JPH08125365A - Fitting body structure of heat radiation plate - Google Patents

Abstract

PURPOSE: To improve the heat radiation efficiency of a heat radiation plate even if it is fitted to tongue pieces cut and raised from a bottom plate having no hole board in the bottom plate. CONSTITUTION: The title fitting body structure is provided with the parts of a case bottom plate cut up for containing a flat platelike plate 10 e.g. a printed board, intermediate part or idle end part thereof arranged in parallel with the case bottom plate, a flat plate part 21 blocking fitting tongue pieces 11 having fitting holes in the parallel part thereof and the tongue cut holes 12 of the plate 10, a riser part rising from the flat plate part 21 as well as engagement parts 22 extending from the riser part in almost parallel with the flat part 21 furthermore including a printed board 40 electrically connecting a heat radiating plate 20 fitted with heat generating parts 30 to the lead of the heat generating parts 30 so that the fitting tongue pieces 11 and the engagement parts 22 of the heat radiating plate 20 may be integrally engaged with one another using screws 50.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a radiator plate mounting structure for mounting a heat-generating component that requires heat radiation and radiating the heat.

[0002]

2. Description of the Related Art Conventionally, in order to attach an electronic component such as a semiconductor element which requires heat radiation to a printed circuit board, a lead wire of an electronic component 30 is electrically connected to a printed circuit board 40 as shown in FIG. The electronic component 30 is mounted and fixed at a predetermined position on the heat sink 20, the printed circuit board 40, and the engaging portion 11 of the mounting tongue cut and raised from the case bottom plate 10.
Overlap each and fix with screws.

[0003]

In the above-mentioned conventional electronic component mounting structure, the hole of the mounting tongue of the case bottom plate has a hole for inserting a finger, and a separate sealing material is used to close the hole or seal the material. However, there is a problem in that the efficiency of assembly work is reduced and the cost is increased. Further, in order to enhance the heat radiation effect of the heat-generating electronic component, it is necessary to enlarge the heat radiation plate. SUMMARY OF THE INVENTION It is an object of the present invention to review the above problems and provide an electronic component assembly that does not cause a reduction in work efficiency or an increase in cost.

[0004]

SUMMARY OF THE INVENTION According to the present invention, a mounting tongue for cutting and raising a part of a flat plate and arranging a free end of the plate in parallel with the plate and a flat plate for closing a tongue hole of the plate are provided. A heat radiating plate having a rising portion rising from the flat plate portion and a locking portion extending from the rising portion substantially parallel to the flat plate portion, a heat generating component attached to the heat radiating plate, and a printed circuit board to which the heat generating component is electrically connected. A mounting structure for a heat radiating plate, characterized in that the mounting tongue of the plate, the end of the printed circuit board, and the locking part of the heat radiating plate are integrally fixed.

[0005]

In the heat sink mounting structure of the present invention, a hole for mounting the tongue piece cut and raised from the case for accommodating the printed circuit board is closed with a part of the heat sink to separately close the hole with a sealing material and seal. You don't need wood. Also, the flat plate part of the heat dissipation plate is closely attached to the case so that the heat dissipation of the heat-generating electronic components can be diffused not only to the heat dissipation plate but also to the printed circuit board housing case.
Since the heat radiation effect is greater than that of the conventional one, the heat radiation plate can be downsized.

[0006]

Embodiments of the present invention will be described below with reference to FIGS. FIG. 1 is a perspective view of an embodiment of the present invention. A flat plate 10 for storing a printed circuit board, for example.
A part of the base plate is cut and raised, and an intermediate portion or a free end of the base plate is arranged in parallel with the case bottom plate, and a mounting tongue piece 11 having a mounting hole in the parallel part and a tongue piece hole 12 of the plate. The flat plate portion 21 that closes the flat plate portion 21 has a rising portion that rises from the flat plate portion 21 and a locking portion 22 that extends from the rising portion substantially in parallel with the flat plate portion 21. Printed circuit board 40 to which the terminals are electrically connected
Including the mounting tongue piece 11 and the printed circuit board locking portion 41.
And a locking portion 22 of the heat radiating plate 20 are integrally locked and fixed by a screw 50 or the like. Punlith board, heat sink and mounting tongue are integrally fixed as shown by the arrow in the figure. The heat radiating plate 20 is made of aluminum or the like having high heat conductivity, and heat is radiated in the entire case that is in close contact with the flat plate portion 21 of the heat radiating plate 20. To be improved.

