell CC, and the origin GP is used to generate a diffusion pattern or the like by using the layout data 7 in the post-layout process.
Must exist above. Therefore, in the layout data 7, it is necessary to manually correct the origin GP deviated from the grid G onto the nearest grid G.

Further, in the automatic placement and routing apparatus 600, when arranging the contact cells CC, the arranging is ignored. 35 to 37 are operation explanatory views for explaining this operation. As shown in FIG. 35, the contact cell CC that connects layers having different wiring widths is
It has a rectangular shape in which the lengths of two adjacent sides are different. Fig. 36
As shown in, when the width of the wiring AW is smaller than that of the wiring BW between the wirings AW and BW arranged in the layers A and B to be connected, the short side of the contact cell CC is the wiring. It must be installed so that the AW faces the long side and the long side faces the wiring BW.

However, the conventional automatic placement and routing apparatus 6
In 00, since the arrangement was performed without considering the directivity of the contact cell CC, as shown in FIG.
It was sometimes placed in the wrong direction. Therefore, in the layout data 7, it has been necessary to manually correct the contact cells CC arranged as shown in FIG. 37 so as to be correctly arranged as shown in FIG.

Further, in the automatic placement and routing apparatus 600, the contact cell CC having the overhanging portion corresponding to the miniaturization process is also placed by ignoring its directionality. Generally, when a circuit to be laid out is built in a semiconductor device by a semiconductor process, arc-shaped thinning occurs at edge portions of various layout cells and wirings (this phenomenon is called "rounding"). When the semiconductor device is miniaturized by using the miniaturization process, the thinning that occurs in the land image LI of the contact cell CC due to this “rounding” cannot be ignored.

Therefore, when the layout data 7 corresponding to the miniaturization process is created, the contact rule CC is prepared with the contact cells CC provided with the extending portions PA and PB in two directions as shown in FIG. . The overhang portions PA and PB are overhang portions in the two layers A and B to which the contact cell CC should be connected, respectively. Contact cell CC having these overhang portions PA and PB
Must be arranged so that the projecting portion PA is located on the opposite side of the wiring AW and the projecting portion PB is located on the opposite side of the wiring BW, as shown in FIG.

However, the conventional automatic placement and routing apparatus 600
Then, since the arrangement was performed without considering the directionality of the contact cells CC, the directionality might be arranged incorrectly as shown in FIG. Therefore, in the layout data 7, it has been necessary to manually correct the contact cells CC arranged as shown in FIG. 40 to be correctly arranged as shown in FIG.

Further, in the conventional automatic placement and routing apparatus 600, the wiring interval defined in the design rule 6 is only one for each layer. However, in the actual layout design, it may be necessary to dispose a wiring having a larger wiring width than the standard wiring prepared by the design rule 6, and in the vicinity of this wide wiring, a standard wiring may be provided. It is necessary to set a wiring interval larger than a certain wiring interval. In the conventional automatic placement and routing apparatus 600, such a wiring width and a wiring interval are not prepared, so that the layout data 7 requires manual work to correct them.

Further, in the conventional automatic placement and routing apparatus 600, wiring is performed so that the wiring length is as short as possible. For this reason, in a semiconductor device prototyped or manufactured based on the layout data 7, crosstalk noise which cannot be ignored may occur between wirings.
In order to avoid the crosstalk noise, the manual work of modifying the wiring of the layout data 7 is required.

As described above, in the conventional automatic placement and routing apparatus, in order to obtain correct layout data or to obtain layout data for realizing a high quality semiconductor device, the layout data generated by the automatic placement and routing apparatus is used. There was a problem that it was necessary to make manual corrections.

The present invention has been made in order to solve the above-mentioned problems in the conventional device, and is an automatic generation of correct layout data and layout data for realizing a high quality semiconductor device without manual correction. An object is to provide a placement and routing device.

[0025]

An automatic placement and routing apparatus according to a first aspect of the present invention is an automatic placement and routing apparatus for laying out a layout target circuit, comprising wiring means for arranging wirings of the layout target circuit over a plurality of wiring layers. A contact cell arranging means for arranging a contact cell connecting these wirings in a portion where the wirings arranged over different wiring layers overlap each other, and a contact cell arranged by the contact cell arranging means And a contact cell arrangement correcting means for correcting the arrangement so that the given predetermined condition is satisfied.

The automatic placement and routing device of the second invention is the device of the first invention, wherein the wiring means arranges the wiring so that the center line of the wiring is arranged on a regularly arranged grid. The contact cell arranging means arranges the contact cell such that the centers of the contact cells overlap with each other at a portion where the center lines of the wirings to be connected intersect, and the contact cell arranging means arranges the contact cell With respect to the arranged contact cells,
It is characterized in that the contact cell is moved so that the origin attached to the contact cell and functioning as a reference point for specifying the position coincides with the nearest grid.

The automatic placement and routing apparatus of the third invention is the apparatus of the second invention, wherein the grids are arranged in a matrix, the contact cells are rectangular and the length of each side is It is an integral multiple of the grid interval, and its origin is defined by one of the four corners of the rectangle, and the contact cell arrangement correcting means is such that the length of any side is an odd multiple of the grid interval. It is characterized in that a certain contact cell is searched and the contact cell found by the search is moved so that its origin coincides with the nearest grid.

In the automatic placement and routing apparatus of the fourth invention, in the apparatus of the first invention, a direction facing each wiring to be connected is designated in the contact cell, and the contact cell placement correcting means is provided. The orientation of the contact cell is changed so that each wiring faces in the direction specified by the contact cell.

The automatic placement and routing apparatus of the fifth invention is the automatic placement and routing apparatus of the fourth invention, wherein the wiring means arranges the wiring so that the center line of the wiring is along a grid arranged in a matrix. , The contact cell arrangement correcting means,
The contact cell is rotated by 90 ° until each wiring to be connected to the contact cell faces in a direction specified by the contact cell.

In the automatic placement and routing apparatus of the sixth invention, in the apparatus of the fifth invention, even if the contact cell is rotated three times, each wiring to be connected by the contact cell is designated as the contact cell. It is characterized by further comprising wiring direction changing means for changing at least one direction of these wirings by 90 ° around the contact cell when the wirings do not face in the same direction as described above.

In the automatic placement and routing apparatus of the seventh invention, in the apparatus of the fourth invention, wirings to be connected by the contact cells intersect each other at an angle that cannot match the direction designated for the contact cells. In this case, the wiring direction changing means for changing at least one direction of these wirings in the vicinity of the contact cell is further provided.

An eighth aspect of the invention is an automatic placement and routing apparatus according to the fourth aspect of the invention, wherein the contact cell has an overhanging portion on the side opposite to the designated direction.

An automatic placement and routing apparatus according to a ninth aspect of the present invention is an automatic placement and routing apparatus for laying out a layout target circuit, wherein wiring means for determining a wiring route and width of the layout target circuit, and the wiring means. In the wiring
Wide wiring search means for searching for wide wiring that is wider than a predetermined reference value, wiring spacing between wide wiring and standard wiring other than that, and wiring spacing between wide wiring are different for each wiring. And a compaction means for executing the layout of the wide wiring and the standard wiring so that the predetermined value is given to the standard wiring.

