JPH08115761A - Jumper chip and its manufacture - Google Patents

Abstract

PURPOSE: To minimize the occupying area, and facilitate the change of the form or size according to a pattern by soldering electrodes on both sides of a jumper chip to different wiring patterns on a circuit board. CONSTITUTION: A jumper chip is used to electrically connect two land parts 7, 7' having different wiring patterns formed on a circuit board. The flat part 4a of the electrode 4 of the jumper chip is brought into contact with the land part 7, and fixed thereto by solder 11. The flat part 4a' of the electrode 4' is brought into contact with the land 7' and fixed by solder 11. A magnet wire covered with an insulating layer is cut into a fixed dimension to form electrodes on both ends. Thus, the structure is simplified, the manufacturing process is shortened, and the material cost is reduced.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a jumper chip structure used for connecting different circuit patterns on a circuit board.

[0002]

2. Description of the Related Art In the case of forming a wiring pattern on a circuit board, another wiring pattern exists between lands of two wiring patterns to be electrically connected due to the space on the circuit board. There are cases. A jumper chip is used to connect the two lands so as not to short-circuit with other wiring patterns interposed therebetween. The structure of such a conventional jumper chip is shown in FIG. In FIG. 22, the surface of the ceramic substrate 102 having high thermal conductivity is covered with the internal electrode 103 made of a conductor foil except for the front surface and the rear surface, and except for the central portion of the lower end surface.

An insulating protective film 101 is attached to the center of the upper end surface of the internal electrode 103 which covers the upper end surface of the ceramic substrate 102. The outer surface of the inner electrode 103 is covered with an intermediate electrode 104 made of a conductor foil, and the outer surface of the intermediate electrode 104 is covered with an outer electrode 105 made of a conductor foil. The intermediate electrode 104 covering the internal electrode 103 and the external electrode 105 are
On the internal electrode 103 that covers the upper end surface of the ceramic substrate 102, it is in contact with the side surface of the insulating protective film 101.

The jumper chip having the above structure has two internal electrodes 103 and an intermediate electrode 10 located on both sides of the lower end surface.
4. A portion where the external electrode 105 is laminated is an electrode. One of the electrodes is arranged on a land portion of a wiring pattern, and the other electrode is arranged on a land portion of another wiring pattern. They are arranged so that different wiring patterns are connected to each other.

[0005]

Although the jumper chip is a jumper chip, it has a complicated structure equivalent to that of a chip resistor, so that the cost is high. Also,
The jumper chip has a plate shape, a column shape, or the like, and the size types are limited.Therefore, the wiring pattern on the circuit board must be designed according to the shape and size of the jumper chip. I had to do it.
Further, it is difficult to integrate the circuit because the size of the chip is limited.

The present invention has been made in order to solve the above problems of the prior art, and is a jumper that is low in cost, occupies a small area, and can be easily changed in shape and size according to a pattern. Intended to provide chips.

[0007]

According to the first aspect of the present invention,
A jumper chip obtained by cutting a wire covered with an insulating layer to an appropriate size, which includes a central portion whose surface is covered with an insulating layer, and electrode portions formed on both sides of the central portion.
The electrode portion is characterized in that the insulating layer is peeled off and the conductor is exposed.

The invention according to claim 2 is characterized in that a bare wire having no insulating layer is cut to an appropriate size, a tubular insulating film is covered on the middle part, and both ends are exposed to form an electrode part. .

According to a third aspect of the invention, the electrode has a curved surface portion,
It is characterized in that it is composed of a curved surface portion and a flat surface portion on the opposite side.

The invention according to claim 4 is characterized in that one of the electrode portions is bent to be L-shaped.

According to a fifth aspect of the invention, both of the electrode portions are bent so that the overall shape is U-shaped.

A sixth aspect of the present invention is characterized in that the flat portions of the respective electrodes in the fifth aspect face each other.

The invention according to claim 7 is characterized in that the plane portions of the respective electrodes are located on the same plane.

The invention described in claim 8 is characterized in that, in the invention described in claim 5, the electrode is formed by peeling off the insulating layer in the central portion between the bent electrodes.

