JPH0781755A - Substrate holder - Google Patents
Substrate holderInfo
- Publication number
- JPH0781755A JPH0781755A JP5253711A JP25371193A JPH0781755A JP H0781755 A JPH0781755 A JP H0781755A JP 5253711 A JP5253711 A JP 5253711A JP 25371193 A JP25371193 A JP 25371193A JP H0781755 A JPH0781755 A JP H0781755A
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- hand
- suction
- plate
- holding plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70691—Handling of masks or workpieces
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
- G03F7/70858—Environment aspects, e.g. pressure of beam-path gas, temperature
- G03F7/70866—Environment aspects, e.g. pressure of beam-path gas, temperature of mask or workpiece
- G03F7/70875—Temperature, e.g. temperature control of masks or workpieces via control of stage temperature
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Health & Medical Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Atmospheric Sciences (AREA)
- Toxicology (AREA)
- Engineering & Computer Science (AREA)
- Environmental & Geological Engineering (AREA)
- Epidemiology (AREA)
- Public Health (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
- Jigs For Machine Tools (AREA)
- Physical Vapour Deposition (AREA)
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は、半導体露光装置におい
てウエハ等基板を保持する基板保持装置に関するもので
ある。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a substrate holding device for holding a substrate such as a wafer in a semiconductor exposure apparatus.
【０００２】[0002]
【従来の技術】半導体製造のための半導体露光装置は、
露光光に対してウエハ等基板（以下、「基板」とい
う。）を高精度で位置決めするための位置決めステージ
を有し、該位置決めステージは、真空吸着力によって基
板を吸着する保持盤と、これを移動させる公知のＸＹス
テージの駆動機構や微動位置決め機構等を備えている。2. Description of the Related Art A semiconductor exposure apparatus for manufacturing semiconductors is
A positioning stage for positioning a substrate such as a wafer (hereinafter, referred to as “substrate”) with high accuracy with respect to exposure light is provided, and the positioning stage includes a holding plate that sucks the substrate by a vacuum suction force, and a holding plate that holds the substrate. It is provided with a known XY stage drive mechanism for moving and a fine movement positioning mechanism.
【０００３】図４は荷電粒子蓄積リング放射光を露光光
とするＸ線露光装置に用いる縦型の位置決めステージを
示すもので、これは、図示しないＸＹステージ駆動機構
によって移動される台板１０３と、台板１０３に支持さ
れた保持盤１０１と、台板１０３上において保持盤１０
１の微動位置決めを行う図示しない微動位置決め機構
と、台板１０３と一体的に設けられたＬ形ミラー１０４
と、それぞれ、Ｌ形ミラー１０４の反射面にレーザ光を
照射してその反射光を受光する測長用の一対のレーザ干
渉計１０５，１０６を有し、保持盤１０１はハンド１０
２によって搬入された基板Ｗ0 を真空吸着力によって吸
着する。また、ＸＹステージ駆動機構と微動位置決め機
構はそれぞれ所定の指令信号に基づいて台板１０３およ
び保持盤１０１を移動させ、台板１０３の移動量はレー
ザ干渉計１０５，１０６によってモニタされ、ＸＹステ
ージ駆動機構に負帰還される。FIG. 4 shows a vertical positioning stage used in an X-ray exposure apparatus which uses charged particle storage ring radiation as exposure light. It has a base plate 103 which is moved by an XY stage drive mechanism (not shown). The holding plate 101 supported by the base plate 103 and the holding plate 10 on the base plate 103.
A fine movement positioning mechanism (not shown) for performing fine movement positioning of No. 1 and an L-shaped mirror 104 provided integrally with the base plate 103.
And a pair of laser interferometers 105 and 106 for measuring the length of the L-shaped mirror 104 which irradiate the reflecting surface with laser light and receive the reflected light.
The substrate W 0 carried in by 2 is adsorbed by the vacuum adsorption force. Further, the XY stage drive mechanism and the fine movement positioning mechanism respectively move the base plate 103 and the holding plate 101 on the basis of a predetermined command signal, and the movement amount of the base plate 103 is monitored by the laser interferometers 105 and 106 to drive the XY stage. Negative feedback to the mechanism.
