JPH0799282A - Multi-chip module manufacture and multi-chip module intermediate - Google Patents

Abstract

PURPOSE:To provide a multi-chip module by electrically inspecting whether the semiconductor chip itself or the connection state of each appropriate before sealing. CONSTITUTION:A plurality of leads 2 of a lead frame 4 consisting of a frame 1 and the plurality of leads 2 interlocked to the frame are mutually fixed by an insulation fixing band 8 formed by the application or printing method, the fixed leads 2 and a terminal 6 for external continuity provided at the peripheral edge part of a wiring circuit substrate 5 where a plurality of semiconductor chips are mounted are connected and then the lead 1 is cut from the leads 2. Then, the connection state of the leads 2 is inspected, the semiconductor chip is mounted for the leads 2 with a proper connection state, further the mounted semiconductor chip is inspected, and the semiconductor chip is sealed if the inspection result is appropriate.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for manufacturing a multi-chip module (hereinafter referred to as MCM). More specifically, it relates to a method for manufacturing an MCM by inspecting the connection state of leads and the quality of the semiconductor chip itself before resin molding.

[0002]

2. Description of the Related Art In recent years, the functions of semiconductor devices have been improved and
In order to increase the response speed and packaging density,
2. Description of the Related Art A plurality of semiconductor chips are mounted and sealed on a printed circuit board having a terminal for external conduction on a peripheral portion thereof. Such a semiconductor device is called a multi-chip module (MCM) and is conventionally manufactured as described below.

That is, first, a strip metal material is patterned by a stamping method, an etching method or the like to prepare a lead frame 4 including a frame 1, leads 2 and tie bars 3 as shown in FIG. 3 (a).

Next, a wiring circuit board 5 for mounting a plurality of semiconductor chips is prepared, and the external conduction terminals 6 of the wiring circuit board 5 and the leads 2 of the lead frame 4 described above are wire-bonded or It is electrically connected by a bump connection method or the like (FIG. 3B).

After that, a semiconductor chip is mounted on the printed circuit board 5, and the entire printed circuit board 5 is sealed with a sealing means 7 such as a mold resin or a ceramic package (FIG. 2 (c)).

Finally, the frame 1 is cut off from the leads 2, the tie bars 3 connecting between the adjacent leads are also cut off, and further the leads 2 are trimmed as necessary, as shown in FIG. An MCM as shown in is obtained.

[0007]

However, the lead frame 4 used in the conventional MCM has such an integral structure that the frame 1, the lead 2 and the tie bar 3 are made of a conductive material. 4 is used to electrically inspect the connection state of the mounted semiconductor chip itself and individual leads, as shown in FIG. 3D, wiring of the MCM is performed. It could be performed only after the circuit board was sealed with a mold resin or the like and the frame and the tie bar were cut off from the lead. It was. Therefore, even if a defect of the semiconductor chip itself or an incomplete connection state of the leads is found, the MCM cannot be replaced or the leads cannot be reconnected because the MCM is already sealed. Therefore, the MCM is forced to be discarded, resulting in a decrease in the rate of non-defective products. Therefore, there is a problem that the manufacturing cost of the MCM cannot be reduced.

The present invention is intended to solve the above-mentioned problems of the prior art, and it is possible to inspect whether or not the connection state of the semiconductor chip itself or individual leads is good before sealing, and Allows easy replacement of chips and reconnection of leads, which allows MC with a high yield rate.
The purpose is to be able to produce M.

[0009]

SUMMARY OF THE INVENTION The inventors of the present invention fixed a plurality of leads of a lead frame used in manufacturing an MCM to each other with an insulating fixing strip, and then connected a wiring circuit board to the leads. In addition, it was found that the above-mentioned object can be achieved by cutting the frame from the leads to electrically separate the leads from each other before performing the sealing treatment, and completed the present invention.

That is, according to the present invention, a plurality of leads of a lead frame composed of a frame and a plurality of leads connected to the frame are fixed to each other by an insulating fixing band formed by a coating method or a printing method. The lead and the external conduction terminal of the printed circuit board on which a plurality of semiconductor chips are mounted are connected, the frame is cut off from the lead, and then,
The connection between each lead and the external conduction terminal of the printed circuit board is inspected, and if the inspection result is good, a semiconductor chip is mounted, and the mounted semiconductor chip is inspected, and the inspection result is good. Provided is a method for manufacturing an MCM, which is characterized by encapsulating a semiconductor chip.

Further, the present invention comprises a wiring circuit board on which a plurality of semiconductor chips are mounted and a plurality of leads connected to external conduction terminals of the wiring circuit board, before mounting the semiconductor chips. An unsealed MCM intermediate product, in which each lead is fixed by an insulating fixing band formed by a coating method or a printing method so that the leads are electrically independent from each other. To provide an MCM intermediate.

[0012]

In the MCM manufacturing method of the present invention, the leads of the lead frame are held by the insulating fixing strips. Therefore, when the printed circuit board and the leads are connected and then the frame is cut off from the leads, an MCM intermediate in which the leads are electrically independent from each other is obtained. Therefore, it is possible to inspect the connection state between the lead and the printed circuit board before sealing. Similarly, if a semiconductor chip is mounted on a lead having a good connection state, it is possible to further inspect the semiconductor chip itself before sealing. Therefore, it is possible to reconnect a lead having a poor connection and replace a defective semiconductor chip. Also, since the individual leads are held together by the insulating fixing strip,
It is difficult for the lead to bend or deform.

