JPH08102574A - Hybrid integrated circuit device - Google Patents

Abstract

PURPOSE: To improve moisture resistance, a heat radiation property and leakage resistance and to attain compactness by laminating a second substrate, a first substrate having a small size from the base on a case, and providing a connector on a second substrate further providing the sealing resin surface above the back side of the first substrate. CONSTITUTION: A first substrate 42 having a small size is mounted on the surface of a second substrate 41 and a connector 44 is provided around the first substrate. The second substrate 41 is provided with a through hole and a lead 47 of the connector 44 is inserted into a through hole and fixed with solder. An electrode is provided on the rear of the second substrate and a lead is fixed to this electrode. Accordingly, the connector is firmly fixed to a spot one step lower than the first substrate 42 so that a injected resin is thinner by a factor of one step lowering, thus realizing compactness. Moreover, the surface of sealing resin 46 is arranged on the upper layer than the base of the lead and the back side of the first substrate 42 so as to completely cover the connector and the lead 47 as well as the first substrate 42 so as to generate no problem such as leakage or the like.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a hybrid integrated circuit device, and more particularly to a hybrid integrated circuit device in consideration of miniaturization, moisture resistance and heat dissipation.

[0002]

2. Description of the Related Art First, the structure of a general washing machine will be briefly described with reference to FIG. This structure has
In FIG. 5, reference numeral 1 is a machine frame, 2 is a water supply unit provided in the upper rear part of the machine frame 1 for accommodating a water supply unit, a power switch, and the like, and 3 is the machine frame 1 An outer tub 4 elastically provided inside is provided in the outer tub 3 and has a dehydration and washing tub having a large number of dewatering holes 5 ... Surrounding it, and 6 is provided at the bottom of the washing tub. Rotating blades 7 are drive motors provided on the outer bottom of the outer tub, which are connected to the washing tub 3 and the rotating blades via a small pulley 8, a large pulley 9, a belt 10 and a power transmission mechanism 11, and are used for washing. The rotary wing 6 is turned over so that the washing tub 4 can be used for dehydration.
And both the rotary blades 6 are rotated at high speed in one direction. 12
Is a drainage port provided at the bottom of the outer tub 3, 13 is a water distribution pipe connected to the drainage port, 14 is a drainage electric valve interposed in the water distribution pipe 13, and 15 is a water supply solenoid valve interposed in the water absorption pipe 16. Is.

The power switch has, for example, a drive circuit for a drive motor mounted on a printed circuit board or the like, and is composed of a semiconductor IC, a transformer, a buzzer, a capacitor and the like.
Further, switches for washing, dehydration and the like are arranged on the surface of the water supply section, which are electrically connected to the printed circuit board and are connected to the back surfaces of these switches. Wiring is provided hidden behind the machine frame 1 and electrically connected to the drive motor.

[0004]

When the washing machine having the above-mentioned structure is used, the base plate of the water supply section is of a completely waterproof type so that water cannot enter due to consideration of leakage due to the use of water. It has become. However, considering that water may be spilled due to the deterioration of the washing tub, it is preferable to install the water supply part in the upper part. There is a problem that the height becomes high and it is difficult to take out the laundry when it is taken out, and the operation is difficult.

Further, since a metal substrate having a good heat dissipation property is adopted, as shown in FIG. 4, the heat of the metal substrate is radiated to the outside by being brought into contact with a case having at least a bottom portion made of metal. Is an upper layer of the metal substrate,
The connector is mounted on this printed circuit board, and there is a problem that the thickness of the hybrid integrated circuit device becomes thick and it cannot be made compact. Further, since the resin is injected so that the leads of the connector are completely hidden, there is a problem that the mold thickness is large.

[0006] As described above, there has been a demand for a product that can solve the problems of moisture resistance, heat dissipation, non-leakage, compactness, and ease of handling all at once in a humid atmosphere.

[0007]

SUMMARY OF THE INVENTION The present invention has been made in view of the above-mentioned problems. First, the case has the second substrate from the bottom surface thereof, and the first substrate having a small size on the second substrate. A connector having a lead inserted into the through hole is provided on the second substrate that is laminated and does not face the first substrate, and a sealing resin surface has a root of the lead and the first substrate.
The solution is to be provided in a layer above the back surface of the substrate.

Secondly, in the case, the second substrate is stacked from the bottom surface thereof, the first substrate having a small size is laminated on the second substrate, and the surface of the first substrate on which the conductive paths are provided is the first substrate. On the second substrate, which is opposed to the surface of the second substrate, the leads fixed to the surface provided with the conductive path are electrically fixed to the second substrate through the through holes and do not face the first substrate. A solution is provided in which a connector having a lead inserted in the through hole is provided, and the sealing resin surface is provided at the base of the lead and above the back surface of the first substrate.

[0009]

First, in the case, the second substrate is stacked from the bottom surface thereof, and the first substrate having a small size is stacked on the second substrate, and the through hole is formed on the second substrate which does not face the first substrate. By providing the connector with the lead inserted in the connector, the connector is firmly provided in the state where the connection part is not peeled off, and the connector is provided at a position one step lower than the upper layer substrate, so that the sealing resin thickness is thin and compact. realizable. Moreover, the surface of the sealing resin is provided above the root of the lead and above the back surface of the first substrate, whereby sufficient moisture resistance and electric leakage can be ensured for the connector and the substrate provided on the upper layer.

