JPH0790603B2 - Stereolithography device - Google Patents
Stereolithography deviceInfo
- Publication number
- JPH0790603B2 JPH0790603B2 JP5170934A JP17093493A JPH0790603B2 JP H0790603 B2 JPH0790603 B2 JP H0790603B2 JP 5170934 A JP5170934 A JP 5170934A JP 17093493 A JP17093493 A JP 17093493A JP H0790603 B2 JPH0790603 B2 JP H0790603B2
- Authority
- JP
- Japan
- Prior art keywords
- resin
- tank
- modeling
- layer
- molding
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- Heating, Cooling, Or Curing Plastics Or The Like In General (AREA)
Description
【0001】[0001]
【産業上の利用分野】本発明は、底面が透明プレートか
らなる光硬化性樹脂造形槽の下方から、光照射装置によ
る光エネルギーを槽内の光硬化性樹脂に照射して、槽内
の樹脂液面上に配置した造形ベースプレートの下面に樹
脂の硬化物層を成形し、前記造形ベースプレートを造形
槽の透明プレートから離反する方向へ移動することによ
り、造形ベースプレートに、順次硬化物層の積層された
造形物を成形していく方式の光造形装置の改良に関する
ものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention irradiates a photocurable resin in a tank with light energy from a light irradiation device from below a photocurable resin molding tank whose bottom surface is a transparent plate. A cured product layer of resin is molded on the lower surface of the modeling base plate arranged on the liquid surface, and the modeling base plate is moved in a direction away from the transparent plate of the modeling tank, whereby the cured product layer is sequentially laminated on the modeling base plate. The present invention relates to an improvement of a stereolithography apparatus of a type that molds a shaped object.
【0002】[0002]
【従来の技術】従来より、樹脂造形槽内の光硬化性樹脂
に光エネルギーを照射して、三次元の造形物を成形する
光造形法として各種のものが知られており、これらのう
ち、広く知られている方法としては、1990年10月
30日,日刊工業新聞社発行の刊行物、丸谷洋二外4名
著「光造形法」の第79頁乃至第83頁に記載されてい
るように、光硬化性樹脂が作る液面の上方から光を照射
して硬化物層の積層された造形物を成形していく自由液
面方式と、透明プレートと造形ベースプレートとの間隔
を造形すべき一層の厚みに一致させて、透明プレートを
介して光を照射することにより硬化物の積層された造形
物を順次成形していく規制液面方式とがある。2. Description of the Related Art Conventionally, various types of stereolithography have been known as a stereolithography method for molding a three-dimensional sculpture by irradiating a photocurable resin in a sculpting tank with light energy. As a widely known method, as described in pages 79 to 83 of "Stereolithography" by Yoji Maruya, four authors, published by Nikkan Kogyo Shimbun on October 30, 1990. , A free liquid surface method that irradiates light from above the liquid surface created by the photocurable resin to form a molded object in which a cured product layer is laminated, and a space between the transparent plate and the molding base plate There is a regulated liquid level method in which a molded article in which a cured product is laminated is sequentially formed by irradiating light through a transparent plate so as to match the thickness of the regulated liquid level.
【0003】前記の自由液面方式は、光硬化性樹脂の貯
留された造形槽内の液面よりも僅かに下側に造形ステー
ジを配置して、造形槽の上方に設けた光照射装置より光
エネルギーを槽内の光硬化性樹脂に照射することで、造
形ステージの上面に硬化物層を成形し、次いで前記造形
ステージの位置を若干下方に沈めることによって、既に
硬化した層の表面に樹脂を流動させ、この流動により充
填された樹脂液面に光を照射して、次の硬化物層を成形
するという工程を繰り返すことで目的とする積層造形物
を成形する。In the above-mentioned free liquid level system, the molding stage is arranged slightly below the liquid level in the molding tank in which the photo-curable resin is stored, and the light irradiation device is provided above the molding tank. By irradiating the photocurable resin in the tank with light energy, a cured product layer is formed on the upper surface of the modeling stage, and then the position of the modeling stage is slightly lowered to lower the resin on the surface of the already cured layer. Is flowed, and the liquid surface of the resin filled by this flow is irradiated with light to form the next cured product layer, thereby repeating the process of forming the desired layered product.
【0004】一方の規制液面方式は、底面が透明プレー
トからなる光硬化性樹脂造形槽の下方から、光照射装置
による光エネルギーを槽内に貯留された光硬化性樹脂に
照射して、槽内の樹脂液面上に配置した造形ベースプレ
ートの下面に樹脂の硬化物層を成形し、前記造形ベース
プレートを造形槽の透明プレートから離反する方向へ引
き上げることにより、造形ベースプレートの下面に次の
硬化物層を成形するという工程を繰り返すことで目的と
する積層造形物を成形する。On the other hand, in the regulated liquid level system, the photocurable resin stored in the tank is irradiated with light energy from a light irradiation device from below the photocurable resin molding tank whose bottom surface is a transparent plate. The cured product layer of the resin is formed on the lower surface of the molding base plate disposed on the liquid surface of the resin, and the next cured product is formed on the lower surface of the molding base plate by pulling the molding base plate away from the transparent plate of the molding tank. By repeating the process of forming layers, the target laminate-molded article is formed.
