JPH08120228A - Conductor connecting structure, its production and connecting member - Google Patents

Abstract

PURPOSE: To provide a conductor connecting member with which finely pitched terminals of conductors can be connected to each other in high reliability in a manner in which the components are repairable. CONSTITUTION: This structure is one provided at least two members 1 and 2 which have their respective connecting terminals 12 and 21, wherein the connecting terminals 12 of the 1st member 1 is connected to the connecting terminal 21 of the 2nd member with a conductive material 810, and the area outside the connecting terminal 21 of the 1st member is adhered to the area outside the conductor of the 2nd member with a nonconductive material, provided that the conductive material comprises a conductive polymer having a main chain having conjugated double bonds, the nonconductive material comprises a connecting layer 820 containing a nonconductive polymer having a main chain having conjugated double bonds and a connecting layer 71 containing a thermoplastic polymer.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a conductor connection structure in which two members each having a conductor are connected, a manufacturing method thereof, and a connection member.

[0002]

2. Description of the Related Art A liquid crystal display device, an LSI (Large
When mounting electronic components such as Scale Integration),
It is necessary to electrically connect and mechanically connect or fix. Currently, in such mounting, the following techniques (a) to (d) are used.

(A) As shown in FIG. 13, the LSI chip 2 is fixed face-up to the wiring board 1 with an adhesive 6. Then, the connection terminal 21 of the LSI chip 2 and the connection terminal 12 of the wiring board 1 are connected by the gold wire 4.

(B) As shown in FIG. 14, gold bumps 23 are formed on the connection terminals 21 of the LSI chip 2. Then, the gold bumps 23 are pressure-bonded to the connection terminals 12 of the wiring board 1. At the same time, these are fixed with a resin 5 (for example, it is described in JP-A-5-21522).

(C) As shown in FIG. 15, an adhesive 6 is applied to the LSI chip mounting portion of the wiring board 1. On the other hand, LS
A resin containing the conductive particles 7 is pattern-printed on the connection terminal 21 of the I-chip 2, these are aligned, then thermocompression bonded and cured (for example, described in JP-A-5-90443).

(D) As shown in FIG.
A film (so-called anisotropic conductive film) formed by dispersing a resin in a thermoplastic or thermosetting polymer 32 3
Is sandwiched between the LSI chip 2 provided with the protruding electrode 23a on the connection terminal 21 and the substrate 1 and aligned, and then thermocompression bonded (for example, described in JP-A-5-206208).

[0007]

The above-mentioned conventional connection systems have the following problems, respectively.

The method (a) is expensive because the connection terminals 12 of the wiring board 1 need to be metallized with gold. Further, there is a drawback that the mounting area is large.

The above method (b) requires gold metallization of the connection terminals 12 of the wiring board 1 and the LSI.
Since it is necessary to form the gold bump 23 also on the chip 2,
It has the drawback of being extremely expensive. Also, if the height of the gold bumps 23 varies, the height of the connection terminals 12 varies as shown in FIG. 17, or the substrate 11 warps as shown in FIG. 18, electrical connection is made. There is also a problem that some parts are not processed.

In the above methods (c) and (d), the electrical connection is ensured only by the simple contact between the conductive particles 7, 31 and the connection terminals 12, 21. It has the drawback of being low. For example, as shown in FIG. 19, there are variations in the height of the connection terminal 12,
If the substrate 11 is warped as shown in FIG. 20,
Some parts are not electrically connected. Further, if the wiring is further miniaturized, it is extremely difficult to prevent a short circuit with an adjacent wiring.

This is because it is difficult for the conductive particles 31 to be completely dispersed, and when the dispersibility is not perfect, as shown in FIG.
This is because a portion 33 where the conductive particles 31 are in contact with each other is generated as shown in FIG. When the conductive particle groups 33 in contact with each other extend between adjacent wirings, a short circuit occurs.

Further, the connection terminals 12 and 21 are made of conductive particles 3.
When located in the region 34 where 1 does not exist, there is also a problem that electrical connection is not achieved. The wiring board 1 and the LS
In connection with the I-chip 2, it is practically impossible to prevent any positional deviation, and if the wiring becomes fine, the effect of this positional deviation on the occurrence of a short circuit will increase at an accelerating rate. Furthermore, as the wiring becomes finer, the number of conductive particles 7 and 31 that come into contact with the connection terminals 12 and 21 decreases, so that the connection resistance per one connection terminal increases and the reliability of the connection decreases. There is also a problem.

In recent years, all electronic circuits and the like have been miniaturized, and the above-mentioned problems are becoming more and more serious. Therefore, there has been a widespread demand for a technique capable of connecting terminals at a narrower pitch.

The present invention solves such a problem and has high reliability even when the distance between terminals is narrow, connection of an LSI chip to a wiring board, and TAB (Tape Automated Bondin).
g) An object of the present invention is to provide a low-cost and high-reliability mounting method for a wiring board for electronic components, such as connecting the board to a liquid crystal display board.

[0015]

In order to achieve the above object, the present invention comprises at least two members each having a connecting terminal made of a conductor, and a connecting terminal provided on a first member and a second connecting member. Of the first member is connected to the connection terminal provided on the member by a conductive material, and the portion other than the conductor of the first member and the portion other than the conductor of the second member are bonded by a non-conductive material. In the conductor connection structure, the conductive material includes a conductive polymer having a conjugated double bond as a main chain skeleton, and the non-conductive material has a non-conductive material having a conjugated double bond as a main chain skeleton. There is provided a conductor connecting structure comprising a connecting layer containing the polymer of 1. and an adhesive layer containing a thermoplastic polymer.

In the non-conductive polymer, at least a part of the conjugated double bond of the conductive polymer having a conjugated double bond as a main chain skeleton is non-conjugated or is cleaved. As a result, a polymer that has become non-conductive can be used. Further, the connection layer of the conductive material and the non-conductive material may include at least one of a thermoplastic polymer and a thermosetting polymer.

Further, in the present invention, a connection layer containing a polymer having a conjugated double bond as a main chain skeleton and an adhesive layer made of a thermoplastic polymer are provided, and the polymer of the connection layer is irradiated with light. Thus, a connecting member having a property of changing conductivity is provided.

This connecting member preferably has the adhesive layer and the connecting layer laminated, and comprises two layers of the adhesive layer, the first adhesive layer, the connecting layer, and the second adhesive layer. It is desirable to have a structure in which the above three layers are laminated in this order.

Further, according to the present invention, there is provided a method of manufacturing a conductor connection structure for connecting connection terminals of two members having a connection terminal made of a conductor, the first member having a surface provided with the connection terminal, and The connecting layer containing a polymer having a conjugated double bond as a main chain skeleton between the surface of the second member and the surface provided with the connection terminal, and having a property of changing conductivity by light irradiation, and a thermoplastic layer. It has a step of holding a connecting member provided with an adhesive layer made of molecules, a step of thermocompression-bonding the first member and a second member, and a step of irradiating at least a part of the connecting layer with light. A method for manufacturing a conductor connection structure is provided.

The connection member is preferably a film having a connection layer and an adhesive layer which are prepared in advance. Alternatively, the connection member includes a step of forming the connection layer on a surface of the first member including the connection terminal,
It may be formed by a step of forming the adhesive layer on the surface of the connection layer. In the connection member, the step of forming the connection layer on the surface of the first member provided with the connection terminal, and the step of forming the adhesive layer on the surface of the second member provided with the connection terminal. You may form by a process. When two adhesive layers are provided, a step of forming the first adhesive layer on the surface of the first member on which the connection terminals are provided, and an upper connection layer on the surface of the first adhesive layer. And a step of forming a second adhesive layer on the surface of the second member on which the connection terminal is provided, and a step of joining the connection layer and the second adhesive layer. May be.

When at least one of the first member and the second member transmits light, the step of irradiating the light is a step of irradiating the light through the member which transmits the light. Is desirable. Moreover, when at least one of the first member and the second member transmits light, the step of irradiating the light may be performed after the step of thermocompression bonding.

[0022]

First, a method of connecting electronic components according to the present invention will be described. Here, the case where the LSI chip is mounted on the wiring board is taken as an example, but the present invention is not limited to this, and can be applied to any connection of an electronic component having a connection terminal.

(1) As the connection method of the present invention, first,
The connection method shown in FIG. 1 may be used. As shown in FIG. 1A, a connection layer 81 made of a composition containing a conductive polymer and an adhesive layer 71 made of a thermoplastic polymer are provided on a wiring board 1.
And 2 are formed so as to be laminated in this order.

Next, from the side of the wiring substrate 1 where the connection layer 81 and the adhesive layer 71 are formed, light is irradiated to the portion other than the upper portion of the connection terminal 12 through the photomask 9. As a result, as shown in FIG. 1B, the connection terminal 1 of the connection layer 81 is
Only the upper part 2 remains as the conductor part 810, and the connection layer 81 of the other part (the part irradiated with light) selectively has a high resistance. This high resistance portion is shown as "high resistance portion 820" in FIG.

After that, if the conductive portion 810 and the connection terminal 21 of the LSI chip 2 with bumps are aligned and thermocompression-bonded, the thermoplastic polymer layer 71 becomes low in viscosity by heating, so that it is pressed. The bumps 23 push the bumps 23 and remove the bumps 23 from the conductive portions 810, so that the wiring board 1 and the LSI chip 2 are connected to each other via the conductive portions 810, as shown in FIG. 1C. To be done. In addition,
The insulation between the terminals 12 is maintained by the high resistance portion 820.

(2) In the above method (1), the connecting member is made of a polymer that becomes high in resistance when exposed to light. However, a polymer that becomes conductive when exposed to light is used. You may use. This case is shown in FIG.

First, a connection layer 91 made of a composition containing a high-resistance conductive polymer precursor and a thermoplastic polymer adhesive layer 71 are formed on the wiring board 1. And FIG.
As shown in (a), the photomask 9 is used, and light is applied only to the upper portion of the connection terminal 12 from the adhesive layer 71 side. As a result, as shown in FIG. 2B, the connection layer 91 above the connection terminal 12 has increased conductivity and becomes a conductive portion 910, and the other portions are left with high resistance (this portion). Is shown as high resistance portion 920).

Thereafter, the conductive portion 910 and the bump 23 are formed.
If the position of the attached LSI chip 2 and the connection terminal 21 are aligned and thermocompression-bonded, the thermoplastic polymer layer 71 has a low viscosity due to heating, and thus is pressed by the bump 23 to be electrically conductive with the bump 23. Since the thermoplastic polymer is excluded from the connection portion with the portion 910 and the bumps 23 of the LSI chip 2 and the connection terminals 12 of the wiring board 1 are connected via the conductive portion 910, it is shown in FIG. Thus, the connection between the wiring board 1 and the LSI chip 2 is achieved. In this case, the insulation between the terminals 12 is maintained by the high resistance portion 920.

(3) In the above (1) and (2),
Although the light is emitted from the side of the substrate on which the adhesive layer 71 is formed, the light may be emitted from the side on which the connection layers 81 and 91 and the adhesive layer 71 are not formed. This method is shown in FIG. In this method, a substrate that transmits the irradiated light, such as a glass substrate, is used.

First, a connection layer 81 made of a composition containing a conductive polymer and an adhesive layer 71 made of a thermoplastic polymer are sequentially formed on one side of the wiring board 1. Next, the LSI chip 2 with the bumps 23 is attached to the bumps 23 and the adhesive layer 7.
When they are placed so as to face each other and thermocompression-bonded, the thermoplastic polymer layer has a low viscosity due to heating, and therefore is pressed by the bumps 23 by pressure to connect the bumps 23 and the conductive portion 810. The electrical connection between the connection terminal 12 of the wiring board 1 and the terminal 21 of the LSI chip 2 is achieved via the conductive polymer.

As shown in FIG. 3A, from the side of the transparent substrate 11 on which the LSI chip is mounted, on which the LSI chip 2 is not mounted, as shown in FIG.
1 is irradiated with light. Then, when the connection terminal 12 is made of a substance that blocks light, the connection terminal 12 functions as a photomask, and the conductive polymer 81 in the portion without the connection terminal 12 is irradiated with light to have a high resistance, As shown in FIG. 3B, the high resistance portion 820 is formed. This ensures the insulation between the adjacent connection terminals. On the other hand, in the conductive polymer (conductive portion 810) of the connection layer 81 located above the connection terminal 12, the connection terminal 12
Since it is blocked by and is not irradiated with light, the conductivity is maintained as it is. In this way, it is not necessary to separately prepare a photomask, and the adhesive layer 8 at the position where the connection terminal 12 is not present.
It is possible to irradiate 1 with light accurately. Further, since the wiring board 1 and the LSI chip 2 are also bonded to each other in the high resistance portion 820, a sufficient bonding force can be obtained.

Incidentally, when the connection terminal 12 is made of a transparent conductive film, or when the metal wiring is also used and the film thickness is thin and the light cannot be sufficiently shielded as a photomask, FIG. As shown in the drawing, if a photomask 9 is separately provided to block the light radiated to the position of the connection terminal 12, the connection terminal 12 and the bump 23 are electrically connected in the same manner and the connection terminal 12 is insulated. Can be secured.

(4) In the above method (3), the light irradiation is performed after the LSI chip 2 is mounted on the wiring board 1.
The wiring board 1 and the LSI chip 2 may be thermocompression-bonded after first irradiating light. In the case where the substrate 11 transmits light like glass and the connection terminal 12 transmits light like a transparent electrode, and the wiring material in the substrate 11 also transmits light like a transparent conductive film. Can also use the method shown in FIG. 4 as described below.

First, a connection layer 81 made of a composition containing a conductive polymer precursor and a thermoplastic polymer adhesive layer 71 are sequentially formed on one side of the wiring board 1. Next, the LSI chip 2 with the bumps 23 is attached to the bumps 23 and the adhesive layer 7.
When they are placed so as to face each other and thermocompression-bonded, the thermoplastic polymer layer has a low viscosity due to heating, and thus is pressed by the bumps 23 by pressure to connect the bumps 23 to the connection layer 81. And the LS and the connection terminal 12 of the wiring board 1
The terminal 21 of the I-chip 2 is connected via the connection layer 81.

Wiring board 1 on which this LSI chip 2 is mounted
From the side where the LSI chip 2 is not mounted, as shown in FIG.
As shown in (a), light is irradiated through the photomask 9 only to the conductive polymer precursor of the connection layer 91 at the position of the connection terminal 12. Then, the light-irradiated portion has increased conductivity, and the highly-conductive portion 910 is obtained. On the other hand, the portion without the connection terminal 12 is not irradiated with light due to the existence of the photomask 9, and remains in a high resistance state. This is,
The high resistance portion 920.

As a result, the connection terminal 12 and the terminal 21 of the LSI chip 2 can be electrically connected and the insulation between adjacent wirings can be secured. Further, since the wiring board 1 and the LSI chip 2 are also adhered to each other in the high resistance portion 920, a sufficient joining force can be obtained.

(5) When the substrate 11 and the wiring in the substrate 11 transmit light and the connection terminal 12 does not transmit light, the method shown in FIG. 5 as described below can also be used.

First, a connection layer 81 made of a composition containing a conductive polymer and an adhesive layer 71 of a thermoplastic polymer are sequentially formed on the wiring board 1, and the connection layer 81 is formed as shown in FIG. As shown, light is emitted through the substrate 11 of the wiring substrate 1. At this time, if the connection terminal 12 blocks light, the connection terminal 12 itself functions as a photomask. As a result, as shown in FIG. 5B, only the portion where the light is blocked by the connection terminal 12 is the conductive portion 810.
As a result, the resistance of the other portion is increased by the irradiated light, and the high resistance portion 820 is obtained.

Next, the conductive portion 810 and the connection terminal 21 of the LSI chip 2 with the bump 23 are aligned with each other,
The LSI chip 2 is placed on the substrate 1 so that the adhesive layer 71 and the bumps 23 face each other and thermocompression bonded. At this time, since the thermoplastic polymer of the adhesive layer 71 has a low viscosity due to heating, it is pushed by the bumps 23 by pressure and is eliminated from the connection portion between the bumps 23 and the conductive portion 810, and the adhesive layer 71 is removed as shown in FIG.
As shown in, the connection between the connection terminal 12 of the wiring board 1 and the bump 23 of the LSI chip 2 is achieved through the conductive portion 810 of the connection layer 81. Also in this case, insulation between terminals is maintained by the high resistance portion 820.

(6) When the substrate 11 and the wiring in the substrate 11 are made of a material that transmits light, the connection terminal 12
It is possible to use the mounting method as shown in FIG.

First, a connection layer 81 made of a composition containing a conductive polymer and an adhesive layer 71 of a thermoplastic polymer are sequentially formed on one surface of the wiring board 1. Next, from the side of the wiring board 1 where the adhesive layer 71 is not formed, light is irradiated through the photomask 9 only to the portion of the connection layer 81 where the connection terminals 12 are not provided. As a result, only the conductive polymer in that portion has a high resistance, and the high resistance portion 820 is obtained. After that, the LSI chip 2 is placed on the wiring board 1 with the adhesive layer 71 and the bumps 23 facing each other, and the conductive portion 810 and the LS are placed.
When the I-chip 2 is aligned with the connection terminal 21 and thermocompression-bonded, the thermoplastic polymer layer 71 has a low viscosity due to heating, and thus is pressed by the bump 23 to be pressed by the bump 23.
And the conductive portion 810 is removed from the connection site, as shown in FIG.
As shown in (c), the connection between the wiring board 1 and the LSI chip 2 is achieved through the conductive portion 810.

(7) When the substrate 11 transmits light like glass and the wiring material transmits light like transparent conductive film, the mounting method shown in FIG. 7 is applied. You can also

First, a connection layer 91 made of a composition containing a conductive polymer precursor and an adhesive layer 71 made of a thermoplastic polymer are sequentially laminated on one surface of the wiring board 1. Then, as shown in FIG. 7A, the adhesive layer 71 of the wiring board 1 is formed.
Light is applied only to the portion of the connection terminal 12 through the photomask 9 from the side where the wiring is not formed. As a result, FIG.
As shown in (b), the connection layer 91 above the connection terminal 12 is formed.
Only the conductive portion 910 can be left, and the other portion can be left as the high resistance portion 920.

Thereafter, the wiring board 1 and the LSI chip are arranged so that the adhesive layer 71 and the bump 23 face each other, and the conductive portion 910 and the connection terminal 21 of the LSI chip 2 are aligned and thermocompression bonded. For example, since the thermoplastic polymer layer has a low viscosity due to heating, it is pressed by the bumps 23 by pressure and is removed from the connection portion between the bumps 23 and the conductive portion 910, as shown in FIG. Thus, the connection between the connection terminal 12 of the wiring board 1 and the bump 23 of the LSI chip 2 through the conductive portion 910 is achieved. Again, insulation between the terminals is maintained by the high resistance portion 920.

(8) In the above (1) to (7), the connection layer 81 or 91 and the adhesive layer 71 are formed on the wiring board 1, but the electronic components to be mounted (here, the LSI chip 2 is used as an example. Connection layer 81 or 91 and the adhesive layer 71 may be formed. An example of the mounting method in this case is shown in FIG.

First, an adhesive layer 71 made of a thermoplastic polymer and a connection layer 81 made of a composition containing a conductive polymer are provided on the bump 23 side of the LSI chip 2 having the bumps 23.
And are sequentially formed. Then, as shown in FIG.
From the side where the connection layer 81 is formed, the connection layer 81 is irradiated with light through the photomask 9 that blocks the light irradiated to the portion of the connection terminal 21. As a result, as shown in FIG. 8B, only the light-irradiated portion has a high resistance and becomes a high-resistance portion 820, and a light-shielded area (connection terminal 21
(Corresponding to the part) remains conductive and the conductive part 81
It becomes 0.

Thereafter, the wiring board 1 and the LSI chip 2 are arranged so that the connection layer 81 (the conductive portion 810 and the high resistance portion 820) and the connection terminal 12 face each other, and the conductive portion 810 and the wiring are arranged. The substrate 1 and the connection terminal 12 are aligned with each other and thermocompression bonded. As a result, before thermocompression bonding,
Even if the bump 23 is not in contact with the conductive portion 810 as shown in (b), since the thermoplastic resin of the connection layer 71 has a low viscosity by heating, it is pressed by the bump 23 due to pressure, and the Excluded from the connection portion with the conductive portion 810, as shown in FIG.
A connection with the chip 2 via the conductive part 810 is achieved. Also in this case, insulation between terminals is maintained by the high resistance portion 820.

(9) Further, even if a conductive polymer precursor which becomes conductive when irradiated with light is used, an adhesive layer and a connection layer are formed on the side of the LSI chip 2 as in (8) above. Implementation method can be realized. This mounting method is shown in FIG.

First, an adhesive layer 71 made of a thermoplastic polymer and a connection layer 91 made of a composition containing a conductive polymer precursor are sequentially formed on the surface of the LSI chip 2 having the bumps 23 on which the bumps 23 are provided. Form. In this LSI chip 2,
As shown in FIG. 9A, through the photomask 9 that blocks the light radiated to other than the portion of the connection terminal 21 (that is, the light is radiated only to the region of the connection terminal 21), Light is emitted from the side where the connection layer 91 is formed. As a result, as shown in FIG. 9B, the connection layer 91 in the light-irradiated region (the region where the connection terminal 21 is present) becomes conductive and becomes the conductive portion 910, and the light-shielded region (connection The connection layer 91 in the region where the terminals 21 are not present) is left as it is not conductive and becomes the high resistance portion 920.

After that, the wiring substrate 1 and the LSI chip 2 are arranged so that the connection layer 91 (the conductive portion 910 and the high resistance portion 920) and the connection terminal 12 face each other, and the conductive portion 910 and the wiring are arranged. The substrate 1 and the connection terminal 12 are aligned with each other and thermocompression bonded. Since the thermoplastic resin of the adhesive layer 71 has a low viscosity due to the heating, even if the bump 23 is not in contact with the conductive portion 810 as shown in FIG. When pushed, the bump 23 and the conductive portion 810 are removed from the connection site,
As shown in (c), the connection between the wiring board 1 and the LSI chip 2 by the conductive portion 910 is achieved. Again, insulation between the terminals is maintained by the high resistance portion 920.

In the above (1) to (9), the mounting of the LSI chip has been described as an example, but the present invention is not limited to surface mounting components (for example, transistors, chip capacitors, chip inductors, chip resistors, etc.). The present invention can be applied to connection of electronic components such as mounting of electronic components such as package LSI) on a wiring substrate and mounting of a liquid crystal display panel on a TAB substrate.

A liquid crystal display device can be mentioned as a typical example of a device using a glass substrate. In the liquid crystal display element, there are cases where only the transparent conductive film is used as the material of the wiring (connection terminal 12) and cases where two-layer wiring of the transparent conductive film and the metal material is used. When a two-layer wiring of a transparent conductive film and a metal material is used as the wiring material, the wiring itself can be used as a photomask as described above. Therefore, a very rational manufacturing process can be realized. On the other hand, when the wiring material is only the transparent conductive film, light may be emitted through the photomask as described above.

In connection with a connection terminal on a wiring board that does not transmit light, such as a printed board or a ceramic board,
As described above, a separate photomask may be provided and light may be irradiated from the side of the film of a conductive polymer or the like.

As described above, according to the present invention, an adhesive layer made of a thermoplastic polymer and a connection layer made of a composition containing a conductive polymer or a conductive polymer precursor are used for connecting electronic parts. A connecting member having a multilayer structure is used. The composition containing the conductive polymer or the conductive polymer precursor of the present invention changes in conductivity (that is, resistance) by irradiation with light. By using a multi-layered connecting member in this way, it is possible to increase the adhesiveness of the connection portion and increase the sensitivity to light irradiation while ensuring conduction and insulation by using a conductive polymer whose resistance changes with light irradiation. be able to.

In the present invention, as a polymer (conductive polymer or conductive polymer precursor) contained in a polymer composition whose resistance changes by irradiation of light, a polymer having a conjugated double bond as a main chain skeleton is used in the present invention. Use the molecule. This polymer compound contains
There is a drawback that the adhesive strength is low as compared with a thermoplastic polymer used as a hot melt adhesive. However, in the present invention, since the electronic component is connected by the layered structure of the connection layer containing the conductive polymer for achieving electrical continuity and the layer of the thermoplastic polymer having high adhesiveness, low adhesion of the conductive polymer is obtained. The adhesiveness can be supplemented and high adhesive strength can be obtained. In the present invention, the adhesive layer is formed by using a thermoplastic polymer. The thermoplastic polymer of the adhesive layer is softened by heating during thermocompression bonding and is pushed away from the joint portion of the conductor, so that it does not hinder conduction and is suitable for the connection method of the present invention.

