JP3436980B2 - Apparatus and method for assembling thermoelectric device - Google Patents

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a thermoelectric element assembly device and method for assembling a thermoelectric element device in which a plurality of thermoelectric elements are connected via metal conductors.

[0002]

2. Description of the Related Art As a cooling device used for a refrigerating box of an automobile, a thermoelectric element utilizing a Peltier effect in which heat is absorbed at a joint between two dissimilar metals when a current is passed through the joint. The device is known. This thermoelectric device has, for example, a configuration in which a large number of thermoelectric devices made of semiconductors are connected in series by electrodes made of metal conductors. In a conventional thermoelectric device assembling method, a thin plate of a thermoelectric element having a predetermined thickness is fixed with an adhesive tape, cut into a predetermined dimension with a thin blade, and peeled off one by one from the adhesive tape, for example, by soldering to an electrode. It was fixed.

[0003]

However, in the conventional method for assembling the thermoelectric element device, the thermoelectric element is held by the holding means, and the solder is melted by the heating means. In addition, there is a problem that it is difficult to fix each thermoelectric element with high accuracy. Further, since the heights of the thermoelectric elements are made uniform, it is necessary to hold down the thermoelectric elements and wait until the solder is solidified, and there is a problem that it takes time to assemble using a large number of thermoelectric elements. Therefore, the first aspect of the present invention
It is an object of the present invention to provide an assembling apparatus and method for a thermoelectric element device that can fix the thermoelectric element with high accuracy and in a short time. A second object of the present invention is to provide an assembling apparatus and method for a thermoelectric element device capable of simultaneously fixing a plurality of thermoelectric elements in addition to the above objects.

[0004]

The invention according to claim 1 is
A thermoelectric element device assembling apparatus for assembling a thermoelectric element device comprising a plurality of thermoelectric elements connected via a metal conductor,
It has a conductive adsorption part, which adsorbs the thermoelectric element and conveys it onto the heat-melting conductive bonding material layer formed on the metal conductor, and puts it in contact with this conductive bonding material layer. A carrier holding means for holding and a state in which the thermoelectric element is in contact with the conductive bonding material layer, so that the conductive bonding material layer melts due to heat generation between the thermoelectric element and the conductive bonding material layer, the adsorption portion, the thermoelectric element, It is provided with a conductive bonding material layer and a current-carrying means for supplying current to the metal conductor. A thermoelectric element device assembling apparatus according to claim 2 is the thermoelectric element device assembling apparatus according to claim 1,
The carrying and holding means has a plurality of adsorption portions, and these adsorption portions simultaneously convey a plurality of thermoelectric elements onto a plurality of conductive bonding material layers and hold them in contact with these conductive bonding material layers. . A thermoelectric element device assembling apparatus according to claim 3 is the thermoelectric element device assembling apparatus according to claim 2,
In the thermoelectric element device, two kinds of thermoelectric elements are alternately arranged in two directions orthogonal to each other on a plane, and thermoelectric elements of the same kind are arranged at a pitch four times the width of the thermoelectric elements. A plurality of adsorption parts are arranged at the same intervals as the intervals of the same type of thermoelectric elements in the thermoelectric element device. The thermoelectric element device assembling apparatus according to claim 4 is the thermoelectric element apparatus assembling apparatus according to any one of claims 1 to 3, wherein the energizing means conducts conductive bonding with the thermoelectric element after the conductive bonding material layer is melted. The current is passed in the opposite direction so that heat is absorbed between the material layer and the conductive bonding material layer is solidified. A thermoelectric element device assembling apparatus according to claim 5 is the thermoelectric element apparatus assembling apparatus according to any one of claims 1 to 4, wherein the thermoelectric element and the metal conductor are lower than a temperature at which the conductive bonding material layer melts. It further comprises a heating means for heating to a predetermined temperature. A sixth aspect of the present invention is a method for assembling a thermoelectric element device in which a plurality of thermoelectric elements are connected via a metal conductor to assemble a thermoelectric element device, wherein a heat-meltable conductive bonding material layer is provided on the metal conductor. Procedure for forming, a step of holding the thermoelectric element in contact with the conductive bonding material layer, a thermoelectric element so that the conductive bonding material layer is melted by heat generation between the thermoelectric element and the conductive bonding material layer, The procedure includes applying a current to the conductive bonding material layer and the metal conductor to melt the conductive bonding material layer and bond the thermoelectric element and the metal conductor via the conductive bonding material layer. The method for assembling the thermoelectric device according to claim 7 is the method for assembling the thermoelectric device according to claim 6, wherein the holding procedure is such that the plurality of thermoelectric devices are simultaneously in contact with the plurality of conductive bonding material layers. To hold. An assembling method of the thermoelectric element device according to claim 8 is the assembling method of the thermoelectric element device according to claim 6 or 7, wherein the joining step is performed after the conductive bonding material layer is melted and then the thermoelectric element and the conductive bonding material layer are joined. In order to absorb heat between the layers and solidify the conductive bonding material layer, the direction of the current is reversed and the current is applied. The thermoelectric element device assembling method according to claim 9 is the thermoelectric element device assembling method according to any one of claims 6 to 8, wherein the joining procedure is such that the thermoelectric element and the metal conductor are preliminarily provided before energization. It includes heating to a predetermined temperature lower than the temperature at which the conductive bonding material layer melts.