The invention according to claim 9 is characterized in that both electrode parts are bent so that the overall shape is U-shaped, and the electrode at the tip of the electrode part is cylindrical.

The invention according to claim 10 is characterized in that the outer diameter dimension of the electrode is smaller than the outer diameter dimension of other portions.

The eleventh aspect of the present invention is characterized in that both electrode portions are bent, the overall shape is U-shaped, and the electrode at the tip of the electrode portion is tapered.

According to a twelfth aspect of the present invention, a step of pulling out a wire whose surface is covered with an insulating layer from a bobbin and peeling the insulating layer at an appropriate interval, and pressing a molding punch to the place where the insulating layer is peeled off It has at least a step of shaping the shape on the side of the forming punch into a concave shape and a step of cutting a portion where the insulating layer is peeled off.

According to a thirteenth aspect of the present invention, the step of pulling out the wire whose surface is covered with an insulating layer from the bobbin, the forming punch is pressed against the wire at appropriate intervals to shape the forming punch side into a concave shape. At the same time, the method further includes at least a step of causing a crack in an insulating layer covering a portion to be shaped, and a step of cutting a portion where a molding punch is pressed.

[0020]

The different wiring patterns are connected by the jumper chip by soldering the electrodes on both sides of the jumper chip to the different wiring patterns on the circuit board.
Since the jumper chip consists of a magnet wire,
By cutting or bending according to the shape and size of the wiring pattern, it is possible to flexibly deal with various wiring patterns.

[0021]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS A jumper chip and a manufacturing method thereof according to the present invention will be described below with reference to the drawings. In FIG. 1 and FIG. 2, the jumper chip is constructed by cutting one magnet wire (wire used for motor winding) whose surface is covered with an insulating layer to an appropriate size, and at both ends. Has electrode portions 3 and 3 ', and a central portion 2 between the electrode portions 3 and 3'. The central portion 2 has a cylindrical shape and the outer peripheral surface is covered with the insulating layer 1. In addition, the tips of the electrode portions 3 and 3 ′ formed at both ends of the central portion are electrodes 4 and 4 ′ whose conductor portions are exposed by peeling off the insulating layer. One of the electrodes 4, 4 ′ at both ends is crushed and spreads in a semi-circular shape in plan view, and the upper surface side of the semi-circular portion is a concave curved surface portion 4 b, and the back surface side of the curved surface portion 4 b. Is a flat portion 4a. Similarly, the other electrode 4'is also crushed into a semicircular shape, and a curved surface portion 4b 'on the upper surface side and a flat surface portion 4a' on the rear surface side of the curved surface portion 4b 'are formed.

As shown in FIG. 3, the jumper chip is used to electrically connect the land portions 7 and 7'of two different wiring patterns formed on the circuit board. The flat portion 4a of the electrode 4 of the jumper chip is in contact with the land portion 7 and is fixed by the solder 11. Further, the flat surface portion 4a ′ of the electrode 4 ′ is brought into contact with the land portion 7 ′ and fixed by the solder 11. Although other wiring patterns 8, 9 and 10 are interposed between the land portions 7 and 7 ', in the jumper chip, the central portion 2 covered with the insulating layer 1 forms the wiring patterns 8, 9 and 10. Since it straddles, the jumper chip and the wiring patterns 8, 9 and 10 are not short-circuited. In addition, since the curved surfaces 4b and 4b 'are formed on the electrodes 4 and 4', the solder is satisfactorily placed on the electrodes 4 and 4 '. Further, since the portions of the electrodes 4 and 4'which are in contact with the land portions 7 and 7'are flat,
When soldering, the jumper chip will not shift.

Next, a method of manufacturing the jumper chip will be described. First, as shown in FIG. 4, the magnet wire 74 wound around the bobbin 73 is drawn out, and the magnet wire 74 is drawn through the die 75 to form a magnet wire 74a having a small diameter. As the magnet wire 74 in this case, a bare wire whose surface is not covered with an insulating layer is used. Then, the magnet wire 74a is further drawn through another die 76 to reduce the diameter. In this way, the diameter of the wire is gradually reduced to obtain the magnet wire 74b having the desired diameter, and then the magnet wire 74b is wound around the bobbin 78.