Further, in the present invention, the connection member comprises a connection layer made of a polymer composition whose resistance changes by irradiation with light,
Since it has a layered structure with an adhesive layer made of a thermoplastic polymer, the amount of the polymer composition whose resistance is changed by irradiation with light is small even if a connecting member having a thickness capable of obtaining sufficient adhesiveness is used. Therefore, the irradiation amount of light required to obtain sufficient conductivity or insulation is smaller than that in the case where the connecting member is made of only the polymer composition whose resistance changes by the irradiation of light. In the present invention, only the thickness necessary for electrical connection is a connection layer made of a polymer composition whose resistance changes by irradiation with light, and the thickness required to secure adhesiveness is Since it is held by a thermoplastic polymer that has no
The conductivity of the connection layer can be significantly changed with a small light irradiation amount.

In the present invention, a polymer having a conjugated double bond as a main chain skeleton is used as the polymer whose conductivity changes. This polymer is classified into those that are conductive in the oxidized or reduced state and not conductive in the neutral state, and those that are not conductive in the basic state and conductive in the salt state.
Here, a conductive state (oxidized state, reduced state, salt state) is called a conductive polymer, and a high resistance state (neutral state, basic state) is a non-conductive polymer or conductive state. It is called a polymer precursor.

Next, the polymer that can obtain conductivity in the redox state will be described. A polymer having such a conjugated double bond as a main chain skeleton is imparted with high conductivity when subjected to a doping treatment with a dopant (oxidizing agent or reducing agent). Typical examples of such polymers are polypyrrole, polythiophene, polyacetylene,
Examples thereof include polyphenylene vinylene and polythienylene vinylene. These polymers have extremely high resistance in a neutral state and are substantially insulators, but when they are changed into an oxidized state or a reduced state by performing the doping treatment with the above-mentioned dopant, the conductivity is remarkably increased. In the present specification, the above-mentioned polymer having a high conductivity in an oxidized state or a reduced state is referred to as a conductive polymer, and the above-mentioned polymer which is substantially an insulator in a neutral state is referred to as a conductive polymer precursor. Call it the body.

Examples of the oxidizing agent that can be used as the dopant include iodine, bromine, ferric chloride and antimony pentafluoride. In general, the polymer is more stable in the oxidized state than in the reduced state. Examples of reducing agents that can be used as dopants include metallic sodium and metallic potassium. When these reducing agents are used as the dopant, it is preferable to use polythiophene as the polymer.

Many of these polymers generally have a low solubility in a solvent and are poor in processability. However, the hydrogen atom of a thiophene ring, a pyrrole ring, a benzene ring, or acetylene is replaced with an alkyl group or an alkoxyl group, or a hydroxyl group, an ester group, a urethane group,
By substituting any of an alkyl group, an alkoxyl group, and a thioalkyl group having an amino group, an amide group, a ketone group, a cyano group, or the like, the solubility in an organic solvent can be increased. In addition, the adhesiveness can be exhibited by introducing these substituents.

By irradiating these polymers with light,
Oxidized state of the above polymer (that is, highly conductive state)
To a neutral state (that is, a state with high resistance), a substance that generates a reducing agent when receiving light (hereinafter,
The “latent reducing agent”) may be mixed in the conductive polymer film. When the latent reducing agent is irradiated with light, the reducing agent is generated, and the reducing agent reduces the conductive polymer in an oxidized state to a neutral state, that is, a high resistance state. Examples of this latent reducing agent include tricarbonyl (cyclopentadienyl) manganese (I) [Mn (CO) ₃ (C
₅ H ₅ )], tricarbonyl (cyclooctatetraene)
Mention may be made of metal carbonyl complexes such as iron (0) [Fe (CO) ₃ (C ₈ H ₈ )]. This metal carbonyl complex generates carbon monoxide as a reducing substance when receiving light. In addition, these latent reducing agents can also be used to change a polymer in a neutral state into a reduced state.

In order to change these polymers from a neutral state (that is, a high resistance state) to an oxidation state (that is, a state having high conductivity) by irradiating with light,
A substance that generates an oxidant upon irradiation with light (hereinafter referred to as “latent oxidant”) may be mixed in the film of the conductive polymer precursor. When the latent oxidant is irradiated with light, the oxidant is generated to oxidize the conductive polymer precursor in a neutral state,
The oxidization state, that is, the high conductivity state. Examples of this latent oxidant include [Co (NH ₃ ) ₅ I] ²⁺ (pentaammine iodocobalt (III) ion) and [Co (N
H ₃ ) ₅ N ₃ ] ²⁺ (pentaammine azidocobalt (III)
Ion). When irradiated with light, these ions generate iodine radicals, which are strong oxidants. These ions are added to the conductive polymer precursor in the form of salt.

As another method for bringing the conductive polymer into a high resistance state, a method in which the conjugated chain of the conductive polymer is partially deconjugated or cleaved by light irradiation to lose the conductivity can be mentioned. be able to. The photoreaction that causes this non-conjugation includes a photoisomerization reaction, a photocyclization reaction, and a photocleavage reaction. Examples of the photoreactive agent for promoting such photoreaction include azide compounds, cinnamoyl compounds, acrylic compounds, diazo compounds, carbonyl compounds, benzyl, benzoin, benzoin alkyl ethers, and disulfide compounds. Among these, particularly, benzoin alkyl ethers and α-
Diketones are preferred.

As described above, the non-conductive polymer in the neutral state is reduced or oxidized when exposed to light in the presence of a latent oxidant or a latent reducing agent, and becomes a conductive polymer. Become. Therefore, when the composition used for forming the connection layer of the present invention contains a non-conductive polymer whose conductivity changes by redox, it further contains a latent oxidant or a latent reducing agent. At this time, the weight ratio of the latent oxidizing agent or the latent reducing agent to the non-conductive polymer having a conjugated double bond as a main chain skeleton is preferably 0.1 to 10. If the latent oxidizing agent or the latent reducing agent is less than this range, the effect of the additive is not sufficient, and if it is more than this range, the conductivity of the obtained film with conductivity is insufficient. Become. Note that, in general, a non-conductive polymer having a conjugated double bond as a main chain skeleton is more stable in an oxidized state than in a reduced state. Therefore, this composition contains a latent oxidizing agent rather than a latent reducing agent. Is desirable.

Further, a conductive polymer having a conjugated double bond as a main chain skeleton in an oxidized state is reduced to a neutral state by being irradiated with light in the presence of a latent reducing agent, and becomes a non-neutral state. Be conductive. Having a conjugated double bond as a main chain skeleton,
When a conductive polymer in a reduced state is irradiated with light in the presence of a latent oxidant, it is oxidized to be in a neutral state and nonconductive. In addition, when a conductive polymer having a conjugated double bond as a main chain skeleton is irradiated with light in the presence of a photoreactive agent, the conjugated system is partially destroyed and becomes non-conductive. Therefore, when the composition used for forming the connection layer of the present invention contains a conductive polymer having a conjugated double bond as a main chain skeleton, a latent reducing agent, a latent oxidizing agent or a photoreactive agent is further added. Including. At this time, the weight ratio of the latent reducing agent, the latent oxidizing agent, and the photoreactive agent to the conductive polymer having a conjugated double bond as a main chain skeleton is preferably 0.1 to 10. If the amount of the latent reducing agent, latent oxidant or photoreactive agent is less than this range, the effect of the additive is not sufficient, and if the amount is more than this range, the portion left unirradiated with light ( The conductivity of the film of the conductive portion) becomes insufficient.

Next, a polymer that is not conductive in the basic state and conductive in the salt state will be described. As such a polymer, specifically, polyaniline having an emeraldine structure (hereinafter, simply referred to as “polyaniline”) can be used. Polyaniline is in a basic state before the doping process. The basic polyaniline is a polymer having a repeating unit represented by the following structural formula (Formula 1). Polyaniline has an extremely high resistance in this state and is practically an insulator. In the present specification, polyanine in such a basic state is also referred to as a conductive polymer precursor.

[0067]

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The polyaniline in the basic state becomes a salt state when treated with an acid, and has high conductivity. This salt-form polyaniline has the following structural formula (Formula 2).
It is a polymer having a repeating unit represented by. In addition, in the present invention, polyaniline in which hydrogen is substituted with an alkyl group, an alkoxyl group, or the like can also be used. It may also be substituted with an epoxy group in order to improve the adhesiveness.

[0069]

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As dopants for doping polyaniline, mineral acids such as hydrochloric acid, sulfuric acid, nitric acid and phosphoric acid, carboxylic acids such as acetic acid, propionic acid and trifluoroacetic acid, methanesulfonic acid, benzenesulfonic acid,
Sulfonic acids such as p-toluenesulfonic acid and camphor sulfonic acid can be used. N-methylpyrrolidone is preferable as a solvent for dissolving polyaniline.

In order to convert the non-conductive polyaniline into a conductive polyaniline by light irradiation, a substance (hereinafter, referred to as “acid generator”) which generates an acid when receiving light is added to the non-conductive polyaniline film. To do. The acid generator generates acid when exposed to light. By the generated acid, the non-conductive polyaniline in the base state is doped and converted into the conductive polyaniline in the salt state. Therefore, when the film containing the non-conductive polyaniline and the acid generator is irradiated with light, only the light irradiation part is selectively conductive.

Examples of the acid generator include halides having a bond between a halogen atom and a carbon atom. Among them, a halide having a trihalomethyl group is preferable. Suitable halogens are chlorine, bromine or iodine, with bromine being most suitable. Examples of such a halide acid generator include tetra (bromomethyl) methane, 1,2-dibromo-1,2-diphenylethane,
1,2-dibromoethylbenzene, 2,2,2-tribromoethanol, tribromomethylphenyl sulfone,
Examples include trichloroacetic acid pentachlorophenyl ester, and trichloroacetamide. Furthermore, acenaphthyl tetramethylene sulfonium trifluoromethane sulfonate can also be used as an acid generator.

In order to make conductive polyaniline into non-conductive polyaniline by light irradiation, a substance that generates a base upon receiving light (hereinafter referred to as "base generator") is formed on the conductive polyaniline film. You can mix them. The base generator generates a base when irradiated with light. Due to the generated base, the conductive polyaniline is undoped and converted into a non-conductive polyaniline in the basic state. For this reason, when the film containing the conductive polyaniline and the base generator is irradiated with light, only the light irradiation portion selectively becomes an insulator.

Examples of the base generator include N-cyclohexylcarbamic acid-2-nitrobenzyl ester, N-
Cyclohexylcarbamic acid-2-nitro-α-methylbenzyl ester, N-cyclohexylcarbamic acid-
2,6-dinitrobenzyl ester, N-cyclohexylcarbamic acid-2,6-dinitro-α-methylbenzyl ester, N-methylcarbamic acid-2-nitrobenzyl ester, N-ethylcarbamic acid-2-nitrobenzyl ester, etc. Carbamate esters may be mentioned.

As a method for making conductive polyaniline in a high resistance state, a photoreactant which causes a photoreaction with polyaniline by light irradiation is mixed and the conjugated chain of conductive polyaniline is partially unconjugated by light irradiation. It is also possible to use a method in which the conductivity is lost by converting the polyaniline into a main chain or by cutting a part of the main chain of polyaniline. In this case, a photoreactive agent is used instead of the base generator. Examples of the photoreactive agent include azide compounds, cinnamoyl compounds, acrylic compounds, diazo compounds, carbonyl compounds, benzyl, benzoin, benzoin alkyl ethers, and disulfide compounds. Among these, particularly, benzoin alkyl ethers, α
-Diketones are preferred.

As described above, when polyaniline in the basic state is irradiated with light in the presence of an acid generator, it becomes a salt and is given conductivity. Therefore, when the composition used for forming the connection layer of the present invention contains polyaniline in the basic state, it further contains an acid generator. At this time, the weight ratio of the acid generator to polyaniline is preferably 0.1 to 10. When the weight ratio of the acid generator to polyaniline is less than 0.1, the doping effect is not sufficient, and when it is more than 10, the conductivity of the obtained film having conductivity is insufficient.

When polyaniline in a salt state is irradiated with light in the presence of a base generator, it becomes in a base state and loses conductivity. Further, when polyaniline in a salt state is irradiated with light in the presence of a photoreactive agent, the conjugated system is partially destroyed and the conductivity is lost. Therefore, when the composition used for forming the connection layer of the present invention contains polyaniline in a salt state, it further contains a base generator or a photoreactive agent.
At this time, the weight ratio of the base generator and the photoreactive agent to polyaniline is preferably 0.1 to 10.
If the amount of the base generator or the photoreactive agent is less than this range, dedoping is not sufficient, and if the amount of the base generator or the photoreactive agent is more than this range, the film of the portion (conductive portion) left unexposed to light is left. The conductivity becomes insufficient.

The composition used for forming the connection layer may contain a thermoplastic polymer or a thermosetting polymer in addition to the conductive polymer or the conductive polymer precursor. By doing so, the adhesiveness of the connection layer itself can be enhanced. Further, since the thermoplastic polymer is easily dissolved in the solvent, there is an advantage that the component can be easily removed and the repair can be easily performed when the component bonded or connected has a defect. Examples of thermoplastic polymers that can be used in the connection layer of the present invention include polyvinyl alcohol, polyethylene oxide, polyvinyl ether, polyvinyl butyral, polyvinyl formal, polystyrene, allyl resin, methacrylic resin, polyvinyl chloride,
Examples thereof include polyvinylidene chloride, vinyl acetate, vinyl propionate, ethylene vinyl acetate copolymer, ethylene vinyl chloride copolymer, ketone resin, polybutadiene, polyacetal, polysulfone, polyamide, copolymerized nylon and thermoplastic polyimide. When high adhesiveness is required, a thermosetting polymer having high adhesiveness, such as epoxy resin or polyimide, is mixed. If necessary, the thermoplastic polymer and the thermosetting polymer may be blended and added.

The weight of the thermoplastic polymer or the thermosetting polymer contained in the composition used for forming the connection layer is 80% or less when the total amount of the polymer compounds contained in the composition is 100%. Is desirable. This is because if it is 80% or more, the conductivity is insufficient. That is, when the total amount of polymer compounds contained in the composition is 100%, it is desirable that the polymer having a conjugated double bond as the main chain skeleton is 20% or more. The conductivity of this composition depends substantially on the amount of the conductive polymer contained in the composition, and if it is 20% or less, sufficient conductivity cannot be obtained.

As the thermoplastic polymer of the adhesive layer of the present invention, polyvinyl alcohol, polyethylene oxide, polyvinyl ether, polyvinyl butyral, polyvinyl formal, polystyrene, allyl resin, methacrylic resin, polyvinyl chloride, polyvinylidene chloride, vinyl acetate, Examples thereof include vinyl propionate, ethylene vinyl acetate copolymer, ethylene vinyl chloride copolymer, ketone resin, polybutadiene, polyacetal, polysulfone, polyamide, copolymerized nylon and thermoplastic polyimide.

The conductive polymer (polymer having a conjugated double bond in the oxidized or reduced state as the main chain or polyaniline in the salt state) or the conductive polymer precursor (in the neutral state) used in the present invention. The composition of a polymer having a conjugated double bond as a main chain or a polyaniline in a basic state) may include a solvent. By including a solvent, the viscosity of the composition can be adjusted to be suitable for coating.

Suitable solvents for adjusting the viscosity of the composition used for forming the connecting layer in the present invention include alcohols, ethylene glycol mono- or dialkyl ethers, diethylene glycol mono- or dialkyl ethers, and N-methyl. Pyrrolidone and dimethyl sulfoxide can be mentioned. In addition, aromatic compounds such as benzene, toluene, xylene, and ketones such as nitriles, acetic acid esters, and acetone can be used as a solvent. In addition, these solvents can also be used for adjusting the viscosity of the thermoplastic polymer for forming the adhesive layer so as to be suitable for coating. The amount of the solvent, the amount of polymer having a conjugated double bond as the main chain,
It is desirable that the content be 10 wt% or more. 10
This is because it is difficult to obtain a film having a sufficient thickness if it is less than wt%.

Next, a method of forming the connecting member will be described. First, a method for forming the connection layer will be described.

First, a conductive polymer other than polyaniline,
That is, the case of using a composition containing a polymer having a conjugated double bond as a main chain skeleton such as polypyrrole, polythiophene, polyacetylene, polyphenylene vinylene, and polythienylene vinylene will be described.

When forming a conductive connection layer, first, these polymers in a neutral state (a conductive polymer precursor having an insulating property) and a latent reducing agent or A composition containing a photoreactive agent, a wiring board, a roll coating method on an electronic component or an adhesive layer, a screen printing method,
It is applied by a method such as a dipping method or brush coating, and then the solvent is evaporated. As a result, a film containing the conductive polymer precursor as a main component is once formed. Subsequently, the conductive polymer precursor film is subjected to oxidation treatment with an oxidizing vapor such as iodine or antimony pentachloride, or a solution of ferric chloride, so that the conductive polymer precursor is highly conductive. The numerator. This makes it possible to obtain a conductive connection layer.

Further, a composition containing a polymer (conductive polymer) which has been oxidized in advance and a latent reducing agent or a photoreactive agent is roll-coated on a wiring board, an electronic component or an adhesive layer by a roll coating method, It is also possible to form the conductive connection layer by applying by a method such as a screen printing method, a dipping method, a brush coating method, and then by evaporating the solvent. Similarly, it is also possible to form a conductive connection layer by applying a composition containing a polymer (conductive polymer) that has been reduced in advance and a latent oxidizing agent or a photoreactive agent, and drying the composition. Generally, a polymer having a conjugated double bond as a main chain is more stable in an oxidized state than in a reduced state, and therefore it is desirable to use a composition containing the polymer in an oxidized state.

When forming an insulating connection layer, a composition containing a polymer in a neutral state and a latent oxidizing agent or a latent reducing agent is applied on a wiring board, an electronic component or an adhesive layer. Is applied by a method such as a roll coating method, a screen printing method, a dipping method or a brush coating method, and then the solvent is evaporated.
This makes it possible to obtain an insulating connection layer. As mentioned above, it is desirable that the composition contain a latent oxidizing agent rather than a latent reducing agent because the oxidation state is more stable.

Next, the case where the composition containing polyaniline is used as a composition whose resistance changes by irradiation with light will be described.

In the case of forming a conductive connection layer using polyaniline, first, polyaniline in the basic state (non-conductive polymer, that is, conductive polymer precursor), and a base generator or photoreaction A composition containing an agent is applied to a wiring board, an electronic component or an adhesive layer by a roll coating method, a screen printing method, a dipping method, a brush coating method or the like, and the solvent is evaporated to give a non-conductive polyaniline. Forming a connection layer including. Next, this non-conductive connecting layer is immersed in an acid solution or exposed to acid vapor to bring polyaniline into a salt state to make it conductive. This allows
A conductive connecting layer is obtained.

Further, a composition containing polyaniline, which has been added with a dopant in advance into a salt state, and a base generator or a photoreactive agent, is subjected to roll coating, screen printing,
The conductive connecting layer containing polyaniline may be formed by coating and drying by a method such as a dipping method or brush coating.

When a non-conductive connecting layer is formed using polyaniline, a composition containing polyaniline in a basic state and an acid generator is used and applied in the same manner as in the above case.
dry. In this way, a non-conductive connecting layer containing polyaniline can be obtained.

For the adhesive layer, a thermoplastic polymer composition composed of a thermoplastic polymer and a solvent is applied onto a wiring board, an electronic component or a connection layer by a roll coating method, a screen printing method, a dipping method, brush coating, etc. It is obtained by coating by the method of 1 and then evaporating the solvent. In addition, without using a solvent,
It is also possible to obtain a connection layer by heating a thermoplastic polymer to reduce its viscosity, applying it and cooling it.

The method of forming the connecting layer and the adhesive layer described above is a method of directly coating the surface of a wiring board or the like with a polymer or its composition and drying the coating film. You may form the film which consists of a polymer or its composition, and you may use it for forming a connection layer and / or an adhesive layer.

Next, a method of forming a connecting member composed of an adhesive layer and a connecting layer will be described. The connection member can be formed by the following first to fourth methods.

The first method is a method of sequentially forming the connection layer 5 and the adhesive layer 71 on the wiring board or the electronic component. In this method, the connection member including the connection layer 5 and the adhesive layer 71 may be formed on only one of the wiring board and the component, or may be formed on both.

In FIG. 22, a connecting member 220 is formed on the wiring board 1.
The process in the case of forming is illustrated. In this method, first, as shown in FIG. 22B, a conductive polymer or a conductive polymer precursor is provided on the side of the wiring substrate 1 shown in FIG. A connection layer 5 made of a composition containing is formed, and an adhesive layer 71 is formed on the connection layer 5 by the method described above, as shown in FIG. As a result, the connecting member 220 is formed.
The electronic component 2 is placed on the connection member 220 as shown in FIG. 22D so that the bumps 23 face the connection layer 5.

In the method shown in FIG. 22 described above, the component (or the substrate) only having the connecting terminal 12 and not having the bump 23 is provided.
Although the connection member 220 is formed on the side of, the connection member 220 may be formed on the side of the component (or the substrate) including the bump 23. Connecting member 22 to electronic component 2 having bumps 23
The process for forming the film is shown in FIG. In this method, first, the adhesive layer 71 is formed on one of the two components or the substrate to be connected, whichever has the bump 23. That is, the bump 23 of the electronic component 2 as shown in FIG.
24B, the adhesive layer 71
And the adhesive layer 71 is formed as shown in FIG.
The connection layer 5 is formed on the surface. Thereby, the connecting member 22
0 is formed. The connection target of this component 2 (see FIG.
In the example shown in FIG. 24, the substrate 1) is arranged on the surface of the connection layer 5 of the connection member 220 so that the connection terminals 12 face the connection layer 5, as shown in FIG.

In the present invention, the first adhesive layer, the connection layer,
A connection member composed of three layers in which the second adhesive layer and the second adhesive layer are laminated in this order can also be used. FIG. 23 illustrates the process for forming the three-layer connecting member. In this method, first, as shown in FIG. 23B, the first adhesive layer 7 is formed on the side of the wiring substrate 1 shown in FIG.
1 is formed, the connection layer 5 is formed on the surface of the adhesive layer 71 as shown in FIG. 23 (c), and as shown in FIG. 23 (d).
A second adhesive layer 71 is formed on the surface of the connection layer 5. As a result, the connecting member 230 having a three-layer structure is formed. The electronic component 2 is mounted on the connecting member 230 so that the bumps 23 face the connecting layer 5, as shown in FIG.

In the method shown in FIG. 23, the connecting member 230 is formed only on the side of the component (or substrate) which does not have the bumps 23 but only the connecting terminals 12, but it is connected to the side of the component (or substrate) which has the bumps 23. The member 230 may be formed. In this method, first, as shown in FIG. 25B, a first adhesive layer 71 is formed on the side of the electronic component 2 shown in FIG. The connection layer 5 is formed as shown in FIG.
As shown in (d), the second adhesive layer 71 is formed on the surface of the connection layer 5. Thereby, the connecting member 23 having a three-layer structure
0 is formed. The wiring board 1 is arranged on the surface of the connection member 230 so that the connection terminal 12 faces the connection layer 5, as shown in FIG.

In the second method, the connection layer 5 is formed on either one of the two components (or the substrate) to be connected, and the adhesive layer 71 is formed on the other, and the connection layer 5 and the adhesive layer 71 are formed.
This is a method of forming the connection member 220 by joining and.

FIG. 26 shows a process in which the connecting layer 5 is formed on one of the two parts (or the substrate) to be connected that does not have the bump 23, and the adhesive layer 71 is formed on the one having the bump 23. To do. The example shown in FIG. 26 is a step of forming the connecting member 220 in the case of connecting the wiring board 1 and the electronic component 2, and the bump 23 is provided in the electronic component 2. In this case, the connection terminals 12 of the wiring board 1 shown in FIG.
The connection layer 5 is formed on the side provided with as shown in FIG. On the other hand, the adhesive layer 7 is formed on the side of the electronic component 2 shown in FIG.
1 is formed. The wiring board 1 including the connection layer 5 and the electronic component 2 including the adhesive layer 71 are connected to the connection layer 5 and the adhesive layer 7.
When they are arranged so as to face each other, the connection member 220 including the adhesive layer 71 and the connection layer 5 is obtained.

In the third method, two layers of the first adhesive layer 71 and the connection layer 5 are formed on one of the two components (or the substrate) to be connected, and the second adhesive layer 71 is formed on the other. Is formed and the connecting layer 5 and the second adhesive layer 71 are joined together to form the connecting member 230.

