JPH08117702A - Treatment of work and device - Google Patents

Abstract

PURPOSE: To surely remove a foreign matter stuck on the surface of a platelike work by holding the platelike work on a work-holding means and rotating the work-holding means in a horizontal plane in a treating liquid. CONSTITUTION: A semiconductor wafer 1 is stuck and held on the work-holding face 4a of a work-holding means 4 positioned in a liquid tank 2 by means of sticking force caused by cleaning liquid 3b flowing through a duct 7. Then, the semiconductor wafer 1 is rotated in the horizontal direction in the liquid tank 2 by rotating the work-holding means 4 by a motor 5. Cleaning liquid 3c is sprayed toward the semiconductor wafer 1 from a liquid-spouting means 10. At this point, the difference of number of revolutions between the semiconductor wafer 1 and cleaning liquid 3a acts on a foreign matter stuck on the surface of the semiconductor wafer 1 as stripping force. On one side, the rotated semiconductor wafer 1 is sprayed with a cleaning liquid 3c through the liquid- spouting means 10 and hydraulic power acts on the semiconductor wafer 1. Therefore, the foreign matter stuck to the semiconductor wafer 1 is forcedly removed.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method and an apparatus for processing a work, and more particularly to a technique effectively applied to the processing of a plate-like work using a processing liquid.

[0002]

2. Description of the Related Art Particles, organic substances, metal surface impurities, etc. (hereinafter referred to as "foreign substances") adhering to the surface of a semiconductor wafer or a photomask, which is a plate-like work, are removed by using a cleaning liquid (treatment liquid) such as pure water. In the semiconductor industry, for example, such a cleaning device is used to perform a predetermined process on a plate-like work using various process liquids.

Here, as a technique for cleaning the surface of a semiconductor wafer with a cleaning solution, for example, "VLSI Manufacturing / Testing Equipment Guidebook <1994 Edition>" issued by the Industrial Research Committee (issued November 20, 1993) ), As described in P115 to P120, a method in which a plurality of semiconductor wafers are stored in a cassette and immersed in a cleaning tank, a method in which a semiconductor wafer is directly gripped by a chuck and immersed in the cleaning tank, etc. are known. ing.

[0004]

However, when the adhered foreign matter has a strong adhesive force to the plate-like work, it cannot be removed by the above-mentioned cleaning device and the cleanliness of the surface of the plate-like work is desired. It becomes difficult to raise to the level of.

Therefore, an object of the present invention is to provide a technique capable of reliably removing foreign matter attached to the surface of a plate-like work.

The above and other objects and novel features of the present invention will be apparent from the description of this specification and the accompanying drawings.

[0007]

The typical ones of the inventions disclosed in the present application will be outlined below.

That is, in the work treatment method according to the present invention, a work holding means which is rotatable in the treatment liquid in the liquid tank is prepared, a plate-like work is held by the work holding means, and the work is held in a horizontal plane in the treatment liquid. It is something that rotates. In addition, a work holding means that can rotate in the processing liquid in the liquid tank is prepared,
The plate-shaped work is held by the work holding means, and while being rotated in the processing liquid, a processing liquid of the same type as the processing liquid is sprayed onto at least one surface of the plate-shaped work.

Further, the work processing apparatus according to the present invention is provided with a liquid tank in which the processing liquid is put and the plate-like work is immersed, and rotatably provided in the liquid tank, and the plate-like work is held on the work holding surface. And a work holding means for rotating the work. Further, a liquid tank in which the treatment liquid is put and the plate-shaped workpiece is immersed, and rotatably provided in the liquid tank,
It has a work holding means for holding a plate-like work on the work holding surface and rotating it, and a liquid jetting means for spraying a treatment liquid of the same kind as the treatment liquid onto the plate-like work rotating in the treatment liquid.

In these cases, the above-mentioned work holding means is formed with a hollow hole which communicates with a pipeline through which a processing liquid of the same kind as the processing liquid flows, and the above-mentioned work holding surface communicates with this hollow hole. A large number of adsorption holes can be formed. This work holding surface can be divided into a plurality of parts or formed narrower than a plate-like work. When the work holding surface is formed narrow, the first liquid jetting means and the second liquid jetting means are provided so that the treatment liquid can be sprayed not only on one surface but also on the other surface of the plate-shaped work. be able to.

A cleaning liquid or an etching solution can be applied as the processing liquid, and a semiconductor wafer or a photomask can be applied as the plate-like work.