[0005]

In the apparatus for assembling the thermoelectric device according to claim 1,
The transport holding means adsorbs the thermoelectric element, transports it onto the conductive bonding material layer formed on the metal conductor, and holds it in contact with the conductive bonding material layer. And in this state,
The energizing means energizes the adsorption portion, the thermoelectric element, the conductive bonding material layer, and the metal conductor so that the conductive bonding material layer melts due to heat generation between the thermoelectric element and the conductive bonding material layer. As a result, the conductive bonding material layer is melted, and the thermoelectric element and the metal conductor are bonded via the conductive bonding material layer. In the assembling apparatus of the thermoelectric element device according to the second aspect, the transport holding means simultaneously transports the plurality of thermoelectric elements onto the plurality of conductive bonding material layers and holds them in contact with these conductive bonding material layers. Claim 3
In the thermoelectric element assembly apparatus described, since the plurality of adsorption portions of the transport holding means are arranged at the same intervals as the intervals of the same type of thermoelectric element arranged at a pitch four times the width of the thermoelectric element, the semiconductor When creating a thermoelectric element by cutting a plate such as a wafer, the carrier holding means takes out a plurality of thermoelectric elements from the plate such as the semiconductor wafer after cutting, without changing the positional relationship of these thermoelectric elements, Can be transported and held. In the thermoelectric element assembly apparatus according to claim 4, after the conductive bonding material layer is melted, heat is generated between the thermoelectric element and the conductive bonding material layer by the energizing means so that the conductive bonding material layer is solidified. , The electric current is applied in the opposite direction, and the conductive bonding material layer is solidified. In the thermoelectric element device assembling apparatus according to claim 5, by heating the thermoelectric element and the metal conductor in advance to a predetermined temperature lower than the temperature at which the conductive bonding material layer melts by the heating means, The time until the conductive bonding material layer is melted by energization is shortened. In the method for assembling a thermoelectric element device according to claim 6, a thermomelting conductive bonding material layer is formed on a metal conductor, and the thermoelectric element is held in contact with the conductive bonding material layer, and the thermoelectric element and the conductive material are electrically connected to each other. The thermoelectric element, the conductive bonding material layer, and the metal conductor are energized so that heat is generated between the thermoelectric element, the conductive bonding material layer, and the metal conductor so that the conductive bonding material layer is melted and the thermoelectric power is generated through the conductive bonding material layer. Join the element and the metal conductor. In the method for assembling the thermoelectric device according to claim 7,
The plurality of thermoelectric elements are simultaneously held in contact with the plurality of conductive bonding material layers. In the method of assembling the thermoelectric element device according to claim 8, after the conductive bonding material layer is melted, heat is absorbed between the thermoelectric element and the conductive bonding material layer to solidify the conductive bonding material layer. Is reversed and electricity is applied to solidify the conductive bonding material layer. In the method for assembling the thermoelectric device according to the ninth aspect, the thermoelectric device and the metal conductor are heated in advance to a predetermined temperature lower than the temperature at which the conductive bonding material layer melts before being energized. This shortens the time until the conductive bonding material layer is melted by energization.

