JPH078962U - Connection structure between circuit boards - Google Patents

Connection structure between circuit boards

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Publication number
JPH078962U
JPH078962U JP3900193U JP3900193U JPH078962U JP H078962 U JPH078962 U JP H078962U JP 3900193 U JP3900193 U JP 3900193U JP 3900193 U JP3900193 U JP 3900193U JP H078962 U JPH078962 U JP H078962U
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JP
Japan
Prior art keywords
circuit boards
connection structure
circuit board
pattern
connection
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP3900193U
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Japanese (ja)
Other versions
JP2602952Y2 (en
Inventor
隆一 寺本
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Japan Aviation Electronics Industry Ltd
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Japan Aviation Electronics Industry Ltd
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Publication date
Application filed by Japan Aviation Electronics Industry Ltd filed Critical Japan Aviation Electronics Industry Ltd
Priority to JP3900193U priority Critical patent/JP2602952Y2/en
Publication of JPH078962U publication Critical patent/JPH078962U/en
Application granted granted Critical
Publication of JP2602952Y2 publication Critical patent/JP2602952Y2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Abstract

(57)【要約】 【目的】 接続に際して位置決めの許容範囲に余裕があ
り、しかも簡単に製造し得る回路基板相互間の接続構造
を提供すること。 【構成】 互いに接続される一対の回路基板に形成され
たパターン2,2´上にその延在方向に対してそれぞれ
斜めに延び,且つパターン2,2´を横断する微細な導
体線31,31´を設け、各回路基板の接続時に導体線
31,31´が交差して押し付け接触されるようにして
いる。
(57) [Abstract] [Purpose] To provide a connection structure between circuit boards, which has a margin in a positioning allowable range for connection and can be easily manufactured. [Structure] Fine conductor lines 31, 31 extending obliquely with respect to the extending direction of the patterns 2, 2'formed on a pair of circuit boards connected to each other and crossing the patterns 2, 2 '. ′ Is provided so that the conductor lines 31 and 31 ′ intersect and are pressed against each other when connecting the circuit boards.

Description

【考案の詳細な説明】[Detailed description of the device]

【0001】[0001]

【産業上の利用分野】[Industrial applications]

本考案は、電気回路基板同士が相互に接続された回路基板相互間の接続構造に 関する。 The present invention relates to a connection structure between circuit boards in which electric circuit boards are connected to each other.

【0002】[0002]

【従来の技術】[Prior art]

従来、一方の回路基板を他方の回路基板に接続する接続構造には、高接触圧な 接続を低操作力で行い得ることが要求される。このような接続構造としては、例 えば図7に示す如く、一方の回路基板1のパターン2上に、2次的加工にてメッ キやエッチング等の製法により導電性の突出部(バンプ)4を形成し、この突出 部4を他方の回路基板1のパターン2における接続端子と一致させて押し付ける ことにより、両回路基板を接続するものがある。 Conventionally, a connection structure for connecting one circuit board to the other circuit board is required to be capable of performing connection with high contact pressure with low operating force. As such a connection structure, for example, as shown in FIG. 7, conductive protrusions (bumps) 4 are formed on the pattern 2 of one circuit board 1 by a manufacturing method such as plating or etching by secondary processing. There is a method in which both circuit boards are connected by forming a protrusion and pressing the protrusion 4 so as to match the connection terminal in the pattern 2 of the other circuit board 1.

【0003】 この接続構造の場合、押し付けた力が突出部4に集中するため、高接触圧を得 ることができる。この結果、突出部4が接続端子の表面の酸化物被膜を破り、回 路基板同士に良好な電気的接続を与える。In the case of this connection structure, since the pressing force is concentrated on the protrusion 4, a high contact pressure can be obtained. As a result, the protrusion 4 breaks the oxide film on the surface of the connection terminal, and provides good electrical connection between the circuit boards.

【0004】[0004]

【考案が解決しようとする課題】[Problems to be solved by the device]

上述した接続構造の場合、一方の回路基板の突出部を他方の回路基板の接続端 子と一致させて接続を行うため、接続に際して接続端子の線幅分の許容範囲が許 され、その線幅方向の位置決めに高精度が要求されるという欠点がある。又、一 方の回路基板にはパターン形成後、突出部をそのパターン上に2次的加工によっ て設けなければならず、製造工程の増加によってコストがアップされてしまうと いう問題もある。 In the case of the connection structure described above, since the connection is made by aligning the protruding part of one circuit board with the connection terminal of the other circuit board, an allowable range for the line width of the connection terminal is allowed at the time of connection. There is a drawback that high accuracy is required for directional positioning. Further, there is also a problem that after forming a pattern on one of the circuit boards, the projecting portion must be provided on the pattern by secondary processing, resulting in an increase in cost due to an increase in manufacturing steps.