【0005】[0005]
【発明が解決すべき課題】前者の自由液面方式による光
造形法では、造形槽内の樹脂液面よりも僅かに下側に配
置した造形ベースプレートの上の樹脂に、上方から光を
照射することで硬化物を成形した後に、この硬化物の上
面に次の硬化物層を成形するために、この成形する硬化
物層の厚みに相当する深さだけ造形ベースプレートを沈
めることになるが、その場合、単に造形ベースプレート
を所定の深さだけ沈めただけでは、樹脂自体の粘性や表
面張力の作用によって、既に成形された硬化物層の表面
に樹脂を均等かつ平滑に供給することができず、供給さ
れた樹脂が均等かつ平滑になるまで所定の時間を必要と
するので、能率よく連続的に次の硬化物層を成形できな
いという問題がある。In the former optical molding method based on the free liquid surface method, the resin on the molding base plate disposed slightly below the liquid surface of the resin in the molding tank is irradiated with light from above. Therefore, after molding the cured product, in order to form the next cured product layer on the upper surface of the cured product, the modeling base plate is sunk by a depth corresponding to the thickness of the cured product layer to be molded. In this case, simply submerging the modeling base plate to a predetermined depth does not allow the resin to be evenly and smoothly supplied to the surface of the already-cured product layer due to the action of the viscosity and surface tension of the resin itself, Since a predetermined time is required until the supplied resin becomes even and smooth, there is a problem that the next cured product layer cannot be efficiently and continuously formed.
【0006】また、この自由液面方式による光造形法で
は、硬化物層の成形に従って造形ベースプレートを順次
沈下させるので、造形槽内に予め多量の樹脂を貯留して
おく必要があるが、前記のように、硬化物層の成形がこ
のように多量の樹脂を貯留した造形槽内の液面近くで行
われるためには、槽内の樹脂温度を常に所定の温度に管
理して樹脂粘度をコントロールすると共に、樹脂の熱膨
張や収縮による液面位の変化を防止しないと、造形ベー
スプレートを沈下する過程で樹脂の供給不良とか、成形
される各硬化物層間の剥離を生ずることになるので、造
形槽に例えば、電気ヒーター等の加温装置を備えて、絶
えず温度管理に留意しなければならないという問題があ
る。Further, in the optical molding method using the free liquid surface method, since the molding base plate is sequentially submerged according to the molding of the cured material layer, it is necessary to store a large amount of resin in the molding tank in advance. As described above, in order to form the cured product layer near the liquid surface in the molding tank that stores a large amount of resin in this way, the resin temperature in the tank is constantly controlled to a predetermined temperature to control the resin viscosity. In addition, if the change in the liquid level due to thermal expansion or contraction of the resin is not prevented, the resin may not be supplied properly during the process of sinking the molding base plate, or peeling may occur between the cured product layers to be molded. There is a problem in that the tank must be equipped with a heating device such as an electric heater and the temperature must be constantly monitored.
【0007】一方、後者の規制液面方式による光造形法
では、底面が透明な樹脂造形槽の下方から光を照射して
槽内に配置した造形ベースプレートと槽の底面との間に
硬化物層を成形した後、造形ベースプレートを順次上方
に引き上げて、既設硬化物層と槽の底面の透明プレート
との間に、予め槽内に貯留された所定の樹脂容量によっ
て順次硬化物層を成形していくので、造形槽内における
樹脂の自由液面の性状や樹脂粘度等の要因を受けずに、
目的とする造形物を成形することができ、造形槽の容量
に比例して大きな形状の造形物を成形できるという利点
を有する。On the other hand, in the latter optical molding method using the regulated liquid level system, a cured material layer is provided between the molding base plate disposed inside the tank by irradiating light from below the resin molding tank having a transparent bottom surface and the bottom surface of the tank. After molding, the modeling base plate is sequentially pulled up, and between the existing cured product layer and the transparent plate on the bottom surface of the tank, the cured product layer is sequentially molded by the predetermined resin volume stored in the tank in advance. Therefore, without being affected by factors such as the properties of the free liquid surface of the resin in the molding tank and the resin viscosity,
It has an advantage that a desired molded article can be molded and a molded article having a large shape can be molded in proportion to the capacity of the molding tank.
【0008】しかしながら、この規制液面方式による光
造形法によって、例えば、図6に示すように、光硬化性
樹脂3を貯留した樹脂造形槽1内に、既に成形された第
一層目硬化物4の外縁4aが第二層目硬化物5の外縁5
aに対してオーバーハングしており、この第二層目硬化
物5の下面に、第三層目硬化物6の外縁6aが前記第二
層目硬化物5の外縁5aよりも突出しているようなデザ
インの積層造形物を成形する場合には、底面の透明プレ
ート2を通して、第二層目硬化物5の外縁5aよりも外
側の領域にある槽内の樹脂3aに対して光を照射するこ
とになるので、第二層目硬化物5の外縁5aよりも外側
に突出した第三層目硬化物6の突出部6bの上面に不要
な硬化物6cが付着成形されてしまうという問題が生ず
る。However, by the stereolithography method based on this regulated liquid level method, for example, as shown in FIG. 6, the first layer cured product already molded in the resin molding tank 1 storing the photocurable resin 3 therein. 4 has an outer edge 4a of the second layer cured product 5
It is overhanging with respect to a, and the outer edge 6a of the third layer cured product 6 is projected on the lower surface of the second layer cured product 5 more than the outer edge 5a of the second layer cured product 5. When molding a laminate-molded article of a different design, irradiate light through the transparent plate 2 on the bottom surface to the resin 3a in the tank in the region outside the outer edge 5a of the second-layer cured product 5. Therefore, there arises a problem that the unnecessary hardened material 6c is adhered and molded on the upper surface of the protruding portion 6b of the third hardened material 6 which is projected outward from the outer edge 5a of the second hardened material 5.