【０００４】ハンド１０２は、図５に示すように、円弧
状の支持部１２１を有し、支持部１２１には吸着溝１２
１ａが設けられ、図示しない排気ラインによって吸着溝
１２１ａに発生する真空吸着力によって基板Ｗ0 の外周
縁に沿った環状部分の一部を吸着するように構成されて
いる。図示しないハンド駆動体によって図５の（ａ）に
示すように保持盤１０１の前面に近接する位置に搬入さ
れた基板Ｗ0 は、保持盤１０１の吸着面に向かって移動
され、図５の（ｂ）に示すように、保持盤１０１の真空
吸着力によってその吸着面に吸着される。ハンド１０２
の真空吸着力を解除したうえで、図５の（ｃ）に示すよ
うに、保持盤１０１に吸着された基板Ｗ0 の裏面に沿っ
てハンド１０２を後退させる。As shown in FIG. 5, the hand 102 has an arcuate support portion 121, and the support portion 121 has a suction groove 12 therein.
1a is provided, and is configured to suck a part of the annular portion along the outer peripheral edge of the substrate W 0 by the vacuum suction force generated in the suction groove 121a by an exhaust line (not shown). As shown in FIG. 5A, the substrate W 0 carried into the position close to the front surface of the holding board 101 by the hand driving body (not shown) is moved toward the suction surface of the holding board 101, and the substrate W 0 shown in FIG. As shown in b), the suction surface is sucked by the vacuum suction force of the holding plate 101. Hand 102
After releasing the vacuum suction force of No. 2, as shown in FIG. 5C, the hand 102 is retracted along the back surface of the substrate W 0 sucked by the holding plate 101.
【０００５】また、保持盤の吸着面の寸法と基板の寸法
がほぼ同じかまたは保持盤の吸着面の方が大きい場合に
は、基板をハンドに吸着させたまま保持盤に吸着させる
ことができない。そこで、ハンドによって保持盤の前面
に近接する位置に搬入された基板を、保持盤の吸着面に
設けられた複数の孔からそれぞれ突出する受渡しピンの
先端に吸着させたうえでハンドを後退させ、続いて、保
持盤の吸着面に真空吸着力を発生させるとともに、各受
渡しピンを保持盤の吸着面の孔へ後退させるように構成
された位置決めステージを用いる。Further, when the size of the suction surface of the holding plate and the size of the substrate are substantially the same or the size of the holding surface of the holding plate is larger, the substrate cannot be sucked by the holding plate while being sucked by the hand. . Therefore, the substrate carried in the position close to the front surface of the holding board by the hand is sucked onto the tips of the transfer pins protruding from the plurality of holes provided on the suction surface of the holding board, and then the hand is retracted, Subsequently, a positioning stage configured to generate a vacuum suction force on the suction surface of the holding plate and to retract each delivery pin to the hole on the suction surface of the holding plate is used.
【０００６】いずれの場合でも、特に荷電粒子蓄積リン
グ放射光を露光光とする露光装置においては、露光光が
高エネルギーであるために基板の温度が上昇し、熱膨張
によって転写ずれを発生する傾向があり、基板の露光中
は、保持盤の内部に温調流媒を循環させて吸着面を冷却
するのが一般的である。In any case, particularly in an exposure apparatus using the charged particle storage ring radiation as the exposure light, the exposure light has a high energy, so that the temperature of the substrate rises and a transfer deviation tends to occur due to thermal expansion. Therefore, during exposure of the substrate, it is common to circulate a temperature control medium inside the holding plate to cool the adsorption surface.
