JPH08129166A - Liquid crystal display device - Google Patents

Abstract

PURPOSE: To effectively use the regions exclusive of the regions to be provided with semiconductor elements and wirings as a display region by nonlinearly forming the lateral sides of a second insulatable substrate. CONSTITUTION: The first and second insulatable substrates 10, 11 are arranged to face each other and are adhered by a seal 12 and liquid crystals are implanted therein. The region where the first insulatable substrate 10 is superposed on the second insulatable substrate 11 is a display region and the non- superposed region is the region where wirings extended from the display region to a chip 13 and wirings extended from the chip 13 to a flexible cable 14 are arranged. Further, the region is the region where, for example, the chip is faced down and is electrically connected. The region is a region where the active elements and wirings directly formed by a semiconductor technique are formed in place of the chip 13 although such formation depends on the heat resistance characteristics of the substrate. The lateral side L of the second insulatable substrate 11 is formed to a nonlinear shape. Then, if, for example, the device is provided with the two chips 13, recessed parts 15 corresponding to the number are formed and both sides of these recessed parts 15 are effectively utilized as the display region.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a liquid crystal display device,
In particular, the present invention relates to a liquid crystal display device that effectively utilizes the COG region.

[0002]

2. Description of the Related Art Recently, liquid crystal display devices are mounted on various devices because of their light weight. For example, it has already been applied to mobile phones, electronic notebooks, remote controllers for video and television, pagers and pagers, etc., and is recently being applied to rectangular flexible substrates as disclosed in Japanese Patent Laid-Open No. 10328/1998.

However, the flexible substrate is formed in a rectangular shape by cutting straight lines like the glass substrate. Further, for example, a plurality of scanning lines arranged in parallel on the transparent first insulating substrate 1 and a plurality of signals arranged in parallel on the transparent second insulating substrate 2 orthogonal to the scanning lines. A line is provided, the first insulating substrate 1 and the second insulating substrate 2 are attached to each other via a seal 3, liquid crystal is injected therein, and the injection port is closed. Both boards 1 and 2 are
Different in size, the first insulating substrate 1 is formed large here, and the bare chip 4 is in face-down contact or wire bond contact with the wiring (not shown) provided in this region in the non-overlap portion. The flexible cable 5 is in contact with the input / output wiring of the chip.

[0004]

In the above structure, if both substrates 1 and 2 are glass substrates, the periphery of the substrates is a straight line due to the cleavage of the glass itself, and has a rectangular shape. Further, since the glass substrate was changed to a flexible substrate, and because of workability, the flexible substrate also had a rectangular shape.
Therefore, the non-overlapping portion also has a rectangular shape, and this area could not be effectively utilized.

On the other hand, the glass substrate, unlike the resin substrate,
Since it has a certain level of strength, the warpage of the substrate was not taken into consideration, but when a flexible resin substrate was used as in the present invention, the warpage of the substrate was likely to occur. As described above, when the chips 4 are fixed in the situation where the substrates have different sizes and the heat treatment is applied after the bonding, warpage occurs due to the difference in the coefficient of thermal expansion.

[0006]

SUMMARY OF THE INVENTION The present invention has been made in view of the above-mentioned problems. First, at least one side of the first insulating substrate has a non-linear shape, and a recess formed by the non-linear shape is formed. The problem is solved by disposing at least a part of the semiconductor element that drives the electrode on the second insulating substrate corresponding to the above, and defining a display region between the recesses where the semiconductor element is disposed.

Secondly, a semiconductor element for driving the electrodes is arranged on the first insulating substrate, and a flow stop made of the same material as the seal is provided so as to surround the semiconductor element, and the semiconductor element is opposed to the arrangement area of the semiconductor element. This is solved by forming a hole in the second insulating substrate and providing a protective resin for the semiconductor element in this hole. Thirdly, the problem is solved by providing an opening connected to the external atmosphere in a part of the flow stop surrounding the semiconductor element.

