JPH0763991B2 - Mold for molding optical disc substrate with format - Google Patents

Mold for molding optical disc substrate with format

Info

Publication number
JPH0763991B2
JPH0763991B2 JP63094099A JP9409988A JPH0763991B2 JP H0763991 B2 JPH0763991 B2 JP H0763991B2 JP 63094099 A JP63094099 A JP 63094099A JP 9409988 A JP9409988 A JP 9409988A JP H0763991 B2 JPH0763991 B2 JP H0763991B2
Authority
JP
Japan
Prior art keywords
mold
stamper
molding
substrate
fixed
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP63094099A
Other languages
Japanese (ja)
Other versions
JPH01264820A (en
Inventor
嘉夫 鬼沢
芳伸 幸長
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Daicel Corp
Original Assignee
Daicel Chemical Industries Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Daicel Chemical Industries Ltd filed Critical Daicel Chemical Industries Ltd
Priority to JP63094099A priority Critical patent/JPH0763991B2/en
Priority to EP89401056A priority patent/EP0338906B1/en
Priority to US07/339,264 priority patent/US5106553A/en
Priority to DE68918623T priority patent/DE68918623T2/en
Publication of JPH01264820A publication Critical patent/JPH01264820A/en
Priority to US07/873,514 priority patent/US5171585A/en
Publication of JPH0763991B2 publication Critical patent/JPH0763991B2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29DPRODUCING PARTICULAR ARTICLES FROM PLASTICS OR FROM SUBSTANCES IN A PLASTIC STATE
    • B29D17/00Producing carriers of records containing fine grooves or impressions, e.g. disc records for needle playback, cylinder records; Producing record discs from master stencils
    • B29D17/005Producing optically read record carriers, e.g. optical discs
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C33/00Moulds or cores; Details thereof or accessories therefor
    • B29C33/44Moulds or cores; Details thereof or accessories therefor with means for, or specially constructed to facilitate, the removal of articles, e.g. of undercut articles
    • B29C33/46Moulds or cores; Details thereof or accessories therefor with means for, or specially constructed to facilitate, the removal of articles, e.g. of undercut articles using fluid pressure
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C37/00Component parts, details, accessories or auxiliary operations, not covered by group B29C33/00 or B29C35/00
    • B29C37/0003Discharging moulded articles from the mould
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17Component parts, details or accessories; Auxiliary operations
    • B29C45/26Moulds
    • B29C45/263Moulds with mould wall parts provided with fine grooves or impressions, e.g. for record discs
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17Component parts, details or accessories; Auxiliary operations
    • B29C45/26Moulds
    • B29C45/263Moulds with mould wall parts provided with fine grooves or impressions, e.g. for record discs
    • B29C2045/2648Outer peripheral ring constructions
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17Component parts, details or accessories; Auxiliary operations
    • B29C45/26Moulds
    • B29C45/263Moulds with mould wall parts provided with fine grooves or impressions, e.g. for record discs
    • B29C2045/2657Drive means for the outer peripheral ring

Description

【発明の詳細な説明】 産業上の利用分野 本発明はCD、VDのようなROMディスク、DRAWディスクあ
るいはE−DRAWディスク等の光ディスクや光カード等の
高密度情報記録担体用のプラスチック基板の射出成形方
法およびそれに用いる金型に関するものである。
Description: INDUSTRIAL APPLICABILITY The present invention relates to injection of a plastic substrate for a high density information recording carrier such as an optical disk such as an optical disk such as a ROM disk such as CD and VD, a DRAW disk or an E-DRAW disk. The present invention relates to a molding method and a mold used therefor.

従来の技術 上記光ディスク等の高密度情報記録担体用の基板は一般
にガラス、金属、セラミックスあるいはプラスチックで
作られているが、軽量性、強度および生産性の点からプ
ラスチックスが望ましい。
2. Description of the Related Art Substrates for high-density information recording carriers such as optical discs are generally made of glass, metal, ceramics or plastics, but plastics are preferable from the viewpoints of lightness, strength and productivity.

