JPH0768460A - Grinding method - Google Patents

Abstract

PURPOSE:To provide a grinding method to remove only projections from the surface to be ground from a body to be ground having endogenous projections without damaging the surface to be ground. CONSTITUTION:In the grinding method, the endogenous projections are ground by sliding a body to be ground having endogenous projections on the surface and a grinding tape having a grinding layer which is mainly composed of particles of the grinding agent and the binding agent on the supporting body in a mutually opposite direction so that the surface to be ground of the body to be ground is brought into contact with the grinding layer of the grinding tape in a sliding manner.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for polishing an object to be polished, which has an intrinsic projection on its surface and excises the endogenous projection, and is particularly used for liquid crystal displays such as STN type and TFT type liquid crystal displays. The present invention relates to a method for polishing an object to be polished of a color filter.

[0002]

2. Description of the Related Art In recent years, color filters used for liquid crystal displays, which have been used for various displays, are
It is created by a pigment dispersion method, a dyeing method, a printing method, or the like. In the normal manufacturing process, a transparent electrode such as ITO (Indium Oxide / Tin Oxide Composite) is installed after this, so if there are protrusions or other defects on the surface of the color filter, it will interfere with the function of the electrode and will function sufficiently as a filter. Disappear. However, even if the dust level (US Federal Standard) class 10 to 10,000 is used for manufacturing, the protrusions of the color filter cannot be completely eliminated. If there is such a defect in the color filter, it will not be useful as a liquid crystal display even if a transparent electrode is installed due to color unevenness, color misregistration, filter missing, or pattern abnormality, and it will be a defective product, and the yield in the production process will increase. This was a big obstacle to practical use.

That is, a liquid crystal display is manufactured by laminating a color filter, a transparent electrode, a pixel electrode and a transistor layer on a glass substrate with a liquid crystal layer in the center, but if the color filter has a protrusion, the liquid crystal display is attached. When matching, the transparent electrode surface may be pierced and a defect related to color may occur.

The protrusions are generally caused by agglomeration of the dispersion liquid or printing ink generated in the process of forming a filter film by coating or printing on a glass substrate during the color filter manufacturing process. Since it is an endogenous protrusion and not a mere deposit, it was difficult to remove it by simply wiping it off.

As a polishing method for polishing the surface of an object to be polished by polishing an uneven surface having protrusions and the like, various methods are adopted depending on the material of the object to be polished, purpose of use, required performance and the like. There is.

As a polishing method, generally, a method of pressing a polishing object against a surface to be polished and slidingly contacting the surface to remove a convex portion on the surface to be polished and flattening the surface is usually adopted. ing.

As the polishing body, a polishing tape having a polishing layer provided on a flexible support is widely used because it can be slidably contacted by following the unspecified shape of the surface to be polished.

Even if the polishing tape is slid on the color filter surface in order to remove the intrinsic projections of the liquid crystal color filter, the endogenous projections cannot be sufficiently removed, and the color filter surface is scratched. Or again
The chips produced by polishing adhered to the surface and caused new problems, and the chips caused scratches on the surface. The above problems could not be sufficiently solved even with the conventional technology. For example, JP-A-3-131463 and JP-A-4
No. 315566, JP-A No. 5-77153, JP-A No. 60-44264 and the like disclose polishing machines using polishing tapes of various structures. These polishing machines are used. When the liquid crystal filter is polished, the roughness of the polishing tape is often inadequate, the surface to be polished is contaminated due to the composition of the polishing tape, and the surface between the polishing tape and the surface to be polished is often damaged. The shavings could enter and scratch the surface to be polished.

[0009]

SUMMARY OF THE INVENTION The present invention has been made in view of the above problems of the prior art, in which only the projections are polished from an object to be polished having an intrinsic projection without scratching the polishing surface. It is intended to provide a polishing method for removing from the surface, and particularly when the surface to be polished is a color filter for liquid crystal, the objective is to improve the yield in the production process by efficiently removing the endogenous protrusions from the surface. It is what

[0010]

The above object of the present invention is to provide an object to be polished having an intrinsic protrusion on the surface thereof and a polishing tape having a polishing layer mainly containing abrasive particles and a binder on a support. This is achieved by a polishing method in which the surface to be polished of the object to be polished and the polishing layer of the polishing tape are brought into sliding contact with each other in opposite directions to grind the endogenous protrusions.

In the polishing method of the present invention, the polishing tape and the object to be polished are moved so as to face each other, and the surface of the polishing layer of the polishing tape and the surface to be polished having the intrinsic protrusions of the object to be polished are brought into sliding contact with each other. By doing so, the endogenous protrusions are removed. The term “intrinsic projection” as used herein means a projection generated from the inside of the object to be polished as a generation source at the time of manufacturing the object to be polished, and does not refer to an extraneous matter that flies from the outside after manufacturing the object to be polished.

In the present invention, the object to be ground and the polishing tape are opposed to each other and brought into contact with each other, so that the object to be ground is removed while the endogenous projection on the object to be ground is ground by the polishing tape. Can be effectively removed without damaging the surface to be polished. Here, the facing and the contacting means moving both the object to be polished and the polishing tape in opposite directions so as to contact each other substantially horizontally. The angle formed by the two moving lines does not necessarily have to be close to 180 °.
What is important is that they both move and that their directions of movement are opposite to each other. Even when using a polishing tape, moving in a direction facing the object to be polished increases the frictional resistance as compared to the case of moving in the forward direction, and effective grinding is achieved by stress concentrated on the protrusions in particular. It is estimated to be possible.

In the case of an endogenous protrusion, since it is fixed in the film together with the surface to be polished, unlike the conventional method, in the conventional method in consideration of not damaging the polishing surface such as air blow or wiping. It was extremely difficult to remove. In the method of the present invention, differently from the conventional method of scraping off the protrusions of the color filter with a knife, a sword, a razor, etc., the abrasive tape is used to act in a direction opposite to the object to be ground, and the object to be ground is ground and simultaneously ground. It is considered that the removal is effective for grinding the intrinsic protrusions without damaging the surface to be polished.

As the binder resin for the polishing layer of the polishing tape used in the polishing method of the present invention, a relatively hard binder resin such as a vinyl chloride resin, a nitrocellulose resin, a polyester resin or an epoxy resin is used. Young's modulus of the dried film measured with a stress-strain measuring device is 400 kg /
A hard resin having a hardness of more than mm ² may be mentioned. Further, examples of the relatively soft resin include a soft resin having a hardness of Young's modulus of 300 Kg / mm ² or less when its own dry film such as urethane resin is measured by a stress-strain measuring device. To be Then, by using the binder resin and the curing agent together, a mechanically strong polishing layer can be obtained. Polyisocyanate is desirable as the curing agent.

