JPH0766516A - Printed-wiring board and through hole making method in the same - Google Patents
Printed-wiring board and through hole making method in the sameInfo
- Publication number
- JPH0766516A JPH0766516A JP21658493A JP21658493A JPH0766516A JP H0766516 A JPH0766516 A JP H0766516A JP 21658493 A JP21658493 A JP 21658493A JP 21658493 A JP21658493 A JP 21658493A JP H0766516 A JPH0766516 A JP H0766516A
- Authority
- JP
- Japan
- Prior art keywords
- wiring board
- hole
- diameter portion
- mounting surface
- printed wiring
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3447—Lead-in-hole components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
- H05K3/429—Plated through-holes specially for multilayer circuits, e.g. having connections to inner circuit layers
Landscapes
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明はプリント配線板及びプリ
ント配線板におけるスルーホールの形成方法に係り、詳
しくは実装部品のリードの挿入長さより大きな厚さのプ
リント配線板のスルーホールとリードとのハンダ付け強
度を向上させることができるプリント配線板及びプリン
ト配線板におけるスルーホールの形成方法に関するもの
である。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a printed wiring board and a method of forming through holes in the printed wiring board. More specifically, the invention relates to a through hole and a lead of a printed wiring board having a thickness larger than a lead insertion length of a mounting component. The present invention relates to a printed wiring board capable of improving soldering strength and a method of forming through holes in the printed wiring board.
【０００２】[0002]
【従来の技術】従来、図３に示すように、プリント配線
板３１には、実装面３１ａから非実装面３１ｂを貫通す
る断面が同一円形状のスルーホール３２が形成されてい
る。このスルーホール３２はドリル等にて貫通孔を形成
し、その貫通孔にスルーホールメッキ３３を施すことに
より形成される。このとき、このスルーホール３２に
は、実装面３１ａ及び非実装面３１ｂにランド３２ａが
形成されている。2. Description of the Related Art Conventionally, as shown in FIG. 3, a printed wiring board 31 is formed with a through hole 32 having a circular cross section which penetrates from a mounting surface 31a to a non-mounting surface 31b. The through hole 32 is formed by forming a through hole with a drill or the like and applying through hole plating 33 to the through hole. At this time, lands 32a are formed on the mounting surface 31a and the non-mounting surface 31b of the through hole 32.
【０００３】このプリント基板３１の実装面３１ａ側に
は、ＩＣ等の部品３４が装着され、該部品３４のリード
３５がスルーホール３２内に挿通されている。このと
き、リード３５の先端部は非実装面３１ｂより突出され
ている。この状態において、非実装面３１ｂ側からハン
ダ３６を供給することにより、該ハンダ３６によりリー
ド３５はスルーホール３２に固着される。このとき、ス
ルーホール３２とリード３５との間に形成された間隙か
ら毛細管現象によりハンダ３６は実装面３１ａまで供給
される。A component 34 such as an IC is mounted on the mounting surface 31a side of the printed circuit board 31, and leads 35 of the component 34 are inserted into the through holes 32. At this time, the tip of the lead 35 is projected from the non-mounting surface 31b. In this state, by supplying the solder 36 from the non-mounting surface 31b side, the leads 35 are fixed to the through holes 32 by the solder 36. At this time, the solder 36 is supplied to the mounting surface 31a by the capillary phenomenon from the gap formed between the through hole 32 and the lead 35.
【０００４】[0004]
【発明が解決しようとする課題】しかしながら、部品３
４のリード３５の長さは、予め規格にて定められてい
る。このため、図４に示すように、多層からなる板厚の
厚いプリント配線板３７に実装面３７ａから非実装面３
７ｂを貫通する断面が同一円形状のスルーホール３８を
形成した場合には、リード３５の先端部が非実装面３７
ｂまで到達することができず、その先端部はスルーホー
ル３８の略中央部に位置することになる。この場合、非
実装面３７ｂ側からハンダ３６を供給しても、ハンダ３
６が非実装面３７ｂ側でフタ状態となり、スルーホール
３８内に侵入しない場合が発生し、リード３５を確実に
スルーホール３８に固着することができず、ハンダ付け
の不良が発生するという問題がある。DISCLOSURE OF THE INVENTION Problems to be Solved by the Invention
The length of the lead 35 of No. 4 is predetermined by the standard. Therefore, as shown in FIG. 4, the mounting surface 37a to the non-mounting surface 3 are formed on the printed wiring board 37 having a multi-layered and thick thickness.