Next, as shown in FIG. 5, the magnet wire 74b is pulled out from the bobbin 78, and the pulled-out magnet wire 74b is passed through the insulating tank 79 filled with the liquid insulating agent 81, so that the magnet wire 74b
An insulating layer is formed on the surface of b. The magnet wire 74b having the insulating layer formed thereon is wound around the bobbin 80 again.
After obtaining the magnet wire 24b having the desired diameter, the magnet wire 74b is directly passed through the insulating layer 79 filled with the liquid insulating material 81 without being wound around the bobbin 78, and the insulating layer is formed on the surface of the magnet wire 74b. May be formed and wound around the bobbin 80.

Thereafter, as shown in FIG. 6A, the magnet wire 7 whose surface is covered with an insulating layer from the bobbin 80.
1 is pulled out and a peeling tool such as a grindstone is applied to the surface of the magnet wire 71 at regular intervals to form the insulating layer peeling portion 71a. Next, as shown in FIG. 6B, the forming punch 72 is pressed against the insulating layer peeling portion 71a of the magnet wire 71 from above. Next, FIG. 6 (c)
As shown in FIG. 5, a jumper chip is formed by cutting the central portion of the insulating layer peeling portion 71a with the cutter 73.

As shown in the step of FIG. 6B, a forming punch 72 is formed in the insulating layer peeling portion 71a of the magnet wire 71.
7B, the insulating layer peeling portion 71a spreads in a direction orthogonal to the magnet wire 71, and as shown in FIG. 7A, the portion on the side of the forming punch 72 is rounded according to the shape of the tip of the forming punch 72. It is shaped into a concave shape.
Further, the portion of the insulating layer peeling portion 71a opposite to the forming punch 72 is shaped like a plane. Cutter 73 after this
In the cutting step by, the central portion of the insulating layer peeling portion 71a shown by reference character B in FIG. 7B is cut. By cutting, the curved surface portions 4b and 4b 'of the electrodes 4 and 4'from the rounded concave portion of the insulating layer peeling portion 71a, and the electrodes 4 and 4b from the flat portion of the insulating layer peeling portion 71a. Flat portion 4a of
4a 'is formed, and a single jumper chip as shown in FIG. 7C is obtained.

According to the jumper chip having the above-mentioned structure, the magnet wire covered with the insulating layer is cut into a certain size, and both ends thereof are used as electrodes, so that the structure is simple.
The manufacturing process can be shortened, the material cost can be reduced, and the manufacturing cost can be kept low as compared with the conventional case. Also,
Since the jumper chip occupies a smaller area than the conventional rectangular chip, it is possible to integrate the circuit board with high density by using such a jumper chip. Further, since the jumper chip is formed of the magnet wire, the dimension setting is easy and it is possible to flexibly deal with various wiring patterns.

Furthermore, since the jumper chip is made of a magnet wire, it can be bent to change its shape freely. For example,
As shown in FIG. 8, when the two land portions 13 and 14 to be connected face each other in a direction orthogonal to each other for convenience of circuit pattern design, one electrode portion 3 of the jumper chip should be bent. L-shaped, the electrode 4 and the land portion 14 are connected by the solder 11, and the electrode 4 ′ and the land portion 1 are connected.
3 may be connected with solder 11.

As described above, since the size and shape of the jumper chip is high, the size and shape of the jumper chip connecting the lands need not be considered so much when designing the wiring pattern. It is possible to improve the degree.

In the embodiments described so far, the jumper chip is formed by peeling off a part of the magnet wire covered with the insulating layer, shaping the peeled part, and cutting it. Is not limited to. For example, as shown in FIG. 9, a bare wire which is not covered with an insulating layer is used as the wire 83, and the conductor wire 83a obtained by cutting the bare wire 83 into a suitable size is tubular. It may be covered with an insulating film 82. The length of the insulating coating 82 in the longitudinal direction is determined by the conductor wire 8
Since it is set to be smaller than the dimension of 3a in the longitudinal direction, when the cylindrical insulating coating 82 is placed over the conductor wire 83a and arranged in the center, both ends of the conductor wire 83a are exposed from both sides of the insulating coating 82. To do. The electrodes 84 and '84' are shaped by shaping both ends of the conductor wire 83a exposed from both sides of the insulating coating 82 so that solder can easily be placed, that is, the upper side is curved and the lower side is flat. A jumper chip may be formed. Even such jumper chips,
Since the wire 83 is formed, the degree of freedom in size and shape is high, and various pattern shapes on the circuit board can be dealt with, and the same effect as that of the above-described embodiment can be obtained.

