JPH08123337A - Display unit for road information display board - Google Patents
Display unit for road information display boardInfo
- Publication number
- JPH08123337A JPH08123337A JP28588894A JP28588894A JPH08123337A JP H08123337 A JPH08123337 A JP H08123337A JP 28588894 A JP28588894 A JP 28588894A JP 28588894 A JP28588894 A JP 28588894A JP H08123337 A JPH08123337 A JP H08123337A
- Authority
- JP
- Japan
- Prior art keywords
- printed wiring
- wiring board
- display unit
- conductor pattern
- surface side
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3415—Surface mounted components on both sides of the substrate or combined with lead-in-hole components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3447—Lead-in-hole components
Landscapes
- Fittings On The Vehicle Exterior For Carrying Loads, And Devices For Holding Or Mounting Articles (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は道路情報表示板におい
て、１つの印刷配線板に発光ダイオードと、該発光ダイ
オードを駆動する駆動回路を取付けて、表示板に取付け
るユニットの厚みを薄くした表示ユニットに関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a road information display board, in which a light emitting diode and a drive circuit for driving the light emitting diode are mounted on one printed wiring board to reduce the thickness of the unit mounted on the display board. Regarding
【０００２】[0002]
【従来の技術】高速道路や一般道路において使用される
道路情報表示板には、発光ダイオード（以下ＬＥＤとい
う）と、該ＬＥＤを駆動するための駆動回路が印刷配線
板に半田付け固定されているのが一般的である。以下、
この従来例の概略を図５、図６と共に説明する。2. Description of the Related Art Light emitting diodes (hereinafter referred to as LEDs) and drive circuits for driving the LEDs are soldered and fixed to a printed wiring board on a road information display board used on highways and general roads. Is common. Less than,
The outline of this conventional example will be described with reference to FIGS.
【０００３】図５は道路情報表示板の概略分解斜視図を
示し、１は表示板の前面に固定された格子枠、２は該格
子枠１のそれぞれに着脱自在に固定された表示ユニット
にして、多数のＬＥＤ２ａをマトリックス状に半田付け
した実装用印刷配線板２ｂと、図示しないＬＥＤ駆動用
部品が半田付け固定された駆動用印刷配線板２ｃと、前
記２つの印刷配線板２ｂ，２ｃが組み込まれたアルミ製
等のケース２ｄとより構成されている。FIG. 5 is a schematic exploded perspective view of a road information display plate, wherein 1 is a lattice frame fixed to the front surface of the display plate, and 2 is a display unit detachably fixed to each of the lattice frames 1. , A mounting printed wiring board 2b in which a large number of LEDs 2a are soldered in a matrix, a driving printed wiring board 2c in which LED driving components (not shown) are fixed by soldering, and the two printed wiring boards 2b, 2c are incorporated. And a case 2d made of aluminum or the like.
【０００４】次に、前記表示ユニット２（例えば、実公
平６−１７１６８号公報）について図６の側面図と共に
説明する。表示ユニット２内の実装用印刷配線板２ｂの
裏面には導体パターンが印刷されると共に、前記ＬＥＤ
２ａを取付けるためのスルーホールが前記導体パターン
と電気的に接続された状態で多数形成されている。そし
て、ＬＥＤ２ａのリードは前記スルーホールに差し込ま
れて、裏面において前記導体パターンに半田付け固定さ
れている。Next, the display unit 2 (for example, Japanese Utility Model Publication No. 6-17168) will be described with reference to the side view of FIG. A conductive pattern is printed on the back surface of the mounting printed wiring board 2b in the display unit 2, and the LED
A large number of through holes for attaching 2a are formed in a state of being electrically connected to the conductor pattern. Then, the leads of the LED 2a are inserted into the through holes and fixed to the conductor pattern by soldering on the back surface.
【０００５】また、表示ユニット２内の他の駆動用印刷
配線板２ｃには、表面に導体パターンが形成され、この
導体パターンには前記ＬＥＤ２ａを駆動するための駆動
回路を構成するＩＣやチップ部品等の電子部品２ｅが半
田付け固定されている。そして、この駆動用印刷配線板
２ｃと前記実装用印刷配線板２ｂとは、接続用配線やコ
ネクター等の接続体２ｆ（図示のものは接続用配線）に
よって電気的に接続されている。Further, a conductor pattern is formed on the surface of another drive printed wiring board 2c in the display unit 2, and the conductor pattern has an IC or a chip component which constitutes a drive circuit for driving the LED 2a. An electronic component 2e such as is fixed by soldering. The drive printed wiring board 2c and the mounting printed wiring board 2b are electrically connected to each other by a connecting body 2f such as a connecting wiring or a connector (the connecting wiring is shown in the figure).