When the through holes 38 having the same circular cross section are formed to penetrate 7 b, the tips of the leads 35 are not mounted on the non-mounting surface 37.
It cannot reach the position b, and its tip end is located in the substantially central part of the through hole 38. In this case, even if the solder 36 is supplied from the non-mounting surface 37b side, the solder 3
There is a problem that 6 becomes a lid state on the non-mounting surface 37b side and does not enter the through hole 38, the lead 35 cannot be securely fixed to the through hole 38, and a soldering defect occurs. is there.
【０００５】本発明は上記問題点を解決するためになさ
れたものであって、その目的は、プリント配線板に装着
される実装部品のリードをハンダにて確実にスルーホー
ルに固着できるプリント配線板及びプリント配線板にお
けるスルーホール形成方法を提供することにある。The present invention has been made to solve the above-mentioned problems, and an object thereof is a printed wiring board capable of securely fixing the leads of mounted components mounted on the printed wiring board to the through holes by soldering. Another object of the present invention is to provide a through hole forming method in a printed wiring board.
【０００６】[0006]
【課題を解決するための手段】上記問題点を解決するた
め、請求項１に記載の発明は、プリント配線板におい
て、その非実装面側に形成された大径部と、該大径部よ
りも小径に形成されるとともに、その大径部の底面部か
ら実装面にかけて貫通する小径部とからなるリード挿入
用のスルーホールを備えたことをその要旨とする。In order to solve the above problems, the invention described in claim 1 is a printed wiring board, wherein a large diameter portion formed on the non-mounting surface side of the printed wiring board and the large diameter portion. The gist of the present invention is to have a through hole for lead insertion, which is formed to have a small diameter and has a small diameter portion that penetrates from the bottom surface portion of the large diameter portion to the mounting surface.
【０００７】請求項２に記載の発明は、請求項１に記載
のスルーホールに、実装部品をそのリードの先端部が前
記大径部の底面部から突出する状態に挿通してハンダ付
けを行って実装したことをその要旨とする。According to a second aspect of the invention, soldering is carried out by inserting the mounted component into the through hole of the first aspect in a state in which the tip portions of the leads project from the bottom surface portion of the large diameter portion. The summary is the implementation.
【０００８】請求項３に記載の発明は、プリント配線板
の非実装面側に大径部下孔を形成した後、大径部下孔よ
り小径の該大径部下孔と実装面とを貫通する小径部下孔
を形成した後、該大径部下孔と小径部下孔とをメッキす
ることによりスルーホールを形成することをその要旨と
する。According to a third aspect of the present invention, after forming the large diameter portion pilot hole on the non-mounting surface side of the printed wiring board, the large diameter portion pilot hole having a smaller diameter than the large diameter portion pilot hole and a small diameter penetrating the mounting surface. After forming the subordinate hole, the gist is to form the through hole by plating the large diameter portion lower hole and the small diameter portion lower hole.
【０００９】[0009]
【作用】従って、請求項１に記載の発明によれば、スル
ーホールは大径部と小径部とからなり、プリント配線板
に装備される実装部品のリードは該スルーホールに挿通
される。そして、プリント配線板の厚さがリードの挿入
部の長さより大きくても、大径部からハンダがリードと
対応する位置に供給される。Therefore, according to the first aspect of the invention, the through hole has the large diameter portion and the small diameter portion, and the lead of the mounting component mounted on the printed wiring board is inserted into the through hole. Even if the thickness of the printed wiring board is larger than the length of the lead insertion portion, the solder is supplied from the large diameter portion to the position corresponding to the lead.
【００１０】請求項２に記載の発明によれば、請求項１
に記載の発明において、リードの先端部が大径部の底面
部から突出されている。このため、例えば非実装面側か
ら底面部に供給されたハンダは毛細管現象等により小径
部を介して実装面側に浸透するとともに、リードとの間
にハンダフィレットが形成されて、確実に該リードがハ
ンダ付けされ、実装部品が該プリント配線板に装着され
る。According to the invention of claim 2, claim 1
In the invention described in (1), the tip end portion of the lead is projected from the bottom surface portion of the large diameter portion. For this reason, for example, the solder supplied from the non-mounting surface side to the bottom surface part penetrates into the mounting surface side through the small diameter portion due to a capillary phenomenon, etc., and a solder fillet is formed between the lead and the lead to ensure that Are soldered, and the mounted components are mounted on the printed wiring board.