The automatic placement and routing apparatus according to the tenth aspect of the invention is the ninth aspect.
In the device of the invention described above, the wiring means determines a wiring route and a width of a layout target circuit over a plurality of wiring layers, and the predetermined reference value is individually given to each of the plurality of wiring layers, The predetermined value is individually given to each of the plurality of wiring layers, and the wide wiring search means is configured to provide the wide wiring based on the predetermined reference value individually given to each of the plurality of wiring layers. Is searched for for each of the plurality of wiring layers.

An automatic placement and routing apparatus according to an eleventh aspect of the present invention is an automatic placement and routing apparatus for laying out a layout target circuit, arranging means for arranging functional elements constituting the layout target circuit, output pins and inputs of the functional element Wiring means for determining the route and width of the wiring connected to the pin,
Crosstalk property verification means for detecting, from among the wirings determined by the wiring means, a set of wirings in which a signal fluctuation exceeding a predetermined limit is induced in the other wiring due to a level transition of a signal of one wiring; It is characterized by further comprising compaction means for executing layout with a wiring interval wider than the standard wiring interval for the set of wires detected by the crosstalk property verification means.

The automatic placement and routing apparatus according to the twelfth aspect of the invention is the first aspect.
The apparatus according to the first aspect of the present invention further includes identification means for identifying a strong pin that is a pin that easily gives crosstalk noise and a weak pin that is a pin that easily receives crosstalk noise to the output pin of the functional element, Wiring means, in the range where the path of the wiring exists, strong wiring that is a wiring connected to the strong pin and weak wiring that is a wiring connected to the weak pin, so as not to be adjacent on the same wiring layer,
Moreover, the route of the wiring is determined so that they do not overlap on different wiring layers, and the crosstalk property verification means inevitably distinguishes between the strong wiring and the weak wiring which are inevitably adjacent or overlap among the wirings determined by the wiring means. A set is selected, and a set of wirings in which a signal variation exceeding a predetermined limit is induced in a weak wiring due to a level transition of a signal in a strong wiring is detected from among the set.

The automatic placement and routing apparatus according to the thirteenth invention is the first one.
In the device of the first aspect of the invention, the crosstalk property verifying unit determines a magnitude of a signal fluctuation of the other wiring due to a level transition of a signal of the one wiring, a level transition width of the one wiring, and a capacitance between these wirings. And the reactance due to the capacitance of the other wiring are evaluated as a divided value.

The automatic placement and routing apparatus of the fourteenth invention is, in the automatic placement and routing apparatus for laying out a layout target circuit, placement means for placing a functional element forming the layout target circuit, and output pins and inputs of the functional element. Wiring means for arranging wiring connected to the pins, and discrimination means for discriminating between the output pin of the functional element, a strong pin that is easy to give crosstalk noise and a weak pin that is easy to receive crosstalk noise. , The wiring means is arranged such that the wiring connected to the strong pin and the wiring connected to the weak pin are not adjacent to each other on the same wiring layer and overlap on different wiring layers within a range where a wiring route exists. The wiring is arranged so as not to do so.

The automatic placement and routing apparatus according to the fifteenth aspect of the present invention is the first aspect.
In the device of the second or fourteenth aspect of the invention, the identifying means identifies the output pin as a strong output pin if the drive capability of the drive element in the functional element that drives the output pin is larger than a first reference value. If the driving capability of the driving element in the functional element that drives the output pin is smaller than the second reference value, the output pin is identified as a weak output pin, and the first reference value is the second reference value. It is characterized by being larger than.

The automatic placement and routing apparatus according to the 16th aspect of the invention is the first aspect.
In the device of the fourth aspect of the invention, the identifying means evaluates the drive capability by a ratio of a channel width and a channel length of a MOS transistor that constitutes the drive element.

[0041]

In the device of the first aspect of the present invention, the arrangement of the contact cells once arranged is corrected according to predetermined conditions. Therefore, the layout in which the contact cells are arranged so as to satisfy the predetermined condition is realized.

In the device of the second aspect of the present invention, the arrangement of contact cells is corrected so that the origin of the contact cells once arranged coincides with the grid. For this reason,
A layout in which the contact cells are arranged so that the origin coincides with the grid is realized.

In the device of the third aspect of the present invention, a contact cell in which the length of any one of the sides is an odd multiple of the grid interval is searched, and the found contact cell is set as the target of movement. The contact cells are arranged so that the centers of the contact cells overlap at the intersections of the center lines of the wirings to be connected. Moreover, since the center lines of the wirings are along the grid, the centers of the contact cells overlap the grid. There is.
Therefore, the contact cells whose origins defined by one of the four corners of the quadrangle deviate from the grid are limited to contact cells in which the length of any side is an odd multiple of the grid interval. The apparatus of the present invention selects such a contact cell and corrects the arrangement.

In the fourth invention, the contact cells are arranged in the designated direction with respect to the wiring to be connected by the function of the position correcting means. Therefore, a layout in which the contact cells are arranged in the correct direction is realized.

In the device of the fifth invention, since the grids are arranged in a matrix and the wirings are arranged so that the center lines are along the grids, as long as the wirings to be connected intersect at a correct angle, While the contact cells are rotated by 90 °, the contact cells are always arranged in the specified direction with respect to the wiring to be connected.

In the device of the sixth aspect of the invention, when each wiring to be connected to the contact cell does not face in the direction specified by the contact cell, at least one direction of these wirings corresponds to the contact cell. It is changed by 90 degrees around. This corrects the wiring direction in the vicinity of the contact cell so that the wirings to be connected do not intersect at the correct angle but intersect at the correct angle.

In the device of the seventh invention, when the wirings to be connected do not intersect at the correct angle, the direction of the wirings near the contact cell is corrected so that they intersect at the correct angle.

In the device of the eighth invention, since the contact cell has the projecting portion on the side opposite to the designated direction, when the layout target circuit is the target of the miniaturization process, the contact by "rounding" is performed. Even if the cells are thinned, it is possible to prevent failures such as poor connection.

In the device of the ninth aspect of the invention, the standard wiring and the wide wiring are laid out at the wiring intervals individually provided.

In the device of the tenth aspect of the invention, the standard wiring and the wide wiring are distinguished for each of the plurality of wiring layers, and the standard wiring and the wide wiring are laid out at individual wiring intervals for each of the plurality of wiring layers.

In the device of the eleventh aspect of the invention, the crosstalk property verification means detects a set of wirings having a large crosstalk noise exceeding a predetermined limit, and the compaction means detects a wiring interval for the set of wirings. Is set to a large value. Crosstalk noise is reduced by setting a large wiring interval. That is, this device realizes a layout in which crosstalk noise is suppressed low for all wirings.

In the device of the twelfth invention, the wiring route is determined so that the strong wiring and the weak wiring do not adjoin and overlap each other within a possible range, and then, in the set of wirings inevitably adjacent or overlapping. From this, a set of wirings whose crosstalk noise exceeds a predetermined limit and is large is detected. In other words, the target for detecting the set of wirings having a large crosstalk noise is narrowed down in advance, so that the time required for the layout is shortened.

In the device of the thirteenth invention, the magnitude of crosstalk noise between wirings is a value obtained by dividing the level transition width of one wiring by the reactance due to the capacitance between these wirings and the reactance due to the capacitance of the other wiring. Be evaluated as. Therefore, it is easy to evaluate the magnitude of crosstalk noise.

In the device of the fourteenth invention, the wiring route is determined so that the strong wiring and the weak wiring do not adjoin or overlap each other within a possible range. Therefore, a layout that is less affected by crosstalk noise is realized.