【0005】 本考案は、かかる問題点を解決すべくなされたもので、その技術的課題は、接 続に際して位置決めの許容範囲に余裕があり、しかも簡単に製造し得る回路基板 相互間の接続構造を提供することにある。The present invention has been made in order to solve such a problem, and its technical problem is that there is a margin in a positioning allowable range at the time of connection, and a connection structure between circuit boards which can be easily manufactured. To provide.

【0006】[0006]

【課題を解決するための手段】[Means for Solving the Problems]

本考案によれば、第1の接続端子が設けられた第1の回路基板と、第2の接続 端子が設けられた第2の回路基板とを互いに接続した回路基板相互間の接続構造 において、第1及び第2の接続端子は、互いに交差されて接続された回路基板相 互間の接続構造が得られる。 According to the present invention, in a connection structure between circuit boards in which a first circuit board having a first connection terminal and a second circuit board having a second connection terminal are connected to each other, The first and second connection terminals have a connection structure in which the circuit boards are connected to each other by intersecting each other.

【0007】 又、本考案によれば、上記回路基板相互間の接続構造において、第1の接続端 子は第1の回路基板上のパターン上に形成された第1の導体線であり、第2の接 続端子は第2の回路基板上のパターン上に形成された第2の導体線であり、第1 及び第2の導体線は互いに交差し、且つ押し付け接触された回路基板相互間の接 続構造が得られる。According to the present invention, in the connection structure between the circuit boards, the first connection terminal is a first conductor wire formed on a pattern on the first circuit board, The second connection terminal is a second conductor wire formed on the pattern on the second circuit board, and the first and second conductor wires intersect each other and are between the circuit boards pressed and contacted with each other. A connection structure is obtained.

【0008】 更に、本考案によれば、上記回路基板相互間の接続構造において、第1の接続 端子は第1の回路基板上のパターン先端に結合された第1の導体線であり、第2 の接続端子は第2の回路基板上のパターン先端に結合された第2の導体線であり 、第1及び第2の導体線は互いに交差し、且つ押し付け接触された回路基板相互 間の接続構造が得られる。Further, according to the present invention, in the connection structure between the circuit boards, the first connection terminal is the first conductor wire coupled to the tip of the pattern on the first circuit board, and the second Is a second conductor wire coupled to the tip of the pattern on the second circuit board, and the first and second conductor wires intersect each other and the connection structure between the circuit boards pressed and contacted with each other. Is obtained.

【0009】 加えて、本考案によれば、上記回路基板相互間の接続構造において、第1の接 続端子は、第1の回路基板上のパターン上に形成された第1の導体線であり、第 2の接続端子は、第2の回路基板上のパターン先端に結合された第2の導体線で あり、第1及び第2の導体線は互いに交差し、且つ押し付け接触された回路基板 相互間の接続構造が得られる。In addition, according to the present invention, in the connection structure between circuit boards, the first connection terminal is a first conductor wire formed on a pattern on the first circuit board. , The second connection terminal is a second conductor wire coupled to the tip of the pattern on the second circuit board, and the first and second conductor wires intersect each other and are pressed and contacted to each other. A connection structure between them is obtained.

【0010】 又、本考案によれば、上記何れかの回路基板相互間の接続構造において、パタ ーンは所定方向に延びており、第1及び第2の導体線のうちの少なくとも一方は 前記所定方向に対して斜めに延びた回路基板相互間の接続構造が得られる。Further, according to the present invention, in any one of the above-described circuit board interconnection structures, the pattern extends in a predetermined direction, and at least one of the first and second conductor lines has the above-mentioned structure. A connection structure between circuit boards that extends obliquely with respect to a predetermined direction can be obtained.

【0011】[0011]

【実施例】【Example】

以下に実施例を挙げ、本考案の回路基板相互間の接続構造について、図面を参 照して詳細に説明する。 Hereinafter, the connection structure between circuit boards of the present invention will be described in detail with reference to the drawings by way of examples.

