JPH0794359A - Manufacture of laminated ceramic electronic component - Google Patents

Abstract

PURPOSE:To enable a laminated ceramic electronic part small in size and large in capacitance to be efficiently manufactured without using complicated manufacturing processes by a method wherein a compression bonding block is surely cut at a prescribed point preventing it from getting out of position. CONSTITUTION:A plurality of ceramic green sheets 11 on which inner electrodes 2 are provided at prescribed positions are laminated and subjected to compression bonding into a compression bonding block 4, the block 4 is fixed to a fixing sheet 7 by bonding by an adhesive means 3, and the compression bonding block 4 is set on a cutting table 5 through the intermediary of the fixing sheet 7 and cut at a prescribed point by a blade 6.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method of manufacturing a ceramic electronic component, and more particularly, to a laminated ceramic electronic device such as a laminated ceramic capacitor or a laminated piezoelectric component (piezoelectric actuator) in which ceramic layers and internal electrodes are alternately laminated. The present invention relates to a method of manufacturing a component.

[0002]

2. Description of the Related Art For example, a monolithic ceramic capacitor, which is a typical monolithic ceramic electronic component, generally has a dielectric ceramic layer 51 and an internal electrode 5 as shown in FIG.
It is formed by alternately laminating two internal electrodes 52 and pulling them out every other layer on the opposite end face to connect to the external electrodes 53, which is smaller and larger than a single plate type capacitor or the like. Since it has the advantage of being able to obtain a capacity, it is widely used in various applications.

As shown in FIG. 4, this monolithic ceramic capacitor is usually a block formed by laminating and crimping a plurality of ceramic green sheets 61 having a plurality of internal electrodes 52 arranged at predetermined positions. Crimp block)
It is manufactured by placing 54 on a cutting table (turntable) 55, cutting it at a predetermined position with a blade 56 and baking it, and then forming an external electrode 53 (FIG. 3).

By the way, in recent years, with the increasing demand for miniaturization and large capacity of chip type monolithic ceramic capacitors, in order to increase the internal electrode area without increasing the product size, the dielectric ceramic layer 51 is formed. A method is adopted in which the distance (gap) G (FIG. 5) from the end portion to the internal electrode 52 is reduced to about 100 μm, for example.

[0005]

However, in the above conventional manufacturing method, since the gap G is small, for example,
As shown in FIG. 4, the crimp block 54 is cut into the cutting table 5
In the step of mounting on 5 and cutting with the blade 56,
When the blade 56 enters the pressure-bonding block 54, the pressure-bonding block 54 slightly moves in the direction of arrow A due to the thickness of the blade 56, causing a positional deviation. Then, when this positional deviation is accumulated, the positional deviation becomes so large that the internal electrode 52 is cut, as in the case of cutting at the position of the line B, and the internal electrode 52 is exposed. There is a problem that the product is not a product, and the distance G becomes small even before exposure, resulting in insulation failure.

In order to solve such a problem, a method of adjusting the position of the crimping block during the step of cutting the crimping block can be considered, but the manufacturing process becomes complicated and the cost is increased. There is a problem.

The above problems are not limited to monolithic ceramic capacitors, but are common to other monolithic ceramic electronic components such as monolithic piezoelectric actuators formed by alternately laminating piezoelectric ceramic layers and internal electrodes. Is.

The present invention solves the above problems and prevents the displacement of the crimping block without requiring a complicated manufacturing process and surely cuts the crimping block at a predetermined position. It is an object of the present invention to provide a method for manufacturing a monolithic ceramic electronic component capable of efficiently manufacturing a small-sized and large-capacity monolithic ceramic electronic component.

