JPH0761670B2 - Mold surface heating device - Google Patents

Mold surface heating device

Info

Publication number
JPH0761670B2
JPH0761670B2 JP62198725A JP19872587A JPH0761670B2 JP H0761670 B2 JPH0761670 B2 JP H0761670B2 JP 62198725 A JP62198725 A JP 62198725A JP 19872587 A JP19872587 A JP 19872587A JP H0761670 B2 JPH0761670 B2 JP H0761670B2
Authority
JP
Japan
Prior art keywords
mold
heating device
molds
resin
halogen bulb
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP62198725A
Other languages
Japanese (ja)
Other versions
JPS6442217A (en
Inventor
茂 浅田
俊雄 久保
Original Assignee
西堀 稔
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 西堀 稔 filed Critical 西堀 稔
Priority to JP62198725A priority Critical patent/JPH0761670B2/en
Publication of JPS6442217A publication Critical patent/JPS6442217A/en
Publication of JPH0761670B2 publication Critical patent/JPH0761670B2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17Component parts, details or accessories; Auxiliary operations
    • B29C45/72Heating or cooling
    • B29C45/73Heating or cooling of the mould
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C33/00Moulds or cores; Details thereof or accessories therefor
    • B29C33/02Moulds or cores; Details thereof or accessories therefor with incorporated heating or cooling means
    • B29C33/06Moulds or cores; Details thereof or accessories therefor with incorporated heating or cooling means using radiation, e.g. electro-magnetic waves, induction heating
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17Component parts, details or accessories; Auxiliary operations
    • B29C45/40Removing or ejecting moulded articles
    • B29C45/42Removing or ejecting moulded articles using means movable from outside the mould between mould parts, e.g. robots

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Health & Medical Sciences (AREA)
  • Toxicology (AREA)
  • Manufacturing & Machinery (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)

Description

【発明の詳細な説明】 (産業上の利用分野) 本発明は金型の表面を加熱して不良品の発生を極くわず
かに抑える事が出来る簡易な加熱装置の発明に関するも
のである。
TECHNICAL FIELD The present invention relates to an invention of a simple heating device capable of heating the surface of a mold to suppress the occurrence of defective products to a very small extent.

(従来の技術とその問題点) 従来の射出成形は、固定金型と可動金型があって両金型
の型締め間に固定金型側のエクストルーダから溶けた樹
脂が金型のキャビティ内に射出され、樹脂が硬化した処
で型開きを行って成型品を取り出すと言うものであっ
た。この場合、樹脂の温度(250℃程度)と金型温度(8
0℃程度)との差が大きかったため、冷たい金型の表面
に高温の樹脂が接触すると直ちに表面部分に薄皮が発生
し、この薄皮が樹脂の流れに沿って引っ張られ、硬化し
た時に成型品の表面に樹脂の流れに沿って細いしわが発
生し、表面状態が悪くなり、その結果成型品の表面を塗
装しなければならないと言うような欠点があった。ガラ
ス繊維やカーボン繊維と樹脂の複合材を用いた場合は特
にその傾向が大きい。
(Prior art and its problems) In conventional injection molding, there are a fixed mold and a movable mold, and the resin melted from the extruder on the fixed mold side enters the mold cavity during mold clamping of both molds. It was said that when the resin was injected and the resin was cured, the mold was opened and the molded product was taken out. In this case, the resin temperature (about 250 ° C) and the mold temperature (8
Since the difference between the temperature and the temperature of the mold is large, when a hot resin comes into contact with the surface of the cold mold, a thin skin is immediately generated on the surface. There was a drawback that fine wrinkles were generated on the surface along the flow of resin and the surface condition deteriorated, and as a result, the surface of the molded product had to be painted. This tendency is particularly large when a composite material of glass fiber or carbon fiber and resin is used.

(本発明の目的) 本発明は、かかる従来例の欠点に鑑みてなされたもの
で、その目的とする処は、金型表面をクリーンで迅速且
つ簡単、低コストで加熱出来、成型品の表面改善効果に
著しく優れた金型表面加熱装置を提供するにある。
(Object of the present invention) The present invention has been made in view of the drawbacks of the conventional example, and the object of the present invention is to clean the mold surface quickly, easily and easily at low cost, and to obtain the surface of the molded product. It is an object of the present invention to provide a mold surface heating device which is remarkably excellent in the improvement effect.