[0006]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Embodiments of a thermoelectric device assembling apparatus and method according to the present invention will be described below in detail with reference to the drawings. 1 and 2 show the construction of an assembling apparatus for a thermoelectric device according to a first embodiment of the present invention. Note that FIG.
2 is a sectional view taken along the line AA ′ of FIG. As shown in these drawings, the assembling apparatus of the thermoelectric device according to the present embodiment includes a transfer jig 10 as a transport holding means mounted on a transfer apparatus (not shown). The transfer jig 10 includes a main body 11 and
Two legs 12 extending downward from the main body 11 and an insulator 1 made of a good conductor of heat are provided on the lower ends of the legs 12.
It has a total of four conductive suction pads 14 connected to each other through two.

An opening is provided at the lower end surface of each suction pad 14, and a suction passage 16 formed through the inside of the leg 12 and the inside of the main body 11 communicates with this opening. The base of this suction passage 16 is connected to a vacuum suction device 17. Then, by operating the vacuum suction device 17, the suction pad 14 sucks and holds the thermoelectric element 20. In addition, the transfer jig 11
Incorporates a heater whose temperature can be adjusted as a heating means, and heats the thermoelectric element 20 held by the suction pad 14 by the heater to a predetermined temperature lower than the temperature at which the solder described later melts. It has become.

The thermoelectric element device assembling apparatus according to the present embodiment further includes a gantry 21, and the gantry 21 incorporates a heater whose temperature can be adjusted as a heating means. An insulating substrate 22 having a lower metal conductor 23 made of copper or the like fixed to a surface thereof in a predetermined pattern is placed on the pedestal 21. Further, two solder layers 24 as conductive bonding material layers are formed on each lower metal conductor 23 at predetermined intervals. Then, the transfer jig 11 is configured to adsorb and hold the thermoelectric element 20 by each adsorption pad 14, convey it to each solder layer 24, and hold it in contact with the solder layer 24. There is.

In the thermoelectric device assembled by the thermoelectric device assembling apparatus of this embodiment, as shown in FIG. 5, a thermoelectric device (shown by symbol P in the figure) 20P made of a P type semiconductor and an N type. Two types of thermoelectric elements 2 of a thermoelectric element (denoted by symbol N in the figure) 20N made of a semiconductor
0 (representing 20P and 20N) are alternately arranged in fours in two orthogonal directions x and y on the plane, and the thermoelectric elements 20 of the same kind have a pitch 4p which is four times the width of the thermoelectric elements 20. It is located in. Further, FIG. 4 shows the thermoelectric element 2
A part of the semiconductor wafer 26 cut out from 0 is shown, and the width of the thermoelectric element 20 matches the cut width of the semiconductor wafer 26. Further, as shown in FIG. 5, the lower metal conductor 23 includes two thermoelectric elements 20P, 20 adjacent to each other in the y direction.
It is arranged to connect N. In addition, the adsorption pad 14 in the thermoelectric device assembly apparatus of the present embodiment has the same pitch as the space between the thermoelectric devices 20 of the same kind in the thermoelectric device, that is, the pitch 4 which is four times the width of the thermoelectric device 20.
It is arranged by p.

The thermoelectric element device assembling apparatus according to the present embodiment further includes two electrically conductive energizing jigs 3 that are in contact with the metal conductor 23.
It has 0. FIG. 3A is a front view of the energizing jig 30,
FIG. 3B shows a left side view of the energizing jig 30. As shown in these figures, each energizing jig 30 has a main body 31.
And has two leg portions 32 extending downward from the main body 31. The two legs 32 are arranged at a pitch 4p that is four times the width of the thermoelectric element 20. Each energizing jig 30 is
It is attached to a moving device (not shown) capable of moving in the x, y directions and the vertical direction, and is arranged along the x direction so as to pass through the central portion of the lower metal conductor 23, as shown in FIGS. The leg portions 32, 32 of the lower metal conductor 23 come into contact with each other in the central portion of the lower metal conductor 23, that is, between the two solder layers 24, 24.

The thermoelectric device assembling apparatus of this embodiment further comprises, as energizing means, a cable 33a having one end connected to each suction pad 14, and a cable 33b having one end connected to each energizing jig 30. These cables 33a, 33
and a power supply device 35 to which the other end of b is connected. Then, these cables 33a and 33b and the power supply device 3
5, while the thermoelectric element 20 is in contact with the solder layer 24, the adsorption pad 14, the thermoelectric element 20, so that the Peltier effect generates heat between the thermoelectric element 20 and the solder layer 24 to melt the solder layer 24. After the solder layer 24, the lower metal conductor 23, and the current-carrying jig 30 are energized, and the solder layer 24 is melted, heat absorption due to the Peltier effect occurs between the thermoelectric element 20 and the solder layer 24, and the solder layer 24 is In order to solidify, the direction of the electric current is reversed and electricity is applied.

