JPH0793249B2 - Method for producing metallized film - Google Patents
Method for producing metallized filmInfo
- Publication number
- JPH0793249B2 JPH0793249B2 JP3058531A JP5853191A JPH0793249B2 JP H0793249 B2 JPH0793249 B2 JP H0793249B2 JP 3058531 A JP3058531 A JP 3058531A JP 5853191 A JP5853191 A JP 5853191A JP H0793249 B2 JPH0793249 B2 JP H0793249B2
- Authority
- JP
- Japan
- Prior art keywords
- source device
- evaporation source
- film
- metallized film
- slit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Description
【０００１】[0001]
【産業上の利用分野】本発明は、コンデンサ用電極の厚
さ変動の抑制に有効な蒸発源装置を用いてフィルムの表
面に電極を形成する金属化フィルムの製造方法に関す
る。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for producing a metallized film in which electrodes are formed on the surface of a film by using an evaporation source device which is effective for suppressing the thickness variation of electrodes for capacitors.
【０００２】[0002]
【従来の技術】従来、真空蒸着法による金属化フィルム
の製造方法においては、図８に示すような蒸発源装置２
１の上部にスリット状の開口２２を設け、内部に発生し
た蒸発金属、例えば亜鉛の蒸気をその開口部から吐出さ
せ、その上部に走行しているフィルム（誘電体）に亜鉛
を蒸着する方法が一般的に知られている。2. Description of the Related Art Conventionally, in a method of manufacturing a metallized film by a vacuum evaporation method, an evaporation source device 2 as shown in FIG.
1 is provided with a slit-shaped opening 22 in the upper part thereof, vaporized metal such as zinc vapor generated inside is discharged from the opening, and zinc is vapor-deposited on the film (dielectric) running on the upper part. Is commonly known.
【０００３】[0003]
【発明が解決しようとする課題】このような従来の技術
において、フィルムの幅方向の金属膜厚を均一化するた
めには、開口部の幅を均一に調整する必要があるが、従
来の方法では、蒸発源装置の熱影響により伸びが発生し
て開口部のスリット幅が変化し、中央部付近が狭くなる
傾向にある。このスリット状開口部の幅は５mm前後と狭
く、開口幅の変化が金属膜厚の均一性に大きく起因し、
金属膜圧のばらつきが発生した。特にフィルム幅が５０
０mm以上になる場合にはこの現象が顕著に現れていた。In such a conventional technique, in order to make the metal film thickness in the width direction of the film uniform, it is necessary to uniformly adjust the width of the opening. In the above, there is a tendency that elongation occurs due to the heat effect of the evaporation source device, the slit width of the opening changes, and the vicinity of the central portion becomes narrow. The width of this slit-shaped opening is as narrow as around 5 mm, and the change in opening width is largely due to the uniformity of the metal film thickness.
Variations in metal film pressure occurred. Especially the film width is 50
This phenomenon remarkably appeared when the length was 0 mm or more.
【０００４】本発明は、上記従来の技術における問題点
を解決するとともに、金属膜厚を精度よく制御すること
を目的とする。An object of the present invention is to solve the above-mentioned problems in the prior art and to control the metal film thickness with high accuracy.
【０００５】[0005]
【課題を解決するための手段】上記目的を達成するため
に本発明は、溶融金属が真空中に噴出するスリット状の
開口部の長さ方向に沿ってスリットの短形方向を橋絡す
るマスクを任意の間隔で設けた蒸発源装置を用いてフィ
ルムの片面または両面に電極を形成するものである。In order to achieve the above-mentioned object, the present invention is a mask which bridges the short direction of a slit along the length direction of a slit-shaped opening through which molten metal is ejected in a vacuum. The electrode is formed on one side or both sides of the film by using the evaporation source device in which is provided at arbitrary intervals.
【０００６】[0006]
【作用】上記手段により、蒸発源装置の熱膨脹による開
口幅の寸法変化が抑制され、併せて、橋絡マスクを電極
の薄手化用マスキングにも兼用することができる。By the above means, the dimensional change of the opening width due to the thermal expansion of the evaporation source device is suppressed, and the bridging mask can also be used as the mask for thinning the electrode.