しかし上記のような光ディスクに用いられるプラスチッ
クス基板は厚さが約1.2mm〜1.5mm、直径が最大約300mm
と極めて薄くて偏平である上、材料としては一般に流動
性の悪いアクリル樹脂やポリカーボネート樹脂が用いら
れるため、複屈折等の光学的特性と転写性等が成形性と
を同時に完全に満足させるプラスチック基板を射出成形
するのは難しい。
However, the plastics substrate used for the above optical discs has a thickness of about 1.2 mm to 1.5 mm and a maximum diameter of about 300 mm.
In addition to being extremely thin and flat, acrylic resin or polycarbonate resin, which generally has poor fluidity, is used as the material, so a plastic substrate that satisfies the optical characteristics such as birefringence and the transferability at the same time to formability. Injection molding is difficult.

この種ディスク基板に要求される種々の性能の中で、金
型内に配置されたスタンパーの表面形状すなわち情報ピ
ット列を正確に転写する転写性能は最も重要な要因の一
つである。
Among various performances required for this kind of disk substrate, the transfer performance for accurately transferring the surface shape of the stamper arranged in the mold, that is, the information pit row, is one of the most important factors.

従来、光ディスク用プラスチック基板の射出成形用金型
としては第2、3図に示すような構造のものが一般的で
ある。
Conventionally, as a mold for injection molding of a plastic substrate for an optical disc, a mold having a structure as shown in FIGS.

第2図に示す金型は1対の金型部分すなわち割型、例え
ば可動型1′と、固定型2′とで形成される成形キャビ
ィティ3′を有し、この成形キャビティの表面の一部
(図では可動型1′の表面)にはサブミクロンオーダー
の情報ビットやトラック等をその表面に有するスタンパ
ー4′がスタンパーホルダー5′によって取り付けられ
ている。また、固定型の成形キャビティ表面上には外周
リング6′が取り付けられている。樹脂はスプルー7′
を介して成形キャビティ3′中に射出される。
The mold shown in FIG. 2 has a molding cavity 3'formed by a pair of mold parts or split molds, for example, a movable mold 1'and a fixed mold 2 ', and a part of the surface of the molding cavity. A stamper 4'having information bits of sub-micron order, tracks, etc. on its surface is attached to (the surface of the movable die 1'in the figure) by a stamper holder 5 '. An outer peripheral ring 6'is mounted on the surface of the fixed mold cavity. Resin is sprue 7 '
And is injected into the molding cavity 3 '.

第3図は従来例の他の射出成形金型を示している。な
お、第3図では第2図に対応する部材には二重のダッシ
ュ(″)が付けられている。この第3図の射出成形金型
は、第2図の場合の外周リング6′を無くし、スタンパ
ーホルダー5″のテーパー付き内周表面10″上に固定型
2″の対向表面9″が当接して成形キャビティの外周端
面が規定されるようになっている。この型式の金型を一
般にインロウ型の金型といっている。
FIG. 3 shows another conventional injection molding die. In Fig. 3, a double dash (") is attached to the member corresponding to Fig. 2. The injection mold of Fig. 3 has the outer ring 6 'in the case of Fig. 2. The outer surface of the molding cavity is defined by contacting the opposed surface 9 ″ of the fixed mold 2 ″ with the tapered inner peripheral surface 10 ″ of the stamper holder 5 ″ so as to define the outer peripheral end surface of the molding cavity. Generally, it is called an inlay mold.

