JPH0766576A - Heat transmission acceleration surface structure - Google Patents

Abstract

PURPOSE:To realize a fast computer wherein an integrated circuit element which generates high heat conduction density, that is, high heat flux can be cooled by making refrigerant with a centrifugal force flow three dimensionally for accelerating heat conduction on a surface with a groove fixed to an integrated circuit element. CONSTITUTION:In a whole heat transmission acceleration surface structure 10, fluid, which is refrigerant, enters a channel structure 20 which is constituted of partition 24 and a guide plate 22 from an inlet channel 26. Furthermore, heat from an integrated circuit element is transmitted while it passes an exit part 44 from an inlet part 42 of a heat conduction surface 80 with a groove through a heat conduction acceleration structure 40, and refrigerant flows out of a refrigerant exit channel 28. That is, refrigerant flows three dimensionally a short distance while receiving centrifugal force along a groove part 80. This brings about an advantage of little pressure loss. Furthermore, heat conduction rate can be improved by applying centrifugal force which is vertical or parallel to a channel or that which is vertical to a flow direction, and cooling efficiency can be improved.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION The present invention relates to an LSI, a diode,
The present invention relates to a heat transfer promotion surface structure of an integrated circuit when cooling heat generated from an element of an electronic device such as an IGBT and a thyristor.

[0002]

2. Description of the Related Art A method using a bellows and a cold water flow path for cooling an integrated circuit element has been conventionally performed. For example, Asme Heat Transfer Division Volume 119 and Heat Transfer High
Energy / High Heat Flux Applications 12/89, pages 25-32, "Flo-boiling in-covered channel" (Gu,
Chow and Beam, “Flow Boili
ng in a Curved Channel ”, A
SME Heat Transfer Divisi
o, Vol. 119, Heat Transfer i
n High Energy / High Heat Fl
ux Applications, 12/89, pp.
25-32) uses He gas or heat conductive grease to reduce the contact thermal resistance on the contact surface of the heat conductive element between the cold water flow path and the element, but the contact thermal resistance is 1 cm ² It is described that the temperature is 0.2 ° C./W or more.

[0003]

In electronic devices, especially computers, it is necessary to shorten the signal transmission time in order to improve the calculation speed, and to minimize the temperature variations of individual elements. In the above-mentioned prior art, this point has not been sufficiently taken into consideration. .

An object of the present invention is to provide a heat transfer promoting surface structure of an integrated circuit which can cool an element which generates a high heat flux with high efficiency and can speed up a computer.

[0005]

In order to achieve the above object, the heat transfer promotion surface structure of the present invention has a cooling medium as a flow path structure of a cooling medium for cooling an integrated circuit element, the cooling medium being provided along the outside thereof. Flow path structure having a plurality of pairs of small curvatures at the end portion and having a pair of inlets and outlets with respect to the heat transfer surface in order to guide It has a heat transfer surface fixed to the integrated circuit element. The heat transfer surface has a boiling heat transfer surface structure. Further, the heat transfer surface structure is provided in plural, and the flow path structure has a flow passage structure in which the refrigerant flows in series or in parallel to each heat transfer surface structure. Further, it has a structure for cooling the cooling medium by an external secondary fluid. Further, the heat transfer surface is provided with fins having an enlarged heat transfer surface.

[0006]

When an integrated circuit element is cooled by convective heat transfer or boiling heat transfer, a method using a very short flow path to reduce pressure loss has an area expansion rate of about 10 times that of a smooth surface. It is valid. With the above configuration,
On the integrated circuit element, a heat transfer promoting surface that three-dimensionally flows on the surface with fine grooves that increases the heat transfer area to cause centrifugal force to act and shortens the flow path length is provided on the integrated circuit element. To form. Also, whether vertical or parallel to the flow path,
The heat transfer coefficient can be improved by applying centrifugal force perpendicular to the flow direction. A flow path having these effects is formed on the integrated circuit element to improve the cooling performance.