Next, a method of assembling a thermoelectric device using the thermoelectric device assembling apparatus of this embodiment will be described. (1) First, the lower metal conductor 23 is fixed to a predetermined position on the insulating substrate 22. (2) Next, two solder pieces each having a size substantially equal to the size of the lower end surface of the thermoelectric element 20 are placed on a predetermined position of each lower metal conductor 23, and heat is applied to the solder pieces to the lower side. Metal conductor 23
Join on top. (3) Next, the upper surface of each solder piece joined on the lower metal conductor 23 is ground to make the height of the upper surface of the solder piece uniform, and the solder layer 2
4 is formed.

(4) Next, the insulating substrate 22 is placed on the gantry 21, and the heater incorporated in the gantry 21 causes the lower metal conductor 23 to reach a predetermined temperature slightly lower than the melting temperature of the solder layer 24. Hold. Hereinafter, an example in which the thermoelectric element 20P made of a P-type semiconductor is first fixed will be described, but the thermoelectric element 20N made of an N-type semiconductor will be described.
May be fixed first. (5) Next, using the transfer device, the transfer jig 10 and the vacuum suction device 17 from the P-type semiconductor wafer 26 after cutting,
Four thermoelectric elements 20P having a positional relationship indicated by diagonal lines in FIG. 4 are taken out, the thermoelectric elements 20P are conveyed onto the solder layer 24, and brought into contact with the upper surface of the solder layer 24. that time,
A thermoelectric element 20 is provided by a heater built in the transfer jig 10.
P is kept at a predetermined temperature slightly lower than the temperature at which the solder layer 24 melts.

(6) Next, the energizing jig 30 is arranged along the x direction so as to pass through the central portion of the lower metal conductor 23, and the two leg portions 32, 32 are placed in the central portion of the lower metal conductor 23. Contact the part. (7) Next, by the energizing device 35, the adsorption pad 14 and the thermoelectric element 20 are arranged so that the Peltier effect generates heat between the thermoelectric element 20P and the solder layer 24 to melt the solder layer 24.
P, solder layer 24, lower metal conductor 23 and energizing jig 30
Is applied to melt the solder layer 24. The energizing device 35 can detect whether or not the thermoelectric element 20P is a defective element by monitoring the energizing current when energizing the energizing jig 30. When the thermoelectric element 20P is found to be a defective element, the power supply is immediately stopped and the semiconductor layer 24 is turned off.
Before melting, the defective element is removed and the other thermoelectric element 2
Replace with 0P. (8) When the thermoelectric element 20P has no defect and the solder layer 24 is melted, the direction of the current is reversed to cause heat absorption by the Peltier effect between the thermoelectric element 20P and the solder layer 24, and the solder layer 24 is solidified. The thermoelectric element 2 through the solder layer 24.
The 0P and the lower metal conductor 23 are joined.

Thereafter, the steps (5) to (8) are repeated to fix all the thermoelectric elements 20P on the lower metal conductor 23. (9) Next, the thermoelectric element 20N made of an N-type semiconductor is fixed on the lower metal conductor 23 by the same procedure as the above (5) to (8). In this case, the direction of current flow is opposite to that when the thermoelectric element 20P made of a P-type semiconductor is fixed during both heat generation and heat absorption.

FIG. 5 is a plan view showing a state in which all the thermoelectric elements 20 are fixed on the lower metal conductor 23 by the above procedure, and FIG. 6 is a sectional view taken along the line BB 'in FIG. (10) Next, as shown in FIG. 7, the upper metal conductor 38 is joined to the upper surface of each thermoelectric element 20 using solder or the like.
In the upper metal conductor 38, a thermoelectric element 20P made of a P-type semiconductor and a thermoelectric element 20N made of an N-type semiconductor are alternately connected in series from the terminal 39a to the terminal 39b via the upper metal conductor 38 and the lower metal conductor 23. As described above, the lower metal conductor 23 and the lower metal conductor 23 are displaced from each other. Note that FIG.
In order to clarify the connection relationship with the upper semiconductor, the lower metal conductor 23 is shown in a small size and is shown by diagonal lines, and a part thereof is omitted.