【０００６】[0006]
【発明が解決しようとする課題】ところで、前記した表
示ユニット２にあっては、ＬＥＤ２ａを取付けるための
実装用印刷配線板２ｂと、電子部品を取付けるための印
刷配線板２ｃとの２枚の印刷配線板を用いるために、表
示ユニット２としての厚みが厚くなるため小型化が不可
能であり、また、前記２枚の印刷配線板２ｂ，２ｃを接
続するための接続体２ｆが必要であるため、組み立てに
時間がかかりコストが高くなるといった問題があった。By the way, in the above-mentioned display unit 2, printing of two sheets, a mounting printed wiring board 2b for mounting the LED 2a and a printed wiring board 2c for mounting electronic parts. Since the wiring board is used, the thickness of the display unit 2 becomes thicker, so that downsizing is not possible, and the connection body 2f for connecting the two printed wiring boards 2b and 2c is required. However, there was a problem that it took time to assemble and the cost was high.
【０００７】本発明は前記した問題点を解決せんとする
もので、その目的とするところは、発光ダイオードの半
田付けを印刷配線板の表面側で行なうようにしたので、
裏面側の実装面積を有効に使用できることにより、電子
部品の実装密度を上げて高密度化を図ることができ、か
つ、厚みを薄くして小型化ができる道路情報表示板用表
示ユニットを提供せんとするにある。The present invention is intended to solve the above-mentioned problems. The object of the present invention is to solder the light emitting diode on the front surface side of the printed wiring board.
Since the mounting area on the back side can be used effectively, it is possible to increase the mounting density of electronic parts to achieve higher density, and to provide a display unit for road information display boards that can be made thinner and smaller. And there is.
【０００８】[0008]
【課題を解決するための手段】本発明の道路情報表示板
用表示ユニットは前記した目的を達成せんとするもの
で、その手段は、多層印刷配線板の表面側に形成したス
ルーホールに発光ダイオードのリードを挿入すると共
に、該スルーホールの上面において半田付け固定し、か
つ、前記リードを導体パターンに電子部品を半田付け固
定した多層印刷配線板の裏面側と電気的に接続したもの
である。The display unit for a road information display board according to the present invention is intended to achieve the above-mentioned object. The means is to provide a light emitting diode in a through hole formed on the surface side of a multilayer printed wiring board. Of the multilayer printed wiring board on which the leads are inserted and fixed by soldering on the upper surface of the through hole, and the leads are electrically fixed on the conductor pattern by soldering.
【０００９】また、多層印刷配線板の表面側に形成した
導体パターンに発光ダイオードのリード先端折曲部を半
田付け固定し、かつ、前記リードを導体パターンに電子
部品を半田付け固定した多層印刷配線板の裏面側と電気
的に接続したものである。A multilayer printed wiring in which a lead tip bent portion of a light emitting diode is soldered and fixed to a conductor pattern formed on the surface side of a multilayer printed wiring board, and an electronic component is soldered and fixed to the lead to the conductor pattern. It is electrically connected to the back side of the plate.
【００１０】[0010]
【作用】前記した如く構成した本発明の道路情報表示板
用表示ユニットは、多層印刷配線板の表面側に形成した
スルーホールに発光ダイオードのリード先端を挿入する
と共に、表面側において半田付け固定したので、多層印
刷配線板の裏面側には前記リードの半田付け部分が現れ
ず、従って、印刷配線板の裏面側には電子部品を高密度
で実装することができる。In the road information display board display unit of the present invention constructed as described above, the lead tips of the light emitting diodes are inserted into the through holes formed on the front surface side of the multilayer printed wiring board, and fixed on the front surface side by soldering. Therefore, the soldered portions of the leads do not appear on the back surface side of the multilayer printed wiring board, and therefore electronic components can be mounted on the back surface side of the printed wiring board at a high density.