【0009】このように、外縁が引っ込んだ前層の下
に、外縁が前層よりも突出した次層を成形する場合に、
次層の突出部上面に不要硬化物が付着成形されるのは、
光照射として紫外線レーザーを用いた場合でも、また、
半導体レーザーを用いた場合でも、硬化深度の違いはあ
るが、同様に生ずることにかわりはない。In this way, when the next layer having the outer edge protruding more than the front layer is formed below the front layer with the outer edge retracted,
The unnecessary hardened material is attached and molded on the upper surface of the protrusion of the next layer.
Even when an ultraviolet laser is used for light irradiation,
Even when a semiconductor laser is used, there is a difference in the curing depth, but the same occurs.
【0010】光照射装置として、紫外線レーザーを用い
る場合と半導体レーザーを用いる場合の相違による光硬
化性樹脂の硬化プロフィールを見た場合、図7aに示す
ように、例えば、Ar(アルゴン)レーザー、He−C
d(ヘリウム−カドミウム)レーザー等の紫外線レーザ
ーの場合では、硬化深度が浅く、幅t1に対する深さh
1の関係は1:0.5から3程度であるのに対して、図
7bに示すように、半導体レーザーの場合は、硬化深度
が深く、幅t2に対する深さh2の関係は1:50から
200程度もあり、深度h2が50mm程度に到達する
迄の時間も数秒から十数秒という特徴をもっている。As shown in FIG. 7a, when the curing profile of the photocurable resin due to the difference between the case where an ultraviolet laser is used and the case where a semiconductor laser is used as a light irradiation device is seen, for example, an Ar (argon) laser, He -C
In the case of an ultraviolet laser such as a d (helium-cadmium) laser, the curing depth is shallow, and the depth h with respect to the width t1.
While the relationship of 1 is about 1: 0.5 to about 3, as shown in FIG. 7b, in the case of the semiconductor laser, the curing depth is deep, and the relationship of the depth h2 to the width t2 is from 1:50. It has a feature of about 200, and the time until the depth h2 reaches about 50 mm is several seconds to ten and several seconds.
【0011】従って、前記図6のような、外縁が引っ込
んだ前層の下に、外縁が前層よりも突出した次層を成形
する際に、光照射として紫外線レーザーを用いた場合に
は、半導体レーザーの場合よりも硬化深度が浅いとして
も、図8に示すように、第二層目硬化物5の外縁5aよ
りも外側に突出した、層厚Tをもつ第三層目硬化物6の
突出部6bの上面に、厚さtという不要な硬化物6cが
付着成形されることになる。Therefore, when an ultraviolet laser is used as the light irradiation when molding the next layer having the outer edge protruding from the front layer under the front layer having the outer edge retracted as shown in FIG. Even if the curing depth is shallower than in the case of a semiconductor laser, as shown in FIG. 8, a third layer cured product 6 having a layer thickness T, which protrudes outside the outer edge 5a of the second layer cured product 5, is formed. An unnecessary hardened material 6c having a thickness t is attached and molded on the upper surface of the protruding portion 6b.
【0012】また、同様に光照射として半導体レーザー
を用いた場合には、硬化深度が紫外線レーザーの場合よ
り深いために、図9に示すように、第二層目硬化物5の
外縁5aよりも外側に突出した、層厚Tをもつ第三層目
硬化物6の突出部6bの上面に、該第三層目硬化物6の
層厚Tよりも遙に厚さtの大きい不要硬化物6dが付着
成形されることになる。Similarly, when a semiconductor laser is used for light irradiation, since the curing depth is deeper than that of the ultraviolet laser, as shown in FIG. 9, the second layer cured product 5 is harder than the outer edge 5a. On the upper surface of the protruding portion 6b of the third layer cured product 6 having a layer thickness T protruding outward, an unnecessary cured product 6d having a thickness t far greater than the layer thickness T of the third layer cured product 6 is formed. Will be adhered and molded.
【0013】一方、光造形法のように所定の層厚の硬化
物層を順次積層して、目的とする造形物を成形する方法
においては、図8及び図9に示すような、夫々の積層硬
化物層4,5,6の間を有効に固着して層間剥離を防止
するために、例えば、図8示した不要硬化物6cの厚さ
tに相当する程度の所定の根入れ深さをもたせる必要が
ある。On the other hand, in the method of forming a desired shaped article by sequentially laminating a cured material layer having a predetermined layer thickness as in the stereolithography method, as shown in FIG. 8 and FIG. In order to effectively fix the cured product layers 4, 5 and 6 and prevent delamination, for example, a predetermined rooting depth corresponding to the thickness t of the unnecessary cured product 6c shown in FIG. 8 is set. It is necessary to have it.
【0014】このように、各積層硬化物層間を所定の根
入れ深さにより、相互に固着する必要性を考慮した場
合、前記のように硬化深度の浅い紫外線レーザーを用い
た場合でも、図8に示すように、層厚Tをもつ各硬化物
層の間に不要硬化物6cの厚さtに相当する所定の根入
れ深さを与えることができるので、層間剥離を防止でき
るという意味では好ましいと言える。In this way, considering the necessity of fixing the layers of the laminated cured products to each other with a predetermined depth of penetration, even when the ultraviolet laser having a shallow curing depth is used, as shown in FIG. As shown in FIG. 5, a predetermined depth of penetration corresponding to the thickness t of the unnecessary cured product 6c can be provided between the cured product layers having the layer thickness T, which is preferable in the sense that delamination can be prevented. Can be said.