[0007]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described with reference to FIGS. 1 is a perspective view showing a system for cooling integrated circuit elements, FIG. 2 is a perspective view showing a heat exchange section, FIG. 3 is a bottom view of a heat transfer promotion structure seen from the opposite side, and FIG. 4 is a heat transfer promotion structure. 6 is a side view of the body and the grooved surface, FIG. 5 is a top view of the heat transfer promoting structure, and FIG.
Is a bottom view of the heat transfer promoting structure, FIG. 7 is a side view of the heat transfer promoting structure, FIG. 8 is a side view of the heat transfer promoting structure and the flow path structure, and FIG. 9 is a heat transfer promoting structure and the flow path. FIG. 10 is a side view of the structure, FIG. 10 is a top view of the heat transfer promotion structure and the flow path structure, and FIG. 11 is a perspective top view of the flow path structure for cooling a large number of integrated circuit elements.
12 is a perspective bottom view of a structure that supplies a coolant to the flow path structure, and FIG. 13 is a cross-sectional view showing the entire cooling structure shown in FIG.

As shown in FIG. 1, the entire heat transfer promotion surface structure 10 is constructed as follows. The fluid that is the refrigerant is
From the inlet flow path 26, the flow path structure 20 composed of the partition plate 24 and the guide plate 22 enters the flow path structure 20, further through the heat transfer promoting structure 40, and from the inlet part 42 of the grooved heat transfer surface 80 to the outlet part 44. In the meantime, heat from the integrated circuit element is transferred, and the refrigerant flows out from the refrigerant outlet passage 28. The coolant is the groove 8
Since it only flows three-dimensionally while receiving a centrifugal force along a small distance along 0, there is an advantage that the pressure loss can be small.

As can be seen from FIG. 2 showing the details, the upper surface 50 of the heat transfer promoting structure 40 and the lower surface 30 of the flow path structure 20 are adapted to be aligned with each other. The refrigerant (fluid) enters from the inlet portion 42, is branched by the edge 84 of the grooved surface, and flows along the grooved surface 80 of the curved portion 82 of the grooved surface and the clearance with the bottom surface 56. The refrigerant inlet and outlet flow paths are
It is partitioned by the inclined wall surface 46 and the flow path wall surface 54.

FIG. 3 is a view of the heat transfer promotion structure 40 of FIG. 2 from the opposite side (the integrated circuit element side is the upper side of FIG. 3), FIG. 4 is a view of the heat transfer promotion structure 40 from the side, Facilitating structure 40
5 viewed from the top, FIG. 6 viewed from the bottom of the heat transfer promotion structure 40, FIG. 7 viewed from the side of the heat transfer promotion structure 40, the heat transfer promotion structure 40 and the flow path structure 20 (inlet). 8 and 9 viewed from the side in a state where the flow path 26, the outlet flow path 28, etc. are assembled), FIG. 10 viewed from above (the side opposite to the integrated circuit element), and a number of integrated circuit elements are shown. As can be seen from FIG. 11 when viewed obliquely from above of the flow channel structure 20 (comprising the inlet flow channel 26, the outlet flow channel 28, etc.) for cooling, the header structure 62 for supplying the refrigerant to the flow channel structure is used. Header inlet portions 64 and header outlet portions 66 are formed alternately. In this figure, the element side is located on the upper side.

FIG. 13 shows a state in which a module 74 having a large number of chips is mounted. Header structure 62
The module 70 is in contact with the module casing 60 from the lower surface 70 thereof, and the modules are connected by the pin row 76 of the module 74. The outer surface 72 of the header structure is cooled by a secondary cooling system such as ordinary cooling water.

FIG. 14 shows another embodiment of the heat transfer promoting structure 40 in which the fin 86 is attached to the curved portion 82 of the groove.

