JPH0768540B2 - Cleaning composition - Google Patents

Cleaning composition

Info

Publication number
JPH0768540B2
JPH0768540B2 JP1196626A JP19662689A JPH0768540B2 JP H0768540 B2 JPH0768540 B2 JP H0768540B2 JP 1196626 A JP1196626 A JP 1196626A JP 19662689 A JP19662689 A JP 19662689A JP H0768540 B2 JPH0768540 B2 JP H0768540B2
Authority
JP
Japan
Prior art keywords
flux
cleaning
carbon atoms
cleaning composition
present
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP1196626A
Other languages
Japanese (ja)
Other versions
JPH0362895A (en
Inventor
宏造 北澤
雅之 武田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kao Corp
Original Assignee
Kao Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kao Corp filed Critical Kao Corp
Priority to JP1196626A priority Critical patent/JPH0768540B2/en
Publication of JPH0362895A publication Critical patent/JPH0362895A/en
Publication of JPH0768540B2 publication Critical patent/JPH0768540B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Description

【発明の詳細な説明】 〔産業上の利用分野〕 本発明は電子部品用洗浄剤組成物、特にプリント基板か
らのはんだフラックス及びフラックス残渣の除去に使用
される洗浄剤組成物に関する。
Description: TECHNICAL FIELD The present invention relates to a cleaning composition for electronic parts, and more particularly to a cleaning composition used for removing solder flux and flux residues from a printed circuit board.

〔従来の技術〕[Conventional technology]

一般に、電子機器等で使用されるプリント基板は、ガラ
ス、エポキシ樹脂等の積層板上に回路を作成し、この回
路にICチップ等の電子部品をはんだ付けすることによっ
て製造されるが、このはんだ付けを完全かつ速やかに行
うために、はんだ付けに先立ってフラックス処理が行わ
れている。しかし、フラックスやフラックス残渣は回路
の電気特性等を悪化させるので、はんだ付け後洗浄剤を
用いて除去している。
Generally, a printed circuit board used in electronic equipment is manufactured by forming a circuit on a laminated plate of glass, epoxy resin, etc., and soldering an electronic component such as an IC chip to this circuit. In order to perform the soldering completely and quickly, the flux treatment is performed before the soldering. However, since the flux and the flux residue deteriorate the electrical characteristics of the circuit, they are removed by using a cleaning agent after soldering.

この洗浄剤としては、これまで多くの水系又は溶媒系の
洗浄剤が提案されているが、実際には、引火点がなく、
化学的にも変化しにくい塩素系あるいはフロン系の溶剤
が使用されている。
As this cleaning agent, many water-based or solvent-based cleaning agents have been proposed so far, but in reality, there is no flash point,
A chlorine-based or chlorofluorocarbon-based solvent that does not change chemically is used.

また、近年、環境汚染が少なくかつ安全性の高い洗浄剤
として、米国特許第4,511,488号明細書、同第4,640,719
号明細書、同第4,740,247号明細書等に見られるような
リモネン、ピネン、ジペンテン等のテルペン類も提案さ
れている。
Further, in recent years, as a cleaning agent with low environmental pollution and high safety, U.S. Pat. No. 4,511,488, 4,640,719.
Also proposed are terpenes such as limonene, pinene, dipentene and the like as found in Japanese Patent No. 4,740,247 and the like.

〔発明が解決しようとする課題〕[Problems to be Solved by the Invention]

しかし、これらの洗浄剤はいずれを取っても、フラック
ス除去性、プリント基板に付着した洗浄剤のリンス性及
び低毒性という、洗浄剤組成物に要求される条件のすべ
てを満たすようなものではなかった。すなわち、塩素系
及びフロン系の溶剤を用いる洗浄剤は、安全性、毒性、
環境汚染性等に大きな問題を有しており、水系洗浄剤
は、溶剤系洗浄剤に比較して危険性と毒性が低い点では
好ましいが、フラックス除去性において数段劣ってい
る。また、リモネンに代表されるテルペン類は、安全性
とフラックス除去性を両立させ得る化合物であるが、リ
ンス性に難点があり温水等ではリンスができないという
問題であるばかりでなく、天然物由来のために安定品質
のものが得難く、高価でかつ供給量に限界があり、実際
的でない。
However, even if these cleaning agents are taken, they do not satisfy all the conditions required for the cleaning agent composition, such as the flux removing property, the rinsing property of the cleaning agent adhering to the printed circuit board and the low toxicity. It was In other words, cleaning agents using chlorine-based and CFC-based solvents are safe, toxic, and
The water-based cleaning agent has a large problem in environmental pollution and the like, and the water-based cleaning agent is preferable in that it is less dangerous and less toxic than the solvent-based cleaning agent, but is slightly inferior in flux removability. Further, terpenes typified by limonene are compounds that can achieve both safety and flux removability, but they are not only a problem that they have difficulty in rinsing and cannot be rinsed with warm water, and are derived from natural products. Therefore, it is difficult to obtain stable quality, it is expensive, and the supply amount is limited, which is not practical.