【0015】しかしながら、従来の規制液面方式の光造
形法では、図6及び図8に示したように、予め樹脂造形
槽1内に貯留された所定の容量の樹脂2によって順次硬
化物層4,5,6を成形していくので、前記のような外
縁5aが引っ込んだ前層5の下に、外縁6aが前層5よ
りも突出した次層6をもつデザインの積層造形物を成形
する場合には、外縁6aが前層5よりも突出した次層突
出部6bの上面に造形槽内の樹脂3aが存在していて、
この部分の樹脂3aに光が照射される限り、硬化深度の
浅い紫外線レーザーを用いたとしても、前記次層突出部
6bの上面に前記の厚さtに相当する不要硬化物6cの
発生することを避けることができず、これが造形不良の
原因となるという致命的欠陥を有している。However, in the conventional regulated liquid surface type optical molding method, as shown in FIGS. 6 and 8, a cured material layer 4 is sequentially formed by a predetermined volume of the resin 2 previously stored in the resin molding tank 1. , 5, 6 are formed, a layered product having a design having the next layer 6 in which the outer edge 6a projects more than the front layer 5 is formed under the front layer 5 in which the outer edge 5a is retracted as described above. In this case, the resin 3a in the molding tank is present on the upper surface of the next layer protruding portion 6b having the outer edge 6a protruding more than the front layer 5,
As long as the resin 3a in this portion is irradiated with light, an unnecessary cured product 6c corresponding to the thickness t is generated on the upper surface of the next layer protruding portion 6b even if an ultraviolet laser having a shallow curing depth is used. Inevitably, there is a fatal defect that causes defective modeling.
【0016】[0016]
【課題を解決するための手段】本発明は、従来における
上記のような光造形法の問題点に鑑み、規制液面方式に
より所定の層厚からなる積層硬化物層を成形する目的
で、外縁が引っ込んだ前層の下に、外縁が前層よりも突
出した次層を成形する際に、次層突出部の上面に光照射
装置による硬化深度に伴った不要硬化物を発生すること
なく、所望の三次元的積層造形物を成形することのでき
る光造形装置の提供を目的としたものである。SUMMARY OF THE INVENTION In view of the problems of the conventional stereolithography method as described above, the present invention provides an outer edge for the purpose of forming a laminated cured product layer having a predetermined layer thickness by a regulated liquid level method. Under the retracted front layer, when molding the next layer whose outer edge protrudes more than the front layer, without generating an unnecessary cured product along with the curing depth by the light irradiation device on the upper surface of the next layer protrusion, The object is to provide an optical modeling apparatus capable of molding a desired three-dimensional layered product.
【0017】本発明の光造形装置は、上記の目的を達成
するための具体的な手段として、底面が透明プレートか
らなる光硬化性樹脂を貯留した樹脂造形槽の下方に、前
記光硬化性樹脂を硬化するための水平及び垂直方向に対
して移動可能な光照射装置を備え、前記樹脂造形槽の上
方には、造形物を積層固着するための造形ベースプレー
トを備えた規制液面方式による光造形装置において、前
記樹脂造形槽に、積層造形物の層厚に相当する分量の光
硬化性樹脂を前記造形槽内へ均一に供給するための樹脂
の供給及び回収用循環装置と、樹脂液面のスキマー装置
とを設けたことを特徴とする。As a concrete means for achieving the above-mentioned object, the stereolithography apparatus of the present invention has the photocurable resin below the resin molding tank in which the photocurable resin having a transparent bottom plate is stored. A stereolithography by a regulated liquid level method, which includes a light irradiation device that is movable in the horizontal and vertical directions for curing the resin, and a molding base plate for stacking and fixing the molded object above the resin molding tank. In the apparatus, in the resin molding tank, a resin supply and recovery circulation device for uniformly supplying a photocurable resin in an amount corresponding to the layer thickness of the layered molded article into the molding tank, and a resin liquid level A skimmer device is provided.
【0018】[0018]
【作用】この発明に係る光造形装置は、樹脂造形槽に設
けた樹脂の供給及び回収用循環装置と、樹脂液面のスキ
ーマー装置とによって、樹脂造形槽における透明プレー
トの上面に、積層造形物を構成する一層分の硬化物層に
相当する分量の光硬化性樹脂を、安定して供給すること
ができるので、外縁が引っ込んだ前層の下に、外縁が前
層よりも突出した次層を成形する際に、次層突出部の上
面を樹脂の存在しない空間として、下方からの光照射装
置による硬化作用を受けても次層突出部の上面に不要硬
化物が発生することがなく、従って、積層造形物を構成
する各層の硬化物層を常に安定した精度のある厚みに成
形することができる。The stereolithography apparatus according to the present invention is a laminated molding product on the upper surface of the transparent plate in the resin molding tank by the circulation device for supplying and collecting resin provided in the resin molding tank and the schema device for the resin liquid level. Since it is possible to stably supply the photocurable resin in an amount corresponding to one layer of the cured product layer, the outer layer protrudes below the front layer and the outer layer protrudes from the front layer. At the time of molding, as the upper surface of the next layer protrusion is a space where no resin exists, an unnecessary cured product does not occur on the upper surface of the next layer protrusion even when subjected to a curing action by a light irradiation device from below, Therefore, it is possible to always form the cured product layer of each layer constituting the layered product to a stable and accurate thickness.