In the device of the fifteenth invention, the output pin is discriminated as a strong pin or a weak pin by comparing the driving capability of the driving element for driving the output pin with a predetermined reference value. Therefore, the strong pin and the weak pin can be easily distinguished.

In the device of the sixteenth aspect of the invention, the drivability is evaluated by the ratio of the channel width and the channel length of the MOS transistor forming the driving element. Therefore, the driving ability can be easily evaluated.

[0057]

【Example】

<First Embodiment> First, a first embodiment will be described. FIG. 1 is a block diagram showing the configuration of the automatic placement and routing apparatus 100 of this embodiment. In the following drawings, the same parts as those of the automatic placement and routing apparatus 600 shown in FIG. 31 are designated by the same reference numerals, and detailed description thereof will be omitted.

Wiring unit 1 of automatic placement and routing apparatus 100
Similarly to the wiring unit 4 of the automatic placement and routing apparatus 600, 2 arranges the wiring for the layout cell layout determined by the layout unit 1 while referring to the netlist 2 and the layout cell data 3. That is, the route and width of the wiring are determined. At the same time, the wiring portion 12 arranges contact cells in the wiring route based on the contact rule 20 as needed. The wiring portion 12 further functions to correct the positions of the contact cells CC whose origin GP does not coincide with the grid G so that the origin GP of all the contact cells CC coincides with the grid G. This characteristic operation of the wiring section 12 will be described later.

FIG. 2 is a flow chart showing the main part of the flow of the layout work in the automatic placement and routing apparatus 100. The operation of the automatic placement and routing apparatus 100 will be described below with reference to this flowchart. Automatic placement and routing device 1
In order to execute the layout using 00, the contact rule 20 is previously provided with data regarding the size of the contact cell CC in step S21. At this time, data regarding the size of the grid interval is also added at the same time. Further, the netlist 2, the layout cell data 3, and the design rule 6 are similarly prepared in advance.

Then, the placement section 1 operates to place the layout cells corresponding to the logic blocks forming the target circuit in the virtual layout area (step S22).

Subsequently, the wiring section 12 performs step S
The processing from 23 to step S26 is executed. First, in step S23, based on the contact rule 20,
The size of the vertical and horizontal sides of the contact cell CC is calculated, and both vertical and horizontal sides are even multiples of the grid spacing (herein referred to as "on-grid"), or at least one side is an odd multiple of the grid spacing. It is determined whether or not there is (here, referred to as “off-grid”). The wiring unit 12 itself has a memory, and for each contact cell CC prepared by the contact rule 20, the data obtained by the determination, that is, the data regarding whether it is on-grid or off-grid, is stored in this memory. To be done.

FIG. 3 shows an example of an off-grid contact cell CC. The length a of the two sides of the square contact cell CC is three times the grid interval g, that is, an odd number. Therefore, in step S23, this contact cell CC is stored as an off-grid.

On the other hand, FIG. 4 shows an example of an on-grid contact cell CC. The length a of the two sides of the contact cell CC, which is also a square, is four times the grid interval g, that is, an even multiple. Therefore, in step S23, this contact cell CC is stored as an on-grid.

Next, in step S24, the route and width of the wiring are determined. Then, in step S25,
Contact cells are arranged at required locations on the wiring. The processing in these steps S24 and S25 is the same as the processing of the wiring section 4 in the automatic placement and routing apparatus 600.

Subsequently, in step S26, offset processing is performed. In this process, the origin GP is set to the grid G for the off-grid contact cell CC.
Is a process for correcting the position so that This process is executed as follows.

First, by the process of step S25, the off-grid contact cells CC are sequentially searched from the contact cells CC arranged in the layout area. Off-grid contact cell CC found
5 is arranged so that the center point CP coincides with the intersection of the center line AC of the layer A and the center line BC of the layer B, as shown in FIG. Therefore, the origin GP exists at a position deviated from the grid G. As shown in FIG. 6, the wiring unit 12 moves the contact cell CC so that the origin GP overlaps the nearest grid G with respect to the off-grid contact cell CC.

On the other hand, as shown in FIG. 7, step S25
Since the origin GP of the on-grid contact cell CC arranged in the layout area by the processing of 1 has already coincided with the grid G, the processing for correcting the position is not necessary.

When step S26 ends, the compaction section 5 executes the process of step S27, that is, the compaction process. This process is performed in the same manner as the process of the compaction unit 5 in the automatic placement and routing apparatus 600.

As described above, in the automatic placement and routing apparatus 100 of this embodiment, the wiring section 12 appropriately corrects the position once set for the off-grid contact cell CC. , The origin GP of all the contact cells CC is located on the grid G. Therefore, it is not necessary to manually correct the layout data 7. That is, the correct layout data 7 can be obtained without making inefficient manual correction.

<Second Embodiment> Next, a second embodiment will be described. FIG. 8 shows an automatic placement and routing apparatus 20 of this embodiment.
It is a block diagram which shows the structure of 0. Automatic placement and routing device 2
00 is characteristically different from the conventional automatic placement and routing apparatus 600 in that the contact cell search unit 23 and the contact cell movement processing unit 24 are provided.

The contact cell search section 23 is a device section for searching the contact cell CC whose origin GP is deviated from the grid G in the layout data obtained after the compaction processing by the compaction section 5 is completed. Further, the contact cell movement processing unit 24 is a device portion that overlaps the origin GP and the grid G by appropriately moving the contact cell CC found as a result of the search.

FIG. 9 is a flow chart showing the main part of the flow of the layout work in the automatic placement and routing apparatus 200. The operation of the automatic placement and routing apparatus 200 will be described below with reference to this flowchart. Automatic placement and routing device 2
To execute the layout using 00,
Predetermined data is given to the netlist 2, layout cell data 3, contact rule 20, and design rule 6 (not shown).

Then, the placement section 1 operates to place the layout cells corresponding to the logic blocks forming the target circuit in the virtual layout area (step S41).

Next, in step S42, the route and width of the wiring are determined, and the contact cells are arranged at the required locations on the wiring. This processing is similar to the processing of the wiring section 4 in the conventional automatic placement and routing apparatus 600, and is performed by the wiring section 4 of the automatic placement and routing apparatus 200.

Next, the compaction section 5 executes the process of step S43, that is, the compaction process. This process is performed in the same manner as the process of the compaction unit 5 in the automatic placement and routing apparatus 600.

Subsequently, the contact cell search section 23 executes the process of step S44. In this step S44, the contact cell CC on the layout area for which the compaction process has been completed is searched for one whose origin GP does not match the grid G.

Next, the contact cell movement processing section 24 executes the processing of steps S45 and S46. In step S45, the origin GP found by the search
With respect to the contact cell CC in which the grid G does not match with the grid G, movement processing is performed so that the origin GP matches the nearest grid G. For example, since the origin GP does not match the grid G, the contact cell CC shown in FIG. 5 is found by the search process of step S45. Then, as shown in FIG. 6, the position of the contact cell CC is corrected by the process of step S46, and the origin GP overlaps with the nearest grid G.

On the other hand, the contact cell CC shown in FIG.
Is not found by the search in step S45 because the origin GP matches the grid G. Therefore, it is not the target of the movement process in step S46.

When the process of step S45 is completed, the process proceeds to step S46, and the layout data whose correction has been completed is output as layout data 7.

As described above, in the automatic placement and routing apparatus 200 of this embodiment, the contact cell search unit 23
Since the positions of the contact cells CC whose origin points GP are displaced from the grid G are appropriately corrected, the origin points GP of all the contact cells CC are located on the grid G in the layout data 7. For this reason,
There is no need to manually modify the layout data 7. That is, the correct layout data 7 can be obtained without making inefficient manual correction.