FIG. 2 is a sectional view of the second embodiment of the present invention. This is a case in which the engagement portion 22 and the flat plate portion 61 are formed in a U-shape in the shape of the heat dissipation plate, which is suitable when the mounting tongue hole 12 is large and the flat plate portion 21 needs to be large.

FIG. 3 is a sectional view of the third embodiment of the present invention. The heat sink is shaped like a staircase, and the first stage is the flat plate 7
1 is the case where the second step is the locking portion 22, and the locking portion 2
It is suitable when 2 fits in a relatively small area.

FIG. 4 is a perspective view of the shape of a heat radiating plate according to the fourth embodiment of the present invention. This is an example in which the U-shaped heat sink shown in FIG. 2 is rotated by 90 degrees, and the rising portion supporting the flat plate portion 61 and the locking portion 22 is selected so that it can be selected when there is an obstacle on the case side. .

FIG. 5 is a perspective view of the shape of a radiator plate according to the fifth embodiment of the present invention. This is an example of a heat dissipation plate shape suitable for a case where the mounting tongue hole of the case bottom plate 10 extends over a wide range. FIG. 6 is a partial perspective view of a heat dissipation plate shape according to a sixth embodiment of the present invention. A locking window is provided in a portion of the case bottom plate 10 that contacts the flat plate portion at the base of the cut-and-raised hole of the mounting tongue, and the flat plate portion of the radiator plate that closes the locking window is the cut-and-raised portion of the mounting tongue. It is an embodiment of a heat dissipation plate provided with a convex portion so as to be fitted in. This is particularly suitable when the mechanical strength of the flat plate portion that closes the attachment tongue hole is required.

FIG. 7 is a partial cross-sectional view of the seventh embodiment of the present invention. The bottom of the case bottom plate 10 is attached with the mounting tongue hole and the heat sink 2
This is a case in which both the front and back surfaces of the case bottom plate are completely closed by the flat plate portion 21 of 0.

[0012]

According to the electronic component mounting structure of the present invention, the mounting tongue is formed by cutting and raising the mounting tongue from the case for housing the printed circuit board. There is no need to separately close the mounting tongue hole with a seal material and no seal material is required. Furthermore, the flat plate part of the heat dissipation plate is in close contact with the case so that the heat dissipation of the heat generating electronic parts can be diffused not only to the heat dissipation plate but also to the printed circuit board housing case.
Since the heat radiation effect is greater than that of the conventional one, the heat radiation plate can be downsized.

[Brief description of drawings]

FIG. 1 is a perspective view of a first embodiment of the present invention.

FIG. 2 is a sectional view of a second embodiment of the present invention.

FIG. 3 is a sectional view of a third embodiment of the present invention.

FIG. 4 is a perspective view of a heat dissipation plate shape according to a fourth embodiment of the present invention.

FIG. 5 is a perspective view of a heat dissipation plate shape according to a fifth embodiment of the present invention.

FIG. 6 is a partial perspective view of a heat dissipation plate shape according to a sixth embodiment of the present invention.

FIG. 7 is a partial cross-sectional view of a seventh embodiment of the present invention.

FIG. 8 is a cross-sectional view of a conventional heat sink mounting structure.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 10 Flat plate 11 Attachment tongue 12 Hole 20 Radiator 21 Flat plate 22 Locking part 30 Heating component 40 Printed circuit board 41 Printed circuit board locking part 50 Screw 61 Flat plate part 71 of the second embodiment 71 Third Flat Plate Part of Example 81 Flat plate part of Seventh Example

Claims (4)

[Claims] 1. A mounting tongue which cuts and raises a part of a plate and arranges a free end portion in parallel with the plate, a flat plate portion which closes a hole formed by cutting and raising the mounting tongue, and rises from this flat plate portion. A heat dissipation plate having a rising part and a locking part extending from the rising part in parallel with the flat plate part; a heat generating component attached to the heat dissipation plate; and a printed circuit board to which the heat generating component is electrically connected, A mounting structure for a heat radiating plate, characterized in that the plate mounting tongue, the end of the printed circuit board and the locking part of the heat radiating plate are integrally fixed. 2. The mounting structure for a heat dissipation plate according to claim 1, wherein an end portion of the printed board is a convex printed board engaging portion. 3. The mounting structure for a heat radiating plate according to claim 1, wherein the flat plate portion is formed in the punched hole shape, and the flat plate portion is fitted into the punched hole. 4. A locking window is formed at the base of the cut-and-raised portion of the mounting tongue, and a convex portion fitted into the flat plate portion is provided in the locking window, and the convex portion fitted into the locking window is fitted into the convex portion. The heat dissipating plate mounting structure according to claim 1, wherein: