JPH079784A - Ic card - Google Patents

Abstract

PURPOSE:To fill in a space between an electronic component and a panel, to stabilize a panel mounted state, and to eliminate adherence and peeling of the component due to stickiness of an adhesive layer provided on the panel by arranging a space filler between the component and the panel of an IC card. CONSTITUTION:A board 14 in which electronic components 13 are placed is supported to a frame 11 of a square shape having a connector 12 at one side face, and panels 17, 18 having adhesive layers 19, 20 mounted on and underneath the frame 11. This IC card is coated with resin solvent mixed with foaming agent on the components 13 or the panels 17, 18, and the solvent is foamed as a space filler. As a result, a space between the components and the panels is filled up with the filler, a panel mounted state is stabilized, and adherence, peeling of the component due to stickiness of the layer provided on the panel are eliminated thereby to obviate unpleasant peeling sound.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to personal information to carry personal information, financial information such as cash cards, OA equipment information, personal computer or game equipment information, television or video equipment information, and security systems. Information, etc.
The present invention relates to an IC card in which various information is stored.

[0002]

2. Description of the Related Art As an IC card of this type, one having a structure shown in FIG. 8 is well known as a conventional example. In this conventional example, a board 3 having an electronic component 2 such as a circuit element mounted thereon is attached to a rectangular frame 1, and
Panels 4 and 5 for covering the upper and lower surfaces of the frame 1 are attached.

The panels 4 and 5 have a thickness of 0.1 to 0.1, for example.
A 0.2 mm stainless plate is used, and an adhesive layer, that is, double-sided adhesive tape 6, 7 is attached to the inner surface of the stainless plate, and the electronic component 2 mounted on the substrate 3 by the double-sided adhesive tape.
And the panels 4 and 5 are adhered.

The double-sided pressure-sensitive adhesive tape is a non-woven fabric impregnated with a pressure-sensitive adhesive or a heat-sensitive adhesive,
A commercially available product is used. After sticking this double-sided adhesive tape to the panels 4 and 5 and incorporating the panel into the frame 1, a temperature of about 100 to 150 ° C. and 0.5 to 1K
It is held for several tens of seconds at a pressure of g / square cm, and is completely adhered (bonded) to the electronic component 2.

However, the electronic components 2 mounted on the substrate 3 have variations in height, and the high electronic components 2 are adhered to the upper and lower panels 4 and 5 by double-sided adhesive tapes 6 and 7, respectively. However, the electronic component 2a having a low height has a predetermined gap, that is, the gap a, between the electronic component 2a and the adhesive tape.

Due to the existence of the gap a as described above,
As shown in FIG. 9, for example, when the panel 4 is partially pressed from the outside, the panel 4 bends and is temporarily adhered to the electronic component 2 a due to stickiness of the adhesive tape 6.

When the external pressing force is released from this state,
As shown in FIG. 10, due to the restoring force of the panel 4, the adhesive tape 6 comes to be peeled off from the electronic component 2a, and at that time, an unpleasant "peeling sound" is generated each time.

Simultaneously with the generation of the peeling sound, as shown in FIG. 11, the stickiness of the adhesive tape 6 causes the electronic component 2a to be pulled upward (arrow b) in each gap a. The pulling action causes a pulling action on the leg portion 2b of the electronic component 2a.

Due to the pulling action and the pressing action from the outside, the action of pushing or pulling the electronic component 2a, that is, the shaking action is frequently performed, which causes the peeling of the solder and the like. The mounting state of the electronic component 2a with respect to the substrate 3 becomes unstable, which causes a connection failure.

Further, in order to avoid stickiness of the adhesive tape, as shown in FIG. 12, the adhesive tape 6a may be formed in a frame shape so that only the peripheral portion of the panel 4 is adhered to the frame 1, for example. It is considered.

However, if only the peripheral portion of the panel 4 is adhered in this way, not only the workability is poor, but also the intermediate portion of the panel 4 is not supported, so that the entire panel is sticky and not stable, and the user is not stable. There is a problem in that it gives a sense of anxiety and lacks reliability.

Further, it is conceivable to attach a predetermined rib higher than the electronic component or a dummy component 8 between the electronic components 2 in order to avoid the stickiness, but such a configuration is difficult to manufacture the substrate 3 itself. In addition to the property, there are various problems such as restricting the mounting position of the electronic component 2.

Therefore, in the conventional example, there are problems to be solved such as elimination of unpleasant peeling noise due to stickiness of the adhesive tape, peeling of solder for mounting electronic parts, difficulty of assembling work, and the like. .