<Third Embodiment> Next, a third embodiment will be described. FIG. 10 shows the automatic placement and routing apparatus 3 of this embodiment.
It is a block diagram which shows the structure of 00. The wiring unit 17 included in the automatic placement and routing apparatus 300 is the automatic placement and routing apparatus 600.
Similar to the wiring section 4 of the wiring section 4, the layout path and width of the layout cell are determined by referring to the netlist 2 and the layout cell data 3 for the layout cell arrangement determined by the placement section 1, and based on the contact rule 21. Then, the contact cell is arranged in the route of the wiring as required.

Further, the contact rule 21 further includes
Data on the directionality of the contact cell CC is described. The wiring portion 17 is characteristically different from the wiring portion 4 in that it further has a function of arranging the contact cells CC in the correct direction by referring to the contact rule 21. This characteristic operation of the wiring section 17 will be described later.

FIG. 11 is a flow chart showing the main part of the flow of the layout work in the automatic placement and routing apparatus 300. The operation of the automatic placement and routing apparatus 300 will be described below with reference to this flowchart. In order to execute the layout using the automatic placement and routing apparatus 300, data regarding the size of the contact cell CC is added to the contact rule 21 in step S61 in advance.
At this time, for each contact cell CC, the wiring direction of each layer to which they are connected is defined.

FIG. 12 shows an example of the definition. In FIG. 12, the contact cell CC connects the wiring of layer A and the wiring of layer B, and the contact rule 2
1 defines a wiring direction DA arranged on the layer A and a wiring direction DB arranged on the layer B. That is, the data regarding the wiring direction DA and the wiring direction DB is written in the contact rule 21 as data accompanying the contact cell CC together with data regarding the shape of the contact cell CC.

Further, in step S61, data regarding the size of the grid interval is also given at the same time. further,
Similarly, the netlist 2, the layout cell data 3, and the design rule 6 are prepared in advance.

Then, the placement section 1 operates to place the layout cells corresponding to the logic blocks forming the target circuit in the virtual layout area (step S62).

Then, the wiring section 17 performs step S6.
The processing from 3 to step S66 is executed. First, in step S63, the route and width of the wiring are determined, and subsequently, in step S64, contact cells are arranged at necessary locations on the wiring. These processes are the same as the processes of the wiring unit 4 in the conventional automatic placement and routing apparatus 600.

At the subsequent step S65, the matching between the direction of the wiring connected to the arranged contact cell and the correct wiring direction described in the contact rule 21 is verified. 13 to 16 show this step S65.
FIG. 8 is an operation explanatory diagram illustrating the processing of FIG.

As shown in FIG. 13, when the route of one wiring is determined so as to extend from the wiring AW of the layer A to the wiring BW of the layer B, contact cells CC to which these are connected (FIG. 12). ) Are arranged as shown in FIG. 14 by the process of step S64. On the other hand, as shown in FIG. 15, when the wiring AW and the wiring BW are arranged in a direction different from that of FIG.
It is arranged as shown in FIG.

In step S65, the wiring directions DA and DB described in the contact rule 21 and the directions of the wirings AW and BW connected to the contact cell CC are compared for each contact cell CC arranged in step S64. , Determine whether the directions match.

For example, in the contact cell CC arranged as shown in FIG. 14, the wiring direction DA and the wiring AW are in the same direction, and the wiring direction DB and the wiring BW are in the same direction. That is, the contact cells CC are arranged in the correct direction. It is determined that the contact cells CC have the same direction. On the other hand, FIG.
Regarding the contact cells CC arranged as above, the wiring direction DA and the wiring AW do not match, and the wiring direction DB and the wiring BW do not match. That is, the contact cells CC are not arranged in the correct direction. It is determined that the directions of the contact cells CC do not match.

In the subsequent step S66, the direction is corrected by applying a rotating operation to the contact cell CC determined to have the same direction. For example, since it is determined that the contact cells CC arranged as shown in FIG. 13 have the same direction,
No direction correction is done.

On the other hand, with respect to the contact cells CC arranged as shown in FIG. 16, it is determined that the directions do not coincide with each other, and thus the contact cells CC are subjected to direction correction. That is,
After the contact cell CC is first rotated in either direction by 90 °, the direction coincidence is determined in the same manner as in step S65. Hereafter, until a direction match is obtained,
The rotation of 90 ° is sequentially performed. As a result, FIG.
The contact cells CC are rearranged in the correct direction, as shown in FIG.

When step S66 ends, the compaction section 5 executes the process of step S67, that is, the compaction process. This process is performed in the same manner as the process of the compaction unit 5 in the automatic placement and routing apparatus 600.

As described above, in the automatic placement and routing apparatus 300 of this embodiment, the wiring section 17 corrects the direction of the contact cell CC which is not placed in the correct direction. , All contact cells CC are arranged in the correct direction. Therefore, it is not necessary to manually correct the layout data 7. That is, the correct layout data 7 can be obtained without making inefficient manual correction.

Further, as shown in FIG.
With respect to the contact cell CC having A and PB, the wiring directions DA and DB are defined in directions opposite to the overhang portions PA and PB, respectively, so that the contact cell CC having the overhang portions PA and PB is arranged in the correct direction. It is possible to

<Fourth Embodiment> Next, a fourth embodiment will be described. FIG. 19 shows the automatic placement and routing apparatus 4 of this embodiment.
It is a block diagram which shows the structure of 00. The automatic placement and routing apparatus 400 is characteristically different from the conventional automatic placement and routing apparatus 600 in that the automatic placement and routing apparatus 400 includes a wide wiring search unit 27.

In the layout data obtained after the wiring unit 4 has determined the wiring route and the wiring width, the wide wiring searching unit 27 has a wiring having a wiring width wider than the standard wiring (here, "wide wiring" for convenience). It is a part of the apparatus for searching. Then, the compaction unit 28 performs a normal compaction process, and lays out the wiring so that the wiring interval becomes wider than the standard, especially for the wide wiring. Therefore, in the design rule 29, in addition to the wiring interval for the standard wiring, the wiring interval for the wide wiring, and the reference value of the wiring width to be compared when determining whether or not the wiring is the wide wiring. Described.

FIG. 20 is a flow chart showing the main part of the flow of the layout work in the automatic placement and routing apparatus 400. The operation of the automatic placement and routing apparatus 400 will be described below with reference to this flowchart. In order to execute a layout using the automatic placement and routing apparatus 400, in step S111, in addition to the wiring interval of the standard wiring, the wiring interval of the wide wiring and the reference wiring serving as a reference for determining whether the wiring is the wide wiring or not. Data regarding the width is added to the design rule 29. These wiring intervals and reference wiring widths are generally given for each layer. Further, in step S111, the netlist 2, the layout cell data 3, and the contact rule 20 are similarly prepared in advance.

Then, the placement unit 1 operates to place the layout cells corresponding to the logic blocks forming the target circuit in the virtual layout area (step S112).

Next, the wiring unit 4 performs step S11.
Step 3 is executed. That is, the route and width of the wiring are determined, and the contact cell is arranged at a required position on the wiring. The process in step S113 is the same as the process of the wiring unit 4 in the automatic placement and routing apparatus 600.