[0013]

DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention will be described below in detail with reference to the drawings. In addition, in each figure, the same reference numeral indicates the same or equivalent component.

FIG. 1 is a process diagram of the method for manufacturing an MCM of the present invention.
Shown in. As shown in the figure, first, a lead frame 4 including a frame 1 and a plurality of leads 2 connected to the frame 1 is prepared (FIG. 1A). Such a lead frame 4 is obtained by patterning a strip-shaped thin plate of copper alloy, iron, iron-nickel, stainless steel or the like having a thickness of about 0.05 to 0.5 mm by an etching method, a stamping method or the like.

Next, the plurality of leads 2 of the lead frame 4
Are fixed to each other with an insulating fixing band 8 (FIG. 1 (b)).
Unlike the conventional tie bar, the insulating fixing band 8 holds and fixes each lead in an electrically independent state. It should be noted that, like the conventional tie bar, it also has a function of preventing the resin from flowing out of the gap between the molding dies when the resin is sealed.

The insulative fixing band 8 can be formed of an insulative thermoplastic resin or a curable resin, and in particular, it can be cured in a short time by irradiation with light such as ultraviolet rays. Resins can be preferably used.

In the present invention, the insulating fixing strip 8 is formed by a coating method or a printing method. That is, as shown in FIG. 2 (a), a highly viscous insulating resin composition 21 is applied from above the lead 2 by a dispenser 22, or as shown in FIG. 2 (b), a silicone resin or a fluororesin is used. The lead 2 is brought into close contact with the peeling plate 23, and the insulating resin composition 21 is squeegeeed with the squeegee 25 through the screen printing plate 24.
It can be formed by printing using.

Next, a wiring circuit board 5 for mounting a plurality of semiconductor chips is prepared, and the external conduction terminals 6 provided on the peripheral portion of the wiring circuit board 5 and the leads 2 are connected by a known method. (FIG. 1 (c)). As the wiring circuit board 5, a wiring board made of a conductive material such as copper, nickel, aluminum, gold or silver and a polyimide, silicon oxide, silicon nitride or epoxy resin is provided on a substrate base such as a ceramic plate, a silicon plate or a glass epoxy plate. A single-layer or multi-layer wiring board provided with an insulating layer made of, for example, can be used.

Next, the frame 1 is cut off from the leads 2 so that the leads 2 are electrically independent of each other to obtain an MCM intermediate (FIG. 1 (d)). And this MCM
The quality of the connection between the individual leads 2 of the intermediate body and the printed circuit board 5 is inspected by a conventional method. For those with a good connection,
A semiconductor chip is mounted on the printed circuit board 5. And
Furthermore, the semiconductor chip itself is inspected by a conventional method. As described above, according to the present invention, lead connection and semiconductor chip inspection can be performed before sealing.

When a lead connection failure or a semiconductor chip failure is found as a result of the inspection, the connection is redone or the semiconductor chip is replaced as necessary.

Finally, for those with good test results,
The mounted semiconductor chip is sealed with a sealing means 7 such as a mold resin or a ceramic package (see FIG. 1).
(E)). As a result, the MCM can be manufactured with a high yield rate.

[0022]

According to the present invention, it is possible to inspect the connection state between the individual leads and the printed circuit board and the quality of the semiconductor chip itself before the semiconductor chip is sealed with the molding resin or the like. Chip replacement and lead reconnection can be easily performed. Therefore, the non-defective rate at the time of manufacturing the MCM can be improved. Further, it is possible to prevent the lead from being bent or deformed.

[Brief description of drawings]

FIG. 1 is a process drawing of a manufacturing method of the present invention.

FIG. 2 is an explanatory diagram of a method of forming an insulating fixing band.

FIG. 3 is a process drawing of a conventional manufacturing method.

[Explanation of symbols]

 1 frame 2 lead 3 tie bar 4 lead frame 5 wiring circuit board 6 terminal for external conduction 7 sealing means 8 insulating fixed band

Claims (2)

[Claims] 1. A lead frame comprising a frame and a plurality of leads connected to the frame, wherein the plurality of leads are fixed to each other by an insulating fixing band formed by a coating method or a printing method, and the fixed lead and the plurality of leads are fixed. Connect the external conduction terminal of the printed circuit board on which the semiconductor chip of
Cut the frame from the leads, and then inspect the connection between each lead and the external conduction terminal of the printed circuit board,
A multi-chip module manufacturing method, characterized in that a semiconductor chip having a good inspection result is mounted with a semiconductor chip, the mounted semiconductor chip is inspected, and a semiconductor chip having a good inspection result is sealed. 2. An unsealed state before mounting a semiconductor chip, comprising a printed circuit board on which a plurality of semiconductor chips are mounted, and a plurality of leads connected to external conduction terminals of the wired circuit board. Multi-chip module intermediate body, wherein each lead is fixed by an insulating fixing band formed by a coating method or a printing method so as to be electrically independent of each other. Intermediate.