JPH0766913B2 - Grinding blade management circuit - Google Patents

Grinding blade management circuit

Info

Publication number
JPH0766913B2
JPH0766913B2 JP30241687A JP30241687A JPH0766913B2 JP H0766913 B2 JPH0766913 B2 JP H0766913B2 JP 30241687 A JP30241687 A JP 30241687A JP 30241687 A JP30241687 A JP 30241687A JP H0766913 B2 JPH0766913 B2 JP H0766913B2
Authority
JP
Japan
Prior art keywords
signal
grinding
grinding blade
blade
circuit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP30241687A
Other languages
Japanese (ja)
Other versions
JPH01141702A (en
Inventor
知行 田中
穂▲高▼ 池田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tokyo Seimitsu Co Ltd
Original Assignee
Tokyo Seimitsu Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Seimitsu Co Ltd filed Critical Tokyo Seimitsu Co Ltd
Priority to JP30241687A priority Critical patent/JPH0766913B2/en
Publication of JPH01141702A publication Critical patent/JPH01141702A/en
Publication of JPH0766913B2 publication Critical patent/JPH0766913B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Landscapes

  • Processing Of Stones Or Stones Resemblance Materials (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Dicing (AREA)
  • Machine Tool Sensing Apparatuses (AREA)

Description

【発明の詳細な説明】 〈産業上の利用分野〉 この発明は半導体製造等の工程において、精密な研削、
溝入れ等の加工を行うダイシング装置の高速回転する研
削刃の刃先の状態を管理し、研削刃の交換時期を管理す
るための電気回路に係るものである。
DETAILED DESCRIPTION OF THE INVENTION <Industrial field of application> This invention is intended for precision grinding, in processes such as semiconductor manufacturing.
The present invention relates to an electric circuit for managing the state of the cutting edge of a grinding blade that rotates at high speed in a dicing device that performs processing such as grooving and for managing the replacement time of the grinding blade.

〈従来技術〉 例えば、半導体製造のときにウエハの溝切装置としてダ
イシング機が使用される。ダイシング機では1万回転以
上の高速に回転する丸い刃(研削刃)をもって精密な溝
切りが、ほとんど無人で行われているが、刃先に欠損を
生じ、もしくは刃の寿命がきたもので研削を続けると、
研削線が凸凹がはげしくなり、ひび割れを生ずる等の事
故が発生し、半導体の歩留りを低下させることになる。
そこで刃の自動管理がいろいろ考えられてきた。例えば
研削の結果である溝の形状を測定するもの(特開昭54−
109681号)、研削の際の機台の振動によって判断しよう
とするもの(特開昭54−113583号)。なおこの他に刃に
光を当て、その反射光を検出器で受けその出力信号によ
って判断しようとするもの(特開昭54−109682号、特開
昭60−62444号、実開昭59−122209号)がある。
<Prior Art> For example, a dicing machine is used as a wafer grooving device during semiconductor manufacturing. With a dicing machine, precision groove cutting is performed with a round blade (grinding blade) that rotates at a high speed of 10,000 rpm or more, but almost unattended, but grinding occurs when the blade edge is broken or the blade has reached the end of its life. If you continue
An irregularity of the grinding line becomes severe, an accident such as cracking occurs, and the yield of semiconductors is reduced.
Therefore, various automatic blade management has been considered. For example, the shape of the groove that is the result of grinding is measured (Japanese Patent Laid-Open No. 54-
No. 109681), which is to be judged by the vibration of the machine base during grinding (Japanese Patent Laid-Open No. 54-113583). In addition to this, the blade is irradiated with light, and the reflected light is received by a detector to determine the output signal (Japanese Patent Laid-Open Nos. 54-109682, 60-62444 and 59-122209). No.)