There is no particular limitation on the object to be polished to which the polishing method of the present invention can be applied. Examples of the object to be polished to which the method of the present invention can be effectively applied include a color filter used in a liquid crystal display device, a magnetic head for finish polishing, a photosensitive drum of a copying machine, and the like. By the method of the present invention, it is possible to remove the endogenous protrusions on the surface of the object to be polished. Among them, an object to be polished to which the polishing method of the present invention is particularly effective is a color filter for a liquid crystal display in which the intrinsic protrusions are made of synthetic resin. This is because it is possible to partially grind the protruding portion by using a flexible polishing tape and prevent further grinding.

The color filter for liquid crystal display referred to in the present invention includes a pigment dispersion method, a dyeing method, a printing method, and an electrodeposition method, and a pigment or dye of three RGB colors is placed on a glass substrate in a synthetic resin. The dispersed filter is 1-3 μm
It is arranged alternately in the thickness of. Minimum line width is about 20
In μm, acrylic resin, polyimide resin, gelatin or the like is used as the synthetic resin. In some cases, a transparent electrode on which an ITO film is arranged may be referred to.

That is, in the color filter for liquid crystal, the intrinsic protrusions on the surface of the color filter are
A counter electrode (ITO) arranged on the color filter,
The alignment film, the enclosed liquid crystal, etc. are adversely affected, and point defects, line defects, display unevenness, cracks and in-plane short-circuits occur. This is because it is possible to prevent the yield of LCDs (liquid crystal displays) from decreasing due to an internal short circuit.

In order to grind away the endogenous projections on the surface of the layer to be polished of the object to be polished such as a color filter for liquid crystal by the polishing method of the present invention, in particular, the hardness of the surface layer of the polishing tape is appropriately adjusted. Need to control. That is, it is necessary to select the hardness of the polishing layer surface of the polishing tape according to the physical properties of the material to be polished or the resin material of the layer to be polished and the height shape of the intrinsic protrusions. Specifically, it is desirable that the Young's modulus in the tape longitudinal direction is in the range of ²⁰ to 400 Kg / mm ² .

From the viewpoint of easily controlling the hardness of such a polishing layer within the above range, the composition ratio of the binder resin in the polishing layer is the above hard resin: soft resin: polyisocyanate composition ratio. It is preferable to use it in a specific ratio. In particular, a vinyl resin as a hard resin is preferably a urethane resin as a soft resin, and a vinyl resin: urethane resin: polyisocyanate weight is 1
10:70 to 95: 5 to 40, preferably 1
5 to 70 to 95:10 to 30. That is, when the composition as described above is used, the hard resin is small, and the polyisocyanate serving as a crosslinking agent is also small, so that a coating film having high elongation and high toughness can be obtained. Since the cutting residue of the tape can be retained without falling off, the hardness of the polishing layer can be easily controlled to meet the above conditions. In order to maintain the hardness of the polishing layer in the above range and prevent the abrasive particles from falling out of the polishing layer, a three-component system including a vinyl chloride resin may be used as the binder resin for the polishing layer. On the other hand, on the other hand, when considering the corrosion of the electrode due to the generation of halogen gas, it is preferable that the vinyl chloride resin is not used.Therefore, when the vinyl chloride resin is used as the hard resin, the composition ratio thereof is particularly a weight percentage. It is essential to keep it below 10.

Considering that the polyvinyl chloride resin decomposes over time to generate halogen gas, and if the grinding powder remains on the color filter or the like, the ITO may be corroded, the urethane resin is not used. It is also conceivable to use a binder consisting of In this case, the composition ratio of urethane resin: polyisocyanate is preferably 60 to 95: 5 to 40, and more preferably 65 to 90:10 to 35. In this case, although there is no hard resin component, when urethane and polyisocyanate are used as the binder resin, a cross-linking reaction between the hydroxyl group of polyurethane and the NCO group of polyisocyanate occurs.
The effect that is sufficiently maintained by the dimensional crosslinked structure can be expected.

The case where the object to be polished to which the method of the present invention is most effectively applied is a liquid crystal color filter will be described below as an example, but the method of the present invention is not limited to the liquid crystal color filter. There is no particular limitation as long as it is a body to be polished having an intrinsic protrusion.

In the polishing method of the present invention, the relative speed of contact between the object to be polished and the polishing tape is important, and the relative speed of contact between the color filter, which is the object to be polished, and the polishing tape is 10. ~ 6000 mm / sec, preferably 30 ~
5000 mm / sec, more preferably 40 to 4000 mm
/ Sec.

If the relative speed is less than 10 mm / sec, it will be difficult to cut off the endogenous protrusion, and if it exceeds 6000 m / sec, the surface to be polished will be easily scratched, which is not desirable.
Further, the speed of the object to be polished or the polishing tape varies depending on the material and shape of the object to be polished, the stiffness of the polishing tape, etc., and therefore cannot be determined unconditionally.

When the color filter and the polishing tape are brought into contact with each other, when the surface to be polished and the polishing layer are in sliding contact with each other, pressure is applied from the surface side of the polishing tape which does not have the polishing layer and pressure is applied with a (hard steel) roll. The height (with respect to the object to be ground) is not preferable because the intrinsic protrusion cannot grind at a constant height and the flatness of the surface to be polished cannot be maintained well. (In this case, the height of the polishing tape with respect to the object to be ground needs to be fixed to 1 to 5 μ by a holding jig.)

At this time, the pressing roll has a diameter of 5 to
It is 600 mmφ, preferably 5 to 100 mmφ, and more preferably 5 to 38 mmφ. The width of the pressure-bonding portion on the back surface of the polishing tape of the pressing roller is 290 mm or less, preferably 100 mm or less, more preferably 50 mm or less. Further, it is preferable that the pressing roller for contacting the polishing tape is made of metal or rubber so that the soft projection can be reliably caught and cut. Further, since the hard protrusion has a large tensile strength, it often expands to the peripheral portion and may be cut into a block shape, but even in that case, the back roll made of rubber can reduce such a case. preferable. As the metal for the roll material, stainless steel, Cr-plated stainless steel, etc. are preferable,
Further, the shape is preferably flat or drum-shaped (the diameter is maximum in the central portion). The rubber material preferably has a Shore hardness of 20 to 100, and is preferably flat or drum-shaped (the diameter is maximum at the center). Furthermore, when the pressing roll for moving the polishing tape is an air pressure roll, the pressing pressure to the surface to be polished is preferably ¹ to 35 Kg / cm ² , and when it is 10 Kg / cm ² or less, It is desirable to polish a plurality of times. Incidentally, the pneumatic roll is to press the polishing tape against the object to be polished with the pressure of the compressed air discharged from the slit nozzle, and the roll is
It is desirable to press the ground object from below so as to prevent the ground object from scattering on the upper surface of the object to be polished.