【0019】[0019]
【実施例】次に、本発明に係る光造形装置の構成を、図
面に示した実施例について説明すると、図1に示すよう
に、樹脂造形槽11は、周辺が樋状の樹脂回収溝14に
よって囲まれた、深さのあまり大きくない比較的浅い皿
形で、底面が透明ガラス等の透明プレート12からなっ
ており、この樹脂造形槽11の下側に、該造形槽内の光
硬化性樹脂13に光エネルギーを照射するための光照射
装置15が、コンピュータ16の制御によってX,Y,
Z軸方向に対して移動可能な駆動装置17を介して設け
られ、更に、前記光硬化性樹脂13の液面には、前記コ
ンピュータ16の制御によって上下方向に移動可能な、
ガラス板等からなる造形ベースプレート18が配置され
ている。EXAMPLE Next, the structure of the optical molding apparatus according to the present invention will be described with reference to the example shown in the drawing. As shown in FIG. 1, the resin molding tank 11 has a gutter-shaped resin recovery groove 14 around its periphery. It has a relatively shallow dish shape surrounded by a relatively small depth, and has a transparent plate 12 such as transparent glass on the bottom surface. Under the resin molding tank 11, a photocurable resin in the molding tank is provided. A light irradiator 15 for irradiating the resin 13 with light energy is controlled by the computer 16 so that X, Y,
It is provided via a drive device 17 that is movable in the Z-axis direction, and further, the liquid surface of the photocurable resin 13 can be moved in the vertical direction by the control of the computer 16.
A modeling base plate 18 made of a glass plate or the like is arranged.
【0020】また、前記樹脂造形槽11における前記透
明プレート12の周囲を形成する周縁部19は、後に述
べる樹脂硬化物層20の厚さに相当する高さに調整され
ており、これら周縁部19の上縁に、前記樹脂造形層1
1の一方側から他方側にかけて移動することにより、造
形槽11内に供給充填される光硬化性樹脂13の表面を
均一に均すためのスキマー装置22が設けられており、
更に、前記樹脂造形槽11には、該造形槽の周囲に設け
られる前記樋状の樹脂回収溝14によって、光硬化性樹
脂13を造形槽11の内外へ供給したり回収するための
循環装置21が設けられている。Further, the peripheral edge portion 19 which forms the periphery of the transparent plate 12 in the resin molding tank 11 is adjusted to a height corresponding to the thickness of the cured resin layer 20 described later, and these peripheral edge portions 19 are formed. The resin molding layer 1 on the upper edge of
A skimmer device 22 for uniformly leveling the surface of the photocurable resin 13 that is supplied and filled in the modeling tank 11 by moving from one side to the other side of 1 is provided.
Further, in the resin molding tank 11, the gutter-shaped resin recovery groove 14 provided around the molding tank is used to supply and recover the photocurable resin 13 into and out of the molding tank 11. Is provided.
【0021】前記樹脂の供給及び回収用循環装置21
は、樹脂造形槽11の周辺を形成する周縁部19と一体
をなす前記樹脂回収溝14と、前記スキマー装置22の
作動により、樹脂造形槽11内から前記樹脂回収溝14
内に流入した樹脂13を、回路24を介して樹脂造形槽
11の外部にいったん貯留しておくための樹脂循環槽2
3と、前記樹脂回収溝14内の樹脂13を前記樹脂循環
槽23へ送り込み、かつ、前記樹脂循環槽23内の樹脂
13を供給ノズル26を介して再び前記樹脂造形槽11
内へ送り出すための循環ポンプ25とからなっている。Circulating device 21 for supplying and recovering the resin
Is operated by the skimmer device 22 and the resin recovery groove 14 that is integral with the peripheral edge portion 19 that forms the periphery of the resin molding tank 11, and the resin recovery groove 14 is removed from the inside of the resin molding tank 11 by the operation of the skimmer device 22.
A resin circulating tank 2 for temporarily storing the resin 13 flowing into the outside of the resin modeling tank 11 via a circuit 24.
3 and the resin 13 in the resin recovery groove 14 are sent to the resin circulation tank 23, and the resin 13 in the resin circulation tank 23 is again supplied to the resin molding tank 11 via the supply nozzle 26.
It is composed of a circulation pump 25 for feeding inward.
【0022】また、前記スキマー装置22は、樹脂造形
槽11の側面と平行に配置された駆動モータ27により
回転するベルト28と、このベルト28に連結されて、
造形槽11の周縁部19上に接触しながら該造形槽11
の一方側から他方側へ移動して、前記樹脂循環槽23か
ら造形槽11内に供給される樹脂13の余分な量を周囲
の樹脂回収溝14内へ排出して、造形槽10内の樹脂1
2を常に造形槽周縁部19の高さと一致させるための均
し板29とからなっている。The skimmer device 22 is connected to the belt 28, which is rotated by a drive motor 27 arranged in parallel with the side surface of the resin molding tank 11 and is connected to the belt 28.
The molding tank 11 is in contact with the peripheral portion 19 of the molding tank 11
Moving from one side to the other side, the surplus amount of the resin 13 supplied from the resin circulation tank 23 into the modeling tank 11 is discharged into the surrounding resin recovery groove 14, and the resin inside the molding tank 10 is discharged. 1
2 and a leveling plate 29 for always matching the height of the peripheral portion 19 of the modeling tank.
【0023】図3は、前記スキマー装置の別の実施例を
示している。この実施例のスキマー装置30は、樹脂造
形槽11の周縁部19上に接触しながら該造形槽11の
一方側から他方側へ移動する均し板31の前方に、ブラ
ケット33を介して下縁が透明プレート12の上面と接
触するような排液板32を一体的に取り付けると共に、
前記均し板31には前記樹脂循環槽23から送られる樹
脂13を、この均し板31と前記排液板32との間から
造形槽11内に供給するための樹脂供給ノズル34が設
けられている。FIG. 3 shows another embodiment of the skimmer device. The skimmer device 30 of this embodiment has a lower edge via a bracket 33 in front of a leveling plate 31 that moves from one side to the other side of the modeling tank 11 while contacting the peripheral portion 19 of the resin modeling tank 11. The drainage plate 32 is integrally attached so that the liquid comes in contact with the upper surface of the transparent plate 12, and
The leveling plate 31 is provided with a resin supply nozzle 34 for supplying the resin 13 sent from the resin circulation tank 23 into the modeling tank 11 from between the leveling plate 31 and the drainage plate 32. ing.