(問題点を解決するための手段) 上記の目的を達成するために、 本発明では; 枠材(4)の収納窓部(5)内にハロゲン電球(2)
を配置する。
(Means for Solving the Problems) In order to achieve the above object, in the present invention; the halogen bulb (2) is provided in the storage window portion (5) of the frame member (4).
To place.

枠材(4)内に冷却材流通路(6)を形成する。A coolant flow passage (6) is formed in the frame material (4).

ハロゲン電球(2)の配線材(7)を冷却材流通路
(6)内に配設する。
The wiring material (7) of the halogen bulb (2) is arranged in the coolant flow passage (6).

;と言う技術的手段を採用している。The technical means called; is adopted.

(作用) 金型(1)の型開き中にハロゲン電球(2)を配置し
た加熱装置(3)を金型(1)間に挿入し、ハロゲン電
球(2)を点灯して金型(1)表面を加熱する。
(Operation) A heating device (3) having a halogen bulb (2) arranged in the mold opening of the die (1) is inserted between the dies (1), and the halogen bulb (2) is turned on to turn on the die (1). ) Heat the surface.

これにより、金型(1)の表面温度は110℃〜130℃迄
昇温する。
As a result, the surface temperature of the mold (1) rises to 110 ° C to 130 ° C.

然る後加熱装置(3)を金型(1)間から抜き出し、
金型(1)を閉じる。
After that, remove the heating device (3) from between the molds (1),
Close the mold (1).

型締め後、溶融した樹脂を射出して金型成形を行うの
であるが、高温の溶融樹脂と金型(1)表面の温度差が
小さくなって成型品の表面にしわが発生しなくなる。
After the mold is clamped, the molten resin is injected to mold the die, but the temperature difference between the hot molten resin and the surface of the die (1) becomes small, and wrinkles do not occur on the surface of the molded product.

ここで、加熱装置(3)はハロゲン電球(2)の発熱
や金型(1)の輻射熱によって高温にさらされるが、枠
材(4)内に冷却材流通路(6)が形成され、且つ、ハ
ロゲン電球(2)の配線材(7)が冷却材流通路(6)
内に配設されているために配線材(7)料が劣化しな
い。
Here, the heating device (3) is exposed to high temperature due to the heat generation of the halogen bulb (2) and the radiant heat of the mold (1), but the coolant flow passage (6) is formed in the frame material (4), and , The wiring material (7) of the halogen bulb (2) is the coolant flow path (6)
The wiring material (7) does not deteriorate because it is disposed inside.

(実施例) 以下、本発明を図示実施例に従って説明する。第2,3図
は本発明に係る加熱装置(3)の一部切欠正面図並びに
一部切欠側面図である。(4)は枠材(4)でアルミニ
ウム製で中空状になっており、この中空部分が冷却材流
通路(6)である。枠材(4)の中央には収納窓部
(5)が開設されており、収納窓部(5)の外面側に直
管型ハロゲン電球(2)が並べて配置されている。枠材
(4)内の冷却材流通路(6)にはハロゲン電球(2)
の配線材(7)が配設されており、枠材(4)の端面に
設けられたターミナル(8)に接続されている。更にタ
ーミナル(8)の近傍に冷却バルブ(9)が設けられて
おり、冷却材流通路(6)内を巡回するように配置され
た冷却チューブ(11)が冷却バルブ(9)に接続してあ
る。ハロゲン電球(2)の更に外側には防護金網(10)
が配設されており、枠材(4)にボルト止めされてい
る。
(Examples) The present invention will be described below with reference to illustrated examples. 2 and 3 are a partially cutaway front view and a partially cutaway side view of a heating device (3) according to the present invention. (4) is a frame member (4) made of aluminum and having a hollow shape, and this hollow portion is a coolant flow passage (6). A storage window portion (5) is opened in the center of the frame member (4), and the straight tube halogen light bulbs (2) are arranged side by side on the outer surface side of the storage window portion (5). A halogen bulb (2) is installed in the coolant flow passage (6) in the frame material (4).
The wiring material (7) is provided and connected to the terminal (8) provided on the end surface of the frame material (4). Further, a cooling valve (9) is provided near the terminal (8), and a cooling tube (11) arranged so as to circulate in the coolant flow passage (6) is connected to the cooling valve (9). is there. Outside the halogen bulb (2) is a protective wire mesh (10)
Are arranged and bolted to the frame member (4).