[0013]

The heat generation density, that is, the high heat flux is generated by three-dimensionally flowing the refrigerant to which centrifugal force is added to accelerate the heat transfer on the grooved surface fixed to the integrated circuit device. Such integrated circuit elements can be cooled, which is effective in increasing the speed of the computer.

[0014]

[Brief description of drawings]

FIG. 1 is a perspective view showing a system for cooling an integrated circuit device which is an embodiment of the present invention.

FIG. 2 is a perspective view showing a heat exchange section of the present embodiment.

FIG. 3 is a bottom view of the heat transfer promotion structure of the present embodiment as seen from the opposite side.

FIG. 4 is a side view of the heat transfer promoting structure and the grooved surface of the present embodiment.

FIG. 5 is a top view of the heat transfer promotion structure of the present embodiment.

FIG. 6 is a bottom view of the heat transfer promotion structure of the present embodiment.

FIG. 7 is a side view of the heat transfer promotion structure of the present embodiment.

FIG. 8 is a side view of the heat transfer promotion structure and the flow path structure of the present embodiment.

FIG. 9 is a side view of the heat transfer promotion structure and the flow path structure of the present embodiment.

FIG. 10 is a top view of a heat transfer promotion structure and a flow path structure of the present embodiment.

FIG. 11 is a perspective top view of a flow path structure for cooling a large number of integrated circuit devices in this embodiment.

FIG. 12 is a perspective bottom view of a structure that supplies a coolant to the flow path structure of the present embodiment.

13 is a cross-sectional view showing the entire cooling structure shown in FIG.

FIG. 14 is a partial perspective view of a heat transfer promotion surface structure according to another embodiment of the present invention.

[Explanation of symbols]

DESCRIPTION OF SYMBOLS 10 ... Heat transfer promotion surface structure, 20 ... Flow path structure, 22 ... Guide plate, 24 ... Partition plate, 26 ... Inlet flow path, 28 ... Exit flow path, 30 ... Lower surface of flow path structure, 32 ... Flow path Top surface of structure, 40 ... Heat transfer promoting structure, 42 ... Entrance part of grooved heat transfer surface, 44 ... Exit part of grooved heat transfer surface, 46 ... Inclined wall surface, 48 ... Upper part of heat transfer promotion structure Grooves, 50 ... the upper surface of the heat transfer promoting structure, 52 ... the side surface of the heat transfer promoting structure, 54 ... the flow path wall surface, 56 ... the lower surface having the curvature of the heat transfer promoting structure, 6
0 ... Housing of flow path structure, 62 ... Header structure, 6
4 ... Header inlet channel, 66 ... Header outlet channel, 68 ... Header section channel, 70 ... Header structure lower surface, 72 ... Header structure upper surface, 74 ... Module, 76 ... Pin row, 80
... Heat transfer surface with groove, 82 ... Curvature portion of grooved surface, 84 ... Sharp edge of grooved surface, 86 ... Fin.

Claims (5)

[Claims] 1. A cooling medium flow path structure for cooling an integrated circuit device, which has a plurality of pairs of small curvatures at its end for guiding the cooling medium along the outside thereof, A heat transfer structure having a flow path structure having an inlet and an outlet paired with the transfer surface, and a heat transfer surface fixed to an integrated circuit element installed at a narrow interval from the flow path structure. Promotional surface structure. 2. The heat transfer promotion surface structure according to claim 1, wherein the heat transfer surface is a boiling heat transfer surface structure. 3. The heat transfer promotion surface structure according to claim 1, wherein the heat transfer surface structure includes a plurality of heat transfer surface structures, and a flow passage structure is provided for flowing a refrigerant in series or in parallel to each heat transfer surface structure. . 4. The heat transfer promotion surface structure according to claim 1, further comprising a structure for cooling the cooling medium by an external secondary fluid. 5. The heat transfer promotion surface structure according to claim 1, wherein the heat transfer surface is provided with fins having an enlarged heat transfer surface.