JPH0766509A - V-cut scored substrate and substrate splitter - Google Patents

Abstract

PURPOSE:To enable a substrate to be slit without fail in a simple structure by providing the substrate with V-cut scored junction part. CONSTITUTION:A substrate 3 packaged with various components is mounted on a substrate positioning table 1 through the intermediary of a substrate props 2 to be positioned using at least two each of positioning pins while the substrate prop 2 arranged beneath the V cut of a junction part whereon a recession 2a is formed. Next, when a lifting table 7 is lowered by a lifting cylinder 8 to press a cutter 9 downward into a V cut of the substrate 3, stress is concentrated in the V cut 4 part to plastic-deform the substrate 3 into the recession 2a of the substrate prop 2 to be slit along the scored V cut. Accordingly, the slit substrate will not be held between the upper blades thus eliminating anyelastic member to separate the held substrate thereby enabling the substrate to be easily slit by the stress concentrated in the V cut part b simply pressing the cutter 9 against the V cut.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a substrate having V-cut perforations and a substrate dividing device.

[0002]

2. Description of the Related Art Conventionally, various inventions have been devised for a printed circuit board that can be divided by perforations or the like, or an apparatus and method for dividing the same. For example, as a method suitable for dividing an atypical printed board having a complicated shape, a method is known in which an upper blade and a lower blade are lapped and cut along a perforation provided on the printed board (Japanese Patent Laid-Open No. Hei 10-1999) 2-1242
96).

That is, as shown in FIG. 3, on the base 01,
The base plate 02 is slidably arranged along the rails 03, and the printed circuit board 04 is placed on the base plate 02 and positioned by the pins 05. The printed circuit board 04 is
As shown in FIG. 4, perforations having a complicated shape are inserted, and a plurality of lower blades 06 are arranged on the base plate 02 below the perforations so that the joints of the perforations can be used as the dividing positions. There is.

Four columns 07 are erected on the base 01 on the side of the base plate 02, and an upper plate 08 is fixed to the upper ends of the columns 07. A moving plate 09 is suspended below the upper plate 08 so that the moving plate 09 can be moved up and down.
An air cylinder 010 for moving up and down is fixed on the upper plate 08.

As shown in FIG. 5, a plurality of upper blades 011 are fixed to the lower surface of the moving plate 09.
The position 1 is arranged so that the joint portion of the perforations having a complicated shape provided on the printed board 04 can be used as the dividing position. Therefore, when the moving plate 09 is lowered, the upper blade 011
And the lower blade 06 are rubbed with each other, and the printed circuit board 04 is sheared. A steady rest 013 including a ball bearing 012 that rolls on the support column 07 is attached to the moving plate 09.

[0006]

In the above-described conventional board dividing device, the lower blade 06 and the upper blade 011 are rubbed together to shear the printed board 06, so that even a perforation with a complicated shape is formed. Can be reliably divided,
For example, it is suitable for dividing an atypical printed circuit board used in an electronic device such as a miniaturized headphone stereo.

However, the lower blade 06 and the upper blade 011 are
Since the printed board 04 is accurately positioned independently at the perforation division position of the printed board 04, it is necessary to position the printed board 04 with high precision with respect to the base plate 02. Further, the steady rest 013, the moving plate 09, and the air cylinder. A highly accurate lifting mechanism including 010 is also required. Therefore, there is a drawback that the structure becomes complicated and the cost becomes high.

Further, in order to prevent the cut printed circuit board 04 from being lifted by being sandwiched by the upper blade 011, it is necessary to provide an elastic member 014 on the moving plate 09 to separate the divided printed circuit board 04. The present invention has been made in view of the above-mentioned conventional art, and an object of the present invention is to provide a substrate and a substrate dividing apparatus which have a simple structure and can be reliably divided.

[0009]

The structure of a substrate having perforations with V-cuts according to the present invention that achieves the above object is a mounted substrate which is divided along perforations and has a joint portion at the perforations. It is characterized by having a V cut. The structure of the substrate dividing apparatus of the present invention that achieves the above object is a mounted substrate having a V-cut at the perforation joint, a substrate positioning table for positioning and supporting the substrate, and a side of the positioning table. A column that stands upright, a lifting table that can be raised and lowered along the column, a cutter that is fixed to the lifting table downward and presses the V cut of the joint from above, and a cutter that is below the V groove. And a substrate receiver provided with a recess for receiving the substrate.

[0010]

DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention will be described below in detail with reference to the embodiments shown in the drawings. 1 and 2 show an embodiment of the present invention. As shown in both figures, the board positioning table 1
A board 3 on which various components are mounted is placed on the board via a board receiver 2 and positioned by at least two positioning pins. The substrate receiver 2 is arranged directly below the V-cut of the joint portion, and the recess 2 is provided at the upper end thereof.
a is formed.