従って、本発明は上述のような従来技術のもつ欠点を改
良し、フラックス除去性に優れかつ溶剤によるリンスだ
けでなく温水によるリンスも可能な、電子部品、特にプ
リント基板からのフラックス又はフラックス残渣を除去
するための洗浄剤組成物を提供することを目的とするも
のである。
Therefore, the present invention improves the drawbacks of the prior art as described above, and is excellent in flux removability and is capable of rinsing with warm water as well as rinsing with a solvent. The purpose of the present invention is to provide a cleaning composition for removal.

〔課題を解決するための手段〕[Means for Solving the Problems]

斯かる実情において、本発明者らは鋭意研究を行った結
果、特定のアルキレンオキサイド化合物を含有する洗浄
剤組成物が上記条件を具備することを見出し、本発明を
完成した。
Under such circumstances, as a result of intensive studies, the present inventors have found that a detergent composition containing a specific alkylene oxide compound satisfies the above conditions, and completed the present invention.

すなわち、本発明は、次の一般式(I)、(II)及び
(III) 〔式中、R1は炭素数6〜22の炭化水素残基を示し、R2
びR3は炭素数2〜4のアルキレン基を示し、Yは水素原
子又は炭素数1〜4の炭化水素残基を示しmは1〜20、
nは0〜20、lは0〜20、pは0〜20でm+n≦20、l
+p≦20の整数を示す〕 の群から選ばれるアルキレンオキサイド化合物を50重量
%以上含有する電子部品用洗浄剤組成物を提供するもの
である。
That is, the present invention provides the following general formulas (I), (II) and (III) [In the formula, R 1 represents a hydrocarbon residue having 6 to 22 carbon atoms, R 2 and R 3 represent an alkylene group having 2 to 4 carbon atoms, and Y represents a hydrogen atom or a hydrocarbon having 1 to 4 carbon atoms. Represents a residue, m is 1 to 20,
n is 0 to 20, l is 0 to 20, p is 0 to 20 and m + n ≦ 20, l
And an integer of + p ≦ 20], a cleaning composition for electronic parts containing 50% by weight or more of an alkylene oxide compound selected from the group.

一般式(I)、(II)及び(III)において、R1は炭素
数6〜22の炭化水素残基であることが必要である。炭素
数が6より小さいと、揮散性や引火性が高まり使用時に
おける安全性が低下し、また22を越えると粘度上昇に伴
ってフラックス除去性が低下する。R1としては炭素数6
〜22のアルキル基又は芳香族炭化水素残基、特に炭素数
8〜14のアルキル基又はアリルアルキル基が好ましい。
また、m,n,l及びpは、フラックスに対する親和性や浸
透性を確保するために、m=1〜20、n=0〜20、l=
0〜20、p=0〜20でm+n≦20、l+p≦20の整数で
あることが必要であり、特にm+n、l+pがそれぞれ
1〜10の整数のものが、優れた効果を示す。また、Yと
しては炭素数1〜4のアルキル基が特に好ましい。
In the general formulas (I), (II) and (III), R 1 needs to be a hydrocarbon residue having 6 to 22 carbon atoms. When the carbon number is less than 6, the volatility and flammability are increased and the safety during use is lowered, and when it exceeds 22, the flux removability is lowered with the increase in viscosity. R 1 has 6 carbon atoms
.About.22 alkyl group or aromatic hydrocarbon residue, particularly preferably C8 to C14 alkyl group or allylalkyl group.
Further, m, n, l and p are m = 1 to 20, n = 0 to 20 and l = in order to secure the affinity and permeability to the flux.
It is necessary that 0 + 20, p = 0-20, and m + n ≦ 20, l + p ≦ 20 are integers, and in particular, those in which m + n and l + p are integers of 1-10 show excellent effects. Further, Y is particularly preferably an alkyl group having 1 to 4 carbon atoms.