Secondly, in addition to the first action, the surface of the first substrate on which the conductive paths are provided faces the surface of the second substrate, so that the back surface of the first substrate is located near the sealing resin. And first
The heat of the substrate can be radiated through the sealing resin having a slight thickness.

[0011]

Embodiments of the present invention will be described below. The drawing of the washing machine shares FIG. 5 used in the conventional example. The water supply unit 2 provided at the upper rear of the machine casing 1 is provided with an operation panel for driving the washing machine, and conventionally, a drive circuit electrically connected to these is installed below the operation panel. Although the board was provided, the present invention realizes a device incorporating this circuit, and omits this circuit in the water supply section. Further, recently, in some cases, an operation panel is provided in the area shown in FIG. 30 and the area protruding above the water supply section is omitted altogether. In either case, since the substrate for the drive circuit is not provided (or eliminated) in the lower layer of the operation panel unit, the position of the operation panel unit can be set lower than that of the conventional structure. Conventionally, it is necessary to provide a connection wiring with a drive motor on the outside or inside of the rear surface of the machine frame 1, but it is necessary to make the wiring thick because it has the highest driving ability. I no longer need it.

A drive motor 7 is provided at the bottom of the washing tub 4 where water accumulates, and a rotary pulley 6 is used for washing, and a washing tub 4 is used for dewatering via a power transmission mechanism 11 of a small pulley 8 and a large pulley 9 and a belt 10. And both the rotary blades 6 are rotating at high speed in one direction. In the present application, the structure shown in FIG. 2 is provided in the vicinity of the drive motor 7, and a fan 31 is provided here for cooling the drive motor.

Further, the flow of air flowing from the outside atmosphere, that is, so-called cooling air is effectively utilized by the fan 31, and the hybrid integrated circuit of this structure is inserted into the air flow as shown by the arrow in the figure. The heat generated in the substrate is effectively released. Although the inflow path is used in the figure, it may be an outflow path,
A stage may be separately provided in one area of the space in which the machine frame, the outer tub, the motor, etc. are mounted.

Reference numeral 33 is a hybrid integrated circuit device,
Although it is fixed to the bottom surface of the washing machine by the fixing metal fitting 34, the fixing method is not limited to this, and may be arranged vertically. However, when washing water or water from the tap enters the bottom of the washing machine, it eliminates problems such as electric leakage, but should be placed away from the bottom. Further, since water may drop from the upper part of the device, it is preferable that the sealing resin surface of the case faces downward.

Further considering the heat dissipation, the upper substrate sealed in the case is preferably a metal substrate. In this case, it is preferable that the surface of the metal substrate is thinly coated with resin in consideration of moisture resistance. Next, an embodiment of the hybrid integrated circuit device will be described with reference to FIG. In this embodiment, a printed circuit board 41 and a hybrid integrated circuit board 42 are integrated with each other. The first board 42 is a metal board whose surface has been subjected to an insulation treatment. Roads, semiconductor chips, etc. are mounted. Hereinafter, the surface on which the semiconductor element is mounted is referred to as the front surface, and the hatching surface is referred to as the back surface.
The second substrate 41 has the surface on which the first substrate is mounted as the front surface.

Here, the metal substrate 42 is an alumite-treated Al substrate, the surface of which is coated with a resin having an excellent insulating property, and a conductive path having a predetermined pattern is formed on the surface by hot pressing. It is worn. Further, a semiconductor chip, for example, an LSI chip, a Tr, a diode, a resistor and the like are electrically fixed by soldering on this, thereby forming a desired circuit. Here, as described above, the circuit for driving the drive motor 7 and the like via the operation panel is mounted.
If necessary, the semiconductor chip and the first substrate 42 are wire-bonded with a fine metal wire, and a terminal group derived from a conductive path or the like is provided on two sides of the first substrate 42.
The V-shaped leads 43 ... Are electrically connected by soldering or the like. The surface of the LSI chip is potted with epoxy resin or the like.

Next, on the printed circuit board 41, external components such as a connector 44, which is not preferable for surface mounting in terms of mounting strength, are mounted through the through holes T.
The conductive paths formed on the front surface and the back surface of No. 1 and the electrode pads extending from the conductive paths are electrically connected by solder. Alternatively, at least the connector 44 is electrically connected by solder with the lead inserted in the through hole T. Here, the printed board 41 is made of epoxy resin, but may be, for example, a ceramic board which is a board in which through holes can be formed. Further, the connector 44 is provided on the side of the printed circuit board, that is, in a non-overlapping region with the first substrate 42, and as described above, is in contact with the mating connector attached to one region of the washing machine.