【００１１】請求項３に記載の発明によれば、プリント
配線板の非実装面側に大径部下孔を形成された後、大径
部下孔より小径の該大径部下孔と実装面とを貫通する小
径部下孔が形成される。次に、該大径部下孔と小径部下
孔とにメッキが施されてスルーホールが形成される。According to the third aspect of the invention, after the large diameter portion pilot hole is formed on the non-mounting surface side of the printed wiring board, the large diameter portion pilot hole having a smaller diameter than the large diameter portion pilot hole and the mounting surface are formed. A small-diameter portion lower hole that penetrates is formed. Next, the large-diameter portion pilot hole and the small-diameter portion pilot hole are plated to form through holes.
【００１２】[0012]
【実施例】（第１実施例）以下、本発明を具体化した第
１実施例を図１に従って説明する。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS (First Embodiment) A first embodiment of the present invention will be described below with reference to FIG.
【００１３】図１は、プリント配線板としての熱硬化性
樹脂等からなる多層プリント配線板１を示し、その内部
には各種の内部回路２が形成されている。この多層プリ
ント配線板１の上面はＩＣ等の部品３を実装する実装面
１ａとなるとともに、下面は非実装面１ｂとなってい
る。そして、この多層プリント配線板１には、部品３の
リード３ａを挿通するための断面円形状のスルーホール
４が形成されている。FIG. 1 shows a multilayer printed wiring board 1 made of a thermosetting resin or the like as a printed wiring board, in which various internal circuits 2 are formed. The upper surface of the multilayer printed wiring board 1 is a mounting surface 1a on which a component 3 such as an IC is mounted, and the lower surface is a non-mounting surface 1b. The multilayer printed wiring board 1 is formed with through holes 4 having a circular cross section for inserting the leads 3a of the component 3.
【００１４】このスルーホール４の非実装面１ｂには、
円柱形状の大径部５が形成されている。この大径部５は
該多層プリント配線板１の板厚における略中央位置まで
の深さに形成されている。この大径部５の底面部６は実
装面１ａ及び非実装面１ｂと平行に形成されている。こ
の底面部６の略中央部には、該底面部６から実装面１ａ
まで貫通するとともに、大径部５よりも小径の小径部７
が形成されている。即ち、スルーホール４は、大径部５
及び小径部７とから形成されている。On the non-mounting surface 1b of the through hole 4,
A cylindrical large-diameter portion 5 is formed. The large diameter portion 5 is formed to a depth up to a substantially central position in the plate thickness of the multilayer printed wiring board 1. The bottom surface portion 6 of the large diameter portion 5 is formed parallel to the mounting surface 1a and the non-mounting surface 1b. The bottom surface portion 6 has a substantially central portion from the bottom surface portion 6 to the mounting surface 1a.
The small diameter part 7 that penetrates up to and is smaller than the large diameter part 5
Are formed. That is, the through hole 4 has the large diameter portion 5
And a small diameter portion 7.
【００１５】このとき、スルーホール４には、銅等より
なるスルーホールメッキ８が形成されている。即ち、こ
のスルーホールメッキ８は大径部５の内周面、底面６及
び、小径部７の内周面に施されるとともに、実装面１ａ
における小径部７近傍に円形状のランド９が形成されて
いる。このランド９の外径は前記大径部５と略同一とな
っており、大径部５及びランド９の断面積は略同一とな
っている。このため、通常の大径部５を形成せず、ラン
ドを形成するプリント配線板に比して、該大径部５を形
成するために余計なスペースは取らないようになってい
る。At this time, through-hole plating 8 made of copper or the like is formed on the through-hole 4. That is, the through-hole plating 8 is applied to the inner peripheral surface of the large-diameter portion 5, the bottom surface 6 and the inner peripheral surface of the small-diameter portion 7, and the mounting surface 1a.
A circular land 9 is formed in the vicinity of the small diameter portion 7 in. The outer diameter of the land 9 is substantially the same as that of the large diameter portion 5, and the cross sectional areas of the large diameter portion 5 and the land 9 are substantially the same. Therefore, an extra space is not required to form the large-diameter portion 5 as compared with a printed wiring board that forms the land without forming the normal large-diameter portion 5.