斯かる化合物の具体例としては、ヘキシルアルコール、
2−エチルヘキシルアルコール、オクチルアルコール、
ラウリルアルコール、オレイルアルコール、炭素数18の
ゲルベアルコール等の高級アルコール、ノニルフェノー
ル、スチレン化フェノール等のフェノール類、オクチル
酸、ラウリン酸、オレイン酸、ステアリン酸、炭素数22
のゲルベ酸等の高級脂肪酸、ヘキシルアミン、ラウリル
アミン、オレイルアミン、炭素数18のゲルベアミンなど
にアルキレン(エチレン、プロピレン、ブチレン)オキ
サイドを単独または配合付加させたものが挙げられ、更
に、これらのアルキレンオキサイド付加物の末端水酸基
をアルキルクロライド等によりメチル化、エチル化また
はブチル化した化合物が挙げられる。また、炭素数1〜
4のアルコールにアルキレンオキサイドを単独又は配合
付加し、更に炭素数6〜22の脂肪酸でエステル化した化
合物も挙げられる。
Specific examples of such compounds include hexyl alcohol,
2-ethylhexyl alcohol, octyl alcohol,
Higher alcohols such as lauryl alcohol, oleyl alcohol, Guerbet alcohol having 18 carbon atoms, nonylphenol, phenols such as styrenated phenol, octylic acid, lauric acid, oleic acid, stearic acid, 22 carbon atoms
Higher fatty acids such as gerberic acid, hexylamine, laurylamine, oleylamine, and gerbereamine having 18 carbon atoms, and alkylene (ethylene, propylene, butylene) oxides alone or in admixture, and further, these alkylene oxides. Examples thereof include compounds in which the terminal hydroxyl group of the adduct is methylated, ethylated or butylated with alkyl chloride or the like. Also, the number of carbon atoms is 1
The compound which added the alkylene oxide individually or by compounding to the alcohol of 4 and esterified with the C6-C22 fatty acid is also mentioned.

これらのアルキレンオキサイド化合物は単独又は2種以
上を組合わせて配合することができ、その配合量はフラ
ックス除去性を維持し、持続性を確保するために、本発
明洗浄剤組成物の50重量%以上であることが必要であ
り、特に60重量%以上が好ましい。
These alkylene oxide compounds can be blended alone or in combination of two or more, and the blending amount is 50% by weight of the cleaning composition of the present invention in order to maintain the flux removing property and ensure the sustainability. It is necessary to be above, and especially 60% by weight or more is preferable.

尚、本発明の洗浄剤組成物には、上記必須成分以外に、
液の流動性及び均一性を良くする目的でアルキルベンゼ
ン、ブチルシクロヘキサン、炭素数8〜18のオレフィ
ン、ケロシン、高沸点の芳香族溶剤又は分岐の炭化水素
等の炭化水素系溶剤、ケトン類、ジブチルエーテル、エ
チルセロソルブ、ブチルジグリコール、プロピルプロピ
レンジグリコール、ジメチルトリグリコール、ジブチル
ジグリコール等のエーテル類等の有機系溶剤を配合する
ことができる。水も洗浄剤としての均一性を損わない範
囲であれば使用できる。また、必要に応じて、その他の
界面活性剤や防錆剤、防腐剤、消泡剤、BHT等のフェノ
ール系、アミン系等の酸化防止剤を配合してもよい。
Incidentally, the cleaning composition of the present invention, in addition to the above essential components,
Alkylbenzene, butylcyclohexane, olefins having 8 to 18 carbon atoms, kerosene, hydrocarbon solvents such as high boiling aromatic solvents or branched hydrocarbons, ketones, dibutyl ether for the purpose of improving the fluidity and homogeneity of the liquid. An organic solvent such as ethers such as ethyl cellosolve, butyl diglycol, propyl propylene diglycol, dimethyl triglycol and dibutyl diglycol can be added. Water can also be used as long as it does not impair the uniformity as a detergent. Further, if necessary, other surfactants, rust preventives, antiseptics, antifoaming agents, phenolic antioxidants such as BHT, and amine antioxidants may be added.

