JPH0772171A - Electric inspection jig for wiring board - Google Patents

Abstract

PURPOSE:To provide an electric inspection jig for a wiring board which can be constituted without a need for an NC boring operation, the insertion operation of a voltage detection pin and the like and in which the electric inspection of narrow-pitch and small-diameter pads on a printed-wiring board can be performed with high accuracy. CONSTITUTION:The inspection jig is formed so as to be provided with a conductive metal layer 1, with a group of conductive bumps 2 whose ends on one side are connected to, and arranged at prescribed positions on the main face of the conductive metal layer 1 and whose height is nearly uniform and with an insulator layer 3 which exposes and buries the individual conductive bumps 2 in the group of the conductive bumps 2 exposing the tip parts and which separates, isolates and insulates the individual conductive bumps 2 from each other. The conductive metal layer 2 adopts a shape which is provided with lead wire parts 1a for electric inspection and with connector parts 1b, and its constitution can be made compact or simple. In addition, when it is formed as a multilayer interconnection structure, its multifunction can be achieved.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electric inspection jig used for an electric continuity test of a printed wiring board, and particularly for a high density wiring board and the like, which enables highly reliable electric inspection. Regarding jigs.

[0002]

2. Description of the Related Art As is well known, printed wiring boards are widely used in various electronic devices and greatly contribute to downsizing of these electronic devices and downsizing of circuit parts. By the way, in a printed wiring board, whether or not the circuit pattern formed on the printed wiring board has a required function is an important issue. That is, since the printed wiring board is manufactured through complicated steps or multi-step steps, the circuit pattern may be broken or the connection between the circuit patterns may be defective. If such a circuit pattern breaks or there is a connection failure, the printed wiring board will lack the functions as designed.When used in the construction of electronic devices, the electronic devices will perform the required functions. I won't get it. Therefore, as a final inspection for the printed wiring board,
on. An electrical inspection called off-grid electrical inspection is performed. In other words, while preparing a continuity tester equipped with a table with terminal pin insertion holes at a predetermined pitch, for example, NC drilling, a lead pin corresponding to the printed wiring board to be inspected. An electric inspection jig equipped with (electrical detection pin) is prepared. Then, the printed wiring board is aligned and mounted on the continuity inspection machine through the electric inspection jig to perform a required electric inspection.

[0003]

As described above, in the case of the conventional electric inspection jig for a printed wiring board, NC drilling is performed at a predetermined position of the table provided in the continuity inspection machine, and a detection pin is inserted. Since the manufacturing process is complicated and many are manual, not only does it take a relatively long time to configure,
There are also problems with accuracy and reliability as an electrical inspection jig. In particular, in the electrical inspection of a printed wiring board having a narrow pitch pad portion, since a small-diameter detection pin will be used, it is inevitable that the NC hole is made smaller in diameter and pitched. While the machining process becomes complicated and takes a long time, the difficulty of inserting the detection pin into a hole having a small diameter and a narrow pitch is also increased, which poses a further problem in terms of accuracy.

[0004] In response to these problems, it has been attempted to use a spring system for the detection pin. That is,
A voltage-sensing pin equipped with a spring is placed in advance in the terminal pin insertion hole of the table, and the spring is set so that the voltage-sensing pin can be raised. Means for contacting the place are also known. However, in the case of this spring method, if the pad portion to be inspected has a pitch of 0.5 mm or less, the construction of the inspection jig itself is difficult and it cannot be used practically. Further, a method called a probe needle method is also known, but it is not practical because the surface arrangement of the probe needle is difficult.

The present invention has been made in consideration of the above circumstances, and can be constructed without the need for NC drilling or the insertion of a detection pin, and it is also possible to provide a printed wiring board for narrow-pitch, small-diameter pads. An object of the present invention is to provide an electric inspection jig for a wiring board that can perform an electric inspection with high accuracy.

[0006]

An electrical inspection jig according to the present invention has a conductive metal layer and a height at which one end is connected to a predetermined position on the main surface of the conductive metal layer so as to have a substantially uniform height. Such a conductive bump group, and an insulating layer that exposes / embeds each conductive bump tip of the conductive bump group and separates / insulates each conductive bump from each other. To do. Here, the conductive metal layer can be configured to have a lead wire portion for electrical inspection and a connector portion to make the configuration compact or simplified, and to provide a multilayer wiring structure. It is possible to achieve multi-functionality.