【０００７】[0007]
【実施例】以下、本発明の一実施例について図面を参照
しながら説明する。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described below with reference to the drawings.
【０００８】図１は蒸発源装置１の構造を示したもの
で、エバポレーターチューブ２の内部にるつぼ３および
蒸発金属４を配している。エバポレーターチューブ２の
外周にはヒーター５が設けられ、幅方向に長細いスリッ
ト状の開口部６が形成され、その開口部６の長さ方向に
沿ってその短形方向を任意の間隔で橋絡するマスク７が
配されている。エバポレーターチューブ２内の金属４は
ヒーター５からの熱により溶融，帰化し開口部６を介し
て蒸発される構造となっている。FIG. 1 shows the structure of an evaporation source device 1, in which an evaporation tube 2 is provided with a crucible 3 and an evaporation metal 4. A heater 5 is provided on the outer periphery of the evaporator tube 2 and a slit-like opening 6 is formed in the width direction, and the slit 6 is bridged along the length direction of the opening 6 at arbitrary intervals. A mask 7 is provided. The metal 4 in the evaporator tube 2 is melted by the heat from the heater 5 and naturalized to be evaporated through the opening 6.
【０００９】図２は上記蒸発源装置１を真空蒸着機に設
置した概略正面図で、巻出し部８から出たフィルム９は
オイルマージンノズル１０を介してオイルを塗布され、
その後蒸着核形成用の蒸発源１１を通過し、本蒸発源装
置１上を通り巻取り部１２に巻取られる。FIG. 2 is a schematic front view of the evaporation source device 1 installed in a vacuum vapor deposition machine. The film 9 discharged from the unwinding part 8 is coated with oil through an oil margin nozzle 10.
After that, it passes through an evaporation source 11 for forming vapor deposition nuclei, passes over the evaporation source apparatus 1, and is wound up by a winding unit 12.
【００１０】図３は蒸発源装置１上を通過したフィルム
９と蒸発源装置１との関係を示した図であり、図におい
て、４ａはフィルム９の片面に蒸着された蒸着金属（電
極）、１０ａは幅５mm程度のオイルマージン部であり、
マスク７の幅は２mm程度である。FIG. 3 is a view showing the relationship between the film 9 that has passed over the evaporation source device 1 and the evaporation source device 1. In FIG. 10a is an oil margin portion having a width of about 5 mm,
The width of the mask 7 is about 2 mm.
【００１１】金属化フィルムの製造方法において、図８
に示すような従来の蒸発源装置２１を使用すると、その
開口部は熱影響により破線のような変形が発生し、フィ
ルム幅方向の蒸着膜厚（表面抵抗値）のばらつきは例え
ば平均膜厚９Ω／cm2の時、図４（ａ）に示すように±
３０％にも達するが、本発明による蒸着源装置１の開口
部６について試験したところ、変動は図４（ｂ）に示す
ように±１０％以内と大幅に改良することができた。In the method for producing a metallized film, the process shown in FIG.
When the conventional evaporation source device 21 as shown in FIG. 3 is used, the opening thereof is deformed as shown by the broken line due to the heat effect, and the variation of the vapor deposition film thickness (surface resistance value) in the film width direction is, for example, the average film thickness 9Ω. when / cm 2, ± as shown in FIG. 4 (a)
Although reaching 30%, when the opening 6 of the vapor deposition source device 1 according to the present invention was tested, the variation could be greatly improved to within ± 10% as shown in FIG. 4 (b).
