JPH0774187A - Semiconductor component manufacturing equipment - Google Patents

Abstract

PURPOSE:To make no space between works before a manufacturing work and to make automatically a space between the works after finishing the manufacturing work in carrying the rectangular works. CONSTITUTION:A reversing mechanism 10 is installed at a place on an actuating shaft 2 nearer the carried-out side C than a bonding point of a carrier path A. A second feed pawl 23 is installed at a driven section 21a which belongs to the reversing mechanism 10 and to which the reversing operation of the actuating shaft 2 is transmitted. When the actuating shaft 2 works, the second feed pawl 23, with the feeding operation at a different cycle from that of the other feed pawl 1, moves a work by a constant distance towards the carried-out side C. By this method, a space corresponding to one pitch is automatically formed between a preceeding work and a following work.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor component manufacturing apparatus such as a die bonder or a wire bonder.

[0002]

2. Description of the Related Art Conventionally, a bonding apparatus, which is a semiconductor component manufacturing apparatus such as a die bonder or a wire bonder, has been used for manufacturing semiconductor components such as transistors and diodes. In such a bonding apparatus, a work such as a lead frame having a plurality of leads formed by a die-cutting process is intermittently moved at a constant distance from a supply side to a delivery side of a conveyance path, while being provided in the middle of the conveyance path. It is common to perform manufacturing work such as die bonding and wire bonding on the stopped work at a different work point.

Among this type of bonding apparatus,
In the case of handling a strip-shaped work having a predetermined length, the work is intermittently moved by a plurality of feed claws 1 as shown in FIG. 5, for example. That is, the bonding apparatus is provided with the operation shaft 2 extending in parallel with the transport path A for the work W. The operating shaft 2 is connected to a drive mechanism (not shown). Further, the operation shaft 2 is provided with a plurality of arms 3 whose tips are located above the transport path A at predetermined intervals, and the feed claws 1 are provided at the tips of the respective arms 3.

In this structure, the operating shaft 2
When the driving mechanism is operated in a predetermined order in the extending direction and the rotating direction according to the operation of the drive mechanism, that is, in the order of to shown in FIGS. Then, the operations of descending, feeding, ascending, and returning are cycled as one cycle. At this time, the feed claw 1 is loosely inserted into a hole or notch existing in the work W continuously supplied from the supply side B of the transport path A along with the descending operation thereof, and then the work W is moved by the next feed operation. To the sending side C. Therefore, by repeating this operation, the work W on the transport path A is intermittently moved toward the delivery side C by a constant distance.

On the other hand, a gap corresponding to one pitch L is previously provided between the works W at the time when the works W are supplied to the supply side B of the conveyance path A. This is the work W whose manufacturing work has been completed.
Is to detect a break between the preceding work W and the succeeding work W when a predetermined point on the delivery side of the transport path A is reached. For example, the gap is detected by a light sensor or the like. Based on the detection, the transfer mechanism (not shown) is operated to send the work W, which has been manufactured, to the storage rack (not shown).

[0006]

However, in such a conventional semiconductor component manufacturing apparatus, there is a gap between the preceding work W and the following work W even at the work point of the transport path A. is doing. Therefore, after the manufacturing work of the preceding work W is completed, there is a time loss of one pitch L, that is, one working cycle of the feed pawl 1 during the manufacturing work of the succeeding work W. Production efficiency per hour is poor. Needless to say, in order to eliminate such time loss, it is sufficient to supply the work W to the transport path A without providing a gap in each work W, but in that case, the break of each work W occurs after passing the work point. There was a problem that it could not be detected.

The present invention has been made in view of the above-mentioned problems of the prior art, and when carrying a strip-shaped work,
An object of the present invention is to provide a semiconductor component manufacturing apparatus capable of automatically providing a gap between each work after the production work is completed, without providing a gap between each work before the production work is performed.

[0008]

In order to solve the above-mentioned problems, in the invention of claim 1, feeding strips are provided at a plurality of points of the conveying path and are continuously fed from the supply side of the conveying path. The work of, by the periodic feed operation of a plurality of the feed pawls, while moving a fixed distance toward the delivery side of the transport path, for the work that has reached a work point located in the middle of the transport path, In a semiconductor component manufacturing apparatus that performs manufacturing work such as die bonding, at a position located on the delivery side from the work point, the work is moved by a certain distance toward the delivery side by a feed operation that is out of cycle with the feed claw. It is characterized in that a second feed claw for moving is provided.