本発明において、電子部品とは、例えば電算機及びその
周辺機器、家電機器、通信機器、OA機器、その他電子応
用機器等に用いられるプリント配線基板;ICリードフレ
ーム、抵抗器、コンデンサー、リレー等接点部材に用い
られるフープ材;OA機器、時計、電算機器、玩具、家電
機器等に用いられる液晶表示器;映像・音声記録/再生
部品、その関連部品等に用いられる磁気記録部品;シリ
コンやセラミックスのウェハ等の半導体材料;水晶振動
子等の電歪用部品;CD、PD、複写機器、光記録機器等に
用いられる光電変換部品などをいう。この中でも、本発
明の洗浄剤組成物は、特にプリント基板に付着したフラ
ックス又はフラックス残渣に対し好適な洗浄性能を発揮
する。
In the present invention, the electronic parts are, for example, printed wiring boards used for computers and their peripheral devices, home appliances, communication devices, OA devices, other electronic application devices, etc .; IC lead frames, resistors, capacitors, contacts such as relays. Hoop materials used for members; Liquid crystal displays used for OA equipment, watches, computer equipment, toys, home appliances, etc .; Magnetic recording parts used for video / audio recording / reproducing parts and related parts; Silicon and ceramics Semiconductor materials such as wafers; electrostrictive parts such as crystal oscillators; photoelectric conversion parts used in CDs, PDs, copying machines, optical recording machines, etc. Among these, the cleaning composition of the present invention exhibits suitable cleaning performance particularly for flux or flux residue attached to the printed circuit board.

本発明の洗浄剤組成物は、浸漬法、超音波洗浄法、揺動
法、スプレー法等の各種の洗浄方法において使用でき、
かつ好ましい結果を得ることができる。
The cleaning composition of the present invention can be used in various cleaning methods such as a dipping method, an ultrasonic cleaning method, a rocking method, and a spray method,
And a desirable result can be obtained.

本発明の洗浄剤を、フラックスの付着したプリント基板
の洗浄工程に用いる場合、例えば、まず本発明洗浄剤組
成物をいれた超音波洗浄槽で超音波洗浄し、次いで本発
明の洗浄剤組成物を満たした液浴槽において浸漬洗浄
し、最後に溶剤あるいは温水でリンスする等の方法を連
続的に行うことにより、効率的に洗浄することができ
る。
When the cleaning agent of the present invention is used in the step of cleaning a printed circuit board to which flux is attached, for example, first, ultrasonic cleaning is performed in an ultrasonic cleaning tank containing the cleaning composition of the present invention, and then the cleaning composition of the present invention. It is possible to perform efficient cleaning by continuously performing a method such as dipping and cleaning in a liquid bath filled with water, and finally rinsing with a solvent or warm water.

〔実施例〕〔Example〕

以下、実施例を挙げて更に詳細に説明するが、本発明は
これらに限定されるものではない。
Hereinafter, the present invention will be described in more detail with reference to examples, but the present invention is not limited thereto.

実施例1〜22及び比較例1〜5 ICチップを装着したプリント配線板をフラックス処理
し、続いてハンダ処理してテストピースとした。このテ
ストピースを80℃に保った洗浄液に浸漬し、5分間洗浄
後プリント配線板からのフラックスの除去性及び洗浄液
のリンス性を目視で評価した。結果を表1に示す。
Examples 1 to 22 and Comparative Examples 1 to 5 A printed wiring board having an IC chip mounted thereon was subjected to a flux treatment and then a solder treatment to obtain test pieces. This test piece was dipped in a cleaning liquid kept at 80 ° C., and after cleaning for 5 minutes, the flux removability from the printed wiring board and the rinsing property of the cleaning liquid were visually evaluated. The results are shown in Table 1.

(評価基準) フラックス除去性 ◎:フラックス残着なく、非常に良好。(Evaluation Criteria) Flux Removability ◎: Very good with no flux residue.

○:フラックス残着がほとんどなく、良好。◯: Flux is hardly left and is good.

△:フラックス残着がわずかにあり、やゝ悪い。Δ: Flux residue is slightly present, which is rather bad.

×:フラックスが残着し、悪い。X: Flux remains and is bad.

リンス性 ◎:非常に良好。Rinseability ◎: Very good.

○:良 好。○: Good.