射出成形では、固定金型(1a)と可動金型(1b)があっ
て両金型(1)の型締め間に固定金型(1a)側のエクス
トルーダから溶けた樹脂が金型(1)のキャビティ内に
射出され、樹脂が硬化した処で型開きを行って成型品を
取り出すものであるが、金型(1)の型開き中にハロゲ
ン電球(2)を配置した一対の加熱装置(3)を金型
(1)間に挿入し、ハロゲン電球(2)を点灯して短時
間で金型(1)表面を110〜130℃程度まで加熱する。然
る後、加熱装置(3)を金型(1)間から抜き出し、型
締めを素早く行ってから金型(1)のキャビティ内にエ
クストルーダから溶融した樹脂(250℃程度)を射出す
るのであるが、樹脂温度と金型(1)表面温度との差が
比較的小さいために流動状態にある樹脂表面に薄皮が張
らず、流動状態が停止した処で樹脂の硬化が起こり、ガ
ラス繊維やカーボン繊維と樹脂の複合材のように表面に
しわの発生し易い材料であっても極めて平滑な表面状態
の成型品が得られる。
In injection molding, there is a fixed mold (1a) and a movable mold (1b), and the resin melted from the extruder on the side of the fixed mold (1a) during mold clamping of both molds (1) is the mold (1). The mold is opened when the resin is injected into the cavity of the mold and the molded product is taken out. A pair of heating devices in which the halogen bulb (2) is arranged in the mold opening of the mold (1) ( 3) is inserted between the molds (1), the halogen bulb (2) is turned on, and the surface of the mold (1) is heated to about 110 to 130 ° C in a short time. After that, the heating device (3) is pulled out from between the molds (1), the molds are quickly clamped, and the molten resin (about 250 ° C.) is injected from the extruder into the cavity of the molds (1). However, since the difference between the resin temperature and the surface temperature of the mold (1) is relatively small, the resin surface in the fluid state does not have a thin skin, and the resin cures when the fluid state is stopped, and glass fiber or carbon A molded product having an extremely smooth surface state can be obtained even with a material such as a composite material of fiber and resin, which is easily wrinkled on the surface.

(本発明の効果) 本発明は叙上のように、金型の型開き中にハロゲン電球
を配置した加熱装置を金型間に挿入して金型表面を加熱
し、然る後加熱装置を金型間から抜き出し、型締めを行
ってから金型成形を行うものであるため、樹脂温度と金
型表面温度との差が従来より大幅に縮まり、金型内に注
入された直後の溶融状態の樹脂が金型表面と接触しても
直ちに薄皮を生ずると言うような事がなく、その結果成
型品の表面にしわが発生したり、湯引けなどが発生せ
ず、極めて平滑な表面が得ら、仕上げ塗装など全く必要
がないと言うような利点がある。又、ハロゲン電球によ
る加熱であるために金型表面の昇温速度が極めて速いだ
けでなく、作業環境の劣化を引き起こす事がなく、同時
に誘導加熱のような大掛かりな設備を必要とせず設備費
用も極めて安価であると言う利点がある。
(Effect of the present invention) As described above, the present invention inserts a heating device in which a halogen bulb is arranged in the mold opening between molds to heat the surface of the mold, and then the heating device is installed. Since it is extracted from between molds and clamped before molding, the difference between the resin temperature and the mold surface temperature is much smaller than before, and the molten state immediately after being injected into the mold. There is no such thing as a thin skin being immediately generated even if the resin of the above comes into contact with the mold surface, and as a result, an extremely smooth surface is obtained without wrinkling or shrinkage of the surface of the molded product. There is an advantage that you don't need any finishing paint. In addition, the heating rate of the mold surface is extremely fast because it is heated by a halogen bulb, and it does not cause deterioration of the working environment, and at the same time, it does not require large-scale equipment such as induction heating and the equipment cost is also high. It has the advantage of being extremely inexpensive.