【０００７】[0007]
【発明が解決しようとする課題】しかしながら上記従来
の技術によれば、基板の寸法が保持盤の吸着面の寸法よ
り大きい場合には、保持盤の内部を流動する温調流媒に
よる冷却効果が基板の外周縁に及ばないために局部的な
温度差が発生し、基板が変形するおそれがある。また、
保持盤の吸着面から突出する受渡しピンによって基板の
受渡しを行うように構成されている場合も、受渡しピン
を後退させる孔のために保持盤の吸着面と基板の接触面
が中断され、局部的な温度差が発生するおそれがある。
さらに、このように基板が保持盤と接触しない部分の比
率が大きいと、基板を堅固に支持することが難しく、局
部的な剛性不足によって基板が変形し、転写ずれを発生
するおそれもある。However, according to the above-mentioned conventional technique, when the size of the substrate is larger than the size of the adsorption surface of the holding plate, the cooling effect of the temperature control medium flowing inside the holding plate is reduced. Since the temperature does not reach the outer peripheral edge of the substrate, a local temperature difference may occur and the substrate may be deformed. Also,
Even when the board is configured to be delivered by the delivery pin protruding from the suction surface of the holding board, the suction surface of the holding board and the contact surface of the board are interrupted due to the hole for retracting the delivery pin, which causes local Temperature difference may occur.
Further, when the ratio of the portion where the substrate does not come into contact with the holding plate is large as described above, it is difficult to firmly support the substrate, and the substrate may be deformed due to lack of local rigidity and transfer misalignment may occur.
【０００８】本発明は、上記従来の技術の有する問題点
に鑑みてなされたものであり、露光中の基板に局部的な
温度差が発生するのを防ぐことができるうえに、基板全
体を堅固に支持することのできる基板保持装置を提供す
ることを目的とするものである。The present invention has been made in view of the above-mentioned problems of the prior art, and it is possible to prevent a local temperature difference from being generated on the substrate during exposure and to firmly fix the entire substrate. It is an object of the present invention to provide a substrate holding device that can be supported on a substrate.
【０００９】[0009]
【課題を解決するための手段】上記目的を達成するため
に本発明の基板保持装置は、互に合体および分離自在で
ある第１および第２の吸着板を有し、前記第２の吸着板
が前記第１の吸着板に向って基板を搬送する搬送手段で
あり、前記第１の吸着板が、前記第２の吸着板と合体し
たときにこれとともに前記基板を保持するように構成さ
れていることを特徴とする。In order to achieve the above object, a substrate holding device of the present invention has first and second suction plates which can be combined and separated from each other, and the second suction plate. Is a transporting means for transporting the substrate toward the first suction plate, and is configured to hold the substrate together with the first suction plate when the first suction plate is combined with the second suction plate. It is characterized by being
【００１０】第１の吸着板が第２の吸着板を収容する浅
溝を備えているとよい。The first suction plate preferably has a shallow groove for accommodating the second suction plate.
【００１１】また、第１および第２の吸着板のそれぞれ
が温調流媒を流動させる内部配管を備えているとよい。Further, it is preferable that each of the first and second adsorption plates is provided with an internal pipe through which the temperature control flow medium is caused to flow.
【００１２】[0012]
【作用】基板の一部分を第２の吸着板によって吸着させ
て第１の吸着板の吸着面に搬送し、第２の吸着板を第１
の吸着板に合体させるとともに基板の他の部分を第１の
吸着板に吸着させる。基板の全面が第１および第２の吸
着板に吸着されるため基板全体を堅固に支持し、局部的
な剛性不足によって基板が変形するおそれがない。第１
および第２の吸着板のそれぞれが温調流媒を流動させる
内部配管を備えていれば、露光中の基板に局部的な温度
差が発生するのを防ぐことができる。The part of the substrate is adsorbed by the second adsorption plate and conveyed to the adsorption surface of the first adsorption plate, and the second adsorption plate is moved to the first adsorption plate.
And the other part of the substrate is adsorbed to the first adsorption plate. Since the entire surface of the substrate is adsorbed by the first and second adsorption plates, the entire substrate is firmly supported, and there is no possibility that the substrate will be deformed due to insufficient local rigidity. First
If each of the second adsorption plate and the second adsorption plate is provided with an internal pipe for flowing the temperature control flow medium, it is possible to prevent a local temperature difference from occurring on the substrate during exposure.
【００１３】[0013]
【実施例】本発明の実施例を図面に基づいて説明する。Embodiments of the present invention will be described with reference to the drawings.