Fourthly, at least one side of the seal provided on the first insulative substrate is made non-linear, and electrodes are formed on the first insulative substrate corresponding to the recesses of the non-linear shape. At least a part of a semiconductor element for driving the semiconductor element is arranged, a space between the recesses where the semiconductor element is arranged is a display area, and the second insulating substrate facing the arrangement area of the semiconductor element is The problem is solved by forming a large hole and providing a protective resin for the semiconductor element in the hole.

Fifthly, the problem is solved by providing an active element, wiring, etc. by a semiconductor technique in the area surrounded by the seal instead of the semiconductor chip. Sixth, similarly to the fifth, the problem is solved by forming a sealed space with both substrates and a seal, and forming an active element directly formed by a chip or a semiconductor technique therein.

[0010]

Since the flexible substrate is made of a thin resin, as shown in FIG. 1, in a region that does not overlap the lower layer substrate,
The side of the upper substrate facing the lower side of the lower substrate can be processed non-linearly. In other words, by forming a recess on the side by making it non-linear (curved, etc.), the semiconductor chip can be fixed in between, while the liquid crystal injection area is enlarged as a display area between the fixed parts of this semiconductor element. it can. Therefore, this display area can be utilized as a display area of a tool box or the like on a display screen of a computer, for example.

Secondly, holes are provided only in the portion corresponding to the chip fixing area of the lower layer substrate, and the sizes of both substrates are substantially equal (although the area is reduced only by the hole and the cable fixing portion).
If so, the warp of the substrate is suppressed even if the heat treatment is applied. Further, when the semiconductor fixing region is surrounded by the sealing material, the resin does not flow during the resin potting of the semiconductor element, and good contact with the cable or the like can be achieved.

Thirdly, if a part of the flow stop is provided with an opening connected to the external atmosphere, the gas in the region surrounded by the seal will not expand and burst. Fourth, by achieving the first to third configurations at a time, it is possible to realize a hybrid integrated circuit device which does not warp and can effectively utilize the substrate. Fifth, if an active element, wiring, etc. are provided by a semiconductor technique instead of the semiconductor chip in the area surrounded by the seal, both substrates 10 and 11 and the seal form a sealed space. You can disconnect from the atmosphere.

Sixth, in the fifth structure, complete sealing is possible without providing a hole.

[0014]

Embodiments of the present invention will be described with reference to FIGS. First, there is a transparent and flexible first insulating substrate 10 (lower layer substrate), which forms a pair.
Second insulating substrate 11 which is transparent and has flexibility
The (upper layer substrate) is arranged to face. For example, in the case of a simple matrix liquid crystal display device, the first insulating substrate 10
A plurality of scanning lines arranged in parallel are provided in the second
The insulating substrate 11 is provided with a signal line orthogonal to the scanning line. Further, in the case of an active matrix liquid crystal display device, a plurality of data lines and address lines are arranged in parallel in parallel on the first insulating substrate 10, and switching elements (for example, TFT) and a display electrode electrically connected to the display electrode, while the second insulating substrate is provided with a counter electrode on the entire surface in order to set a voltage for aligning liquid crystal with the display electrode. Is provided.

The first insulative substrate 10 and the second insulative substrate 11 are opposed to each other and adhered by a seal 12 shown by a dotted line, and liquid crystal is injected therein. Further, the region where the first insulating substrate overlaps with the second insulating substrate 11 is
The non-overlapping area, which is a display area of the present liquid crystal display device, includes wiring extending from the display area to the chip 13, and the chip 1.
3 is an area where wiring is extended from the flexible cable 14 to the flexible cable 14, and the chip is, for example, an area where the chip is face down and electrically connected.

Depending on the heat resistance of the substrate, the semiconductor element 13 is replaced by an active element or wiring forming region directly formed by semiconductor technology. The feature of the present invention resides in that the side L of the second insulating substrate 11 has a non-linear shape. In other words, a glass substrate needs to be a straight line due to the cleavage of the glass itself, but the present invention is a thin resin flexible plate, so any processing is possible. Therefore, for example, when two chips 13 are provided,
The recessed portions 15 corresponding to this number are provided, and both sides of the recessed portions 15 can be effectively used as display areas. In addition, semiconductor devices can be used to directly connect active devices and wiring to CV
When it is formed by D or the like, a display area other than the necessary circuit element arrangement area can be used.