又、ハロゲン電球の配線材を冷却材流通路内に配設して
あるので、装置全体が高温にさらされても配線材が比較
的低温に保持され、劣化する事がない。
Further, since the wiring material of the halogen bulb is arranged in the coolant flow passage, even if the entire apparatus is exposed to high temperature, the wiring material is kept at a relatively low temperature and is not deteriorated.

【図面の簡単な説明】[Brief description of drawings]

第1図…本発明の使用状態を説明する正面図 第2図…本発明に使用する加熱装置の一部切欠正面図 第3図…第2図の一部切欠側面図 (1)……金型、(1a)……固定金型 (1b)……可動金型、(2)……ハロゲン電球 (3)……加熱装置、(4)……枠材 (5)……収納窓部、(6)……冷却材流通路 (7)……配線材、(8)……ターミナル (9)……冷却バルブ、(10)……防護金網 FIG. 1 ... Front view for explaining the usage state of the present invention FIG. 2 ... Front view of a heating device used in the present invention in a partially cutaway view FIG. 3 ... Side view of partially cutaway view in FIG. 2 (1). Mold, (1a) …… Fixed mold (1b) …… Movable mold, (2) …… Halogen bulb (3) …… Heating device, (4) …… Frame material (5) …… Storage window, (6) …… Coolant flow passage (7) …… Wiring material, (8) …… Terminal (9) …… Cooling valve, (10) …… Protective wire mesh

Claims (1)

【特許請求の範囲】[Claims] 【請求項1】金型の型開き中にハロゲン電球を配置した
加熱装置を金型間に挿入して金型表面を加熱し、然る後
加熱装置を金型間から抜き出し、型締めを行った後金型
成形を行う金型表面加熱装置であって、 枠材の収納窓部内にハロゲン電球を配置し、枠材内に冷
却材流通路を形成し、ハロゲン電球の配線材を冷却材流
通路内に配設して成る事を特徴とする金型表面加熱装
置。
1. A heating device, in which a halogen bulb is arranged during mold opening, is inserted between the molds to heat the surface of the molds, after which the heating device is pulled out from between the molds and the molds are clamped. After heating the mold surface, it is a mold surface heating device.Halogen bulbs are placed inside the window of the frame material, a coolant flow passage is formed in the frame material, and the wiring material of the halogen bulb is circulated through the coolant. A mold surface heating device characterized by being arranged in a passage.
JP62198725A 1987-08-08 1987-08-08 Mold surface heating device Expired - Lifetime JPH0761670B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP62198725A JPH0761670B2 (en) 1987-08-08 1987-08-08 Mold surface heating device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP62198725A JPH0761670B2 (en) 1987-08-08 1987-08-08 Mold surface heating device

Publications (2)

Publication Number Publication Date
JPS6442217A JPS6442217A (en) 1989-02-14
JPH0761670B2 true JPH0761670B2 (en) 1995-07-05

Family

ID=16395952

Family Applications (1)

Application Number Title Priority Date Filing Date
JP62198725A Expired - Lifetime JPH0761670B2 (en) 1987-08-08 1987-08-08 Mold surface heating device

Country Status (1)

Country Link
JP (1) JPH0761670B2 (en)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0628901B2 (en) * 1990-05-28 1994-04-20 株式会社日本製鋼所 Method of heating mold cavity for plastic molding
JP3977565B2 (en) 1999-05-06 2007-09-19 小野産業株式会社 Mold for synthetic resin molding, mold temperature control device and mold temperature control method
AU2001269576A1 (en) * 2000-08-24 2002-03-04 Sook-Jia Yim Method for momentarily heating the surface of a mold and system thereof
EP1225020B1 (en) 2001-01-17 2007-01-17 Ono Sangyo Co., Ltd. Mold device for injection molding of synthetic resin

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60175620U (en) * 1984-05-02 1985-11-21 株式会社 名機製作所 Injection molding machine
JPS6259539U (en) * 1985-10-02 1987-04-13

Also Published As

Publication number Publication date
JPS6442217A (en) 1989-02-14

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