【００１６】そして、この多層プリント配線板１におい
て、部品３は実装面１ａ側に配設されるとともに、リー
ド３ａがスルーホール４に挿通される。そして、リード
３ａの先端部は底面部６よりも下方に突出されている。
このとき、ハンダ１０は非実装面１ｂの下方から供給さ
れ、リード３ａと底面部６との間にハンダフィレット１
０ａが形成されて、該リード３ａはハンダ１０にて底面
部６に固着される。更に、リード３ａは断面が矩形のた
め、ハンダ１０は該リード３ａと小径部７の間に形成さ
れた間隙内に毛細管現象によって浸透し、小径部７の内
周面及び実装面１ａの各部位においてもリード３ａは確
実にハンダ付けされる。In the multilayer printed wiring board 1, the component 3 is arranged on the mounting surface 1a side, and the leads 3a are inserted into the through holes 4. The tip end of the lead 3 a is projected below the bottom face 6.
At this time, the solder 10 is supplied from below the non-mounting surface 1b, and the solder fillet 1 is provided between the lead 3a and the bottom surface portion 6.
0a is formed, and the lead 3a is fixed to the bottom surface portion 6 by the solder 10. Further, since the lead 3a has a rectangular cross section, the solder 10 permeates into the gap formed between the lead 3a and the small diameter portion 7 by a capillary phenomenon, and each portion of the inner peripheral surface of the small diameter portion 7 and the mounting surface 1a. Also, the lead 3a is surely soldered.
【００１７】従って、例えば、板厚の厚い多層プリント
配線板１に部品３を装着し、該部品３のリード３ａの先
端部がスルーホール４を貫通して多層プリント配線板１
の非実装面１ｂまで到達しない場合でも、大径部５の底
面部６にリード３ａを確実にハンダ付けすることができ
る。このため、多層プリント配線板１において、その厚
みが大きいことによるハンダ付けの不良を防止すること
ができる。Therefore, for example, the component 3 is mounted on the multilayer printed wiring board 1 having a large thickness, and the tip end of the lead 3a of the component 3 penetrates through the through hole 4 to form the multilayer printed wiring board 1.
Even if it does not reach the non-mounting surface 1b, the leads 3a can be reliably soldered to the bottom surface portion 6 of the large diameter portion 5. Therefore, in the multilayer printed wiring board 1, it is possible to prevent defective soldering due to its large thickness.
【００１８】次に、多層プリント配線板１に前記のスル
ーホール４を成形する方法について説明する。まず、多
層プリント配線板１の非実装面１ｂからランド９の径と
ほぼ等しい径のルーター（図示せず）を使用して、プリ
ント配線板１の途中まで穴あけ作業を行い、大径部下孔
５ａを形成する。このとき、該大径部下孔５ａの底面部
を実装面１ａ及び非実装面１ｂと平行に形成する。更
に、その底面部５ａの略中央部から実装面１ａに向かっ
て前記大径部下孔５ａよりも小径のドリルを使用して、
貫通孔を形成し、小径部下孔７ａを形成する。Next, a method of forming the through hole 4 in the multilayer printed wiring board 1 will be described. First, using a router (not shown) having a diameter substantially equal to the diameter of the land 9 from the non-mounting surface 1b of the multilayer printed wiring board 1, the printed wiring board 1 is pierced halfway, and the large-diameter portion pilot hole 5a is formed. To form. At this time, the bottom surface portion of the large diameter portion pilot hole 5a is formed parallel to the mounting surface 1a and the non-mounting surface 1b. Further, using a drill having a diameter smaller than that of the large-diameter portion prepared hole 5a from the substantially central portion of the bottom surface portion 5a toward the mounting surface 1a,
A through hole is formed and a small diameter portion lower hole 7a is formed.
【００１９】そして、これら大径部下孔５ａ及び小径部
下孔７ａ等の各部位にスルーホールメッキ８を施すこと
により該スルーホール４が形成される。 （第２実施例）以下、本発明を具体化した第２実施例を
図２に従って説明する。尚、多層プリント配線板の基本
的構成は第１実施例のそれと同一であるとして、同一の
構成には同一の番号を付してその説明を省略する。そし
て、前記第１実施例の構成とその構成を異にするスルー
ホールの大径部の構成についてのみ詳細に説明する。The through holes 4 are formed by applying through-hole plating 8 to each of the large-diameter portion pilot hole 5a, the small-diameter portion pilot hole 7a, and the like. (Second Embodiment) A second embodiment of the present invention will be described below with reference to FIG. Since the basic structure of the multilayer printed wiring board is the same as that of the first embodiment, the same components are designated by the same reference numerals and the description thereof will be omitted. Then, only the configuration of the large diameter portion of the through hole, which differs from the configuration of the first embodiment, will be described in detail.