In this electrical inspection jig, for example, conductive bump groups having a required pitch and a required shape and height are selectively arranged and formed at predetermined positions on the surface of a conductive metal foil,
For example, by stacking a prepreg insulating sheet on the surface on which the conductive bump group is formed and pressurizing / laminating them integrally, the structure in which the conductive bump group penetrates the prepreg insulating sheet and the tip portion is exposed becomes easy. It is formed. Here, the conductive metal foil functioning as a support for the conductive bump group is patterned, for example, by etching or by photoetching to form a lead wire for electrical inspection and a connector portion,
An electrical inspection jig for a wiring board having the above structure can be obtained. In the above structure, if the tip end portion of the conductive bump group exposed on the surface of the insulating layer is plated and reinforced with a metal having a small contact resistance, such as gold, silver, or rhodium,
Damage due to abrasion is prevented and the life can be extended.

In the manufacture of the electrical inspection jig for a wiring board according to the present invention, the conductive metal layer (conductive sheet or foil) having the conductor bump group formed therein may be a single sheet, It may be patterned in advance, and its shape is not particularly limited. In addition, the conductive metal layer forming the supporting base of the conductive bumps 2 (conductive wiring portion) inserted is
It may be used as a common conductive layer, or may be patterned as described above and used as an electrical inspection lead portion or a connector portion.

In the present invention, the conductor bump (group of conductor bumps) is made of, for example, conductive powder such as silver, gold, copper, solder powder, etc., an alloy powder or a composite (mixed) metal powder thereof, and a polycarbonate resin, a polysulfone resin, for example. , A conductive composition prepared by mixing with a binder component such as polyester resin, phenoxy resin, phenol resin, polyimide resin, or a conductive metal. When the bump group is formed of a conductive composition, a conductive bump having a high aspect ratio can be formed by, for example, a printing method using a relatively thick metal mask. Is generally 1
00 to 400 μm is desirable.

On the other hand, as means for forming a bump group with a conductive metal, (a) fine metal particles having a certain shape or size are dispersed on the surface of the conductive metal layer on which an adhesive layer is previously provided, Selectively fixed (may be arranged with a mask at this time), or (b) if the copper foil is used as a conductive metal layer, print / pattern a plating resist,
Copper, tin, gold, silver, solder, etc. are plated to selectively form minute metal pillars (bumps), (c) Applying and patterning a solder resist on the conductive metal layer surface and immersing in a solder bath For example, the formation of a group of minute metal columns (bumps) can be mentioned. Here, the minute metal pillar having no minute metal soul corresponding to the bump may have a multilayer structure or a multilayer shell structure formed by combining different metals. In addition, in the present invention, when the bump group is formed of a conductive composition, the process can be further simplified as compared with the case where it is performed by a method such as a plating method, which is effective in reducing the cost.

In the present invention, examples of the synthetic resin sheet having the conductor bump group inserted therethrough to form a through-type conductor wiring portion include a thermoplastic resin film (sheet), and the thickness thereof is a conductor. Determined by bump height. In other words, since the tips of the conductor bumps arranged to face each other need to be plastically deformed to form a sufficient electrical connection, they are selected and set thinner than the sum of the heights of the conductor bumps forming the pair. It is preferably about 50 to 800 μm.
Here, examples of the thermoplastic resin sheet include sheets of polycarbonate resin, polysulfone resin, thermoplastic polyimide resin, tetrafluoropolyethylene resin, hexafluoropolypropylene resin, polyetheretherketone resin, and the like. Further, as the thermosetting resin sheet to be kept in the pre-curing state, epoxy resin, bismaleimide triazine resin, polyimide resin, phenol resin, polyester resin, melamine resin, or butadiene rubber, butyl rubber, natural rubber, neoprene rubber, silicone rubber Sheets of raw rubber such as. These synthetic resins may be used alone or may contain an insulating inorganic or organic filler, and are a sheet formed by combining with a reinforcing material such as glass cloth or mat, organic synthetic fiber cloth or mat, or paper. It may be.