[0009]

In order to achieve the above object, a method for manufacturing a monolithic ceramic electronic component according to the present invention comprises:
A plurality of ceramic green sheets having a plurality of internal electrodes arranged at predetermined positions were laminated and pressure-bonded to each other, and a pressure-bonding block was cut at a predetermined position and fired to embed the internal electrodes in the ceramic. In a method for manufacturing a monolithic ceramic electronic component, a pressure-bonding block is adhesively fixed to a fixing sheet using an adhesive means, and the pressure-bonding block is placed on a cutting table via the fixing sheet and cut at a predetermined position with a blade. It is characterized by

[0010]

In the method for manufacturing a monolithic ceramic electronic component according to the present invention, the crimping block is cut at a predetermined position by the blade in a state where the crimping block is installed on the cutting table via the fixing sheet bonded and fixed by the bonding means. Therefore, the force that moves (finely moves) the crimping block in the direction perpendicular to both surfaces of the blade, which is generated when the blade enters the crimping block, is absorbed by the crimping block itself, the bonding means, or the like. Therefore, it is possible to reliably prevent the displacement of the crimping block and cut the crimping block at a predetermined position, and it is possible to efficiently manufacture a small-sized and large-capacity monolithic ceramic electronic component. .

[0011]

Embodiments of the present invention will be described below with reference to the drawings. 1A, 1B and 1C are cross-sectional views showing a method for manufacturing a monolithic ceramic electronic component (a monolithic ceramic capacitor in this embodiment) according to an embodiment of the present invention.

In the method of manufacturing a monolithic ceramic capacitor of this embodiment, first, as shown in FIG.
A plurality of ceramic green sheets 11 on which a plurality of internal electrodes 2 are printed are laminated at predetermined positions and pressure-bonded to form a block (pressure-bonded block) 4. If necessary, green sheets with no printed electrodes are further laminated on the upper and lower surfaces of the block.

Then, as shown in FIG. 1 (b), a thickness of about 15 is applied to the pressure-bonding block 4 by an adhesive means (adhesive) 3.
A fixing sheet 7 made of polyethylene of 0 μm is fixed by adhesion. As the material of the fixing sheet, various materials such as polyethylene, polypropylene, and resin materials such as polyvinyl chloride can be used.

In this embodiment, specifically, a pressure-sensitive adhesive sheet 8 formed by applying an adhesive as the adhesive means 3 to the surface of the polyethylene sheet 7 facing the pressure-bonding block 4.
The fixing sheet 7 was adhered and fixed to the pressure-bonding block 4 by sticking (FIG. 1B) to the pressure-bonding block 4.

As the bonding means, various kinds of adhesives such as synthetic resin type adhesives and natural resin type adhesives can be used, and the adhesive is applied to both sides of the sheet-shaped core material. It is also possible to adhesively fix the fixing sheet to the pressure-bonding block using the adhesive sheet (for example, double-sided tape).

Next, the bottom dead center of the blade 6 is adjusted so that the blade 6 reaches the middle of the fixing sheet 7 so that the fixing sheet 7 is not cut by the blade 6. In this embodiment, as the blade 6,
A blade with a thickness of several hundred μm is used.

Then, as shown in FIG. 1 (c), the fixing sheet is attached to a cutting table (for example, a turntable) 5 configured to vacuum-adsorb the fixing sheet 7 by vacuum suction from a suction hole 9. The pressure-bonding block 4 to which 7 is adhesively fixed is placed, and the pressure-bonding block 4 is fixed on the sheet 7 for fixing.
It is fixed to the cutting table 5 via the blade, and the crimping block 4 is sequentially cut at a predetermined position by the blade 6. 2 is a perspective view showing the cut unfired monolithic ceramic capacitor element 10.

After the laminated ceramic capacitor element 10 is fired, external electrodes are formed on both end surfaces of the laminated ceramic capacitor element 10, so that the embedded internal electrode 2 is formed as shown in FIG.
Is alternately drawn out to the opposite end face to form a monolithic ceramic capacitor connected to the external electrode 13.

In the method of manufacturing a monolithic ceramic capacitor according to this embodiment, the crimping block 4 is cut by the blade 6 while being installed on the cutting table 5 via the fixing sheet 7 which is adhered and fixed by the adhering means 3. Therefore, it is possible to reliably prevent the displacement of the crimping block 4 in the step of cutting the crimping block 4, and to cut the crimping block 4 at a predetermined position to reduce the size,
A large-capacity monolithic ceramic electronic component can be efficiently manufactured.