【００１４】図１は一実施例を示す模式立面図であっ
て、本実施例の基板保持装置は、公知のＸＹステージ駆
動機構および微動位置決め機構によって位置決めされる
第１の吸着板である保持盤１と、駆動手段である駆動部
材２ａに着脱自在に連結された第２の吸着板であるハン
ド２からなり、保持盤１の吸着面１ａには、図２に示す
第１の排気ライン１ｂに連通する吸着溝１ｃと、ハンド
２を収容自在な浅溝であるハンド収容溝１ｄが設けら
れ、また、保持盤１の内部には、吸着面１ａに近接する
位置に内部配管１ｅが設けられ、内部配管１ｅは第１の
温調流媒供給ライン１ｆと第１の温調流媒排出ライン１
ｇに連通している。FIG. 1 is a schematic elevational view showing an embodiment. The substrate holding device of this embodiment is a first suction plate which is positioned by a known XY stage drive mechanism and fine movement positioning mechanism. It is composed of a board 1 and a hand 2 which is a second suction plate which is detachably connected to a driving member 2a which is a driving means. The suction surface 1a of the holding board 1 has a first exhaust line 1b shown in FIG. Is provided with a suction groove 1c communicating with the hand 2 and a hand housing groove 1d which is a shallow groove capable of accommodating the hand 2, and an internal pipe 1e is provided inside the holding plate 1 at a position close to the suction surface 1a. , The internal pipe 1e is the first temperature control flow medium supply line 1f and the first temperature control flow medium discharge line 1
It communicates with g.
【００１５】保持盤１はアルミニウム、チタン、セラミ
ックス、ステンレス等の材料によって作られており、ま
た、ハンド２の材料は、アルミニウム、チタン、セラミ
ックス等から適当なものが選定される。また、保持盤１
のハンド収容溝１ｄの寸法は、ハンド２の外形よりやや
大きく、ハンド２を嵌入させたときにハンド２の周囲に
幅０．５ｍｍ、深さ０．１ｍｍ程度の遊びが残るように
設定されている。The holding plate 1 is made of a material such as aluminum, titanium, ceramics or stainless steel, and the material of the hand 2 is appropriately selected from aluminum, titanium, ceramics or the like. Also, the holding board 1
The size of the hand accommodating groove 1d is slightly larger than the outer shape of the hand 2 and is set so that when the hand 2 is fitted, a play with a width of 0.5 mm and a depth of 0.1 mm remains around the hand 2. There is.
【００１６】ハンド２は二又状の基板支持部２ｂとこれ
と一体である棒状部分２ｃを有し、棒状部分２ｃの自由
端２ｄは駆動部材２ａの溝２ｅに摺動自在に挿入され、
図示しない締着具によって駆動部材２ａと一体化されて
いる。ハンド２の吸着面２ｆには吸着溝２ｇが設けら
れ、吸着溝２ｇは第２の排気ライン２ｈによって排気さ
れる。また、ハンド２の内部にはその吸着面２ｆに近接
する位置に内部配管２ｉが設けられ、該内部配管２ｉは
第２の温調流媒供給ライン２ｊと第２の温調流媒排出ラ
イン２ｋに連通している。The hand 2 has a bifurcated substrate supporting portion 2b and a rod-shaped portion 2c which is integral therewith, and a free end 2d of the rod-shaped portion 2c is slidably inserted into a groove 2e of a driving member 2a.
It is integrated with the driving member 2a by a fastener (not shown). A suction groove 2g is provided on the suction surface 2f of the hand 2, and the suction groove 2g is exhausted by the second exhaust line 2h. In addition, an internal pipe 2i is provided inside the hand 2 at a position close to the adsorption surface 2f, and the internal pipe 2i includes a second temperature control medium supply line 2j and a second temperature control medium discharge line 2k. Is in communication with.