According to the second aspect of the invention, arms having feed claws are provided at a plurality of points on the operating shaft extending along the conveying path, and the strips are continuously supplied from the supply side of the conveying path. A work in the shape of a sheet, which is moved in the transport path toward the delivery side of the transport path by a constant distance by the cyclic feed operation of the plurality of feed claws associated with the operation of the actuating shaft, and which is located in the middle of the transport path. For the work that reached the point,
In a semiconductor component manufacturing apparatus that performs manufacturing work such as die bonding, the operation shaft is reversed in operation from a driving part that is located on the delivery side from the work point and is fixed to the operation shaft. A reversing mechanism having a driven portion that is transmitted through the second feed claw for moving the work toward the delivery side by a predetermined distance.

[0010]

In the structure of claim 1, the strip-shaped work is
When continuously supplied from the supply side to the transport path without a gap, the supplied multiple workpieces are intermittently moved while maintaining a continuous state by multiple feed claws, and reach the work point. Manufacturing work is performed sequentially from the work to be performed. Subsequently, the work for which the manufacturing work has been completed passes through the work point and is intermittently moved to the delivery side of the transport path, and eventually reaches the point where the second feed claw is provided. Then, the preceding work is moved to the delivery side by the second feed claw before another subsequent work is moved to the delivery side of the transport path by the plurality of feed claws. For this reason, a gap is formed between the preceding work and the following work, which is a constant distance, that is, a distance in which the work is moved by one feeding operation of each feeding claw.

Further, according to the second aspect of the invention, since the second feed pawl is provided on the driven portion of the reversing mechanism provided on the actuating shaft, the feed pawl of the arm is periodically moved along with the operation of the actuating shaft. When the feeding operation is repeated, the second feeding pawl repeats the feeding operation in an operation cycle having a phase opposite to the operation cycle of the arm feeding pawl. Further, since the reversing mechanism provided with the second feed pawl is provided on the delivery side from the work point on the transport path, the second feed pawl is used to pass the work point in the same manner as above. A gap of a constant distance, that is, a distance by which the work is moved by one feeding operation of each feed pawl can be formed between the preceding work and the following work after the work. Moreover, since the second feed pawl is configured to be actuated along with the actuation of the actuating shaft like the feed pawl, it is not necessary to separately provide another actuating shaft or the like to operate the second feed pawl. .

[0012]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described below with reference to the drawings. FIG. 1 is a plan view showing a main part of a bonding apparatus according to the present invention. A transfer path A is formed in the bonding apparatus by a transfer rail (not shown),
A bonding mechanism, which is located on the supply side B (not shown), is provided in the middle of the transport path A for performing a bonding operation on the continuously supplied strip-shaped works W.

Further, the bonding apparatus is provided with an operating shaft 2 parallel to the transport path A, as in the case of the conventional example. Arms 3 are attached to the operating shaft 2 at a plurality of positions at predetermined intervals, and feed claws 1 for moving the work W are provided at the tips of the arms 3 located above the transport path A, respectively. Has been. As described in the conventional example, the feeding claws 3 are shown in a predetermined order in the extending direction and the rotating direction of the operating shaft 2 by the drive mechanism (not shown), that is, in FIGS. 1 and 2. By being operated in the order of to, the feeding operation is periodically performed (see FIG. 7).

On the other hand, the operating shaft 2 has the arms 3,
A reversing mechanism 10 is provided between the two. The reversing mechanism 10 is composed of a rectangular parallelepiped mounting member 11 fixed to the actuation shaft 2 in an externally inserted state, a supporter 15 and a link plate 21 described later. The mounting member 11 is a driving part of the reversing mechanism 10, and as shown in FIG. 2, the side surface 11a located on the transport path A side extends slightly obliquely upward toward the transport path A. A transmission shaft 12 is provided. The transmission shaft 12 is formed at its tip end side with an annular convex portion 13 projecting over the entire circumference, and at the tip end thereof, a disc portion 14 having a larger diameter than the annular convex portion 13 is formed. There is.

A supporter 15 is arranged between the mounting member 11 and the conveyance path A. The supporter 15 includes an X-axis side bearing 16 supported by the bonding apparatus, a rotary shaft 17 rotatably supported by the X-axis side bearing 16, and a rotary shaft 17 protruding in the X-axis direction, that is, the extending direction of the transport path A. A Z-axis side bearing 18 provided at the tip, and a rotary shaft 19 rotatably supported by the Z-axis side bearing 18 and protruding upward along the Z-axis.
It is composed of and.