In carrying out the method of the present invention, a pressing load per unit line segment (12.5 mm) is 5 to 500.
g, preferably 50 to 300 g. Further, when the color filter and the polishing tape are brought into contact with each other, the nip pressure of the pressing roller is preferably 0.1 to 100 g / mm. Further, the surface to be polished of the object to be polished is arranged downward,
By polishing the polishing tape from below so that the polishing layer is brought into contact with the object to be polished so that the polishing layer is in sliding contact with the surface to be polished, it is possible to prevent contamination due to the scattering of fine powder of the object to be polished onto the object to be polished. It is desirable because it can.

The size of the abrasive particles contained in the polishing layer of the polishing tape used in the method of the present invention is 0.
The thickness is 05 to 1 μm, more preferably 0.5 to 0.1 μm. If the average particle size of the abrasive particles is less than 0.05 μm, the protrusions cannot be effectively cut off, and it takes a long time to grind, and if it exceeds 1 μm, scratches occur on the surface to be polished. It is not preferable because it will occur. In addition, when the projections are removed with a polishing tape by making sliding contact with the color filter, the color filter may be damaged by charging. Therefore, the polishing layer has an average particle size of 5 to 100 nm, preferably 10 as an antistatic agent. .About.90 nm, more preferably 15 to 80 nm of carbon black is preferably contained. If the average particle size of carbon black is too small, the dispersive mixing of the abrasive particles will be poor, and it will be difficult for the coating film surface to become smooth due to the aggregation of particles, and if it is too large, the dispersive mixing will be good, but the electrical resistance will be low. Care must be taken because the size of the polishing layer becomes large and the surface of the polishing layer becomes rough.

The polishing tape used in the method of the present invention is not particularly limited, and conventionally known polishing tapes can be used. However, the addition of a binder component, the average particle size of the abrasive particles, and especially carbon black As described above, it is preferable for effectively achieving the object of the present invention.

The intrinsic protrusions that can be ground by the polishing method of the present invention have a height of 5 to 10 in the case of a protrusion of a color filter.
0 μm, the size is 1 to 1000 μm in diameter, and the protrusion is at a height from the center line of the color filter surface roughness,
Grind to 4 μm or less.

A more specific method of the polishing method of the present invention is to feed the polishing tape from a supply reel,
Work (grinding of protrusion) while applying back tension
Move the polishing tape and color filter in part. The feed rate at that time is 10 cm to 1000 cm / min, and oscillation (sliding in the direction intersecting the feed direction)
Is 0 to 10 mm / sec. Further, the work may be sent obliquely. When moving 10 mm, feed 0 to 5 mm in the width direction.
For winding, tension is 5 to 500 g per 10 mm width.
Then wind it up on the take-up reel. As the nip roll for supporting the polishing tape, various types can be used, but as the material, the metal or rubber as described above is preferable. When operating the lifting mechanism of the nip roll, it is desirable to raise and lower while applying tension to the polishing tape,
Further, it is desirable to make the width of the polishing tape larger than the width of the nip roll.

The polishing tape in the method of the present invention is
A coating for a polishing layer, which mainly contains abrasive particles and a binder, is formed on a flexible support. The vinyl chloride resin that can be used in the present invention is not particularly limited, and a conventionally known binder resin can be used. For example, vinyl chloride vinyl acetate vinyl alcohol copolymer, vinyl chloride vinyl alcohol copolymer, vinyl chloride vinylidene chloride copolymer, vinyl chloride acrylonitrile copolymer and the like can be mentioned. Among them, vinyl chloride copolymer- (C
HClCH ₂ ) _n- (CHXCH ₂ ) _m- (X is -SO ₃
Those having a basic unit of a polar group such as Na, —SO ₃ H, and —PO ₄ H) are desirable from the viewpoint of the strength of the polishing layer and the dispersibility of the abrasive particles. Among the vinyl chloride resins, MR11 manufactured by Nippon Zeon Co., Ltd. is particularly desirable in terms of dispersibility and coating film strength.
0, 400 × 110A, etc.

The urethane-based resin is not particularly limited, and a conventionally known binder resin can be used. For example, 100% modulus is 50 ~ 300K
The glass transition temperature (Tg) of g / cm ² is 0 to 5
The ability of 0 ° C. to hold the abrasive particles in the polishing layer,
It is also desirable because it imparts appropriate elasticity to the coating film. Specifically, C-7209 manufactured by Dainippon Ink and Co., Ltd., Pandex, N-230 manufactured by Nippon Polyurethane Co., Ltd.
1, N-2302, N-2304, N-3107, UR-8200, UR-8300, UR manufactured by Toyobo Co., Ltd.
-8600 and the like can be mentioned, and among them, those having a polar group in the molecule for promoting dispersion of abrasive particles are preferable. Among the urethane resins, those having a polar group are preferable from the viewpoint of dispersibility and coating film strength, and therefore, UR8200 and UR83 manufactured by Toyobo Co., Ltd.
00, UR8600, etc. The polyisocyanate used in the present invention is not particularly limited, and conventionally known binder resins can be used. For example,
Tolylene diisocyanate, 4,4'-diphenylmethane diisocyanate, hexamethylene diisocyanate
Toxylylene diisocyanate, naphthylene-1,5
-Diisocyanate, o-toluidine diisocyanate-
, Isophorone diisocyanate, triphenylmethane triisocyanate, isophorone diisocyanate, and other isocyanates, as well as products of the isocyanates and polyalcohols, and isocyanate. 2-10 mer polyisocyanate produced by condensation of a polyisocyanate, or a product of polyisocyanate and polyurethane, such as isocyanate having an end functional group. Among them, an isocyanate group (-NCO) is contained in one molecule. It is desirable that there are three or more of them because crosslinking is three-dimensionally performed. These polyisocyanates
The average molecular weight of the moss is preferably 100 to 20,000. Commercially available trade names of these polyisocyanates are Coronet L, Coronet HL, and Coronet.
2030, coronet 2031, millionaire MR,
Millionate MTL (Nippon Polyurethane Co., Ltd.), Takenate D-102, Takenate D-110N, Takenate D-200, Takenate D-202, Takenate 300
S, Takenet 500 (manufactured by Takeda Pharmaceutical Co., Ltd.), SUMIJOUR T-80, SUMIJOUR 44S, SUMIJUL PF, SUMIJUL L, SUMIJUL N desmodul L, desmodur IL, desmodur IL -Le N, Death module H
L, Death module T65, Death module 15, Death module R, Death module RF, Death module S
L, Desmodule Z4273 (manufactured by Sumitomo Bayer Co., Ltd.) and the like, and these can be used alone or in combination of two or more utilizing the difference in curing reactivity. In addition, for the purpose of accelerating the curing reaction, hydroxyl groups (butanediol, hexanediol, molecular weight 100) are used.
It is also possible to use a compound having an amino group (monomethylamine, dimethylamine, trimethylamine, etc.), a metal oxide catalyst, or a catalyst such as iron acetylacetonate, together with 0 to 10,000 polyurethane, water, etc.). It is desirable that these compounds having a hydroxyl group or an amino group are polyfunctional. Of the above polyisocyanates, trifunctional polyisocyanates are particularly preferable in order to promote and improve the three-dimensional crosslink density, and examples include Coronate 3040 manufactured by Nippon Polyurethane Co., Ltd.