【００１１】また、印刷配線板の表面側の導体パターン
に発光ダイオードのリード先端折曲部を半田付け固定
し、この半田付けした導体パターンをスルーホールを介
して裏面側の導体パターンと接続したので、多層印刷配
線板の裏面側には前記リードの半田付け部分が現れず、
従って、印刷配線板の裏面側には電子部品を高密度で実
装することができる。Further, the lead tip bent portion of the light emitting diode is soldered and fixed to the conductor pattern on the front surface side of the printed wiring board, and the soldered conductor pattern is connected to the conductor pattern on the rear surface side through the through hole. , The soldering part of the lead does not appear on the back side of the multilayer printed wiring board,
Therefore, electronic components can be mounted at a high density on the back surface side of the printed wiring board.
【００１２】[0012]
【実施例】以下、本発明に係る道路情報表示板用表示ユ
ニットの第１実施例を図１、図２と共に説明する。３は
多層印刷配線板（本実施例にあっては３層）にして、上
下２枚の印刷配線板からなり上の印刷配線板３１には多
数のスルーホール３１ａがマトリックス状に形成される
と共に、このスルーホール３１ａは図１に示すようにＸ
軸方向において印刷配線板３１の表面に形成した導体パ
ターン３１ｂで接続され、各この導体パターン３１ｂは
左端のスルーホール３１ｃを介して下の印刷配線板３２
の裏面に導出されている。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS A first embodiment of a display unit for road information display board according to the present invention will be described below with reference to FIGS. Reference numeral 3 denotes a multilayer printed wiring board (three layers in this embodiment), which is composed of upper and lower two printed wiring boards, and a large number of through holes 31a are formed in a matrix in the upper printed wiring board 31. , This through hole 31a is X as shown in FIG.
The conductor patterns 31b formed on the surface of the printed wiring board 31 in the axial direction are connected, and each conductor pattern 31b is connected to the lower printed wiring board 32 via a through hole 31c at the left end.
Has been derived on the back side of.
【００１３】また、印刷配線板３１には貫通するスルー
ホール３２ａがマトリックス状に形成されると共に、こ
の各スルーホール３２ａはＹ軸方向において上の印刷配
線板３１の裏面に形成された導体パターン３２ｂに接続
され、かつ、各Ｙ軸方向の導体パターン３２ｂは図１に
おいて下端のスルーホール３２ｃを介して下の印刷配線
板３２の裏面に導出されている。Through holes 32a penetrating the printed wiring board 31 are formed in a matrix, and the through holes 32a are formed on the back surface of the upper printed wiring board 31 in the Y-axis direction. And the conductor pattern 32b in each Y-axis direction is led out to the back surface of the lower printed wiring board 32 through the through hole 32c at the lower end in FIG.
【００１４】このように構成された多層印刷配線板３に
対して、ＬＥＤ４のリード４ａをスルーホール３１ａ，
３２ａ内に挿入して、それぞれ上の印刷配線板３１の表
面において半田付け固定する。また、下の印刷配線板３
２の裏面に形成した導体パターン３２ｄにＬＥＤ４の点
灯を制御するためのドライバーＩＣや抵抗アレー等の電
子部品５を半田付け固定する。With respect to the multilayer printed wiring board 3 thus constructed, the leads 4a of the LEDs 4 are connected to the through holes 31a,
32a, and soldered and fixed on the surface of the printed wiring board 31 above. Also, the printed wiring board 3 below
An electronic component 5 such as a driver IC or a resistor array for controlling the lighting of the LED 4 is soldered and fixed to the conductor pattern 32d formed on the back surface of 2.
【００１５】このように、ＬＥＤ４を多層印刷配線板３
の表面において半田付けし、また、電子部品５を多層印
刷配線板３の裏面において半田付けすることにより、裏
面側にはＬＥＤ４のリード４ａが出現しないため、裏面
側の実装面積が大きくなり、従って、１枚の印刷配線板
３にＬＥＤ４と駆動回路を組み込むことができるもので
ある。In this way, the LED 4 is connected to the multilayer printed wiring board 3
By soldering on the front surface of the multilayer printed wiring board 3 and soldering the electronic component 5 on the back surface of the multilayer printed wiring board 3, the leads 4a of the LEDs 4 do not appear on the back surface side, so that the mounting area on the back surface side is increased, and The LED 4 and the drive circuit can be incorporated in one printed wiring board 3.
