JPH0763892B2 - Method for manufacturing wire for wire saw - Google Patents

Method for manufacturing wire for wire saw

Info

Publication number
JPH0763892B2
JPH0763892B2 JP1343236A JP34323689A JPH0763892B2 JP H0763892 B2 JPH0763892 B2 JP H0763892B2 JP 1343236 A JP1343236 A JP 1343236A JP 34323689 A JP34323689 A JP 34323689A JP H0763892 B2 JPH0763892 B2 JP H0763892B2
Authority
JP
Japan
Prior art keywords
wire
layer
saw
thickness
tin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP1343236A
Other languages
Japanese (ja)
Other versions
JPH03202223A (en
Inventor
明雄 松村
武夫 小林
茂樹 山村
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP1343236A priority Critical patent/JPH0763892B2/en
Publication of JPH03202223A publication Critical patent/JPH03202223A/en
Publication of JPH0763892B2 publication Critical patent/JPH0763892B2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23DPLANING; SLOTTING; SHEARING; BROACHING; SAWING; FILING; SCRAPING; LIKE OPERATIONS FOR WORKING METAL BY REMOVING MATERIAL, NOT OTHERWISE PROVIDED FOR
    • B23D61/00Tools for sawing machines or sawing devices; Clamping devices for these tools
    • B23D61/18Sawing tools of special type, e.g. wire saw strands, saw blades or saw wire equipped with diamonds or other abrasive particles in selected individual positions
    • B23D61/185Saw wires; Saw cables; Twisted saw strips

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Wire Processing (AREA)
  • Other Surface Treatments For Metallic Materials (AREA)

Description

【発明の詳細な説明】 〔産業上の利用分野〕 本発明はワイヤ・ソー用ワイヤの製造方法に関するもの
であり、詳細には、ワイヤ・ソー用ワイヤ用芯線の表面
に錫めっき層を剥離することなく形成する手段を提供す
るものである。
TECHNICAL FIELD The present invention relates to a method for manufacturing a wire for a wire / saw, and more specifically, a tin plating layer is peeled off from the surface of a core wire for a wire / saw wire. It provides a means of forming without any.

〔従来の技術〕 フェライトやアモルファス等の磁性材料からなる脆弱な
ワークの切断用工具としてワイヤ・ソー用ワイヤが使用
されている。ワイヤ・ソー用ワイヤ(1)は第3図に横
断面図として示すように、高炭素鋼製芯線(2)の表面
に錫めっき層(3)を形成したものである。ワイヤ・ソ
ー用ワイヤ(1)の製造に際しては、高炭素鋼の細線を
芯線(2)の母材として、この細線に延線による線引き
加工と、結晶組織の改質と硬度の調節を目的とする熱処
理加工(パテンテイング加工)とを所定回数繰返し、最
終の仕上げ伸線の前乃至は仕上げ伸線後、芯線(2)の
表面に錫メット層(3)を被着させることによって、所
望の線経を具えたワイヤ・ソー用ワイヤ(1)に形成し
ている。
[Prior Art] A wire for a saw is used as a tool for cutting a fragile work made of a magnetic material such as ferrite or amorphous. The wire / saw wire (1) is a high carbon steel core wire (2) having a tin plating layer (3) formed on its surface, as shown in FIG. 3 as a cross-sectional view. When manufacturing a wire for a saw / saw (1), a fine wire of high carbon steel is used as a base material of the core wire (2) for the purpose of drawing the fine wire by drawing, modifying the crystal structure and adjusting hardness. The desired heat treatment (patenting) is repeated a predetermined number of times, and a tin met layer (3) is applied to the surface of the core wire (2) before the final finish wire drawing or after the finish wire drawing to obtain a desired wire. The wire (1) for a wire saw having a warp is formed.

上記錫めっき層(3)は、硬質の芯線(2)が露呈した
り、硬質の金属表層によってワークが破損したりするの
を防止する目的で一般に賞用されている被覆層である
が、ワークを切断する際に補助的な切断媒体として使用
されるペースト中に分散されたダイヤモンド砥粒に対し
て緩衝層もしくは担持層として機能することによって、
ワイヤ・ソー用ワイヤ(1)の切断能力並びにワークの
加工精度の維持に寄与するものである。
The tin-plated layer (3) is a coating layer generally used for the purpose of preventing the hard core wire (2) from being exposed and the work from being damaged by the hard metal surface layer. By functioning as a buffer layer or a carrier layer for the diamond abrasive grains dispersed in the paste used as an auxiliary cutting medium when cutting
This contributes to maintaining the cutting ability of the wire / saw wire (1) and the machining accuracy of the work.