The abrasive particles in the polishing layer of the polishing tape in the method of the present invention have an average particle diameter of 0.05 to 1 μm.
m chromium oxide, α-alumina, silicon carbide, non-magnetic iron oxide, red iron oxide (α iron oxide), diamond, γ-alumina,
α, γ-alumina Fused alumina, cerium oxide, corundum, artificial diamond, garnet, emery (main component: corundum and magnetite), garnet, silica stone, silicon nitride, boron nitride, molybdenum carbide, boron carbide, tungsten carbide , Titanium carbide, etc., mainly moose hardness 6
The above items are used in combination of 1 to 4 types. The pH of these abrasives used in combination is 2 to 10, and particularly preferably 5 to 10. These abrasives are used as the main constituent material of the polishing layer.

It is preferable that the polishing layer contains carbon black in order to prevent electrostatic breakdown due to static electricity generated between the polishing layer and the object to be polished. As the carbon black, a furnace for rubber, thermal for rubber, black for color, acetylene black, etc. can be used. These carbon blacks are used as an antistatic agent, a light-shielding agent, a friction coefficient adjusting agent, and a durability improving tape. SA is a concrete example of the abbreviations of these carbon blacks in the United States.
F, ISAF, IISAF, T, HAF, SPF, F
F, FEF, HMF, GPF, APF, SRF, MP
F, ECF, SCF, CF, FT, MT, HCC, HC
There are F, MCF, LFF, RCF, etc.
It is possible to use the one classified in the standard D-1765-82a. Among the above-mentioned carbon blacks, in order to effectively achieve the object of the present invention, it is preferable to use furnace black having a particle size satisfying the above-mentioned conditions. The carbon black used in the present invention has an average particle size of 5 to 100 nm (electron microscope), a nitrogen adsorption method specific surface area of 10 to 800 m ² / g, and a pH of 4 to 11 (J.
IS standard K-6221-1982 method), dibutyl phthalate (DBP) oil absorption is 10 to 800 ml / 100 g
(JIS standard K-6221-1982 method). The carbon black used in the present invention has an average particle size of 5 to 100 nm for the purpose of lowering the surface electric resistance of the coating film, and 50 to 1000 nm for controlling the strength of the coating film. Carbon black is used. Further, the type and the amount of carbon black added are properly selected according to the purpose of the polishing tape. Further, these carbon blacks may be used after being surface-treated with a dispersant described later or grafted with a resin. Further, it is also possible to use one in which a part of the surface is graphitized by treating the furnace temperature at the time of producing carbon black at 2000 ° C. or higher.
Hollow carbon black can also be used as a special carbon black. In the case of the polishing layer, these carbon blacks are added to 0.1 parts by weight of the inorganic powder in an amount of 0.1
It is desirable to use -100 parts by weight. In the case of the back layer, it is 20 to 400 with respect to 100 parts by weight of the resin described later.
It is desirable to use parts by weight. Carbon black that can be used in the present invention is, for example, "Carbon Black Handbook",
(Edited by Carbon Black Association, published in 1972) can be referred to.

In addition to the vinyl chloride resin, urethane resin and polyisocyanate used in the polishing layer of the polishing tape of the present invention, conventionally known thermoplastic resins, thermosetting resins, reactive resins, electron beam curing resins and ultraviolet rays are used. A curable resin, a visible light curable resin, an antifungal resin, or a mixture thereof can be used. However, in that case, the amount used should be at most 50% by weight, preferably 25% by weight or less of the total amount of the binder resin. Softening temperature of thermoplastic resin is 150 ℃
Hereafter, those having an average molecular weight of 10,000 to 300,000 and a degree of polymerization of about 50 to 2000 are more preferable and 200
To about 700, for example, acrylic acid ester acrylonitrile copolymer, acrylic acid ester vinylidene chloride copolymer, acrylic acid ester styrene copolymer,
Methacrylic acid ester acrylonitrile copolymer, methacrylic acid ester vinylidene chloride copolymer, methacrylic acid ester styrene copolymer, urethane elastomer,
Nylon-silicone resin, nitrocellulosic-polyamide resin, polyfucca vinyl, vinylidene chloride acrylonitrile copolymer, butadiene acrylonitrile copolymer, polyamide resin, polyvinyl butyral, cellulose
Derivatives (cellulosic acetate butyrate, cellulose
Sudiacetate, cellulose acetate, cellulose propionate, nitrocellulose, ethyl cellulose, methyl cellulose, propyl cellulose, methyl ethyl cellulose, carboxymethyl cellulose, acetyl cellulose, etc. ), A styrene-butadiene copolymer, a polyester resin, a polycarbonate resin, a chlorovinyl ether acrylate copolymer, an amino resin, various synthetic rubber thermoplastic resins, and mixtures thereof. Among the above, nitrocellulose and polycarbonate are preferable in terms of strength as a coating film of the polishing layer and prevention of removal of abrasive particles from the polishing layer.