【００１２】図５，図６はともに本発明の応用を示した
ものである。各図において、（ａ）は蒸発源装置の平面
図、（ｂ）は金属化フィルムの正面図である。一方、図
７のように蒸発源装置の開口部を広げることにより段つ
き形状の蒸着パターンが得られることが知られている
が、この方法では蒸発源装置と走行するフィルムの間の
間隙で図７（ｂ）のように段つき部が広がる欠点があ
る。しかし、開口部を図５（ａ）のようなパターンにす
ることにより極細の段つき部および薄膜部を得ることが
できる。また図６（ｂ）のように逆に蒸着膜の薄い部分
を設けることもできる。5 and 6 both show the application of the present invention. In each figure, (a) is a plan view of the evaporation source device, and (b) is a front view of the metallized film. On the other hand, it is known that a stepped vapor deposition pattern can be obtained by expanding the opening of the evaporation source device as shown in FIG. 7 (b) has a drawback that the stepped portion is widened. However, by forming the opening into a pattern as shown in FIG. 5A, it is possible to obtain an extremely fine stepped portion and a thin film portion. Alternatively, as shown in FIG. 6B, a thin portion of the vapor deposition film may be provided on the contrary.
【００１３】なお、本発明の実施例で説明したフィルム
９はプラスチックフィルムに限らず、フィルム状の誘電
体であれば何でもよい。The film 9 described in the embodiments of the present invention is not limited to the plastic film, and may be any film-shaped dielectric.
【００１４】[0014]
【発明の効果】以上の実施例から明らかなように本発明
は、蒸発源装置から溶融金属が蒸気となって噴出するス
リット状の開口部に長さ方向に沿って任意の間隔で橋絡
するマスクを設けることにより、スリットの幅方向寸法
変化を抑制し、膜厚さの変動が減少するコンデンサ電極
ひいては特性のよい金属化フィルムを得ることができ、
また、橋絡マスクを応用して電極膜厚さを精度よく制御
することも可能である。As is apparent from the above embodiments, according to the present invention, the slit-shaped openings where molten metal is ejected as vapor from the evaporation source device are bridged at arbitrary intervals along the length direction. By providing a mask, it is possible to suppress the dimensional change in the width direction of the slit, and to obtain a metallized film with good characteristics and thus capacitor electrodes in which the variation in film thickness is reduced,
It is also possible to apply a bridging mask to accurately control the electrode film thickness.
【図１】本発明の金属化フィルムの製造方法に使用する
蒸発源装置の斜視図FIG. 1 is a perspective view of an evaporation source device used in a method for producing a metallized film of the present invention.
【図２】同蒸発源装置を使用する真空蒸着機のフィルム
走行系の概略正面図FIG. 2 is a schematic front view of a film traveling system of a vacuum vapor deposition machine using the evaporation source device.
【図３】同蒸発源装置とその蒸発源装置によって製造さ
れた金属化フィルムとの関係を示す図FIG. 3 is a diagram showing a relationship between the evaporation source device and a metallized film produced by the evaporation source device.
【図４】（ａ）従来の蒸発源装置とその蒸発源装置によ
って製造された金属化フィルムとその金属化フィルムの
電極の表面抵抗値との関係を示す図 （ｂ）本発明による蒸発源装置とその蒸発源装置によっ
て製造された金属化フィルムとその金属化フィルムの電
極の表面抵抗値との関係を示す図FIG. 4A is a diagram showing a relationship between a conventional evaporation source device, a metallized film manufactured by the evaporation source device, and a surface resistance value of an electrode of the metallized film. FIG. 4B is a diagram showing the evaporation source device according to the present invention. And a diagram showing the relationship between the metallized film produced by the evaporation source device and the surface resistance value of the electrode of the metallized film
【図５】（ａ）本発明による蒸発源装置の他の実施例の
平面図 （ｂ）同蒸発源装置によって製造された金属化フィルム
の正面図5A is a plan view of another embodiment of the evaporation source device according to the present invention. FIG. 5B is a front view of a metallized film manufactured by the evaporation source device.
【図６】（ａ）本発明による蒸発源装置のさらに他の実
施例の平面図 （ｂ）同蒸発源装置によって製造された金属化フィルム
の正面図FIG. 6A is a plan view of still another embodiment of the evaporation source device according to the present invention. FIG. 6B is a front view of a metallized film produced by the evaporation source device.
【図７】（ａ）従来の蒸発源装置の平面図 （ｂ）同蒸発源装置によって製造された金属化フィルム
の正面図FIG. 7A is a plan view of a conventional evaporation source device. FIG. 7B is a front view of a metallized film produced by the evaporation source device.