Of the two components (or substrate) to be connected, the adhesive layer 71 and the connecting layer 5 are formed on the side not having the bumps 23, and the side having the bumps 23 has the adhesive layer 71.
FIG. 28 illustrates a process for forming the film. The example shown in FIG. 28 is a step of forming the connecting member 230 in the case of connecting the wiring board 1 and the electronic component 2, and the bump 23 is provided in the electronic component 2. In this case, as shown in FIG. 28B, the first adhesive layer 71 and the connection layer 5 are laminated in this order on the side of the wiring board 1 shown in FIG. On the other hand, as shown in FIG. 28D, a second adhesive layer 71 is formed on the side of the electronic component 2 shown in FIG. 28C where the bumps 23 are provided. When the wiring board 1 including the first adhesive layer 71 and the connecting layer 5 and the electronic component 2 including the second adhesive layer 71 are arranged so that the connecting layer 5 and the second adhesive layer 71 face each other. , The first adhesive layer 71 and the connection layer 5
A connecting member 230 including the second adhesive layer 71 and the second adhesive layer 71 is obtained.

Of the two parts (or substrate) to be connected, the adhesive layer 71 and the connection layer 5 are provided on the side having the bump 23.
The adhesive layer 71 is formed on the side not having the bumps 23.
The process for forming the is shown in FIG. The example shown in FIG. 29 is a step of forming the connecting member 230 when the wiring board 1 and the electronic component 2 are connected, and the bump 23 is provided in the electronic component 2. In this case, the first adhesive layer 71 is formed on the side of the wiring board 1 shown in FIG. 29A having the connection terminal 12 as shown in FIG. 29B. On the other hand, FIG.
The second adhesive layer 71 and the connection layer 5 are laminated in this order on the side of the electronic component 2 shown in FIG. When the wiring board 1 including the first adhesive layer 71 and the electronic component 2 including the second adhesive layer 71 and the connecting layer 5 are arranged such that the connecting layer 5 and the first adhesive layer 71 face each other. , The first adhesive layer 71 and the connection layer 5
A connecting member 230 including the second adhesive layer 71 and the second adhesive layer 71 is obtained.

The fourth method is a method in which a connection member, which is a laminate of the connection layer 5 and the adhesive layer 71, is separately prepared in advance. The connection member 230 made of three layers is taken as an example, and the connection member created in advance is shown in FIG.

In this method, a film made of a composition containing a polymer whose conductivity is changed by light is formed, and the film is laminated with a thermoplastic polymer to form an adhesive layer 71, which is a connection member. A film for use is prepared. Alternatively, the connection film 5 serving as a connection member may be produced by forming the connection layer 5 made of the above composition on the surface of the thermoplastic polymer film 71 by coating or the like. Further, in a connection member including a multilayer adhesive layer 71, such as a three-layered connection member including the first adhesive layer 71, the connection layer 5, and the second adhesive layer 71, the thermoplastic material forming each adhesive layer 71 is thermoplastic. The macromolecule is
They may be the same as or different from each other. further,
Each layer forming the connecting member may be separately prepared in advance as a film, and the connecting member may be formed by laminating the films.

When connecting two electronic parts (or substrates) using this pre-made connecting member,
Light is applied to a predetermined portion of the connection layer 5 in advance to form a conductive portion or a non-conductive portion, and then connection 2
Hold this connecting member with one electronic component (or board),
After thermocompression bonding or holding the connecting member with two electronic parts (or substrates) to be connected, light is irradiated to a predetermined portion of the connecting layer 5 to form a conductive portion or a non-conductive portion. , Thermocompression bonding. In FIG. 30B, the electronic component 2 and the wiring board 1 are used to form a three-layer connection member 230.
The cross-sectional view at the time of holding is shown.

Next, a connecting method using the above-mentioned connecting member will be described. The connection terminals of the two connection objects (electronic components or wiring boards) on which the connection layer and / or the adhesive layer formed by the above-described method are formed are aligned with each other and thermocompression bonded. This achieves electrical connection and mechanical bonding. If a layer formed of a composition containing a thermoplastic polymer or a thermosetting polymer in addition to a conductive polymer or a non-conductive polymer is used for the connection layer, the bonding should be easier. You can After the thermocompression bonding, it is preferable to continue the pressurization until the connection part is cooled, but the pressurization can be stopped before the connection part is cooled to room temperature. In addition, it is possible to improve the reliability of electrical connection and mechanical adhesion by applying ultrasonic waves to the connection portion during thermocompression bonding.

As described above, in the present invention, the connection of the electronic parts is not made only by the conductive polymer and the non-conductive polymer having a low adhesive force, but by the thermoplastic polymer having a high adhesive force. Since the layers are used, a strong bond can be achieved. Therefore, high reliability of connection can be obtained. Further, since the thickness of the connection layer whose conductivity is changed by light irradiation is thin, the light irradiation amount required for changing the conductivity can be small.

Further, according to the present invention, even if the surface of the wiring board has irregularities, the connection surface can be flattened by the polymer film. Further, even if there is variation in the height of the connection terminals, it is not affected. Therefore, high connection yield and high reliability can be obtained. 10 shows the case where the height of the connection terminal 23 varies, FIG. 11 shows the case where the height of the connection terminal 12 varies, and FIG. 12 shows the case where the substrate 11 warps. Figure 10
As shown in FIGS. 12 to 12, according to the present invention, good connection can be obtained through the connection layer 5 even if there is a cause of poor contact in the case of these conventional techniques.

Further, since the connection layer 5 of the present invention can change the conductivity of only a desired portion by irradiating with light, it can be applied to connection of connection terminals with a fine pitch.

In the present invention, as described above, the connecting member may be formed on either the substrate or the electronic component mounted thereon, but it is preferable to form the connecting member on the substrate. This is more effective when it is formed on the substrate than when it is formed on the electronic component, in order to eliminate the influence of the unevenness of the substrate surface, and multiple electronic components are mounted on one substrate. This is because there is an advantage that the work efficiency is high because it is sufficient to form one connecting member for each substrate at once instead of forming the connecting member for each electronic component. Actually, when mounting a small component such as an LSI chip, it is not preferable in terms of workability to form a polymer film on the connection terminal side of the electronic component. But,
When the components to be connected are relatively large, for example, when the liquid crystal display panel is mounted on the TAB substrate, even if the connection member is formed on the electronic component (liquid crystal display panel) side instead of the substrate, There is no problem in workability.

The conductivity of the connection layer of the present invention is changed by irradiation of light, but after mounting the electronic parts, the connection part is covered with a casing or the like to block the light from the outside, and thus the conductivity of the connection layer is improved. It is desirable to inhibit the change. The change in conductivity due to the incident light on the connection layer due to the multiple reflection of the glass substrate or the like of the light irradiated in the normal use condition is not so large and does not impair the practical use. When used for a long period of time, it is desirable to prevent the irradiation of ultraviolet rays by attaching an ultraviolet ray blocking filter or the like.

[0114]

EXAMPLES Examples of the present invention will be described below. In addition,
Embodiments 1 to 31 are for mounting an LSI chip on a wiring board. Example 32 to Example 54 are examples in which a liquid crystal display plate is mounted on a TAB substrate.

[Embodiment 1] This corresponds to the example shown in FIG.

First, 5 wt% of poly (3-n-octylthiophene), which is a polymer having a conjugated double bond as a main chain skeleton, and tricarbonyl (cyclopentadienyl) manganese (, which is a latent reducing agent, Chloroform solution containing 5% by weight of I) (concentration of solute is 10% by weight)
Was prepared.

A wiring having a width of 25 μm, which is made of a metal chrome having a thickness of 0.25 μm and a transparent conductive film having a thickness of 0.12 μm, a metal chrome having a thickness of 0.25 μm, and a thickness of 0.12 μm, 256 made of transparent conductive film of
0.7 with 50 μm × 50 μm connecting terminals 12
It is applied to the surface of the glass wiring board 1 having a thickness of mm, which is provided with the connection terminals 12, to evaporate chloroform as a solvent,
A film containing a conductive polymer precursor having a thickness of 5 μm was formed.
This film was oxidized with iodine vapor to obtain a conductive polymer connecting layer 81.

On the other hand, a 10 wt% solution of polyvinyl butyral in chloroform was applied to the surface of the LSI chip 2 on which the gold bumps 23 were formed to provide the connection terminals 21, and chloroform was evaporated to form a film of polyvinyl butyral having a thickness of 8 μm. The adhesive layer 71 was formed.

Next, as shown in FIG. 3A, the LSI chip 2 is aligned and placed on the connection layer 81 of the glass wiring board 1 and heated at 150 ° C. and 1.5 MPa / cm ² . After pressure bonding, ultraviolet rays (365 nm) were irradiated for 5 minutes from the side of the glass wiring board 1 on which the LSI chip 2 was not mounted, and the non-projection portion 820 of the connection terminal 12 was made to have high resistance. In this case, the metallic chrome of the connection terminal 12 functions as a photomask. In this embodiment, the wiring is provided perpendicularly to the connection terminal 12 and the ultraviolet rays are irradiated in parallel with the wiring, so that light shielding by the wiring does not pose a problem. The obtained mount has a structure as shown in FIG. The connection resistance of this mounting body was 1 Ω or less, and the insulation resistance between adjacent terminals was 200 MΩ or more.

[Embodiment 2] This corresponds to the example shown in FIG.

First, 5 wt% of poly (thienylenevinylene) (1 part by weight), which is a polymer having a conjugated double bond as a main chain skeleton, and tricarbonyl (cyclopentadienyl), which is a latent reducing agent. A connecting composition which is a chloroform solution containing 5 wt% of manganese (I) (1 part by weight) (solute concentration is 10 wt%) was prepared.

A wiring having a width of 25 μm, which is made of a chromium metal film having a thickness of 0.25 μm and a transparent conductive film having a thickness of 0.12 μm, a metal chromium film having a thickness of 0.25 μm and a thickness of 0.12 μm, 256 made of transparent conductive film of
0.7 with 50 μm × 50 μm connecting terminals 12
It is applied to the surface of the glass wiring board 1 having a thickness of mm, which is provided with the connection terminals 12, to evaporate chloroform as a solvent,
A film containing a conductive polymer precursor having a thickness of 5 μm was formed.
This was oxidized with iodine vapor to obtain a connection layer 81 containing a conductive polymer.

On the other hand, the LSI chip 2 on which gold bumps are formed
A 10 wt% chloroform solution of polyvinyl butyral was applied to the surface provided with the connection terminal 21 of 1. and chloroform was evaporated to form a polyvinyl butyral film having a thickness of 8 μm.

Next, as shown in FIG. 3A, the LSI chip 2 is aligned and placed on the connection layer 81 of the glass wiring board 1 and heated at 150 ° C. and 1.5 MPa / cm ² . After pressure bonding, ultraviolet rays (365 nm) were irradiated for 5 minutes from the side of the glass wiring board 1 on which the LSI chip 2 was not mounted, and the non-projection portion 820 of the connection terminal 12 was made to have high resistance. In this case, the metallic chrome of the connection terminal 12 functions as a photomask. The obtained mounting body is shown in FIG.
The structure is as shown in Fig. The connection resistance of this mounting body was 1 Ω or less, and the insulation resistance between adjacent terminals was 200 MΩ or more.

[Third Embodiment] This corresponds to the example shown in FIG.

First, 5 w of poly (paraphenylene vinylene), which is a polymer having a conjugated double bond as a main chain skeleton, is used.
t% (1 part by weight) and 5% of tricarbonyl (cyclopentadienyl) manganese (I) which is a latent reducing agent.
A chloroform solution containing wt% (1 part by weight) (concentration of solute is 10 wt%) was prepared.

This connecting composition is composed of a wiring having a width of 25 μm, which is made of chrome metal having a thickness of 0.25 μm and a transparent conductive film having a thickness of 0.12 μm, and a metal chrome having a thickness of 0.25 μm and a bright conductive film. 256 50μm x 50μ
It is applied to a glass wiring board 1 having a thickness of 0.7 mm provided with m connecting terminals 12 to evaporate chloroform as a solvent and poly (paraphenylene vinylene) as a conductive polymer precursor (1 part by weight). And tricarbonyl (cyclopentadienyl) manganese (I) (1 part by weight) were formed to a thickness of 5 μm. This film was oxidized with ferric chloride to obtain a connection layer 81 containing a conductive polymer.

On the other hand, a 10 wt% solution of polyvinyl butyral in chloroform was applied to the surface of the LSI chip 2 on which the gold bumps 23 were formed and the connection terminals 21 were formed. The adhesive layer 71 was formed.

Next, as shown in FIG. 3A, the LSI chip 2 is aligned and placed on the connection layer 81 of the glass wiring board 1 and heated at 150 ° C. and 1.5 MPa / cm ² . After pressure bonding, ultraviolet rays (365 nm) were irradiated for 5 minutes from the side of the glass wiring board 1 on which the LSI chip 2 was not mounted, and the non-projection portion 820 of the connection terminal 12 was made to have high resistance. In this case, the metallic chrome of the connection terminal 12 functions as a photomask. The obtained mounting body is shown in FIG.
The structure is as shown in Fig. The connection resistance of this mounting body was 1 Ω or less, and the insulation resistance between adjacent terminals was 200 MΩ or more.

[Embodiment 4] This corresponds to the example shown in FIG.

First, a connection composition was prepared in which the solute was a 10 wt% meta-cresol solution consisting of polyaniline, camphorsulfonic acid as a dopant, and N-cyclohexylcarbamic acid 2-nitrobenzyl ester as a base generator. did. Polyaniline, camphor sulfonic acid, N-cyclohexylcarbamic acid 2-
The weight ratio with the nitrobenzyl ester is 1: 1.3: 3.
Is.

A wiring having a width of 25 μm, which is made of a chromium metal film having a film thickness of 0.25 μm and a transparent conductive film having a film thickness of 0.12 μm, a metal chromium film having a film thickness of 0.25 μm and a film thickness of 0.12 μm, 256 made of transparent conductive film of
0.7 with 50 μm × 50 μm connecting terminals 12
It is applied to the surface of the glass wiring board 1 having a thickness of mm having the connection terminal 12 to evaporate the solvent metacresol, and polyaniline, camphorsulfonic acid and N-cyclohexylcarbamic acid 2-nitrobenzyl ester A connection layer 81, which is a conductive polyaniline film containing in a weight ratio of: 1.3: 3, was formed.

On the other hand, a 10 wt% solution of polyvinyl butyral in chloroform was applied to the surface of the LSI chip 2 having the gold bumps 23 on which the connection terminals 21 were provided, and chloroform was evaporated to form a film of polyvinyl butyral having a thickness of 8 μm. The adhesive layer 71 was formed.

Next, as shown in FIG. 3A, the LSI chip 2 is aligned and placed on the connection layer 81 of the glass wiring board 1 and heated at 150 ° C. and 1.5 MPa / cm ² . After pressure bonding, ultraviolet rays (365 nm) were irradiated for 5 minutes from the side of the glass wiring board 1 on which the LSI chip 2 was not mounted, and the non-projection portion 820 of the connection terminal 12 was made to have high resistance. In this case, the metallic chrome of the connection terminal 12 functions as a photomask. The obtained mounting body is shown in FIG.
The structure is as shown in Fig. The connection resistance of this mounting body was 1 Ω or less, and the insulation resistance between adjacent terminals was 200 MΩ or more.

[Embodiment 5] This corresponds to the example shown in FIG.

First, the solute is poly (3-n-octylthiophene) which is a polymer having a conjugated double bond as a main chain skeleton, polyvinyl butyral which is a thermoplastic polymer, and a trit which is a latent reducing agent. A 10 wt% chloroform solution containing carbonyl (cyclopentadienyl) manganese (I) was prepared as a connecting composition. Poly (3
The weight ratio of -n-octylthiophene), polyvinyl butyral, and tricarbonyl (cyclopentadienyl) manganese (I) is 1: 2: 1.

A wiring having a width of 25 μm, which is made of a metal chrome having a thickness of 0.25 μm and a transparent conductive film having a thickness of 0.12 μm, metal chrome having a thickness of 0.25 μm and a thickness of 0.12 μm, 256 made of transparent conductive film of
0.7 with 50 μm × 50 μm connecting terminals 12
It is applied to the surface of the glass wiring board 1 having a thickness of mm, which is provided with the connection terminals 12, to evaporate chloroform as a solvent,
The conductive polymer precursor poly (3-n-octylthiophene) (1 part by weight), polyvinyl butyral (2 parts by weight), and tricarbonyl (cyclopentadienyl) manganese (I) (1 part by weight) were used. A film having a thickness of 5 μm was formed. This was oxidized with iodine vapor to make it conductive, and a connection layer 81 was obtained.

On the other hand, a 10 wt% solution of polyvinyl butyral in chloroform was applied to the surface of the LSI chip 2 on which the gold bumps 23 were formed to provide the connection terminals 21, and chloroform was evaporated to form a film of polyvinyl butyral having a thickness of 8 μm. The adhesive layer 71 was formed.

Next, as shown in FIG. 3A, the LSI chip 2 is aligned and placed on the connection layer 81 of the glass wiring board 1 and heated at 150 ° C. and 1.5 MPa / cm ² . After pressure bonding, ultraviolet rays (365 nm) were irradiated for 5 minutes from the side of the glass wiring board 1 on which the LSI chip 2 was not mounted, and the non-projection portion 820 of the connection terminal 12 was made to have high resistance. In this case, the metallic chrome of the connection terminal 12 functions as a photomask. The obtained mounting body is shown in FIG.
The structure is as shown in Fig. The connection resistance of this mounting body was 1 Ω or less, and the insulation resistance between adjacent terminals was 200 MΩ or more.

[Sixth Embodiment] This corresponds to the example shown in FIG.

First, the solute is polyaniline, polyvinyl butyral which is a thermoplastic polymer, camphorsulfonic acid which is a dopant, and N-cyclohexylcarbamic acid 2-nitrobenzyl ester which is a base generator. A connection composition which is a meta-cresol solution of was prepared. The weight ratio of polyaniline, polyvinyl butyral, camphor sulfonic acid and N-cyclohexylcarbamic acid 2-nitrobenzyl ester is
It is 1: 2: 1.3: 3.

A wiring having a width of 25 μm, which is made of a metal chrome having a thickness of 0.25 μm and a transparent conductive film having a thickness of 0.12 μm, a metal chrome having a thickness of 0.25 μm and a thickness of 0.12 μm, 256 made of transparent conductive film of
0.7 with 50 μm × 50 μm connecting terminals 12
It is applied to the surface of the glass wiring board 1 having a thickness of mm, which is provided with the connection terminals 12, to evaporate metacresol which is a solvent, polyaniline (1 part by weight), polyvinyl butyral (2 parts by weight), and camphor sulfonic acid ( 1.3 parts by weight)
A connection layer 81 having a thickness of 5 μm, which is a conductive polyaniline film containing N-cyclohexylcarbamic acid 2-nitrobenzyl ester (3 parts by weight), was formed.

On the other hand, a 10 wt% solution of polyvinyl butyral in chloroform was applied to the surface of the LSI chip 2 having the gold bumps 23 on which the connection terminals 21 were provided, and chloroform was evaporated to form a film of polyvinyl butyral having a thickness of 8 μm. The adhesive layer 71 was formed.

Next, as shown in FIG. 3A, the LSI chip 2 is aligned and placed on the connection layer 81 of the glass wiring board 1 and heated at 150 ° C. and 1.5 MPa / cm ² . After pressure bonding, ultraviolet rays (365 nm) were irradiated for 5 minutes from the side of the glass wiring board 1 on which the LSI chip 2 was not mounted, and the non-projection portion 820 of the connection terminal 12 was made to have high resistance. In this case, the metallic chrome of the connection terminal 12 functions as a photomask. The obtained mounting body is shown in FIG.
The structure is as shown in Fig. The connection resistance of this mounting body was 1 Ω or less, and the insulation resistance between adjacent terminals was 200 MΩ or more.

[Embodiment 7] This corresponds to the example shown in FIG.

First, the solute is polyaniline, polyvinyl formal which is a thermoplastic polymer, camphor sulfonic acid which is a dopant, and N-cyclohexylcarbamic acid 2-nitrobenzyl ester which is a base generator. A connection composition which is a meta-cresol solution of was prepared. The weight ratio of polyaniline, polyvinyl formal, camphor sulfonic acid and N-cyclohexylcarbamic acid 2-nitrobenzyl ester is
It is 1: 2.5: 1.3: 3.

A wiring having a width of 25 μm, which is made of a metallic chromium film having a thickness of 0.25 μm and a transparent conductive film having a thickness of 0.12 μm, a metallic chromium film having a thickness of 0.25 μm and a thickness of 0.12 μm, 256 made of transparent conductive film of
0.7 with 50 μm × 50 μm connecting terminals 12
It is applied to the surface of the glass wiring board 1 having a thickness of mm, which is provided with the connection terminals 12, to evaporate metacresol which is a solvent, polyaniline (1 part by weight), polyvinyl formal (2.5 parts by weight), and camphor sulfone. A connection layer 81 having a thickness of 5 μm which is a conductive polyaniline film containing an acid (1.3 parts by weight) and N-cyclohexylcarbamic acid 2-nitrobenzyl ester (3 parts by weight) was formed.

On the other hand, a 10 wt% meta-cresol solution of polyvinyl formal is applied to the surface of the LSI chip 2 on which the gold bumps 23 are formed to have the connection terminals 21, and meta-cresol is evaporated to form a polyvinyl formal having a thickness of 8 μm. A film was formed and used as the adhesive layer 71.

Next, as shown in FIG. 3A, the LSI chip 2 is aligned and placed on the connection layer 81 of the glass wiring board 1 and heated at 150 ° C. and 1.5 MPa / cm ² . After pressure bonding, ultraviolet rays (365 nm) were irradiated for 5 minutes from the side of the glass wiring board 1 on which the LSI chip 2 was not mounted, and the non-projection portion 820 of the connection terminal 12 was made to have high resistance. In this case, the metallic chrome of the connection terminal 12 functions as a photomask. The obtained mounting body is shown in FIG.
The structure is as shown in Fig. The connection resistance of this mounting body was 1 Ω or less, and the insulation resistance between adjacent terminals was 200 MΩ or more.

[Embodiment 8] This corresponds to the example shown in FIG.

First, the solute is polyaniline, an ethylene / vinyl acetate copolymer (ethylene vinyl acetate copolymer) which is a thermoplastic polymer, camphorsulfonic acid which is a dopant, and N-cyclohexylcarbamic acid which is a base generator. 1 consisting of 2-nitrobenzyl ester
A connection composition which is a 0 wt% meta-cresol solution was prepared. The weight ratio of polyaniline, ethylene / vinyl acetate copolymer, camphor sulfonic acid and N-cyclohexylcarbamic acid 2-nitrobenzyl ester was 1:
It is 1: 1.3: 3.

A wiring having a width of 25 μm, which is made of a metal chromium film having a film thickness of 0.25 μm and a transparent conductive film having a film thickness of 0.12 μm, a metal chromium film having a film thickness of 0.25 μm and a film thickness of 0.12 μm, 256 made of transparent conductive film of
0.7 with 50 μm × 50 μm connecting terminals 12
It is applied to the surface of the glass wiring board 1 having a thickness of mm, which is provided with the connection terminals 12, to evaporate the solvent metacresol, and polyaniline (1 part by weight) and ethylene / vinyl acetate copolymer (1 part by weight). And camphor sulfonic acid (1.3
Part by weight) and N-cyclohexylcarbamic acid 2-nitrobenzyl ester (3 parts by weight), and a connection layer 81 having a thickness of 5 μm, which is a conductive polyaniline film, was formed.

On the other hand, a 10 wt% meta-cresol solution of ethylene / vinyl acetate copolymer was applied to the surface of the LSI chip 2 on which the gold bumps 23 were formed to have the connection terminals 21, and the meta-cresol was evaporated to a thickness of 8 μm. A film made of ethylene / vinyl acetate copolymer of
And

Next, as shown in FIG. 3A, the LSI chip 2 is aligned and placed on the connection layer 81 of the glass wiring board 1 and heated at 150 ° C. and 1.5 MPa / cm ² . After pressure bonding, ultraviolet rays (365 nm) were irradiated for 5 minutes from the side of the glass wiring board 1 on which the LSI chip 2 was not mounted, and the non-projection portion 820 of the connection terminal 12 was made to have high resistance. In this case, the metallic chrome of the connection terminal 12 functions as a photomask. The obtained mounting body is shown in FIG.
The structure is as shown in Fig. The connection resistance of this mounting body was 1 Ω or less, and the insulation resistance between adjacent terminals was 200 MΩ or more.

[Embodiment 9] This corresponds to the example shown in FIG.

First, the solute consists of polyaniline, polyvinyl butyral which is a thermoplastic polymer, camphorsulfonic acid which is a dopant, and N-cyclohexylcarbamic acid 2,6-dinitrobenzyl ester which is a base generator. A connection composition which is a 10 wt% meta-cresol solution was prepared. The weight ratio of polyaniline, polyvinyl butyral, camphorsulfonic acid and N-cyclohexylcarbamic acid 2,6-dinitrobenzyl ester is 1: 2: 1.3: 3.7.