The position deviation occurrence rate and the gap G between the case where the crimping block is cut by the method of the above-described embodiment and the case where the crimping block is cut by the conventional method (method without using the fixing sheet) (comparative example) Table 1 shows the minimum values (minimum gap) of (FIGS. 2 and 5). The target value of the gap G is 100 μm. Further, in Table 1, the positional deviation occurrence rate is such that the size of the gap G is 80 μm.
The occurrence rate (%) of samples of m or less is shown.

[0021]

[Table 1]

As shown in Table 1, according to the method of the comparative example, the positional deviation occurrence rate is as high as 15%, and the minimum gap of the sample after cutting is 0 μm, so that the internal electrodes are exposed from the end face. However, according to the method of the example, the occurrence rate of misalignment was extremely low at 1%, and the minimum gap of the sample after cutting was as large as 50 μm, so that the internal electrodes were exposed from the end face. Nothing was recognized at all.

In the above embodiments, the method for manufacturing a monolithic ceramic capacitor has been described.
The present invention is not limited to this, and can be applied to the manufacture of various laminated ceramic electronic components such as a laminated piezoelectric actuator in which internal electrodes are embedded in ceramic.

The present invention is not limited to the above-mentioned embodiments, but relates to specific patterns of internal electrodes, the number of laminated ceramic layers and internal electrodes, the thickness of blades, adhesive means and fixing sheets. Various applications and modifications can be made within the scope of the invention.

[0025]

As described above, according to the method of manufacturing a laminated ceramic electronic component of the present invention, a pressure bonding block obtained by laminating and pressure bonding a plurality of ceramic green sheets having a plurality of internal electrodes arranged at predetermined positions. Is adhered and fixed to the fixing sheet by using an adhesive means, and the pressure-bonding block is set on the cutting table through the fixing sheet, and the blade is cut at a predetermined position, so that a complicated manufacturing process is performed. It is possible to reliably prevent the displacement of the crimping block in the process of cutting the crimping block with a blade without needing to do so. The parts can be efficiently manufactured.

[Brief description of drawings]

1A and 1B are cross-sectional views showing a method for manufacturing a monolithic ceramic electronic component according to an embodiment of the present invention, in which FIG. 1A is a view showing a crimping block, and FIG. FIG. 6C is a diagram showing a state, and FIG. 7C is a diagram showing a step of installing a pressure-bonding block to which a fixing sheet is adhesively fixed on a cutting table and cutting.

FIG. 2 is a perspective view showing a monolithic ceramic electronic component element cut from a crimping block in one embodiment of the present invention.

FIG. 3 is a cross-sectional view showing the structure of a monolithic ceramic capacitor.

FIG. 4 is a cross-sectional view showing a method for manufacturing a conventional monolithic ceramic capacitor.

FIG. 5 is a plan view showing an example of internal electrode patterns of a laminated ceramic capacitor.

[Explanation of symbols]

 1 Dielectric Ceramic Layer 2 Internal Electrode 3 Adhesive Means 4 Crimping Block 5 Cutting Table 6 Blade 7 Fixing Sheet 8 Adhesive Sheet 10 Multilayer Ceramic Capacitor Element 11 Ceramic Green Sheet 13 External Electrode G Gap

Claims (1)

[Claims] 1. A pressure-bonding block formed by stacking and pressure-bonding a plurality of ceramic green sheets having a plurality of internal electrodes arranged at predetermined positions is cut at a predetermined position and fired to form an internal structure in the ceramic. In a method of manufacturing a laminated ceramic electronic component in which electrodes are embedded, a pressure-bonding block is bonded and fixed to a fixing sheet using an adhesive means, and the pressure-bonding block is set on a cutting table through the fixing sheet, and a predetermined blade is used. A method for manufacturing a monolithic ceramic electronic component, which comprises cutting at the position of.