【００１６】なお、６は印刷配線板３の表面に塗布した
放熱用樹脂（例えば、シリコン樹脂）にして、ＬＥＤ４
の一部が埋設されるように塗布し、かつ、前記印刷配線
板３と共に放熱ケース７に前記放熱用樹脂６が接触する
ように収容する。これにより、放熱用樹脂６はＬＥＤ４
の点灯により発生した熱を、放熱ケース７を介して外部
（格子枠）に放熱する。これにより、温度上昇に伴うＬ
ＥＤの輝度低下を防止する。なお、ＬＥＤ４の熱を放熱
する方法としては、放熱ケース７の他にＬＥＤの遮光用
ルーバー（図示せず）によって行なってもよい。LED 6 is a resin for heat radiation (eg, silicone resin) applied to the surface of the printed wiring board 3.
Is applied so as to be partially embedded, and is housed so that the heat dissipation resin 6 contacts the heat dissipation case 7 together with the printed wiring board 3. As a result, the resin 6 for heat dissipation becomes the LED 4
The heat generated by lighting is radiated to the outside (lattice frame) through the heat dissipation case 7. As a result, L
It prevents the brightness of the ED from decreasing. As a method of radiating the heat of the LED 4, a light shielding louver (not shown) of the LED may be used in addition to the heat radiating case 7.
【００１７】次に、第２実施例を図３、図４と共に説明
する。なお、前記した第１実施例と同一符号は同一部品
を示し、説明は省略する。本実施例における印刷配線板
３と前記した第１実施例の印刷配線板３と相違する点
は、Ｙ軸方向のスルーホール３２ａと接続された導体パ
ターン３１ｄを上の印刷配線板３１の表面に形成した点
であり、それ以外は全く同じである。Next, a second embodiment will be described with reference to FIGS. The same reference numerals as those in the above-described first embodiment indicate the same parts, and the description thereof will be omitted. The printed wiring board 3 in this embodiment differs from the printed wiring board 3 in the first embodiment described above in that the conductor pattern 31d connected to the through hole 32a in the Y-axis direction is provided on the surface of the upper printed wiring board 31. It is the point that was formed, and other than that is exactly the same.
【００１８】そして、本実施例にあっては、ＬＥＤ４の
リード４ａの先端を互いに向き合うように折曲し、この
先端折曲部４ａ1 を上の印刷配線板３１の表面に形成し
た導体パターン３１ｂ，３１ｄに半田付け固定する。こ
の場合もリード４ａが印刷配線板３の裏面に出現しない
ので、裏面側の実装面積が大きくなる。In this embodiment, the leads 4a of the LED 4 are bent at their tips so as to face each other, and the tip bent portions 4a 1 are formed on the surface of the upper printed wiring board 31 as a conductor pattern 31b. , 31d by soldering. Also in this case, the lead 4a does not appear on the back surface of the printed wiring board 3, so that the mounting area on the back surface side becomes large.
【００１９】従って、電子部品５を下の印刷配線板３２
の裏面に形成した導体パターン３２ｃに半田付け固定す
ることができる。また、本実施例の場合にも、放熱用樹
脂６をＬＥＤ４の一部を埋設するように塗布することに
より、ＬＥＤ４をより安定した状態で固定できると共に
放熱も行なえるものである。Therefore, the electronic component 5 is mounted on the printed wiring board 32 below.
It can be fixed by soldering to the conductor pattern 32c formed on the back surface of the. Also in the case of the present embodiment, the LED 4 can be fixed in a more stable state and the heat can be radiated by applying the heat radiating resin 6 so as to partially embed the LED 4.
【００２０】なお、本実施例の場合には、Ｘ軸とＹ軸の
導体パターンに２本のリードを持つ単色のＬＥＤ４を接
続し、ダイナミック点灯させる方法を説明したが、３本
以上のリードを持つ多色のＬＥＤをダイナミック点灯さ
せる場合においても、多数の多層印刷配線板を用い、各
々のリードと各印刷配線板の導体パターンとをスルーホ
ールで接続し、印刷配線板表面から裏面へ貫通するスル
ーホールを適宜設け電子部品を接続することにより、多
色表示の表示ユニットを形成することができる。但し、
リードがスルーホールを介して各印刷配線板の導体パタ
ーンに直接接続される必要はなく、表面で接続してもよ
い。In the case of the present embodiment, the method of connecting the monochromatic LED 4 having two leads to the X-axis and Y-axis conductor patterns and dynamically lighting the LED 4 has been described. Even in the case of dynamically lighting the multi-colored LEDs that it has, a large number of multilayer printed wiring boards are used, each lead and the conductor pattern of each printed wiring board are connected by through holes, and the printed wiring board is penetrated from the front surface to the back surface By appropriately providing through holes and connecting electronic components, a display unit for multicolor display can be formed. However,
The lead need not be directly connected to the conductor pattern of each printed wiring board through the through hole, but may be connected on the surface.