[0014]

As a concrete means for solving the above-mentioned problems of the conventional example, the first invention according to the present invention is as follows.
An IC card in which a board having electronic components mounted thereon is supported by a rectangular frame having a connecting portion on one side, and panels having adhesive layers are attached to the upper and lower sides of the frame, and a foaming agent is mixed into the electronic components or the panel. The present invention provides an IC card in which a space-filling material is obtained by applying a foaming treatment to a resin-based solvent described above, and the resin-based solvent mixed with the foaming agent is paint or printing ink, and brush painting or screen printing. The resin-based solvent mixed with the foaming agent may be foamed by heating so as to adhere to the opposite surface, or the resin-based solvent mixed with the foaming agent may be mixed with an extender. In addition, after foaming and bonding, it can be broken at the middle portion in the thickness direction.

Further, a second invention is an IC card in which a board having electronic parts mounted thereon is supported by a rectangular frame having a connecting portion on one side surface, and panels having adhesive layers are attached above and below the frame. There is provided an IC card having a release layer formed on an upper surface of the electronic component,
The release layer is a film formed by applying a resin solvent having a release property, and the surface of the film is a skin layer having a high release property.

[0016]

By arranging the space filling material between the electronic component and the panel in the IC card, the space between the electronic component and the panel is filled, the mounting state of the panel is stable, and the panel is provided on the panel. By eliminating the phenomenon of adhesion and peeling from an electronic component due to stickiness of a certain adhesive layer, the unpleasant peeling noise is eliminated, and at the same time the pulling action of the electronic component disappears, so the solder peeling phenomenon also disappears and the mounting state of the electronic component Is maintained in a stable state.

Further, a resin-based solvent having a releasability is applied to the surface of the electronic component to form a release layer, and the surface of the release layer is a skin layer having a high releasability, so that the adhesive layer is attached to the panel. However, the adhesive phenomenon due to stickiness disappears, and the unpleasant peeling noise is eliminated, and at the same time, the solder peeling phenomenon also disappears.

[0018]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention will now be described in more detail with reference to the illustrated embodiment. In the first embodiment shown in FIGS.
Reference numeral 1 denotes a frame that constitutes an IC card, and the frame is molded into a substantially rectangular shape with a synthetic resin such as PBT, PC, ABS, or modified PPO.

The frame 11 is provided with an electrical connecting portion 12 on one side surface thereof, and a plurality of electronic components 1 such as ICs.
A board 14 on which 3 is mounted is arranged, and the connecting portion 12 and the board 14 are electrically connected. Reference numeral 15 is a battery power source, which is separated from other electronic components 13 by a partition section 16.

In this way, the panels 17 and 18 that cover the entire top and bottom of the frame 11 to which the substrate 14 is attached are attached. In this installation, the upper and lower panels 1
Adhesive layers 19 and 20 are attached to the inside of 7 and 18, respectively.

In this case, for the adhesive layers 19 and 20, for example, double-sided adhesive tape similar to the conventional example is used. Since the battery power supply 15 needs to be replaced from time to time, the adhesive layer 19 corresponding to this portion is a cutout portion 19a along the partition portion 16 with a part thereof removed.

The plurality of electronic components 13 mounted on the substrate 14 have a height difference rather than a constant height in the mounted state, and due to the height difference, they are between the upper and lower panels 17, 18. Different spaces, or gaps, are created.

In order to substantially fill this gap, the electronic component 1 mounted on the substrate 14 as shown in FIGS.
A resin-based solvent mixed with a foaming agent is applied or printed to a predetermined thickness on the upper surface of 3 to form a film 21. By the way, film 2
The thickness of 1 is about 0.03 mm.

As the resin-based solvent, for example, a vinyl chloride paste resin is dispersed in a plasticizer, and a plastisol type ink or paint in which a foaming agent is added to this, water evaporates and polymer adhesion or cross-linking occurs to form a film. A water-based ink or paint in which foaming occurs at the same time and the coating layer rises.

As the foaming agent, an azo type, a sulfone hydrazide type or a nitroso compound is used, and sumaric acid, maleic anhydride, trimetic anhydride or the like is used as a foaming inhibitor.

As the resin-based solvent, for example, a commercially available heat-foamable solvent DM-003 (trade name-manufactured by Harako Kagaku Kogyo Co., Ltd.) is appropriately applied by brush coating, roller coating, pad printing or silk printing. To form a coating film or film 21.