△:やゝ劣る。Δ: Somewhat inferior

×:悪 い。×: Bad

〔発明の効果〕 叙上の如く、本発明の洗浄剤組成物は、優れたフラック
ス除去性及びリンス性を有すると共に、安全性が高く環
境汚染の心配もないので、電子部品、特にプリント基板
のフラックス洗浄工程に有利に使用できる。
[Advantages of the Invention] As described above, the cleaning composition of the present invention has excellent flux removing property and rinsing property, and also has high safety and no concern about environmental pollution. It can be advantageously used in the flux cleaning process.

Claims (2)

【特許請求の範囲】[Claims] 【請求項1】次の一般式(I)、(II)及び(III) 〔式中、R1は炭素数6〜22の炭化水素残基を示し、R2
びR3はそれぞれ炭素数2〜4のアルキレン基を示し、Y
は水素原子又は炭素数1〜4の炭化水素残基を示しmは
1〜20、nは0〜20、lは0〜20、pは0〜20でm+n
≦20、l+p≦20の整数を示す〕 の群から選ばれるアルキレンオキサイド化合物を50重量
%以上含有する電子部品用洗浄剤組成物。
1. The following general formulas (I), (II) and (III): [In the formula, R 1 represents a hydrocarbon residue having 6 to 22 carbon atoms, R 2 and R 3 each represent an alkylene group having 2 to 4 carbon atoms, and Y
Represents a hydrogen atom or a hydrocarbon residue having 1 to 4 carbon atoms, m is 1 to 20, n is 0 to 20, l is 0 to 20, p is 0 to 20 and m + n.
≦ 20, 1 + p ≦ 20 is an integer], and a cleaning composition for electronic parts, containing 50% by weight or more of an alkylene oxide compound selected from the group:
【請求項2】一般式(I)、(II)及び(III)中、R1
が炭素数6〜22の脂肪族炭化水素残基である請求項1記
載の洗浄剤組成物。
2. R 1 in the general formulas (I), (II) and (III)
The cleaning composition according to claim 1, wherein is an aliphatic hydrocarbon residue having 6 to 22 carbon atoms.
JP1196626A 1989-07-31 1989-07-31 Cleaning composition Expired - Fee Related JPH0768540B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1196626A JPH0768540B2 (en) 1989-07-31 1989-07-31 Cleaning composition

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1196626A JPH0768540B2 (en) 1989-07-31 1989-07-31 Cleaning composition

Publications (2)

Publication Number Publication Date
JPH0362895A JPH0362895A (en) 1991-03-18
JPH0768540B2 true JPH0768540B2 (en) 1995-07-26

Family

ID=16360890

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1196626A Expired - Fee Related JPH0768540B2 (en) 1989-07-31 1989-07-31 Cleaning composition

Country Status (1)

Country Link
JP (1) JPH0768540B2 (en)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2789046B2 (en) * 1989-11-08 1998-08-20 荒川化学工業株式会社 Cleaning agent for rosin solder flux
JPH08917B2 (en) * 1990-06-27 1996-01-10 花王株式会社 Detergent composition
JP2617247B2 (en) * 1991-03-19 1997-06-04 花王株式会社 Cleaning composition for precision parts or jigs
JPH0756039B2 (en) * 1991-07-04 1995-06-14 第一工業製薬株式会社 Cleaning composition
JPH06228593A (en) * 1993-02-01 1994-08-16 Kaken Tec Kk Detergent composition for flux
DE4327327A1 (en) * 1993-08-13 1995-02-16 Henkel Kgaa Detergent mixtures
GB2281909B (en) * 1993-09-21 1997-06-04 Asahi Chemical Ind Propylene glycol cyclohexyl ether derivatives, method of producing same and uses thereof
KR100222460B1 (en) 1994-03-18 1999-10-01 도키와 후미카츠 Cleaning process
JP2736365B2 (en) * 1994-10-13 1998-04-02 花王株式会社 Cleaning method and cleaning agent
JP3845180B2 (en) * 1997-06-25 2006-11-15 ライオン株式会社 Process for producing fatty acid polyoxyalkylene alkyl ether, and composite metal oxide catalyst used in the process
JPH11349983A (en) * 1998-06-10 1999-12-21 Asahi Denka Kogyo Kk Detergent
JP2001332575A (en) * 2000-05-19 2001-11-30 Sony Corp Method for cleaning flux and method for manufacturing semiconductor device

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59134891A (en) * 1983-01-21 1984-08-02 メック株式会社 Printed circuit cleaner

Also Published As

Publication number Publication date
JPH0362895A (en) 1991-03-18

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