A link plate 21 extending from the tip of the transmission shaft 12 to the upper portion of the transport path A is supported at the tip of the rotary shaft 19 on the Z-axis bearing 18 side. The link plate 21 is supported by the supporter 15 (rotary shaft 19) at a fulcrum O located in the middle of the longitudinal direction, and the link plate 21 has the fulcrum O as a rotation center in the X-axis direction and the Z-axis direction. It is freely rotatable to. At one end of the link plate 21, a plate-shaped protrusion 22 is formed continuously to the right side 21a located on the delivery side C of the transport path A, and the reversing mechanism located above the transport path A is formed. At the other end 21c of the link plate 21, which is the driven portion of 10, the second feed claw 23 for moving the work W is vertically provided toward the transport path A.

Further, on the left side 21b of the link plate 21, at a portion located closer to the mounting member 11 than the fulcrum O, and at an upper portion (not shown) of the bonding apparatus located on the supply side B of the transport path A. The other end of the spring 31 whose one end is supported is connected. As a result, the link plate 21 is urged toward the supply side B at one end side at a raising angle of about 45 °, and the upper surface at the one end side is directed to the disc portion 14 of the transmission shaft 12 and the above-mentioned. The projection 22 to the transmission shaft 1
The two annular protrusions 13 are pressed against each other.

In the present embodiment having the above-mentioned structure, when the actuating shaft 2 is actuated by the driving mechanism (not shown) in the order of 1 to 2 shown in FIGS. 1 and 2, the reversing mechanism 10 is actuated, that is, When the link plate 21 rotates about the fulcrum O in the X-axis direction and the Z-axis direction, the operation of the operating shaft 2 is inverted and transmitted to the other end 21c of the link plate 21, which is the driven portion. It Along with this, the second feed claw 2
3 cyclically operates in the order of a to d indicated by the arrow in FIG. 2 with each of the operations of ascending, returning, descending, and feeding as one cycle. Moreover, the operation of the second feed claw 23 is, as shown in FIG. 3, a phase in which the operation of the feed claw 1 of the arm 3 is reversed.

On the other hand, when the strip-shaped works W are continuously supplied from the supply side B to the transport path A without a gap, the plurality of supplied works W are the same as those shown in the conventional example. Is continuously moved by the feed claw 1 of the arm 3 of the robot 3 and is intermittently moved, and eventually a working point (not shown)
The bonding work is sequentially performed from the preceding work W which has reached. Subsequently, the work W for which the bonding work has been completed passes through the work point and is intermittently moved to the delivery side of the transport path, and eventually reaches the point where the second feed claw 23 is located.

Then, the feed claw 1 and the second claw 2 of the arm 3
Since the operation with 3 has a relationship in which the phases are inverted from each other,
As shown in FIG. 4, the preceding work W is sent to the delivery side C of the transport path A by the other work W following it by the plurality of feed claws 1.
Before being moved to, the sheet is moved to the delivery side C by the second feeding claw 23. Therefore, a gap is formed between the preceding work and the following work, which is a constant distance L, that is, a distance in which the work is moved by one feeding operation of each feed claw (first cycle in FIG. 4). Thereby, the break of each work W can be detected by the light sensor or the like. Note that, while the preceding work W is moved by the second feed claw 23, the above-mentioned gap is provided between both feed claws 1, 2.
Each time 3 operates for one cycle, it spreads by a constant distance L.

Therefore, in the bonding apparatus of this embodiment, the plurality of works W continuously supplied to the transfer path A without any gap are transferred while maintaining the state before the bonding work is performed, and the bonding is performed. After completion of the work, it becomes possible to automatically provide a gap between the works W. As a result, by transporting the strip-shaped work W to the bonding work point without interruption, the production efficiency per unit time in the bonding apparatus can be improved.

Further, in the present embodiment, the second feed pawl 23 is operated in accordance with the operation of the operating shaft 2 like the feed pawl 1, so that the second feed pawl 23 is operated. Therefore, it is not necessary to separately provide another operating shaft or the like. Therefore,
The structure of the bonding apparatus does not become complicated. Moreover, the conventional bonding apparatus can be changed to the bonding apparatus of the present invention only by adding the reversing mechanism 10.