The difference between FIG. 1 and FIG. 2 lies only in whether the chips 13 are arranged in the center or on both sides.
In the case of 3, the display areas are formed at a total of three locations on both sides of the recessed portion 15, but in the case of FIG. 2, they are collectively formed between the chips 13. Therefore, the display area can be enlarged depending on the chip and wiring method, and a tool box can be arranged on a computer screen, for example.

Further, FIG. 6 shows a hybrid integrated circuit device (liquid crystal panel 20) shown in FIG.
It is a case that covers this panel. Generally, when viewing a display device, the case is made of plastic, and the display area is transparent. The band-shaped frame 22 hatched with dots is black in order to improve the recognition. The width is about several millimeters to 1 cm. If the recessed portion of the present invention is provided in this width, the chip can be displaced inward by the recessed portion toward the display area side, and the non-overlapping area can be enlarged or the area can be narrowed. Therefore, the flexibility of the wiring can be improved, or the whole can be made compact.

Next, the embodiment shown in FIG. 3 will be described. In this configuration, the first insulating substrate 10 and the second insulating substrate 11 are
Are also substantially the same size. The difference is that the upper substrate 11 is provided with a hole 20 and a cutout 21. The cutout portion 21 is an area for arranging the flexible cable 14, and the hole 20 is an area for arranging the chip 13, and is formed larger than the chip size. Although it depends on the thickness of the substrate 11 itself of the liquid crystal display device, the distance between the substrates 10 and 11 and the thickness of the chip, the back surface of the chip is the substrate 11.
More protruding or dented.

The feature of the present invention is that, first of all, the two substrates 10 and 11 facing each other have substantially the same size. In order to have flexibility, it needs to be thin regardless of whether it is a glass substrate or a resin, and if it is thin, it is deformed by a slight external force. Therefore, only the hole 20 and the excision region 21 are provided and the rest is made the same since the shell of the heat treatment is surely inserted. In particular, if it is a resin, it is easy to deal with it, since it is easy to make holes.

The second feature is that the area where the chips 13 are arranged is surrounded by a sealing material. FIG. 4 is a cross-sectional view of FIG. 3. When the bare chip is to be faced down, it is necessary to pot the resin 22 in the space formed by both substrates and the seal 12, thus achieving a structure of the sealing space and a resin flow stop. ing. Here, if a substrate having the holes 20 and the cutout regions 21 provided in advance is adhered to the substrate 10 of the lower layer and then the resin 22 is potted, the air may escape into the sealed space, so that the air can escape. Prepared mouth 23. Therefore, in the heat treatment process after potting, it is possible to prevent the air contained therein from bursting. Here, C
Although described with the OG technique, active elements and wirings may be directly formed by CVD that can be formed at a low temperature, and these may be surrounded by a seal.

Further, the region surrounded by the seal is formed by the above-mentioned CVD or COG in advance, the sealing resin is dropped after forming the seal, and a substrate of exactly the same size having no hole or cut region is attached. May be combined. As a result, both substrates function as a case such as a hybrid integrated circuit device, and a good sealed space can be formed. Also, since the substrate sizes are the same, it is possible to eliminate warpage.

[0023]

As is clear from the above description, first, by making the side L of the second insulating substrate non-linear, it is possible to utilize the area other than the area where the semiconductor element and wiring are provided as the display area. . Second, a seal space can be formed by surrounding the semiconductor element arrangement region with a seal, and a thick semiconductor chip or the like can be easily mounted by providing a hole.

Thirdly, by providing an opening in a part of the sealed space, it is possible to prevent air from entering during resin potting or the like. Fourth, by making the side M of the seal non-linear, it is possible to effectively utilize the area other than the semiconductor element arrangement area for the display area, and to make the size of both substrates substantially the same except for the holes and cutout areas. Can be prevented from warping.