Further, the thermosetting resin or the reactive resin has a molecular weight of 200,000 or less in the state of a coating liquid, and by heating and humidifying after coating and drying, the molecular weight is infinite due to reactions such as condensation and addition. Will be the one. Also,
Among these resins, those that do not soften or melt before the resin thermally decomposes are preferable. Specifically, for example, phenol resin, phenoxy resin, epoxy resin, polyurethane resin, polyester resin, polyurethane polycarbonate resin, urea resin, melamine resin, alkyd resin, silicon resin, acrylic reaction resin (electron beam curing resin), epoxy -Polyamide resin, nitrocellulosmelamine resin, high molecular weight polyester resin and isocyanate-
Mixtures of toprepolymers, mixtures of methacrylate copolymers and diisocyanate prepolymers, mixtures of polyester polyols and polyisocyanates, urea formaldehyde resins, low molecular weight glycols / high molecular weight dio-mers.
And a mixture of triphenylmethane triisocyanate,
Examples thereof include polyamine resins, polyimine resins, and mixtures thereof. These thermoplastic, thermosetting resins, and reactive resins have carboxylic acid (CO) as a functional group in addition to the main functional group.
OM), sulfinic acid, sulfenic acid, sulfonic acid (S
O ₃ M), phosphoric acid (PO (OM) (OM)), phosphon
Acid, sulfuric acid (OSO ₃ M), and acidic groups such as ester groups (M is H, alkali metal, alkaline earth metal,
(Hydrocarbon groups), amino acids; aminosulfonic acids, sulfuric acid or phosphoric acid esters of amino alcohols, amphoteric groups such as sulfobetaine, phosphobetaine, alkylbetaine type, amino groups, imino groups, imide groups, amide groups Etc. Further, a hydroxyl group, an alkoxyl group, a thiol group, an alkylthio group, a halogen group (F, Cl, Br, I), a silyl group,
The siloxane group, the epoxy group, the isocyanato group, the cyano group, the nitrile group, the oxo group, the acryl group, the phosphine group usually contains at least 1 type and up to 6 types, each functional group is a resin 1
It is desirable to contain 1 × 10 ⁻⁶ eq to 1 × 10 ⁻² eq per g in order to promote the dispersion of the abrasive particles and to improve the strength of the polishing layer coating film.

The mixing ratio of the polishing agent and the binder resin in the polishing layer is 5 to 100 parts by weight of the polishing agent in the binder resin of 5 parts by weight.
Used in the range of 70 parts by weight. In addition, compounds having various functions are added to the polishing layer as additives.
For example, a dispersant, a lubricant, an antistatic agent, an antioxidant, an antifungal agent, a coloring agent, a solvent and the like are added. Of these, carbon black is preferable as the antistatic agent, as described above.

In the method of the present invention, an undercoat layer is provided between the support of the polishing tape and the polishing layer to prevent the polishing layer from peeling off, to prevent the abrasive particles from falling out of the polishing layer, and to prevent the end surface of the polishing tape from being damaged. Can be provided. The undercoat layer is preferably a thermosetting resin, and is preferably a polyester or polyurethane resin having a glass transition temperature (Tg) of -40 to 50 ° C. Further, from the viewpoints of improving the adhesiveness of the polishing layer and maintaining the adhesiveness over time, a polyester resin having a polar functional group is desirable.

To the polishing layer, the following powdery lubricants may be added in anticipation of the effect of reducing the friction coefficient and preventing the adhesion between layers. The amount of addition at that time is 1 to 50% by weight, preferably 2 to 25% by weight with respect to the abrasive particles.
It is desirable that the amount is, by weight, more preferably 3 to 10% by weight. As the powdery lubricant used for the polishing layer,
Inorganic fine powder of graphite, molybdenum disulfide, boron nitride, graphite fluoride, calcium carbonate, barium sulfate, silicon oxide, titanium oxide, zinc oxide, tin oxide, tungsten disulfide, acrylic styrene resin fine powder, benzoguanamine resin Fine powder, melamine-based resin fine powder, polyolefin-based resin fine powder, polyester-based resin fine powder, polyamide-based resin fine powder, polyimide-based resin fine powder, poly-fucca ethylene-based resin fine powder, and other resin fine powders.

The following organic compound-based lubricants may be added to the polishing layer, with the expectation that the friction coefficient will be reduced and the elasticity of the coating film will be controlled. The amount of addition at that time is 0.01 to 10% by weight, preferably 0.05 to 5% by weight, based on the weight of the abrasive particles. As the organic compound-based lubricant, silicone oil (dialkyl polysiloxane, dialkoxy polysiloxane, phenyl polysiloxane, fluoroalkyl polysiloxane (KF96, KF69 manufactured by Shin-Etsu Chemical Co., Ltd.)
Etc.)), fatty acid modified silicone oil, fluorine alcohol
Polyolefin (polyethylene wax, polypropylene, etc.), polyglycol (ethylene glycol, polyethylene oxide wax, etc.), tetrafluoroethylene oxide wax, polytetrafluoroglyco-
Fluorine, perfluoroalkyl ether, perfluoro fatty acid, perfluoro fatty acid ester, perfluoroalkyl sulfuric acid ester, perfluoroalkyl sulfonic acid ester, perfluoroalkylbenzene sulfonic acid ester, perfluoroalkyl phosphoric acid ester, etc. And compounds with silicon introduced, alkyl sulfates, alkyl sulfonates, alkyl phosphonate triesters,
Organic acid and organic acid ester compounds such as alkylphosphonic acid monoester, alkylphosphonic acid diester, alkylphosphoric acid ester, and succinic acid ester, triazaindolizine, tetraazaindene, benzotriazole,
Heterocyclic compounds containing nitrogen and sulfur such as benzotriazine, benzodiazole and EDTA, C10
To 40 monobasic fatty acids and monovalent alcohols having 2 to 40 carbon atoms, divalent alcohols, and trivalent alcohols
Any one of a tetravalent alcohol, a tetravalent alcohol, and a hexavalent alcohol
One or two or more, a monobasic fatty acid having 10 or more carbon atoms, and a monovalent to hexavalent alcohol having a carbon number of 11 to 70 in total with the carbon number of the fatty acid Also usable are fatty acid esters consisting of, fatty acids having 8 to 40 carbon atoms or fatty acid amides, fatty acid alkyl amides, and aliphatic alcohols. Specific examples of these compounds include butyl caprylate, octyl caprylate, ethyl laurate, butyl laurate, octyl laurate, ethyl myristate, butyl myristate,
Octyl myristate, 2-ethylhexyl myristate,
Ethyl palmitate, butyl palmitate, octyl palmitate, 2 ethylhexyl palmitate, ethyl stearate, butyl stearate, isobutyl stearate, octyl stearate, 2 ethylhexyl stearate, amyl stearate, isoamyl stearate, 2 ethyl stearate. Pentyl, 2-hexyldecyl stearate, isotridecyl stearate, stearic acid amide, stearic acid alkylamide, butoxyethyl stearate, anhydrosorbitan monostearate, anhydrosorbitan distearate, anhydrosorbitan tristearate. , Anhydrosorbitan tetrastearate, oleyl oleate, oleyl alcohol, lauryl alcohol, montan wax, carnauba wax, etc. There alone or in combination can be used.