【００１７】なお、第１の排気ライン１ｂと第２の排気
ライン２ｈは個別に制御自在であり、また、第１の温調
流媒供給ライン１ｆおよび第１の温調流媒排出ライン１
ｇと第２の温調流媒供給ライン２ｊおよび第２の温調流
媒排出ライン２ｋもそれぞれ個別に制御自在である。ま
た、駆動部材２ａは図示しない駆動装置によって駆動さ
れ、後述するように、ハンド２を保持盤１の吸着面１ａ
に対向する位置へ搬入し、続いて保持盤１の吸着面１ａ
に向かって移動させ、保持盤１のハンド収容溝１ｄに嵌
入させたのち、ハンド収容溝１ｄ内にハンド２を残して
後退する一連の動作を行うように構成されている。な
お、第２の排気ライン２ｈ、第２の温調流媒供給ライン
２ｊおよび第２の温調流媒排出ライン２ｋは、ハンド２
の移動を容易にするために塩化ビニルやウレタン等の軽
くて柔軟性のある材料で作るのが望ましい。The first exhaust line 1b and the second exhaust line 2h can be individually controlled, and the first temperature control medium supply line 1f and the first temperature control medium discharge line 1 can be controlled.
g, the second temperature control flow medium supply line 2j, and the second temperature control flow medium discharge line 2k can also be individually controlled. Further, the driving member 2a is driven by a driving device (not shown), and the hand 2 holds the suction surface 1a of the holding plate 1 as described later.
To the position opposite to, and then the suction surface 1a of the holding plate 1.
It is configured to perform a series of operations in which the hand 2 is moved toward and is fitted into the hand accommodating groove 1d of the holding plate 1, and then the hand 2 is left in the hand accommodating groove 1d and is retracted. The second exhaust line 2h, the second temperature control flow medium supply line 2j, and the second temperature control flow medium discharge line 2k are connected to the hand 2
It is desirable to use a light and flexible material such as vinyl chloride or urethane to facilitate the transfer of the material.
【００１８】図示しない基板供給装置から基板Ｗ1 を受
取ったハンド２は、前述の駆動装置によって、図３の
（ａ）に示すように、保持盤１の吸着面１ａに対向する
位置へ移動したうえで保持盤１の吸着面１ａに向かって
移動する。続いて、図３の（ｂ）に示すように、ハンド
２が保持盤１のハンド収容溝１ｄに嵌入し、保持盤１の
吸着溝１ｃに第１の排気ライン１ｂによって発生される
真空吸着力によって、基板Ｗ1 が保持盤１の吸着面１ａ
に吸着されるのを確認したうえで、図３の（ｃ）に示す
ようにハンド２を駆動部材２ａから切離す。The hand 2 which has received the substrate W 1 from a substrate supply device (not shown) is moved to a position facing the suction surface 1a of the holding plate 1 by the above-mentioned drive device, as shown in FIG. 3 (a). Then, it moves toward the suction surface 1a of the holding plate 1. Subsequently, as shown in FIG. 3B, the hand 2 is fitted into the hand accommodating groove 1d of the holding plate 1, and the vacuum adsorption force generated by the first exhaust line 1b is generated in the adsorption groove 1c of the holding plate 1. As a result, the substrate W 1 is attached to the suction surface 1a of the holding plate 1.
After confirming that the hand 2 is adsorbed on the hand 2, the hand 2 is separated from the drive member 2a as shown in FIG.
【００１９】保持盤１に吸着された基板Ｗ1 は、図示し
ない光源からマスクを経て照射される露光光によって露
光される。露光中の基板Ｗ1 は、保持盤１の吸着面１ａ
とハンド２の吸着面２ｆに吸着されることでその全体を
堅固に支持されるとともに、保持盤１の内部配管１ｅと
ハンド２の内部配管２ｉをそれぞれ流動する温調流媒に
よって均一に冷却され、所定の温度に維持される。露光
終了後は、駆動部材２ａを再びハンド２に連結し、第１
の排気ライン１ｂによる保持盤１の真空吸着力を解除し
たうえで前述と逆の手順で基板Ｗ1 を搬出する。The substrate W 1 attracted to the holding plate 1 is exposed by exposure light emitted from a light source (not shown) through a mask. The substrate W 1 being exposed has a suction surface 1 a of the holding plate 1.
The whole is firmly supported by being adsorbed to the adsorption surface 2f of the hand 2, and is evenly cooled by the temperature control medium that flows through the internal pipe 1e of the holding plate 1 and the internal pipe 2i of the hand 2. , Maintained at a predetermined temperature. After the exposure is completed, the drive member 2a is connected to the hand 2 again, and the first
After the vacuum suction force of the holding plate 1 by the exhaust line 1b is released, the substrate W 1 is unloaded in the reverse procedure to the above.