〔発明が解決しようとする課題〕[Problems to be Solved by the Invention]

前述のように錫めっき層をワイヤ・ソー用ワイヤ芯線の
表層として形成することが必要とされるが、この錫めっ
き層と芯線の伸び率に相当の懸隔があるため、従来のワ
イヤ・ソー用ワイヤの製造においては、最終の仕上げ伸
線工程に先立って芯線の表面に錫めっき層を設けた場合
は、錫めっき層が伸線用ダイスによってしごかれ剥離し
易くなる。このため、ワイヤ・ソー用ワイヤの切断能力
ならびにワークの加工精度の維持が困難となる。また、
最終の仕上げ伸線後、芯線の表面に錫めっき層を形成す
ると、錫めっき層の寸法精度が得難く、また錫めっき層
の被着強度が小さいため、最終の仕上げ伸線に先立って
錫めっきした場合と同様に充分な耐用回数が得られなか
った。
As mentioned above, it is necessary to form the tin plating layer as the surface layer of the wire core wire for the wire saw, but since there is a considerable gap in the elongation of the tin plating layer and the core wire, In the production of wires, when a tin-plated layer is provided on the surface of the core wire prior to the final finish wire-drawing step, the tin-plated layer is easily squeezed by a wire-drawing die and peeled off. For this reason, it becomes difficult to maintain the cutting ability of the wire for the wire saw and the machining accuracy of the work. Also,
If the tin plating layer is formed on the surface of the core wire after the final finish drawing, it is difficult to obtain the dimensional accuracy of the tin plating layer and the adhesion strength of the tin plating layer is small. As in the case of the above, sufficient service life was not obtained.

〔課題を解決するための手段〕[Means for Solving the Problems]

上記課題解決手段として本発明は、高炭素鋼製芯線の表
面に厚み1μm程度の銅下地層を介して、厚み15〜20μ
mの錫めっき層を形成して、伸線と熱処理加工を所定回
数繰返し、最終仕上げの伸線に先立って、前記錫めっき
層上に1〜3μmの銅外被層を積層し、更に上記錫めっ
き層が厚み5〜8μmとなって、略表層に露呈するよう
に伸線加工することを特徴とするワイヤ・ソー用ワイヤ
の製造方法を提供するものである。
As a means for solving the above problems, the present invention has a thickness of 15 to 20 μm on the surface of a high carbon steel core wire with a copper underlayer having a thickness of about 1 μm interposed.
m tin plating layer is formed, wire drawing and heat treatment are repeated a predetermined number of times, a copper coating layer having a thickness of 1 to 3 μm is laminated on the tin plating layer prior to final drawing, and the tin is further added. The present invention provides a method for manufacturing a wire for a wire saw, which comprises drawing a wire so that the plating layer has a thickness of 5 to 8 μm and is exposed to a substantially surface layer.

〔作用〕[Action]

最終仕上げ伸線に先立って芯線の表面に錫めっき層と、
めっきによる銅外被層とを積層し、この銅外被層をその
後の伸線工程における錫めっき層の剥離防止層とする。
A tin-plated layer on the surface of the core wire prior to final drawing
A copper coating layer formed by plating is laminated, and this copper coating layer is used as a peeling prevention layer for the tin plating layer in the subsequent wire drawing step.

〔実施例〕〔Example〕

第1図は本発明方法によって製造されるワイヤ・ソー用
ワイヤの模式的横断面図、第2図は本発明方法を説明す
る工程図である。
FIG. 1 is a schematic cross-sectional view of a wire for a saw wire manufactured by the method of the present invention, and FIG. 2 is a process diagram illustrating the method of the present invention.

第1図において、(10)はワイヤ・ソー用ワイヤの本
体、(11)は錫めっき層(12)と高炭素鋼からなる芯線
(13)とのなじみを良くするため芯線(13)の表面に被
着形成されためっきによる下地層、(14)は前記錫めっ
き層(12)の表面に被着形成されためっきによる銅外被
層である。
In FIG. 1, (10) is the body of the wire / saw wire, and (11) is the surface of the core wire (13) to improve the familiarity between the tin plating layer (12) and the core wire (13) made of high carbon steel. The plated underlayer is formed on the surface of the tin plating layer (12), and the plated copper outer layer is formed on the surface of the tin plating layer (12).

芯線(13)は、適当な減面率でのダイスによる伸線と、
パテンティング処理を繰返して線引きし、上述の錫めっ
き層(12)とめっきによる銅外被層(14)とを形成した
後、パテンティング処理を行うことなく、仕上げの伸線
を行う。
The core wire (13) is drawn with a die at an appropriate reduction ratio,
After the patenting treatment is repeated to draw the wire to form the tin plating layer (12) and the copper outer coating layer (14) by plating, finish wire drawing is performed without performing the patenting treatment.