【0024】このスキマー装置30では、所定の硬化物
層の成形が終了した時点で、均し板31と排液板32と
を矢印の方向へ移動すると、排液板32が造形槽11内
に残された樹脂13を全て樹脂回収溝14内へ排出す
る。その間に後方の均し板31に取り付けられた樹脂供
給ノズル34より新しい樹脂13が造形槽11内へ補給
され、この補給された樹脂13の余剰分が均し板31に
より樹脂回収溝14内へ排出され、造形槽11内の樹脂
を適量に維持する。In this skimmer device 30, when the leveling plate 31 and the drainage plate 32 are moved in the direction of the arrow at the time when the formation of a predetermined hardened material layer is completed, the drainage plate 32 is placed in the molding tank 11. All the remaining resin 13 is discharged into the resin recovery groove 14. Meanwhile, new resin 13 is replenished into the molding tank 11 from the resin supply nozzle 34 attached to the rear leveling plate 31, and the surplus amount of the replenished resin 13 is fed into the resin recovery groove 14 by the leveling plate 31. The resin in the molding tank 11 is discharged and maintained in an appropriate amount.
【0025】この光造形装置による積層硬化物の成形工
程を説明すると、図4aに示すように、造形槽11内の
透明プレート12の上に樹脂13が供給されて、前記ス
キマー装置22もしくは30により、樹脂13の表面が
造形槽周縁部19の高さと一致する位置に整えられる
と、造形槽11内に積層造形物の積層ステップの一層分
に相当する樹脂13が貯えられたことになるので、この
樹脂13の液面に造形ベースプレート18を接触させ
て、造形槽11の下方の光照射装置15より透明プレー
ト12を通して光エネルギーを照射し、第一層目の硬化
物層20aを成形する。The molding process of the laminated cured product by this optical modeling apparatus will be described. As shown in FIG. 4A, the resin 13 is supplied onto the transparent plate 12 in the modeling tank 11, and the skimmer device 22 or 30 is used. When the surface of the resin 13 is adjusted to a position that matches the height of the peripheral portion 19 of the modeling tank, the resin 13 corresponding to one layer of the layering step of the layered model is stored in the modeling tank 11, The molding base plate 18 is brought into contact with the liquid surface of the resin 13, and light energy is irradiated from the light irradiation device 15 below the molding tank 11 through the transparent plate 12 to form the first cured product layer 20a.
【0026】このようにして、硬化物層20aが成形さ
れたのち、図4bのように、前記造形ベースプレート1
8をスキマー装置22の走行に支障のない位置まで上昇
退避させる。目的とする硬化物層20aが成形される
と、造形槽11内の樹脂13は硬化物槽20aに相当す
る体積分が消費されるので、造形槽11内に新しい樹脂
13を補給する。After the hardened material layer 20a is molded in this manner, as shown in FIG. 4b, the molding base plate 1 is formed.
8 is raised and retracted to a position where there is no hindrance to traveling of the skimmer device 22. When the desired hardened material layer 20a is molded, the resin 13 in the modeling tank 11 consumes the volume corresponding to the hardened material tank 20a. Therefore, new resin 13 is replenished in the modeling tank 11.
【0027】造形槽11内に新しい樹脂13を補給する
際には、第一層目の硬化物層20aが成形された後の残
された樹脂13の上に新しい樹脂13を補給するように
してもよいが、その際、例えば図3に示したスキマー装
置30を用いて、槽内に残された樹脂13をいったん全
て槽外に排出し、槽内の樹脂13を全て新しい樹脂13
に置き換えてやることが好ましい。When the new resin 13 is replenished into the molding tank 11, the new resin 13 is replenished on the resin 13 remaining after the first cured product layer 20a is molded. However, at that time, for example, by using the skimmer device 30 shown in FIG. 3, all the resin 13 remaining in the tank is once discharged to the outside of the tank, and the resin 13 in the tank is entirely replaced with the new resin 13
It is preferable to replace with.
【0028】その理由は、目的とする硬化物層20aが
成形された後に残された樹脂13というのは、多少なり
ともレーザー光に被曝されて硬くなっているために、こ
の古い樹脂13の上に新しい樹脂13が補給されると、
新旧の樹脂に粘度の差異を生ずることとなり、その状態
で光を照射して次の硬化物層を成形した場合に好ましく
ない硬化条件を与えることになるからである。The reason is that the resin 13 left after the desired cured material layer 20a is molded is hardened by being exposed to a laser beam to some extent, so that the resin 13 on the old resin 13 is hardened. When new resin 13 is supplied to
This is because a difference in viscosity is caused between the old resin and the new resin, and unfavorable curing conditions are given when the next cured product layer is molded by irradiating light in that state.
【0029】図4cのように、造形槽11内に新しい樹
脂13を補給する際には、造形槽周縁部19よりも高く
なるように供給し、次いで前記のようにスキマー装置の
均し板29により余剰樹脂を排出したのち、図4dのよ
うに、造形ベースプレート18を下降して既設硬化物層
20aを樹脂13の液面に接触させ、次の硬化物層20
bを積層成形する。以下前記と同様な工程を繰り返すこ
とにより、図4eのように、既設硬化物層20bの下面
に次の硬化物層20cを積層成形する。As shown in FIG. 4c, when the new resin 13 is replenished in the molding tank 11, the resin 13 is supplied so as to be higher than the peripheral portion 19 of the molding tank, and then the leveling plate 29 of the skimmer device as described above. After discharging the surplus resin by, the modeling base plate 18 is lowered to bring the existing cured material layer 20a into contact with the liquid surface of the resin 13 as shown in FIG.
b is laminated. By repeating the same steps as described above, the next cured product layer 20c is laminated on the lower surface of the existing cured product layer 20b as shown in FIG. 4e.