【００２０】スルーホール４の非実装面１ｂ側には、大
径部１１が該多層プリント配線板１の板厚における略中
央位置までの深さに形成されている。この大径部１１の
底面部１２は非実装面１ｂ側から実装面１ａ側に向かっ
て先細形状に形成されている。従って、非実装面１ｂ側
から供給されたハンダ１０がこの底面部１３の形状に沿
って案内されることにより確実に該ハンダ１０を実装面
１ａ側に浸透させることができる。On the non-mounting surface 1b side of the through hole 4, a large diameter portion 11 is formed at a depth up to a substantially central position in the thickness of the multilayer printed wiring board 1. The bottom surface portion 12 of the large diameter portion 11 is formed in a tapered shape from the non-mounting surface 1b side toward the mounting surface 1a side. Therefore, the solder 10 supplied from the non-mounting surface 1b side is guided along the shape of the bottom surface portion 13 so that the solder 10 can surely penetrate into the mounting surface 1a side.
【００２１】この大径部１１の大径部下孔１１ａは、先
端部が先細形状に形成されるとともにランド９の径と等
しい径のドリル（図示せず）を使用して、非実装面１ｂ
側から該プリント配線板１の途中まで穴あけ作業を行う
ことにより形成される。このとき、大径部下孔１１ａの
底面部は前記ドリルの先端部の形状に従って非実装面１
ｂから実装面１ａに向かって先細形状に形成される。The large-diameter portion lower hole 11a of the large-diameter portion 11 has a tapered tip portion and uses a drill (not shown) having a diameter equal to the diameter of the land 9 to form the non-mounting surface 1b.
It is formed by performing a drilling operation from the side to the middle of the printed wiring board 1. At this time, the bottom surface portion of the large-diameter portion pilot hole 11a has the non-mounting surface 1 according to the shape of the tip of the drill.
The taper shape is formed from b to the mounting surface 1a.
【００２２】尚、本発明は上記実施例に限定されるもの
ではなく、発明の趣旨を逸脱しない範囲で構成の一部を
適宜に変更して以下のように構成してもよい。 （１）上記実施例では、多層プリント配線板１を使用し
たが、例えば耐電圧を高める等により板厚を厚くした単
層のプリント配線板に適用してもよい。The present invention is not limited to the above embodiments, but may be modified as follows without departing from the spirit of the invention. (1) In the above embodiment, the multilayer printed wiring board 1 is used, but it may be applied to a single-layer printed wiring board having a thickened plate, for example, by increasing the withstand voltage.
【００２３】（２）上記実施例では、大径部下孔５ａ，
１１ａ及び小径部下孔７ａをルーター又はドリル等で形
成したが、例えば、プリント配線板がガラスエポキシ等
からなる場合にはＣＯ2 レーザー加工等の各種レーザー
加工により形成してもよい。(2) In the above embodiment, the large-diameter portion pilot hole 5a,
11a and the small diameter portion pilot hole 7a are formed by a router, a drill or the like, but may be formed by various laser processing such as CO 2 laser processing when the printed wiring board is made of glass epoxy or the like.
【００２４】（３）上記実施例では、部品３のリード３
ａの先端部は底面部６，１２から突出した状態に形成さ
れていたが、特に突出することなく、該底面部６，１２
と略面一の状態又は、若干小径部７内に没入した状態で
あってもよい。即ち、リード３ａの先端部が底面部６，
１２近傍に位置し、非実装面１ｂから供給されるハンダ
１０が毛細管現象によりリード３ａに供給される位置で
あればよい。(3) In the above embodiment, the lead 3 of the component 3 is used.
The tip portion of a is formed so as to project from the bottom surface portions 6 and 12, but it does not particularly project and the bottom surface portions 6 and 12 do not project.
It may be in a state of being substantially flush with or slightly immersed in the small diameter portion 7. That is, the tip portion of the lead 3a is the bottom portion 6,
It suffices that the solder 10 located near 12 and supplied from the non-mounting surface 1b is supplied to the leads 3a by the capillary phenomenon.