In the present embodiment, the feed claw 1 and the second feed claw 23 of the arm 3 are operated in a state in which the phases are reversed, but it is not always necessary to reverse both phases. However, it suffices that the feeding operation cycles of both sides are deviated. Further, the feed claw 1 and the second feed claw 23 of the arm 3 may be configured to be operated by different operation shafts or the like.

[0024]

As described above, according to the first aspect of the present invention, the work is delivered to the point on the delivery side of the manufacturing work point on the transport path by the feed operation whose cycle is different from that of the other feed claws. A second feed pawl that moves a certain distance toward the side is provided, and the second feed pawl feeds the preceding work of the works whose manufacturing work has been completed to the other work that follows by another feed pawl. It was configured to move to the sending side before moving to the side.

Therefore, a plurality of works continuously supplied to the carrying path without gaps are carried while maintaining the state before the manufacturing work is performed, and after the manufacturing work is completed, the work is automatically transferred between the works. It is possible to provide a gap in.
As a result, it is possible to improve the production efficiency per unit time in the semiconductor component manufacturing apparatus by continuously transporting the strip-shaped work to the manufacturing work point.

According to the second aspect of the present invention, the second feed pawl for moving the work by the feed operation whose cycle is deviated from the other feed pawl is located on the delivery side from the manufacturing work point, and the other feed pawl is provided. Provided in the driven part of the reversing mechanism having a driving part fixed to the actuating shaft for actuating the claw, and a driven part to which the operation of the actuating shaft is inverted and transmitted, by the second feed claw,
Among the workpieces for which the manufacturing work has been completed, the preceding work is moved to the sending side before another succeeding work is moved to the sending side by another sending claw.

Therefore, the same effect as that of the first aspect of the invention can be obtained. Moreover, since it is not necessary to separately provide another operation shaft or the like to operate the second feed claw,
It does not complicate the structure of the bonding apparatus. Moreover, the conventional bonding apparatus can be changed to the bonding apparatus of the present invention only by adding the reversing mechanism.

[Brief description of drawings]

FIG. 1 is a plan view of a main part of a bonding apparatus showing an embodiment of the present invention.

FIG. 2 is a perspective view of a reversing mechanism showing the same embodiment.

FIG. 3 is a diagram showing a relationship in operation between a feed pawl and a second feed pawl in the embodiment.

FIG. 4 is an explanatory diagram showing a movement state of a work in the embodiment.

FIG. 5 is a plan view of a main part of a bonding apparatus showing a conventional example.

6 is a side view showing an arrow D in FIG.

FIG. 7 is an explanatory view showing an operation sequence of the feed claws in the embodiment of the present invention and the conventional example.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Feed claw 2 Operating shaft 3 Arm 10 Inversion mechanism 11 Mounting member (driving part) 15 Supporter 21 Link plate 21c The other end (driven part) 23 Second feed claw A Conveying path B Supply side C Sending side

Claims (2)

[Claims] 1. A feed claw is provided at a plurality of points of a conveyance path, and a strip-shaped workpiece continuously supplied from a supply side of the conveyance path is moved by a periodic feeding operation of the plurality of the feed claws. In the semiconductor component manufacturing apparatus that performs a manufacturing work such as die bonding on a work that has reached a work point located in the middle of the transport path while moving the work piece toward the delivery side of the work piece from the work point. A semiconductor component manufacturing apparatus characterized in that a second feed pawl for moving the work toward the delivery side by a constant distance is provided at a point located on the side by a feed operation whose cycle is deviated from the feed pawl. . 2. An arm having feed claws is provided at a plurality of points of an operating shaft extending along a transfer path, and strip-shaped workpieces continuously supplied from a supply side of the transfer path are operated by the operating shaft. By the periodic feeding operation of the plurality of feeding pawls associated with the above, the work is moved toward the delivery side of the transport path by a constant distance, and the work that has reached a work point located in the middle of the transport path is die-bonded. In a semiconductor component manufacturing apparatus that performs manufacturing operations such as, for example, a driving portion located on the delivery side from the working point and fixed to the working shaft, and the working of the working shaft are reversed and transmitted to the working shaft. And a driven unit provided with a reversing mechanism, and the driven unit is provided with a second feed pawl for moving the work toward the delivery side by a predetermined distance. .