On the other hand, the case 45 includes the pair of substrates 4
It is formed to be slightly larger than the outer shapes of 1, 42 so that it can be easily inserted into the case as indicated by the arrow. Further, the bottom surface of the case 45 contacts the back surface of the printed circuit board 41, and in consideration of electrical insulation from the electrical means (for example, wiring, leads inserted through through holes, etc.) provided on the back surface. , The case itself is integrally molded with insulating resin. Insulating resin 46 such as urethane or epoxy is injected into the remaining space. FIG. 2 illustrates this, and FIG. 3 is a sectional view thereof.

The feature of the present invention is, firstly, that the first substrate 42 having a small size is mounted on the surface of the second substrate 41 and does not overlap the first substrate, that is, the connector 44 is provided around the first substrate. Especially. That is, the second substrate 41 needs to be provided with the through hole T, and the lead 4 of the connector 44 is provided.
7 is inserted into the through hole T and fixed by soldering. Here, an electrode is provided on the back surface of the second substrate, and the electrode and the lead are fixed via solder. Therefore, the connector is firmly fixed at a position one step lower than the first substrate 42, and the thickness of the injected resin is thin due to the step down, so that the connector can be made compact accordingly. Moreover, since the root of the lead and the surface of the sealing resin 46 are disposed above the root of the first substrate 42, the space between the connector leads 47 is completely covered, and the first substrate 42 is completely covered. Even in many places, problems such as leakage do not occur.

Secondly, in addition to the first characteristic, the back surface of the first substrate 42 is on the upper side, and the sealing resin is disposed on this slightly thinly. is there),
The heat generated in the first substrate can be released to the outside by this thin sealing resin. Therefore, the second substrate is brought into contact with the bottom surface of the case (specifically, the conductive means formed on the back surface of the second substrate is brought into contact), so that the conductor on the bottom surface of the case in FIG. However, this thin sealing resin can realize the same heat radiation effect as the conventional one.

Further, the firmly fixed connector is exposed from the encapsulating resin, and it suffices to simply insert the connector into the mating connector, and a compact and one-touch connection can be realized. In addition, since the semiconductor chip can be fixed to the first substrate, the main body on which the drive circuit is mounted can be made significantly smaller, which allows it to be installed in a narrow empty space where a drive motor as shown in FIG. 5 is installed. The position of the control panel of the machine can be set low. Moreover, the hybrid integrated circuit device can be efficiently cooled by the cooling air generated by the fan of the drive motor even if heat is generated on the substrate.

[0022]

As is apparent from the above description, firstly, in the present device, the power supply unit, except for the operation unit and the drive motor,
Since the drive circuit and power output part can be installed, it can be placed in a narrow open space near the drive motor, which is one of the reasons for raising the operating part of the washing machine. The circuit board under the operation panel is omitted. Yes, the operation panel surface can be set to a low position.

Moreover, since the connector is mounted through the through hole of the second substrate, the strength and size can be improved. Further, since the leads of the connector and the back surface of the first substrate are arranged in a layer lower than the surface of the sealing resin, the moisture resistance and the leakage resistance of the circuit between the leads of the connector and the circuit of the first substrate are improved. Furthermore, since the printed circuit board is arranged on the bottom surface of the insulating case, the back surface of the first substrate is brought close to the surface of the sealing resin, and the heat of the first substrate is efficiently dissipated by the thin sealing resin. I am making it
It is possible to maintain heat dissipation equivalent to that of the conventional structure.

[Brief description of drawings]

FIG. 1 is a diagram illustrating an assembly configuration of a hybrid integrated circuit device of the present invention.

FIG. 2 is a diagram of a hybrid integrated circuit device of the present invention.

3 is a cross-sectional view of FIG.

FIG. 4 is a cross-sectional view of a conventional hybrid integrated circuit device.

FIG. 5 is a diagram of a washing machine in which a hybrid integrated circuit device is mounted.

[Explanation of symbols]

 41 Second Substrate 42 First Substrate 43 Lead 44 Connector 45 Case 46 Sealing Resin 47 Connector Lead

Claims (2)

[Claims] 1. An insulating case accommodates a metallic first substrate provided with a conductive path at least on its surface through an adhesive resin, and a second substrate laminated with the metallic substrate and having a through hole. In the resin-sealed hybrid integrated circuit device, the second substrate, the second substrate
A first substrate having a small size is laminated on a substrate, a connector having a lead inserted into the through hole is provided on the second substrate that does not face the first substrate, and the sealing resin surface is formed on the surface of the lead. A hybrid integrated circuit device, characterized in that the hybrid integrated circuit device is provided at the base and above the back surface of the first substrate. 2. An insulating case accommodates a metallic first substrate provided with a conductive path at least on its surface via an adhesive resin, and a second substrate laminated with the metallic substrate and having a through hole. In the resin-sealed hybrid integrated circuit device, the second substrate, the second substrate
The first substrate having a small size is laminated on the substrate, the surface of the first substrate on which the conductive path is provided faces the surface of the second substrate, and the lead fixed on the surface of the conductive path is provided. On the second substrate, which is electrically fixed to the second substrate through the through hole and does not face the first substrate,
The hybrid integrated circuit device is characterized in that a connector having a lead inserted therein is provided in the through hole, and the surface of the sealing resin is provided at a base of the lead and above the back surface of the first substrate.