JPH0810844Y2 - Head chip repair device - Google Patents

Description

[Detailed Description of the Invention] [Industrial field of application] The present invention relates to a video head for a VTR, in particular, in a multiple chip head in which a large number of chips are pasted on one base, one defective chip is used as a base. The present invention relates to a head chip repair device that strips off and regenerates an attachment surface of a base.

[Prior Art] Conventional VTR video heads have either a single head in which one or two chips are attached to one base, or a double head, and the number of heads is small.

Therefore, in consideration of yield and manufacturing man-hours, when a chip is damaged, the defective chip is not repaired, but is discarded as a defective product and replaced with a new head.

[Problems to be Solved by the Invention] The above-mentioned conventional technology does not consider repairing and reusing one defective chip on the base partially, and a large number of chips are attached to one base. With regard to the multiple chip heads, there was a problem that partial repair could not be performed during the head assembly or after the VTR cylinder was installed and one chip was damaged or an output failure accident occurred.

For this reason, even with a multi-chip head made by multiplying the number of man-hours by a single head, the yield decreases in proportion to the number of constituent chips, but there is still the problem that it must be discarded. .

An object of the present invention is to provide a head chip repair device that repairs a defective chip of a multiple chip head so that it can be reused.

[Means for Solving the Problems] In order to achieve the above object, the defective chip of the multiple chip head is stripped from the base, and repair work is performed to regenerate the attachment surface of the base, and only one chip is individually reassembled. It was made possible.

The technical means of repair work is to install multiple chip heads on the jig and heat the defective chip with a spotlight that is a heat source of infrared rays, etc. Furthermore, hook the tip of the defective chip with a stick to make it defective. The chip has a means to make it easier to peel off than the base, and also has a means to detect the movement of the rod with a sensor, which is fed back to detect the peeling timing of the defective chip and turn off the power of the spotlight. Have means. Furthermore, the cotton swab is impregnated with an adhesive peeling agent or abrasive, and the upper surface of the base after scraping is rubbed to remove residual adhesive on the upper surface of the base. By wiping it off, it will be a head chip repair device that can reproduce the pasting surface of the base where new chips can be reassembled.

[Operation] When the spotlight of the infrared irradiator during defective chip repair work is concentrated and applied only to the upper surface of the defective chip, the adhesive between the chip and the base can be thermally decomposed and the adhesive strength is reduced. If an external force is applied to a part of the chip with a hooking rod or the like in advance, the defective chip and the base can be peeled off in a short time without overheating. In addition, the movement of the hooking rod is detected by the sensor to catch the timing of chipping to turn off the illumination of the spotlight and prevent deformation of the base due to overheating and carbonization of the adhesive. Even after the defective chip and the base are peeled off, a part of the adhesive remains on the base side. Therefore, the residual adhesive is removed by decomposing or polishing it with an adhesive peeling agent or an abrasive impregnated in a cotton swab or the like.

Finally, in order to wipe off the peeling agent and the abrasive agent attached to the base, the base surface is rubbed and cleaned with a cotton swab impregnated with a cleaning agent. By the above repair work, defective multiple chip heads can be reused, which can contribute to improvement in yield.

[Embodiment] An embodiment of the present invention will be described below with reference to FIGS. 1 to 5. FIG. 1 shows a head chip repair device for a multiple chip head. The configuration of the head chip repair device (1) is a multiple chip in which a plurality of chips (4) are attached on a base (3) on a frame (2) with an adhesive (5). A base (8) for fixing the head (6) with screws (7)
Infrared irradiator (10) for irradiating a spotlight (9) with
(15) with the hook (12) at the tip (11) of the tip (4) and the spring (14) adjusted by the nut (13)
Mount the stand (17) on which the sensor and the sensor (16) are attached to the Z stage (1
8) and a stand (20) and (21) that are a combination of the XY stage (19). Figure 2 shows multiple chip heads (6)
An example is shown below. A plurality of chips (4) are attached to one base (3) with an adhesive (5). FIG. 3 shows the multiple chip head (6) after the defective chip (4) has been peeled off. Base (3) even after chipping (4)
Residual adhesive (5 ') is attached on top.

FIG. 4 shows a state after the chip (4) is peeled off by the head chip repair device (1). The hooking rod (12) moves up to the position where the sensor (16) is activated by the spring (14). The tip portion (23) of the swab (22) is impregnated with an adhesive peeling agent (24) or an abrasive (25) to rub the residual adhesive (5 ').
Further, the swab (22 ') is impregnated with the cleaning agent (25) for the base (3) to clean the base (3).

FIG. 5 shows the multiple chip head (6) after repairing the defective chip (4).