Further, in the step of manufacturing the jumper chip from the magnet wire whose surface is covered with the insulating layer, it is possible to omit the step of peeling the insulating layer at the portion to be the electrode. The embodiment shown in FIG. 10 is such an example. The jumper chip shown in FIG. 10 has a cylindrical central portion 22 and electrode portions 23, 2 located on both sides of the central portion 22.
3 ', and both ends of the electrode portions 23, 23' are shaped by punches so that the solder can be placed well, and electrodes 24, 24 'having a spread are formed. Electrode 24
The upper surface is a curved surface portion 24b, and the lower surface is a flat surface portion 24a. The upper surface of the other electrode 24 'is a curved surface portion 24b', and the lower surface thereof is a flat surface portion 24a '. Since the jumper chip is formed without peeling off the insulating layer of the magnet wire, the insulating layer 21 covers all the surfaces of the electrodes 24 and 24 ′, which are the cutting surfaces of the cutter, except the tip surfaces. Furthermore, the electrode 2
Since 4 and 24 'are shaped by punching while the surface is covered with the insulating layer 21, a plurality of cracks 26 are generated in the insulating layer 21 covering the curved surface portions 24b and 24b' and the flat surface portions 24a and 24a '. ing.

Therefore, as shown in FIG. 11, the flat portions 24 and 24a 'of the electrodes 24 and 24' of the jumper chip are formed.
12 is placed on the lands 29 and 28 and fixed by using the solder 30, the solder 30 permeates the inner conductor portion from the crack 26 generated on the surface of the insulating layer on the surface of the electrode 24, as shown in FIG. When the amount of the solder 30 that permeates the conductor portion from the crack 26 increases, the insulating layer 21 covering the surface of the electrode 24 is torn and completely peeled off, and the conductor portion of the electrode 24 and the land portion 29 are electrically connected by the solder 30. To be done. Since the crack 26 is generated in the insulating layer 21 covering the surface of the other electrode 24 ′ as well, the solder 30 permeates through the crack 26 in the same manner, and the conductor portion of the electrode 24 and the land portion 28 are electrically connected by the solder 30. It

According to the method of manufacturing the jumper chip as described above, the step of peeling the insulating layer 21 of the magnet wire to form the insulating layer peeling portion can be omitted, which increases productivity and contributes to cost reduction. can do. Of course, the crack 26 of the insulating layer 21 naturally occurs when shaping the magnet wire, and therefore, the step of generating the crack 26 is not particularly necessary.

Further, as shown in FIG. 13, both electrode portions 2
The crack 26 generated in the insulating layer 21 on the surface of the electrodes 24, 24 'is also effective for a jumper chip in which 3, 23' are bent into a U shape. As shown in FIG. 14, the electrodes 24, 2
When the jumper chip is erected on the circuit board by bringing the tip end surface of 4 ′ into contact with the upper surfaces of the land portions 29 and 28 and fixing the electrodes 24 and 24 ′ with the solder 30, cracks 2
The solder 30 permeates the inside of the electrodes 24, 24 ′ from 6 and the insulating layer 21 is peeled off, so that the conductors of the electrodes 24, 24 ′ are electrically connected to the lands 29, 28 by the solder 30.

Next, another embodiment of the jumper chip will be described. In FIG. 15, linear wiring patterns 36 and 37 are arranged in parallel on the circuit board. A land portion 34a of the wiring pattern 34 and a land portion 35a of the wiring pattern 35 are formed on one side of the wiring patterns 36 and 37. On the other hand, a wiring pattern 38 is formed on the other side of the wiring patterns 36 and 37. A part of the wiring pattern 38 is drawn out in a direction orthogonal to the wiring patterns 36 and 37, and
c is formed.