[0012]

According to the above-mentioned means, the foreign matter adhering to the plate-like work is peeled off by the difference in rotation between the work holding means and the processing liquid in the liquid tank, or in addition to this, the water pressure by the liquid ejection means. Since it acts, foreign matter attached to the plate-like work with a strong adhesive force can be reliably removed from the plate-like work.

One of the surfaces of the plate-shaped work held by the work holding means is formed by dividing the work holding surface of the work holding means into a plurality of parts or by forming the work holding surface narrower than the plate-like work. Since the part also comes into contact with the processing liquid, foreign matter attached to this part can be removed by the peeling force. In this case, by providing the second liquid jetting means for spraying the treatment liquid also on the surface of the plate-shaped work held by the work holding means, it becomes possible to more reliably remove the foreign matter attached to this surface.

[0014]

Embodiments of the present invention will now be described in detail with reference to the drawings.

(Embodiment 1) FIG. 1 is a sectional view schematically showing a work processing apparatus which is an embodiment of the present invention.

The work processing apparatus of the present embodiment has a foreign substance (not shown) attached to the surface of the semiconductor wafer (plate-shaped work) 1.
Is for removing. As shown, liquid tank 2
A semiconductor wafer 1 is immersed in a cleaning liquid (treatment liquid) 3a such as pure water.

A work holding means 4 is provided so as to penetrate the bottom surface of the liquid tank 2 formed of, for example, quartz. The work holding means 4 is provided with a work holding surface 4 a which is formed in substantially the same shape as the semiconductor wafer 1 and holds the semiconductor wafer 1 inside the liquid tank 2, and is rotatable by a motor 5. There is. Therefore, the semiconductor wafer 1 held by the work holding means 4 is washed with the cleaning liquid 3 by the work holding means 4 rotated by the motor 5.
It is designed to be rotated in a. The liquid tank 2 and the work holding means 4 are sealed by a sealing material 6 to prevent liquid leakage.

A hollow hole 8 communicating with the conduit 7 is formed inside the work holding means 4 made of, for example, a fluororesin. A cleaning liquid (treatment liquid) 3b of the same type as the cleaning liquid 3a in the liquid tank 2 flows through the pipe line 7, and thus the hollow hole 8 is filled with the cleaning liquid 3b from the pipe line 7. . Further, a work holding surface 4a for holding the semiconductor wafer 1
A large number of suction holes 4b communicating with the hollow holes 8 are formed in the. Therefore, the cleaning liquid 3b in the hollow hole 8 is pulled by the cleaning liquid 3b flowing in the pipe line 7, and the suction force of the suction hole 4b generated by this causes the work holding surface 4a.
The semiconductor wafer 1 is sucked and held by the semiconductor wafer 1. The space between the work holding means 4 and the conduit 7 is also sealed by the sealing material 9 to prevent liquid leakage.

Above the liquid tank 2, the cleaning liquid 3a in the liquid tank 2 is provided.
Liquid ejecting means 1 for ejecting a cleaning liquid (treatment liquid) 3c of the same type as
0 is provided. The jet port 10a of the liquid jetting means 10 directed toward the semiconductor wafer 1 is located in the cleaning liquid 3a in which the semiconductor wafer 1 is immersed, and the cleaning liquid 3c is supplied from the liquid to the rotating semiconductor wafer 1. It is supposed to be sprayed. The ejection port 10a may be provided at a position in the liquid tank 2 that does not soak into the cleaning liquid 3a.

Removal of foreign matter attached to the semiconductor wafer 1 by such a work processing apparatus is performed as follows.

First, the semiconductor wafer 1 is sucked and held on the work holding surface 4a of the work holding means 4 located in the liquid tank 2 by the suction force generated by the cleaning liquid 3b flowing through the pipe 7. Next, the work holding means 4 is rotated by the motor 5 to rotate the semiconductor wafer 1 in the liquid tank 2 in the horizontal direction. Then, while the semiconductor wafer 1 is being rotated, the cleaning liquid 3c is sprayed from the liquid ejection means 10 toward the semiconductor wafer 1 to remove the foreign matter.

When the work holding means 4 rotates,
Along with this, the cleaning liquid 3a in the liquid tank 2 also starts to rotate at the same time, but since the cleaning liquid 3a is rotated by the work holding means 4 due to its own viscosity, the rotation speed of both, in other words, the work holding means. Semiconductor wafer 1 held by
There is a difference in the number of rotations with the cleaning liquid 3a in which the semiconductor wafer 1 is immersed. Then, such a difference in the number of rotations acts as a peeling force for the foreign matter attached to the surface of the semiconductor wafer 1. On the other hand, the cleaning liquid 3 is applied to the rotating semiconductor wafer 1 by the liquid ejecting means 10.
c is sprayed and water pressure is acting. Therefore,
The foreign matter attached to the semiconductor wafer 1 is forcibly removed from the surface of the semiconductor wafer 1 by the peeling force due to the rotation difference and the water pressure by the liquid jetting means 10.