【0030】[0030]
【発明の効果】以上に述べたように、本発明に係る光造
形装置は、造形槽内の樹脂をスキマー装置によって造形
槽周縁部と同じ高さに均した状態で造形ベースプレート
もしくは既設硬化物層をこの樹脂液面に接触させ、底面
の透明プレートを通して、造形ベースプレートもしくは
既設硬化物層と透明プレートとの間の樹脂に下方から光
を照射するので、成形される各積層ステップの形状とし
て、図5のように、外縁5aが引っ込んだ前層20bの
下に、外縁6aが前層20bよりも突出した次層20c
を成形するような場合でも、次層突出部6bの上面に樹
脂が存在しない空間とすることができ、従って、下方か
らの光照射装置による硬化作用を受けても次層突出部6
bの上面に不要硬化物が発生することがなく、光照射装
置の硬化深度に影響を受けない造形を実現することが可
能となり、この種の光造形装置の実用的可能性を高める
ことができる。As described above, the optical modeling apparatus according to the present invention has the modeling base plate or the existing hardened material layer in which the resin in the modeling tank is leveled with the skimmer device to the same height as the peripheral portion of the modeling tank. The resin between the molding base plate or the existing cured product layer and the transparent plate is irradiated with light from below through the transparent plate on the bottom surface, so that the shape of each lamination step to be formed is as shown in FIG. 5, the outer layer 5a is below the front layer 20b, and the outer layer 6a is below the front layer 20b.
Even in the case of molding, the upper surface of the next layer projecting portion 6b can be a space where no resin exists, and therefore, even if the next layer projecting portion 6b is cured by the light irradiation device from below.
It is possible to realize modeling that is not affected by the curing depth of the light irradiation device without generating an unnecessary cured product on the upper surface of b, and it is possible to increase the practical possibility of this type of optical modeling device. .
【0031】また、光照射装置による露光量が過大にな
っても過深度硬化や、樹脂の滞留等に起因する樹脂の相
互近接硬化による造形不良を抑止することができと共
に、容量の小さい樹脂造形槽とすることができるので、
槽内に供給する樹脂を常に造形物の成形に必要な量だけ
とし、余剰樹脂は循環装置により絶えず槽内に供給でき
るので、造形作業を円滑に能率よく行うことができると
いう効果を有する。Further, even if the amount of exposure by the light irradiation device becomes excessive, it is possible to prevent excessive depth hardening and molding defects due to mutual proximity hardening of the resin due to resin retention and the like, and at the same time, molding of resin with a small capacity is possible. Because it can be a tank,
The amount of resin to be supplied into the tank is always limited to the amount necessary for molding the molded article, and the surplus resin can be continuously supplied into the tank by the circulation device, so that there is an effect that the molding operation can be smoothly and efficiently performed.
【図1】本発明に係る光造形装置の構成を示す一部欠切
正面斜視図。FIG. 1 is a partially cutaway front perspective view showing a configuration of a stereolithography apparatus according to the present invention.
【図2】図1の光造形装置の構成を示す断面図。FIG. 2 is a cross-sectional view showing the configuration of the stereolithography apparatus of FIG.
【図3】スキーマー装置の別の実施例を示す断面図。FIG. 3 is a cross-sectional view showing another embodiment of the schema device.
【図4】本発明の光造形装置による硬化物層の成形工程
を示す説明図。FIG. 4 is an explanatory view showing a molding step of a cured product layer by the stereolithography apparatus of the present invention.
【図5】本発明の光造形装置による硬化物層の成形状態
を示す部分断面図。FIG. 5 is a partial cross-sectional view showing a molded state of a cured product layer by the stereolithography apparatus of the present invention.
【図6】従来の光造形法の一例を示す断面図。FIG. 6 is a sectional view showing an example of a conventional stereolithography method.
【図7】光照射装置として紫外線レーザーを使用した場
合と半導体レーザーを使用した場合における光硬化性樹
脂の硬化プロフィールの相違を示す説明図。FIG. 7 is an explanatory diagram showing a difference in curing profile of a photocurable resin when an ultraviolet laser is used as a light irradiation device and when a semiconductor laser is used.
【図8】図6の光造形法を紫外線レーザーで行った場合
の硬化物層の部分拡大図。FIG. 8 is a partially enlarged view of a cured product layer when the stereolithography method of FIG. 6 is performed with an ultraviolet laser.
【図9】図6の光造形法を半導体レーザーで行った場合
の硬化物層の部分拡大図。FIG. 9 is a partially enlarged view of a cured product layer when the stereolithography method of FIG. 6 is performed with a semiconductor laser.