Next, a method of repairing a defective chip (4) of the multiple chip head (6) by the chip repair device (1) will be described. First, the base (3) of the multiple chip head (6) is mounted on the base (8) with the screw (7). By reducing the output of the spotlight (9), the XY stage (17) and Z stage (1) are placed on the defective chip (4) of the multiple chip head (6).
Move the infrared irradiator (10) up / down, left / right, front / back in 8) to focus the spotlight. Further nut (1
3) Hang the hooking rod (12) with the spring (14) set to the proper tension on the tip (11) of the defective tip (4) by hand. Next, the output of the spotlight (9) is increased to intensively heat the top of the defective chip (4). The defective chip (4) is intensively heated while receiving an external force by the hook bar (12), and the adhesive (5) is thermally decomposed. As a result, when the adhesive strength of the thermally decomposing adhesive (5) becomes weaker than the external force applied to the defective chip (4), the defective chip (4) and the base (3) are caught by the hooking rod (12) in a short time. It has the effect that forced peeling can be done. Immediately after the defective chip (4) is peeled off, the spring (14) pulls the catch bar (12) upward to activate the sensor (16) to detect the timing of peeling and turn on the power of the spotlight (9). Cut.

As a result, deformation of the base (3) and carbonization of the adhesive (5) due to overheating can be prevented, and information on the end of the peeling work can be obtained to prevent overheating and improve the efficiency of the peeling work. There is an effect.

However, as shown in FIG. 3, the residual adhesive (5 ') adheres to the base (3) even after the defective chip (4) is peeled off. Therefore, as shown in Fig. 4, the peeling agent (24)
Base (3) with a cotton swab (22) impregnated with a polishing agent (25)
Scrape on the residual adhesive (5 ') to remove. Finally, the surface of the rubbing base is cleaned with a cotton swab (22 ') impregnated with a cleaning agent (26) so that a new chip can be reattached.

As described above, first, the adhesive (5) is thermally decomposed while applying an external force to the defective chip (4), and forced peeling is performed without overheating.

Second, the residual adhesive on the base is scraped off with a cotton swab impregnated with stripping agent. Third, wash the base with a cotton swab impregnated with adhesive. The defective chip of the multiple chip head can be repaired by the three-step process.

As an application shown in the embodiment of FIGS. 1 and 4, the following contents can be considered as a method of peeling the defective chip (4). Apply only the defective chip (4) of the multiple chip head with a cotton swab impregnated with the peeling agent (24), and leave it until the adhesive (5) decomposes. It is possible to get better. Furthermore, by applying an external force to the defective chip with the hook bar (12) or the like, the time for peeling the defective chip can be shortened.

[Advantage of the Invention] According to the present invention, by first heating one defective chip portion of the multiple chip head intensively and thermally decomposing the adhesive, only the defective chip can be peeled from the base in a short time without difficulty. There is an effect. Next, an external force is applied with a hook bar of the tip to assist the peeling action, so that the peeling time can be further shortened. Thirdly, the sensor detects a catch bar that moves at the same time as the defective chip is peeled off, and the signal for automatic heating stop or peeling end is obtained to prevent damage to the entire multiple chip head due to overheating. It is possible to automate the peeling work and improve the efficiency of the work for switching to the next process. Fourth, after the defective chip is peeled off, the residual adhesive can be easily removed by a simple tool such as a cotton swab impregnated with an adhesive peeling agent or an abrasive. Fifth, a simple tool that does not use a heat source to peel off a defective chip, applies an adhesive peeling agent to the bonding part of the defective chip with a cotton swab, etc., and then applies an external force to the defective chip with a hooking rod or the like. You can also remove defective chips with. This device has the effect that it can be left alone if it is set, and does not require a full-time worker at all times, because the sensor can detect the timing of the peeling to automate the peeling work.

According to the above-described defective chip repair apparatus for multiple chip heads, a multiple chip head assembled by multiplying the number of man-hours by that of a single head results in a defective product due to damage to one chip or defective output. The product can be reused and it can contribute to the improvement of the head yield.

Further, since it is possible to reproduce one chip, it is possible to stably supply high quality multiple head chips while maintaining a high yield.

[Brief description of drawings]

FIG. 1 is a side view of a head chip repair device, FIG. 2 is a plan view of a multiple chip head, FIG. 3 is a plan view of a multiple chip head after defective chip removal, and FIG. FIG. 5 is a side view of the head chip repair apparatus after the defective chip is removed, and FIG. 5 is a plan view of the multiple chip head after repairing the defective chip. Explanation of reference numerals (1) ... head chip repair device, (3) ... base, (4) ... chip, (4 ') ... defective chip,
(5) ... Adhesive, (5 ') ... Residual adhesive, (6) ...
… Multiple chip head, (9) …… Spotlight, (1
0) …… Infrared irradiator, (12) …… Hook bar, (16)
…… Sensor, (18) …… Z stage, (19) …… XY stage, (22) …… Cotton swab, (24) …… Peeling agent, (26)…
…Washing soap.

Claims (1)

[Scope of utility model registration request] 1. A jig for mounting a multiple chip head, a heating element for intensively heating a defective chip of the multiple chip head, a hooking rod for applying an external force to the defective chip to facilitate peeling, and the pulling member. A sensor for detecting the movement of the hanging rod, and means for stopping the heating by the heating element by detecting the timing of peeling of the defective chip based on the movement of the hanging rod detected by the sensor. Head chip repair device.