That is, according to the work processing apparatus of this embodiment, even if foreign matter adheres to the semiconductor wafer 1 with a strong adhesive force, the peeling force and the water pressure act on the foreign matter. This makes it possible to reliably remove this from the surface of the semiconductor wafer 1.

(Embodiment 2) FIG. 2 is a sectional view schematically showing a work processing apparatus which is another embodiment of the present invention, and FIG.
3 is a perspective view showing a work holding means used in the work processing apparatus of FIG.

In the work processing apparatus of this embodiment, the work holding surface 4a of the work holding means 4 is divided into a plurality of parts, and the rest of the construction is the same as that of the work processing apparatus of the first embodiment. ing. Therefore, in this embodiment, the members common to those in the first embodiment are designated by the same reference numerals.

As shown in FIG. 3, the work holding means according to this embodiment is upwardly branched into five parts, and a work holding surface 4a having suction holes 4b is formed at each branch part. There is. Therefore, the semiconductor wafer 1 is sucked and held by the five work holding surfaces 4a.

According to the work processing apparatus of this embodiment,
In addition to the function of the work processing apparatus of the first embodiment that foreign substances attached to the semiconductor wafer 1 can be reliably removed, a part of the surface of the semiconductor wafer 1 held by the work holding means 4 is also the cleaning liquid 3a in the liquid tank 2. Since it comes into contact with the foreign matter, the foreign matter attached to this portion is also removed by the peeling force.

(Embodiment 3) FIG. 4 is a sectional view schematically showing a work processing apparatus which is still another embodiment of the present invention.

In the work processing apparatus of this embodiment, the work holding surface 4a is formed narrower than the semiconductor wafer 1. The other parts are configured similarly to the work processing apparatus of the first embodiment, and the members common to the first embodiment in the present embodiment are designated by the same reference numerals.

According to the work processing apparatus of this embodiment,
Similar to the work processing apparatus of the second embodiment, a part of the surface of the semiconductor wafer 1 held by the work holding means 4 also has the cleaning liquid 3
Since it comes into contact with a, the foreign matter attached to this portion is also removed by the peeling force.

(Embodiment 4) FIG. 5 is a sectional view schematically showing a work processing apparatus which is still another embodiment of the present invention.

In addition to the work processing apparatus of the fourth embodiment described above, the work processing apparatus of this embodiment sprays the cleaning liquid 3c onto the surface of the semiconductor wafer 1 held by the work holding means 4. .

That is, the present work processing apparatus has the first liquid jetting means 20a for spraying the cleaning liquid 3c onto one surface of the semiconductor wafer 1 which is not held by the work holding means 4.
In addition to the above, the second liquid jetting means 20b is provided so as to spray the cleaning liquid 3c also on the held other surface. The other parts are configured similarly to the work processing apparatus, and common members are denoted by the same reference numerals.

According to the work processing apparatus of this embodiment,
Since the foreign matter adhered to the surface of the semiconductor wafer 1 held by the work holding means 4 is not only peeled off by the rotation of the work holding means 4 but also water pressure by the second liquid ejecting means 20b acts. It becomes possible to remove the foreign matter more reliably.

Although the invention made by the present inventor has been specifically described based on the embodiments, the present invention is not limited to the embodiments and various modifications can be made without departing from the scope of the invention. Needless to say.

For example, in this embodiment, the suction holes 4
Semiconductor wafer 1 which is a plate-like work by the adsorption action of b
However, it is also possible to attach a fixing member for locking the semiconductor wafer 1 to the work holding means 4 to mechanically hold the semiconductor wafer 1.

Further, in this embodiment, the semiconductor wafer 1 is used as the plate-shaped work, but the present invention is not limited to this, and adhesion of minute foreign matter such as a photomask becomes a problem. Various plate-shaped workpieces can be used.

In the work processing apparatus of this embodiment, the foreign matter adhered is removed by using both the peeling force due to the rotation difference and the water pressure, but it is also possible to remove the foreign matter only by the peeling force.

Further, as the processing liquid in this embodiment, cleaning liquids 3a, 3b and 3c for cleaning the semiconductor wafer 1 which is a plate-like work are used, but other processing such as etching solution is used. It is also possible to use a liquid. Here, when the thin film formed on the plate-shaped work is etched using the etching solution, the etching solution positively acts on the etched thin film, and thus the etching time can be shortened.