The wiring pattern 38 and the wiring pattern 34, and the wiring pattern 38 and the wiring pattern 35 are interposed by one jumper chip, and the wiring patterns 36 and 37 are interposed therebetween.
And connected without shorting. The jumper chip is formed of a magnet wire whose surface is covered with an insulating layer 41, and the electrode portions 43, 43 'on both sides are bent to form a U shape. Electrode part 43, 4
At the tip of 3 ', the insulating layer 41 is peeled off, and the surface of one side is curved so that the surface on the other side is a curved surface and the surface on the other side is a flat surface by crushing to improve the placement of the solder.
It is 4 '. Further, the insulating layer 41 is also peeled off to form the electrode 46 in the central portion 42 located between the electrode 43 and the electrode 43 '.

The electrode 44 of the jumper chip having the above structure
Is the land portion 34a of the wiring pattern 34, the electrode 44 'is the land portion 35a of the wiring pattern 35, and the electrode 46 formed in the central portion 42 is the lead portion 38c of the wiring pattern 38.
And are connected and fixed by solder 30.

According to the jumper chip having the above-mentioned structure, since it is formed from the magnet wire, the degree of freedom of the shape is high and it can be freely set according to the shape of the wiring pattern such as a U shape. In addition, the central portion 42
Like the electrode 46 formed on the insulating layer 41 that covers the surface.
The number of electrodes can be formed by peeling off, so that one landing pad 3 can be formed by one jumper chip.
It is possible to electrically connect to three or more points such as 4a, land portion 35a, and lead-out portion 38c.

However, since the conventional rectangular jumper chip cannot connect at three points of the wiring pattern, the wiring pattern 38 is extended and the land portion 34a is formed as shown in FIGS. A land portion 38a is formed at a location facing each other, a land portion 38a is formed at a location facing the land portion 35a, and two rectangular jumper chips 39, 39 'are used. The land portion 38a and the land portion 34a are jumper chips 39, The land portion 38b and the land portion 35a were soldered and connected by the jumper chip 39 '.

On the other hand, according to the above-described embodiment, since it is possible to connect at three points with only one jumper chip made of an inexpensive magnet wire, without using a high-cost rectangular jumper chip at all. It can contribute to cost reduction. In addition, since one jumper chip can be connected at three points, there is no need to form unnecessary lands on the circuit board as in the case of using a rectangular jumper chip, which saves space. It can be used effectively and can contribute to circuit integration and high density. In addition,
The number of points that can be connected with one jumper chip is 3
It is not limited to individuals. If necessary, the insulating layer of the jumper chip may be peeled off to form an electrode, and three or more points may be connected.

Next, another embodiment of the jumper chip will be described. In FIG. 18, two sets of land portions facing each other are formed on the circuit board. One of them is a land portion 50 and a land portion 51,
These two land portions 50 and land portions 51 are soldered and connected by a rectangular jumper chip 39. Another set is the land portion 60 and the land portion 65,
These two land portions 60 and 65 are soldered and connected by a jumper chip 69.

The jumper chip 69 is formed by cutting a magnet wire, the surface of which is covered with an insulating layer, to a certain size and bending both sides to make the entire shape U-shaped. The bent side portions of the jumper chip 69 are electrode portions 63 and 63 '.
The insulating layers 61 are peeled off at the tips of the electrodes 3, 63 ′ to form electrodes 64, 64 ′ whose conductor portions are exposed. Electrode 64
Is fixed to the upper end surface of the land portion 60, and the end surface of the electrode 64 ′ is fixed to the upper end surface of the land portion 65 by the solder 30. As a result, the land portion 60 and the land portion 65 are electrically connected by the jumper chip 69. Connected to each other. In order to secure a sufficient area for the electrodes 64, 64 'that are in contact with the lands 60, 65, the electrodes 64, 64' are not shaped and remain in a cylindrical shape.

Since the jumper chip 69 having the above structure has a U-shape, the land portion 60 and the land portion 6 are formed.
Square-shaped jumper chip 3 obstructing the connection of 5
While avoiding in the form of crossing over 9, land portions 60, 65
Can be connected. Also, jumper chip 69
Since the contacting part with the circuit board is only the tip surfaces of the electrodes 64 and 64 ′, the circuit area can be reduced and the degree of freedom in pattern design on the circuit board can be improved. Since the jumper chip 69 is formed of a magnet wire, it has a high degree of freedom in size and shape, and this also contributes to the improvement in the degree of freedom in pattern design on the circuit board.