As described above, according to this embodiment,
The thermoelectric element 20 is transferred onto the solder layer 24 by the transfer jig 10 or the like, and is brought into contact with the upper surface of the solder layer 24.
The adsorption pad 14, the thermoelectric element 20, the solder layer 24, the lower metal conductor 23, and the energization jig 30 are energized, and the thermoelectric element 20 itself is used to melt the solder layer 24 by heat generation by the Peltier effect, and further Reverse the orientation of the solder layer 2
Since the thermoelectric element 20 is solidified and the thermoelectric element 20 is joined to the lower metal conductor 23, the fixing work of the thermoelectric element 20 is simplified, and the thermoelectric element 20 can be fixed accurately and in a short time. it can.

Further, according to this embodiment, four thermoelectric elements 20 can be fixed at the same time, and the time for fixing the thermoelectric elements 20 can be further shortened. In addition, a thermoelectric element 20 of the same type is provided with a pitch 4 which is four times the width of the thermoelectric element 20.
p, and the four suction pads 14 of the transfer jig 10 are
Since the thermoelectric elements 20 are arranged at the same intervals as the thermoelectric elements 20 of the same type,
When the semiconductor wafer 26 is cut to form the thermoelectric elements 20, the transfer jig 10 takes out the four thermoelectric elements 20 from the semiconductor wafer 26 after cutting, and transfers these thermoelectric elements 2 to each other.
It can be transported without changing the positional relationship of 0. Further, according to the present embodiment, the thermoelectric element 20 and the lower metal conductor 23 are heated in advance to a predetermined temperature lower than the temperature at which the solder layer 24 melts. The time until 24 melts can be shortened.

FIG. 8 shows the construction of an assembling apparatus for a thermoelectric device according to the second embodiment of the present invention. In this example,
The energizing jig is attached to the transfer jig 10. An energizing jig holder 41 is attached to the lower end surface of the main body 11 of the transfer jig 10, and the energizing jig 4 is placed in the energizing jig holder 41.
The upper part of 2 is inserted and prevented from coming off. The energizing jig 42 includes a main body 43 made of an insulator and a main body 4
3 has two conductive leg portions 44 extending downward. The two leg portions 44 are arranged at a pitch 4p, which is four times the width of the thermoelectric element 20, as with the leg portion 32 of the energizing jig 30 shown in FIG. 2, and are held by the adsorption pad 14. It is provided at a position such that when the 20 is abutted on the solder layer 24, it contacts the central portion (between the two solder layers 24, 24) of the lower metal conductor 23.

A part of the upper side of the main body 43 of the energizing jig 42 is inserted into the energizing jig holder 41, and the legs 44 are insulated from the transfer jig 10. Further, the inner upper surface of the energizing jig holder 41 and the main body 43 of the energizing jig 42.
A spring 45 is provided between the upper surface and the upper surface of the device, and the spring 45 urges the energizing jig 42 downward. Further, when no force is applied to the energizing jig 42, the lower end surface of the leg portion 44 of the energizing jig 42 is longer than the thickness of the thermoelectric element 20 and the solder layer 24 from the lower end surface of the suction pad 14. It is located below. In addition, although not shown, the energizing jig 4
A cable 33b for connecting to the energizing device 35 is connected to the second leg portion 44.