A wiring having a width of 25 μm, which is made of a chromium metal film having a film thickness of 0.25 μm and a transparent conductive film having a film thickness of 0.12 μm, a metal chromium film having a film thickness of 0.25 μm and a film thickness of 0.12 μm, 256 made of transparent conductive film of
0.7 with 50 μm × 50 μm connecting terminals 12
It is applied to the surface of the glass wiring board 1 having a thickness of mm, which is provided with the connection terminals 12, to evaporate metacresol which is a solvent, polyaniline (1 part by weight), polyvinyl butyral (2 parts by weight), and camphor sulfonic acid ( 1.3 parts by weight)
A connection layer 81 having a thickness of 5 μm, which is a conductive polyaniline film containing N-cyclohexylcarbamic acid 2,6-dinitrobenzyl ester (3.7 parts by weight), was formed.

On the other hand, a 10 wt% solution of polyvinyl butyral copolymer in meta-cresol was applied to the surface of the LSI chip 2 on which the gold bumps 23 were formed to provide the connection terminals 21, and the meta-cresol was evaporated to give polyvinyl chloride having a thickness of 8 μm. A film made of butyral was formed as an adhesive layer 71.

Next, as shown in FIG. 3A, the LSI chip 2 is aligned and placed on the connection layer 81 of the glass wiring board 1 and heated at 150 ° C. and 1.5 MPa / cm ² . After pressure bonding, ultraviolet rays (365 nm) were irradiated for 5 minutes from the side of the glass wiring board 1 on which the LSI chip 2 was not mounted, and the non-projection portion 820 of the connection terminal 12 was made to have high resistance. In this case, the metallic chrome of the connection terminal 12 functions as a photomask. The obtained mounting body is shown in FIG.
The structure is as shown in Fig. The connection resistance of this mounting body was 1 Ω or less, and the insulation resistance between adjacent terminals was 200 MΩ or more.

[Embodiment 10] This corresponds to the example shown in FIG.

First, the solute is polyaniline, polyvinyl butyral which is a thermoplastic polymer, camphor sulfonic acid which is a dopant, and N-ethylcarbamic acid 2-nitrobenzyl ester which is a base generator. A connection composition which is a meta-cresol solution of was prepared. The weight ratio of polyaniline, polyvinyl butyral, camphorsulfonic acid, and N-ethylcarbamic acid 2-nitrobenzyl ester was 1: 3: 1.3 :.
It is 3.

A wiring having a width of 25 μm, which is made of a chromium metal film having a film thickness of 0.25 μm and a transparent conductive film having a film thickness of 0.12 μm, a metal chromium film having a film thickness of 0.25 μm and a film thickness of 0.12 μm, 256 made of transparent conductive film of
0.7 with 50 μm × 50 μm connecting terminals 12
It is applied to the surface of the glass wiring board 1 having a thickness of mm, which is provided with the connection terminals 12, to evaporate metacresol which is a solvent, polyaniline (1 part by weight), polyvinyl butyral (3 parts by weight), and camphor sulfonic acid ( 1.3 parts by weight)
A connection layer 81 having a thickness of 5 μm, which is a conductive polyaniline film containing N-ethylcarbamic acid 2-nitrobenzyl ester (3 parts by weight), was formed.

On the other hand, a 10 wt% meta-cresol solution of a polyvinyl butyral copolymer is applied to the surface of the LSI chip 2 on which the gold bumps 23 are formed to have the connection terminals 21, and the meta-cresol is evaporated to give a polyvinyl chloride having a thickness of 8 μm. A film made of butyral was formed as an adhesive layer 71.

Next, as shown in FIG. 3A, the LSI chip 2 is aligned and placed on the connection layer 81 of the glass wiring board 1 and heated at 150 ° C. and 1.5 MPa / cm ² . After pressure bonding, ultraviolet rays (365 nm) were irradiated for 5 minutes from the side of the glass wiring board 1 on which the LSI chip 2 was not mounted, and the non-projection portion 820 of the connection terminal 12 was made to have high resistance. In this case, the metallic chrome of the connection terminal 12 functions as a photomask. The obtained mounting body is shown in FIG.
The structure is as shown in Fig. The connection resistance of this mounting body was 1 Ω or less, and the insulation resistance between adjacent terminals was 200 MΩ or more.

[Embodiment 11] This corresponds to the example shown in FIG.

First, the solute is a 10 wt% meta-cresol solution consisting of polyaniline, polyvinyl butyral which is a thermoplastic polymer, camphor sulfonic acid which is a dopant, and tetraethyl thiuram disulfide which is a photoreactant. A composition for use was prepared. The weight ratio of polyaniline, polyvinyl butyral, camphor sulfonic acid and tetraethyl thiuram disulfide is
It is 1: 2.5: 1.3: 2.6.

A wiring having a width of 25 μm, which is made of a chromium metal film having a thickness of 0.25 μm and a transparent conductive film having a thickness of 0.12 μm, a metal chromium film having a thickness of 0.25 μm and a thickness of 0.12 μm, 256 made of transparent conductive film of
0.7 with 50 μm × 50 μm connecting terminals 12
It is applied to the surface of the glass wiring board 1 having a thickness of mm to be provided with the connection terminals 12 to evaporate metacresol which is a solvent, polyaniline (1 part by weight), polyvinyl butyral (2.5 parts by weight) and camphor sulfone. A connection layer 81 having a thickness of 5 μm which is a conductive polyaniline film containing an acid (1.3 parts by weight) and tetraethylthiuram disulfide (2.6 parts by weight) was formed.

On the other hand, a 10 wt% meta-cresol solution of a polyvinyl butyral copolymer is applied to the surface of the LSI chip 2 on which the gold bumps 23 are formed to have the connection terminals 21, and the meta-cresol is evaporated to give a polyvinyl chloride having a thickness of 8 μm. A film made of butyral was formed as an adhesive layer 71.

Next, as shown in FIG. 3A, the LSI chip 2 is aligned and placed on the connection layer 81 of the glass wiring board 1 and heated at 150 ° C. and 1.5 MPa / cm ² . After pressure bonding, ultraviolet rays (365 nm) were irradiated for 5 minutes from the side of the glass wiring board 1 on which the LSI chip 2 was not mounted, and the non-projection portion 820 of the connection terminal 12 was made to have high resistance. In this case, the metallic chrome of the connection terminal 12 functions as a photomask. The obtained mounting body is shown in FIG.
The structure is as shown in Fig. The connection resistance of this mounting body was 1 Ω or less, and the insulation resistance between adjacent terminals was 200 MΩ or more.

[Embodiment 12] This corresponds to the example shown in FIG.

First, the solute is a 10 wt% meta-cresol solution containing polyaniline, polyvinyl butyral which is a thermoplastic polymer, camphor sulfonic acid which is a dopant, and benzoin isopropyl ether which is a photoreactant. A composition for use was prepared. The weight ratio of polyaniline, polyvinyl butyral, camphor sulfonic acid and benzoin isopropyl ether was 1:
It is 2: 1.3: 2.8.

A wiring having a width of 25 μm, which is composed of chrome metal having a thickness of 0.25 μm and a transparent conductive film having a thickness of 0.12 μm, metal chrome having a thickness of 0.25 μm and a thickness of 0.12 μm, 256 made of transparent conductive film of
0.7 with 50 μm × 50 μm connecting terminals 12
It is applied to the surface of the glass wiring board 1 having a thickness of mm, which is provided with the connection terminals 12, to evaporate metacresol which is a solvent, polyaniline (1 part by weight), polyvinyl butyral (2 parts by weight), and camphor sulfonic acid ( 1.3 parts by weight)
A connection layer 81 having a thickness of 5 μm, which is a conductive polyaniline film containing benzoin isopropyl ether (2.8 parts by weight), was formed.

On the other hand, a 10 wt% meta-cresol solution of a polyvinyl butyral copolymer is applied to the surface of the LSI chip 2 on which the gold bumps 23 are formed to have the connection terminals 21, and the meta-cresol is evaporated to give a polyvinyl chloride film having a thickness of 8 μm. A film made of butyral was formed as an adhesive layer 71.

Next, as shown in FIG. 3A, the LSI chip 2 is aligned and placed on the connection layer 81 of the glass wiring board 1 and heated at 150 ° C. and 1.5 MPa / cm ² . After pressure bonding, ultraviolet rays (365 nm) were irradiated for 5 minutes from the side of the glass wiring board 1 on which the LSI chip 2 was not mounted, and the non-projection portion 820 of the connection terminal 12 was made to have high resistance. In this case, the metallic chrome of the connection terminal 12 functions as a photomask. The obtained mounting body is shown in FIG.
The structure is as shown in Fig. The connection resistance of this mounting body was 1 Ω or less, and the insulation resistance between adjacent terminals was 200 MΩ or more.

[Embodiment 13] This corresponds to the example shown in FIG.

First, the solute is polyaniline, polyvinyl butyral which is a thermoplastic polymer, camphor sulfonic acid which is a dopant, and N-cyclohexylcarbamic acid 2-nitrobenzyl ester which is a base generator. A connection composition which is a meta-cresol solution of was prepared. The weight ratio of polyaniline, polyvinyl butyral, camphor sulfonic acid and N-cyclohexylcarbamic acid 2-nitrobenzyl ester is
It is 1: 1: 1.3: 3.

This connecting composition was applied to a wiring having a width of 25 μm and a thickness of 50 μm × 50, which was made of a transparent conductive film having a thickness of 0.2 μm.
It is applied to the surface of the glass wiring board 1 having a thickness of 0.7 mm having 256 μm connecting terminals 12 and having the connecting terminals 12 to evaporate metacresol, which is a solvent, to obtain polyaniline (1 part by weight). A connection layer 81 having a thickness of 5 μm, which is a conductive polyaniline film containing polyvinyl butyral (1 part by weight), camphorsulfonic acid (1.3 parts by weight) and N-cyclohexylcarbamic acid 2-nitrobenzyl ester (3 parts by weight). Was formed.

On the other hand, a 10 wt% solution of polyvinyl butyral in chloroform was applied to the surface of the LSI chip 2 on which the gold bumps 23 were formed to provide the connection terminals 21, and the chloroform was evaporated to form a film of polyvinyl butyral having a thickness of 8 μm. The adhesive layer 71 was formed.

Next, as shown in FIG. 3C, the LSI chip 2 is aligned and mounted on the connection layer 81 of the glass wiring board 1 so that the connection layer 81 and the adhesive layer 71 face each other. Then, it is heated and pressed at 150 ° C. and 1.5 MPa / cm ² so as to block the light radiated to the connection terminal 12 from the side of the glass wiring board 1 on which the LSI chip 2 is not mounted. Ultraviolet rays (365n
m) was irradiated for 5 minutes to increase the resistance of the unmasked portion 820. The obtained mount has a structure as shown in FIG. The connection resistance of this mounting body is 1Ω or less,
The insulation resistance between adjacent terminals was 200 MΩ or more.

[Embodiment 14] This corresponds to the example shown in FIG.

First, the solute is polyaniline, polyvinyl butyral which is a thermoplastic polymer, camphor sulfonic acid which is a dopant, and N-cyclohexylcarbamic acid 2-nitrobenzyl ester which is a base generator. A connection composition which is a meta-cresol solution of was prepared. The weight ratio of polyaniline, polyvinyl butyral, camphor sulfonic acid and N-cyclohexylcarbamic acid 2-nitrobenzyl ester is
It is 1: 1.5: 1.3: 3.

This connecting composition was applied to a wiring having a width of 25 μm and made of a transparent conductive film having a thickness of 0.2 μm and 50 μm × 50.
It is applied to the surface of the glass wiring board 1 having a thickness of 0.7 mm having 256 μm connecting terminals 12 and having the connecting terminals 12 to evaporate metacresol, which is a solvent, to obtain polyaniline (1 part by weight). Polyvinyl butyral (1.5 parts by weight), camphor sulfonic acid (1.3 parts by weight) and N-
A connection layer 81 having a thickness of 5 μm, which is a conductive polyaniline film containing cyclohexylcarbamic acid 2-nitrobenzyl ester (3 parts by weight), was formed.

On the surface of the connection layer 81, a 10 wt% chloroform solution of polyvinyl butyral was applied and chloroform was evaporated to form a film of polyvinyl butyral having a thickness of 8 μm, which was used as the adhesive layer 71.

Next, as shown in FIG. 1A, an ultraviolet ray (365) is passed through the photomask 9 so as to block the light radiated from the adhesive layer 71 to the portion of the connection terminal 12.
nm) for 5 minutes, and as shown in FIG.
The unmasked portion 820 has a high resistance.

As shown in FIG. 1C, the connection layer 71
And the gold bumps 23 face each other so that the glass wiring board 1
The LSI chip 2 was aligned and placed on the adhesive layer 71, and thermocompression bonded at 150 ° C. and 1.5 MPa / cm ² .
The connection resistance of the obtained mounting body was 1 Ω or less, and the insulation resistance between adjacent terminals was 200 MΩ or more.

[Embodiment 15] This corresponds to the example shown in FIG.

First, the solute is polyaniline, polyvinyl butyral which is a thermoplastic polymer, camphorsulfonic acid which is a dopant, and N-cyclohexylcarbamic acid 2-nitrobenzyl ester which is a base generator. A connection composition which is a meta-cresol solution of was prepared. The weight ratio of polyaniline, polyvinyl butyral, camphor sulfonic acid and N-cyclohexylcarbamic acid 2-nitrobenzyl ester is
It is 1: 1.5: 1.3: 1.5.

A wiring having a width of 25 μm, which is made of chrome metal having a film thickness of 0.25 μm and a transparent conductive film having a film thickness of 0.12 μm, metal chrome having a film thickness of 0.25 μm and a film thickness of 0.12 μm, 256 made of transparent conductive film of
0.7 with 50 μm × 50 μm connecting terminals 12
It is applied to the surface of the glass wiring board 1 having a thickness of mm, which is provided with the connection terminals 12, to evaporate metacresol which is a solvent, polyaniline (1 part by weight), polyvinyl butyral (1.5 parts by weight) and camphor sulfone. A connection layer 81 having a thickness of 5 μm which is a conductive polyaniline film containing an acid (1.3 parts by weight) and N-cyclohexylcarbamic acid 2-nitrobenzyl ester (1.5 parts by weight) was formed.

A 10 wt% solution of polyvinyl butyral in chloroform was applied to the surface of the connection layer 81, the chloroform was evaporated, and a film made of polyvinyl butyral having a thickness of 8 μm was formed as an adhesive layer 71.

Next, as shown in FIG. 5A, ultraviolet rays (365 nm) are radiated from above the adhesive layer 71 for 5 minutes, and as shown in FIG. The other part 820 has a higher resistance. In this case, the metallic chrome of the connection terminal 12 functions as a photomask.

As shown in FIG. 5C, the connection layer 71
And the gold bumps 23 face each other so that the glass wiring board 1
The LSI chip 2 was aligned and placed on the adhesive layer 71, and thermocompression bonded at 150 ° C. and 1.5 MPa / cm ² .
The connection resistance of the obtained mounting body was 1 Ω or less, and the insulation resistance between adjacent terminals was 200 MΩ or more.

[Embodiment 16] This corresponds to the example shown in FIG.

First, the solute is polyaniline, polyvinyl butyral which is a thermoplastic polymer, camphor sulfonic acid which is a dopant, and N-cyclohexylcarbamic acid 2-nitrobenzyl ester which is a base generator. A connection composition which is a meta-cresol solution of was prepared. The weight ratio of polyaniline, polyvinyl butyral, camphor sulfonic acid and N-cyclohexylcarbamic acid 2-nitrobenzyl ester is
It is 1: 1: 1.3: 3.

This connecting composition was applied to a wiring having a width of 25 μm and 50 μm × 50, which was made of a transparent conductive film having a thickness of 0.2 μm.
It is applied to the surface of the glass wiring board 1 having a thickness of 0.7 mm having 256 μm connecting terminals 12 and having the connecting terminals 12 to evaporate metacresol, which is a solvent, to obtain polyaniline (1 part by weight). A connection layer 81 having a thickness of 5 μm, which is a conductive polyaniline film containing polyvinyl butyral (1 part by weight), camphorsulfonic acid (1.3 parts by weight) and N-cyclohexylcarbamic acid 2-nitrobenzyl ester (3 parts by weight). Was formed.

A 10 wt% chloroform solution of polyvinyl butyral was applied to the surface of the connection layer 81, the chloroform was evaporated, and a film made of polyvinyl butyral having a thickness of 8 μm was formed to form an adhesive layer 71.

Next, as shown in FIG. 6A, a photomask 9 is provided so as to block the light radiated to the connection terminal 12 from the side of the glass substrate 11 where the connection terminal 12 is not provided. Ultraviolet rays (365 nm) were radiated for 5 minutes to increase the resistance of the unmasked portion 820, as shown in FIG. 6B.

As shown in FIG. 6C, the connection layer 71
And the gold bumps 23 face each other so that the glass wiring board 1
The LSI chip 2 was aligned and placed on the adhesive layer 71, and thermocompression bonded at 150 ° C. and 1.5 MPa / cm ² .
The connection resistance of the obtained mounting body was 1 Ω or less, and the insulation resistance between adjacent terminals was 200 MΩ or more.

[Embodiment 17] This corresponds to the example shown in FIG.

First, the solute is composed of polyaniline, polyvinyl butyral which is a thermoplastic polymer, and 2,2,2-tribromoethanol which is an acid generator.
A connecting composition was prepared which was a t% N-methylpyrrolidone solution. Polyaniline, polyvinyl butyral and 2,
The weight ratio with 2,2-tribromoethanol is 1: 2 :.
It is 1.6.

This connecting composition was applied to a wiring having a width of 25 μm and a thickness of 50 μm × 50, which was made of a transparent conductive film having a thickness of 0.2 μm.
The glass wiring board 1 having a thickness of 0.7 mm and having 256 μm connection terminals 12 formed thereon is applied to the surface provided with the connection terminals 12 to evaporate the solvent N-methylpyrrolidone,
Polyaniline (1 part by weight) and polyvinyl butyral (2
Parts by weight) and 2,2,2-tribromoethanol (1.6
And a connection layer 91 having a thickness of 5 μm, which is a conductive polymer precursor composition film containing

A 10 wt% solution of polyvinyl butyral in chloroform was applied to the surface of the connection layer 91 to evaporate the chloroform to form a film of polyvinyl butyral having a thickness of 8 μm, which was used as the adhesive layer 71.

Next, as shown in FIG. 2A, ultraviolet rays (3) are passed through the photomask 9 so as to block the light radiated from above the adhesive layer 71 to the portions where the connection terminals 12 are not present.
(65 nm) for 5 minutes to reduce the resistance of the unmasked portion 910 to give conductivity, as shown in FIG. 2 (b).

As shown in FIG. 2C, the adhesive layer 71
And the gold bumps 23 face each other so that the glass wiring board 1
The LSI chip 2 was aligned and placed on the adhesive layer 71, and was thermocompression-bonded at 1.5 MPa / cm ² and 150 ° C.
The connection resistance of the obtained mounting body was 1 Ω or less, and the insulation resistance between adjacent terminals was 200 MΩ or more.

[Embodiment 18] This corresponds to the example shown in FIG.

First, the solute is composed of polyaniline, polyvinyl butyral which is a thermoplastic polymer, and tribromomethylphenyl sulfone which is an acid generator.
A connecting composition was prepared which was a t% N-methylpyrrolidone solution. The weight ratio of polyaniline, polyvinyl butyral, and tribromomethylphenyl sulfone is 1: 1:
2.1.

This connecting composition was applied to a wiring having a width of 25 μm and a thickness of 50 μm × 50, which was made of a transparent conductive film having a thickness of 0.2 μm.
The glass wiring board 1 having a thickness of 0.7 mm and having 256 μm connection terminals 12 formed thereon is applied to the surface provided with the connection terminals 12 to evaporate the solvent N-methylpyrrolidone,
Polyaniline (1 part by weight) and polyvinyl butyral (1
Parts by weight) and tribromomethylphenyl sulfone (2.1
And a connection layer 91 having a thickness of 5 μm, which is a conductive polymer precursor composition film including

A 10 wt% chloroform solution of polyvinyl butyral was applied to the surface of the connection layer 91, the chloroform was evaporated, and a film made of polyvinyl butyral having a thickness of 8 μm was formed as an adhesive layer 71.

Next, as shown in FIG. 2A, ultraviolet rays (3) are applied through the photomask 9 so as to block the light radiated from above the adhesive layer 71 to the portion where the connection terminal 12 is not present.
(65 nm) for 5 minutes to reduce the resistance of the unmasked portion 910 to give conductivity, as shown in FIG. 2 (b).

As shown in FIG. 2C, the connection layer 71
And the gold bumps 23 face each other so that the glass wiring board 1
The LSI chip 2 was aligned and placed on the adhesive layer 71, and was thermocompression-bonded at 1.5 MPa / cm ² and 150 ° C.
The connection resistance of the obtained mounting body was 1 Ω or less, and the insulation resistance between adjacent terminals was 200 MΩ or more.

[Embodiment 19] This corresponds to the example shown in FIG.

First, the solute is composed of polyaniline, polyvinyl butyral which is a thermoplastic polymer, and 2,2,2-tribromoethanol which is an acid generator.
A connecting composition was prepared which was a t% N-methylpyrrolidone solution. Polyaniline, polyvinyl butyral and 2,
The weight ratio with 2,2-tribromoethanol is 1: 2 :.
It is 1.6.

This connecting composition was applied to a wiring having a width of 25 μm and a thickness of 50 μm × 50, which was made of a transparent conductive film having a thickness of 0.2 μm.
The glass wiring board 1 having a thickness of 0.7 mm and having 256 μm connection terminals 12 formed thereon is applied to the surface provided with the connection terminals 12 to evaporate the solvent N-methylpyrrolidone,
Polyaniline (1 part by weight) and polyvinyl butyral (2
Parts by weight) and 2,2,2-tribromoethanol (1.6
And a connection layer 91 having a thickness of 5 μm, which is a conductive polymer precursor composition film containing

A 10 wt% chloroform solution of polyvinyl butyral was applied to the surface of the connection layer 91 to evaporate chloroform to form a film of polyvinyl butyral having a thickness of 8 μm, which was used as the adhesive layer 71.

Next, the LS is formed on the adhesive layer 71 of the glass wiring board 1 so that the adhesive layer 71 and the gold bump 23 face each other.
I-chip 2 is aligned and placed at 1.5 MPa / c
As shown in FIG. 4 (a), heat and pressure are applied at m ² at 150 ° C. to block the light radiated from the side of the glass substrate 11 not provided with the connection terminal 12 to the portion without the connection terminal 12. The film was irradiated with ultraviolet rays (365 nm) for 5 minutes through the photomask 9, and as shown in FIG. 4B, the unmasked portion 910 was made low in resistance to give conductivity. The connection resistance of the obtained mounting body was 1 Ω or less, and the insulation resistance between adjacent terminals was 200 MΩ or more.

[Embodiment 20] This corresponds to the example shown in FIG.

First, the solute is composed of polyaniline, polyvinyl butyral which is a thermoplastic polymer, and 2,2,2-tribromoethanol which is an acid generator.
A connecting composition was prepared which was a t% N-methylpyrrolidone solution. Polyaniline, polyvinyl butyral and 2,
The weight ratio with 2,2-tribromoethanol is 1: 2 :.
It is 1.6.

This connecting composition was applied to a wiring having a width of 25 μm and a thickness of 50 μm × 50, which was made of a transparent conductive film having a thickness of 0.2 μm.
The glass wiring board 1 having a thickness of 0.7 mm and having 256 μm connection terminals 12 formed thereon is applied to the surface provided with the connection terminals 12 to evaporate the solvent N-methylpyrrolidone,
Polyaniline (1 part by weight) and polyvinyl butyral (2
Parts by weight) and 2,2,2-tribromoethanol (1.6
And a connection layer 91 having a thickness of 5 μm, which is a conductive polymer precursor composition film containing

A 10 wt% solution of polyvinyl butyral in chloroform was applied to the surface of the connection layer 91 to evaporate the chloroform to form a film of polyvinyl butyral having a thickness of 8 μm, which was used as the adhesive layer 71.

Next, as shown in FIG. 7A, the photomask 9 is arranged so as to block the light radiated from the side of the glass substrate 11 where the connection terminal 12 is not provided to the portion where the connection terminal 12 is not provided. Ultraviolet rays (365 nm) were irradiated for 5 minutes through the film to reduce the resistance of the unmasked portion 910 to give conductivity, as shown in FIG. 7B.

As shown in FIG. 7C, the adhesive layer 71
And the gold bumps 23 face each other so that the glass wiring board 1
The LSI chip 2 was aligned and placed on the adhesive layer 71, and was thermocompression-bonded at 1.5 MPa / cm ² and 150 ° C.
The connection resistance of the obtained mounting body was 1 Ω or less, and the insulation resistance between adjacent terminals was 200 MΩ or more.

[Embodiment 21] This corresponds to the example shown in FIG.