第2図の金型を用いてディスク基板の成形方法を説明す
ると、先ず、射出成形機(図示せず)の金型取付け用固
定盤に固定型2′が、また、可動盤に可動型1′が取付
けられる。成形時には、可動型と固定型を閉じ後に、溶
融された樹脂がスプルー7′を介してキャビティ3′内
に射出される。その後キャビティ内に溶融射出された樹
脂が一定時間冷却され固化した後、型締機構を駆動して
可動型を固定型から分離して型開きすると同時に、固定
型の中央部附近にもうけられたエアーエジェクターより
エアーを吹き出し、成形された基板を固定型鏡面より離
型させる。
A method of molding a disk substrate will be described using the mold of FIG. 2. First, a fixed mold 2 ′ is fixed to a fixed plate for mounting a mold of an injection molding machine (not shown), and a movable mold 1 is set to a movable plate. 'Is attached. At the time of molding, after the movable die and the fixed die are closed, the molten resin is injected into the cavity 3'through the sprue 7 '. After that, the resin melt-injected into the cavity is cooled and solidified for a certain period of time, and then the mold clamping mechanism is driven to separate the movable mold from the fixed mold to open the mold, and at the same time, the air generated near the center of the fixed mold Air is blown from the ejector to release the molded substrate from the fixed mirror surface.

従って、成形されたプラスチック基板は、可動型鏡面す
なわちスタンパー4′の表面に付着した状態で型開きが
行われる。次いで、金型が完全に開いた後に、可動型の
中央部附近に設けられた他のエアーエジェクターからエ
アーを吹き出してスタンパーと基板を分離し、さらに、
機械的エジェクターロッドを用いて基板を突き出すこと
によって、基板を金型より完全に離型させる。
Therefore, the molded plastic substrate is opened while being attached to the movable mirror surface, that is, the surface of the stamper 4 '. Then, after the mold is completely opened, air is blown from another air ejector provided near the center of the movable mold to separate the stamper and the substrate, and
The substrate is completely released from the mold by ejecting the substrate with a mechanical ejector rod.

発明が解決しようとする課題 光ディスクには、プリフォーマット方式とポストフォー
マット方式がある。
DISCLOSURE OF THE INVENTION Problems to be Solved by the Invention Optical discs include a pre-format system and a post-format system.

ポストフォーマット方式の場合には、ガイドトラックと
なるグルーブ(連続溝)のみを光ディスク用プラスチッ
ク基板に成形しておき、必要なフォーマットは、こうし
て得られた溝付きプラスチック基板を記録膜を付けて得
られる光ディスクをドライブに組込んだ後に書き込まれ
る。従って、基板成形には、上記グルーブを精度よくス
タンパーより転写させるだけでよい。
In the case of the post-format system, only the groove (continuous groove) to be the guide track is formed on the plastic substrate for optical disk, and the required format is obtained by attaching the grooved plastic substrate thus obtained to the recording film. Written after the optical disc is installed in the drive. Therefore, in forming the substrate, it is sufficient to accurately transfer the groove from the stamper.

しかし、最近では、ポストフォーマット法の非経済性に
加えて、マスタリング或いはドライブ設計技術等の進歩
により、プラスチック基板の成形段階でグルーブと同時
にフォーマットを入れる、いわゆるプリフォーマット方
式が主流となってきた。このプリフォーマット信号は、
前記の連続したガイドトラックとは異なり一定の長さを
もったピットで構成されている。
However, recently, in addition to the uneconomical effect of the post-formatting method, the so-called pre-formatting method, in which formatting is performed at the same time as the groove at the molding stage of the plastic substrate, has become mainstream due to advances in mastering or drive design technology. This preformatted signal is
Unlike the continuous guide track described above, it is composed of pits having a fixed length.

プリフォーマット信号は一般にマスタリングによってス
タンパーに切られるが、このプリフォーマット信号の入
ったスタンパーを前記従来型金型で前記手順で成形した
ところグルーブ部では見られないピットの内周方向への
「流れ現象」すなわちスタンパーから転写・成形された
プラスチック基板の凹凸形状が「だれて」、正確に転写
が行われないという現象が発生する。
The pre-format signal is generally cut by a mastering into a stamper, but when the stamper containing the pre-format signal is molded by the above-mentioned conventional mold in the above procedure, the "flow phenomenon in the inner circumferential direction of the pit which cannot be seen in the groove part is seen. That is, the uneven shape of the plastic substrate transferred / molded from the stamper “droops”, which causes a phenomenon that the transfer is not performed accurately.