【００２５】[0025]
【発明の効果】以上詳述したように本発明によれば、プ
リント配線板に装着される実装部品のリードをハンダに
て確実にスルーホールに固着できる優れた効果がある。As described in detail above, according to the present invention, there is an excellent effect that the lead of the mounted component mounted on the printed wiring board can be securely fixed to the through hole by soldering.
【図１】本発明を具体化した第１実施例におけるプリン
ト配線板を示す断面図である。FIG. 1 is a sectional view showing a printed wiring board according to a first embodiment of the present invention.
【図２】第２実施例におけるプリント配線板を示す断面
図である。FIG. 2 is a sectional view showing a printed wiring board according to a second embodiment.
【図３】従来例におけるプリント配線板を示す断面図で
ある。FIG. 3 is a cross-sectional view showing a printed wiring board in a conventional example.
【図４】従来例におけるプリント配線板を示す断面図で
ある。FIG. 4 is a cross-sectional view showing a printed wiring board in a conventional example.
１…プリント配線板、１ａ…実装面、１ｂ…非実装面、
３…実装部品としての部品、３ａ…リード、４…スルー
ホール、５，１１…大径部、５ａ，１１ａ…大径部下
孔、６，１２…底面部、７…小径部、７ａ…小径部下
孔、８…メッキとしてのスルーホールメッキ。1 ... Printed wiring board, 1a ... Mounting surface, 1b ... Non-mounting surface,
3 ... Component as mounted component 3a ... Lead, 4 ... Through hole, 5, 11 ... Large diameter part, 5a, 11a ... Large diameter part lower hole, 6, 12 ... Bottom part, 7 ... Small diameter part, 7a ... Small diameter part Hole, 8 ... Through-hole plating as plating.
Claims (3)
側に形成された大径部と、該大径部よりも小径に形成さ
れるとともに、その大径部の底面部から実装面にかけて
貫通する小径部とからなるリード挿入用のスルーホール
を備えたことを特徴とするプリント配線板。1. A printed wiring board having a large diameter portion formed on the non-mounting surface side and a diameter smaller than the large diameter portion, and penetrating from the bottom surface portion of the large diameter portion to the mounting surface. A printed wiring board having a through hole for insertion of a lead having a small diameter portion.
部品をそのリードの先端部が前記大径部の底面部から突
出する状態に挿通してハンダ付けを行って実装したプリ
ント配線板。2. A printed wiring board in which a mounted component is inserted into the through-hole according to claim 1 in a state where a tip of a lead thereof projects from a bottom surface of the large-diameter portion and soldering is performed.
孔を形成した後、大径部下孔より小径の該大径部下孔と
実装面とを貫通する小径部下孔を形成した後、該大径部
下孔と小径部下孔とをメッキすることによりスルーホー
ルを形成するプリント配線板におけるスルーホール形成
方法。3. After forming a large-diameter part pilot hole on the non-mounting surface side of the printed wiring board, after forming a large-diameter part pilot hole having a smaller diameter than the large-diameter part pilot hole and a small-diameter part pilot hole, A method of forming a through hole in a printed wiring board, wherein a through hole is formed by plating the large diameter portion pilot hole and the small diameter portion pilot hole.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP21658493A JPH0766516A (en) | 1993-08-31 | 1993-08-31 | Printed-wiring board and through hole making method in the same |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP21658493A JPH0766516A (en) | 1993-08-31 | 1993-08-31 | Printed-wiring board and through hole making method in the same |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0766516A true JPH0766516A (en) | 1995-03-10 |
Family
ID=16690712
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP21658493A Pending JPH0766516A (en) | 1993-08-31 | 1993-08-31 | Printed-wiring board and through hole making method in the same |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0766516A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2012023386A (en) * | 2011-09-13 | 2012-02-02 | Fuji Electric Co Ltd | Printed board |
| JP2017199726A (en) * | 2016-04-25 | 2017-11-02 | 富士通株式会社 | Cable connection board |
-
1993
- 1993-08-31 JP JP21658493A patent/JPH0766516A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2012023386A (en) * | 2011-09-13 | 2012-02-02 | Fuji Electric Co Ltd | Printed board |
| JP2017199726A (en) * | 2016-04-25 | 2017-11-02 | 富士通株式会社 | Cable connection board |
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