[0012]

According to the above-mentioned structure, the so-called detection pin is formed by the conductive bump group having a substantially constant height, and the conductive bump group is insulated / separated from each other and the tip portion is exposed. Embedded in the insulator layer. The conductive bump group can be accurately formed in both position and shape, and can be easily penetrated (inserted) through the insulating sheet layer without causing deformation or displacement during pressure molding. , The tip portion is exposed on the surface of the insulating sheet layer. In other words, because it has a narrow-pitch, small-diameter detection pin with high accuracy and certainty, it is possible to perform the required electrical inspection with high accuracy even on a printed wiring board that targets narrow-pitch, small-diameter pads. Becomes

[0013]

Embodiments of the present invention will be described below with reference to FIGS.

Embodiment 1 FIGS. 1 (a) and 1 (b) show an example of the essential structure of an electrical inspection jig for a wiring board according to the present invention, where (a) is a sectional view and (b) is
Is a plan view. In FIGS. 1 (a) and 1 (b), 1 is a conductive metal layer, and 2 is a conductive metal having a substantially uniform height, one end of which is arranged at a predetermined position on the main surface of the conductive metal layer 1. It is a bump. Here, the conductive bump 2 has a function as a detection pin, and the tip portion thereof is previously plated with gold. Reference numeral 3 is an insulator layer that exposes and buries the tip of each conductive bump 2 and separates and insulates each conductive bump 2 from each other. Then, in this configuration example, the conductive metal layer 1 is subjected to so-called patterning treatment to form an electrical inspection lead portion 1a and a connector portion 1b.

FIG. 2 schematically shows a mode of use of the electric inspection jig for a wiring board having the above-mentioned structure. The wiring board is placed on the surface of the mounting table 4 of the continuity inspection machine via, for example, a rubber sheet 5. The electrical inspection jig 6 for wiring is arranged, and the connector portion 1b of the electrical inspection jig 6 for wiring board is connected to the connector of the mounting table 4 of the continuity inspection machine, while the tip of the conductive bump 2 that functions as a detection pin. The part is aligned with and brought into contact with a part to be inspected of a printed wiring board as a part to be inspected, for example, a small-diameter pad part, and a required electrical inspection can be performed.

Next, a manufacturing example of the electrical inspection jig for a wiring board having the above structure will be described.

FIGS. 3 (a), 3 (b) and 3 (c) schematically show an embodiment of the manufacturing process. First, an electrolytic copper foil having a thickness of 35 μm is provided with a conductive metal layer and a polymer type silver-based copper foil. Conductive paste (trade name, thermosetting conductive paste MS-7, Toshiba Chemical KK) of 1.
We prepared metal masks with 3mm holes.
Then, the metal mask is positioned and arranged on one surface of the electrolytic copper foil, a conductive paste is printed, and after the printed conductive paste is dried, it is printed again at the same position using the same mask. Repeated printing times, height 200 ~
A 300 μm chevron-shaped conductive bump 2 was formed (formed).

On the other hand, a synthetic resin sheet 3 having a thickness of 160 μm, for example, a polyetherimide resin film (trade name, Sumilite FS-1400, Sumitomo Bakelite KK) is prepared, and as shown in a sectional view in FIG. The synthetic resin sheet 3 was positioned and arranged so as to face the conductive bumps 2 with respect to the electrolytic copper foil 1 on which the group of conductive bumps 2 was formed (formed), and a laminated body was formed. After that, aluminum foil or a rubber sheet is laminated and arranged as a backing plate (not shown) on the surface of the laminated synthetic resin sheet 3 (not shown), and is arranged between the hot plates of the hot press kept at 170 ° C (see Fig. (Not shown), when the temperature is not lower than the glass point transfer of the synthetic resin sheet 3, preferably in a thermoplasticized state, the resin pressure is maintained at 1 MPa for about 30 minutes, and the conductive pump 2 and the synthetic resin sheet are kept under pressure. When the resin component of the sheet 3 was cured, taken out after cooling, and the aluminum foil or rubber sheet was peeled off, as shown in the sectional view in FIG. 3 (b), the tips of the conductive bumps 2 were made of synthetic resin. A laminate having a conductor wiring portion press-fitted into the sheet 3 and further having a tip portion penetrating the back surface side of the synthetic resin sheet 3 and insulated and separated from each other was formed.