この現象が発生したプラスチック基板に記録膜に付けた
光ディスク基板は、反射光量に悪影響が出て、最終的に
は記録・再生特性に悪影響を及ぼすということが記録特
性の評価で判明した。
The evaluation of the recording characteristics revealed that the optical disk substrate having the recording film attached to the plastic substrate in which this phenomenon occurred adversely affects the amount of reflected light and finally affects the recording / reproducing characteristics.

この現象について鋭意検討した結果、本発明者は、上記
現象は金型を開く時から成形されたディスク基板をスタ
ンパー面より離型するまでの間に発生することを見出
し、これを解決する方法を発明した。
As a result of extensive studies on this phenomenon, the present inventor has found that the above phenomenon occurs between the time when the mold is opened and the time when the molded disk substrate is released from the stamper surface, and a method for solving this is found. Invented

従って、本発明の目的は、上記のピットの「流れ現象」
に起因する転写性の低下を解決する方法と、それに用い
る金型組立体を提供することにある。
Therefore, the object of the present invention is to provide the above-mentioned "flow phenomenon" of pits.
(EN) Provided is a method for solving a decrease in transferability caused by the above, and a mold assembly used for the method.

課題を解決するための手段 本発明の提供するフォーマット信号入り光ディスク用プ
ラスティック基板の成形用金型は、固定型と可動型との
一対の割型を備え、該割型の一方の内表面は鏡面であ
り、該割型の他方の内表面には情報ピットを転写するた
めのスタンパーが装着されており、該鏡面と該スタンパ
ーとによって成形キャビティーが画成される金型であっ
て、更に、成形したプラスティック基板を離型させるた
めのエアーブローエジェクターを該割型の各々が備えて
いる金型において、該スタンパーが該固定型に取付けら
れていることを特徴としている。
Means for Solving the Problems A molding die for a plastic substrate for an optical disc containing a format signal provided by the present invention comprises a pair of split dies, a fixed die and a movable die, and one inner surface of the split die is a mirror surface. A stamper for transferring information pits is mounted on the other inner surface of the split mold, and a mold having a molding cavity defined by the mirror surface and the stamper, further comprising: In a mold in which each of the split molds is provided with an air blow ejector for releasing the molded plastic substrate, the stamper is attached to the fixed mold.

作用 先ず、前記のような従来方法で光ディスク基板を成形し
た場合について説明する。
First, the case where the optical disk substrate is molded by the conventional method as described above will be described.

キャビティ内に射出された溶融樹脂は、冷却が進むにつ
れ内周方向に収縮しようとするが、金型が閉じている間
は、金型からの押圧力と金型面との摩擦により押さえ込
まれているため、応力は発生するが収縮は起こらない。
The molten resin injected into the cavity tends to shrink inward as the cooling progresses, but while the mold is closed, it is pressed by the pressing force from the mold and the friction between the mold surface. As a result, stress occurs but contraction does not occur.

次に、金型が開き始め、基板の信号面がスタンパーとま
だ密着した状態で、成形された基板の信号面と逆の面が
金型より離れると、基板のその面は内周方向にむかって
収縮を始める。この時点で基板の信号面がスタンパーと
まだ密着しているので、この信号面はスタンパー面との
摩擦力によりそのまま保持されようとする。しかし、樹
脂の収縮力の方が大きいため、力のバランスが取れる点
まで引きずられる。
Next, when the mold begins to open and the signal surface of the substrate is still in close contact with the stamper, and the surface opposite to the signal surface of the molded substrate separates from the mold, that surface of the substrate peels inward. Begins contraction. At this point, the signal surface of the substrate is still in close contact with the stamper, so this signal surface tends to be held as it is due to the frictional force with the stamper surface. However, since the shrinkage force of the resin is greater, it is dragged to the point where the forces are balanced.