Next, the wide wiring searching unit 27 executes the processing of steps S114 and S115. First, in step S114, it is determined whether or not the width of the wiring is larger than the reference wiring width described in the design rule 29 while sequentially searching the wiring arranged in step S113. The comparison is generally performed individually for each layer in which wiring is arranged. If the wiring placed in a layer is larger than the standard wiring width in that layer,
The wiring is determined to be a wide wiring in the layer.

Subsequently, in step S115, constraint information for instructing to maintain the wiring interval of the wide wiring described in the design rule 29 is added to the wiring determined to be the wide wiring. Further, for standard wiring not determined to be wide wiring, constraint information for instructing that the wiring interval of the standard wiring described in the design rule 29 should be maintained is added.

Upon completion of step S115, the compaction section 28 executes the process of step S116, that is, the compaction process. At this time, the compaction unit 28 lays out the wirings based on the constraint information provided by the wide wiring search unit 27 so that separate wiring intervals are realized between the standard wirings and the wide wirings and between the wide wirings. Run.

21 and 22 show step S113.
It is an operation explanatory view explaining the processing of to step S116. As shown in FIG. 21, it is assumed that the three wirings Wa, Wb, and Wc are arranged in a certain layer by the process of step S113. Then, among these, the width of the wiring Wa is larger than the reference wiring width in the layer, and the other wirings Wb and Wc are conversely smaller.

At this time, by the processing in step S114, the wiring Wa is determined to be the wide wiring in that layer, and the other wirings Wb and Wc are determined to be the standard wiring. As a result, in step S115, the wiring W
The wiring distance DL of the wide wiring in the layer is given to a as constraint information, and the wiring distance DS of the standard wiring in the layer (where DS <D is given to the wirings Wb and Wc.
L) is added as constraint information.

In the processing of step S116, as a result of referring to these pieces of constraint information, as shown in FIG.
a is laid out so as to maintain the wiring interval DL, and the wirings Wb and Wc are laid out so as to maintain the wiring interval DS.

As described above, in the automatic placement and routing apparatus 400 of this embodiment, the wide wiring search section 27 and the compaction section 28 work so that the wide wiring and the standard wiring maintain different preferable wiring intervals. The wiring layout is performed. Therefore, it is not necessary to manually correct the layout data 7. That is, it is possible to obtain the preferable layout data 7 without making an inefficient manual correction.

<Fifth Embodiment> Next, a fifth embodiment will be described. FIG. 23 shows the automatic placement and routing apparatus 5 of this embodiment.
It is a block diagram which shows the structure of 00. The wiring unit 30 included in the automatic placement and routing apparatus 500 is the automatic placement and routing apparatus 600.
Similar to the wiring section 4 of the wiring section 4, the wiring path and width are determined with reference to the netlist 2 and the layout cell data 3 for the layout cell arrangement determined by the arranging section 1, and based on the contact rule 20. Then, the contact cell is arranged in the route of the wiring as required.

Further, when determining the wiring route, the wiring section 30 can refer to the crosstalk property verification rule 31 and the output impedance data 32 to enable wiring that easily gives crosstalk noise and wires that easily receive crosstalk noise. As much as possible, a wiring route that is not adjacent on the same layer and does not overlap between different layers is searched and determined. This characteristic operation of the wiring section 30 will be described later.

The automatic placement and routing apparatus 500 further comprises a crosstalk property verification section 33. The crosstalk property verifying unit 33 includes a crosstalk property verifying rule 31 in a set of wires that easily inject crosstalk noise and wires that easily receive crosstalk noise that are inevitably arranged adjacently or overlapping in the wiring unit 30.
And referring to the design rule 6, it is determined whether there is a risk of malfunction due to crosstalk noise. Then, the compaction unit 35 performs a compaction operation similar to that of the conventional compaction unit 5 and a function of separating the set of wirings determined to be at risk of malfunction by the crosstalk property verification unit 33 by a certain distance or more. Also fulfill.

FIG. 24 is a flow chart showing the main part of the flow of the layout work in the automatic placement and routing apparatus 500. The operation of the automatic placement and routing apparatus 500 will be described below with reference to this flowchart. In order to execute the layout using the automatic placement and routing apparatus 500, in step S141, a numerical value indicating the driving capability of the transistor for driving the output pin of each layout cell described in the layout cell data 3, for example, a MOS transistor may be used. For example, the value of the ratio (W / L) of the width W and the length L of the channel is given to the output impedance data 32.

Further, in step S142, the lower limit value of the drive capability of the output pin (herein referred to as "strong reference value" for convenience) which can be judged to be susceptible to the influence of crosstalk noise, and conversely the influence of crosstalk noise. The upper limit value of the drive capability of the output pin that can be determined to be easily received (herein, referred to as “weak reference value” for convenience), and the reference value for determining whether there is a risk of malfunction due to crosstalk (here “Crosstalk reference value”) is added to the crosstalk property verification rule 31. If the value given to the output impedance data 32 is the W / L value,
Both the “strong reference value” and the “weak reference value” are given as reference values for the W / L value.

In step S141 or S142, the netlist 2, layout cell data 3, contact rule 20, and design rule 6 are similarly prepared in advance.

Then, the placement section 1 operates to place the layout cells corresponding to the logic blocks forming the target circuit in the virtual layout area (step S143).

Then, the wiring unit 30 performs step S1.
The processing of 44 is executed. That is, the route and width of the wiring are determined, and the contact cell is arranged at a required position on the wiring. At this time, the wiring unit 30 performs wiring so as to suppress crosstalk between the wirings as much as possible while referring to the crosstalk property verification rule 31 and the output impedance data 32.

In the following, the case where all the output pins of each layout cell are driven by MOS transistors will be described as an example. When performing the wiring, the wiring unit 30 compares the W / L value of the output pin of the layout cell described in the output impedance data 32 with the “strong reference value” and the “weak reference value”. If the W / L value is larger than the “strong reference value”, it is determined that the output pin is a pin that easily gives crosstalk (herein, referred to as “strong pin” for convenience). On the contrary, if the W / L value is smaller than the "weak reference value", it is determined that the output pin is a pin susceptible to crosstalk (referred to as "weak pin" here for convenience).
Since the "strong reference value" is set larger than the "weak reference value", there can generally be output pins that are neither strong nor weak.

The wiring section 30 performs wiring so that a wiring connected to a strong pin and a wiring connected to a weak pin are not adjacent to each other on the same layer and the layers do not overlap each other within a possible range. In this way, step S14
In 4, the wiring is executed so as to reduce the crosstalk noise between the wirings as much as possible.

Next, the crosstalk property verifying section 33 executes the processes of steps S145 to S147. First, in step S145, step S144
With respect to the layout data obtained by completing the wiring by, crossing noise occurrence danger points are searched.
That is, by referring to the W / L value of each output pin described by the output impedance data 32 and the “strong reference value” and “weak reference value” described by the crosstalk property verification rule 31, Search for a location where strong wiring and weak wiring are adjacent to each other or where they overlap (that is, a location where crosstalk noise is likely to occur).

Next, in step S146, the parasitic capacitance of each wiring and the parasitic capacitance between each wiring are calculated with respect to the set of wirings corresponding to the crosstalk noise occurrence risk location discovered by the processing of step S145. FIG. 25 shows an example of a wiring set corresponding to a crosstalk noise occurrence danger point. In FIG. 25, the output pin of the layout cell LCx is a strong pin and the layout cell LCy is a weak pin. Then, it is assumed that the wiring (strong wiring) Wx connected to the strong pin and the wiring (weak wiring) Wy connected to the weak pin are adjacent to or overlap with each other.