Fifth, even if an active element or wiring is formed by the CVD technique or the like which can be formed at a low temperature in the above-mentioned structure, a sealed space can be realized by the seal and both substrates, and deterioration due to the external atmosphere can be prevented. . Sixth, since both substrates are made to have the same shape to prevent the panel from warping and a sealing space can be formed by a seal with the both substrates, an IC circuit formed by a chip or CVD mounted therein is externally connected. It can shield from the atmosphere and prevent deterioration.

[Brief description of drawings]

FIG. 1 is a diagram of a first liquid crystal display device of the present invention.

FIG. 2 is a diagram of a second liquid crystal display device of the present invention.

FIG. 3 is a diagram of a third liquid crystal display device of the present invention.

4 is a cross-sectional view of FIG.

FIG. 5 is a diagram illustrating a conventional liquid crystal display device.

FIG. 6 is a diagram illustrating a relationship between a liquid crystal display device and a case.

[Explanation of symbols]

 10 First Insulating Substrate 11 Second Insulating Substrate 12 Seal 13 Chip 14 Flexible Cable 15 Recess 20 Hole 21 Excision Area 23 Mouth

Claims (6)

[Claims] 1. A transparent and flexible first insulative substrate, and a transparent and flexible second insulative substrate which is disposed so as to face the first insulative substrate.
In a liquid crystal display device having at least electrodes provided on both substrates and a liquid crystal injected between the two substrates, at least one side of the second insulating substrate has a non-linear shape, At least a part of a semiconductor element that drives the electrode is disposed on the first insulating substrate corresponding to the recess having the non-linear shape, and a space between the recesses in which the semiconductor element is disposed is a display area. Liquid crystal display device characterized by. 2. A transparent and flexible first insulative substrate, and a transparent and flexible second insulative substrate which is disposed so as to face the first insulative substrate.
In a liquid crystal display device having at least electrodes provided on both substrates, a seal provided between both substrates, and a liquid crystal injected between both substrates, the first insulating substrate is provided with A semiconductor element for driving the electrode is arranged, a flow stopper made of the same material as the seal is provided so as to surround the semiconductor element, and a hole is provided in the second insulating substrate facing the arrangement area of the semiconductor element. ,
A liquid crystal display device characterized in that a protective resin for the semiconductor element is provided in the hole. 3. The liquid crystal display device according to claim 2, wherein a part of the flow stop surrounding the semiconductor element is provided with an opening communicating with an external atmosphere. 4. A transparent and flexible first insulating substrate, and a transparent and flexible second insulating substrate which is disposed so as to face the first insulating substrate.
In a liquid crystal display device having at least electrodes provided on both substrates, a seal provided between both substrates, and a liquid crystal injected between both substrates, provided on the second insulating substrate. At least one side of the seal is a non-linear shape, and at least a part of the semiconductor element that drives the electrode is arranged on the first insulating substrate corresponding to the recess having the non-linear shape, A space larger than that of the semiconductor element is provided in the second insulating substrate facing the area where the semiconductor element is arranged, with a display area defined between the recesses where the semiconductor element is arranged. A liquid crystal display device, which is provided with a protective resin for elements. 5. The liquid crystal display device according to claim 2, 3 or 4, wherein at least an active element and a wiring made of semiconductor technology are provided in a region surrounded by the seal. 6. A transparent and flexible first insulative substrate, and a transparent and flexible second insulative substrate which is disposed so as to face the first insulative substrate.
In a liquid crystal display device having at least electrodes provided on both substrates, a seal provided between both substrates, and a liquid crystal injected between both substrates, the both substrates are substantially the same. At least a semiconductor element or wiring for driving the electrodes is arranged in a non-display area of the first insulating substrate, and the arrangement area is surrounded by the sealing material and is surrounded by the both substrates and the seal. A liquid crystal display device characterized by the above.