The substrate 3 has perforations along the direction in which it is to be divided, and V-cuts 4 are provided at the joints of the perforations. The perforation means a joint portion such as a multi-piece substrate, but also a joint portion for cutting an extra portion from one substrate. The V-cut 4 is not limited to the V-shape in the strict sense, but means a recess where stress is likely to concentrate. Two columns 5 are erected on the side of the substrate positioning table 1, and an upper plate 6 is fixed to the upper end thereof. Below the upper plate 6, an elevating table 7 which can be raised and lowered by using the support column 5 as a guide is suspended, and an elevating cylinder 8 for elevating the elevating table 7 is attached to the upper plate 6.

The lifting cylinder 8 is a hydraulic cylinder connected to a hydraulic source (not shown), and has two operation switches 1
By operating 0 at the same time, the lifting table 7 starts to descend, and when the lower limit switch 8a detects the lowermost end, it goes up, and when the upper limit switch 8b detects the uppermost end, it stops. The reason why the two operation switches 10 must be operated at the same time is to prevent erroneous operation.
As the upper limit switch 8a and the lower limit switch 8b, for example, a magnetic sensor that detects a magnetic field of a magnet mounted on the piston portion can be used.

A cutter 9 is attached downward to the lifting table 7, and the position of the cutter 9 is located directly above the V-cut 4 of the perforation. The cutter 9 may be a double-edged blade as shown in the drawing, or may be a single-edged blade. Therefore, when the lifting table 7 is lowered by the lifting cylinder 8 and the cutter 9 is pressed against the V-cut 4 of the substrate 3 from above, stress concentrates on the V-cut 4 and plastically deforms in the recess 2 a of the substrate receiver 2. However, it will break along the perforations.

As described above, in this embodiment, since the V-cut 4 is provided at the joint portion of the perforation of the mounted substrate 3, the cutter 9 is lowered and pressed against the V-cut 4, so that the perforation can be easily performed. Can be split along. Moreover, even if the cutter 9 is not at the center of the V-cut 4, if it is pressed into the recess 2a near the V-cut 4, the
Since stress concentrates on the portion of the cut 4 and breaks, it is not necessary to position the cut 4 with high precision. Therefore, the elevating mechanism of the cutter can be simplified and the cost can be reduced.

Further, unlike the prior art in which the substrate is sheared by the rubbing with the upper blade and the lower blade, the divided substrates are not sandwiched between the upper blades, so that an elastic member for separating them is unnecessary. There are advantages. Although the cutter 9 is lowered and pressed against the V-cut 4 of the substrate 3 in the above embodiment, the present invention is not limited to this, and the cutter 9 is fixed and the substrate 3 and the substrate receiver 2 are raised. Let
The cutter 9 may be pressed against the V cut 4 of the substrate 3.

[0016]

As described above in detail with reference to the embodiments, the present invention provides a V-cut at the perforated joint portion of the mounted board, so that the V-cut is pressed by the cutter. , The stress is concentrated on the V-cut portion, so that it can be easily divided. Therefore, the positioning accuracy of the cutter does not need to be particularly high as compared with the conventional technology in which the substrate is sheared and divided by the upper blade and the lower blade, and as a result, the lifting mechanism of the cutter is simplified and the device configuration is improved. Can be made cheaper.

[Brief description of drawings]

FIG. 1 is a schematic configuration diagram of a substrate having a V-cut perforation and a substrate dividing apparatus according to an embodiment of the present invention.

FIG. 2 is a cross-sectional view of a main part of a substrate having a V-cut perforation and a substrate dividing device according to an embodiment of the present invention.

FIG. 3 is a schematic configuration diagram of a conventional substrate dividing device.

FIG. 4 is a plan view of an atypical printed circuit board.

FIG. 5 is a layout view of a base plate, a printed circuit board, and a moving plate.

[Explanation of symbols]

 1 substrate positioning table 2 substrate receiver 2a recessed portion 3 substrate 4 substrate perforation V cut 5 column 6 upper plate 7 lifting table 8 lifting cylinder 8a lower limit switch 8b upper limit switch 9 cutter 10 operation switch

Claims (2)

[Claims] 1. A mounted board which is divided along perforations, wherein a V-cut is attached to a joint portion of the perforations. 2. A mounted board having a V-cut at a perforation joint, a board positioning table for positioning and supporting the board, and a column standing upright on a side of the positioning table, An elevating table that can be moved up and down along the columns
A substrate dividing apparatus comprising: a cutter that is fixed to the lifting table downward and presses the V cut of the joining portion from above; and a substrate receiver that has a recessed portion that receives the cutter below the V groove.