Then, the electroplated copper foil 1 is used as an electrode on the tip of the conductive bump 2 penetrating and exposed on the surface of the synthetic resin sheet 3 of the laminate having the conductor wiring portion, and gold plating is applied to the tip. As shown in a sectional view in FIG. 3 (c), the tips of the conductive bumps 2 were covered with gold 2a. After that, an etching resist is printed on the exposed surface of the electrolytic copper foil 1, the copper foil 1 is selectively removed by etching, and then the etching resist is peeled off with an alkaline aqueous solution.
As shown in (a) and (b), an electric inspection jig for a wiring board integrally provided with an electric inspection lead portion 1a and a connector portion 1b electrically connected to each conductive bump 2 was obtained.

Example 2 FIG. 4 is a cross-sectional view showing an example of the essential structure of an electrical inspection jig for a wiring board in which the electrical inspection lead portion is densified so as to have higher functionality. In the above configuration, an insulator layer 3 for electrically insulating and embedding a group of conductive bumps 2 having a gold plating layer 2a coated on the tip end portion of the detection pin, and an electrical inspection lead portion 1a.
And between the electrolytic copper foil 1 on which the connector portion 1b is formed,
The wiring layers that form the electrical inspection lead portion 1a are formed in a multi-layered manner by making the required interlayer connection.

The wiring board electrical inspection jig arrangement including a plurality of wiring layers can be manufactured by a method similar to that of the first embodiment. That is, first, the thickness of a plurality of sheets
35μm electrolytic copper foil with conductive metal layer, polymer type silver-based conductive paste (trade name, thermosetting conductive paste
MS-7, TOSHIBA CHEMICAL KK), and required metal masks (plural types) in which holes of 0.3 mm diameter were drilled at predetermined locations on an aluminum plate with a plate thickness of 300 μm were prepared. Then, the required metal mask is positioned and arranged on the surface of each of the electrolytic copper foils, and a conductive paste is printed. After the printed conductive paste is dried, the same mask is used to print again at the same position. Printing is repeated 3 times, and the height is 200-300μ.
An m-shaped chevron-shaped conductive bump 2 was formed (shaped).

On the other hand, a synthetic resin sheet 3 having a thickness of 160 μm, for example, a polyether imide resin film (trade name, Sumilite FS-1400, Sumitomo Bakelite KK) is prepared to form (form) the second group of conductive bumps. The synthetic resin sheet 3 was positioned and arranged so as to face the conductive bumps 2 with respect to the first electro-deposited copper foil 1, and a laminated body was formed. Then, an aluminum foil or a rubber sheet is laminated and arranged on the surface of the laminated body as a backing plate, and is placed between the hot plates of a hot press kept at 120 ° C., and the temperature is equal to or higher than the glass point transfer of the synthetic resin sheet 3, preferably. Is held at 1 MPa as the resin pressure in the thermoplasticized state, the tips of the conductive bumps 2 are press-fitted into the synthetic resin sheet 3, and the tips are placed on the back surface side of the synthetic resin sheet 3. A laminated body having conductor wiring portions that penetrate each other and are insulated and separated from each other is formed.

Next, the electroplated copper foil 1 is used as an electrode and gold-plated at the tip of the conductive bump 2 penetrating and exposed on the surface of the synthetic resin sheet 3 of the laminate having the conductor wiring portion. As shown in a sectional view in FIG. 3 (c), the tips of the conductive bumps 2 were covered with gold 2a. Then, an etching resist is printed on the exposed surface of the electrolytic copper foil 1, the copper foil 1 is selectively removed by etching, and then the etching resist is peeled off with an alkaline aqueous solution to electrically connect the conductive bumps 2 to each other. A blank plate having an electrical inspection lead portion 1a connected to is obtained.