The crosstalk property verification section 33 determines in step S
At 146, the parasitic capacitance C ₁ of the strong wiring Wx, the parasitic capacitance C _{n of} the weak wiring Wy, and the parasitic capacitance C _int between the strong wiring Wx and the weak wiring Wy are calculated. The value of the wiring interval between the strong wiring Wx and the weak wiring Wy is required to calculate the parasitic capacitance C _int , and this value is the design rule 6
The minimum wire spacing value described by is used.

In the following step S147, the wiring section 30
Then, it is determined whether or not there is a risk of malfunction due to crosstalk noise with respect to the set of the strong wiring Wx and the weak wiring Wy which are inevitably arranged adjacent to each other or overlap each other. The procedure of this determination will be described below by taking the wiring shown in FIG. 26 as an example.

FIG. 26 shows FIG. 25 in more detail. The strong pin connected to the strong wiring Wx is an NMOS.
A weak pin driven by the transistor T _nx and the PMOS transistor T _px and connected to the weak wiring Wx is driven by the NMOS transistor T _ny and the PMOS transistor T _py . The parasitic capacitance C _int between the wirings is given by the sum of the parasitic capacitances C ₂ and C ₃ , and the parasitic capacitance C ₄ corresponds to the parasitic capacitance C _n in FIG.

When the signal of the weak wiring Wy is at low level (hereinafter referred to as "L"), the strong wiring Wx.
FIG. 27 schematically shows the waveform of the signal in each wiring when the signal in FIG. 6 rises from “L” to a high level (hereinafter referred to as “H”). At this time, the PMOS transistor T _py connected to the weak wiring Wy remains off (blocking state), and the NMOS transistor T _ny remains on (conducting state). Further, the PMOS transistor T _px connected to the strong wiring Wx makes a transition from off to on, and at the same time, the NMOS transistor T _nx makes a transition from on to off.

When the signal voltage Vx of the strong wiring Wx rises from "L" to "H", the variable voltage Vr resulting from the crosstalk noise appears in the signal voltage Vy of the weak wiring Wy. The magnitude of the fluctuating voltage Vr is given by Equation 1 with respect to the voltage V between “L” and “H” corresponding to the power supply voltage.

[0126]

[Equation 1]

On the contrary, when the signal of the weak wiring Wy is "H" and the signal of the strong wiring Wx falls from "H" to "L", the waveform of the signal in each wiring is shown in FIG.
Is schematically shown in. At this time, P connected to the weak wiring Wy
The MOS transistor T _py remains on and the NMOS
The transistor _Tny remains off. Further, the PMOS transistor T _px connected to the strong wiring Wx makes a transition from on to off, and at the same time, the NMOS transistor T _nx makes a transition from off to on.

When the signal voltage Vx of the strong wiring Wx falls from "H" to "L", a variable voltage due to crosstalk noise appears in the signal voltage Vy of the weak wiring Wy. The magnitude of the fluctuating voltage Vf based on the potential of “L” is given by Equation 2.

[0129]

[Equation 2]

The crosstalk property verification section 33 determines in step S
At 147, these fluctuating voltages Vr and Vf are first calculated. Next, the crosstalk reference value described in the crosstalk property verification rule 31 and these fluctuation voltages Vr, V
Compare with f. The crosstalk property verification rule 31 includes
A reference voltage V _H to be compared with the fluctuating voltage Vr and a reference voltage V _L to be compared with the fluctuating voltage Vf are prepared in advance as crosstalk reference values.

As shown in Expression 1, if the fluctuation voltage Vr is higher than the reference voltage V _H , the set of the strong wiring Wx and the weak wiring Wy is an “error point” that may cause a malfunction due to crosstalk. To be judged. Further, as shown in Equation 2, if the fluctuating voltage Vf is lower than the reference voltage V _L, it is determined that the set of the strong wiring Wx and the weak wiring Wy is also the “error location”.

Equations 1 and 2 show the magnitude of crosstalk noise between the strong wiring and the weak wiring, the level transition width of the strong wiring as the reactance due to the capacitance between these wirings and the reactance due to the capacitance of the other wiring. It means to evaluate as a value divided by. This evaluation is a kind of approximation, but an easy and quick evaluation is possible because only three types of capacitance are used. In addition, the level transition period, that is, the period required for the signal to rise or fall on the wiring is, for example, about 10 nsec, and rises or falls almost instantaneously. Therefore, the accuracy of this approximation is sufficiently high for practical use. .

When the process of step S147 ends, the process proceeds to step S148. This step S1
At 48, the compaction process is performed by the compaction unit 35. The compaction unit 35 performs the same compaction processing as the conventional compaction unit 5, and also causes the crosstalk property verification unit 33 to perform an “error part”.
With respect to the wiring set determined to be, a process of separating the interval between them to a predetermined distance set in advance or more is executed. For the set of wirings determined to be the “error location”, the wiring route is also changed as necessary.

As described above, in the automatic placement and routing apparatus 500 of this embodiment, the wiring section 30 performs the wiring processing so as to reduce the influence of the crosstalk noise, and the crosstalk property verification section. By the functions of 33 and the compaction section 35, a process of separating the mutual wirings in which there is a risk of malfunction due to crosstalk noise in order to sufficiently reduce the crosstalk noise is added.

Therefore, the layout data 7 can be obtained without the risk of malfunction due to the crosstalk noise between the wirings. In particular, the target of detection by the crosstalk property verification unit 33 is limited to a set of a strong wiring and a weak wiring which are inevitably adjacent or overlapped in the wiring unit 30, so that the layout is efficiently performed in a short time. .

By using this automatic placement and routing apparatus 500, the labor of manually correcting the layout data 7 in order to avoid malfunction due to crosstalk noise is saved. That is, it is possible to obtain the preferable layout data 7 without making an inefficient manual correction.

<Sixth Embodiment> In the automatic placement and routing apparatus 300 of the third embodiment, the wiring section 17 may be configured to additionally perform the following processing.

As a result of the wiring process in step S63 (FIG. 11), as shown in FIG. 29, the contact cell C in which the wiring AW and the wiring BW are prepared in the contact rule 21.
It may be connected in a direction not suitable for C (FIG. 12).
At this time, the wiring section 17 additionally performs a process of changing the direction of the wiring AW or the wiring BW in the connection section as shown in FIG. 30, for example.

This additional processing is performed, for example, in step S6.
Rotate the contact cell by 90 ° in 6 in 3
If the contact cell direction and the wiring direction do not match even after performing all the times, it is realized by rotating at least one of the wiring AW and the wiring BW by 90 ° at the connection portion and performing the process of step S66 again. obtain. Then, the rotation of at least one of the wiring AW and the wiring BW in the connection portion is continued until the directions are matched.

Alternatively, based on the shape of the contact cell described in the contact rule 21, step S6
In the wiring process No. 3, the wirings AW and BW may be performed so as to match the shape of the contact cell.

By configuring the automatic placement and routing apparatus 300 as described above, the contact cells are always placed in the correct direction without manually correcting the direction of the set of wirings to be connected by the contact cells.

[0142]

In the device of the first aspect of the present invention, since the placement of the contact cell once placed is modified according to a predetermined condition, the contact cell is provided by giving a correct condition or a preferable condition. A layout result in which is correctly or preferably arranged can be obtained without manual work.