【００２１】また、リードを印刷配線板に挿入する方法
と、折曲したリードを印刷配線板に直接半田付けする２
つの方法を併用してもよい（例えば、３本のリードの
内、１本を折り曲げ表面の導体パターンに、２本目と３
本目をスルーホール内に挿入し、それぞれ１枚目と２枚
目の印刷配線板の裏面の導体パターンにスルーホールを
介して接続してもよい）。A method of inserting the leads into the printed wiring board and a method of directly soldering the bent leads to the printed wiring board 2
One of the three leads may be used together (for example, one of the three leads is bent to form a conductor pattern on the surface and the second and
The first may be inserted into the through hole and connected to the conductor patterns on the back surfaces of the first and second printed wiring boards via the through hole, respectively).
【００２２】さらに、多層印刷配線板の貫通するスルー
ホールを予め各印刷配線板に設け、スルーホールの位置
を合わせた状態で重合し形成しても、あるいは積層後に
孔を開け、メッキを施して（スルーホールを）形成して
もよい（本実施例は後者）。また、表面の導体パターン
に折り曲げたリードを半田付けする方法にあっては、折
り曲げ方向に制約されるものではない。Further, through holes penetrating through the multilayer printed wiring board may be provided in advance in each printed wiring board, and the through holes may be formed by superposition with the positions of the through holes aligned, or by forming a hole after lamination and plating. (Through hole) may be formed (the latter in this embodiment). In addition, the method of soldering the bent leads to the conductor pattern on the surface is not limited to the bending direction.
【００２３】また、各印刷配線板の厚みや挿入するリー
ドの長さにも制約を受けるものではない（多層で、か
つ、厚みの制約を受ける場合には、リードを安定させる
ため本来の導体パターンより深くリードを挿入する必要
がある）。以上の如く、発光ダイオードのリードを印刷
配線板の表面で半田付けし、スルーホールによって裏面
の電子部品と電気的に接続する構造は、本出願に含まれ
るものとする。Further, there is no restriction on the thickness of each printed wiring board or the length of the lead to be inserted (when there is a multilayer and there is a restriction on the thickness, in order to stabilize the lead, an original conductor pattern is provided. Need to insert the lead deeper). As described above, the structure in which the leads of the light emitting diode are soldered on the surface of the printed wiring board and electrically connected to the electronic components on the back surface through the through holes is included in the present application.
【００２４】[0024]
【発明の効果】本発明は前記したように、発光ダイオー
ドのリードを多層印刷配線板のスルーホールに挿入し、
半田付けを該印刷配線板の表面側で行ない、あるいは、
印刷配線板のスルーホールに接続された表面側の導体パ
ターンにリードの先端折曲部を半田付けしたので、裏面
側の実装面積を有効に使用できて電子部品の実装密度を
上げて高密度化を図ることができ、しかも、印刷配線板
は１枚であることから薄型化が図れ、その結果、表示ユ
ニットの小型化を図ることができると共に、接続体が不
要であることから部品点数が減ってコストの低減を図る
ことができる等の効果を有するものである。As described above, the present invention inserts the lead of the light emitting diode into the through hole of the multilayer printed wiring board,
Soldering is performed on the surface side of the printed wiring board, or
Since the bent tip of the lead is soldered to the conductor pattern on the front side that is connected to the through hole of the printed wiring board, the mounting area on the back side can be used effectively and the mounting density of electronic parts can be increased to increase the density. Moreover, since the number of printed wiring boards is one, it can be made thin, and as a result, the display unit can be downsized, and the number of parts is reduced because a connecting body is not required. Therefore, there is an effect that the cost can be reduced.
【図１】本発明の道路情報表示板用表示ユニットの第１
実施例を示す平面図である。FIG. 1 is a first display unit for a road information display board according to the present invention.
It is a top view showing an example.