【0012】 図1は、本考案の一実施例に係る回路基板相互間の接続構造における要部構成 を斜視図により示したものである。この接続構造では、第1の回路基板1上に電 気回路を成す複数の導電性のパターン2が設けられ、その上に保護層5が設けら れている。これらのパターン2は、互いに離間し,それぞれが回路基板1の長手 方向に平行な所定方向に延びている。各パターン2の所定方向での一端は回路基 板1の端面近傍に位置している。各パターン2の他端近傍部分には、それぞれ図 示の如く第1の接続端子としての微細な第1の導体線31が所定方向に対して斜 め方向に,しかもパターン2を横断して形成されている。ここで導体線31は、 全て同一方向に揃うように形成されている。FIG. 1 is a perspective view showing a configuration of a main part of a connection structure between circuit boards according to an embodiment of the present invention. In this connection structure, a plurality of conductive patterns 2 forming an electric circuit are provided on the first circuit board 1, and a protective layer 5 is provided thereon. These patterns 2 are separated from each other and extend in a predetermined direction parallel to the longitudinal direction of the circuit board 1. One end of each pattern 2 in a predetermined direction is located near the end face of the circuit board 1. In the vicinity of the other end of each pattern 2, as shown in the figure, a fine first conductor wire 31 as a first connecting terminal is formed obliquely to a predetermined direction and across the pattern 2. Has been done. Here, the conductor wires 31 are all formed so as to be aligned in the same direction.

【0013】 又、第1の回路基板1と接続される第2の回路基板1´にも同様に複数のパタ ーン2´が設けられ、その上に保護層5´が設けられている。これらのパターン 2´の他端近傍部分には、第1の導体線31と交差する第2の接続端子としての 微細な第2の導体線31´が所定方向に対して斜め方向に,しかもパターン2´ を横断して形成されている。Also, a plurality of patterns 2'is similarly provided on the second circuit board 1'connected to the first circuit board 1, and a protective layer 5'is provided thereon. In the vicinity of the other end of these patterns 2 ', a fine second conductor wire 31' as a second connecting terminal intersecting the first conductor wire 31 is formed diagonally with respect to a predetermined direction, and moreover, in a pattern. It is formed across 2 '.

【0014】 次に、このような構成の第1の回路基板1及び第2の回路基板1´の接続につ いて、図2及び図3を参照して説明する。但し、各図共便宜上、回路基板を省略 し、パターンのみの接続について説明する。Next, the connection between the first circuit board 1 and the second circuit board 1 ′ having such a configuration will be described with reference to FIGS. 2 and 3. However, for the sake of convenience in each drawing, the circuit board will be omitted and only the connection of the patterns will be described.

【0015】 先ず、図2を参照すれば、第1の回路基板1のパターン2上には第1の導体線 31が設けられ、第2の回路基板1´のパターン2´上には第1の導体線31´ が設けられている。ここで、各回路基板の端面同士をパターン2,2´が向き合 わうように突き合わせると、下側に位置された回路基板1のパターン2の導体線 31と、上側に位置された回路基板1´のパターン2´の導体線31´とが交差 されて接触される。そこで、両回路基板1,1´を相対的に近接すべく、一方の 回路基板を他方の回路基板側へ押圧すると、図3に示す如く両パターン2,2´ 上の導体線31,31´が相互に押し付けられて通電接触状態となる。この状態 でパターン2,2´の幅方向やその延在方向に多少の位置ずれがあっても、導体 線31,31´が向き合っていれば必ず通電接触される。従って、位置ずれを許 容し得る範囲が大きくなる。First, referring to FIG. 2, a first conductor line 31 is provided on the pattern 2 of the first circuit board 1 and a first conductor line 31 is provided on the pattern 2'of the second circuit board 1 '. Of the conductor wire 31 '. Here, when the end faces of each circuit board are butted so that the patterns 2 and 2 ′ face each other, the conductor wire 31 of the pattern 2 of the circuit board 1 located on the lower side and the circuit located on the upper side. The conductor line 31 'of the pattern 2'of the substrate 1'is crossed and brought into contact with it. Therefore, when one circuit board is pressed toward the other circuit board side so that the two circuit boards 1 and 1'are relatively close to each other, as shown in FIG. Are pressed against each other to be in a conductive contact state. In this state, even if there is a slight positional deviation in the width direction of the patterns 2 and 2'and the extending direction thereof, the conductor wires 31 and 31 'are always energized and contacted if they face each other. Therefore, the range in which the positional deviation can be tolerated increases.