ここで溝形状により判断しようとするものでは研削作業
終了、もしくは途中でマシンを停止させ、研削刃の表面
をきれいに拭いてからでなくては測定ができず能率上好
ましくなく、間接的な測定であって適切とはいえない。
また駆動中の振動による方法では、研削刃が非常に高速
回転している関係上、振動と刃の欠損との関係が判断し
難い欠点がある。尚、光を刃に当ててその反射光もしく
は通過光を検出器を検出して刃の状態を検出することは
上記公報に示されているが、検出信号をどのように処理
して刃の状態を判断するかは何も示されていない。すな
わち高速に回転して研削中の研削刃には常時研削液が噴
射され、切粉が付着し、離脱していて、検出信号が不安
定で、これから刃の状態を判定する信号を作り出す必要
があるのに、これについては全く示されていない。した
がって、上記公報の技術はそのままでは実用不可能であ
る。
If you want to judge based on the groove shape, it is not possible to perform measurement unless you finish the grinding work or stop the machine in the middle and wipe the surface of the grinding blade cleanly. It's not right.
In addition, the method using vibration during driving has a drawback that it is difficult to determine the relationship between vibration and blade loss because the grinding blade rotates at a very high speed. Incidentally, it is disclosed in the above publication that the light is applied to the blade and the reflected light or the passing light is detected by the detector to detect the state of the blade, but how the detection signal is processed to determine the state of the blade. Nothing is shown to judge. That is, the grinding fluid is constantly jetted to the grinding blade during high-speed rotation and grinding, and the chips adhere to and separate from the grinding blade, and the detection signal is unstable.Therefore, it is necessary to generate a signal for judging the state of the blade. However, this is not shown at all. Therefore, the technique of the above publication cannot be put to practical use as it is.

本願発明は、光ファイバーによって高速回転する研削刃
を挟み対向して至近距離から狭い範囲に光を当てる事に
よって、直線性の良い光源を不要とし、研削水の影響を
少なくすると共に、単位時間当たりの光量変化を検出す
る事にって応答速度を高くすることができ、また、光量
変化を時間測定回路を付加した事で研削水による影響を
取り除くと同時に研削刃の欠損(欠け)の大きさの程度
を知る事ができる研削刃管理回路と、研削刃の状況信号
をローパスフィルターに通し平均化された信号とし、設
定基準信号との比較により、その出力信号をもって刃の
寿命を判定する回路とで研削刃の交換時期を管理するも
のである。
The present invention eliminates the need for a light source with good linearity by irradiating light in a narrow range from a close distance by sandwiching a grinding blade that rotates at a high speed by an optical fiber, reducing the influence of grinding water, and The response speed can be increased by detecting the change in light intensity, and the effect of grinding water can be removed by adding a time measurement circuit to the change in light intensity, and at the same time, the size of the grinding edge can be reduced. With a grinding blade management circuit that can know the degree, and a circuit that determines the life of the blade by comparing the output signal with the setting reference signal, by comparing the grinding blade status signal to a signal that is averaged through a low-pass filter. It controls the replacement time of the grinding blade.

〈問題点を解決するための手段〉 本発明においては高速で回転する研削刃を挟み対向近接
して光ファイバーを介して設けられた投光器と受光器か
らなる光検出器の受光器出力を分岐し、一方の信号をロ
ーパスフィルターに通し平均化された信号とし、他方の
信号を増幅し、両信号との差を作る第一コンパレータ回
路により信号の急変を検出し、その信号をクロックパル
スによって前記研削刃の欠損の大きさを判定し、又、上
記研削刃の状況信号をローパスフィルターに通し平均化
された信号とし、設定基準信号との比較により、その出
力信号をもって刃の寿命を判定する2つの判定信号で研
削刃を管理するものである。
<Means for Solving Problems> In the present invention, the photodetector output of the photodetector consisting of the projector and the photoreceiver provided via the optical fiber in close proximity to each other with the grinding blade rotating at a high speed interposed therebetween is branched, One signal is passed through a low-pass filter and averaged, the other signal is amplified, and a sudden change in the signal is detected by the first comparator circuit that makes the difference between the two signals, and the signal is clock pulsed to the grinding blade. Two judgments are made to judge the size of the defect of the grinding wheel, and to make the status signal of the grinding blade an averaged signal through a low-pass filter, and compare it with the set reference signal to judge the life of the blade with the output signal. The signal controls the grinding blade.

〈実施例〉 以下、図面を参照に本発明の実施例について説明する。<Examples> Examples of the present invention will be described below with reference to the drawings.

第1図は、本発明の構成を示すものでこれにより発明の
構成を説明する。
FIG. 1 shows the constitution of the present invention. The constitution of the present invention will be described with reference to FIG.