ピットの「流れ現象」はいわばスタンパーとディスク基
板の収縮率の差によって生ずるスタンパーのピットによ
り成形基板につけられた痕跡である。従って、この現象
はピットの高さに影響を受け、高ければ高い程流れ距離
は長くなる。
The "flow phenomenon" of pits is, so to speak, a trace made on the molded substrate by the pits of the stamper caused by the difference in shrinkage between the stamper and the disk substrate. Therefore, this phenomenon is affected by the height of the pit, and the higher the height, the longer the flow distance.

前記解析から、本発明者は、この現象を解決するために
は、基板の信号面が逆の面によりひきずられる前に、ス
タンパーより離型させておけばよいと考え、本発明を完
成した。
From the above analysis, the present inventor has completed the present invention by thinking that, in order to solve this phenomenon, it is sufficient to release the stamper from the stamper before the signal surface of the substrate is scratched by the opposite surface.

すなわち、本発明では、上記のピットの「流れ現象」に
起因する転写性の低下を解決するために、スタンパーの
取り付け面をこれまでの可動型面から固定型面にした。
That is, in the present invention, in order to solve the decrease in transferability due to the above-mentioned "flow phenomenon" of pits, the mounting surface of the stamper is changed from the movable mold surface to the fixed mold surface.

従来金型においても、型開きの際に、可動型のエアーエ
ジェクターからのエアーブローを固定型のエアーエジェ
クターからのエアーブローより時間的に先に働かせるこ
とによって上記現象の解決は可能である。しかし、その
場合には、成形されたプラスティック基板は固定型に付
着し、一方スプルーは可動型に付くため、ロボット等の
自動取り出し装置の操作が煩雑となるという欠点が生ず
る。
Even in the conventional mold, the above phenomenon can be solved by causing the air blow from the movable air ejector to work earlier than the air blow from the fixed air ejector when opening the mold. However, in that case, the molded plastic substrate is attached to the fixed mold, while the sprue is attached to the movable mold, so that the operation of an automatic take-out device such as a robot becomes complicated.

本発明においては、スタンパー取付け面を可動型から固
定型に変えることにより上記現象が解決できると同時
に、成形条件や取出し装置の操作を従来の成形装置のも
のをそのまま用いて、従来技術を一切変更せずに成形で
きるという大きな利点がある。
In the present invention, the above phenomenon can be solved by changing the mounting surface of the stamper from the movable type to the fixed type, and at the same time, the conventional technique is changed without changing the molding conditions and the operation of the take-out device as they are in the conventional molding device. There is a great advantage that it can be molded without doing.

以下、添付図面を用いてさらに具体的に説明する。Hereinafter, it will be described more specifically with reference to the accompanying drawings.

第1図は第3図に示した従来公知のインロウ型の金型組
立体に本発明を適用した場合を示している。
FIG. 1 shows a case where the present invention is applied to the conventionally known in-row type mold assembly shown in FIG.

この第1図において、1は可動型、2は固定型、3は成
形キャビティ、4はガイドグルーブおよび/またはフォ
マット信号ピットを表面に有するスタンパー、5は固定
型に保持された外周リング、8はパーティングライン、
10は外周リング5の内周面に形成された型開き方向に向
かって拡大したテーパー面すなわち可動型方向に向かっ
て拡大したテーパー面、11は上記スタンパーを中心で保
持する中心スタンパーホルダーである。なお、可動型1
と固定型2は成形機(図示せず)の可動盤と固定盤にそ
れぞれ取り付けられている。
In this FIG. 1, 1 is a movable die, 2 is a fixed die, 3 is a molding cavity, 4 is a stamper having guide grooves and / or format signal pits on its surface, 5 is an outer ring held by the fixed die, and 8 is Parting line,
Reference numeral 10 denotes a taper surface formed on the inner peripheral surface of the outer peripheral ring 5 and expanding in the mold opening direction, that is, a taper surface expanding in the movable mold direction, and 11 is a central stamper holder for holding the stamper at the center. The movable type 1
And the fixed mold 2 are attached to a movable platen and a fixed platen of a molding machine (not shown), respectively.

以下、この第1図の金型を用いて実際に成形した際の作
動順序を説明する。
Hereinafter, the operation sequence when actually molding using the mold of FIG. 1 will be described.