[0040]

The effects obtained by the typical ones of the inventions disclosed in this application will be briefly described as follows.

(1) That is, according to the work processing technique of the present invention, the foreign matter attached to the plate-like work has a peeling force due to the rotation difference between the work holding means and the processing liquid in the liquid tank, or In addition to this, the water pressure by the liquid ejection means acts. Therefore, even if the foreign matter adheres to the plate-like work with a strong adhesive force, the foreign matter can be reliably removed from the plate-like work.

(2) Further, since the plate-shaped works are washed one by one, foreign matters brought into the liquid tank are reduced as compared with the batch processing, and the plate-shaped works are kept in the liquid tank. Reduces the risk of contamination with foreign matter.

(3) The work holding surface of the work holding means is held by the work holding means of the plate-shaped work by dividing the work holding surface into a plurality of parts or by forming the work holding surface narrower than the plate-shaped work. A part of the exposed surface also comes into contact with the processing liquid. Therefore, the foreign matter attached to this portion can be removed by the stripping force.

(4) In the above (3), in addition to the first liquid jetting means, the second liquid jetting means is arranged so that the treatment liquid is also sprayed on the surface of the plate-shaped work held by the work holding means. By also providing the above, since the water pressure also acts on the foreign matter attached to this surface, the foreign matter can be removed more reliably.

(5) When an etching solution is used as the processing liquid, the etching solution positively acts on the thin film to be etched, so that the etching time can be shortened.

[Brief description of drawings]

FIG. 1 is a sectional view schematically showing a work processing apparatus according to a first embodiment of the present invention.

FIG. 2 is a sectional view schematically showing a work processing apparatus according to a second embodiment of the present invention.

3 is a perspective view showing a work holding means used in the work processing apparatus of FIG. 2. FIG.

FIG. 4 is a sectional view schematically showing a work processing apparatus according to a third embodiment of the present invention.

FIG. 5 is a sectional view schematically showing a work processing apparatus according to a fourth embodiment of the present invention.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Semiconductor wafer (plate-shaped work) 2 Liquid tank 3a Cleaning liquid (processing liquid) 3b Cleaning liquid (processing liquid) 3c Cleaning liquid (processing liquid) 4 Work holding means 4a Work holding surface 4b Adsorption hole 5 Motor 6 Seal material 7 Pipe line 8 Hollow Hole 9 Sealing material 10 Liquid jetting means 10a Jet outlet 20a First liquid jetting means 20b Second liquid jetting means

Claims (9)

[Claims] 1. A method is provided in which a work holding means rotatable in a processing liquid in a liquid tank is prepared, a plate-shaped work is held by the work holding means, and the work is rotated in a horizontal plane in the processing liquid. Work processing method. 2. A work holding means that is rotatable in the processing liquid in a liquid tank is prepared, and the plate-shaped work is held by the work holding means and is rotated in the processing liquid, and at least the plate-shaped work is rotated. A method for treating a work, characterized in that a treatment liquid of the same kind as the treatment liquid is sprayed on one surface. 3. A liquid tank in which a treatment liquid is put and a plate-like work is immersed, and a work which is rotatably provided in the liquid tank and holds the plate-like work on a work holding surface to rotate the work. A work processing apparatus comprising: a holding unit. 4. A liquid tank in which a treatment liquid is put and a plate-like work is immersed, and a work which is rotatably provided in the liquid tank and holds the plate-like work on a work holding surface to rotate the work. A work processing apparatus comprising: a holding unit and a liquid ejecting unit that sprays a processing liquid of the same type as the processing liquid onto the plate-shaped workpiece that rotates in the processing liquid. 5. The work holding means is formed with a hollow hole communicating with a pipeline through which a processing liquid of the same kind as the processing liquid flows, and the work holding surface has a large number of suction holes communicating with the hollow holes. 5. The work processing apparatus according to claim 3, wherein the work processing apparatus is opened. 6. The work processing apparatus according to claim 3, wherein the work holding surface is divided into a plurality of parts. 7. The work processing apparatus according to claim 3, wherein the work holding surface is formed narrower than the plate-like work. 8. The liquid ejecting means comprises a first liquid ejecting means for ejecting the treatment liquid onto one surface of the plate-like work and a second liquid ejecting means for ejecting the treatment liquid onto the other surface of the plate-like work. The work processing apparatus according to claim 7, further comprising a means. 9. The processing liquid is a cleaning liquid or an etching solution, and the plate-shaped work is a semiconductor wafer or a photomask.
7. The work processing device according to 7 or 8.