JPH0778846A - Tape carrier package - Google Patents

Abstract

PURPOSE:To enable the number of molds to be decreased by arranging curved parts bent in mutually inverse directions connecting to mutually adjacent outer lead end parts. CONSTITUTION:Within this tape carrier package, an electrically connected tub 11 and the surface part of a sheetlike semiconductor element 10 covered with a sealing resin layer 16 are integrated with each other, the tub 11 comprising polyimide resin is arranged outside the sealing resin layer 16 while an outer lead 13 electrically connected to a conductive patter 12 is linearly arranged. On the other hand, a curved part 17 arranged on adjacent outer leads 13 are bent in the mutually inverse directions while the axial direction of the outer lead 13 is perpendicular to the surface of a substrate 18 for an electronic equipment. Furthermore, the curved part 17 is fixed using a bonding agent 19 while a wall 20 is provided on said substrate 18 to reinforce the mechanical strength. Through these procedures, a plurality of semiconductor elements can be packaged in high density.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION The present invention relates to a tape carrier package.
Involved in the improvement of Ji.

[0002]

2. Description of the Related Art As the degree of integration of semiconductor devices has increased, the number of pins has increased, and the number of pins of an envelope for assembling the same has naturally increased. Due to such an increase in the number of pins, the so-called tape carrier method has been adopted in many kinds of semiconductor element assembling methods in addition to the conventional lead frame method.

A method of assembling a plate-shaped semiconductor element by the tape carrier method will be described with reference to FIGS. 1 to 4. FIG. 1 is a sectional view of the semiconductor element assembled by the tape carrier method, and this semiconductor element is predetermined. 2 is a sectional view showing the step of mounting on the substrate of FIG. 2, FIG. 3 is an enlarged view of a main part of FIG. 2, and FIG. 4 is a top view corresponding to the sectional view of FIG. Figure 1
As is clear from the sectional view of FIG. 4 and the top view of FIG. 4, a tab 2 made of, for example, a polyimide resin is attached to the periphery of the plate-shaped semiconductor element 1, and a conductive pattern 3 (FIG.
The outer lead 4 which extends linearly is formed in (see). The conductive pattern 3 and the semiconductor element 1 are electrically connected via a linear lead 5, and the periphery of the semiconductor element 1 and one surface thereof are covered with a sealing resin layer 6 to integrally form the tab 2. The structure to be formed is general.

As a result, as is apparent from FIG. 4, the tab 2 made of polyimide resin is arranged outside the sealing resin layer 6,
An active element or a passive element formed in the plate-shaped semiconductor element 1 is an electronic element via a thin metal wire 5 or a linear lead 5, a conductive pattern 3 installed on the tab 2 and an outer lead 4. A predetermined electronic circuit is configured by being electrically connected to the device.

The electrical connection between the outer lead 4 installed on the tape carrier package 8 and the electronic equipment substrate 7 will be described with reference to FIGS. 2 and 3. As described above, the conductive pattern 3 made of copper foil or the like is provided on the surface portion of the tab 2 made of polyimide resin or the like, for example, by an etching method or the like. When forming the lead 5 used for electrical connection between the semiconductor substrate and the conductive pattern 3, the so-called bump electrode 7 formed on the plate-shaped semiconductor element is used.
To use.

The outer lead 4 is linearly attached to the conductive pattern 3, and its tip is fixed to the electronic device substrate 7 by soldering or the like to be electrically connected. As shown, the curved portion 8 is formed by bending in the same direction.

On the other hand, in order to attach the plurality of semiconductor elements 1 assembled by the sealing resin layer 6 and the like to the electronic device substrate 7, a method of putting them on top of each other as apparent from FIG. 2 is adopted.

[0008]

A plurality of semiconductor elements 1 assembled in the tape carrier package 8 as described above.
3 is attached to the electronic device substrate 7, there is a problem due to the difference in the offset amounts a and b, as is apparent from FIG.
That is, the outer reel corresponding to the number of stages corresponding to each difference
A bending mold is required.

The present invention has been made in view of the above circumstances, and particularly provides a novel tape carrier package capable of suppressing the number of molds.

[0010]

A tab disposed outside a plate-shaped semiconductor element, a plurality of linear outer leads formed on the tab and electrically connected to the semiconductor element, and the outer A board on which the leads are mounted, the outer lead ends arranged in a direction perpendicular to the board, and the outer lead ends that are adjacent to each other, are continuous with each other and fold in opposite directions. The bent curved portion is characteristic of the tape carrier package according to the present invention.

Another feature is a plate-shaped semiconductor element that is in an upright state with respect to the substrate to which the curved portion is fixed.

[0012]

As described above, in the tape carrier package according to the present invention, the outer leads are arranged in the direction perpendicular to the substrate, and the curved portions adjacent to each other are formed in the opposite bending directions. As a result, many semiconductor elements can be mounted.