先ず、可動型と固定型が閉じられ、溶融樹脂11がキャビ
ティ内に射出充填される。次に、キャビティ内に溶融射
出された樹脂が一定時間冷却固化した後、成形されたプ
ラスチックディスクを金型から取り出すための型開き操
作を開始する。
First, the movable mold and the fixed mold are closed, and the molten resin 11 is injected and filled in the cavity. Next, after the resin melt-injected into the cavity is cooled and solidified for a certain period of time, a mold opening operation for taking out the molded plastic disc from the mold is started.

この型開き操作の開始時には、成形されたプラスチック
基板の離型のために、固定型の中央附近に設けられたエ
アーブローエジェクター(図示せず)を介してエアーが
吹き出される。従って、成形されたプラスチック基板は
先ずスタンパー面側から離型し、スプルーもプラスチッ
ク基板と同時に離型される。なお、このスプルーは後で
機械的に切り取ることができる。
At the start of this mold opening operation, air is blown out through an air blow ejector (not shown) provided near the center of the fixed mold in order to release the molded plastic substrate. Therefore, the molded plastic substrate is first released from the stamper surface side, and the sprue is released simultaneously with the plastic substrate. The sprue can be mechanically cut out later.

そして、金型が完全に開いた後に、機械的突出しリン
グ、ロッド等を用いて成形されたプラスチック基板を可
動型より完全に離型させる。
Then, after the mold is completely opened, the plastic substrate molded by using the mechanical protruding ring, the rod and the like is completely released from the movable mold.

以下、本発明の好ましい実施例を説明するが、本発明は
これにのみ限定されるものではない。
Hereinafter, preferred embodiments of the present invention will be described, but the present invention is not limited thereto.

実施例 第1図に示す改良型インロー型の金型に、溝深さが800
Åでビット高さが1600Åのスンパーを取付け、各機製作
所製M−70射出成形機を用い、ポリカーポネート樹脂を
シリンダー温度330℃、金型温度100℃で直径200mm、厚
さ1.2mmの基板の成形を行った。
Example An improved spigot die shown in FIG. 1 has a groove depth of 800.
With a Å bit and a bumper with a bit height of 1600 Å, and using an M-70 injection molding machine manufactured by Koki Seisakusho, a polycarbonate resin with a cylinder temperature of 330 ° C and a die temperature of 100 ° C with a diameter of 200 mm and a thickness of 1.2 mm Was molded.

このとき、成形された基板の金型からの離型手順として
は、従来法と同様まず固定型すなわちスンパー4が取付
けられている方の割型から離型させ、金型が完全に開い
た後に、可動型から形成品を離型させた。
At this time, the procedure for releasing the molded substrate from the mold is as follows. First, like the conventional method, the fixed mold, that is, the split mold to which the bumper 4 is attached is released, and after the mold is completely opened. The molded product was released from the movable mold.

この成形品ビットの電顕写真を示す図4から明らかなよ
うに、流れ現象は見られなかった。
As is clear from FIG. 4 showing an electron micrograph of this molded product bit, no flow phenomenon was observed.

なお、この成形を続けて100ショート実施したが、成形
された基板の特性の不良または取り出し時のトラブル等
は一切発生しなかった。
The molding was continued for 100 short circuits, but no defective characteristics of the molded substrate or troubles during taking out occurred.

比較例1 第2図の金型を用いて、実施例1と同じ条件で成形し
た。
Comparative Example 1 Using the mold shown in FIG. 2, molding was performed under the same conditions as in Example 1.

この場合には、成形された基板はスタンパーに付着した
状態で先ず固定型2′から離型した。
In this case, the molded substrate was first released from the fixed mold 2'while being attached to the stamper.

得られた成形品のビット部分の電顕写真を示す図5から
明らかなように、流れ現象が発生していた。
As apparent from FIG. 5 showing an electron micrograph of the bit part of the obtained molded product, a flow phenomenon occurred.