As the lubricant used in the present invention, a so-called lubricating oil additive can be used alone or in combination.
Antioxidants known as rust preventives (alkylphenols, benzotriazines, tetraazaindenes, sulfamides, guanidines, nucleic acids, pyridines, amines, hydroquinones, metal chelating agents such as EDTA), rust-preventing agents (naphthenes) Acid, alkenyl succinic acid, phosphoric acid, dilauryl phosphate, etc.), oily agent (rapeseed oil, lauryl alcohol)
Etc.), extreme pressure agents (dibenzyl sulfide, tricresyl phosphate, tributyl phosphite, etc.), detergent dispersants, viscosity index improvers, pour point depressants, foam depressants and the like. These lubricants are added in the range of 0.01 to 30 parts by weight with respect to 100 parts by weight of the binder.

Regarding these, I-M Technical Disclosure Bulletin (IBM Techni)
cal Disclosure Bulletin) V
ol. 9, No7, p779 (December 1966), Electronic (ELEKTRONIK) 1961 No
12, p380, Chemical Handbook, Advanced Edition, p954-96
7, disclosed in Maruzen Co., Ltd., etc. in 1980, and the compound can be referred to.

A dispersant and a dispersion aid may be added to the polishing layer for the purpose of assisting the dispersion of the abrasive particles. As the dispersant and the dispersion aid, caprylic acid, capric acid, lauric acid, myristic acid, palmitic acid, stearic acid,
Oleic acid, elaidic acid, linoleic acid, linolenic acid,
C2-C40 fatty acids such as stearoic acid, behenic acid, maleic acid, and phthalic acid (R ₁ COOH, R ₁ is an alkyl group having ₁ to 39 carbon atoms, a phenyl group, and an aralkyl group); Alkali metals of fatty acids (Li, Na, K,
NH ⁴⁺ ) or alkaline earth metals (Mg, Ca, B)
a) and the like, metal soap (copper oleate) composed of Cu, Pb and the like, fatty acid amide; lecithin (soybean oil lecithin) and the like are used. In addition to this, high-grade alcohol with 4 to 40 carbon atoms
(Butanol, octyl alcohol, myristyl alcohol, stearyl alcohol) and their sulfuric acid esters, sulfonic acids, phenylsulfonic acids, alkylsulfonic acids, sulfonic acid esters, phosphoric acid monoesters, phosphoric acid diesters, Phosphoric acid triester, alkylphosphonic acid, phenylphosphonic acid, amine compounds and the like can also be used. Further, polyethylene glycol, polyethylene oxide, sulfosuccinic acid, sulfosuccinic acid metal salt, sulfosuccinic acid ester and the like can also be used. One or more kinds of these dispersants are usually used, and one kind of the dispersant is added in the range of 0.005 to 20 parts by weight with respect to 100 parts by weight of the binder. The method of using these dispersants may be such that they are pre-deposited on the surface of the ferromagnetic fine powder or the non-magnetic fine powder, or they may be added during dispersion.

A mildew-proofing material may be added to the polishing layer. The antifungal agent that can be used is 2- (4-
Thiazolyl) -benzimidazole, N- (fluorodichloromethylthio) -phthalimide, 10,10'-oxybisphenoxarcine, 2,4,5,6 tetrachloroisophthalonitrile, P-tolyldiiodomethylsulfone, triiodo Examples include allyl alcohol, dihydroacetate, mercury phenyloleate, bis (tributyltin) oxide, and saltylanilide. Such materials are described, for example, in "Microbial Hazard and Prevention Technology", 1972 Engineering Book, "Chemistry and Industry", 32, 904 (1979).

Antistatic agents other than carbon black used in the present invention include graphite, modified graphite, carbon black graft polymer, tin oxide-antimony oxide, tin oxide, titanium oxide-tin oxide-antimony oxide.
Conductive powder such as saponin; Natural surfactant such as saponin; Nonionic surface active agent such as alkylene oxide type, glycerin type, glycidyl type, polyhydric alcohol, polyhydric alcohol ester, and alkylphenol EO adduct Agents; higher alkyl amines, cyclic amines, hydantoin derivatives, amido amines, ester amides, quaternary ammonium salts, pyridine and other heterocycles, cation surfactants such as phosphonium or sulfoniums; carboxylic acids, sulfonic acids, phosphonic acids , Anionic surfactants containing acidic groups such as phosphoric acid, sulfuric acid ester groups, phosphonic acid ester groups, phosphoric acid ester groups, etc .; amino acids; amphoteric interfaces such as aminosulfonic acids, sulfuric acid or phosphoric acid esters of amino alcohols, alkyl betaine type, etc. Activators and the like are used. Some of the examples of surfactant compounds that can be used as these antistatic agents are:
Ryohei Oda et al., “Synthesis of surfactants and their applications” (Maki Shoten 1972 edition); W. Bailey's "Surface Active Agents" (Interscience Publications Coporated 1985 edition);
P. Sisley's "Encyclopedia of Surfactive Agents, Volume 2" (Chemical Public Company 1964 edition); "Surfactant Handbook"
6th printing (Sangyo Tosho Co., Ltd., December 20, 1966)
Sun); Hideo Marumoshi, "Antistatic Agent," written in Koshobo (1968). These surfactants may be added alone or as a mixture. The amount of these surfactants used in the polishing layer is 0.01 to 10 parts by weight based on 100 parts by weight of the total amount of the abrasive and / or the ferromagnetic fine powder. The amount used in the back layer is 0.01 to 30 parts by weight per 100 parts by weight of the binder. Although these are used as antistatic agents, they are sometimes used for other purposes such as dispersion, improvement of magnetic properties, improvement of lubricity, coating aid, wetting agent, curing accelerator and dispersion accelerator. In some cases.

As the organic solvent used for dispersion, kneading and coating in preparing the polishing tape used in the method of the present invention, acetone, methyl ethyl ketone, methyl isobutyl ketone, cyclohexanone, isophorone, tetrahydrofuran, etc. can be used in any ratio. Ketone system; alcohol system such as methanol, ethanol, propanol, butanol, isobutyl alcohol, isopropyl alcohol, and methylcyclohexanol; methyl acetate, ethyl acetate,
Ester systems such as butyl acetate, isobutyl acetate, isopropyl acetate, ethyl lactate, glycol monoethyl ether acetate; ether systems such as diethyl ether, tetrahydrofuran, glycol dimethyl ether, glycol monoethyl ether, dioxane; benzene , Toluene, xylene, cresol, chlorobenzene, styrene and other tal type (aromatic hydrocarbons); methylene chloride, ethylene chloride, carbon tetrachloride, chloroform,
Chlorinated hydrocarbons such as ethylene chlorohydrin and dichlorobenzene, N, N-dimethylformaldehyde, hexane and the like can be used. Further, these solvents are usually used in two or more kinds at an arbitrary ratio. In addition, trace amounts of impurities (polymers of the solvent itself, water, raw material components, etc.) in an amount of 1% by weight or less
May be included.