Further, when connecting different wiring patterns formed on both sides of the circuit board by through holes, the jumper chip formed of the magnet wire and having a U-shape is also effective. In such a jumper chip, as shown in FIG. 19A, a magnet wire covered with an insulating layer is cut into a predetermined size, and the insulating layer at both ends of the cut magnet wire is peeled off to form an electrode 94. , 94 'are formed, and the portion of the insulating layer 91 slightly on the center side of the electrodes 94, 94' is bent, so that the overall shape is U-shaped. In addition, the bent portions at both ends of the jumper chip having the electrodes 94 and 94 ′ are electrode portions 93 and 93 ′.

In the jumper chip, as shown in FIG. 19B, the electrode 94 of the jumper chip is formed in the through hole 96 formed on the circuit board, and the electrode 94 'of the jumper chip is formed on the circuit board. Through hole 97
To insert. The through hole 96 is a part of the wiring pattern 98, and the wiring pattern 98 is formed by the through hole 96 over both surfaces of the circuit board. On the other hand, the through hole 97 is a part of the wiring pattern 99, and the wiring pattern 99 is formed across the both surfaces of the circuit board by the through hole 97.

The jumper chip is attached to the through holes 96, 9
19 (c), the electrodes 94, 94 'of the jumper chip are connected from both sides of the circuit board by using the solder 30 to insert the wiring pattern 98 into the wiring pattern 99 and the wiring pattern 99. These patterns and the patterns on both sides can be connected by a jumper chip.

In the above embodiment, in order to make the insertion dimension of the jumper chip into the circuit board constant, the steps shown in FIG.
As shown in FIG. 5, the diameters of the tips of the electrodes 94, 94 'are made smaller than the diameters of the through holes 96, 97, and the other portions are made larger than the diameters of the through holes 96, 97. Good. When the electrodes 94, 94 'are inserted into the through holes 96, 97, the step surface between the large diameter portion and the small diameter portion of the electrodes 94, 94' comes into contact with the outer edge portion of the through holes 96, 97, and further insertion is prevented. Since it is hindered, the insertion dimension of the jumper chip on the circuit board is always constant.

Alternatively, as shown in FIG. 21, the electrode 9
4, 94 ′ are tapered so that the tip of the taper is smaller than the diameter of the through holes 96, 97, and the location where the taper has the largest diameter is the through holes 96, 9
It may be set to be larger than the diameter dimension of No. 7. When the outer dimensions of the taper are slightly larger than the inner diameters of the through holes 96 and 67, the outer peripheral surface of the taper of the electrodes 94 and 94 is caught in the through holes 96 and 67,
Since the further insertion is prevented, the insertion dimension of the jumper chip on the circuit board is always constant.

Further, as shown in FIG. 20 or 21, the tips of the electrodes 94, 94 'are made smaller, or the tips of the electrodes 94, 94' are tapered so that the electrodes 94, 94 'have a tapered shape. Through hole 96, 97
It is also possible to eliminate the occurrence of misalignment after insertion into the.

15, FIG. 18, FIG. 19, FIG. 20, and FIG.
In the embodiment shown in (1), a bare wire as shown in the example of FIG. 9 may be used instead of the wire having an insulating layer, and an insulating film may be covered on the bare wire to expose both ends to form an electrode part.

[0051]

According to the present invention, a wire covered with an insulating layer is cut to an appropriate size, and the surface is formed with a central portion covered with the insulating layer and both ends of the central portion. Since it has an electrode part and an electrode with a conductor exposed at the tip of the electrode part, the structure is simple, and it is possible to keep the manufacturing cost low by shortening the manufacturing process and reducing material costs. . Also, since the shape and dimensions can be set freely by bending, it is not necessary to consider the dimensions and shape of the jumper chip so much when designing the wiring pattern on the circuit board. improves.
Further, since the jumper chip is linear and occupies a small area, it can contribute to the integration of the circuit board. Furthermore, electrodes can be added freely by simply peeling off the insulating layer covering the surface, and connection of three or more points is also possible.