【００２０】本実施例によれば、露光中の基板を保持盤
の内部配管とハンドの内部配管をそれぞれ流動する温調
流媒によって均一な温度に維持することができるため、
基板の熱変形による転写ずれが発生するおそれがない。
また、基板全体が堅固に支持されるため、局部的な剛性
不足による変形のおそれもない。According to this embodiment, since the substrate being exposed can be maintained at a uniform temperature by the temperature adjusting flow mediums flowing through the internal pipe of the holding plate and the internal pipe of the hand, respectively.
There is no risk of transfer displacement due to thermal deformation of the substrate.
Further, since the whole substrate is firmly supported, there is no possibility of deformation due to local lack of rigidity.
【００２１】さらに、基板を保持盤に吸着させたのちに
ハンドを後退させる工程や、露光後の基板をハンドに受
渡す工程等が不要であり、露光装置の動作信頼性を向上
させることができる。Further, there is no need for a step of retracting the hand after adsorbing the substrate to the holding plate, a step of delivering the exposed substrate to the hand, and the like, so that the operational reliability of the exposure apparatus can be improved. .
【００２２】[0022]
【発明の効果】本発明は、上述のように構成されている
ので、以下に記載するような効果を奏する。Since the present invention is configured as described above, it has the following effects.
【００２３】露光中の基板に局部的な温度差が発生する
のを防ぐことができるうえに、基板全体を堅固に支持す
ることができる。従って、露光中の基板の熱歪や局部的
な剛性不足による変形のために転写ずれが発生するおそ
れがない。その結果、高精度の微細パターンを転写、焼
付けできる半導体露光装置を実現できる。It is possible to prevent a local temperature difference from being generated on the substrate during exposure and to firmly support the entire substrate. Therefore, there is no possibility of transfer deviation due to thermal distortion of the substrate during exposure or deformation due to local lack of rigidity. As a result, it is possible to realize a semiconductor exposure apparatus that can transfer and print a highly precise fine pattern.
【図１】一実施例を示す模式立面図である。FIG. 1 is a schematic elevational view showing an embodiment.
【図２】図１の装置を、部分的に図１のＡ−Ａ線に沿っ
た断面で示す一部断面側面図である。2 is a partial cross-sectional side view of the device of FIG. 1 partially shown in cross-section along line AA of FIG.
【図３】図１の装置に基板が保持される工程を示すもの
で、（ａ）は基板が保持盤の吸着面に対向する位置に搬
入された状態、（ｂ）は保持盤に基板が吸着された状
態、（ｃ）はハンドから駆動部材が切離された状態をそ
れぞれ示す。3A and 3B show a process of holding the substrate in the apparatus of FIG. 1, where FIG. 3A is a state in which the substrate is carried in a position facing the suction surface of the holding plate, and FIG. The state of being sucked, (c) shows the state in which the drive member is separated from the hand.
【図４】従来例を説明する説明図である。FIG. 4 is an explanatory diagram illustrating a conventional example.
【図５】従来例による基板の受渡し工程を示すもので、
（ａ）は基板が保持盤の吸着面に対向する位置に搬入さ
れた状態、（ｂ）は保持盤に基板が吸着された状態、
（ｃ）は保持盤に吸着された基板からハンドを後退させ
た状態をそれぞれ示す。FIG. 5 shows a conventional substrate delivery process,
(A) is a state in which the substrate is carried in a position facing the suction surface of the holding plate, (b) is a state in which the substrate is sucked in the holding plate,
(C) shows the state where the hand is retracted from the substrate sucked by the holding plate.