In accordance with the above method, each conductive bump 2 '
A laminated body having (a conductor wiring portion for interlayer connection) is manufactured, and the electrolytic copper foil 1 is patterned to obtain only the required electrical inspection lead portion 1a or the required electrical inspection lead portion 1a.
And a blank plate provided with the connector portion 1b is obtained. After that, each of these blanks is laminated and arranged as shown in cross section in Fig. 5, and aluminum foil, rubber sheet, etc. are laminated and arranged as a backing plate on the surface of this laminated body, and hot pressed at 170 ° C. It is placed between the hot plates of 1 MPa, and is held under pressure of 1 MPa as the resin pressure to cure the insulating layer 3 and the conductive bumps 2 and 2'resin, and after cooling, it is taken out and then aluminum foil, rubber sheet, etc. Of the conductive bumps 2'which contribute to the connection between the layers as shown in a sectional view in FIG.
However, an electrical inspection jig for a wiring board of a multi-layer wiring type having a configuration in which it is plastically deformed and electrically connected to the opposing connection surface in an electrically favorable state was obtained.

[0025]

As described above, according to the wiring board inspection jig of the present invention, the so-called detection pins are insulated from each other by the pressure applied in the integrated molding process of the inspection jig. It is possible to easily adopt a configuration in which it is arranged with high accuracy and certainty. In other words, because it is possible to form and arrange minute-diameter detection pins with a narrow pitch by printing or plating, it is possible to use highly reliable electrical wiring for high-density wiring or wiring boards with fine connection pads. An inspection can be done. Moreover, unlike the case of the conventional wiring board inspection jig, the drilling process and the operation of inserting the detection pin are not necessary, and the reliability of the inspection can be improved.
In addition, it can be said to bring many practical advantages because it can be repeatedly subjected to electrical inspection of wiring boards by repeated design changes.

(1) Improving the efficiency of the electrical inspection (reducing man-hours)
Greatly contribute to.

[Brief description of drawings]

FIG. 1 is a sectional view showing a configuration example of a main part of an electric inspection jig for a wiring board according to the present invention, and FIG.

FIG. 2 is a cross-sectional view showing an example of a state in which the electrical inspection jig for a wiring board according to the present invention is mounted on a current inspection machine.

FIG. 3 schematically shows an example of a manufacturing process of an electric inspection jig for a wiring board according to the present invention, in which (a) aligns a conductive metal layer provided with a conductive bump group with an insulator layer. Cross-sectional view of stacked state, (b) cross-sectional view of a state where the conductive bump group is inserted into the insulator layer by pressure integration, (c) is a conductive bump tip part that penetrates the insulator layer FIG. 3 is a cross-sectional view of a state in which a plating layer is covered on the.

FIG. 4 is a cross-sectional view showing another example of the essential structure of a wiring board electrical inspection jig according to the present invention.

FIG. 5 schematically shows another example of the manufacturing process of the electrical inspection jig for a wiring board according to the present invention, and is a cross-sectional view showing the alignment / stacking state of each constituent plate. 1 ... Conductive metal layer 1a ... Electrical inspection lead part 1b ... Connector part 2 ... Conductive bump (forms an electric test pin)
2 '... Conductive bump (forms an interlayer connection conductor) 2a ... Plating coating layer 3 ... Insulator layer (insulating resin-based sheet) 4 ... Mounting table for current inspection machine 5 ... Rubber sheet
6 ... Electrical inspection jig for wiring boards

Claims (2)

[Claims] 1. A conductive metal layer, a conductive bump group having one end connected to a predetermined position on the main surface of the conductive metal layer and having a substantially uniform height, and each of the conductive bump groups. An electrical inspection jig for a wiring board, comprising: an insulating layer that exposes and buries conductive bump tips and separates and insulates each conductive bump from each other. 2. A conductive metal layer having an electrical inspection lead wire portion and a connector portion, and a conductive material having one end connected to a predetermined position on the main surface of the conductive metal layer and having a substantially uniform height. Wiring board, comprising: a conductive bump group; and an insulating layer that exposes / embeds each conductive bump tip of the conductive bump group and separates / insulates each conductive bump from each other. Electrical inspection jig.