【図２】同上のＡ−Ａ線断面図である。FIG. 2 is a sectional view taken along line AA of the above.
【図３】第２実施例の平面図である。FIG. 3 is a plan view of a second embodiment.
【図４】同上のＢ−Ｂ線断面図である。FIG. 4 is a sectional view taken along line BB of the above.
【図５】電光表示盤の要部を示す分解斜視図である。FIG. 5 is an exploded perspective view showing a main part of the electronic display panel.
【図６】従来の道路情報表示板用表示ユニットの断面図
である。FIG. 6 is a cross-sectional view of a conventional road information display board display unit.
【符号の説明】 ３ 多層印刷配線板 ３１ 上の印刷配線板 ３１ａ，３１ｃ スルーホール ３１ｂ，３１ｄ 導体パターン ３２ 下の印刷配線板 ３２ａ，３２ｃ スルーホール ３２ｂ，３２ｄ 導体パターン ４ 発光ダイオード ４ａ リード ４ａ1 先端折曲部 ５ 電子部品 ６ 放熱用樹脂 ７ 放熱ケース[Explanation of Codes] 3 multilayer printed wiring board 31 printed wiring board 31a, 31c through hole 31b, 31d conductor pattern 32 lower printed wiring board 32a, 32c through hole 32b, 32d conductor pattern 4 light emitting diode 4a lead 4a 1 tip Bent part 5 Electronic parts 6 Heat dissipation resin 7 Heat dissipation case
Claims (2)
ーホールに発光ダイオードのリードを挿入すると共に、
該スルーホールの上面において半田付け固定し、かつ、
前記リードを導体パターンに電子部品を半田付け固定し
た多層印刷配線板の裏面側と電気的に接続したことを特
徴とする発光ダイオードを用いた道路情報表示板用表示
ユニット。1. A light emitting diode lead is inserted into a through hole formed on the front surface side of a multilayer printed wiring board, and
Fixed by soldering on the upper surface of the through hole, and
A display unit for a road information display board using a light emitting diode, characterized in that the lead is electrically connected to the back side of a multilayer printed wiring board in which an electronic component is soldered and fixed to a conductor pattern.
パターンに発光ダイオードのリード先端折曲部を半田付
け固定し、かつ、前記リードを導体パターンに電子部品
を半田付け固定した多層印刷配線板の裏面側と電気的に
接続したことを特徴とする道路情報表示板用表示ユニッ
ト。2. A multi-layer printed wiring in which a lead tip bent portion of a light emitting diode is fixed by soldering to a conductor pattern formed on the front surface side of a multi-layer printed wiring board, and an electronic component is fixed by soldering the lead to the conductor pattern. A display unit for a road information display board, which is electrically connected to the back side of the board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP28588894A JPH08123337A (en) | 1994-10-26 | 1994-10-26 | Display unit for road information display board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP28588894A JPH08123337A (en) | 1994-10-26 | 1994-10-26 | Display unit for road information display board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH08123337A true JPH08123337A (en) | 1996-05-17 |
Family
ID=17697327
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP28588894A Pending JPH08123337A (en) | 1994-10-26 | 1994-10-26 | Display unit for road information display board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH08123337A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| FR2834112A1 (en) * | 2001-12-24 | 2003-06-27 | Simon Elkrief | Video screen electroluminscent diode lighting control having card support outer face control component with secondary card outer face fixed each control equipment |
| WO2019150949A1 (en) * | 2018-01-30 | 2019-08-08 | ソニーセミコンダクタソリューションズ株式会社 | Display device and electronic device |
| JP2022537701A (en) * | 2019-06-14 | 2022-08-29 | エックス ディスプレイ カンパニー テクノロジー リミテッド | Pixel module with controller and light emitter |
-
1994
- 1994-10-26 JP JP28588894A patent/JPH08123337A/en active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| FR2834112A1 (en) * | 2001-12-24 | 2003-06-27 | Simon Elkrief | Video screen electroluminscent diode lighting control having card support outer face control component with secondary card outer face fixed each control equipment |
| WO2019150949A1 (en) * | 2018-01-30 | 2019-08-08 | ソニーセミコンダクタソリューションズ株式会社 | Display device and electronic device |
| JP2022537701A (en) * | 2019-06-14 | 2022-08-29 | エックス ディスプレイ カンパニー テクノロジー リミテッド | Pixel module with controller and light emitter |
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