Further, by forming the shape of the electrode from the flat surface portion and the curved surface portion, when the electrode and the land portion are connected by soldering, the solder is satisfactorily placed, so that the fixing strength of the jumper chip is improved. It becomes possible.

Further, the entire shape of the jumper chip is U-shaped.
By arranging three-dimensionally on the circuit board as a letter shape, it is possible to connect the land parts while avoiding various parts arranged on the circuit board. From this point also, the degree of freedom in wiring pattern design is increased. It is possible to improve.

Further, when different through holes are connected to each other, a jumper chip having a U shape as a whole is effective, and both electrodes may be inserted into the through holes for soldering connection. If the tip of the electrode is tapered, or the outer dimensions of the jumper chip are made larger than the diameter of the through hole, and the diameter of the tip of the electrode is made smaller than the diameter of the through hole. , It is possible to always keep the insertion dimension of the jumper chip on the circuit board constant.

Further, when manufacturing a jumper chip, it is possible to omit the step of peeling the insulating layer covering the surface of the magnet wire to reduce the cost and improve the productivity. If a shaping punch is directly pressed against a portion of the magnet wire which is to be an electrode while being covered with an insulating layer to shape the shape, an electrode having a crack in the insulating layer on the surface is formed. When such an electrode having a crack in the insulating layer is soldered to the land portion, the solder permeates into the land from the crack, the insulating layer is peeled off, and the electrode and the land portion are electrically connected.

[Brief description of drawings]

FIG. 1 is a perspective view showing an embodiment of a jumper chip according to the present invention.

FIG. 2 is a cross-sectional view of the same.

FIG. 3 is a perspective view showing an example of connection with the wiring pattern of the jumper chip.

FIG. 4 is a process drawing showing a method of manufacturing a magnet wire applied to a jumper chip according to the present invention.

FIG. 5 is another process diagram of the same.

FIG. 6 is a process drawing showing the method of manufacturing the jumper chip according to the present invention.

FIG. 7 is a process drawing showing an enlarged main part of the same jumper chip manufacturing method.

FIG. 8 is a perspective view showing another embodiment of the jumper chip according to the present invention.

FIG. 9 is a perspective view showing still another embodiment of the jumper chip according to the present invention.

FIG. 10 is a perspective view showing still another embodiment of the jumper chip according to the present invention.

FIG. 11 is a perspective view showing an example of connection with the wiring pattern of the jumper chip of the same.

FIG. 12 is a sectional view of the same.

FIG. 13 is a perspective view showing still another embodiment of the jumper chip according to the present invention.

FIG. 14 is a perspective view showing an example of connection with the wiring pattern of the jumper chip of the same.

FIG. 15 is a perspective view showing still another embodiment of the jumper chip according to the present invention.

FIG. 16 is a perspective view showing an example of a wiring pattern connected by a conventional jumper chip.

FIG. 17 is a perspective view showing an example of connection of the same wiring pattern with a jumper chip.

FIG. 18 is a perspective view showing still another embodiment of the jumper chip according to the present invention.

FIG. 19 is a perspective view showing still another embodiment of the jumper chip according to the present invention.

FIG. 20 is a perspective view showing still another embodiment of the jumper chip according to the present invention.

FIG. 21 is a perspective view showing still another embodiment of the jumper chip according to the present invention.

FIG. 22 is a perspective view showing an example of a conventional jumper chip.

[Explanation of symbols]

 1 Insulating layer 2 Central part 3, 3'Electrode part 4, 4 'Electrode 4a, 4a' Planar part 4b, 4b 'Curved part

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[Procedure amendment]

[Submission date] October 11, 1995

[Procedure Amendment 1]

[Document name to be amended] Statement

[Name of item to be corrected] Claim 12

[Correction method] Change

[Correction content]

[Procedure Amendment 2]

[Document name to be amended] Statement

[Correction target item name] 0018

[Correction method] Change

[Correction content]

According to a twelfth aspect of the present invention, a step of pulling out a wire whose surface is covered with an insulating layer from a bobbin and peeling the insulating layer at an appropriate interval, and pressing a molding punch to the place where the insulating layer is peeled off It has at least a step of shaping the shape on the side of the forming punch into a concave shape, and a step of cutting the portion of the wire where the insulating layer is peeled off.

