JPH0126122Y2 - - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION This invention relates to a lead connecting device for connecting leads on a substrate to leads on another substrate in order to lead the leads to the outside.

For example, as shown in FIG. 1, a plurality of leads 2 patterned on the surface of a substrate 1 such as ceramic are connected to leads 4 of another substrate 3 such as flexible wire leads in order to lead them out to the outside. There are things to do. For this connection, apply solder to the surfaces of leads 2 and 4 in advance.
Both substrates 1 and 3 are placed one on top of the other so that their respective leads 2 and 4 are in contact with each other, and are soldered by applying heat and pressure. By this soldering, both leads 2 and 4 are mechanically coupled to each other and electrically connected.

By the way, as described above, since both the substrates 1 and 3 are positioned so that the leads 2 and 4 face each other, the solder attached to the surfaces of the leads 2 and 4 also face each other.
Therefore, if both solders are pressed while facing each other, slippage may occur at the contact points between the solders, resulting in misalignment. If such a misalignment occurs, the alignment of the substrates 1 and 3 will be disrupted, making it impossible to correctly solder the leads 2 and 4 together.

The purpose of this invention is to prevent the occurrence of displacement between solders due to pressure applied during soldering.

An embodiment of this invention will be explained with reference to FIG. 2 and subsequent figures. Note that parts with the same reference numerals as in FIG. 1 refer to the same or corresponding parts. As can be understood from FIG. 2, in this invention, at least one of the plurality of leads provided on the substrate 1 (specifically, if each lead has a different width, the lead with the widest width is preferable). ), lead portions 2a and 2b are formed on both sides of the lead 2A, leaving a space 5 at the center of its width. That is, the lead 2A is patterned so that such a void 5 is formed.

When solder is attached to the surfaces of the leads 2 and 2A having such a shape, the leads 2 and 2A are shaped as shown in FIG.
Solder 6 is attached to the surface of lead 2A.
Regarding the lead parts 2a and 2b on both sides of the empty space 5
Solder 7a, 7b comes to be attached to the surface of. On the other hand, the leads 4 of the substrate 3 are formed so as to face the leads 2, but the leads 4A facing the leads 2A are formed so as to face each other between the lead portions 2a and 2b. FIG. 4 shows this positional relationship, and FIG. 5 shows the state in which they are overlapped for soldering. In Figure 5, 8 is lead 4.
9 shows the solder on the surface of the lead 4A.

If both substrates 1 and 3 are now faced to each other as shown in FIG. 5, the solders 6 and 8 will be faced to each other, but the solder 9 will be faced between the solders 7a and 7b. If both substrates 1 and 3 are pressurized here, the solder 9 will fit between the solders 7a and 7b, and its movement from side to side will be restrained. That is, positional displacement due to slippage between the solders 9, 7a, and 7b is thereby prevented. By preventing the solders 9, 7a, and 7b from misaligning in this way, slipping between the other solders 6 and 8 is also prevented, and thus all solders are prevented from slipping and therefore from misaligning. This allows the alignment of each lead to be maintained with high precision.

Note that the amount of solder attached to a lead increases depending on the width of the lead. Therefore, substrates 1 and 3
When pressurizing the comrades, a large amount of solder adhered to the
The lead may be pushed by the solder attached to the opposite lead, causing it to shift significantly in the lateral direction, and this may come into contact with another adjacent lead or the solder attached to its surface, resulting in a short circuit. However, if the wide lead 2A is divided into lead parts 2a and 2b, the amount of solder 7a and 7b that adheres to these surfaces will be smaller than the amount that would adhere when the lead 2A was not divided. Therefore, short circuits with adjacent leads can be sufficiently prevented, which is convenient.

As described in detail above, this invention has the effect of reliably preventing misalignment of the leads due to slippage of the solders when soldering the leads of each board together.

In the illustrated embodiment, lead portions 2a and 2b are formed for lead 2A, but these lead portions may be formed for another lead. Further, in the figure, the lead portions 2a and 2b are again bridged at their tips, but instead of this, they may be opened without being bridged. Also, one lead portion may be separated from the other lead portion. Furthermore, although the lead portion is formed for the lead 2A of the substrate 1, it may be formed for the lead 4 of another substrate 3.

[Brief explanation of the drawing]

Fig. 1 is a perspective view of the conventional example, Fig. 2 is a plan view of the board according to this invention, Fig. 3 is a cross-sectional view of the same, Fig. 4 is a plan view showing the positional relationship between both boards, and Fig. 5 is the same cross-section. It is a diagram. 1, 3... Board, 2, 2A, 4... Lead, 2
a, 2b...lead part, 5...blank space, 6,7
a, 7b, 8, 9...Solder.

Claims (1)

[Scope of utility model registration request] Connecting leads that are arranged in parallel on the surface of a board and leads that are arranged in parallel on the surface of another board at the same pitch as the leads using solder applied to the lead surface. In the lead connection device, at least one lead on one board is made wider than the other leads and divided into lead parts leaving a space in the center, and the lead on the other board is made wider than the other leads. A lead connecting device that is fitted into a cavity and stacked on the one substrate.