11:樹脂造形槽 12:透明プレート 13:光硬化性樹脂 14:樹脂回収溝 15:光照射装置 16:コンピュータ 17:駆動装置 18:造形ベースプ
レート 19:造形槽周縁部 20a,20b,20c:硬化物層 21:循環装置 22:スキマー装置 23:樹脂循環槽 24:回路 25:循環ポンプ 26:供給ノズル 27:駆動モータ 28:ベルト 29:均し板 30:スキーマー装
置 31:均し板 32:排液板 33:ブラケット 34:供給ノズル11: Resin modeling tank 12: Transparent plate 13: Photocurable resin 14: Resin recovery groove 15: Light irradiation device 16: Computer 17: Driving device 18: Modeling base plate 19: Modeling tank peripheral part 20a, 20b, 20c: Hardened material Layer 21: Circulation device 22: Skimmer device 23: Resin circulation tank 24: Circuit 25: Circulation pump 26: Supply nozzle 27: Drive motor 28: Belt 29: Leveling plate 30: Schematic device 31: Leveling plate 32: Drainage Plate 33: Bracket 34: Supply nozzle
Claims (4)
脂を貯留した樹脂造形槽の下方に、前記光硬化性樹脂を
硬化するための水平及び垂直方向に対して移動可能な光
照射装置を備え、前記樹脂造形槽の上方には、造形物を
積層固着するための造形ベースプレートを備えた規制液
面方式による光造形装置において、前記樹脂造形槽に、
積層造形物の層厚に相当する分量の光硬化性樹脂を前記
造形槽内へ均一に供給するための樹脂の供給及び回収用
循環装置と、樹脂液面のスキマー装置とを設けたことを
特徴とする光造形装置。1. A light irradiation device for curing the photocurable resin, which is movable in horizontal and vertical directions, is provided below a resin molding tank having a bottom surface made of a transparent plate and storing the photocurable resin. , Above the resin modeling tank, in the optical modeling apparatus by the regulated liquid surface method, which comprises a modeling base plate for stacking and fixing the molded article, in the resin modeling tank,
A circulation device for supplying and collecting a resin for uniformly supplying the photocurable resin in an amount corresponding to the layer thickness of the layered model into the modeling tank, and a skimmer device for the resin liquid surface are provided. Stereolithography device.
造形槽の周囲に設けられた樹脂回収溝と、回収された樹
脂を貯留するための樹脂循環槽と、前記樹脂回収溝の樹
脂を前記樹脂循環槽へ送り、かつ、前記樹脂循環槽内の
樹脂を前記樹脂回収溝へ送るための循環ポンプとからな
っている請求項1の光造形装置。2. A circulating device for supplying and collecting the resin,
A resin recovery groove provided around the molding tank, a resin circulation tank for storing the recovered resin, a resin in the resin recovery groove is sent to the resin circulation tank, and a resin in the resin circulation tank The stereolithography apparatus according to claim 1, further comprising a circulation pump for sending the resin to the resin recovery groove.
に接触して槽の一方側から他方側へ移動される均し板
と、造形槽の外部側面に配置された前記均し板を駆動す
るための駆動装置とからなっている請求項1の光造形装
置。3. The leveling plate, wherein the skimmer device is in contact with the peripheral portion of the modeling tank and is moved from one side to the other side of the modeling tank, and the leveling plate disposed on an outer side surface of the modeling tank. The stereolithography apparatus according to claim 1, comprising a driving device for driving.
造形した後に透明プレート上に残った不要樹脂を排除す
るための排液板と、造形槽内へ次層造形用の樹脂を供給
するためのノズルと、前記ノズルより供給された樹脂の
液面を造形槽の周縁部の高さと同じ面に均すための均し
板とからなっている請求項1の光造形装置。4. The skimmer device supplies a drain plate for removing unnecessary resin remaining on the transparent plate after forming the front layer in the forming tank, and a resin for forming the next layer into the forming tank. The stereolithography apparatus according to claim 1, further comprising: a nozzle for smoothing and a leveling plate for smoothing the liquid level of the resin supplied from the nozzle to the same level as the height of the peripheral portion of the modeling tank.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP5170934A JPH0790603B2 (en) | 1993-06-18 | 1993-06-18 | Stereolithography device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP5170934A JPH0790603B2 (en) | 1993-06-18 | 1993-06-18 | Stereolithography device |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH071594A JPH071594A (en) | 1995-01-06 |
JPH0790603B2 true JPH0790603B2 (en) | 1995-10-04 |
Family
ID=15914081
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP5170934A Expired - Fee Related JPH0790603B2 (en) | 1993-06-18 | 1993-06-18 | Stereolithography device |
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JP (1) | JPH0790603B2 (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2013015518A1 (en) * | 2011-07-28 | 2013-01-31 | 주식회사 씨에이텍 | Visible light scan-type, low-cost, high-speed molding apparatus using an lcd mask |
EP2699408B1 (en) | 2011-04-20 | 2016-12-14 | Dws S.R.L. | Method for producing a three-dimensional object |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8623264B2 (en) * | 2008-10-20 | 2014-01-07 | Ivoclar Vivadent Ag | Device and method for processing light-polymerizable material for building up an object in layers |
US20180200946A1 (en) * | 2015-07-15 | 2018-07-19 | Stichting Energieonderzoek Centrum Nederland | Method and apparatus for forming thin layers of slurries for additive manufacturing |
CN109016506A (en) * | 2017-06-08 | 2018-12-18 | 扬明光学股份有限公司 | Three-dimensional printing device |
WO2019130734A1 (en) * | 2017-12-25 | 2019-07-04 | コニカミノルタ株式会社 | Three-dimensional shaping device and three-dimensional shaped article manufacturing method |
JP2019123181A (en) * | 2018-01-18 | 2019-07-25 | 株式会社ミマキエンジニアリング | Three-dimensional fabrication apparatus |
-
1993
- 1993-06-18 JP JP5170934A patent/JPH0790603B2/en not_active Expired - Fee Related
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP2699408B1 (en) | 2011-04-20 | 2016-12-14 | Dws S.R.L. | Method for producing a three-dimensional object |
WO2013015518A1 (en) * | 2011-07-28 | 2013-01-31 | 주식회사 씨에이텍 | Visible light scan-type, low-cost, high-speed molding apparatus using an lcd mask |
KR101238340B1 (en) * | 2011-07-28 | 2013-03-04 | 박인백 | Rapid prototyping using beam-scanning by visible light |
Also Published As
Publication number | Publication date |
---|---|
JPH071594A (en) | 1995-01-06 |
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