効果 上記の実施例から明らかなように、本発明によって、上
記スタンパーを固定型に取付けることによって、ロボッ
ト等の自動取り出し装置の操作を煩雑とせずに、しか
も、上記の流れ現象が解決でき、成形条件や取出し装置
の操作を従来の成形装置のものをそのまま用いて、従来
技術を一切変更せずに成形できるという大きな利点があ
る。
Effects As is apparent from the above-described embodiments, according to the present invention, by mounting the stamper on a fixed mold, the operation of an automatic take-out device such as a robot is not complicated, and moreover, the above flow phenomenon can be solved, forming There is a great advantage that molding can be performed by using the conventional molding apparatus as it is as the conditions and the operation of the take-out apparatus without changing the conventional technology.

さらに、以下のような効果も得られる。Further, the following effects can be obtained.

(1) 型開きと同時に信号面が離型されるため、信号
面全体が均一に収縮する。従って、グルーブの真円度が
よくなる。
(1) Since the signal surface is released at the same time when the mold is opened, the entire signal surface contracts uniformly. Therefore, the roundness of the groove is improved.

(2) さらに、型開きと同時に信号面が離型され、従
って、離型のアンバランスが解消されるため、一般にCD
で問題となるいわゆるクラウドといわれる状模様が無く
なる。
(2) Furthermore, the signal surface is released at the same time when the mold is opened, and therefore, the imbalance of the release is eliminated, so that in general, CD
The so-called cloud pattern, which is a problem with, disappears.

(3) 本発明金型を射出−圧縮成形法において用いた
場合には、金型からの圧縮力がプラスチック基板に均一
に加えられるため、基板全体の応力分布が均一となり、
従って、成形されたプラスチック基板の変形量が小さく
なる。
(3) When the mold of the present invention is used in the injection-compression molding method, the compressive force from the mold is uniformly applied to the plastic substrate, so that the stress distribution of the entire substrate becomes uniform,
Therefore, the amount of deformation of the molded plastic substrate is small.

【図面の簡単な説明】[Brief description of drawings]

第1図は本発明の一実施例による光ディスク用のプラス
チック基板の成形に用いられる射出成形金型組立体の概
念的断面図である。 第2および3図は従来公知の光ディスク用のプラスチッ
ク基板の成形に用いられる射出成形金型組立体の概念的
断面図である。 第4図は本発明によって成形されたプラスチックディス
ク基板のビット部の電顕写真の模写図。 第5図は従来法によって成形されたプラスチックディス
ク基板のビット部の電顕写真の模写図。 (図中符号) 1……可動型、2……固定型、 3……成形キャビティ、 4……スタンパー、5……外周リング、 7……スプルー、 8……パーティングライン、 10……テーパー面 11……中心スタンパーホルダー
FIG. 1 is a conceptual cross-sectional view of an injection mold assembly used for molding a plastic substrate for an optical disc according to an embodiment of the present invention. 2 and 3 are conceptual cross-sectional views of a conventionally known injection molding die assembly used for molding a plastic substrate for an optical disc. FIG. 4 is a copy of an electron micrograph of a bit portion of a plastic disk substrate molded according to the present invention. FIG. 5 is a copy of an electron micrograph of a bit portion of a plastic disk substrate molded by the conventional method. (Symbols in the figure) 1 ... Movable type, 2 ... Fixed type, 3 ... Molding cavity, 4 ... Stamper, 5 ... Outer ring, 7 ... Sprue, 8 ... Parting line, 10 ... Taper Surface 11 …… Center stamper holder

Claims (1)