In the transfer jig 10 of this embodiment having the above structure, the suction pad 14 for sucking the thermoelectric element 20
When the four thermoelectric elements 20P indicated by the diagonal lines in FIG. 4 are taken out, the energizing jig 42 extending below the transfer jig 10 descends to come into contact with the adjacent thermoelectric element and move upward. And is housed in the energizing jig holder 41. Further, when the taken out thermoelectric element 20 is brought into contact with the solder layer 24 by the movement of the transfer jig 10, the leg portion 44 of the energizing jig 42 is pressed against the central portion of the lower metal conductor 23 by the spring 45. . As described above, according to the present embodiment, the labor for positioning the energizing jig 42 separately from the transfer jig 10 can be saved, and the work becomes simpler. Incidentally, in the present embodiment, the energizing jig 42 is attached only to one side (the left side of the suction pad 14 in FIG. 8) corresponding to each suction pad 14. Therefore, the thermoelectric element 20 made of the N-type semiconductor
When N is bonded, the semiconductor substrate 24 and the lower metal body 23 are attached to the insulating substrate 22 or the pedestal 21 on which the insulating substrate 22 is mounted is rotated 180 degrees, and then the N is joined. Alternatively, the insulating substrate 22 and the gantry 21 may be left as they are, and the transfer jig 10 may be rotated 180 degrees. Further, in the present embodiment, one energizing jig 42 is arranged for each suction pad 14, but four energizing jigs 42 may be arranged around the energizing jig 42. By arranging four, P type, N
When joining any of the thermoelectric elements 20 of the mold, it is not necessary to rotate the insulating substrate 22, the gantry 21, and the energizing jig 42, and the workability is improved. Further, when the thermoelectric element 20 is taken out from the semiconductor wafer 26, the four peripheral thermoelectric elements are pressed by the energizing jig 42, so that the positional displacement of the peripheral thermoelectric elements can be effectively prevented. Other configurations, operations and effects are similar to those of the first embodiment.

The present invention is not limited to the above-mentioned embodiments. For example, in the embodiment, four thermoelectric elements 20 are processed at the same time, but they may be processed one by one. You may make it process several simultaneously except four. When processing multiple pieces at the same time, suction pad 1
The arrangement of 4 is not limited to a pitch of 4 times the width of the thermoelectric element 20, and may be a pitch of 4n (n is an integer of 2 or more) times such as 8 times or 12 times. In addition, after the solder layer 24 is melted by energization, the energization may be stopped and the solder layer 24 may be naturally cooled and solidified.

[0023]

As described above, according to the invention described in any one of claims 1 to 9, the thermoelectric element is brought into contact with the heat-meltable conductive bonding material layer formed on the metal conductor. The thermoelectric element, the conductive bonding material layer, and the metal conductor are energized so that the conductive bonding material layer melts by generating heat between the thermoelectric element and the conductive bonding material layer to melt the conductive bonding material layer. Since the thermoelectric element and the metal conductor are joined via the conductive joining material layer, there is an effect that the thermoelectric element can be fixed accurately and in a short time. Further, according to the invention of claim 2 or 7, since a plurality of thermoelectric elements are simultaneously held in contact with a plurality of conductive bonding material layers, a plurality of thermoelectric elements can be added in addition to the first effect. The thermoelectric elements can be fixed at the same time, and the working time can be further shortened. According to the third aspect of the invention, the plurality of adsorption portions of the transport holding means are arranged at the same intervals as the intervals of the same kind of thermoelectric elements arranged at a pitch four times the width of the thermoelectric elements in the thermoelectric element device. Therefore, in addition to the above-described second effect, when a plate such as a semiconductor wafer is cut to form a thermoelectric element, the transport holding unit takes out a plurality of thermoelectric elements from the plate such as the semiconductor wafer after cutting, There is an effect that they can be transported without changing the positional relationship of these thermoelectric elements. According to the invention of claim 4 or 8, after the conductive bonding material layer is melted, heat is absorbed between the thermoelectric element and the conductive bonding material layer to solidify the conductive bonding material layer. Since the direction is reversed to energize to solidify the conductive bonding material layer, there is an effect that the working time can be further shortened in addition to the above respective effects. Further, according to the invention of claim 5 or 9, by heating the thermoelectric element and the metal conductor in advance to a predetermined temperature lower than the temperature at which the conductive bonding material layer melts, before energizing. In addition to the above respective effects, there is an effect that the time until the conductive bonding material layer is melted by energization can be shortened.

[Brief description of drawings]

FIG. 1 is a cross-sectional view showing a configuration of an assembly device of a thermoelectric element device according to a first embodiment of the present invention.

FIG. 2 is a sectional view taken along the line AA ′ of FIG.

FIG. 3 is an explanatory diagram showing a current-carrying jig in FIG. 1.

FIG. 4 is an explanatory view showing a part of a semiconductor wafer from which the thermoelectric element in FIG. 1 is cut out.

FIG. 5 is a plan view showing an arrangement of lower metal conductors and thermoelectric elements in the thermoelectric element device to which the first embodiment of the present invention is applied.

6 is a cross-sectional view taken along the line BB ′ of FIG.