回転する薄い円板の研削刃1の先端部に向かって投光、
受光用の光ファイバー2、3の先端を固定し、他端に投
光器4、受光器5を取り付ける。
Light is projected toward the tip of the rotating thin disc grinding blade 1.
The tips of the optical fibers 2 and 3 for light reception are fixed, and the projector 4 and the light receiver 5 are attached to the other ends.

そして、受光器5において光量を電圧に変換して出力
し、これを前置増幅器に通し2つに分岐する。
Then, the light receiver 5 converts the amount of light into a voltage and outputs the voltage, which is passed through a preamplifier and branched into two.

なお、前記増幅器を出た信号aの波形は第2図に示す。The waveform of the signal a output from the amplifier is shown in FIG.

第2図においては、波形の縦軸の上(ハイレベル)は反
射光が多い状態、下(ローレベル)は反射光が少ない状
態を示す物とする。
In FIG. 2, the vertical axis of the waveform indicates a state in which a large amount of reflected light is present (upper level), and the lower portion (low level) represents a state in which less reflected light is present.

aにおいては小さな上下動は刃の表面の粗荒等による反
射の部分的むらがあり、窪み部分は刃の欠損(欠け)に
よって反射光の少ない部分に原因する。その横軸は時間
を大きく延長して示すものである。
In a, a small vertical movement has partial unevenness of reflection due to roughening of the surface of the blade, and the recessed portion is caused by a portion of the blade where the reflected light is small due to the lack of the blade. The horizontal axis shows the time greatly extended.

受光器5により得られた反射光信号は前置増幅器6を通
り2分され、一方は前置増幅器7を通り第1コンパレー
タ9に入り、他方の信号はローパスフイルター8を通り
平均化された信号となり、該反射信号の急変を第1コン
パレータ9により検出される。すなわち、ローパスフィ
ルター8を出た反射信号を平均化した信号c(積分回路
を通るため信号急変に対する応答は鈍い)は第1コンパ
レータの基準信号となり、研削刃に欠損(欠け)のない
正規の状態で前置増幅器7のオフセットを調整し、信号
cよりも信号bが若干高めになるようにする。この調整
を行う事により緩やかな直流変動(研削液等による投光
面、受光面の曇り、研削刃の摩耗による光量変化)に対
しては第1コンパレータの信号が反転しない。(ローレ
ベルが継続する) また、研削派の欠損(欠け)による急変な信号は増幅器
7を通り第1コンパレータの被比較信号となり前述のロ
ーパスフィルター8の出力信号と比較して第1コンパレ
ータ出力より研削刃の欠損信号dとして出力される。こ
の欠点信号dを欠損判定回路10に入れ、その信号の時間
長(パルス幅)をクロックパルスによって研削刃の欠損
(欠け)の大きさを判定し欠損の警告信号とする。すな
わち欠損(欠け)判定回路10には外部よりクロックパル
スe(周期t)を入れ、波形dにおいて突出したm、n
のパルスの中にクロックパルスの周期tが何個入るかを
カウントし、いま波形fに示すようにdの波形の突出部
m、nでmはt×1、nはt×3の幅を有するとする。
The reflected light signal obtained by the light receiver 5 passes through the preamplifier 6 and is divided into two, one passes through the preamplifier 7 and enters the first comparator 9, and the other signal passes through the low-pass filter 8 and is averaged. Then, the first comparator 9 detects a sudden change in the reflected signal. That is, the signal c obtained by averaging the reflection signals output from the low-pass filter 8 (the response to the sudden change in the signal is slow because it passes through the integrating circuit) becomes the reference signal of the first comparator, and the grinding blade is in a normal state with no defects. The offset of the preamplifier 7 is adjusted by so that the signal b is slightly higher than the signal c. By performing this adjustment, the signal of the first comparator is not inverted with respect to the gentle DC fluctuations (clouding of the light-projecting surface and light-receiving surface due to grinding fluid or the like, and light quantity change due to wear of the grinding blade). (The low level continues.) Also, a sudden change signal due to the loss (loss) of the grinding wave passes through the amplifier 7 and becomes the compared signal of the first comparator, and is compared with the output signal of the low-pass filter 8 described above to output from the first comparator output. It is output as a grinding blade loss signal d. This defect signal d is input to the defect determination circuit 10 and the time length (pulse width) of the signal is used to determine the size of the defect (defect) of the grinding blade by the clock pulse, and this is used as a defect warning signal. That is, a clock pulse e (cycle t) is input from the outside to the loss determination circuit 10 to cause m, n protruding in the waveform d.
The number of clock pulse periods t included in each pulse is counted. Now, as shown in the waveform f, the protrusions m and n of the waveform of d are such that m is t × 1 and n is t × 3. Suppose you have.