[Procedure 3]

[Document name to be amended] Statement

[Name of item to be corrected] 0023

[Correction method] Change

[Correction content]

Next, a method of manufacturing the jumper chip will be described. First, as shown in FIG. 4, the magnet wire 74 wound around the bobbin 73 is pulled out, and the magnet wire 74 is passed through the die 75 to reduce the diameter.
The magnet wire 74a is used. As the magnet wire 74 in this case, a bare wire whose surface is not covered with an insulating layer is used. Then, the magnet wire 74a is further drawn through another die 76 to reduce the diameter. In this way, the diameter of the wire is gradually reduced, and the magnet wire 7 having the desired diameter is obtained.
After obtaining 4b, it is wound on a bobbin 78.

[Procedure amendment 4]

[Document name to be amended] Statement

[Name of item to be corrected] 0024

[Correction method] Change

[Correction content]

Next, as shown in FIG. 5, the magnet wire 74b is pulled out from the bobbin 78, and the pulled-out magnet wire 74b is passed through the insulating tank 79 filled with the liquid insulating agent 81, so that the magnet wire 74b
An insulating layer is formed on the surface of b. The magnet wire 74b having the insulating layer formed thereon is wound around the bobbin 80 again.
After obtaining the magnet wire 74b having the desired diameter, the magnet wire 74b is directly passed through the insulating layer 79 filled with the liquid insulating material 81 without being wound around the bobbin 78, and the insulating layer is formed on the surface of the magnet wire 74b. May be formed and wound around the bobbin 80.

[Procedure Amendment 5]

[Document name to be amended] Statement

[Name of item to be corrected] Fig. 10

[Correction method] Change

[Correction content]

[Figure 10]

Claims (13)

[Claims] 1. A jumper chip obtained by cutting a wire covered with an insulating layer to an appropriate size, the central part having a surface covered with the insulating layer, and electrode parts formed on both sides of the central part. The jumper chip is characterized in that the electrode portion has an electrode in which the insulating layer is peeled off and the conductor is exposed. 2. A jumper chip obtained by cutting a bare wire having no insulating layer to an appropriate size, wherein a tubular insulating coating is covered in the middle part, and both ends are exposed to form electrode parts. Jumper chip featuring. 3. The electrode is composed of a curved surface portion and a flat surface portion opposite to the curved surface portion.
Alternatively, the jumper chip described in 2. 4. The jumper chip according to claim 1, wherein one of the electrode portions is bent to be L-shaped. 5. The jumper chip according to claim 1, wherein both of the electrode portions are bent so that the overall shape is a U shape. 6. The jumper chip according to claim 5, wherein the flat portions of the respective electrodes face each other. 7. The jumper chip according to claim 5, wherein the flat surfaces of the electrodes are located on the same plane. 8. The jumper chip according to claim 7, wherein an insulating layer is peeled off to form an electrode in a central portion between the two bent electrodes. 9. The electrode according to claim 1 or 2, wherein both of the electrode portions are bent so that the overall shape is U-shaped, and the electrode at the tip of the electrode portion is cylindrical. The described jumper chip. 10. The jumper chip according to claim 9, wherein an outer diameter of the electrode is smaller than outer diameters of other portions. 11. The electrode according to claim 1 or 2, wherein both of the electrode portions are bent so that the overall shape is U-shaped and the electrode at the tip of the electrode portion is tapered. Jumper chip. 12. A step of pulling out a wire whose surface is covered with an insulating layer from a bobbin and peeling off the insulating layer at appropriate intervals; A method for manufacturing a jumper chip, which has at least a step of shaping into a concave shape and a step of cutting a portion where an insulating layer is peeled off. 13. A step of pulling out a wire whose surface is covered with an insulating layer from a bobbin, pressing a forming punch on the wire at appropriate intervals,
A method of manufacturing a jumper chip, which comprises at least a step of shaping the shape on the side of the forming punch into a concave shape and causing a crack in an insulating layer covering a portion to be shaped, and a step of cutting a portion where the forming punch is pressed.