FIG. 7 is a plan view showing an arrangement of a lower metal conductor, a thermoelectric element and an upper metal conductor in a thermoelectric device to which the first embodiment of the present invention is applied.

FIG. 8 is a cross-sectional view showing a configuration of an assembling device for a thermoelectric element device according to a second embodiment of the present invention.

[Explanation of symbols]

10 Transfer jig 14 Suction pad 17 Vacuum suction device 20 thermoelectric element 21 stand 22 Insulating substrate 23 Lower metal conductor 24 Solder layer 30 energizing jig 33a, 33b cable 35 energizer 38 Upper metal conductor

─────────────────────────────────────────────────── ─── Continuation of the front page (72) Inventor Junhiro Sato 4-3-1 Yashiki, Narashino City, Chiba Seiko Seiki Co., Ltd. (58) Fields investigated (Int.Cl. ⁷ , DB name) H01L 35 / 34 H01L 35/32

Claims (9)

(57) [Claims] 1. A thermoelectric element assembly apparatus for assembling a thermoelectric element device, comprising a plurality of thermoelectric elements connected via a metal conductor, comprising a conductive adsorbing part, wherein the adsorbing part forms a thermoelectric element. A carrier holding means that adsorbs and conveys it onto the heat-melting conductive bonding material layer formed on the metal conductor and holds it in contact with the conductive bonding material layer, and the thermoelectric element contacts the conductive bonding material layer. In this state, the adsorbing part, the thermoelectric element, the conductive bonding material layer, and a current-carrying means for supplying current to the conductive material so that the conductive bonding material layer melts by generating heat between the thermoelectric element and the conductive bonding material layer. An apparatus for assembling a thermoelectric device, characterized in that 2. The carrying and holding means has a plurality of the adsorbing portions, and the adsorbing portions simultaneously convey a plurality of thermoelectric elements onto a plurality of conductive bonding material layers and contact the conductive bonding material layers. The thermoelectric element device assembling apparatus according to claim 1, wherein the thermoelectric element apparatus is held in a state. 3. The thermoelectric element device, wherein two types of thermoelectric elements are alternately arranged in two directions orthogonal to each other on a plane, and thermoelectric elements of the same type are arranged at a pitch of four times the width of the thermoelectric elements. The plurality of suction portions of the transport holding means are
The thermoelectric element device assembling apparatus according to claim 2, wherein the thermoelectric element devices are arranged at the same intervals as the intervals of the thermoelectric elements of the same type in the thermoelectric element device. 4. The energizing means reverses the direction of the current so that heat is generated between the thermoelectric element and the conductive bonding material layer to solidify the conductive bonding material layer after the conductive bonding material layer is melted. The thermoelectric element device assembling apparatus according to any one of claims 1 to 3, wherein the thermoelectric element device assembling apparatus is energized by supplying electricity. 5. The heating means for heating the thermoelectric element and the metal conductor to a predetermined temperature lower than a temperature at which the conductive bonding material layer melts, further comprising heating means. The thermoelectric element device assembling apparatus according to claim 1. 6. A method of assembling a thermoelectric element device, comprising assembling a plurality of thermoelectric elements via a metal conductor, the method comprising assembling a thermomeltable conductive bonding material layer on a metal conductor. And a procedure for holding the thermoelectric element in contact with the conductive bonding material layer, and a thermoelectric element and a conductive bonding material so that the conductive bonding material layer melts due to heat generation between the thermoelectric element and the conductive bonding material layer. A method of assembling a thermoelectric element device, comprising the steps of energizing a layer and a metal conductor to melt the conductive bonding material layer and bonding the thermoelectric element and the metal conductor via the conductive bonding material layer. 7. The method of assembling a thermoelectric element device according to claim 6, wherein the holding step holds a plurality of thermoelectric elements in contact with a plurality of conductive bonding material layers at the same time. 8. The procedure of the joining is such that, after the conductive bonding material layer is melted, heat is absorbed between the thermoelectric element and the conductive bonding material layer and the conductive bonding material layer is solidified so that the current direction is reversed. The method for assembling a thermoelectric element device according to claim 6 or 7, further comprising energizing the device. 9. The step of joining includes heating the thermoelectric element and the metal conductor in advance to a predetermined temperature lower than a temperature at which the conductive joining material layer melts before energizing. The method for assembling the thermoelectric device according to any one of claims 6 to 8.