JPH0799767B2 - Chip carrier IC device - Google Patents

Description

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a chip carrier configured to mount an IC chip on a ceramic carrier and connect the IC chip to a circuit board by an external connection electrode provided on the ceramic carrier. It relates to IC devices.

2. Related Art As shown in FIG. 4, a conventional chip carrier IC device 11 has an IC chip in the center of a rectangular flat ceramic carrier 12.
13 is mounted, this IC chip 13 and ceramic carrier 12
Is formed by wire bonding with a gold wire 14 to the pad formed on the ceramic carrier 12, and the ceramic carrier 12 is provided with external connection electrodes 15 connected to the pad by wiring (not shown) on the four peripheral edges thereof. ing. The chip carrier IC device 11 is mounted on the circuit board 16 and the external connection electrodes 15 are connected to the wirings 17 of the circuit board 16.

Problems to be Solved by the Invention However, since the external connection electrodes are arranged at the four peripheral edges of the rectangular flat ceramic carrier 12, if the number of external connection electrodes is large, the length of one side of the ceramic carrier 12 is reduced. The longer the flat area, the smaller the mounting density on the circuit board 16, and the ceramic carrier 12 and the circuit board.
There is a problem that it is easily affected by the difference in thermal expansion of 16 and a connection failure may occur in the connection portion between the external connection electrode 15 and the wiring 17 of the circuit board 16.

In view of the above conventional problems, it is an object of the present invention to provide a chip carrier IC device which is improved in mounting density on a circuit board and is less susceptible to a thermal expansion difference.

Means for Solving the Problems In order to achieve the above object, the present invention has an IC chip having a plurality of connection terminals on each side, and the IC chip is mounted on a plane, and a plurality of IC chips on the first side of the IC chip are mounted. The first external connection electrode, which is electrically connectable to the connection terminal, is provided on one side surface in the stacking direction.
A substrate, a plurality of connection terminals on the second side of the IC chip, and an external connection electrode capable of conducting through a through hole formed in the first substrate, provided on one side surface in the stacking direction.
The present invention is characterized by comprising a substrate and a plurality of the first substrate and the second substrate, and a circuit substrate which is electrically connected to the external connection electrode of each substrate arranged on one side surface in the laminating direction. Since it has the above-mentioned structure, the external connection electrode connected to the connection terminal of the IC chip is disposed on one side surface along the stacking direction of the multilayer board.
The chip carrier IC device can be mounted by joining one side surface to the circuit board and connecting each external connection electrode to the wiring of the circuit board. Further, since all the external connection electrodes are formed on one side surface of the multilayer substrate, the bonding area of the chip carrier IC with respect to the circuit substrate can be small, and the packaging density of the chip carrier IC device can be increased.
In addition, since the substrates constituting the multi-layer substrate only need to have a height to which an IC chip can be mounted and one group of connection terminals can be connected to an external connection electrode on one end face of each substrate,
The space in the height direction does not become extremely large, and the overall structure can be made compact. Further, since the bonding area with the circuit board becomes smaller, it is less likely to be affected by the difference in thermal expansion.

Embodiment An embodiment of the present invention will be described below with reference to FIGS. 1 to 3.

In FIG. 1, reference numeral 1 is a chip carrier IC device in which an IC chip 4 is mounted on the central portion of the first-layer substrate 2a in a multilayer substrate 3 in which four substrates 2a to 2d are stacked. A large number of connection terminals formed on the four circumferences of the IC chip 4 are connected to pads (not shown) formed on the substrate 2a by wire bonding using gold wires 5, respectively. These pads are arranged around the four sides of the IC chip 4, and the pads corresponding to one side of the IC chip 4 in the pads are provided on the substrate 2a via the wiring 6 formed on the substrate 2a. It is connected to the external connection electrode 7a formed on one end face. The pads corresponding to the other sides are formed by passing through the respective boards 2a to 2c to the wirings (not shown) similarly formed on the second to fourth layer boards 2b to 2d. The wirings of the second to fourth layers of the substrates 2b to 2d, which are connected through the through holes, are connected to the external connection electrodes 7b to 7d formed on one end surface of each substrate. Each substrate
One end surface of 2a to 2d constitutes one side surface 3a of the multilayer substrate 3 in the stacking direction, and the external connection electrodes 7a to 7d are
As shown in FIG. 2, the one side surfaces 3a are arranged in a staggered manner so as not to short-circuit with each other.

In this way, the IC chip 4 is mounted on the multilayer substrate 3 and the external connection electrode 7a is formed on one side surface 3a along the stacking direction of the multilayer substrate 3.
As shown in FIG. 3, the chip carrier IC device 1 on which ~ 7d is formed is mounted and fixed on the circuit board 8 with one side surface 3a of the multilayer substrate 3 as a joint surface, and is formed on this one side surface 3a. The external connection electrodes 7a to 7d are connected to the wiring (not shown) of the circuit board 8. At that time, since all the external connection electrodes 7a to 7d are formed on the one side surface 3a along the stacking direction of the multilayer substrate 3, the bonding area of the chip carrier IC device 1 to the circuit board 8 is small and the chip carrier IC device 1 is small. The packaging density of can be increased. In addition, each board 2a-2d
Can mount the IC chip 4 and connect its connection terminals to each board 2a.
Since it is sufficient that the wiring for connecting to the external connection electrodes 7a to 7d on one end face of ~ 2d is formed, the space in the height direction does not become extremely large, and the overall structure can be made compact. . Further, since the bonding area with the circuit board 8 is small, it is not easily affected by the difference in thermal expansion.

EFFECTS OF THE INVENTION According to the chip carrier IC device of the present invention, since all the external connection electrodes are formed on one side surface along the stacking direction of the multilayer substrate as described above, the chip carrier IC device is bonded to the circuit board. The area is small and the packaging density of the chip carrier IC device is high. In addition, since the substrate that constitutes the multilayer substrate only needs to have a height to which the IC can be mounted and the connection terminal and the external connection electrode can be connected, the space in the height direction is relatively small and the overall structure can be made compact. . Further, since the bonding area with the circuit board is reduced, it is less likely to be affected by the difference in thermal expansion, and other great effects can be obtained.

[Brief description of drawings]

1 to 3 show an embodiment of the present invention. FIG. 1 is a perspective view of a chip carrier IC device, FIG. 2 is a bottom view of FIG. 1, and FIG. 3 is a circuit diagram of the chip carrier IC device. FIG. 4 is a schematic perspective view of a state where it is mounted on a substrate, and FIG. 4 is a perspective view of a conventional example. 1 ... Chip carrier IC device 2a-2d ... Substrate 3 ... Multilayer substrate 4 ... IC chips 7a-7d ... External connection electrode 8 ... Circuit board.

Claims (1)

[Claims] 1. An IC chip having a plurality of connection terminals on each side, and an external connection electrode which is mounted on a flat surface and is electrically conductive with each of the plurality of connection terminals on the first side of the IC chip. A first substrate provided on one side surface in the stacking direction, a plurality of connection terminals on the second side of the IC chip, and an external connection electrode capable of conducting through a through hole formed in the first substrate, in the stacking direction. A second substrate provided on one side surface, and a circuit board formed by laminating a plurality of the first substrate and the second substrate and electrically connected to an external connection electrode of each substrate arranged on one side surface in the laminating direction. Chip carrier IC device characterized by.