JPH0786469A - Electronic part - Google Patents

Abstract

PURPOSE:To provide an electronic part capable of avoiding degrading the radiation power by reducing the thermal resistance in a connecting member for connecting a semiconductor chip to a wiring layer. CONSTITUTION:It comprises an Si or ceramic substrate 5, wiring layer 4 composed of an insulator and conductor formed on the substrate, thermal-conductor- made columnar members (thermal via-holes) 7 piercing the layer 4, and semiconductor chip 1 secured through a mounting member 2 to the layer 4. Thermally conductive members 8 are disposed near the ends of the thermal via-holes 7 in the member 2.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic component such as a multi-chip module having a cooling function.

[0002]

2. Description of the Related Art A multi-chip module is one of the methods for obtaining a high-speed and high-density circuit module. FIG. 8 is a schematic diagram showing an example of a multi-chip module. In this module, a plurality of semiconductor elements 1 are mounted in a package having a silicon or ceramic substrate 5 as a main structure, and wiring between each element is a wiring layer 4 including an insulator and a conductor.
This is done by A surface of the substrate 5 on which the semiconductor element 1 is mounted is sealed by a cap 15, and a heat radiation fin 12 is provided on a surface facing the cap 15.

From a thermal standpoint, when a low thermal conductivity material such as polyimide is used for the insulator that occupies most of the wiring layer 4, the resistance against heat transfer from the semiconductor element 1 to the substrate 5 increases, and It becomes necessary to take heat dissipation measures.

As a measure against such heat radiation, as shown in FIG. 9, a fine columnar member 7 made of a material having high thermal conductivity is used.
Attempts have been made to form a heat passage from the semiconductor element 1 to the substrate 5 by providing a thermal via 7 (hereinafter referred to as a thermal via) so as to penetrate the inside of the wiring layer 4.

However, as shown in FIG. 10, the heat flow generated in the semiconductor element 1 contracts and expands before and after the thermal via 7, so that the heat resistance accompanying this increases the heat dissipation performance. In particular, in the process in which the heat flow generated in the semiconductor element 1 is reduced to reach the thermal via 7, the thermal conductivity of the mount material 2 which is a joining member for joining the semiconductor element 1 to the surface of the wiring layer 4 is Since it is small, there is a problem that the thermal resistance generated by the reduction of the heat flow inside the mount material 2 becomes large. In addition, the semiconductor device 1
When air bubbles are generated inside the mount material 2 when mounting, the heat radiation performance is further deteriorated.

[0006]

As described above, in a conventional electronic component such as a multi-chip module having a thermal via penetrating the inside of a wiring layer, a mount for joining each semiconductor element to the wiring layer. Inside the material, the heat flow generated in the semiconductor element 1 is reduced to increase the thermal resistance in the process of reaching the thermal via 7 and the heat radiation performance is deteriorated. There is a problem that the heat dissipation performance is further deteriorated when bubbles are generated.

The present invention has been made in order to solve such a problem, and provides an electronic component capable of preventing the deterioration of the heat radiation performance by reducing the thermal resistance inside the mount material. With the goal.

[0008]

To achieve the above object, in the present invention, a substrate, a wiring layer made of an insulator and a conductor formed on the substrate, and a wiring layer penetrating the wiring layer are provided. An electronic component comprising a columnar member made of a heat conductive material and a semiconductor element bonded on the wiring layer via a bonding member, wherein the thermal conductivity is provided near the columnar member inside the bonding member. Provided is an electronic component, which is provided with a member.

[0009]

According to the present invention having the above-described structure, by providing the heat conductive member in the vicinity of the end of the thermal via inside the bonding member, when the semiconductor element is bonded, the heat conductive member and the semiconductor element are separated from each other. Since it is possible to reduce the thickness of the joining member interposed in the semiconductor element, the reduction of the heat flow generated in the semiconductor element does not occur inside the joining member but in the semiconductor element 1
Since it occurs in the inside of the, it is possible to reduce the above-mentioned thermal resistance. Further, according to the above-mentioned configuration, even when bubbles are generated inside the joining member, the influence of the bubbles on heat passage can be reduced.

[0010]

Embodiments of the present invention will now be described in detail with reference to the drawings. FIG. 1 is a sectional view of an essential part showing a first embodiment of an electronic component according to the present invention. A semiconductor element 1 that generates heat is bonded to a die pad 3 on the surface of a wiring layer 4 formed on a silicon or ceramic substrate 5 by a mount material 2 that is a bonding member. Here, the wiring layer 4 is composed of an insulator and a conductor (not shown). Since a material having low thermal conductivity such as polyimide is used for the insulator that occupies most of the wiring layer, it becomes an obstacle when the heat generated in the semiconductor element 1 is transferred to the substrate 5. Therefore, in order to promote heat transfer between the semiconductor element 1 and the substrate 5,
A thermal via 7 which is a fine columnar member penetrating the wiring layer 4 is provided. The thermal via 7 needs to be formed of a material having high thermal conductivity, and is often made of the same material as the conductor (for example, copper) in the wiring layer 4.

By providing the thermal vias 7, the wiring layer 4 can be provided with a place where heat easily passes and a place where heat does not easily pass. Therefore, above and below the wiring layer 4, as shown in FIG. 10, the heat flow contracts and expands, which causes thermal resistance. This thermal resistance becomes smaller as the heat transfer coefficient of the material in the portion where the above-mentioned contraction and expansion of heat occurs becomes higher. Therefore, the substrate 5 made of silicon or ceramic has a relatively small thermal resistance. On the other hand, since the mount material 2 is made of an epoxy-based or polyimide-based resin material, a material having a thermal conductivity that is nearly two orders of magnitude lower than that of the semiconductor element 1 is generally used. Therefore, the thermal resistance when the heat flow generated in the mount material 2 is reduced is increased.