１ 保持盤 １ａ，２ｆ 吸着面 １ｂ 第１の排気ライン １ｃ，２ｇ 吸着溝 １ｄ ハンド収容溝 １ｅ，２ｉ 内部配管 ２ ハンド ２ａ 駆動部材 ２ｈ 第２の排気ライン 1 Holding board 1a, 2f Adsorption surface 1b First exhaust line 1c, 2g Adsorption groove 1d Hand accommodation groove 1e, 2i Internal piping 2 Hand 2a Drive member 2h Second exhaust line
───────────────────────────────────────────────────── フロントページの続き (51)Int.Cl.6 識別記号 庁内整理番号 ＦＩ 技術表示箇所 Ｇ０３Ｆ 9/00 Ｈ 9122−2Ｈ Ｈ０１Ｌ 21/027 21/68 Ｎ Ａ Ｐ ─────────────────────────────────────────────────── ─── Continuation of the front page (51) Int.Cl. 6 Identification code Internal reference number FI Technical display location G03F 9/00 H 9122-2H H01L 21/027 21/68 N A P
Claims (4)
び第２の吸着板を有し、前記第２の吸着板が前記第１の
吸着板に向って基板を搬送する搬送手段であり、前記第
１の吸着板が、前記第２の吸着板と合体したときにこれ
とともに前記基板を保持するように構成されていること
を特徴とする基板保持装置。1. A transfer means having first and second suction plates that can be combined and separated from each other, wherein the second suction plate transports the substrate toward the first suction plate. The substrate holding device, wherein the first suction plate is configured to hold the substrate together with the second suction plate when the first suction plate is united with the second suction plate.
浅溝を備えていることを特徴とする請求項１記載の基板
保持装置。2. The substrate holding device according to claim 1, wherein the first suction plate has a shallow groove for accommodating the second suction plate.
調流媒を流動させる内部配管を備えていることを特徴と
する請求項１または２記載の基板保持装置。3. The substrate holding device according to claim 1, wherein each of the first and second adsorption plates is provided with an internal pipe through which the temperature control flow medium is made to flow.
の吸着板に対して着脱自在であることを特徴とする請求
項１ないし３いずれか１項記載の基板保持装置。4. A driving means for moving the conveying means is a second means.
4. The substrate holding device according to claim 1, wherein the substrate holding device is detachable from the suction plate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5253711A JPH0781755A (en) | 1993-09-16 | 1993-09-16 | Substrate holder |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5253711A JPH0781755A (en) | 1993-09-16 | 1993-09-16 | Substrate holder |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0781755A true JPH0781755A (en) | 1995-03-28 |
Family
ID=17255091
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5253711A Pending JPH0781755A (en) | 1993-09-16 | 1993-09-16 | Substrate holder |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0781755A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005059173A (en) * | 2003-08-18 | 2005-03-10 | Yoshioka Seiko:Kk | Suction device and chuck table |
| EP1653283A2 (en) * | 2004-10-26 | 2006-05-03 | ASML Netherlands BV | Lithographic apparatus and device manufacturing method |
| KR100853927B1 (en) * | 2001-04-17 | 2008-08-25 | 도쿄엘렉트론가부시키가이샤 | Apparatus for forming coating film and spin chuck |
| JP2010182906A (en) * | 2009-02-06 | 2010-08-19 | Tokyo Electron Ltd | Substrate treatment apparatus |
-
1993
- 1993-09-16 JP JP5253711A patent/JPH0781755A/en active Pending
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100853927B1 (en) * | 2001-04-17 | 2008-08-25 | 도쿄엘렉트론가부시키가이샤 | Apparatus for forming coating film and spin chuck |
| JP2005059173A (en) * | 2003-08-18 | 2005-03-10 | Yoshioka Seiko:Kk | Suction device and chuck table |
| EP1653283A2 (en) * | 2004-10-26 | 2006-05-03 | ASML Netherlands BV | Lithographic apparatus and device manufacturing method |
| EP1653283A3 (en) * | 2004-10-26 | 2006-07-05 | ASML Netherlands BV | Lithographic apparatus and device manufacturing method |
| US7196768B2 (en) | 2004-10-26 | 2007-03-27 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
| JP2010182906A (en) * | 2009-02-06 | 2010-08-19 | Tokyo Electron Ltd | Substrate treatment apparatus |
| US8375884B2 (en) | 2009-02-06 | 2013-02-19 | Tokyo Electron Limited | Substrate processing apparatus |
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