The coating film or film 21 may be formed by coating either before or after the substrate 14 is incorporated into the frame 11. After the film 21 is substantially dried, the adhesive layers 19 and 20 are formed. Upper and lower panels 17, each of which is equipped with
18 is assembled and the manufacturing process similar to the conventional example, that is, the process of thermocompression bonding is performed.

The thermocompression bonding step in the present invention includes, for example, 1
It is maintained at 20 ° C. for 10 seconds, whereby the applied coating film or film 21 is foamed and its thickness is about 6 times (about 0.19) as shown in FIG.
mm), and becomes the space filling material 21a, and the gap between the adhesive layer 19 and the electronic component 13, that is, the gap is filled.

Due to the presence of the space filling material 21a in this manner, the upper and lower panels 17 and 18 are maintained in a stable state, and even if the adhesive layers 19 and 20 are present, an unpleasant peeling sound due to stickiness is generated. Not only that, but the inconvenience caused by the adhesion with the electronic component 13 is eliminated.

The second embodiment shown in FIG. 4 shows an example in which the space filling material 21a is attached to the adhesive layer 19 on the panel 17 (18) side. In this case, there are two examples.

First, in the above-described embodiment, when there is an electronic component 13a having a low height, even if the film formed on the upper surface of the electronic component 13a is subjected to the foaming treatment, the space filling material 21a has a foaming ratio sufficient to fill the gap. However, a slight gap exists between the panel 17 and the adhesive layer 19.

When the panel 17 is pressed from the outside in this state, the panel 17 is bent and the adhesive layer 19 is pressure-bonded to the space filling material 21a to be in an adhesive state. Space filler 21a
If the adhesiveness between the electronic component 13a and the electronic component 13a is weak, the adhesiveness with the adhesive layer 19 prevails, and the space filler 21a is peeled off from the electronic component 13a and the state of being adhered to the adhesive layer 19 is maintained.

Secondly, a coating film or film 21 is formed on the adhesive layer 19 side of the panel 17, and the coating film or film is foamed to fill the gap with the electronic component 13. Also in this case, when the gap between the electronic component 13 and the adhesive layer 19 is small, the gap is filled as in the case of FIG. 3, but when the gap is large, the space filler 21a is attached to the adhesive layer 19. Become.

In any case, since the space filling material 21a is attached to the adhesive layer 19 side, the sticky layer 19 does not stick to the electronic component 13a, an unpleasant peeling sound is not generated, and the electronic component is not generated. Also, the shaking action on 13a does not occur.

FIG. 5 shows a third embodiment. In this embodiment, the space filling material 21a is broken in the middle portion and is maintained in a state of being adhered to the electronic component 13a and the adhesive layer 19, respectively.

In the third embodiment, the electronic component 13
This is the case where the adhesion of the coating film or film 21 formed on the upper surface of a is strong. When such a resin solvent having strong adhesion is used, an appropriate extender is mixed in, and after foaming, the panel 17 is pressed to bond the adhesive layer 19 and the space filler 21a. The restoring force of the panel 17 causes the space filling material 21a to be broken at approximately the middle portion, and the state where the space filling material 21a is attached to both sides with the breaking surface as a sakai is maintained.

The extender used here is, for example, calcium carbonate, polyethylene wax or the like, and when it is mixed in a considerable amount, the cohesive force of the coating film or the coating film 21 is lowered and the coating material is easily broken. .

Even in this case, no unpleasant peeling sound due to stickiness of the adhesive layer 19 is generated, and no shaking action is generated on the electronic component 13a.

Further, FIGS. 6 and 7 show a fourth embodiment. In this embodiment, a paint having a peeling property such as silicon is used. An example of this paint is, for example, a thermoplastic resin in which 20 to 25% by weight of a urethane resin is mixed with 3% by weight of a vinyl chloride resin, and 10 to 50% by weight of calcium carbonate and polyethylene are used to reduce the coating strength. 1 to 5 W% of wax and 1 to 5 W% of dimethyl silicone etc. as a slip agent are filled, and MEK ethyl acetate,
It is melted with a mixed solvent such as toluene and butyl acetate.

This peelable paint is applied to the electronic component 1 by means of roller coating, brush coating, silk printing or the like.
A coating film 21b is formed by coating the upper surface of 3a with an appropriate thickness. Then, by drying the coating film 21b, the surface thereof is formed into a skin layer having high peelability.