【図８】従来の蒸発源装置の他の例の平面図FIG. 8 is a plan view of another example of the conventional evaporation source device.
１ 蒸発源装置 ３ るつぼ ４ 蒸発金属 ６ スリット状の開口部 ７ マスク ９ フィルム 1 Evaporation source device 3 Crucible 4 Evaporated metal 6 Slit-shaped opening 7 Mask 9 Film
───────────────────────────────────────────────────── フロントページの続き (51)Int.Cl.6 識別記号 庁内整理番号 ＦＩ 技術表示箇所 Ｈ０１Ｇ 4/015 4/18 (72)発明者 武藤 博之 大阪府門真市大字門真1006番地 松下電器 産業株式会社内 (72)発明者 内村 登 大阪府門真市大字門真1006番地 松下電器 産業株式会社内 (72)発明者 錦織 由朋 大阪府門真市大字門真1006番地 松下電器 産業株式会社内 (72)発明者 山本 佐太郎 大阪府門真市大字門真1006番地 松下電器 産業株式会社内─────────────────────────────────────────────────── ─── Continuation of the front page (51) Int.Cl. 6 Identification number Internal reference number FI Technical location H01G 4/015 4/18 (72) Inventor Hiroyuki Muto 1006 Kadoma, Kadoma-shi, Osaka Matsushita Electric Industrial Incorporated (72) Inventor Noboru Uchimura 1006 Kadoma, Kadoma, Osaka Prefecture Matsushita Electric Industrial Co., Ltd. (72) Inventor, Yuho Nishikori, 1006 Kadoma, Kadoma, Osaka Matsushita Electric Industrial Co., Ltd. (72) Invention Satoshi Yamamoto, 1006 Kadoma, Kadoma City, Osaka Prefecture Matsushita Electric Industrial Co., Ltd.
Claims (1)
の開口部の長さ方向に沿ってスリットの短形方向を橋絡
するマスクを任意の間隔で設けた蒸発源装置を用いてフ
ィルムの片面または両面に電極を形成することを特徴と
する金属化フィルムの製造方法。1. A film is formed by using an evaporation source device in which masks bridging a short direction of a slit along a length direction of a slit-shaped opening through which molten metal is jetted in a vacuum are provided at arbitrary intervals. A method for producing a metallized film, comprising forming electrodes on one side or both sides.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3058531A JPH0793249B2 (en) | 1991-03-22 | 1991-03-22 | Method for producing metallized film |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3058531A JPH0793249B2 (en) | 1991-03-22 | 1991-03-22 | Method for producing metallized film |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH04293222A JPH04293222A (en) | 1992-10-16 |
| JPH0793249B2 true JPH0793249B2 (en) | 1995-10-09 |
Family
ID=13087017
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3058531A Expired - Lifetime JPH0793249B2 (en) | 1991-03-22 | 1991-03-22 | Method for producing metallized film |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0793249B2 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107735509A (en) * | 2015-07-28 | 2018-02-23 | 夏普株式会社 | Vapor deposition source, evaporation coating device and evaporation film manufacturing method |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| RU2388846C2 (en) * | 2005-05-31 | 2010-05-10 | Корус Текнолоджи Бв | Facility and procedure for application of coating on padding |
-
1991
- 1991-03-22 JP JP3058531A patent/JPH0793249B2/en not_active Expired - Lifetime
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107735509A (en) * | 2015-07-28 | 2018-02-23 | 夏普株式会社 | Vapor deposition source, evaporation coating device and evaporation film manufacturing method |
| CN107735509B (en) * | 2015-07-28 | 2019-12-13 | 夏普株式会社 | Vapor deposition source, vapor deposition device, and vapor deposition film manufacturing method |
| US10597770B2 (en) | 2015-07-28 | 2020-03-24 | Sharp Kabushiki Kaisha | Vapor deposition source, vapor deposition apparatus and method for producing vapor-deposited film |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH04293222A (en) | 1992-10-16 |
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