ここで研削刃の測定点の周長、刃の回転数及びtが判か
っているので、tに相当する寸法が判る。これにより
m、nの長さを読み取ることが可能である。そこで研削
刃の1回転のうちの刃の欠損部をtをもって分離、集計
すれば刃の欠損状態が判明する。
Here, since the circumference of the measuring point of the grinding blade, the number of revolutions of the blade, and t are known, the dimension corresponding to t can be known. This makes it possible to read the lengths of m and n. Therefore, if the cutting portion of the blade in one rotation of the grinding blade is separated with t, and is tabulated, the broken state of the blade can be found.

また、例えばt×3以上の欠損を要警告とすればこれを
警告表示信号として出力するこができる。すなわち、研
削刃の欠損(欠け)管理の信号を作ることができる。
Further, for example, if a warning of t × 3 or more is required, this can be output as a warning display signal. That is, it is possible to generate a signal for managing the lack of the grinding blade.

第3図は長時間の使用による研削刃の損耗状況を反射光
量を縦軸に取って模型的に示したものであり、図の右側
は第1図の研削刃1のツキ出し量が減るのに従い反射光
量が逐次下降減少する状況を現す。このとき第1図のロ
ーパスフィルター8を通し平均化された出力信号は第2
図の波形c′において、実線で示すように逐次下降す
る。そして第2コンパレータ回路11において第2図波形
c′の実線波形が点線で接点された基準電圧pに接触す
る。
FIG. 3 shows a model of the wear condition of the grinding blade due to long-term use with the amount of reflected light taken along the vertical axis. The right side of the figure shows that the amount of protrusion of the grinding blade 1 in FIG. 1 decreases. Therefore, the reflected light amount gradually decreases. At this time, the output signal averaged through the low pass filter 8 in FIG.
In the waveform c ′ in the figure, it gradually descends as shown by the solid line. Then, in the second comparator circuit 11, the solid line waveform of the waveform c'in FIG. 2 contacts the reference voltage p contacted by the dotted line.

このときをもって刃の寿命と設定して、警告信号gを出
力する。すなわち上記欠損管理信号と寿命警告信号を以
て、研削刃の欠損と共に寿命判定の管理を行うものであ
る。
At this time, the life of the blade is set and the warning signal g is output. That is, the defect management signal and the life warning signal are used to manage the life judgment as well as the defect of the grinding blade.

〈効果〉 以上説明したように、本願発明によって、研削刃の欠損
部を長さによって検知することができる。
<Effect> As described above, according to the present invention, the defective portion of the grinding blade can be detected by the length.

そこで研削刃の1回転の信号を使えば研削刃の全周にど
のような長さの欠損(欠け)が何個発生しているかを知
るこができ、研削刃の欠損(欠け)の長さによって研削
刃の交換条件を設定すれば、設定条件になったとき直ち
に警告表示を行うことができる。
Therefore, by using the signal of one revolution of the grinding blade, it is possible to know how many defects (chips) have occurred on the entire circumference of the grinding blade, and the length of the grinding blade (chips). By setting the replacement condition of the grinding blade by, a warning can be displayed immediately when the setting condition is met.

また、このとき研削加工中の長時間中に起こる環境変化
による信号の変動(直流変動)は信号b、cの比較では
キャンセルされるので影響がなくなり、研削刃の欠損は
信号の急変を検知する事によりリアルタイムに正確に検
知できる。この事を特徴とする。
Further, at this time, the fluctuation of the signal (DC fluctuation) due to the environmental change that occurs during a long time during the grinding process is canceled by the comparison of the signals b and c, so that there is no influence, and the defect of the grinding blade detects the sudden change of the signal. It can be accurately detected in real time. Characterized by this.

又、上記回路に僅かの回路を付加することにより、研削
刃の寿命を併せて総合的に研削刃の交換時期を管理する
ことができる。
Further, by adding a small number of circuits to the above circuit, it is possible to comprehensively control the replacement time of the grinding blades together with the life of the grinding blades.