In the device of the second aspect of the invention, the arrangement of contact cells is corrected so that the origin of the contact cells once arranged coincides with the grid. For this reason,
A layout result in which the contact cells are arranged so that the origin coincides with the grid can be obtained without manual work.

In the device of the third aspect of the present invention, a contact cell in which the length of any one of the sides is an odd multiple of the grid interval is searched for, and the found contact cell is set as the movement target. Contact cells whose origin is off the grid
Since the length of one of the sides is limited to the contact cell having an odd multiple of the grid interval, the layout of the contact cell can be efficiently corrected.

In the fourth invention, the contact cells are arranged in the designated direction with respect to the wiring to be connected by the function of the position correcting means. Therefore, a layout in which the contact cells are arranged in the correct direction is realized, and manual correction can be omitted.

In the device of the fifth invention, since the grids are arranged in a matrix and the wirings are arranged so that the center lines are along the grids, as long as the wirings to be connected intersect at a correct angle, While the contact cells are rotated by 90 °, the contact cells are always arranged in the specified direction with respect to the wiring to be connected. Since a layout result in which the contact cells are arranged in the correct direction is obtained, it is possible to omit manual correction.

In the device of the sixth invention, even if the wirings to be connected do not intersect at the correct angle, the wiring directions near the contact cells are corrected so that they intersect at the correct angle. Therefore, the correct arrangement of the contact cells in the designated direction is always realized.

In the device of the seventh invention, even if the wirings to be connected do not intersect at the correct angle, the wiring directions near the contact cells are corrected so that they intersect at the correct angle. Therefore, the correct arrangement of the contact cells in the designated direction is always realized.

In the device of the eighth invention, since the contact cell has the projecting portion on the side opposite to the designated direction, when the layout target circuit is the target of the miniaturization process, the contact by "rounding" is performed. Even if the cells are thinned, it is possible to prevent failures such as poor connection.

In the device of the ninth aspect of the invention, the standard wiring and the wide wiring are laid out at the wiring intervals individually provided. Therefore, it is possible to obtain a desired layout result in which the wide wiring is laid out at a wider wiring interval than the standard wiring. Therefore, it is not necessary to manually correct the wiring interval.

In the device of the tenth aspect of the invention, the standard wiring and the wide wiring are distinguished for each of the plurality of wiring layers, and the standard wiring and the wide wiring are laid out at individual wiring intervals for each of the plurality of wiring layers. That is, it is possible to obtain a layout result in which wirings are arranged at wiring intervals suitable for each wiring layer.

In the device of the eleventh invention, the crosstalk property verifying means detects a set of wirings having a large crosstalk noise exceeding a predetermined limit, and the compacting means detects a wiring interval for the wiring set. Is set to a large value. As a result, crosstalk noise between the wirings is reduced. That is, with this device, a layout result in which the crosstalk noise is suppressed low for all wirings can be obtained. Therefore, in order to suppress the crosstalk noise, it is possible to save the trouble of manually searching for the wiring in which the crosstalk noise is likely to occur, and the time of manually correcting the interval between the wirings.

In the device of the twelfth invention, the wiring route is determined so that the strong wiring and the weak wiring do not adjoin or overlap each other within a possible range, and then, in the set of wirings inevitably adjacent or overlapping. From this, a set of wirings whose crosstalk noise exceeds a predetermined limit and is large is detected. That is, since the objects to be detected are narrowed down in advance, the layout in which the crosstalk noise is suppressed low for all the wirings can be efficiently performed in a short time.

In the device of the thirteenth invention, the magnitude of crosstalk noise between wirings is a value obtained by dividing the level transition width of one wiring by the reactance due to the capacitance between these wirings and the reactance due to the capacitance of the other wiring. Be evaluated as. Therefore, the crosstalk noise can be easily evaluated, and the accuracy of the evaluation is high in the layout target circuit having a short level transition period.

In the device of the fourteenth invention, the wiring route is determined so that the strong wiring and the weak wiring do not adjoin or overlap each other within a possible range. Therefore, a layout result that is less affected by crosstalk noise can be obtained.

In the device of the fifteenth invention, by comparing the driving capability of the driving element for driving the output pin with a predetermined reference value, the output pin is discriminated as a strong pin or a weak pin. Therefore, the strong pin and the weak pin can be easily distinguished.

In the device of the sixteenth invention, the driving ability is evaluated by the ratio of the channel width and the channel length of the MOS transistor which constitutes the driving element. Therefore, the driving ability can be easily evaluated.

[Brief description of drawings]

FIG. 1 is a block diagram of an apparatus according to a first embodiment.

FIG. 2 is a flowchart showing a processing procedure of the first embodiment.

FIG. 3 is an operation explanatory view showing the operation of the apparatus of the first embodiment.

FIG. 4 is an operation explanatory view showing the operation of the apparatus of the first embodiment.

FIG. 5 is an operation explanatory view showing the operation of the apparatus of the first embodiment.

FIG. 6 is an operation explanatory view showing the operation of the apparatus of the first embodiment.

FIG. 7 is an operation explanatory view showing the operation of the apparatus of the first embodiment.

FIG. 8 is a block diagram of an apparatus according to a second embodiment.

FIG. 9 is a flowchart showing a processing procedure of the second embodiment.

FIG. 10 is a block diagram of an apparatus according to a third embodiment.

FIG. 11 is a flowchart showing a processing procedure of a third embodiment.

FIG. 12 is an operation explanatory view showing the operation of the apparatus of the third embodiment.

FIG. 13 is an operation explanatory view showing the operation of the device of the third embodiment.

FIG. 14 is an operation explanatory view showing the operation of the device of the third embodiment.

FIG. 15 is an operation explanatory view showing the operation of the device of the third embodiment.

FIG. 16 is an operation explanatory view showing the operation of the device of the third embodiment.

FIG. 17 is an operation explanatory view showing the operation of the device of the third embodiment.

FIG. 18 is an operation explanatory view showing the operation of the apparatus of the third embodiment.

FIG. 19 is a block diagram of an apparatus according to a fourth embodiment.

FIG. 20 is a flowchart showing the processing procedure of the fourth embodiment.

FIG. 21 is an operation explanatory view showing the operation of the apparatus of the fourth embodiment.

FIG. 22 is an operation explanatory view showing the operation of the apparatus of the fourth embodiment.

FIG. 23 is a block diagram of a device according to a fifth embodiment.

FIG. 24 is a flowchart showing the processing procedure of the fifth embodiment.

FIG. 25 is an operation explanatory view showing the operation of the apparatus of the fifth embodiment.

FIG. 26 is an operation explanatory view showing the operation of the device of the fifth embodiment.

FIG. 27 is an operation explanatory view showing the operation of the device of the fifth embodiment.

FIG. 28 is an operation explanatory view showing the operation of the apparatus of the fifth embodiment.

FIG. 29 is an operation explanatory view showing the operation of the apparatus of the sixth embodiment.

FIG. 30 is an operation explanatory view showing the operation of the apparatus of the sixth embodiment.

FIG. 31 is a block diagram of a conventional device.

FIG. 32 is an operation explanatory view showing the operation of the conventional apparatus.

FIG. 33 is an operation explanatory view showing the operation of the conventional device.

FIG. 34 is an operation explanatory view showing the operation of the conventional device.

FIG. 35 is an operation explanatory diagram showing the operation of the conventional apparatus.

FIG. 36 is an operation explanatory view showing the operation of the conventional device.