【0016】 この通電接触の許容範囲を図2に基づいて具体的に説明する。先ず、パターン 2,2´同士のパターン幅方向における位置ずれは、導体線31のパターン端面 側における先端31aと導体線31´のパターン側面部に位置する端部31b´ とが接触する点から導体線31と導体線31´のパターン端面側における先端3 1a´とが接触する点までの距離,即ち、パターン2幅方向の距離L1の約2倍 の距離の範囲で許容される。The permissible range of this energizing contact will be specifically described with reference to FIG. First, the misalignment between the patterns 2 and 2'in the pattern width direction is caused by the fact that the tip 31a on the pattern end face side of the conductor wire 31 and the end 31b 'located on the pattern side face part of the conductor wire 31' come into contact with each other. The distance to the point where the line 31 and the tip 31a 'of the conductor wire 31' on the pattern end face side contact each other, that is, a range of about twice the distance L1 in the width direction of the pattern 2 is allowed.

【0017】 次に、パターン2の延在方向における位置ずれ許容範囲について説明する。こ の場合は、両パターン2,2´における導体線31,31´の各先端31a,3 1a´同士が相互に接触する点から端部31b,31b´同士が接触する点まで の距離,即ち、導体線31のパターン2の延在方向に沿った方向における距離L 2の約2倍の距離が位置ずれ許容範囲となる。Next, the positional deviation allowable range in the extending direction of the pattern 2 will be described. In this case, the distance from the point where the tips 31a, 31a 'of the conductor wires 31, 31' in both patterns 2, 2'contact each other to the point where the ends 31b, 31b 'contact each other, that is, The distance that is about twice the distance L 2 in the direction along the extending direction of the pattern 2 of the conductor wire 31 is the positional deviation allowable range.

【0018】 因みに、ここでの通電接触は通常或る程度の位置決め精度を管理した条件下で 行われるので、上述した最大許容範囲のような極端な位置ずれを生じるような場 合は殆ど無視できる。又、実際の位置ずれはパターン2,2´の延在方向や幅方 向だけに存在するものではなく、これらを合成した方向においても生じるが、こ うした場合にも距離L1,L2を掛け合わせた領域が許容領域となるので、位置 ずれ許容範囲を拡大することができる。Incidentally, the energization contact here is usually performed under the condition that the positioning accuracy is controlled to some extent, and therefore, in the case where an extreme positional deviation such as the above-mentioned maximum allowable range occurs, it can be almost ignored. . Further, the actual positional deviation does not exist only in the extending direction and the width direction of the patterns 2 and 2 ', but also in the direction in which these patterns are combined. In such a case, the distances L1 and L2 are also multiplied. Since the combined area becomes the allowable area, the positional deviation allowable range can be expanded.

【0019】 次に、図4を参照して本考案の他の実施例について説明する。この回路基板相 互間の接続構造は、先の実施例のものと比較すると、導体線31,31´をそれ ぞれパターン2,2´上に形成する代わりに、図示の如くパターン2,2´の先 端に導体線32,32´を結合させて設けている。Next, another embodiment of the present invention will be described with reference to FIG. The connection structure between the circuit board and the circuit board according to the present embodiment is different from that of the previous embodiment in that instead of forming the conductor lines 31 and 31 'on the patterns 2 and 2', respectively, as shown in the figure, the patterns 2 and 2'are formed. The conductor wires 32, 32 'are connected to the front end of the ???

【0020】 この実施例の場合、各回路基板1,1´のパターン2,2´から延在する導体 線32,32´をそれぞれ図5に示す如く交差するように対向させ、図6に示す 如く導体線32,32´を押圧して通電接触するものである。この場合も、先の 実施例と同様に位置ずれ許容範囲を拡大して確実な接続を行うことができる。In the case of this embodiment, the conductor lines 32 and 32 'extending from the patterns 2 and 2'of the circuit boards 1 and 1'are made to face each other so as to cross each other as shown in FIG. As described above, the conductor wires 32, 32 'are pressed to make an electric contact. In this case as well, as in the previous embodiment, the positional deviation allowable range can be expanded to ensure reliable connection.