These solvents are added in an amount of 100 to 20 relative to 100 parts by weight of the total solid content of the coating liquid for polishing layer and the coating liquid for undercoat layer.
Used at 000 parts by weight. The solid content of the coating liquid is preferably 1 to 40% by weight.

The polishing layer is formed by dissolving the above composition in any combination and dissolving it in an organic solvent, coating it on a support as a coating solution, drying it, and orienting it if necessary. The thickness of the support of the polishing tape is 2.5 to 500 μm, preferably 3 to 75 μm. Further, it is desirable that the Young's modulus of either the longitudinal direction or the width direction of the support is 400 kg / mm @ 2 or more. Materials include polyesters such as polyethylene terephthalate and polyethylene naphthalate, polyolefins such as polypropylene, and cellulose triacetate.
, Cellulose derivatives such as cellulose diacetate,
Vinyl resins such as polyvinyl chloride, polycarbonate
In addition to plastics such as polyimide, polyamide, polysulfone, polyphenyl sulfone, and polybenzoxazole, metals such as aluminum and copper, ceramics such as glass, and the like can be used. Of these, polyethylene naphthalate or polyamide is particularly preferable. Prior to coating, these supports may be subjected to corona discharge treatment, plasma treatment, undercoating treatment, heat treatment, dust removal treatment, metal dusting treatment, and alkali treatment. Regarding these supports, for example, West German Patent 3338854A and JP-A-59-1
No. 16926, JP-A No. 61-129731, U.S. Pat. No. 4,388,368; Yukio Mitsuishi, "Fiber and Industry", Vol. 31, p50-55, 1975. In the case of an abrasive tape or the like, the center line average surface roughness of these supports is 0.001 to 1.5 μm (cutoff value of 0.
25 mm) is preferred.

The method of dispersion and kneading is not particularly limited, and the order of addition of each component (resin, powder, lubricant, solvent, etc.),
The addition position during dispersion / kneading, the dispersion temperature (0 to 80 ° C.) and the like can be set appropriately. For the preparation of the coating for the polishing layer, a conventional kneading machine such as a two-roll mill, a three-roll mill, a ball mill, a pebble mill, a tron mill, a sand grinder, a Szegvari attritor, a high speed impeller, Disperser, high-speed stone mill, high-speed impact mill, disperser, kneader, high-speed mixer, ribbon blender, conider, intensive mixer,
A tumbler, a blender, a disperser, a homogenizer, a single-screw extruder, a twin-screw extruder, and an ultrasonic disperser can be used.
For normal dispersion / kneading, a plurality of these dispersion / kneading machines are provided,
Process continuously. For details of the technology related to kneading and dispersion,
T. C. By Patton (T-C-Patton) "P
aint Flow and Pigment Dis
"Person" (Paint Flow and Pigment Day Spar John) 1964 John Wil
published by ey & Sons (John Willy & Sons) and Shinichi Tanaka, "Industrial Materials," Vol. 25, 37 (19).
77) and the like and cited documents of the book. As an auxiliary material for the dispersion and kneading, in order to efficiently carry out the dispersion and kneading, steel balls, steel beads, ceramic beads, glass beads, and organic polymer beads having a sphere equivalent diameter of 10 cmφ to 0.05 mmφ can be used. Also, these materials are not limited to spherical shapes. It is also described in the specifications such as US Pat. Nos. 2,581,414 and 2,855,156. Also in the present invention, the polishing layer coating material and the back layer coating material can be prepared by kneading and dispersing according to the method described in the above-mentioned book or the cited document of the book.

As a method for coating the above-mentioned coating liquid for the polishing layer on the support, the viscosity of the coating liquid is adjusted to 1 to 20000 centistokes (25 ° C.), and an air doctor coater and a blade coater are used. -Coater, air knife coater, squeeze coater, impregnation coater, river roll coater, transfer roll coater, gravure coater, kiss coater, cast coater, spray coater, rod coater , A normal rotation roll coater, a carten coater, an extrusion coater, a bar coater, a lip coater, etc. can be used, and other methods are also possible, and specific explanations of these are given by Asakura Shoten. Published "Coating Engineering" pp. 253-2
It is described in detail on page 77 (published 46.20. Showa) and the like. The order of applying these coating liquids can be arbitrarily selected, and corona discharge treatment or the like may be performed before the application of the desired liquid in order to improve the adhesion to the undercoat layer or the support. When it is desired to form the polishing layer in multiple layers, simultaneous multilayer coating, sequential multilayer coating and the like may be performed. These are disclosed, for example, in JP-A-57-123532 and JP-B-62-3.
7451, JP-A-59-142741, and JP-A-59-165239.

By such a method, about 1 to about 1 is formed on the support.
Immediately after applying the polishing layer coating liquid of about 100 μm,
After performing a multi-stage drying treatment at 0 to 130 ° C., the formed polishing layer is dried to a thickness of 0.1 to 10 μm. The transport speed of the support at this time is usually 10 m / min.
The drying temperature is controlled at 900 m / min, the drying temperature is controlled at 20 ° C to 130 ° C in a plurality of drying zones, and the residual solvent amount of the coating film is set to 0.1 to 40 mg / m ² . If necessary, a back layer may be provided in the same procedure, and then the surface is smoothed to obtain a polishing layer or a back layer having a center line average surface roughness of 0.001 to 0.3 μm (cutoff of 0.25 m).
m) and cut into a desired shape to produce the polishing tape of the present invention. These manufacturing methods include powder pretreatment / surface treatment, kneading / dispersion, coating / orientation / drying, smoothing treatment, heat treatment, EB treatment, surface cleaning treatment, cutting,
It is desirable to carry out the winding process continuously. The polishing tape prepared in this manner is cut and then wound on a desired plastic or metal reel. It is desirable to burnish and / or clean the polishing tape (polishing layer, back layer, edge surface, base surface) immediately before or before winding. Burnish is a sapphire blade, a razor blade, a cemented carbide blade, a diamond blade, a blade for controlling the surface roughness and polishing power of the polishing tape.
Use a hard material such as a ceramics blade to scrape the protrusions on the surface of the polishing tape to make it uniform or smooth. The Mohs hardness of these materials is preferably 8 or more, but is not particularly limited as long as it can remove the protrusions. The shape of these materials does not have to be a blade, and a shape such as a square shape, a round shape, or a wheel (these materials may be provided around a rotating cylindrical shape) can be used. Cleaning of the polishing tape is performed by wiping the polishing tape surface, the back layer surface, the edge end surface, and the back side base surface with a non-woven fabric or the like on the surface layer of the polishing tape for the purpose of removing dirt on the surface of the polishing tape and excess lubricant. Examples of such wiping materials include various types of Vilene made in Japan Vilene, Toraysee made by Toray, Exaine, Kim Wipe, trade name.
As the non-woven fabric, a nylon non-woven fabric, a polyester non-woven fabric, a rayon non-woven fabric, an acrylonitrile non-woven fabric, a mixed-spun non-woven fabric, a tissue paper or the like can be used.