In order to reduce the thermal resistance, in the present invention, the thermal conductive member 8 made of a material having high thermal conductivity is provided on the die pad 3 near each end of the thermal via 7. FIG. 2 is an enlarged cross-sectional view of an essential part of the vicinity of the heat conductive member 8. As shown in the figure, the thermally conductive member 8 is provided so as to project inside the mount material 2, so that when the semiconductor element 1 is bonded, the mount material interposed between the thermally conductive member 8 and the semiconductor element 1 is provided. Since the thickness of 2 can be reduced, the reduction of the heat flow generated in the semiconductor element 1 occurs not inside the mount material 2 but inside the semiconductor element 1. It is possible to reduce the amount. Further, according to the above-described configuration, even when bubbles are generated inside the mount material 2, the influence of the bubbles on the heat passage can be reduced.

FIG. 3 shows another embodiment of the above-mentioned heat conductive member. In this embodiment, the heat conductive member 9 for forming the heat conductive portion 8 is arranged directly on the thermal via 7, and the sheet-shaped die pad 3 is provided thereon. Here, the heat conductive member 9 may be formed integrally with the thermal via 7.

In the first embodiment described above, the heat conductive member may be of any shape as long as it can reduce the thickness of the mount material 2 between the heat conductive member and the semiconductor element 1. However, in order to reduce the thermal resistance due to the reduction of the heat flow, the wider the surface of the heat conductive member 8 facing the semiconductor element 1, the better. However, if it is too wide,
The area where the mount material 2 intervenes becomes small, which may cause a problem in the bonding of the semiconductor element 1. FIG. 4 shows another embodiment relating to the shape of the heat conductive member.
The heat conductive member 8 in this embodiment has a shape in which the surface facing the semiconductor element 1 is wide and the surface on the thermal via 7 side is narrow. With such a shape, a region into which the mount material 2 flows is secured between the heat conductive members 8, so that even if the surface of the heat conductive member 8 facing the semiconductor element 1 is wide, the semiconductor element 1 is bonded. Can be sufficiently performed.

Although not shown, at least one of the heat conductive members 8 may be connected to both the semiconductor element 1 and the thermal via 7. In this case, the heat conductive member 8 connected to both sides is the semiconductor element 1
It may be electrically connected as well as thermally connected to.

FIG. 5 is a sectional view of the essential parts showing a second embodiment of the electronic component according to the present invention. In this embodiment, the thermally conductive member 8 protruding inside the mount material 2 is provided on the semiconductor element 1 side. With this configuration, the same effect as that of the first embodiment can be obtained.

FIG. 6 is a sectional view of the essential parts showing a third embodiment of the electronic component according to the present invention. In this embodiment, a particulate thermal conductive member 10 made of a material having high thermal conductivity such as copper, alumina, and aluminum nitride is provided near the thermal via 7 inside the mount material 2. Here, the heat conductive member 10 is the semiconductor element 1 or the die pad 3
You may contact with. Even with such a configuration, it is possible to obtain the same effects as those of the first and second embodiments described above.

FIG. 7 shows an example of a method for realizing the configuration according to the third embodiment. A sheet in which the particulate heat conducting members 10 are arranged in the thermoplastic resin 11 at the same pitch as the thermal vias 7 or at a pitch that is an integer fraction thereof is sandwiched between the semiconductor element 1 and the die pad 3 and heat is applied. By joining. According to this method, the heat conductive member 10 can be positioned near the end of the thermal via 7. Although the embodiments of the present invention have been described above, the present invention is not limited to these cases, and various modifications can be made without departing from the scope of the invention. Further, in the embodiment, the die pad 3 is provided between the wiring layer 4 and the mount material 2, but the die pad 3 need not be used.

[0019]

As described above, according to the present invention,
By reducing the thermal resistance inside the mount material, which is a joining member that joins the semiconductor element onto the wiring layer provided on the surface of the substrate, it is possible to provide an electronic component that can prevent deterioration of heat dissipation performance. Becomes

[Brief description of drawings]

FIG. 1 is a sectional view of an essential part showing a first embodiment of an electronic component according to the present invention.

FIG. 2 is an enlarged cross-sectional view of an essential part of the vicinity of the heat conductive member of the electronic component according to the present invention.

FIG. 3 is a sectional view of an essential part showing another embodiment of the heat conductive member of the electronic component according to the present invention.

FIG. 4 is a cross-sectional view of essential parts showing another embodiment of the shape of the heat conductive member of the electronic component according to the present invention.

FIG. 5 is a cross-sectional view of essential parts showing a second embodiment of the electronic component according to the present invention.

FIG. 6 is a cross-sectional view of essential parts showing a third embodiment of the electronic component according to the present invention.

FIG. 7 is a diagram showing an example of a method for realizing the configuration according to the third exemplary embodiment of the present invention.

FIG. 8 is a schematic diagram showing an example of a conventional electronic component (multichip module).

FIG. 9 is a main-portion cross-sectional view showing an example of a conventional electronic component (multichip module).

FIG. 10 is an explanatory diagram related to reduction and expansion of heat flow before and after a thermal via.

[Explanation of symbols]

 1 Semiconductor Element 2 Mounting Material (Joining Member) 3 Die Pad 4 Wiring Layer 5 Substrate 7 Sar Via 8, 9, 10 Thermal Conductive Member 11 Thermoplastic Resin 12 Radiating Fin 15 Cap

Claims (1)

[Claims] 1. A substrate, a wiring layer made of an insulator and a conductor formed on the substrate, a columnar member made of a heat conductive material and penetrating the wiring layer, and bonded on the wiring layer. An electronic component comprising a semiconductor element bonded via a member, wherein a heat conductive member is provided near the columnar member inside the bonding member.