First, a 10 wt% chloroform solution of polyvinyl butyral is applied to the surface of the LSI chip 2 having 256 50 μm × 50 μm connection terminals 21 and the connection terminals 21 on which gold bumps 23 are formed. Then, chloroform was evaporated and a film made of polyvinyl butyral having a thickness of 8 μm was formed to form an adhesive layer 71.

Next, the solute is composed of polyaniline, polyvinyl butyral which is a thermoplastic polymer, camphorsulfonic acid which is a dopant, and N-cyclohexylcarbamic acid 2-nitrobenzyl ester which is a base generator, 10 wt. % N-methylpyrrolidone solution was prepared. The weight ratio of polyaniline, polyvinyl butyral, camphor sulfonic acid and N-cyclohexylcarbamic acid 2-nitrobenzyl ester is 1: 2: 1.3: 3.

This connecting composition is applied to the surface of the adhesive layer 71 to evaporate the solvent N-methylpyrrolidone,
Polyaniline (1 part by weight) and polyvinyl butyral (2
Parts by weight), camphor sulfonic acid (1.3 parts by weight) and N
A connection layer 81 having a thickness of 5 μm, which is a conductive polymer composition film containing -cyclohexylcarbamic acid 2-nitrobenzyl ester (3 parts by weight), was formed.

Next, as shown in FIG. 8A, ultraviolet rays (36) are passed through the photomask 9 so as to block the light irradiated from the connection layer 81 side to the connection terminal 21 portion.
(5 nm) for 5 minutes to increase the resistance of the unmasked portion 820 as shown in FIG. 7 (b).

Finally, as shown in FIG. 8C, the width 2 made of a transparent conductive film having a thickness of 0.2 μm is formed so that the connection terminal 12 and the conductive portion 810 of the connection layer 81 are joined.
2 μm wiring and 50 μm x 50 μm connecting terminal 12
The LSI chip 2 is aligned and placed on the glass wiring board 1 having a thickness of 0.7 mm and formed of 56 pieces.
It was thermocompression bonded at 150 ° C. at a / cm ² . The connection resistance of the obtained mounting body is 1 Ω or less, and the insulation resistance between adjacent terminals is 200.
It was MΩ or more.

[Embodiment 22] This corresponds to the example shown in FIG.

First, a 10 wt% chloroform solution of polyvinyl butyral is applied to the surface of the LSI chip 2 having 256 50 μm × 50 μm connection terminals 21 and the gold bumps 23 formed on the connection terminals 21. Then, chloroform was evaporated and a film made of polyvinyl butyral having a thickness of 8 μm was formed to form an adhesive layer 71.

Next, the solute comprises polyaniline, polyvinyl butyral which is a thermoplastic polymer, and 2,2,2-tribromoethanol which is an acid generator.
A connection composition, which is a wt% N-methylpyrrolidone solution, was prepared. The weight ratio of polyaniline, polyvinyl butyral and 2,2,2-tribromoethanol was 1:
2: 1.6.

This connecting composition was applied to the surface of the connecting layer 91 to evaporate the solvent N-methylpyrrolidone,
Polyaniline (1 part by weight) and polyvinyl butyral (2
Parts by weight) and 2,2,2-tribromoethanol (1.6
And a connection layer 91 having a thickness of 5 μm, which is a conductive polymer precursor composition film containing

Next, as shown in FIG. 9A, ultraviolet rays (365 nm) are passed through the photomask 9 so as to block the light radiated from the side of the connection layer 91 to the portion without the connection terminal 21. Was irradiated for 5 minutes, and as shown in FIG. 9B, the unmasked portion 910 was made low in resistance to give conductivity.

As shown in FIG. 9C, the conductive layer 910 of the connection layer 91 of the LSI chip 2 and the connection terminal 12 of the glass wiring board 1 are arranged to face each other with a film thickness of 0.2 μm.
With a width of 25 μm and 50 μm ×
0.7 mm with 256 connection terminals 12 of 50 μm formed
The LSI chip 2 is aligned and placed on the surface of the glass wiring board 1 having the thickness
It thermocompression-bonded at 1.5 MPa / cm < ² > and 150 degreeC. The connection resistance of the obtained mounting body was 1 Ω or less, and the insulation resistance between adjacent terminals was 200 MΩ or more.

[Embodiment 23] This corresponds to the example shown in FIG.

First, the solute is polyaniline, polyvinyl butyral which is a thermoplastic polymer, camphorsulfonic acid which is a dopant, and N-cyclohexylcarbamic acid 2-nitrobenzyl ester which is a base generator. A connection composition which is a N-methylpyrrolidone solution of was prepared. The weight ratio of polyaniline, polyvinyl butyral, camphor sulfonic acid and N-cyclohexylcarbamic acid 2-nitrobenzyl ester is 1: 2: 1.3: 3.

After applying this connecting composition to a release substrate, the solvent N-methylpyrrolidone was evaporated,
Polyaniline (1 part by weight) and polyvinyl butyral (2
Parts by weight), camphor sulfonic acid (1.3 parts by weight) and N
A connection layer 81 having a thickness of 5 μm, which is a conductive polyaniline film containing cyclohexylcarbamic acid 2-nitrobenzyl ester (3 parts by weight), is formed.
A 10 wt% solution of polyvinyl butyral in chloroform was coated on 1 and the chloroform was evaporated to a thickness of 8 μm.
The polyvinyl butyral adhesive layer 71 was formed to obtain a two-layer laminate on the peeling base material. The laminate was peeled from the peeling base material to obtain a connecting member which was a film having a two-layer structure.

This connection member was formed by forming a wiring having a width of 25 μm and 256 connection terminals 12 of 50 μm × 50 μm, which is made of metallic chrome having a thickness of 0.25 μm and a transparent conductive film having a thickness of 0.12 μm, and is 1.0 mm. Thickness of glass wiring board 1
Between the surface provided with the connection terminal 12 and the surface provided with the connection terminal 21 and the gold bump 23 of the LSI chip 2, the connection layer 81 is bonded to the glass wiring substrate 1, and the adhesive layer 71 is LS.
Hold it so that it can be bonded to I-chip 2, 150 ℃, 1.5
It was thermocompression bonded at MPa / cm ² .

Next, as shown in FIG. 3A, ultraviolet rays (365 nm) are irradiated for 5 minutes from the side of the glass wiring board 1 on which the LSI chip 2 is not mounted, and the connection terminal 1
The second non-projection portion 820 has a high resistance. In this case, the metallic chrome of the connection terminal 12 functions as a photomask. The obtained mount has a structure as shown in FIG. The connection resistance of this mounting body was 1 Ω or less, and the insulation resistance between adjacent terminals was 200 MΩ or more.

[Embodiment 24] This corresponds to the example shown in FIG.

First, a wiring having a width of 25 μm, which is made of metal chrome having a film thickness of 0.25 μm and a transparent conductive film having a film thickness of 0.12 μm, metal chromium having a film thickness of 0.25 μm, and a film thickness of 0.
256 pieces of 50 μm x made of 12 μm transparent conductive film
Connection terminal 1 of glass wiring board 1 (illustrated in FIG. 23 (a)) having a thickness of 0.7 mm provided with connection terminal 12 of 50 μm
2 wt% of a polyvinyl butyral chloroform solution is applied to the surface having 2 to evaporate chloroform,
A film made of polyvinyl butyral having a thickness of 2 μm was formed to obtain a first adhesive layer 71 shown in FIG. 23 (b).

Next, the solute is composed of polyaniline, polyvinyl butyral which is a thermoplastic polymer, camphorsulfonic acid which is a dopant, and N-cyclohexylcarbamic acid 2-nitrobenzyl ester which is a base generator, 10 wt. % N-methylpyrrolidone solution was prepared. The weight ratio of polyaniline, polyvinyl butyral, camphor sulfonic acid and N-cyclohexylcarbamic acid 2-nitrobenzyl ester is 1: 2: 1.3: 3.

This connecting composition was applied to the surface of the first adhesive layer 71 to evaporate the solvent N-methylpyrrolidone, and polyaniline (1 part by weight), polyvinyl butyral (2 parts by weight) and camphor sulfone. The connection layer 5 (FIG. 23 (c)) having a thickness of 5 μm, which is a conductive polymer composition film containing an acid (1.3 parts by weight) and N-cyclohexylcarbamic acid 2-nitrobenzyl ester (3 parts by weight). (Shown)
Was formed.

Further, a 10 wt% solution of polyvinyl butyral in chloroform was applied on the surface of the connection layer 5 to evaporate chloroform to form a film of polyvinyl butyral having a thickness of 6 μm, as shown in FIG. 23 (d). Thus, the second adhesive layer 71 was obtained. As a result, the connecting member 230 composed of three layers was formed.

Next, as shown in FIG. 23 (e),
The LSI chip 2 is aligned and placed on the adhesive layer 71 of the glass wiring board 1 so that the surface of the LSI chip 2 having the connection terminal 21 and the second adhesive layer 71 face each other.

[0244] This was applied at 1.5 MPa / cm ² and 150 ° C.
Then, the connection layer 5 was irradiated with ultraviolet rays (365 nm) for 5 minutes from the side of the glass substrate 11 not provided with the connection terminal 12 to increase the resistance of the non-projected portion of the connection terminal 12. In this case, the metallic chrome of the connection terminal 12 functions as a photomask. The connection resistance of the obtained mounting body was 1 Ω or less, and the insulation resistance between adjacent terminals was 200 MΩ or more.

[Embodiment 25] This corresponds to the example shown in FIG.

First, on the surface of the LSI chip 2 having the gold bumps 23 shown in FIG.
A 10 wt% polyvinyl butyral chloroform solution was applied to evaporate the chloroform to form a film of polyvinyl butyral having a thickness of 8 μm, and an adhesive layer 71 was obtained as shown in FIG.

Next, the solute is composed of polyaniline, polyvinyl butyral which is a thermoplastic polymer, camphorsulfonic acid which is a dopant, and N-cyclohexylcarbamic acid 2-nitrobenzyl ester which is a base generator, 10 wt. % N-methylpyrrolidone solution was prepared. The weight ratio of polyaniline, polyvinyl butyral, camphor sulfonic acid and N-cyclohexylcarbamic acid 2-nitrobenzyl ester is 1: 2: 1.3: 3.

This connecting composition was applied to the surface of the connecting layer 71 to evaporate the solvent N-methylpyrrolidone, and polyaniline (1 part by weight), polyvinyl butyral (2 parts by weight) and camphorsulfonic acid ( 1.3 parts by weight)
A connection layer 5 (shown in FIG. 24C) having a thickness of 5 μm, which is a conductive polymer composition film containing N-cyclohexylcarbamic acid 2-nitrobenzyl ester (3 parts by weight), was formed. As a result, the connecting member 220 having two layers was obtained.

Next, a width of 25 μm formed of metallic chrome having a thickness of 0.25 μm and a transparent conductive film having a thickness of 0.12 μm.
And the transparent conductive film with a thickness of 0.25 μm and a transparent conductive film with a thickness of 0.12 μm.
A glass wiring board 1 having a thickness of 0.7 mm provided with connection terminals 12 of μm × 50 μm is prepared, and as shown in FIG. 24D, the connection layer 5 of the LSI chip 2 and the glass wiring board 1 are connected. The LSI is provided on the surface of the glass wiring board 1 on which the connection terminals 12 are provided so as to face the connection terminals 12.
Chip 2 is aligned and placed, 1.5 MPa / cm
² , heated and pressed at 150 ° C.

From the side of the glass substrate 11 having the LSI chip 2 not provided with the connection terminal 12, the connection layer 5 was irradiated with ultraviolet rays (365 nm) for 5 minutes to increase the resistance of the non-projected portion of the connection terminal 12. In this case, the metallic chrome of the connection terminal 12 functions as a photomask. The connection resistance of the obtained mounting body is 1Ω or less, and the insulation resistance between adjacent terminals is 2
It was more than 00 MΩ.

[Embodiment 26] This corresponds to the example shown in FIG.

First, the surface of the LSI chip 2 having the gold bumps 23 shown in FIG.
A 10 wt% chloroform solution of polyvinyl butyral was applied and chloroform was evaporated to form a film of polyvinyl butyral having a thickness of 6 μm, and a first adhesive layer 71a was obtained as shown in FIG. 25 (b).

Next, the solute is polyaniline, polyvinyl butyral which is a thermoplastic polymer, camphor sulfonic acid which is a dopant, and N-cyclohexylcarbamic acid 2-nitrobenzyl ester which is a base generator, 10 wt. % N-methylpyrrolidone solution was prepared. The weight ratio of polyaniline, polyvinyl butyral, camphor sulfonic acid and N-cyclohexylcarbamic acid 2-nitrobenzyl ester is 1: 2: 1.3: 3.

This connecting composition was used as the first connecting layer 71a.
N-methylpyrrolidone, which is a solvent, is evaporated to give polyaniline (1 part by weight), polyvinyl butyral (2 parts by weight), camphorsulfonic acid (1.3 parts by weight) and N-cyclohexylcarbamic acid 2 A connection layer 5 (illustrated in FIG. 25C) having a thickness of 5 μm, which is a conductive polymer composition film containing -nitrobenzyl ester (3 parts by weight), was formed.

Further, a 10 wt% solution of polyvinyl butyral in chloroform was applied on the surface of the connection layer 5 to evaporate chloroform to form a film of polyvinyl butyral having a thickness of 2 μm, as shown in FIG. 25 (d). Thus, the second adhesive layer 71b was obtained. As a result, the connecting member 230 composed of three layers was formed.

Next, a width of 25 μm composed of chrome film having a thickness of 0.25 μm and a transparent conductive film having a thickness of 0.12 μm.
Of the wiring, the metal chrome having a film thickness of 0.25 μm, and the transparent conductive film having a film thickness of 0.12 μm.
A glass wiring board 1 having a thickness of 0.7 mm provided with connection terminals 12 of m × 50 μm is prepared, and as shown in FIG. 25 (e), the second adhesive layer 71b of the LSI chip 2 and this glass wiring are provided. So that the connection terminals 12 of the substrate 1 face each other,
The LSI chip 2 is aligned and placed on the surface of the glass wiring board 1 on which the connection terminal 12 is provided,
It was thermocompression bonded at 150 ° C. at a / cm ² .

From the side of the glass substrate 11 on which the LSI chip 2 is mounted, which does not have the connection terminal 12, the connection layer 5 was irradiated with ultraviolet rays (365 nm) for 5 minutes to increase the resistance of the non-projected portion of the connection terminal 12. In this case, the metallic chrome of the connection terminal 12 functions as a photomask. The connection resistance of the obtained mounting body is 1Ω or less, and the insulation resistance between adjacent terminals is 2
It was more than 00 MΩ.

[Embodiment 27] This corresponds to the example shown in FIG.

First, the solute is polyaniline, polyvinyl butyral which is a thermoplastic polymer, camphorsulfonic acid which is a dopant, and N-cyclohexylcarbamic acid 2-nitrobenzyl ester which is a base generator. A connection composition which is a N-methylpyrrolidone solution of was prepared. The weight ratio of polyaniline, polyvinyl butyral, camphor sulfonic acid and N-cyclohexylcarbamic acid 2-nitrobenzyl ester is 1: 2: 1.3: 3.

A wiring having a width of 25 μm, which is made of a chromium metal film having a film thickness of 0.25 μm and a transparent conductive film having a film thickness of 0.12 μm, metal chromium film having a film thickness of 0.25 μm and a film thickness of 0.12 μm, 256 made of transparent conductive film of
0.7 with 50 μm × 50 μm connecting terminals 12
Glass wiring substrate 1 with a thickness of mm (illustrated in FIG. 26 (a))
Of N-methylpyrrolidone, which is a solvent, is applied to the surface having the connection terminal 12 to evaporate polyaniline (1 part by weight), polyvinyl butyral (2 parts by weight), and camphorsulfonic acid (1.3 parts by weight). A connection layer 5 (illustrated in FIG. 26B) having a thickness of 5 μm, which is a conductive polymer composition film containing N-cyclohexylcarbamic acid 2-nitrobenzyl ester (3 parts by weight), was formed.

Next, on the surface of the LSI chip 2 (shown in FIG. 26C) having 256 50 μm × 50 μm connection terminals 21 and gold bumps 23 formed on the connection terminals 21, Polyvinyl butyral 10wt
% Chloroform solution was applied and chloroform was evaporated to form a film of polyvinyl butyral having a thickness of 8 μm to obtain an adhesive layer 71 as shown in FIG.

The connection terminal 12 of the glass wiring board 1 and the LS
26, by aligning the position with the connection terminal 21 of the I-chip 2.
As shown in (e), the connection layer 5 and the adhesive layer 71 were joined and thermocompression bonded at 1.5 MPa / cm ² and 150 ° C.

The connecting layer 5 was irradiated with ultraviolet rays (365 nm) for 5 minutes from the side of the glass substrate 11 on which the LSI chip 2 was not mounted to have the connecting terminal 12 to increase the resistance of the non-projected portion of the connecting terminal 12. In this case, the metallic chrome of the connection terminal 12 functions as a photomask. The connection resistance of the obtained mounting body is 1Ω or less, and the insulation resistance between adjacent terminals is 2
It was more than 00 MΩ.

[Embodiment 28] This corresponds to the example shown in FIG.

First, a wiring having a width of 25 μm, which is made of chrome metal having a thickness of 0.25 μm and a transparent conductive film having a thickness of 0.12 μm, metal chrome having a thickness of 0.25 μm, and a thickness of 0.1 μm.
256 pieces of 50 μm x made of 12 μm transparent conductive film
Connection terminal 1 of glass wiring board 1 (illustrated in FIG. 27A) having a thickness of 0.7 mm provided with connection terminal 12 of 50 μm
2 wt% of a polyvinyl butyral chloroform solution is applied to the surface having 2 to evaporate chloroform,
A film made of polyvinyl butyral having a thickness of 8 μm was formed to obtain an adhesive layer 71 as shown in FIG. 27 (b).

Next, the solute is polyaniline, polyvinyl butyral which is a thermoplastic polymer, camphorsulfonic acid which is a dopant, and N-cyclohexylcarbamic acid 2-nitrobenzyl ester which is a base generator, 10 wt. % N-methylpyrrolidone solution was prepared. The weight ratio of polyaniline, polyvinyl butyral, camphor sulfonic acid and N-cyclohexylcarbamic acid 2-nitrobenzyl ester is 1: 2: 1.3: 3.

This connecting composition was used to prepare 256 pieces of 50 μm.
It is applied to the surface of the LSI chip 2 (shown in FIG. 27 (c)) having the connecting terminals 21 having a size of 50 μm and the gold bumps 23 formed on the connecting terminals 21, and the solvent is N-methyl. Pyrrolidone is evaporated to conduct electricity containing polyaniline (1 part by weight), polyvinyl butyral (2 parts by weight), camphor sulfonic acid (1.3 parts by weight) and N-cyclohexylcarbamic acid 2-nitrobenzyl ester (3 parts by weight). A connection layer 5 (illustrated in FIG. 27D) having a thickness of 5 μm, which is a film of a high-molecular composition was formed.

The connection terminal 12 of the glass wiring board 1 and the LS
Aligning the position with the connection terminal 21 of the I-chip 2,
As shown in (e), the adhesive layer 71 and the connection layer 5 were joined and thermocompression-bonded at 1.5 MPa / cm ² and 150 ° C.
As a result, the connecting member 220 composed of two layers is formed,
The LSI chip 2 is mounted on the substrate 1.

From the side of the glass wiring board 1 having the LSI chip 2 not provided with the connection terminal 12, the connection layer 5 was irradiated with ultraviolet rays (365 nm) for 5 minutes to increase the resistance of the non-projected portion of the connection terminal 12. . In this case, the metallic chrome of the connection terminal 12 functions as a photomask. The connection resistance of the obtained mounting body was 1 Ω or less, and the insulation resistance between adjacent terminals was 200 MΩ or more.

[Embodiment 29] This corresponds to the example shown in FIG.

First, a wiring having a width of 25 μm, which is made of metal chrome having a film thickness of 0.25 μm and a transparent conductive film having a film thickness of 0.12 μm, metal chromium having a film thickness of 0.25 μm, and a film thickness of 0.1 μm.
256 pieces of 50 μm x made of 12 μm transparent conductive film
The connection terminal 1 of the glass wiring board 1 (illustrated in FIG. 28A) having a thickness of 0.7 mm provided with the connection terminal 12 of 50 μm.
2 wt% of a polyvinyl butyral chloroform solution is applied to the surface having 2 to evaporate chloroform,
A film made of polyvinyl butyral having a thickness of 2 μm was formed to obtain a first adhesive layer 71a.

Next, the solute is composed of polyaniline, polyvinyl butyral which is a thermoplastic polymer, camphorsulfonic acid which is a dopant, and N-cyclohexylcarbamic acid 2-nitrobenzyl ester which is a base generator, 10 wt. % N-methylpyrrolidone solution was prepared. The weight ratio of polyaniline, polyvinyl butyral, camphor sulfonic acid and N-cyclohexylcarbamic acid 2-nitrobenzyl ester is 1: 2: 1.3: 3.

This connecting composition was applied to the first adhesive layer 71a.
N-methylpyrrolidone, which is a solvent, is evaporated to give polyaniline (1 part by weight), polyvinyl butyral (2 parts by weight), camphorsulfonic acid (1.3 parts by weight) and N-cyclohexylcarbamic acid 2 A connection layer 5 having a thickness of 5 μm, which is a conductive polymer composition film containing -nitrobenzyl ester (3 parts by weight), was formed. As a result, the surface of the wiring board 1 provided with the connection terminals 12 is attached to
As shown in (b), a two-layer laminate of the first adhesive layer 71a and the connection layer 5 was obtained.

On the other hand, on the surface having the connection terminals 21 of the LSI chip 2 (shown in FIG. 28C), which has 256 50 μm × 50 μm connection terminals 21 and the gold bumps 23 are formed on the connection terminals 21, 10 wt% of polyvinyl butyral
A chloroform solution was applied, chloroform was evaporated, and a film made of polyvinyl butyral having a thickness of 6 μm was formed to obtain a second adhesive layer 71b shown in FIG. 28 (d).

[0275] The connection terminal 12 of the glass wiring board 1 and the LS
Aligning the position of the I-chip 2 with the connection terminal 21,
As shown in (e), the connection layer 5 and the second adhesive layer 71b were joined and thermocompression-bonded at 1.5 MPa / cm ² and 150 ° C. As a result, the connecting member 230 composed of three layers was formed, and the LSI chip 2 was mounted on the substrate 1.

From the side of the glass wiring board 1 having the LSI chip 2 not provided with the connection terminals 12, the connection layer 5 was irradiated with ultraviolet rays (365 nm) for 5 minutes to increase the resistance of the non-projected portions of the connection terminals 12. . In this case, the metallic chrome of the connection terminal 12 functions as a photomask. The connection resistance of the obtained mounting body was 1 Ω or less, and the insulation resistance between adjacent terminals was 200 MΩ or more.

[Embodiment 30] This corresponds to the example shown in FIG.

First, a wiring having a width of 25 μm, which is made of chrome metal having a film thickness of 0.25 μm and a transparent conductive film having a film thickness of 0.12 μm, metal chrome having a film thickness of 0.25 μm, and a film thickness of 0.1 μm.
256 pieces of 50 μm x made of 12 μm transparent conductive film
The connection terminal 1 of the glass wiring board 1 (illustrated in FIG. 29A) having a thickness of 0.7 mm provided with the connection terminal 12 of 50 μm.
2 wt% of a polyvinyl butyral chloroform solution is applied to the surface having 2 to evaporate chloroform,
A film made of polyvinyl butyral having a thickness of 2 μm was formed to obtain a first adhesive layer 71a as shown in FIG. 29 (b).

On the other hand, on the surface having the connection terminals 21 of the LSI chip 2 (shown in FIG. 29C) having 256 connection terminals 21 of 50 μm × 50 μm, and gold bumps 23 formed on the connection terminals 21, 10 wt% of polyvinyl butyral
A chloroform solution was applied, chloroform was evaporated, and a film made of polyvinyl butyral having a thickness of 6 μm was formed to obtain a second adhesive layer 71b.

Next, the solute is polyaniline, polyvinyl butyral which is a thermoplastic polymer, camphor sulfonic acid which is a dopant, and N-cyclohexylcarbamic acid 2-nitrobenzyl ester which is a base generator, 10 wt. % N-methylpyrrolidone solution was prepared. The weight ratio of polyaniline, polyvinyl butyral, camphor sulfonic acid and N-cyclohexylcarbamic acid 2-nitrobenzyl ester is 1: 2: 1.3: 3.