最終的に得られるワイヤ・ソー用ワイヤ(10)の直径は
用途に応じて選定するが、一般的には0.1乃至0.3mm程度
である。また、仕上げ伸線に先立って芯線(13)の表面
に被着形成される錫めっき層(12)の厚みは、最終仕上
げされた錫めっき層(12)の厚み5乃至8μmの3乃至
4倍となるように、15乃至20μm程度とする。そして、
上記の被膜厚みを有する錫めっき層(12)に対応して、
その表面に被着形成されるめっきによる銅外被層(14)
の厚みは、仕上げ伸線時に錫めっき層(12)に対して剥
離防止作用を発揮すると共に、仕上げ伸線が終了した後
は、錫めっき層(12)の上に殆んど残存しない程度の1
乃至3μm程度とする。
The diameter of the finally obtained wire / saw wire (10) is selected according to the application, but is generally about 0.1 to 0.3 mm. In addition, the thickness of the tin plating layer (12) formed on the surface of the core wire (13) prior to the finished wire drawing is 3 to 4 times the thickness of the finished tin plating layer (12) of 5 to 8 μm. To be about 15 to 20 μm. And
Corresponding to the tin plating layer (12) having the above coating thickness,
Copper coating layer by plating formed on its surface (14)
Has a function of preventing the tin-plated layer (12) from peeling off during the finish wire-drawing, and hardly remains on the tin-plated layer (12) after finishing the wire-drawing. 1
To about 3 μm.

一方、銅下地層(11)は、芯線(13)と錫めっき層(1
2)とのなじみを良くするための中間層で、厚みは1μ
m程度に設定すればよい。
On the other hand, the copper underlayer (11) consists of the core wire (13) and the tin plating layer (1).
2) It is an intermediate layer for better compatibility with, and the thickness is 1μ.
It may be set to about m.

以下、本発明を具体例に基づいて説明する。Hereinafter, the present invention will be described based on specific examples.

直径1.2mmのピアノ線からなる芯線母材(13)にパテン
ティング処理を施し乍ら直径0.42mm迄伸線してワイヤ・
ソー用ワイヤ(10)の中間溝体(10A)を製造する。次
いでこの中間溝体(10A)の表面に、厚さ1μmのめっ
きによる銅下地層(11)、厚さ15μmの錫めっき層(1
2)、厚さ2μmのめっきによる銅外被層(14)を順次
積層する。このようにして得られた中間溝体(10A)
を、第1図及び第2図に示すように直径が0.22mmになる
迄仕上げ伸線することによって、5乃至8μmの厚みを
有する錫めっき層(12)が略表層に露呈したワイヤ・ソ
ー用ワイヤ(10)を得た。めっきによる銅外被層(14)
は最終の伸線加工工程において、錫めっき層(12)が芯
線(13)から剥離することなく強固に圧着されるように
保護しつつ、最終段階においては当該外被層自体の殆ど
が剥離除去される。
The core wire base material (13) consisting of a piano wire with a diameter of 1.2 mm is subjected to patenting treatment, and then drawn to a diameter of 0.42 mm.
An intermediate groove body (10A) of a saw wire (10) is manufactured. Then, on the surface of the intermediate groove body (10A), a copper underlayer (11) having a thickness of 1 μm and a tin plating layer (1 having a thickness of 1 μm) were formed.
2), a copper coating layer (14) having a thickness of 2 μm is sequentially laminated. Intermediate groove body (10A) thus obtained
For wire saws with a tin plating layer (12) having a thickness of 5 to 8 μm exposed to the surface by finish wire drawing until the diameter becomes 0.22 mm as shown in FIGS. 1 and 2. A wire (10) was obtained. Copper coating layer by plating (14)
Protects the tin plating layer (12) from the core wire (13) in the final wire drawing process so that it is firmly pressed without peeling, and at the final stage, most of the outer coating layer itself is peeled and removed. To be done.

尚、この剥離した銅外被層(14)の一部が錫めっき層
(12)の中に埋入されたり、あるいは錫めっき層(12)
上に極めて薄肉で残存していたとしても、前述の使用目
的上何等差しつかえないものである。
Incidentally, a part of the peeled copper outer coating layer (14) is embedded in the tin plating layer (12), or the tin plating layer (12).
Even if it is extremely thin and remains on the top, it does not matter for the purpose of use.