If the coating film 21b has strong adhesion, as shown in FIGS. 6 and 7, it firmly adheres to the upper part of the electronic component 13a, and the surface of the coating film 21b is on the panel 17. Even when it comes into contact with the adhesive layer 19, it is easily peeled off due to the peelability of the surface, so that no unpleasant peeling noise is generated and no shaking action is generated on the electronic component 13a.

When the adhesion of the coating film 21b is weak, the coating film 21b is peeled off from the surface of the electronic component 13a and adheres to the adhesive layer 19 side of the panel 17, as in FIG. Further, as in the case of FIG. 5, by mixing the extender, the coating film 21b is broken at the substantially middle portion and adheres to both sides, and the same operation as described above is performed respectively.

[0043]

As described above, the IC card according to the present invention has a structure in which the electronic component or panel is coated with a resin solvent containing a foaming agent and foamed to form a space filling material. , Especially by the interposition of space filling material,
The panel remains stable with respect to the frame, and not only the unpleasant peeling noise that occurs between the adhesive layer provided inside the panel and the electronic component can be prevented, but also the adhesion and peeling due to stickiness of the adhesive layer are repeated. The peeling of the solder due to the shaking phenomenon of the electronic component, which is caused by the above, is also eliminated, and there is an excellent effect that contact failure is not caused.

Further, by applying a resin solvent having a peeling property to the upper surface of the electronic component to form the peeling layer, an unpleasant peeling sound due to stickiness of the adhesive layer provided inside the panel is not generated. In addition, it has an excellent effect that it does not generate a shaking action for electronic parts.

[Brief description of drawings]

FIG. 1 is an exploded perspective view of an IC card according to the present invention.

FIG. 2 is an enlarged cross-sectional view of only a main part showing an unfoamed state of a coating film or a film in the first embodiment of the IC card.

FIG. 3 is an enlarged cross-sectional view of only an essential part showing a foaming state of a coating film or a film in the IC card.

FIG. 4 is an enlarged sectional view similar to FIG. 3 of the second embodiment of the IC card.

FIG. 5 is an enlarged sectional view similar to FIG. 3 in the third embodiment of the IC card.

FIG. 6 is an enlarged cross-sectional view of a main part for explaining a peeling state between an adhesive layer and a peeling layer in a fourth embodiment of the IC card.

FIG. 7 is an enlarged cross-sectional view of a peeling state between the adhesive layer and the peeling layer in the example.

FIG. 8 is a sectional view of a main part of an IC card in a conventional example.

FIG. 9 is an enlarged cross-sectional view of a main part showing a state of adhesion to an electronic component due to stickiness of an adhesive layer in the conventional example.

FIG. 10 is an enlarged cross-sectional view showing a situation in which the adhesive layer in the conventional example is peeled off from the adhesion with the electronic component.

FIG. 11 is an enlarged cross-sectional view showing a state after the adhesive layer in the conventional example has been peeled off from the adhesion with the electronic component.

FIG. 12 is a plan view showing a modified example of the adhesive layer in the conventional example.

FIG. 13 is an enlarged cross-sectional view of a main part using a dummy so that the adhesive layer in the conventional example does not adhere to an electronic component.

[Explanation of symbols]

 11 frame 12 connection part 13 and 13a electronic part 14 substrate 15 power supply battery 16 partition part 17 and 18 panel 19 and 20 adhesive part 21 and 21b coating film or film 21a space filling material

Claims (7)

[Claims] 1. An IC card in which a board having electronic components mounted thereon is supported by a rectangular frame having a connecting portion on one side, and panels having adhesive layers are attached to the top and bottom of the frame. An IC card in which a space-filling material is obtained by applying a resin-based solvent mixed with a foaming agent to a foaming process. 2. The IC card according to claim 1, wherein the resin-based solvent mixed with the foaming agent is paint or printing ink. 3. The IC card according to claim 1, wherein the resin-based solvent mixed with the foaming agent is foamed by heating and adhered to the opposing surface. 4. The IC card according to claim 1, 2 or 3, wherein an extender is added to a resin-based solvent mixed with a foaming agent so that it can be ruptured at an intermediate portion in the thickness direction after foam bonding. 5. An IC card in which a board having electronic components mounted thereon is supported by a rectangular frame having a connecting portion on one side, and panels having adhesive layers are attached to the upper and lower sides of the frame, and the upper surface of the electronic components. IC with release layer
card. 6. The IC according to claim 5, wherein the release layer is a film formed by applying a resin solvent having a release property.
card. 7. The IC card according to claim 5, wherein the surface of the film is a skin layer having high peelability.