This connecting composition is used as a second adhesive layer 71b.
N-methylpyrrolidone, which is a solvent, is evaporated to give polyaniline (1 part by weight), polyvinyl butyral (2 parts by weight), camphorsulfonic acid (1.3 parts by weight) and N-cyclohexylcarbamic acid 2 A connection layer 5 having a thickness of 5 μm, which is a conductive polymer composition film containing -nitrobenzyl ester (3 parts by weight), was formed. As a result, the surface of the LSI chip 2 on which the connection terminals 21 are provided is
As shown in FIG. 9 (d), the second adhesive layer 71a and the connection layer 5
A two-layer laminate was obtained.

The connection terminal 12 of the glass wiring board 1 and the LS
29, by aligning the position with the connection terminal 21 of the I-chip 2.
As shown in (e), the first adhesive layer 71a and the connection layer 5 were joined together and thermocompression bonded at 150 ° C. at 1.5 MPa / cm ² . As a result, the connecting member 230 composed of three layers was formed, and the LSI chip 2 was mounted on the substrate 1.

From the side of the glass wiring board 1 on which the LSI chip 2 is mounted, which does not have the connection terminals 12, the connection layer 5 is irradiated with ultraviolet rays (365 nm) for 5 minutes to increase the resistance of the non-projected portions of the connection terminals 12. . In this case, the metallic chrome of the connection terminal 12 functions as a photomask. The connection resistance of the obtained mounting body was 1 Ω or less, and the insulation resistance between adjacent terminals was 200 MΩ or more.

[Embodiment 31] This corresponds to the example shown in FIG.

First, a 10 wt% chloroform solution of polyvinyl butyral is applied to the surface of the peeling base material to evaporate the chloroform to form a film of polyvinyl butyral having a thickness of 2 μm, and the first adhesive layer 71 is formed. Obtained.

Next, the solute is composed of polyaniline, polyvinyl butyral which is a thermoplastic polymer, camphorsulfonic acid which is a dopant, and N-cyclohexylcarbamic acid 2-nitrobenzyl ester which is a base generator, 10 wt. % N-methylpyrrolidone solution was prepared. The weight ratio of polyaniline, polyvinyl butyral, camphor sulfonic acid and N-cyclohexylcarbamic acid 2-nitrobenzyl ester is 1: 2: 1.3: 3.

This connecting composition is applied to the surface of the first adhesive layer 71 to evaporate the solvent N-methylpyrrolidone, and polyaniline (1 part by weight), polyvinyl butyral (2 parts by weight) and camphor. A connection layer 5 having a thickness of 5 μm, which is a conductive polymer composition film containing sulfonic acid (1.3 parts by weight) and N-cyclohexylcarbamic acid 2-nitrobenzyl ester (3 parts by weight) was formed.

Furthermore, a 10 wt% chloroform solution of polyvinyl butyral is applied to the surface of the connection layer 5 to evaporate chloroform to form a film of polyvinyl butyral having a thickness of 6 μm, and the second adhesive layer 71 is formed. Obtained. As a result, the first adhesive layer 7 is formed on the surface of the peeling base material.
Since a three-layer laminated body including the connection layer 5, the connection layer 5, and the second adhesive layer 71 was formed, the laminated body was peeled from the peeling base material, and the three-layer film shown in FIG. A certain connecting member 230 was obtained.

As shown in FIG. 30B, this connecting member is made of metal chrome having a thickness of 0.25 μm and a thickness of 0.12.
A wiring of 25 μm in width made of a transparent conductive film of μm, 256 pieces of connecting terminals 12 of 50 μm × 50 μm made of a transparent conductive film having a film thickness of 0.25 μm and chromium metal and a thickness of 0.12 μm. The glass wiring board 1 having a thickness is sandwiched between the surface provided with the connection terminals 12 and the surface provided with the connection terminals 21 and the gold bumps 23 of the LSI chip 2 and thermocompression bonded at 150 ° C. and 1.5 MPa / cm ^2. did.
As a result, the LSI chip 2 was mounted on the glass wiring board 1.

From the side of the glass wiring board 1 having the LSI chip 2 not provided with the connection terminal 12, the connection layer 5 is irradiated with ultraviolet rays (365 nm) for 5 minutes to increase the resistance of the non-projected portion of the connection terminal 12. . In this case, the metallic chrome of the connection terminal 12 functions as a photomask. The connection resistance of the obtained mounting body was 1 Ω or less, and the insulation resistance between adjacent terminals was 200 MΩ or more.

[Embodiment 32] This corresponds to the example shown in FIG. However, in the example shown in FIG. 3, the LSI chip 2 is mounted on the wiring board 1, but in this embodiment, the TAB board is mounted on the liquid crystal display board. The substrate of the liquid crystal display panel used in Examples 32 to 54 is made of glass and transmits light.

First, the solute is polyaniline, polyvinyl butyral which is a thermoplastic polymer, camphor sulfonic acid which is a dopant, and N-cyclohexylcarbamic acid 2-nitrobenzyl ester which is a base generator. A connection composition which is a meta-cresol solution of was prepared. The weight ratio of polyaniline, polyvinyl butyral, camphor sulfonic acid and N-cyclohexylcarbamic acid 2-nitrobenzyl ester is
It is 1: 2: 1.3: 3.

This connection composition was prepared by using an electrode width and an electrode interval of 25 μm, a wiring made of metal chrome having a film thickness of 0.25 μm and a transparent conductive film having a film thickness of 0.12 μm, and the connection terminal 12 having a film thickness of 0. 25 μm metallic chromium and a film thickness of 0.
A liquid crystal display panel having a thickness of 0.7 mm and formed of a transparent conductive film having a thickness of 12 μm is applied to the surface provided with the connection terminal 12 to evaporate metacresol which is a solvent, and polyaniline (1 part by weight) and polyvinyl butyral (2 parts). Part by weight), camphor sulfonic acid (1.3 parts by weight) and N-cyclohexylcarbamic acid 2-nitrobenzyl ester (3 parts by weight), which is a conductive polyaniline film and has a thickness of 5 μm.
1 was formed.

Further, a 10 wt% solution of polyvinyl butyral in chloroform was applied to the surface of the obtained connection layer 81 to evaporate chloroform to form a film of polyvinyl butyral having a thickness of 8 μm, which was used as the adhesive layer 71. .

On the adhesive layer 71, the TAB substrate was placed with the connecting terminal positions aligned, and at 150 ° C. and 1.5 MPa / c.
The liquid crystal display plate was heated and pressed under m ² and irradiated with ultraviolet rays (365 nm) from the side of the liquid crystal display plate on which the TAB substrate was not mounted for 5 minutes to increase the resistance of the non-projected portion 820 of the connection terminal 12.
In this case, the metallic chrome of the connection terminal 12 functions as a photomask. The connection resistance of this mounting body is 1Ω or less,
The insulation resistance between adjacent terminals was 200 MΩ or more.

[Embodiment 33] This corresponds to the example shown in FIG. However, in the example shown in FIG. 3, the LSI chip 2 is mounted on the wiring board 1, but in this embodiment, the TAB board is mounted on the liquid crystal display board.

First, the solute is polyaniline, polyvinyl acetate which is a thermoplastic polymer, camphor sulfonic acid which is a dopant, and N-cyclohexylcarbamic acid 2-nitrobenzyl ester which is a base generator, 10 wt. % Metacresol solution was prepared. Polyaniline, polyvinyl acetate, camphor sulfonic acid and N-cyclohexylcarbamic acid 2-
The weight ratio with the nitrobenzyl ester is 1: 1.5:
It is 1.3: 3.

This connection composition was prepared by using an electrode width and an electrode interval of 25 μm, a wiring material made of metallic chrome having a film thickness of 0.25 μm and a transparent conductive film having a film thickness of 0.12 μm, and the connection terminal 12 having a film thickness of 0. .25 μm metallic chrome and a 0.12 μm-thick transparent conductive film are applied to the surface of a 0.7 mm-thick liquid crystal display panel on which the connection terminals 12 are provided to evaporate metacresol, which is a solvent. (1
Parts by weight), polyvinyl acetate (1.5 parts by weight), camphor sulfonic acid (1.3 parts by weight) and N-cyclohexylcarbamic acid 2-nitrobenzyl ester (3 parts by weight). A connection layer 81 having a thickness of 5 μm was formed.

Further, a 10 wt% meta-cresol solution of polyvinyl acetate was applied to the surface of the obtained connection layer 81 to evaporate the meta-cresol and form a film of polyvinyl acetate having a thickness of 8 μm, followed by adhesion. It was layer 71.

A TAB substrate is placed on the adhesive layer 71 with the connecting terminals aligned, and the temperature is 150 ° C. and the pressure is 1.5 MPa / c.
The liquid crystal display plate was heated and pressed under m ² and irradiated with ultraviolet rays (365 nm) from the side of the liquid crystal display plate on which the TAB substrate was not mounted for 5 minutes to increase the resistance of the non-projected portion 820 of the connection terminal 12.
In this case, the metallic chrome of the connection terminal 12 functions as a photomask. The connection resistance of this mounting body is 1Ω or less,
The insulation resistance between adjacent terminals was 200 MΩ or more.

[Embodiment 34] This corresponds to the example shown in FIG. However, in the example shown in FIG. 3, the LSI chip 2 is mounted on the wiring board 1, but in this embodiment, the TAB board is mounted on the liquid crystal display board.

First, the solute is polyaniline, an ethylene / vinyl acetate copolymer which is a thermoplastic polymer, camphorsulfonic acid which is a dopant, and N-cyclohexylcarbamic acid 2-nitrobenzyl ester which is a base generator. Was prepared, which was a 10 wt% meta-cresol solution. The weight ratio of polyaniline, ethylene / vinyl acetate copolymer, camphor sulfonic acid and N-cyclohexylcarbamic acid 2-nitrobenzyl ester is 1: 2: 1.3: 3.

This connecting composition was used, in which the electrode width and the electrode interval were 25 μm, the wiring material was made of metallic chrome having a film thickness of 0.25 μm and the transparent conductive film having a film thickness of 0.12 μm, and the connecting terminal 12 had a film thickness of 0. .25 μm metallic chrome and a 0.12 μm-thick transparent conductive film are applied to the surface of a 0.7 mm-thick liquid crystal display panel on which the connection terminals 12 are provided to evaporate metacresol, which is a solvent. (1
Parts by weight) and ethylene / vinyl acetate copolymer (2 parts by weight)
And camphor sulfonic acid (1.3 parts by weight) and N-cyclohexylcarbamic acid 2-nitrobenzyl ester (3
A conductive polyaniline film containing 5 parts by weight and
m of the connection layer 81 was formed.

Further, a 10 wt% solution of ethylene / vinyl acetate copolymer in metacresol was applied to the surface of the obtained connection layer 81 to evaporate metacresol to a thickness of 8
An adhesive layer 71 is formed by forming a film made of polyvinyl acetate having a thickness of μm.
And

On the adhesive layer 71, the TAB substrate was placed with the connecting terminals aligned, and the temperature was 150 ° C. and the pressure was 1.5 MPa / c.
The liquid crystal display plate was heated and pressed under m ² and irradiated with ultraviolet rays (365 nm) from the side of the liquid crystal display plate on which the TAB substrate was not mounted for 5 minutes to increase the resistance of the non-projected portion 820 of the connection terminal 12.
In this case, the metallic chrome of the connection terminal 12 functions as a photomask. The connection resistance of this mounting body is 1Ω or less,
The insulation resistance between adjacent terminals was 200 MΩ or more.

[Embodiment 35] This corresponds to the example shown in FIG. However, in the example shown in FIG. 3, the LSI chip 2 is mounted on the wiring board 1, but in this embodiment, the TAB board is mounted on the liquid crystal display board.

First, the solute is polyaniline, polyvinyl butyral which is a thermoplastic polymer, camphorsulfonic acid which is a dopant, and N-ethylcarbamic acid 2-nitrobenzyl ester which is a base generator. A connection composition which is a meta-cresol solution of was prepared. The weight ratio of polyaniline, polyvinyl butyral, camphorsulfonic acid, and N-ethylcarbamic acid 2-nitrobenzyl ester was 1: 2: 1.3:
It is 3.

This connection composition was prepared by using an electrode width and an electrode interval of 25 μm, a wiring made of metallic chrome having a film thickness of 0.25 μm and a transparent conductive film having a film thickness of 0.12 μm, and the connection terminal 12 having a film thickness of 0. 25 μm metallic chromium and a film thickness of 0.
A liquid crystal display panel having a thickness of 0.7 mm and formed of a transparent conductive film having a thickness of 12 μm is applied to the surface provided with the connection terminal 12 to evaporate metacresol which is a solvent, and polyaniline (1 part by weight) and polyvinyl butyral (2 parts). Part by weight), camphor sulfonic acid (1.3 parts by weight), and N-ethylcarbamic acid 2-nitrobenzyl ester (3 parts by weight), which is a conductive polyaniline film and has a thickness of 5 μm.

Further, a 10 wt% solution of polyvinyl butyral in chloroform was applied to the surface of the obtained connection layer 81 to evaporate chloroform to form a film of polyvinyl butyral having a thickness of 8 μm, which was used as the adhesive layer 71. .

A TAB substrate was placed on the adhesive layer 71 with the connecting terminals aligned, and the temperature was 150 ° C. and the pressure was 1.5 MPa / c.
The liquid crystal display plate was heated and pressed under m ² and irradiated with ultraviolet rays (365 nm) from the side of the liquid crystal display plate on which the TAB substrate was not mounted for 5 minutes to increase the resistance of the non-projected portion 820 of the connection terminal 12.
In this case, the metallic chrome of the connection terminal 12 functions as a photomask. The connection resistance of this mounting body is 1Ω or less,
The insulation resistance between adjacent terminals was 200 MΩ or more.

[Embodiment 36] This corresponds to the example shown in FIG. However, in the example shown in FIG. 3, the LSI chip 2 is mounted on the wiring board 1, but in this embodiment, the TAB board is mounted on the liquid crystal display board.

First, the solute is poly (3-n-octylthiophene) which is a polymer having a conjugated double bond as a main chain, polyvinyl butyral which is a thermoplastic polymer, and tricarbonyl which is a latent reducing agent. A 10 wt% chloroform solution containing (cyclopentadienyl) manganese (I) was prepared as a connecting composition. The weight ratio of poly (3-n-octylthiophene), polyvinyl butyral and tricarbonyl (cyclopentadienyl) manganese (I) is 1: 2: 1.

This connecting composition was prepared by using an electrode width and an electrode interval of 25 μm, a wiring made of metallic chrome having a film thickness of 0.25 μm and a transparent conductive film having a film thickness of 0.12 μm, and the connection terminal 12 having a film thickness of 0. 25 μm metallic chromium and a film thickness of 0.
It is applied to a surface of a liquid crystal display panel having a thickness of 0.7 mm, which is made of a transparent conductive film of 12 μm and has a connection terminal 12, to evaporate chloroform as a solvent, and poly (3-n-octylthiophene) (1 wt. Part) and polyvinyl butyral (2)
(Part by weight) and tricarbonyl (cyclopentadienyl) manganese (I) (1 part by weight), which is a conductive polyaniline film and has a thickness of 5 μm.

Further, a 10 wt% solution of polyvinyl butyral in chloroform was applied on the surface of the obtained connection layer 81 to evaporate chloroform to form a film of polyvinyl butyral having a thickness of 8 μm, which was used as the adhesive layer 71. .

A TAB substrate is placed on the adhesive layer 71 with the connecting terminals aligned, and the temperature is 150 ° C. and the pressure is 1.5 MPa / c.
The liquid crystal display plate was heated and pressed under m ² and irradiated with ultraviolet rays (365 nm) from the side of the liquid crystal display plate on which the TAB substrate was not mounted for 5 minutes to increase the resistance of the non-projected portion 820 of the connection terminal 12.
In this case, the metallic chrome of the connection terminal 12 functions as a photomask. The connection resistance of this mounting body is 1Ω or less,
The insulation resistance between adjacent terminals was 200 MΩ or more.

[Embodiment 37] This corresponds to the example shown in FIG. However, in the example shown in FIG. 3, the LSI chip 2 is mounted on the wiring board 1, but in this embodiment, the TAB board is mounted on the liquid crystal display board.

First, the solute is polyaniline, polyvinyl butyral which is a thermoplastic polymer, camphor sulfonic acid which is a dopant, and N-cyclohexylcarbamic acid 2-nitrobenzyl ester which is a base generator. A connection composition which is a meta-cresol solution of was prepared. The weight ratio of polyaniline, polyvinyl butyral, camphor sulfonic acid and N-cyclohexylcarbamic acid 2-nitrobenzyl ester is
It is 1: 2: 1.3: 3.

Wirings (not shown) and connecting terminals 12 were prepared by using this connecting composition, which had an electrode width and an electrode interval of 25 μm, and was made of metal chrome having a film thickness of 0.25 μm and a transparent conductive film having a film thickness of 0.12 μm. Is applied to the surface of the 0.7 mm-thick liquid crystal display panel provided with the connection terminal 12 to evaporate metacresol which is a solvent, and to obtain polyaniline (1 part by weight) and polyvinyl butyral (2 parts by weight). A connection layer 81 having a thickness of 5 μm, which is a conductive polymer composition film containing camphorsulfonic acid (1.3 parts by weight) and N-cyclohexylcarbamic acid 2-nitrobenzyl ester (3 parts by weight) was formed.

Next, a 10 wt% solution of polyvinyl butyral in chloroform was applied to the surface of the connection layer 81 to evaporate chloroform to form an adhesive layer 71 which was a film of polyvinyl butyral having a thickness of 8 μm.

On this adhesive layer 71, the TAB substrate was placed with the connecting terminals aligned, and at 150 ° C. and 1.5 MPa / c.
As shown in FIG. 3 (c), the connection terminal 1 is pressed from the side of the liquid crystal display panel on which the TAB substrate is not mounted by thermocompression bonding with m ² .
The connection layer 81 is irradiated with ultraviolet rays (365 nm) for 5 minutes through the photomask 9 that blocks the light applied to the second portion, and the non-projection portion 820 of the connection terminal 12 is exposed as shown in FIG. Has a high resistance. The connection resistance of the obtained mounting body was 1 Ω or less, and the insulation resistance between adjacent terminals was 200 MΩ or more.

[Embodiment 38] This corresponds to the example shown in FIG. However, in the example shown in FIG.
The LSI chip 2 is mounted on the wiring board 1, but in the present embodiment, the TAB board is mounted on the liquid crystal display board.

First, the solute is polyaniline, polyvinyl butyral which is a thermoplastic polymer, camphor sulfonic acid which is a dopant, and N-cyclohexylcarbamic acid 2-nitrobenzyl ester which is a base generator. A connection composition which is a meta-cresol solution of was prepared. The weight ratio of polyaniline, polyvinyl butyral, camphor sulfonic acid and N-cyclohexylcarbamic acid 2-nitrobenzyl ester is
It is 1: 2: 1.3: 3.

Wirings (not shown) and connection terminals 12 were prepared by using this composition for connection, which had an electrode width and an electrode interval of 25 μm, and which consisted of metallic chrome with a film thickness of 0.25 μm and a transparent conductive film with a film thickness of 0.12 μm. Is applied to the surface of the 0.7 mm-thick liquid crystal display panel provided with the connection terminal 12 to evaporate metacresol which is a solvent, and to obtain polyaniline (1 part by weight) and polyvinyl butyral (2 parts by weight). A connection layer 81 having a thickness of 5 μm, which is a conductive polymer composition film containing camphorsulfonic acid (1.3 parts by weight) and N-cyclohexylcarbamic acid 2-nitrobenzyl ester (3 parts by weight) was formed.

Further, a 10 wt% solution of polyvinyl butyral in chloroform was applied on the surface of the connection layer 81 to evaporate the chloroform to form an adhesive layer 71 which was a film of polyvinyl butyral having a thickness of 8 μm.

Next, as shown in FIG. 1A, ultraviolet rays (3) are applied to the connection layer 81 from above the adhesive layer 71 through a photomask 9 that blocks the light irradiated to the connection terminals 12.
65 nm) for 5 minutes, and as shown in FIG.
The non-projection portion 820 of the connection terminal 12 has a high resistance.

Finally, the TAB substrate is placed on the adhesive layer 71 with the connecting terminals aligned, and the temperature is 150 ° C. and the pressure is 1.5 MPa.
By thermocompression bonding at / cm ² , a mounting body having a TAB substrate mounted on a liquid crystal display plate as shown in FIG. 1C was obtained. The connection resistance of the obtained mounting body was 1 Ω or less, and the insulation resistance between adjacent terminals was 200 MΩ or more.

[Embodiment 39] This corresponds to the example shown in FIG. However, in the example shown in FIG.
The LSI chip 2 is mounted on the wiring board 1, but in the present embodiment, the TAB board is mounted on the liquid crystal display board.

First, the solute is polyaniline, polyvinyl butyral which is a thermoplastic polymer, camphorsulfonic acid which is a dopant, and N-cyclohexylcarbamic acid 2-nitrobenzyl ester which is a base generator. A connection composition which is a meta-cresol solution of was prepared. The weight ratio of polyaniline, polyvinyl butyral, camphor sulfonic acid and N-cyclohexylcarbamic acid 2-nitrobenzyl ester is
It is 1: 2: 1.3: 3.

This connecting composition was applied to a wiring (not shown) made of metallic chrome having a thickness of 0.25 μm and a transparent conductive film having a thickness of 0.12 μm, with an electrode width and an electrode interval of 25 μm, and a thickness of 0. 0.25 μm metallic chromium and a film thickness of 0.
A liquid crystal display panel having a thickness of 0.7 mm provided with a connection terminal 12 made of a transparent conductive film of 12 μm is applied to the surface provided with the connection terminal 12 to evaporate metacresol which is a solvent, and polyaniline (1 wt. Parts), polyvinyl butyral (2 parts by weight) and camphor sulfonic acid (1.3 parts by weight)
A connection layer 81 having a thickness of 5 μm, which is a conductive polymer composition film containing N-cyclohexylcarbamic acid 2-nitrobenzyl ester (3 parts by weight), was formed.

Further, a 10 wt% solution of polyvinyl butyral in chloroform was applied to the surface of the connection layer 81 to evaporate chloroform to form an adhesive layer 71 which was a film of polyvinyl butyral having a thickness of 8 μm.

Next, a connecting member for the liquid crystal display panel (connecting layer 8
1 and the side where the adhesive layer 71) is not formed,
As shown in (a), ultraviolet rays (365n
m) was irradiated for 5 minutes to increase the resistance of the non-projection portion 820 of the connection terminal 12, as shown in FIG. in this case,
The metal chrome of the connection terminal 12 functions as a photomask.

Finally, the TAB substrate is placed on the adhesive layer 71 with the connecting terminal positions aligned, and the temperature is 150 ° C. and the pressure is 1.5 MPa.
By thermocompression bonding at / cm ² , a mounting body having a TAB substrate mounted on a liquid crystal display plate as shown in FIG. 5C was obtained. The connection resistance of the obtained mounting body was 1 Ω or less, and the insulation resistance between adjacent terminals was 200 MΩ or more.

[Embodiment 40] This corresponds to the example shown in FIG. However, in the example shown in FIG.
The LSI chip 2 is mounted on the wiring board 1, but in the present embodiment, the TAB board is mounted on the liquid crystal display board.

First, the solute is polyaniline, polyvinyl butyral which is a thermoplastic polymer, camphorsulfonic acid which is a dopant, and N-cyclohexylcarbamic acid 2-nitrobenzyl ester which is a base generator. A connection composition which is a meta-cresol solution of was prepared. The weight ratio of polyaniline, polyvinyl butyral, camphor sulfonic acid and N-cyclohexylcarbamic acid 2-nitrobenzyl ester is
It is 1: 2: 1.3: 3.

[0335] This connecting composition was applied to a wiring (not shown) made of a transparent conductive film having an electrode width and an electrode interval of 25 µm and a film thickness of 0.2 µm, and 0.7 m including a connecting terminal 12.
It is applied to the surface of the liquid crystal display panel having a thickness of m to be provided with the connection terminal 12 to evaporate metacresol which is a solvent, polyaniline (1 part by weight), polyvinyl butyral (2 parts by weight) and camphor sulfonic acid (1 part by weight). .3 parts by weight) and N-cyclohexylcarbamic acid 2-nitrobenzyl ester (3 parts by weight), which is a conductive polymer composition film, and a connection layer 81 having a thickness of 5 μm was formed.

Further, a 10 wt% solution of polyvinyl butyral in chloroform was applied to the surface of the connection layer 81 to evaporate the chloroform to form an adhesive layer 71 which was a film of polyvinyl butyral having a thickness of 8 μm.

Next, a connecting member of the liquid crystal display panel (connecting layer 8
1 and the side where the adhesive layer 71) is not formed,
As shown in FIG. 6A, the connection layer 81 is irradiated with ultraviolet rays (365 nm) for 5 minutes through the photomask 9 that blocks the light irradiated to the connection terminal 12, and as shown in FIG. In addition, the non-projection portion 820 of the connection terminal 12 has a high resistance.