〔発明の効果〕〔The invention's effect〕

本発明方法によって製造されたワイヤ・ソー用ワイヤ
は、最終の仕上げ伸線工程でめっきによる銅外被層を錫
めっき層の剥離防止膜として機能させることによって、
芯線の表面に錫めっき層を均一な厚みで、かつ、強固に
被着形成している。この結果、錫めっき層の厚みの管理
が容易となり、ワークの切断能力と切削ロスの節減及び
加工精度が大幅に向上する。
The wire / saw wire produced by the method of the present invention has the copper coating layer formed by plating in the final finish drawing step functioning as a peeling-preventing film for the tin-plated layer,
A tin plating layer is formed on the surface of the core wire with a uniform thickness and firmly. As a result, it becomes easy to control the thickness of the tin-plated layer, the cutting ability of the work, the reduction of cutting loss and the processing accuracy are significantly improved.

【図面の簡単な説明】[Brief description of drawings]

第1図は本発明方法によって製造されるワイヤ・ソー用
ワイヤの模式的横断面図、第2図は本発明方法を説明す
る工程図である。 また、第3図は従来方法によって製造されたワイヤ・ソ
ー用ワイヤの模式的横断面図である。 (10)……ワイヤ・ソー用ワイヤ、(11)……めっきに
よる銅下地層、(12)……錫めっき層、(13)……芯
線、(14)……めっきによる銅外被層。
FIG. 1 is a schematic cross-sectional view of a wire for a saw wire manufactured by the method of the present invention, and FIG. 2 is a process diagram illustrating the method of the present invention. FIG. 3 is a schematic cross-sectional view of a wire for a saw wire manufactured by a conventional method. (10) …… Wire / saw wire, (11) …… Plated copper underlayer, (12) …… Tin plated layer, (13) …… Core wire, (14) …… Plated copper coating layer.

───────────────────────────────────────────────────── フロントページの続き (72)発明者 山村 茂樹 茨城県勝田市大字稲田1410 株式会社日立 製作所東海工場内 (56)参考文献 特開 昭61−99514(JP,A) 実公 昭61−17784(JP,Y2) ─────────────────────────────────────────────────── ─── Continuation of the front page (72) Inventor Shigeki Yamamura 1410 Inada, Katsuta City, Ibaraki Prefecture In the Tokai factory of Hitachi, Ltd. (56) (JP, Y2)

Claims (1)

【特許請求の範囲】[Claims] 【請求項1】高炭素鋼製芯線の表面に厚み1μm程度の
銅下地層を介して、厚み15〜20μmの錫めっき層を形成
して、伸線と熱処理加工を所定回数繰返し、最終仕上げ
の伸線に先立って、前記錫めっき層上に1〜3μmの銅
外被層を積層し、更に上記錫めっき層が厚み5〜8μm
となって、略表層に露呈するように伸線加工することを
特徴とするワイヤ・ソー用ワイヤの製造方法。
1. A tin-plated layer having a thickness of 15 to 20 μm is formed on the surface of a high carbon steel core wire through a copper underlayer having a thickness of about 1 μm, and wire drawing and heat treatment are repeated a predetermined number of times for final finishing. Prior to wire drawing, a copper coating layer having a thickness of 1 to 3 μm is laminated on the tin plating layer, and the tin plating layer has a thickness of 5 to 8 μm.
The method for producing a wire for a wire-saw is characterized in that the wire drawing process is performed so that the wire is exposed to a substantially surface layer.
JP1343236A 1989-12-27 1989-12-27 Method for manufacturing wire for wire saw Expired - Lifetime JPH0763892B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1343236A JPH0763892B2 (en) 1989-12-27 1989-12-27 Method for manufacturing wire for wire saw

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1343236A JPH0763892B2 (en) 1989-12-27 1989-12-27 Method for manufacturing wire for wire saw

Publications (2)

Publication Number Publication Date
JPH03202223A JPH03202223A (en) 1991-09-04
JPH0763892B2 true JPH0763892B2 (en) 1995-07-12

Family

ID=18359975

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1343236A Expired - Lifetime JPH0763892B2 (en) 1989-12-27 1989-12-27 Method for manufacturing wire for wire saw

Country Status (1)

Country Link
JP (1) JPH0763892B2 (en)

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6117784U (en) * 1984-07-05 1986-02-01 富士通株式会社 Shield cable installation structure
JPS6199514A (en) * 1984-10-22 1986-05-17 Shinko Kosen Kogyo Kk Manufacture of small-gauge wire plated with zinc

Also Published As

Publication number Publication date
JPH03202223A (en) 1991-09-04

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