[0013]

Embodiments of the present invention will be described in detail with reference to FIGS. FIG. 5 shows a sectional view of a tape carrier package which can be mounted in a direction perpendicular to the surface of the electronic device substrate, FIG. 6 is an enlarged view of the main part thereof, and FIG. 7 is a tape carrier package. FIG. 8 is an example in which the module is modularized, FIG. 8 is a diagram for demonstrating the layout of footprints formed on a substrate for high-density mounting, and FIG. 9 is another example of a tape carrier package. I chose

The tape carrier package according to the present invention has the same structure as the conventional one except for the outer lead, but will be briefly described.

A tab 11 made of, for example, a polyimide resin is attached to the periphery of a plate-shaped semiconductor element 10 in which an electrode, a wiring layer, an insulating layer and a passivation layer are formed outside the active element or the passive element. The tab 11 has a conductive pattern 1 made of copper or the like, for example, by a screen printing method.
2 is provided and is electrically connected to the outer lead 13
Set up. Conductive pattern 12 and plate-shaped semiconductor element 1
For the connection of 0, a lead 15 is fixed between the bump electrode 14 and the conductive pattern 12 provided on the plate-shaped semiconductor element 10 to achieve electrical connection.

The tab 11 electrically connected in this way and the surface of the plate-shaped semiconductor element 10 are covered with a sealing resin layer 16 and are integrated with each other. The outer lead 1 is provided with a tab 11 and is electrically connected to the conductive pattern 12.
3 are arranged linearly.

The outer lead 13 is made of, for example, a metal foil such as copper, and a curved portion 17 is formed at the end thereof to prepare for surface mounting on a substrate 18 for electronic equipment. FIG. 6 is an enlarged view of a portion A surrounded by a dotted line in FIG.

As is apparent from this figure, the outer casings adjacent to each other
The curved portions 17 installed on the lead 13 are bent in opposite directions, and the axial direction of the outer lead 13 is perpendicular to the surface of the electronic device substrate 18. Note that, as shown in FIG. 7, the curved portion 17 may be fixed by an adhesive 19, for example, and the wall 20 may be installed on the electronic device substrate 18 in order to supplement the mechanical strength.

FIG. 8 shows an arrangement of footprints formed on a board for high-density mounting, which is a footprint for mounting a tape carrier package on the left end of the electronic device board 18 and is the second from the left end 21a. The footprint 21b to be installed in is described.

In addition to standing vertically, the method of FIG. 9 is also possible. That is, when the plurality of plate-shaped semiconductor elements 10 are attached to the electronic device substrate 18, the adhesive 19 is used as described above, and another semiconductor element 10 to be stacked thereon is used.
Similarly, the both are fixed by the adhesive 19, for example. Then, as described above, the curved portions 17 formed on the outer leads 13 adjacent to each other are formed so that the bending direction is reversed. However, the outer lead 13 made of, for example, copper foil or the like can be brought into contact with the surface of the electronic device substrate 18 by bending it once at 90 ° before the curved portion 17 formed at the end.

In this case, since the plate-shaped semiconductor element 10 is fixed to the surface of the electronic device substrate 18 by the adhesive 19, the mechanical strength of the curved portion 17 is larger than that in the above example.

[0022]

The tape carrier package according to the present invention.
In order to attach a plurality of semiconductor elements to the substrate, it is sufficient to prepare at least two molds for bending the outer lead, so that the cost can be reduced and the plurality of semiconductor elements can be densely arranged. Can be implemented.

[Brief description of drawings]

FIG. 1 is a view showing a cross section of a conventional tape carrier package.

FIG. 2 is a cross-sectional view showing a situation in which a plurality of tape carrier packages are arranged.

FIG. 3 is an enlarged view of a main part of FIG.

FIG. 4 is a top view of the tape carrier package shown in FIG.

FIG. 5 is a cross-sectional view of a tape carrier package according to the present invention.

FIG. 6 is an enlarged cross-sectional view of a part thereof.

FIG. 7 is a view showing a state in which the tape carrier package according to the present invention is modularized.

FIG. 8 is a diagram showing the layout of footprints formed on a substrate for high-density mounting.

9 is a diagram showing another state in which the tape carrier package is modularized as a modification of FIG. 7. FIG.

[Explanation of symbols]

 1, 10: Semiconductor element, 2, 11: Tab, 3, 12: Conductive pattern, 4, 13: Outer lead, 5, 15: Lead, 14: Bump electrode, 6, 16: Sealing resin layer, 7, 18: Substrate for electronic device, 8, 17: Curved portion, 19: Adhesive, 20: Wall, 21a, b: Footprint.

Claims (2)

[Claims] 1. A tab arranged outside a plate-shaped semiconductor element, a plurality of linear outer leads formed on the tab and electrically connected to the semiconductor element, and the outer lead.
A board on which a board is mounted, the outer lead end arranged in a direction perpendicular to the board, and a curve continuous with the outer lead ends adjacent to each other and bent in opposite directions. And a tape carrier package. 2. The tape carrier package according to claim 1, further comprising a plate-shaped semiconductor element that is in an upright state with respect to a substrate to which the curved portion is fixed.