JPH0770565B2 - Equipment for joining parts to film carriers - Google Patents

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a device for bonding electronic parts such as ICs to a film carrier by using a single bonding tool.

[0002]

2. Description of the Related Art A conventional device for joining a component to a film carrier (hereinafter simply referred to as a component joining device) will be described with reference to the drawings.

FIG. 2 is a schematic perspective view of a conventional component joining apparatus. In the figure, 1 is a nozzle, 2 is a component sucked and held by the nozzle 1, 3 is a film carrier, 4 is a film carrier 3, and XY is supplied. Transport unit for moving in the direction,
Reference numeral 5 is a bonding tool A, 6 is a bonding tool B, and 7 is a heater for heating the bonding tool A5 and the bonding tool B6.

In the above-described structure, since the conventional component joining apparatus has to make the bonding surfaces of the bonding tools 5 and 6 correspond to the dimensions of the component 2 to be joined, as shown in FIG. A5
By providing B6 and B6, multiple types of parts 2 can be joined.

[0005]

However, in the above-mentioned conventional configuration, since the number of bonding tools A5 and B6 must be increased in correspondence with the number of types of the component 2, in order to perform multi-type component joining, The parts joining device became large in size, and its manufacture was difficult due to the equipment configuration. Therefore, when joining various types of parts, the bonding tool A
There is a problem that 5, 5 must be replaced for each type of parts.

The present invention is intended to solve the above problems,
It is an object of the present invention to provide an excellent component joining apparatus that does not require a bonding tool to be replaced for each type of component.

[0007]

In order to achieve the above object, the present invention has a plurality of tool tips arranged in a circle and provided with a rotary ring which moves in the Z direction at the same time as rotation switching and bonding tools. Is.

[0008]

Therefore, according to the present invention, by selecting the tool tip corresponding to each type of component from the rotary ring, it is possible to join a plurality of types of components, and to bond a number of bonding corresponding to the number of types of components. It is not necessary to provide a large number of tools, and one bonding tool can be used to join various types of parts.

[0009]

DESCRIPTION OF THE PREFERRED EMBODIMENTS In the following, with respect to one embodiment of the present invention, the same parts as those of FIG. 2 are denoted by the same reference numerals, detailed description thereof will be omitted, and different points will be described.

FIG. 1 shows a schematic structure of a component joining apparatus according to an embodiment of the present invention. In the figure, a nozzle 1 can be moved to arbitrary positions in XYZ and θ directions. 8 is a bonding tool 9 is a part 2 of each type
It is possible to join a plurality of types of components 2 to the film carrier 3 with a tool tip having a different shape corresponding to. 10 has a plurality of tool tips 9 arranged in a circle,
It is a rotary ring capable of switching the rotation of each tool tip 9 and moving in the Z direction simultaneously with the bonding tool 8. A heater 7 is attached to the bonding tool 8 and is in a state of being heated to a high temperature.

Next, the operation of the above structure will be described. The component 2 sucked and held by the nozzle 1 and the film carrier 3 are adjusted to the center of the bonding tool 8 in the XY directions on the bonding tool 8 by means such as recognition.
Further, the parts 2 and the film carrier 3 are aligned in the XY and θ directions, and the parts 2 are moved in the Z direction onto the surface of the film carrier 3. In parallel with this operation, the tool tip 9 corresponding to the component 2 is rotationally switched onto the bonding tool 8. At this time, the tool tip 9 comes into contact with the bonding tool 8 to be heated by the heat of the heater 7. Since the tool tip 9 has a much smaller heat capacity than the bonding tool 8, it is instantly heated to a predetermined temperature. In the heated state, the rotary ring 10 and the bonding tool 8 are raised in the Z direction, and the tool tip 9 applies heat and pressure to the film carrier 3 and the component 2 to move the component 2 to the film carrier 3.
To join.

When joining the next component 2 to the film carrier 3, the tool tip 9 is attached to the rotary ring 10.
Are rotated and switched, and are joined in the same manner.

As described above, according to the above-described embodiment, it is possible to bond various kinds of components 2 to the film carrier 3 with one bonding tool 8.

[0014]

As is apparent from the above embodiment, the present invention differs from a bonding tool that moves in the Z direction by being pressed and heated when joining a component to a film carrier, and differs depending on a plurality of types of components. Tool tips with different shapes are arranged in a circle, and each is equipped with a rotary ring that switches in rotation and moves in the Z direction at the same time as the bonding tool. It has the advantage of being able to do so.

[Brief description of drawings]

FIG. 1 is a schematic perspective view of a main part of a component joining device according to an embodiment of the present invention.

FIG. 2 is a schematic perspective view of a main part of a conventional component joining device.

[Explanation of symbols]

 1 Nozzle 2 Parts 3 Film Carrier 4 Conveying Section 8 Bonding Tool 9 Tool Tip 10 Rotary Ring

Claims (1)

[Claims] 1. A nozzle that moves in XYZ and θ directions while adsorbing a component, a film carrier that joins the component, a transport unit that conveys the film carrier, and pressure and heat when joining the component to the film carrier. A device for bonding a component to a film carrier, which includes a bonding tool that moves in the Z direction and a rotary ring that has a plurality of tool tips arranged circumferentially and that moves in the Z direction simultaneously with rotation switching and the bonding tool.