Abrasive particles, binder resin, additives (lubricant, dispersant, antistatic agent, surface treatment agent, carbon black, light-shielding agent, antioxidant, and anti-static agent used in the polishing method of the present invention. Mold and the like), solvent and support (which may have an undercoat layer, a back layer, a back undercoat layer) or a method for producing the same are further described in JP-B-56-26890. You can refer to the one on the recording medium.

[0053]

EXAMPLES The method of the present invention will be described more specifically below with reference to examples. It is easily understood by those skilled in the art that the components, ratios, operation sequences and the like shown herein can be changed without departing from the spirit of the present invention. Therefore, the present invention should not be limited to the examples below. In addition, "part" in the examples means "part by weight".

[Examples 1 and 2 and Comparative Examples 1 to 5] Thickness 2
On a polyethylene terephthalate (PET) support having a width of 5 μm and a width of 300 mm, an undercoat layer made of a polyester polyurethane resin is applied to a thickness of 0.1 μm, and a polishing layer coating solution prepared by the following composition is applied to the thickness after drying. Saga 1
A bar coating was applied so as to have a thickness of 0 μm, dried, and slit into various widths to prepare polishing tape samples.

[Coating Liquid Composition] Abrasive particles (alumina, granular, average particle size 0.1 μm, Mohs hardness 9): 95 parts Abrasive particles (diamond, granular, average particle size 0.5 μm, Mohs hardness 10): 5 parts Binder resin (polyester resin): 10 parts Binder resin (polyurethane, containing sodium sulfonate 2 × 10 ⁻³ equivalent / g resin, Mw 70000): 10 parts Polyisocyanate (trimethylolpropane (1 mol) TDI ( 3 moles) Additive): 5 parts Dispersant (copper oleate / phthalocyanine = 1/1): 0.1 part Lubricant (oleic acid / oleyl oleate): 0.1 part Diluent (methyl ethyl ketone / cyclohexanone =) 2/1): 200 parts Diluent (toluene / MIBK): 150 parts Additive (carbon black): 3 parts The results of polishing the protrusions of the filter under the following conditions shown in Table 1.

[Polishing conditions] Polishing tape count # 800
It was carried out under the conditions shown in Table 1 by selecting in the range of 0 to # 33000.

[Conditions for Measuring Height of Protrusion] Optical microscope (4
(00 times). The highest height before polishing was adopted.

[Conditions for Measuring Damage of Color Filter] By optical microscope observation. The sample with almost no scratch was evaluated as ○, and the sample with scratch was evaluated as ×.

[0059]

[Table 1]

[Examples 3 to 7 and Comparative Examples 6 to 10] A polyethylene terephthalate (PET) support having a thickness of 25 μm was coated with a subbing layer made of a polyester polyurethane resin to a thickness of 0.5 μm, and the following layers were formed thereon. The coating solution for polishing layer adjusted by the composition was bar-coated so as to have a thickness of 3 μm after drying to prepare a polishing tape sample. Composition of coating liquid Abrasive (alumina, granular, average particle size Aμm, Mohs hardness 9): 100 parts Binder resin (vinyl chloride resin): X part Binder resin (polyurethane, sodium sulfonate 2 × 10 ⁻³ equivalent / g resin) Included, Mw 70000): Y part Binder resin (polyisocyanate, TD I (3 mol) adduct of trimethylolpropane (1 mol)): Z part Carbon black (Ketjenblack EC): B part Lubricant (oleic acid / Oleyl oleate): 0.1 part Diluent (methyl ethyl ketone / cyclohexanone = 2/1): 200 parts Diluent (toluene / MIBK): 150 parts The above coating liquid compositions are listed in Table 2.

[0061]

[Table 2]

The prepared polishing tape sample was 12.65.
Table 3 shows the results of processing to mm and polishing the projections of the color filter under the above conditions. In addition, the grinding method and the conditions thereof for the intrinsic projections were the same as those in the first embodiment. Each evaluation item and its evaluation conditions were as follows. [Electrostatic Discharge] The amount of charge on the surface immediately after sliding of the polishing tape during grinding was measured by TRECK manufactured by TRECK and evaluated from the amount of charge as follows. ○ -10 to +10 mV x -11 mV or less or +11 mV or more [corrosion] Polished color filter at 50 ° C 90%
After being left under RH conditions for 30 days, an LCD panel was prepared and a voltage was applied to examine the corrosion state of the color filter element. ○: No short circuit was recognized. × ... A short circuit was observed at one or more places.

[0063]

[Table 3]

[0064]

EFFECTS OF THE INVENTION It is possible to carry out cutting and polishing without damaging the surface to be polished by the endogenous projections, and in particular, it is possible to polish the color filter for liquid crystal at a high rate. Furthermore, by specifying the binder resin component used in the polishing layer of the polishing tape used for it, it is possible to prevent the color filter for liquid crystal from being corroded or the electrical short circuit.

Claims (4)

[Claims] 1. An object to be polished having an intrinsic protrusion on the surface thereof, and a polishing tape having a polishing layer mainly composed of abrasive particles and a binder on a support, the surface to be polished of the object to be polished, and the polishing tape. (3) A polishing method of grinding the endogenous protrusions by bringing them into contact with each other in directions opposite to each other so as to make sliding contact with the polishing layer. 2. The polishing method according to claim 1, wherein the object to be polished is a color filter for a liquid crystal display. 3. The binder of the polishing layer of the polishing tape is made of vinyl chloride resin, urethane resin and polyisocyanate, and the composition ratio thereof is 1 to 10:70 to 95: by weight.
It is 5-40, The polishing method of Claim 1 or Claim 2. 4. The binder of the polishing layer of the polishing tape is made of urethane resin and polyisocyanate, and the composition ratio thereof is 60 to 95: 5 to 40 by weight.
Alternatively, the polishing method according to claim 2.