FIG. 37 is an operation explanatory view showing the operation of the conventional device.

FIG. 38 is an operation explanatory view showing the operation of the conventional device.

FIG. 39 is an operation explanatory view showing the operation of the conventional device.

FIG. 40 is an operation explanatory view showing the operation of the conventional apparatus.

[Explanation of symbols]

1 Arrangement part, 4, 12, 17, 30 Wiring part, 5, 2
8,35 compaction section, 23 contact cell search section, 24 contact cell movement processing section, 27 wide wiring search section, 33 crosstalk property verification section.

Claims (16)

[Claims] 1. An automatic placement and routing apparatus for laying out a circuit to be laid out, wherein wiring means for arranging the wiring of the circuit to be laid out over a plurality of wiring layers and wirings arranged over different wiring layers. The contact cell arranging means for arranging the contact cells connecting these wirings in the overlapping part and the contact cells arranged by the contact cell arranging means are corrected so that the given conditions are satisfied. Contact cell arrangement correcting means for
An automatic placement and routing device comprising: 2. The automatic placement and routing apparatus according to claim 1, wherein the wiring unit arranges the wiring so that a center line of the wiring is arranged on a regularly arranged grid, and the contact cell arrangement is provided. The means arranges the contact cell such that the centers of the contact cells overlap each other at a position where the center lines of wirings to be connected intersect, and the contact cell arrangement correcting means arranges the contact arranged by the contact cell arrangement means. An automatic placement and routing apparatus, wherein a contact cell is moved so that an origin attached to the contact cell and functioning as a reference point for specifying the position of the cell coincides with a nearest grid. 3. The automatic placement and routing apparatus according to claim 2, wherein the grids are arranged in a matrix, the contact cells are rectangular in shape, and the length of each side is equal to the grid interval. It is an integer multiple and its origin is defined by one of the four corners of the rectangle, and the contact cell arrangement correcting means searches for a contact cell whose length of any side is an odd multiple of the grid interval. Then, with respect to the contact cell found by the search, the contact cell is moved so that its origin coincides with the nearest grid. 4. The automatic placement and routing apparatus according to claim 1, wherein a direction facing each wiring to be connected is specified in the contact cell, and the contact cell placement correction means sets the contact cell in the contact cell. An automatic placement and routing apparatus, characterized in that the direction of the contact cell is changed so that each wiring faces a specified direction. 5. The automatic placement and routing apparatus according to claim 4, wherein the wiring unit arranges the wiring so that a center line of the wiring is arranged on a grid arranged in a matrix, and the contact cell arrangement is provided. The correcting means keeps the contact cells 90 until each wiring to be connected to the contact cells faces in the direction as specified by the contact cell.
An automatic placement and routing device characterized by rotating in degrees. 6. The automatic placement and routing apparatus according to claim 5, wherein even if the contact cell is rotated three times, each wiring to be connected by the contact cell is in a direction as specified in the contact cell. The automatic placement and routing apparatus further comprising wiring direction changing means for changing at least one direction of these wirings by 90 ° around the contact cell when the wiring does not face the wiring. 7. The automatic placement and routing apparatus according to claim 4, wherein wirings to be connected to the contact cells intersect at an angle that cannot match the direction designated for the contact cells. An automatic placement and routing apparatus further comprising wiring direction changing means for changing at least one direction of these wirings in the vicinity of the contact cell. 8. The automatic placement and routing apparatus according to claim 4, wherein the contact cell has a projecting portion on a side opposite to a designated direction. 9. An automatic placement and routing apparatus for laying out a layout target circuit, wherein wiring means for determining a wiring route and width of the layout target circuit, and a predetermined reference among the wirings determined by the wiring means. Wide wiring search means for searching wide wiring that is wider than the value, wiring spacing between wide wiring and standard wiring that is not, and wiring spacing between wide wiring are individually assigned to each wiring. And a compaction unit that executes the layout of the wide wiring and the standard wiring so that the predetermined value is obtained. 10. The automatic placement and routing apparatus according to claim 9, wherein the wiring unit determines a wiring path and a width of a layout target circuit over a plurality of wiring layers, and the predetermined reference value is the plurality of wiring layers. It is individually assigned to each wiring layer, the predetermined value is individually assigned to each of the plurality of wiring layers, the wide wiring search means, the predetermined value is individually assigned to each of the plurality of wiring layers An automatic placement and routing apparatus, wherein the wide wiring is searched for each of the plurality of wiring layers based on a predetermined reference value. 11. An automatic placement and routing apparatus for laying out a circuit to be laid out, arranging means for arranging functional elements constituting the circuit to be laid out, and paths and widths of wirings connected to output pins and input pins of the functional element. And a cross for detecting, from among the wirings determined by the wiring means, a pair of wirings in which a signal fluctuation exceeding a predetermined limit is induced in the other wiring due to the level transition of the signal of one wiring. An automatic placement and routing apparatus comprising: a talkability verifying means; and a compaction means for performing a layout with respect to a set of wirings detected by the crosstalk verifying means with a wiring interval wider than a standard wiring interval. 12. The automatic placement and routing apparatus according to claim 11, wherein a strong pin that is a pin that easily gives crosstalk noise and a weak pin that is a pin that easily receives crosstalk noise are output pins of the functional element. Identification means for identifying is further provided, wherein the wiring means includes a strong wiring that is a wiring connected to the strong pin and a weak wiring that is a wiring connected to the weak pin on the same wiring layer in a range where a wiring path exists. So as not to be adjacent to each other and not to overlap on different wiring layers, and the crosstalk property verification means inevitably adjoins or overlaps among the wires determined by the wiring means. A pair of strong wiring and weak wiring is selected, and a signal fluctuation exceeding a predetermined limit is induced in the weak wiring due to the level transition of the signal of the strong wiring. An automatic placement and routing device characterized by detecting a set of wiring. 13. The automatic placement and routing apparatus according to claim 11, wherein the crosstalk property verifying unit determines the magnitude of the signal fluctuation of the other wiring due to the level transition of the signal of the one wiring of the one wiring. An automatic placement and routing apparatus, wherein the level transition width is evaluated as a value obtained by dividing the reactance due to the capacitance between these wirings and the reactance due to the capacitance between the other wirings. 14. An automatic placement and routing apparatus for laying out a circuit to be laid out, laying out means for arranging functional elements constituting the circuit to be laid out, and wiring for arranging wiring connected to output pins and input pins of the functional element. Means for identifying, with respect to the output pin of the functional element, a strong pin that is a pin that easily gives crosstalk noise and a weak pin that is a pin that easily receives crosstalk noise;
The wiring means is configured such that the wiring connected to the strong pin and the wiring connected to the weak pin are not adjacent to each other on the same wiring layer and do not overlap on different wiring layers within a range where a wiring route exists. An automatic placement and routing device characterized by arranging wiring as described above. 15. The automatic placement and routing apparatus according to claim 12 or 14, wherein the identifying unit has a driving capability of a driving element in the functional element that drives the output pin to be larger than a first reference value. For example, the output pin is identified as a strong output pin, and if the driving capability of the driving element in the functional element that drives the output pin is smaller than the second reference value, the output pin is identified as a weak output pin, and The automatic placement and routing apparatus, wherein the first reference value is larger than the second reference value. 16. The automatic placement and routing apparatus according to claim 15, wherein the identifying means evaluates the driving capability by a ratio of a channel width and a channel length of a MOS transistor which constitutes the driving element. Automatic placement and routing equipment.