Finally, the TAB substrate is placed on the adhesive layer 71 with the connecting terminals aligned, and the temperature is 150 ° C. and the pressure is 1.5 MPa.
By thermocompression bonding at / cm ² , a mounting body having a TAB substrate mounted on a liquid crystal display plate as shown in FIG. 6C was obtained. The connection resistance of the obtained mounting body was 1 Ω or less, and the insulation resistance between adjacent terminals was 200 MΩ or more.

[Embodiment 41] This corresponds to the example shown in FIG. However, in the example shown in FIG.
The LSI chip 2 is mounted on the wiring board 1, but in the present embodiment, the TAB board is mounted on the liquid crystal display board.

First, the solute is composed of polyaniline, polyvinyl butyral which is a thermoplastic polymer, and 2,2,2-tribromoethanol which is an acid generator.
A connecting composition was prepared which was a t% N-methylpyrrolidone solution. Polyaniline, polyvinyl butyral and 2,
The weight ratio with 2,2-tribromoethanol is 1: 2 :.
It is 1.6.

[0341] This connecting composition was provided with a wiring (not shown) made of a transparent conductive film having an electrode width and an electrode interval of 25 µm and a film thickness of 0.2 µm, and a connecting terminal 12 having a thickness of 0.7 m.
It is applied to the surface of the liquid crystal display panel having a thickness of m, which is provided with the connection terminals 12, to evaporate the solvent N-methylpyrrolidone,
Polyaniline (1 part by weight) and polyvinyl butyral (2
Parts by weight) and 2,2,2-tribromoethanol (1.6
And a connection layer 91 having a thickness of 5 μm, which is a conductive polymer precursor composition film containing

Further, a 10 wt% solution of polyvinyl butyral in chloroform was applied on the surface of the connection layer 91 to evaporate the chloroform to form an adhesive layer 71 which was a film of polyvinyl butyral having a thickness of 8 μm.

Next, as shown in FIG. 2A, an ultraviolet ray (3) is applied to the connection layer 91 from above the adhesive layer 71 through a photomask 9 that allows only the light irradiated to the connection terminal 12 portion to pass therethrough.
65 nm) for 5 minutes, and as shown in FIG.
The resistance of the upper portion 910 of the connection terminal 12 of the connection layer 91 was reduced to give conductivity.

Finally, the TAB substrate is placed on the adhesive layer 71 with the connecting terminals aligned, and the temperature is 150 ° C. and the pressure is 1.5 MPa.
By thermocompression bonding at / cm ² , a mounting body having a TAB substrate mounted on a liquid crystal display plate as shown in FIG. 2C was obtained. The connection resistance of the obtained mounting body was 1 Ω or less, and the insulation resistance between adjacent terminals was 200 MΩ or more.

[Embodiment 42] This corresponds to the example shown in FIG. However, in the example shown in FIG.
The LSI chip 2 is mounted on the wiring board 1, but in the present embodiment, the TAB board is mounted on the liquid crystal display board.

First, the solute is composed of polyaniline, polyvinyl butyral which is a thermoplastic polymer, and 2,2,2-tribromoethanol which is an acid generator.
A connecting composition was prepared which was a t% N-methylpyrrolidone solution. Polyaniline, polyvinyl butyral and 2,
The weight ratio with 2,2-tribromoethanol is 1: 2 :.
It is 1.6.

[0347] This connecting composition was provided with a wiring (not shown) made of a transparent conductive film having an electrode width and an electrode interval of 25 µm and a film thickness of 0.2 µm, and a connecting terminal 12 having a thickness of 0.7 m.
It is applied to the surface of the liquid crystal display panel having a thickness of m, which is provided with the connection terminal 12, to evaporate the solvent N-methylpyrrolidone,
Polyaniline (1 part by weight) and polyvinyl butyral (2
Parts by weight) and 2,2,2-tribromoethanol (1.6
And a connection layer 91 having a thickness of 5 μm, which is a conductive polymer precursor composition film containing

Further, a 10 wt% solution of polyvinyl butyral in chloroform was applied to the surface of the connection layer 91 to evaporate chloroform to form an adhesive layer 71 which was a film of polyvinyl butyral having a thickness of 8 μm.

Next, the TAB substrate is placed on the adhesive layer 71 with the connecting terminals aligned, and the temperature is 150 ° C. and the pressure is 1.5 MPa.
A TAB substrate was mounted on the liquid crystal display plate by thermocompression bonding at / cm ² .

Finally, the connecting member of the liquid crystal display panel (connecting layer 9
1 and the side where the adhesive layer 71) is not formed,
As shown in FIG. 4A, the connection layer 91 is irradiated with ultraviolet rays (365 nm) for 5 minutes through the photomask 9 that allows only the light irradiated to the connection terminal 12 to pass therethrough, and as shown in FIG. In addition, the resistance of the upper portion 910 of the connection terminal 12 of the connection layer 91 was reduced to give conductivity. The connection resistance of the obtained mounting body was 1 Ω or less, and the insulation resistance between adjacent terminals was 200 MΩ or more.

[Embodiment 43] This corresponds to the example shown in FIG. However, in the example shown in FIG.
The LSI chip 2 is mounted on the wiring board 1, but in the present embodiment, the TAB board is mounted on the liquid crystal display board.

First, the solute is composed of polyaniline, polyvinyl butyral which is a thermoplastic polymer, and 2,2,2-tribromoethanol which is an acid generator.
A connecting composition was prepared which was a t% N-methylpyrrolidone solution. Polyaniline, polyvinyl butyral and 2,
The weight ratio with 2,2-tribromoethanol is 1: 2 :.
It is 1.6.

[0353] This connecting composition was used to form a wiring (not shown) made of a transparent conductive film having an electrode width and an electrode interval of 25 µm and a film thickness of 0.2 µm, and a connecting terminal 12 having a thickness of 0.7 m.
It is applied to the surface of the liquid crystal display panel having a thickness of m, which is provided with the connection terminals 12, to evaporate the solvent N-methylpyrrolidone,
Polyaniline (1 part by weight) and polyvinyl butyral (2
Parts by weight) and 2,2,2-tribromoethanol (1.6
And a connection layer 91 having a thickness of 5 μm, which is a conductive polymer precursor composition film containing

Further, a 10 wt% solution of polyvinyl butyral in chloroform was applied to the surface of the connection layer 91 to evaporate chloroform to form an adhesive layer 71 which was a film of polyvinyl butyral having a thickness of 8 μm.

Next, as shown in FIG. 7A, only the light radiated to the connection terminals 12 from the side of the liquid crystal display panel on which the connection members (connection layer 91 and adhesive layer 71) are not formed. The connection layer 91 is irradiated with ultraviolet rays (365 nm) for 5 minutes through the photomask 9 that passes through, and as shown in FIG. 7B, the resistance of the upper portion 910 of the connection terminal 12 of the connection layer 91 is reduced to improve conductivity. Granted.

Finally, the TAB substrate is placed on the adhesive layer 71 with the connecting terminal position aligned, and the temperature is 150 ° C. and the pressure is 1.5 MPa.
By thermocompression bonding at / cm ² , a mounting body having a TAB substrate mounted on a liquid crystal display plate as shown in FIG. 7C was obtained. The connection resistance of the obtained mounting body was 1 Ω or less, and the insulation resistance between adjacent terminals was 200 MΩ or more.

[Embodiment 44] This corresponds to the example shown in FIG. However, in the example shown in FIG.
The LSI chip 2 is mounted on the wiring board 1, but in the present embodiment, the TAB board is mounted on the liquid crystal display board.

First, a 10 wt% solution of polyvinyl butyral in chloroform was applied to the surface of the TAB substrate having an electrode width and electrode spacing of 25 μm and a thickness of 18 μm, which had a connection terminal, and chloroform was evaporated to a thickness of 8 μm.
An adhesive layer 71, which is a film made of polyvinyl butyral, was formed.

Next, the solute is composed of polyaniline, polyvinyl butyral which is a thermoplastic polymer, camphorsulfonic acid which is a dopant, and N-cyclohexylcarbamic acid 2-nitrobenzyl ester which is a base generator, 10 wt. % Metacresol solution was prepared. The weight ratio of polyaniline, polyvinyl butyral, camphor sulfonic acid and N-cyclohexylcarbamic acid 2-nitrobenzyl ester is
It is 1: 2: 1.3: 3.

This connecting composition was applied to the surface of the adhesive layer 71 to evaporate the solvent metacresol to give polyaniline (1 part by weight), polyvinyl butyral (2 parts by weight) and camphor sulfonic acid (1.3 parts by weight). Part by weight) and N-cyclohexylcarbamic acid 2-nitrobenzyl ester (3 parts by weight), and a connection layer 81 having a thickness of 5 μm, which is a conductive polymer composition film, was formed.

As shown in FIG. 8A, ultraviolet rays (365 nm) are radiated from the connection layer 81 to the connection layer 81 through a photomask 9 which blocks the light radiated to the connection terminals of the TAB substrate. Irradiation was carried out for 5 minutes to increase the resistance of the non-projection portion 820 of the connection terminal as shown in FIG.

Finally, the electrode width and the electrode interval are 20 μm.
Then, on the surface of the liquid crystal display panel having a thickness of 0.2 mm and including the wiring (not shown) and the connection terminal 12, which has the connection terminal 12, the TAB is formed. The substrate is placed by aligning the positions of the connection terminals so that the connection terminals 12 of the liquid crystal display panel and the conductive portions 810 of the connection layer 81 are joined, and heat-pressed at 150 ° C. and 1.5 MPa / cm ^2. On the liquid crystal display panel as shown in FIG. 8 (c).
A mounting body having the B board mounted thereon was obtained. The connection resistance of the obtained mounting body was 1 Ω or less, and the insulation resistance between adjacent terminals was 200 MΩ or more.

[Embodiment 45] This corresponds to the example shown in FIG. However, in the example shown in FIG.
The LSI chip 2 is mounted on the wiring board 1, but in the present embodiment, the TAB board is mounted on the liquid crystal display board.

First, a 10 wt% solution of polyvinyl butyral in chloroform was applied to the surface of the TAB substrate having the electrode width and the electrode interval of 25 μm and the thickness of 18 μm, and the chloroform was evaporated to a thickness of 8 μm.
An adhesive layer 71, which is a film made of polyvinyl butyral, was formed.

Next, the solute is composed of polyaniline, polyvinyl butyral which is a thermoplastic polymer, and 2,2,2-tribromoethanol which is an acid generator.
A connection composition, which is a wt% N-methylpyrrolidone solution, was prepared. The weight ratio of polyaniline, polyvinyl butyral and 2,2,2-tribromoethanol was 1:
2: 1.6.

This connecting composition was applied to the surface of the adhesive layer 71 to evaporate N-methylpyrrolidone which was a solvent, and polyaniline (1 part by weight), polyvinyl butyral (2 parts by weight), 2,2,2. A connection layer 91 having a thickness of 5 μm, which is a conductive polymer precursor composition film containing 2-tribromoethanol (1.6 parts by weight), was formed.

Next, as shown in FIG. 9A, ultraviolet rays (365 nm) are applied to the connection layer 91 from the connection layer 91 side through a photomask 9 which allows only the light with which the connection terminal 12 is irradiated. ) Was irradiated for 5 minutes, and the resistance of the upper portion 910 of the connection terminal 12 of the connection layer 91 was reduced to give conductivity, as shown in FIG. 9B.

Finally, the electrode width and the electrode interval are 20 μm.
Then, on a surface of the liquid crystal display panel having a thickness of 0.2 mm and having a wiring (not shown) and a connection terminal 12 of 0.7 mm, the TAB The substrate is placed by aligning the positions of the connection terminals so that the connection terminals 12 of the liquid crystal display panel and the conductive portions 910 of the connection layer 81 are joined, and heat-pressed at 150 ° C. and 1.5 MPa / cm ^2. On the liquid crystal display panel as shown in FIG. 9 (c).
A mounting body having the B board mounted thereon was obtained. The connection resistance of the obtained mounting body was 1 Ω or less, and the insulation resistance between adjacent terminals was 200 MΩ or more.

[Embodiment 46] This corresponds to the example shown in FIG. However, in the example shown in FIG. 3, the LSI chip 2 is mounted on the wiring board 1, but in this embodiment, the TAB board is mounted on the liquid crystal display board.

First, a 10 wt% chloroform solution of polyvinyl butyral was applied to the surface of the peeling base material, chloroform was evaporated, and a film made of polyvinyl butyral having a thickness of 2 μm was formed to obtain an adhesive layer 71.

Next, the solute is polyaniline, polyvinyl butyral which is a thermoplastic polymer, camphorsulfonic acid which is a dopant, and N-cyclohexylcarbamic acid 2-nitrobenzyl ester which is a base generator, 10 wt. % N-methylpyrrolidone solution was prepared. The weight ratio of polyaniline, polyvinyl butyral, camphor sulfonic acid and N-cyclohexylcarbamic acid 2-nitrobenzyl ester is 1: 2: 1.3: 3.

This connecting composition was applied to the surface of the adhesive layer 71 to evaporate the solvent N-methylpyrrolidone, and polyaniline (1 part by weight), polyvinyl butyral (2 parts by weight) and camphorsulfonic acid ( 1.3 parts by weight)
A connection layer 81 having a thickness of 5 μm, which is a conductive polymer composition film containing N-cyclohexylcarbamic acid 2-nitrobenzyl ester (3 parts by weight), was formed. This allows
Since a two-layer laminate of the adhesive layer 71 and the connecting layer 81 was formed on the surface of the peeling base material, the laminate was peeled from the peeling base material to obtain the connection member 230 which was a two-layer structure film. .

This connecting member had a width of 25 μm and an electrode width and an electrode interval of 25 μm, and was made of metallic chrome having a thickness of 0.25 μm and a transparent conductive film having a thickness of 0.12 μm, and a thickness of 0.25 μm. Metal chrome and film thickness 0.1
1.0m with connection terminal made of transparent conductive film of 2μm
The liquid crystal display panel having a thickness of m is sandwiched between the surface provided with the connection terminal and the surface provided with the electrode of the TAB substrate having an electrode width and an electrode interval of 25 μm and a thickness of 18 μm.
It was thermocompression bonded at 1.5 ° C. and 1.5 MPa / cm ² .

Finally, as shown in FIG. 3 (a), the connection layer 5 is irradiated with ultraviolet rays (365 nm) for 5 minutes from the side of the liquid crystal display panel which is not provided with the connection terminals 12, as shown in FIG. 3 (b). As described above, the non-projection portion 820 of the connection terminal 12 has a high resistance. In this case, the metallic chrome of the connection terminal 12 functions as a photomask. The connection resistance of the obtained mounting body is 1
Ω or less, insulation resistance between adjacent terminals was 200 MΩ or more.

[Embodiment 47] This corresponds to the example shown in FIG. However, in the example shown in FIG. 23, the LSI chip 2 is mounted on the wiring substrate 1, but in this embodiment, the TAB substrate is mounted on the liquid crystal display plate.

First, the electrode width and the electrode interval are 25 μm.
, A wiring (not shown) made of a transparent conductive film having a film thickness of 0.2 μm, metallic chrome having a film thickness of 0.25 μm, and a film thickness of 0.
A 10 wt% chloroform solution of polyvinyl butyral is applied to the surface of the 0.7 mm-thick liquid crystal display panel having a connecting terminal 12 made of a transparent conductive film of 12 μm and having the connecting terminal 12 to evaporate chloroform. , FIG. 23
As shown in (b), a first adhesive layer 71, which is a film made of polyvinyl butyral having a thickness of 2 μm, was formed.

Next, the solute is polyaniline, polyvinyl butyral which is a thermoplastic polymer, camphorsulfonic acid which is a dopant, and N-cyclohexylcarbamic acid 2-nitrobenzyl ester which is a base generator, 10 wt. % Metacresol solution was prepared. The weight ratio of polyaniline, polyvinyl butyral, camphor sulfonic acid and N-cyclohexylcarbamic acid 2-nitrobenzyl ester is
It is 1: 2: 1.3: 3.

This connection composition is applied to the surface of the adhesive layer 71 to evaporate the solvent metacresol, and the composition shown in FIG.
As shown in (c), polyaniline (1 part by weight), polyvinyl butyral (2 parts by weight), camphor sulfonic acid (1.3 parts by weight) and N-cyclohexylcarbamic acid 2
A connection layer 5 having a thickness of 5 μm, which is a conductive polymer composition film containing -nitrobenzyl ester (3 parts by weight), was formed.

Further, a 10 wt% chloroform solution of polyvinyl butyral is applied to the surface of the connection layer 5 to evaporate chloroform, and a film made of polyvinyl butyral having a thickness of 6 μm is formed as shown in FIG. 23 (d). A certain second adhesive layer 71 was formed. As a result, the connecting member 230 including the three layers of the first adhesive layer 71, the connecting layer 5, and the second adhesive layer 71 was formed.

On the second adhesive layer 71, the TAB substrate is placed with the connecting terminals aligned, and at 150 ° C. and 1.5MP.
It was thermocompression bonded at a / cm ² and a TAB substrate was mounted on the liquid crystal display plate as shown in FIG. From the side of the liquid crystal display plate on which the TAB substrate is not mounted, the connection layer 81 is irradiated with ultraviolet rays (365 nm) for 5 minutes through the photomask 9 that blocks the light irradiated to the connection terminal 12 portion to connect. The non-projection portion of the terminal 12 has a high resistance. The connection resistance of the obtained mounting body was 1 Ω or less, and the insulation resistance between adjacent terminals was 200 MΩ or more.

[Embodiment 48] This corresponds to the example shown in FIG. However, in the example shown in FIG. 24, the LSI chip 2 is mounted on the wiring substrate 1, but in the present embodiment, the TAB substrate is mounted on the liquid crystal display plate.

First, the electrode width and the electrode interval are 25 μm.
And a 18 μm thick TAB substrate (illustrated in FIG. 24 (a))
Of 10% by weight of polyvinyl butyral in chloroform is applied to the surface having the connection terminal 12 to evaporate chloroform, and the thickness is 8 μm as shown in FIG.
An adhesive layer 71, which is a film made of polyvinyl butyral, was formed.

Next, the solute is polyaniline, polyvinyl butyral which is a thermoplastic polymer, camphorsulfonic acid which is a dopant, and N-cyclohexylcarbamic acid 2-nitrobenzyl ester which is a base generator, 10 wt. % Metacresol solution was prepared. The weight ratio of polyaniline, polyvinyl butyral, camphor sulfonic acid and N-cyclohexylcarbamic acid 2-nitrobenzyl ester is
It is 1: 2: 1.3: 3.

This connecting composition is applied to the surface of the adhesive layer 71 to evaporate the metacresol which is a solvent.
As shown in (c), polyaniline (1 part by weight), polyvinyl butyral (2 parts by weight), camphor sulfonic acid (1.3 parts by weight) and N-cyclohexylcarbamic acid 2
A connection layer 5 having a thickness of 5 μm, which is a conductive polymer composition film containing -nitrobenzyl ester (3 parts by weight), was formed. As a result, the connecting member 220 including the adhesive layer 71 and the connecting layer 5 was formed.

Wiring (not shown) made of metal chrome with a film thickness of 0.25 μm and a transparent conductive film with a film thickness of 0.2 μm, with an electrode width and electrode spacing of 25 μm, and a film thickness of 0.25 μm.
The connecting layer 5 is formed on the surface of the liquid crystal display panel having a thickness of 0.7 mm including the metallic chromium and the connecting terminal 12 made of the transparent conductive film having a thickness of 0.12 μm. The TAB substrate is placed by aligning the positions of the connection terminals so as to be bonded to the substrate, and at 150 ° C. and 1.5 MPa / cm.
^After heat-pressing at ² , a TAB substrate was mounted on the liquid crystal display plate as shown in FIG. TAB of this liquid crystal display board
From the side where the substrate is not mounted, ultraviolet rays (3
(65 nm) for 5 minutes to increase the resistance of the non-projected portion of the connection terminal 12. In this case, the metal chrome of the connection terminal functions as a photomask. The connection resistance of the obtained mounting body was 1 Ω or less, and the insulation resistance between adjacent terminals was 200 MΩ or more.

[49th Embodiment] This corresponds to the embodiment shown in FIG. However, in the example shown in FIG. 25, the LSI chip 2 is mounted on the wiring substrate 1, but in the present embodiment, the TAB substrate is mounted on the liquid crystal display plate.

First, the electrode width and the electrode interval are 25 μm.
Then, on the surface of the TAB substrate having a thickness of 18 μm (FIG. 25A) provided with the connection terminals 12, polyvinyl butyral 10 w
A t% chloroform solution was applied and chloroform was evaporated to form a first adhesive layer 71a, which is a film made of polyvinyl butyral and having a thickness of 2 μm, as shown in FIG. 25 (b).

Next, the solute is polyaniline, polyvinyl butyral which is a thermoplastic polymer, camphorsulfonic acid which is a dopant, and N-cyclohexylcarbamic acid 2-nitrobenzyl ester which is a base generator, 10 wt. % Metacresol solution was prepared. The weight ratio of polyaniline, polyvinyl butyral, camphor sulfonic acid and N-cyclohexylcarbamic acid 2-nitrobenzyl ester is
It is 1: 2: 1.3: 3.

This connecting composition is applied to the surface of the adhesive layer 71 to evaporate the metacresol which is a solvent.
As shown in (c), polyaniline (1 part by weight), polyvinyl butyral (2 parts by weight), camphor sulfonic acid (1.3 parts by weight) and N-cyclohexylcarbamic acid 2
A connection layer 5 having a thickness of 5 μm, which is a conductive polymer composition film containing -nitrobenzyl ester (3 parts by weight), was formed.

Further, a 10 wt% solution of polyvinyl butyral in chloroform was applied on the surface of the connection layer 5 to evaporate chloroform, and a film made of polyvinyl butyral having a thickness of 6 μm was formed as shown in FIG. 25 (d). A certain second adhesive layer 71b was formed. Thereby, the connection member 230 in which the first adhesive layer 71a, the connection layer 5, and the second adhesive layer 71b were laminated in this order was formed.

Wiring (not shown) made of metal chrome having a film thickness of 0.25 μm and a transparent conductive film having a film thickness of 0.12 μm with an electrode width and an electrode interval of 25 μm, and a film thickness of 0.25 μm.
m of metallic chromium and a connecting terminal 12 made of a transparent conductive film having a film thickness of 0.12 μm, and a first adhesive layer 71b is formed on a surface of the 0.7 mm thick liquid crystal display panel having the connecting terminal 12. So as to join the connection terminal 12, align the position of the connection terminal and mount the TAB substrate at 150 ° C. for 1.5
After thermocompression bonding at MPa / cm ² , a TAB substrate was mounted on the liquid crystal display plate as shown in FIG. From the side of the liquid crystal display panel on which the TAB substrate is not mounted, the connection layer 81
UV rays (365 nm) for 5 minutes, and the connection terminal 12
The non-projected part of was made high resistance. In this case, the metal chrome of the connection terminal functions as a photomask. The connection resistance of the obtained mounting body was 1 Ω or less, and the insulation resistance between adjacent terminals was 200 MΩ or more.

[Embodiment 50] This corresponds to the example shown in FIG. However, in the example shown in FIG. 26, the LSI chip 2 is mounted on the wiring board 1, but in this embodiment, the TAB board is mounted on the liquid crystal display board.

First, the solute is polyaniline, polyvinyl butyral which is a thermoplastic polymer, camphor sulfonic acid which is a dopant, and N-cyclohexylcarbamic acid 2-nitrobenzyl ester which is a base generator. A connection composition which is a meta-cresol solution of was prepared. The weight ratio of polyaniline, polyvinyl butyral, camphor sulfonic acid and N-cyclohexylcarbamic acid 2-nitrobenzyl ester is
It is 1: 2: 1.3: 3.

This connecting composition was applied to a wiring (not shown) consisting of metallic chrome having a film thickness of 0.25 μm and a transparent conductive film having a film thickness of 0.12 μm, with an electrode width and an electrode interval of 25 μm, and a film thickness of 0. 0.25 μm metallic chromium and a film thickness of 0.
A liquid crystal display panel having a thickness of 0.7 mm, which is provided with a connection terminal 12 made of a transparent conductive film having a thickness of 12 μm (illustrated in FIG. 26A).
26 is applied to the surface provided with the connection terminal 12 to evaporate metacresol, which is a solvent, and polyaniline (1 part by weight), polyvinyl butyral (2 parts by weight) and camphor sulfonic acid ( 1.3 parts by weight) and N-
A connection layer 5 having a thickness of 5 μm, which is a conductive polymer composition film containing cyclohexylcarbamic acid 2-nitrobenzyl ester (3 parts by weight), was formed.