【0021】 尚、上述した各実施例においては、導体線31,31´と導体線32,32´ との配置方向をそれぞれ同一にした場合を示したが、導体線は各回路基板1,1 ´の接続を行う際にそれぞれが交差された状態になれば良いので、これらの方向 を交互に反対向きとなるように変更することもできる。In each of the above-described embodiments, the conductor lines 31, 31 ′ and the conductor lines 32, 32 ′ are arranged in the same arranging direction. Since it suffices that the two intersect when they are connected, it is possible to change these directions alternately to the opposite directions.

【0022】 更に、本考案の回路基板相互間の接続構造では、上述した各実施例を組み合わ せた構成,即ち、一方の回路基板のパターン上に第1の導体線を形成すると共に 、他方の回路基板のパターンの先端に第2の導体線を結合して設けておき、これ らの第1及び第2の導体線が互いに交差するように押し付け接触される構成とす ることもできる。Further, in the connection structure between the circuit boards of the present invention, a configuration combining the above-described embodiments, that is, the first conductor line is formed on the pattern of one circuit board, and the other one is formed. It is also possible that the second conductor wire is provided so as to be coupled to the tip of the pattern of the circuit board, and the first and second conductor wires are pressed and contacted so as to intersect with each other.

【0023】[0023]

【考案の効果】[Effect of device]

以上に述べた通り、本考案の回路基板相互間の接続構造によれば、回路基板相 互に設けた微細な導体線(接続端子)同士が互いに交差された状態で押し付け接 触されることによって回路基板相互間の接続が図られるので、位置ずれ許容範囲 を拡大した上で高接触圧な接続を低操作力で確実に行い得るようになる。又、パ ターン先端に導体線を設けているので、この場合には導体線を回路基板に対する パターンを形成工程にて同時に形成できるため、製造時の工程数が短縮され、低 コスト化を実現できるという長所がある。 As described above, according to the connection structure between the circuit boards of the present invention, the fine conductor wires (connection terminals) provided on the circuit boards are pressed and contacted while crossing each other. Since the circuit boards can be connected to each other, the positional deviation allowable range can be expanded, and the connection with high contact pressure can be reliably performed with a low operating force. Further, since the conductor wire is provided at the tip of the pattern, in this case, the conductor wire can be simultaneously formed in the step of forming the pattern for the circuit board, so that the number of manufacturing steps can be shortened and the cost can be reduced. There is an advantage called.

【図面の簡単な説明】[Brief description of drawings]

【図1】本考案の一実施例に係る回路基板相互間の接続
構造における要部構成を示した斜視図である。
FIG. 1 is a perspective view showing a main configuration of a connection structure between circuit boards according to an embodiment of the present invention.

【図2】図1に示す接続構造における接続前の各回路基
板相互の位置関係を示した斜視図である。
FIG. 2 is a perspective view showing a positional relationship between circuit boards before connection in the connection structure shown in FIG.

【図3】図1に示す接続構造における接続後の各回路基
板相互の位置関係を示した斜視図である。
3 is a perspective view showing a positional relationship between the circuit boards after connection in the connection structure shown in FIG.

【図4】本考案の他の実施例に係る回路基板相互間の接
続構造における要部構成を示した斜視図である。
FIG. 4 is a perspective view showing a configuration of a main part of a connection structure between circuit boards according to another embodiment of the present invention.

【図5】図4に示す接続構造における接続前の各回路基
板相互の位置関係を示した斜視図である。
5 is a perspective view showing a positional relationship between the circuit boards before connection in the connection structure shown in FIG.

【図6】図4に示す接続構造における接続後の各回路基
板相互の位置関係を示した斜視図である。
6 is a perspective view showing a positional relationship between the circuit boards after connection in the connection structure shown in FIG.

【図7】従来の回路基板相互間の接続構造における要部
構成を示した側面図である。
FIG. 7 is a side view showing a configuration of a main part of a conventional connection structure between circuit boards.