【特許請求の範囲】[Claims] 【請求項1】固定型と可動型との一対の割型を備え、該
割型の一方の内表面は鏡面であり、該割型の他方の内表
面には情報ピットを転写するためのスタンパーが装着さ
れており、該鏡面と該スタンパーとによって成形キャビ
ティーが画成されるフォーマット信号入り光ディスク用
プラスチック基板を成形するための金型であって、更
に、成形したプラスティック基板を離型させるためのエ
アーブローエジェクターを該割型の各々が備えている金
型において、該スタンパーが該固定型に取付けられてい
ることを特徴とする金型。
1. A pair of split dies, a fixed die and a movable die, wherein one inner surface of the split die is a mirror surface and the other inner surface of the split die is a stamper for transferring information pits. Is a mold for molding a plastic substrate for an optical disc containing a format signal in which a molding cavity is defined by the mirror surface and the stamper, and further for releasing the molded plastic substrate. 2. A mold in which each of the split molds is equipped with the air blow ejector, wherein the stamper is attached to the fixed mold.
JP63094099A 1988-04-16 1988-04-16 Mold for molding optical disc substrate with format Expired - Lifetime JPH0763991B2 (en)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP63094099A JPH0763991B2 (en) 1988-04-16 1988-04-16 Mold for molding optical disc substrate with format
EP89401056A EP0338906B1 (en) 1988-04-16 1989-04-17 Method for molding a formatted substrate for an optical disk and a mold assembly used in the method
US07/339,264 US5106553A (en) 1988-04-16 1989-04-17 Method for molding a formatted substrate for an optical disk
DE68918623T DE68918623T2 (en) 1988-04-16 1989-04-17 Process and manufacture of a formatted substrate for an optical disk and injection mold for its use.
US07/873,514 US5171585A (en) 1988-04-16 1992-04-20 Apparatus for molding a formatted substrate for an optical disk

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP63094099A JPH0763991B2 (en) 1988-04-16 1988-04-16 Mold for molding optical disc substrate with format

Publications (2)

Publication Number Publication Date
JPH01264820A JPH01264820A (en) 1989-10-23
JPH0763991B2 true JPH0763991B2 (en) 1995-07-12

Family

ID=14100998

Family Applications (1)

Application Number Title Priority Date Filing Date
JP63094099A Expired - Lifetime JPH0763991B2 (en) 1988-04-16 1988-04-16 Mold for molding optical disc substrate with format

Country Status (1)

Country Link
JP (1) JPH0763991B2 (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2555149B2 (en) * 1988-06-03 1996-11-20 株式会社日立製作所 Optical disc substrate and its molding die
JPH0716973B2 (en) * 1988-09-01 1995-03-01 株式会社名機製作所 Disc molding method and molding die therefor

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2060471B (en) * 1977-10-31 1982-09-08 Discovision Ass Cooling injection moulding apparatus
JPS59176029A (en) * 1983-03-28 1984-10-05 Sony Corp Releasing method of molded article made of synthetic resin from die
JPS609721A (en) * 1983-06-29 1985-01-18 Daicel Chem Ind Ltd Assembly of mold for injection molding for plastic disc for carrier of high density informaton record
JPS6019518A (en) * 1983-07-13 1985-01-31 Daicel Chem Ind Ltd Injection molding and mold assembly of plastic disk for high density information recording carrier
JPS60155424A (en) * 1984-01-26 1985-08-15 Daicel Chem Ind Ltd Large diameter optical disc substrate made of polycarbonate and its preparation
JPS60245529A (en) * 1984-05-22 1985-12-05 Sumitomo Heavy Ind Ltd Forming die for disk recording medium such as compact disk or video disk
JPS60187022U (en) * 1984-05-23 1985-12-11 株式会社テクノプラス Peeling structure on the fixed mold plate side of a mold for forming a disc-shaped recording medium
JPS62191112A (en) * 1986-02-17 1987-08-21 Idemitsu Petrochem Co Ltd Injection molding of high density information recording disc and injection mold unit
JPS62216713A (en) * 1986-03-19 1987-09-24 Toshiba Corp Mold for molding video disk
JPS62261416A (en) * 1986-05-09 1987-11-13 Japan Steel Works Ltd:The Separation of molded form in injection molding
JPH01194151A (en) * 1988-01-28 1989-08-04 Ricoh Co Ltd Manufacture of optical disk substrate

Also Published As

Publication number Publication date
JPH01264820A (en) 1989-10-23

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