【図面の簡単な説明】[Brief description of drawings]

第1図は本発明の構成を示すブロック図、第2図は第1
図の各点における出力波形説明図、第3図は研削刃の寿
命と反射量の関係図 1:回転刃(研削刃)、2:光ファイバー 3:光ファイバー、4:投光器 5:受光器、6:前置増幅器 7:増幅器 8:ローパスフィルター 9:第1コンパレーター 10:欠損(欠け)判定回路 11:第2コンパレータ
FIG. 1 is a block diagram showing the configuration of the present invention, and FIG.
Output waveform explanatory diagram at each point in the figure, Fig. 3 shows the relationship between the life of the grinding blade and the reflection amount Figure 1: Rotary blade (grinding blade), 2: Optical fiber 3: Optical fiber, 4: Emitter 5: Receiver, 6: Preamplifier 7: Amplifier 8: Low-pass filter 9: First comparator 10: Missing judgment circuit 11: Second comparator

───────────────────────────────────────────────────── フロントページの続き (56)参考文献 特開 昭60−177847(JP,A) 特開 昭61−252051(JP,A) 特開 昭62−94209(JP,A) 特開 昭60−62444(JP,A) 特開 昭55−90248(JP,A) 特開 昭57−204414(JP,A) 実開 昭53−156984(JP,U) 実開 昭60−139280(JP,U) ─────────────────────────────────────────────────── ─── Continuation of the front page (56) Reference JP-A-60-177847 (JP, A) JP-A-61-252051 (JP, A) JP-A-62-94209 (JP, A) JP-A-60- 62444 (JP, A) JP 55-90248 (JP, A) JP 57-204414 (JP, A) Actually opened 53-156984 (JP, U) Actually opened 60-139280 (JP, U)

Claims (1)

【特許請求の範囲】[Claims] 【請求項1】加工物に研削液を噴出させながら研削する
ダイシング装置において、高速回転する研削刃を挟み対
向近接して光ファイバーを介して設けられた投光器と受
光器からなる光検出器の受光器出力を分岐し、一方の信
号をローパスフイルターに通し平均化された信号とし、
他方の信号を増幅し、両信号との差を作る第一コンパレ
ータ回路により光検出器の受光器出力信号の急変を検出
し、その信号とクロックパルスとで前記研削刃の欠損の
大きさを判定をする回路と、上記ローパカフイルターを
通し、平均化された信号と、任意設定可能な基準信号と
を比較する第二コンパレータ回路の出力信号とで研削刃
の寿命を判定する回路により研削刃の交換時期を管理す
る研削刃管理回路。
1. A photodetector of a photodetector comprising a light emitter and a light receiver, which are provided in close proximity to each other via an optical fiber in a dicing device for grinding while ejecting a grinding liquid onto a workpiece, with a grinding blade rotating at a high speed interposed therebetween. The output is branched, one signal is passed through a low-pass filter to be an averaged signal,
A first comparator circuit that amplifies the other signal and creates a difference between the two signals detects a sudden change in the photodetector output signal of the photodetector, and determines the size of the grinding blade defect with that signal and a clock pulse. Circuit, through the roper filter, averaged signal, and the output signal of the second comparator circuit that compares the reference signal that can be set arbitrarily, the circuit that determines the life of the grinding blade of the grinding blade Grinding blade management circuit that manages replacement time.
JP30241687A 1987-11-30 1987-11-30 Grinding blade management circuit Expired - Fee Related JPH0766913B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP30241687A JPH0766913B2 (en) 1987-11-30 1987-11-30 Grinding blade management circuit

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP30241687A JPH0766913B2 (en) 1987-11-30 1987-11-30 Grinding blade management circuit

Publications (2)

Publication Number Publication Date
JPH01141702A JPH01141702A (en) 1989-06-02
JPH0766913B2 true JPH0766913B2 (en) 1995-07-19

Family

ID=17908654

Family Applications (1)

Application Number Title Priority Date Filing Date
JP30241687A Expired - Fee Related JPH0766913B2 (en) 1987-11-30 1987-11-30 Grinding blade management circuit

Country Status (1)

Country Link
JP (1) JPH0766913B2 (en)

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
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