【符号の説明】[Explanation of symbols]

1,1´ 回路基板 2,2´ パターン 4 突出部 5,5´ 保護層 31,31´,32,32´ 導体線 1, 1'Circuit board 2, 2'Pattern 4 Projection part 5, 5'Protective layer 31, 31 ', 32, 32' Conductor wire

Claims (5)

【実用新案登録請求の範囲】[Scope of utility model registration request] 【請求項1】 第1の接続端子が設けられた第1の回路
基板と、第2の接続端子が設けられた第2の回路基板と
を互いに接続した回路基板相互間の接続構造において、
前記第1及び第2の接続端子は、互いに交差されて接続
されたことを特徴とする回路基板相互間の接続構造。
1. A connection structure between circuit boards in which a first circuit board provided with a first connection terminal and a second circuit board provided with a second connection terminal are connected to each other,
The connection structure between circuit boards, wherein the first and second connection terminals are crossed and connected to each other.
【請求項2】 請求項1記載の回路基板相互間の接続構
造において、前記第1の接続端子は前記第1の回路基板
上のパターン上に形成された第1の導体線であり、前記
第2の接続端子は前記第2の回路基板上のパターン上に
形成された第2の導体線であり、前記第1及び第2の導
体線は互いに交差し、且つ押し付け接触されたことを特
徴とする回路基板相互間の接続構造。
2. The connection structure between circuit boards according to claim 1, wherein the first connection terminal is a first conductor wire formed on a pattern on the first circuit board, The second connection terminal is a second conductor wire formed on a pattern on the second circuit board, and the first and second conductor wires intersect each other and are pressed and contacted with each other. Connection structure between circuit boards.
【請求項3】 請求項1記載の回路基板相互間の接続構
造において、前記第1の接続端子は前記第1の回路基板
上のパターン先端に結合された第1の導体線であり、前
記第2の接続端子は前記第2の回路基板上のパターン先
端に結合された第2の導体線であり、前記第1及び第2
の導体線は互いに交差し、且つ押し付け接触されたこと
を特徴とする回路基板相互間の接続構造。
3. The connection structure between circuit boards according to claim 1, wherein the first connection terminal is a first conductor wire coupled to a tip of a pattern on the first circuit board, The second connecting terminal is a second conductor wire coupled to the tip of the pattern on the second circuit board, and includes the first and second connecting wires.
The connecting structure between the circuit boards is characterized in that the conductor wires of are crossed and pressed against each other.
【請求項4】 請求項1記載の回路基板相互間の接続構
造において、前記第1の接続端子は、前記第1の回路基
板上のパターン上に形成された第1の導体線であり、前
記第2の接続端子は、前記第2の回路基板上のパターン
先端に結合された第2の導体線であり、前記第1及び第
2の導体線は互いに交差し、且つ押し付け接触されたこ
とを特徴とする回路基板相互間の接続構造。
4. The connection structure between circuit boards according to claim 1, wherein the first connection terminal is a first conductor line formed on a pattern on the first circuit board, The second connection terminal is a second conductor wire connected to the tip of the pattern on the second circuit board, and the first and second conductor wires intersect each other and are pressed and contacted. The characteristic connection structure between circuit boards.
【請求項5】 請求項1〜4の何れかに記載の回路基板
相互間の接続構造において、前記パターンは所定方向に
延びており、前記第1及び第2の導体線のうちの少なく
とも一方は前記所定方向に対して斜めに延びていること
を特徴とする回路基板相互間の接続構造。
5. The connection structure between circuit boards according to claim 1, wherein the pattern extends in a predetermined direction, and at least one of the first and second conductor lines is formed. A connection structure between circuit boards, wherein the connection structure extends obliquely with respect to the predetermined direction.
JP3900193U 1993-07-16 1993-07-16 Connection structure between circuit boards Expired - Fee Related JP2602952Y2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP3900193U JP2602952Y2 (en) 1993-07-16 1993-07-16 Connection structure between circuit boards

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP3900193U JP2602952Y2 (en) 1993-07-16 1993-07-16 Connection structure between circuit boards

Publications (2)

Publication Number Publication Date
JPH078962U true JPH078962U (en) 1995-02-07
JP2602952Y2 JP2602952Y2 (en) 2000-02-07

Family

ID=12540892

Family Applications (1)

Application Number Title Priority Date Filing Date
JP3900193U Expired - Fee Related JP2602952Y2 (en) 1993-07-16 1993-07-16 Connection structure between circuit boards

Country Status (1)

Country Link
JP (1) JP2602952Y2 (en)

Also Published As

Publication number Publication date
JP2602952Y2 (en) 2000-02-07

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