On the other hand, the electrode width and the electrode interval are 25 μm.
And a 18 μm thick TAB substrate (illustrated in FIG. 26 (c))
Of 10 wt% of polyvinyl butyral in chloroform is applied to the surface provided with the connection terminal 12 to evaporate chloroform, and the thickness is 8 μm as shown in FIG.
An adhesive layer 71, which is a film made of polyvinyl butyral, was formed.

Next, on the connection layer 5 of the liquid crystal display panel provided with the connection layer 5, the TAB substrate provided with the adhesive layer 71 is aligned with the connection terminals so that the adhesion layer 71 and the connection layer 5 are joined. The sample is placed, and thermocompression-bonded at 150 ° C. and 1.5 MPa / cm ² , and as shown in FIG.
An AB board was mounted. Thereby, the connection layer 5 and the adhesive layer 7
1 and a joining member 220 including
A liquid crystal display panel on which an AB substrate was mounted was obtained. From the side of the liquid crystal display panel on which the TAB substrate is not mounted, the connection layer 8
1 is irradiated with ultraviolet rays (365 nm) for 5 minutes, and the connection terminal 1
The non-projected portion of No. 2 has a high resistance. In this case, the metal chrome of the connection terminal functions as a photomask. The connection resistance of the obtained mounting body was 1 Ω or less, and the insulation resistance between adjacent terminals was 200 MΩ or more.

[Example 51] This corresponds to the example shown in FIG. However, in the example shown in FIG. 27, the LSI chip 2 is mounted on the wiring board 1, but in this embodiment, the TAB board is mounted on the liquid crystal display board.

First, the electrode width and the electrode interval are 25 μm.
With a thickness of 0.25 μm of metallic chromium and a thickness of 0.12
A liquid crystal having a thickness of 0.7 mm, including wiring (not shown) made of a transparent conductive film having a thickness of μm, and a connection terminal 12 made of a transparent conductive film having a thickness of 0.25 μm and metal chromium and a thickness of 0.12 μm. Connection terminal 1 of display board (illustrated in FIG. 27 (a))
2 wt% of a polyvinyl butyral chloroform solution is applied to the surface having 2 to evaporate chloroform,
As shown in FIG. 27B, an adhesive layer 71 which is a film made of polyvinyl butyral having a thickness of 8 μm was formed.

Next, the solute is polyaniline, polyvinyl butyral which is a thermoplastic polymer, camphorsulfonic acid which is a dopant, and N-cyclohexylcarbamic acid 2-nitrobenzyl ester which is a base generator, 10 wt. % Metacresol solution was prepared. The weight ratio of polyaniline, polyvinyl butyral, camphor sulfonic acid and N-cyclohexylcarbamic acid 2-nitrobenzyl ester is
It is 1: 2: 1.3: 3.

This connecting composition was applied to a TAB substrate having an electrode width and an electrode interval of 25 μm and a thickness of 18 μm (see FIG. 27).
27 (FIG. 27C) is applied to the surface provided with the connection terminal 12 to evaporate metacresol which is a solvent.
As shown in (d), polyaniline (1 part by weight), polyvinyl butyral (2 parts by weight), camphor sulfonic acid (1.3 parts by weight) and N-cyclohexylcarbamic acid 2
A connection layer 5 having a thickness of 5 μm, which is a conductive polymer composition film containing -nitrobenzyl ester (3 parts by weight), was formed.

Next, on the adhesive layer 71 of the liquid crystal display panel provided with the adhesive layer 71, the TAB substrate provided with the connection layer 5 is aligned with the connection terminals so that the adhesive layer 71 and the connection layer 5 are joined. It was placed and thermocompression bonded at 150 ° C. and 1.5 MPa / cm ² , and the TAB substrate was mounted on the liquid crystal display plate as shown in FIG. Thereby, the joining member 220 including the connection layer 5 and the adhesive layer 71 is formed, and
A liquid crystal display panel on which a TAB substrate was mounted was obtained. The connection layer 81 was irradiated with ultraviolet rays (365 nm) for 5 minutes from the side of the liquid crystal display plate on which the TAB substrate was not mounted to increase the resistance of the non-projected portion of the connection terminal 12. In this case, the metal chrome of the connection terminal functions as a photomask. The connection resistance of the obtained mounting body was 1 Ω or less, and the insulation resistance between adjacent terminals was 200 MΩ or more.

[Embodiment 52] This corresponds to the example shown in FIG. However, in the example shown in FIG. 28, the LSI chip 2 is mounted on the wiring substrate 1, but in this embodiment, the TAB substrate is mounted on the liquid crystal display plate.

First, the electrode width and the electrode interval are 25 μm.
With a thickness of 0.25 μm of metallic chromium and a thickness of 0.12
A liquid crystal having a thickness of 0.7 mm, including wiring (not shown) made of a transparent conductive film having a thickness of μm, and a connection terminal 12 made of a transparent conductive film having a thickness of 0.25 μm and metal chromium and a thickness of 0.12 μm. Connection terminal 1 of display board (illustrated in FIG. 28 (a))
2 wt% of a polyvinyl butyral chloroform solution is applied to the surface having 2 to evaporate chloroform,
As shown in FIG. 28B, a first adhesive layer 71a, which is a film made of polyvinyl butyral and having a thickness of 2 μm, was formed.

Next, the solute is polyaniline, polyvinyl butyral which is a thermoplastic polymer, camphorsulfonic acid which is a dopant, and N-cyclohexylcarbamic acid 2-nitrobenzyl ester which is a base generator, 10 wt. % Metacresol solution was prepared. The weight ratio of polyaniline, polyvinyl butyral, camphor sulfonic acid and N-cyclohexylcarbamic acid 2-nitrobenzyl ester is
It is 1: 2: 1.3: 3.

[0405] This connecting composition was applied to the first adhesive layer 71a.
28), the solvent metacresol is evaporated, and as shown in FIG. 28 (b), polyaniline (1 part by weight), polyvinyl butyral (2 parts by weight) and camphor sulfonic acid (1.3 parts by weight). ) And N-cyclohexylcarbamic acid 2-nitrobenzyl ester (3 parts by weight), which is a conductive polymer composition film and has a thickness of 5 μm.
Was formed.

On the other hand, the electrode width and the electrode interval are 25 μm.
Then, a TAB substrate having a thickness of 18 μm (illustrated in FIG. 28C)
Of 10% by weight of polyvinyl butyral in chloroform is applied to the surface provided with the connection terminal 12.
The chloroform was evaporated, and as shown in FIG. 28 (d),
A second adhesive layer 71b, which is a film made of polyvinyl butyral having a thickness of 6 μm, was formed.

Next, the second layer is formed on the connection layer 5 of the liquid crystal display panel.
The TAB substrate is placed by aligning the positions of the connection terminals so that the adhesive layer 71b of 1) and the connection layer 5 are joined, and the TAB substrate is placed at 150 ° C.
It was thermocompression bonded at 5 MPa / cm ² , and a TAB substrate was mounted on the liquid crystal display plate as shown in FIG. 28 (e). As a result, the joining member 230 including the first adhesive layer 71a, the connection layer 5 and the second adhesive layer 71b is formed, and
A liquid crystal display panel on which a TAB substrate was mounted was obtained. The connection layer 81 was irradiated with ultraviolet rays (365 nm) for 5 minutes from the side of the liquid crystal display plate on which the TAB substrate was not mounted to increase the resistance of the non-projected portion of the connection terminal 12. In this case, the metal chrome of the connection terminal functions as a photomask. The connection resistance of the obtained mounting body was 1 Ω or less, and the insulation resistance between adjacent terminals was 200 MΩ or more.

[Embodiment 53] This corresponds to the example shown in FIG. However, in the example shown in FIG. 29, the LSI chip 2 is mounted on the wiring substrate 1, but in this embodiment, the TAB substrate is mounted on the liquid crystal display plate.

First, the electrode width and the electrode interval are 25 μm.
With a thickness of 0.25 μm of metallic chromium and a thickness of 0.12
A liquid crystal having a thickness of 0.7 mm, including wiring (not shown) made of a transparent conductive film having a thickness of μm, and a connection terminal 12 made of a transparent conductive film having a thickness of 0.25 μm and metal chromium and a thickness of 0.12 μm. Connection terminal 1 of display board (illustrated in FIG. 29 (a))
2 wt% of a polyvinyl butyral chloroform solution is applied to the surface having 2 to evaporate chloroform,
As shown in FIG. 29B, a first adhesive layer 71a, which is a film made of polyvinyl butyral having a thickness of 2 μm, was formed.

On the other hand, the electrode width and the electrode interval are 25 μm.
Then, a TAB substrate having a thickness of 18 μm (illustrated in FIG. 29C)
Of a polyvinyl butyral 10 wt% chloroform solution is applied to evaporate the chloroform, and as shown in FIG. 29D, a film of polyvinyl butyral having a thickness of 6 μm is formed. There is a second
Adhesive layer 71b was formed.

Next, the solute is composed of polyaniline, polyvinyl butyral which is a thermoplastic polymer, camphorsulfonic acid which is a dopant, and N-cyclohexylcarbamic acid 2-nitrobenzyl ester which is a base generator, 10 wt. % Metacresol solution was prepared. The weight ratio of polyaniline, polyvinyl butyral, camphor sulfonic acid and N-cyclohexylcarbamic acid 2-nitrobenzyl ester is
It is 1: 2: 1.3: 3.

[0412] This connecting composition is applied to the second adhesive layer 71b.
29, the solvent metacresol is evaporated, and as shown in FIG. 29 (d), polyaniline (1 part by weight), polyvinyl butyral (2 parts by weight) and camphor sulfonic acid (1.3 parts by weight). ) And N-cyclohexylcarbamic acid 2-nitrobenzyl ester (3 parts by weight), which is a conductive polymer composition film and has a thickness of 5 μm.
Was formed.

Next, the first adhesive layer 71a of the liquid crystal display panel.
Then, the TAB substrate is placed by aligning the positions of the connection terminals so that the first adhesive layer 71a and the connection layer 5 are bonded to each other.
By thermocompression bonding at 0 ° C. and 1.5 MPa / cm ² , FIG.
As shown in (e), a TAB substrate was mounted on the liquid crystal display plate. As a result, the bonding member 230 including the first adhesive layer 71a, the connection layer 5, and the second adhesive layer 71b was formed, and the liquid crystal display panel on which the TAB substrate was mounted was obtained. The connection layer 81 was irradiated with ultraviolet rays (365 nm) for 5 minutes from the side of the liquid crystal display plate on which the TAB substrate was not mounted to increase the resistance of the non-projected portion of the connection terminal 12. In this case, the metal chrome of the connection terminal functions as a photomask. The connection resistance of the obtained mounting body was 1 Ω or less, and the insulation resistance between adjacent terminals was 200 MΩ or more.

[Embodiment 54] This corresponds to the example shown in FIG. However, in the example shown in FIG. 30, the LSI chip 2 is mounted on the wiring board 1, but in this embodiment, the TAB board is mounted on the liquid crystal display board.

First, a 10 wt% chloroform solution of polyvinyl butyral is applied to the surface of the peeling base material to evaporate chloroform to form a film of polyvinyl butyral having a thickness of 2 μm, and the first adhesive layer 71 is formed. Obtained.

Next, the solute is composed of polyaniline, polyvinyl butyral which is a thermoplastic polymer, camphorsulfonic acid which is a dopant, and N-cyclohexylcarbamic acid 2-nitrobenzyl ester which is a base generator, 10 wt. % N-methylpyrrolidone solution was prepared. The weight ratio of polyaniline, polyvinyl butyral, camphor sulfonic acid and N-cyclohexylcarbamic acid 2-nitrobenzyl ester is 1: 2: 1.3: 3.

This connecting composition was applied to the surface of the first adhesive layer 71 to evaporate N-methylpyrrolidone as a solvent, to give polyaniline (1 part by weight), polyvinyl butyral (2 parts by weight) and camphor. A connection layer 5 having a thickness of 5 μm, which is a conductive polymer composition film containing sulfonic acid (1.3 parts by weight) and N-cyclohexylcarbamic acid 2-nitrobenzyl ester (3 parts by weight) was formed.

Further, a 10 wt% solution of polyvinyl butyral in chloroform is applied to the surface of the connection layer 5 to evaporate chloroform to form a film of polyvinyl butyral having a thickness of 6 μm, and the second adhesive layer 71 is formed. Obtained. As a result, the first adhesive layer 7 is formed on the surface of the peeling base material.
Since a three-layer laminated body including the connection layer 5, the connection layer 5, and the second adhesive layer 71 was formed, the laminated body was peeled from the peeling base material, and the three-layer film shown in FIG. A certain connecting member 230 was obtained.

As shown in FIG. 30 (b), this connecting member has an electrode width and electrode spacing of 25 μm and a film thickness of 0.25.
A wiring (not shown) made of metallic chromium having a thickness of 0.12 μm and a transparent conductive film having a thickness of 0.12 μm, and a connection terminal 12 made of metallic chromium having a thickness of 0.25 μm and a transparent conductive film having a thickness of 0.12 μm are provided. The surface of the liquid crystal panel having a thickness of 0.7 mm, which has the connection terminals 12, and the electrode width and the electrode interval are 2
The connection terminal 12 of the TAB substrate having a thickness of 5 μm and a thickness of 18 μm
It is held between the surface equipped with and at 150 ° C, 1.5 MPa /
It was thermocompression-bonded at cm ² . As a result, the LSI chip 2 was mounted on the glass wiring board 1.

From the side of the glass wiring board 1 having the LSI chip 2 not provided with the connection terminal 12, the connection layer 5 was irradiated with ultraviolet rays (365 nm) for 5 minutes to increase the resistance of the non-projected portion of the connection terminal 12. . In this case, the metallic chrome of the connection terminal 12 functions as a photomask. The connection resistance of the obtained mounting body was 1 Ω or less, and the insulation resistance between adjacent terminals was 200 MΩ or more.

As described above, in the above embodiments, fine connection pitch is possible. In addition, the manufacturing method is excellent in mass productivity and economical efficiency.

[0422]

According to the present invention, highly reliable mounting of a wiring structure having a fine connection pitch, which is important in various fields, can be realized. Further, the manufacturing method of the present invention, mass productivity,
It is an economical method and has great industrial significance. In particular,
It is effective in the development of liquid crystal display devices for ultra-high-definition images, high-density mounting circuits, etc., which have become increasingly important in recent years.

[Brief description of drawings]

FIG. 1 is a cross-sectional view showing a mounting method of the present invention.

FIG. 2 is a cross-sectional view showing a mounting method of the present invention.

FIG. 3 is a cross-sectional view showing a mounting method of the present invention.

FIG. 4 is a cross-sectional view showing a mounting method of the present invention.

FIG. 5 is a cross-sectional view showing a mounting method of the present invention.

FIG. 6 is a cross-sectional view showing a mounting method of the present invention.

FIG. 7 is a cross-sectional view showing a mounting method of the present invention.

FIG. 8 is a cross-sectional view showing a mounting method of the present invention.

FIG. 9 is a cross-sectional view showing a mounting method of the present invention.

FIG. 10 is a cross-sectional view showing a state of a connecting portion when the present invention is applied and mounted.

FIG. 11 is a cross-sectional view showing a state of a connecting portion when the present invention is applied and mounted.

FIG. 12 is a cross-sectional view showing a state of a connecting portion when the present invention is applied and mounted.

FIG. 13 is a cross-sectional view showing a conventional mounting method.

FIG. 14 is a cross-sectional view showing a conventional mounting method.

FIG. 15 is a cross-sectional view showing a conventional mounting method.

FIG. 16 is a cross-sectional view showing a conventional mounting method.

FIG. 17 is a cross-sectional view showing a conventional mounting method.

FIG. 18 is a cross-sectional view showing a joint portion when mounted by a conventional mounting method.

FIG. 19 is a cross-sectional view showing a joint portion when mounted by a conventional mounting method.

FIG. 20 is a cross-sectional view showing a joint portion when mounted by a conventional mounting method.

FIG. 21 is a cross-sectional view showing a dispersed state of conductive particles in an anisotropic conductive film.

FIG. 22 is a cross-sectional view showing the mounting method of the present invention.

FIG. 23 is a cross-sectional view showing the mounting method of the present invention.

FIG. 24 is a cross-sectional view showing the mounting method of the present invention.

FIG. 25 is a cross-sectional view showing the mounting method of the present invention.

FIG. 26 is a cross-sectional view showing the mounting method of the present invention.

FIG. 27 is a cross-sectional view showing the mounting method of the present invention.

FIG. 28 is a cross-sectional view showing the mounting method of the present invention.

FIG. 29 is a cross-sectional view showing the mounting method of the present invention.

FIG. 30 is a cross-sectional view showing the mounting method of the present invention.

[Explanation of symbols]

1 ... Circuit board, 2 ... LSI chip, 3 ... Anisotropic conductive film, 4 ... Gold wire, 5 ... Resin, 6 ... Adhesive, 7 ... Conductive particles, 9 ... Photomask , 11 ……
Substrate, 12 ... Connection terminal, 21 ... Connection terminal, 23 ...
Gold bumps, 31 ... Conductive particles, 32 ... Polymer materials, 3
3 ... Contact state of conductive particles, 34 ... Area without conductive particles, 71 ... Thermoplastic polymer, 81 ... Conductive polymer,
810 ... Conductive part, 820 ... High resistance part, 91
... Conductive polymer precursor, 910 ... Conductive portion, 92
0: High resistance part.

Claims (34)

[Claims] 1. At least two members having a connecting terminal made of a conductor are provided, and the connecting terminal provided on the first member and the connecting terminal provided on the second member are made of a conductive material. Connected to a portion other than the conductor of the first member and the second
In a conductor connection structure in which a portion of the member other than the conductor is bonded by a non-conductive material, the conductive material includes a conductive polymer having a conjugated double bond as a main chain skeleton, The conductor connecting structure, wherein the conductive material includes a connection layer containing a non-conductive polymer having a conjugated double bond as a main chain skeleton and an adhesive layer containing a thermoplastic polymer. 2. The non-conductive polymer according to claim 1, wherein at least a part of the conjugated double bonds of the conductive polymer having a conjugated double bond as a main chain skeleton is non-conjugated. A conductor connection structure characterized by being a polymer that has become non-conductive by doing so. 3. The non-conductive polymer according to claim 1, wherein at least a part of the conjugated double bond of the conductive polymer having a conjugated double bond as a main chain skeleton is cut. A conductor connection structure characterized by being a molecule. 4. The conductive material according to claim 1, wherein the conductive polymer includes the conductive polymer in an oxidized state or a reduced state, and the connection layer of the non-conductive material is the non-conductive material in a neutral state. A conductive connection structure comprising a conductive polymer. 5. The non-conductive polymer according to claim 1, wherein the conductive polymer includes a polyaniline having an emeraldine structure in a basic state, and the conductive polymer includes a polyaniline having an emeraldine structure in a salt state. Characteristic conductor connection structure. 6. The conductor according to claim 4, wherein the connection layer containing the non-conductive polymer further contains a latent oxidant that is a substance that generates an oxidant when receiving light. Connection structure. 7. The conductor connecting structure according to claim 4, wherein the conductive material further includes a latent reducing agent that is a substance that generates a reducing agent when receiving light. 8. The conductor connection structure according to claim 5, wherein the connection layer containing the non-conductive polymer further contains an acid generator that is a substance that generates an acid when receiving light. . 9. The conductive material according to claim 5, wherein the conductive material is a base generator that is a substance that generates a base when receiving light.
A conductor connection structure further comprising: 10. The conductor connecting structure according to claim 1, wherein the conductive material further includes a photoreactive agent that is a substance that causes a photoreaction with the conductive polymer. 11. The conductor connection structure according to claim 6, wherein the weight of the latent oxidant is 0.1 to 10 when the weight of the non-conductive polymer is 1. . 12. The conductor connecting structure according to claim 8, wherein the weight of the non-conductive polymer is 1, and the weight of the acid generator is 0.1 to 10. 13. The conductor connecting structure according to claim 7, wherein the weight of the latent reducing agent is 0.1 to 10 when the weight of the conductive polymer is 1. 14. The conductor connection structure according to claim 9, wherein the weight of the base generator is 0.1 to 10 when the weight of the conductive polymer is 1. 15. The conductor connection structure according to claim 10, wherein the weight of the electroconductive polymer is 1, and the weight of the photoreactive agent is 0.1 to 10. 16. The conductor connecting structure according to claim 1, wherein the connecting layer of the conductive material and the non-conductive material contains at least one of a thermoplastic polymer and a thermosetting polymer. . 17. The conductor connection according to claim 6, wherein the latent oxidant contains a salt of at least one of pentaammine iodocobalt (III) ion and pentaammine azidocobalt (III) ion. Structure. 18. The latent reducing agent according to claim 7, wherein the latent reducing agent contains at least one of tricarbonyl (cyclopentadienyl) manganese (I) and tricarbonyl (cyclooctatetraene) iron (0). And a conductor connection structure. 19. The conductor connecting structure according to claim 8, wherein the acid generator is 2,2,2-tribromoethanol. 20. The base generator according to claim 9, wherein the base generator is N-cyclohexylcarbamic acid-2-nitrobenzyl ester, N-cyclohexylcarbamic acid-2-nitro-α-methylbenzyl ester, N-cyclohexylcarbamic acid- 2,6-dinitrobenzyl ester, N
-Cyclohexylcarbamic acid-2,6-dinitro-α
-Methylbenzyl ester, N-methylcarbamic acid-
A conductor connection structure comprising at least one of 2-nitrobenzyl ester and N-ethylcarbamic acid-2-nitrobenzyl ester. 21. The photoreactive agent according to claim 10, wherein the photoreactive agent is an azide compound, a cinnamoyl compound, an acrylic compound,
A conductor connection structure comprising at least one of a diazo compound, a carbonyl compound, benzyl, benzoin, benzoin alkyl ethers, and a disulfide compound. 22. The conductor connecting structure according to claim 21, wherein the photoreactive agent is benzoin isopropyl ether. 23. The thermoplastic polymer of the adhesive layer according to claim 1, wherein: polyvinyl alcohol, polyethylene oxide, polyvinyl ether, polyvinyl butyral, polyvinyl formal, polystyrene, allyl resin, methacrylic resin, polyvinyl chloride, polyvinylidene chloride. , Vinyl acetate, vinyl propionate, ethylene vinyl acetate copolymer, ethylene vinyl chloride copolymer, ketone resin, polybutadiene, polyacetal, polysulfone, polyamide, copolymerized nylon and thermoplastic polyimide. Structure. 24. A connecting layer containing a polymer having a conjugated double bond as a main chain skeleton, and an adhesive layer made of a thermoplastic polymer, wherein the polymer of the connecting layer has conductivity when irradiated with light. A connecting member having a changing property. 25. The connection member according to claim 24, wherein the adhesive layer and the connection layer are laminated. 26. The adhesive layer according to claim 24, wherein two layers of the adhesive layer are provided, and three layers of the first adhesive layer, the connection layer, and the second adhesive layer are laminated in this order. A connecting member characterized by. 27. A method of manufacturing a conductor connection structure for connecting connection terminals of two members having a connection terminal made of a conductor, comprising: a surface of the first member having the connection terminals; and a connection of the second member. A connecting layer containing a polymer having a conjugated double bond as a main chain skeleton and having a property of changing conductivity by light irradiation, and an adhesive layer made of a thermoplastic polymer. A conductor comprising: a step of holding a connection member including: a step of thermocompression bonding the first member and a second member; and a step of irradiating at least a part of the connection layer with light. Method for manufacturing connection structure. 28. The method of manufacturing a conductor connection structure according to claim 27, wherein the connection member is a film including a connection layer and an adhesive layer which are produced in advance. 29. The connecting member according to claim 27, wherein the connecting layer is formed on a surface of the first member having the connecting terminal, and the adhesive layer is formed on a surface of the connecting layer. And a step of forming a conductor connection structure. 30. The connection member according to claim 27, wherein the connection member has a step of forming the connection layer on a surface of the first member provided with the connection terminal, and a surface of the second member provided with the connection terminal. And a step of forming the above-mentioned adhesive layer, the method for producing a conductor connection structure. 31. The method according to claim 27, wherein the adhesive layer is provided in two layers, and the connecting member has a step of forming the first adhesive layer on a surface of the first member on which the connection terminal is provided, A step of forming an upper connection layer on the surface of the first adhesive layer; a step of forming a second adhesion layer on the surface of the second member provided with the connection terminals; A method for manufacturing a conductor connection structure, which is formed by joining with a second adhesive layer. 32. The method according to claim 27, wherein at least one of the first member and the second member transmits light, and in the step of irradiating the light, the light is irradiated through the member transmitting the light. A method of manufacturing a conductor connection structure, comprising: 33. The method of manufacturing a conductor connection structure according to claim 27, wherein the step of thermocompression bonding is performed after the step of irradiating with light. 34. The method for manufacturing a conductor connection structure according to claim 32, wherein the step of irradiating with light is performed after the step of thermocompression bonding.