JPH0761199A - Production of ornamental body - Google Patents
Production of ornamental bodyInfo
- Publication number
- JPH0761199A JPH0761199A JP23742593A JP23742593A JPH0761199A JP H0761199 A JPH0761199 A JP H0761199A JP 23742593 A JP23742593 A JP 23742593A JP 23742593 A JP23742593 A JP 23742593A JP H0761199 A JPH0761199 A JP H0761199A
- Authority
- JP
- Japan
- Prior art keywords
- resin layer
- layer
- base material
- conductive resin
- ring
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Other Surface Treatments For Metallic Materials (AREA)
- Laminated Bodies (AREA)
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は、非導電性膜である樹脂
層が形成された金属基材上に任意の金属パタ−ンを形成
した装飾体の製造方法に関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for producing a decorative body in which an arbitrary metal pattern is formed on a metal base material on which a resin layer which is a non-conductive film is formed.
【０００２】[0002]
【従来の技術】従来、樹脂層を形成した金属基材上に金
属調のパタ−ンを形成するには、切削などの方法で樹脂
層を一部除去し金属基材を露出させたり、必要に応じ露
出した金属基材部分にめっき等の方法で金属層を形成す
ることによりパタ−ニングを行っている。具体的には、
特開平２−２２８５８６号に開示されているように、金
属上に非導電性膜である樹脂層を形成した後、樹脂層の
必要部分を下地金属に達するように除去し、下地金属上
にめっきを形成する方法である。2. Description of the Related Art Conventionally, in order to form a metallic pattern on a metal base material on which a resin layer is formed, it is necessary to partially remove the resin layer by a method such as cutting to expose the metal base material. The patterning is performed by forming a metal layer on the exposed metal base material portion by a method such as plating. In particular,
As disclosed in JP-A-2-228586, after forming a resin layer which is a non-conductive film on a metal, a necessary portion of the resin layer is removed so as to reach the base metal, and plating is performed on the base metal. Is a method of forming.
【０００３】[0003]
【発明が解決しようとする課題】従来の金属調のパタ−
ン形成方法は、切削などの工程で樹脂層を一部除去し金
属層を露出する際に樹脂層と金属基材との密着性が不可
欠であるが、樹脂層と金属基材の密着性が不十分である
場合は、カット部のエッジ部分の樹脂層がはく離したり
するという問題があった。又、カットで露出した金属基
材上にめっき法などにより金属層を形成する場合には、
脱脂などの前処理工程で樹脂層が基材金属より剥離して
しまうという問題があった。DISCLOSURE OF THE INVENTION Conventional metallic pattern
In the method of forming a resin, the adhesiveness between the resin layer and the metal substrate is essential when the resin layer is partially removed and the metal layer is exposed in a process such as cutting. If it is insufficient, there is a problem that the resin layer on the edge portion of the cut portion may peel off. Also, when forming a metal layer on the metal substrate exposed by cutting by a plating method or the like,
There has been a problem that the resin layer is separated from the base metal in the pretreatment process such as degreasing.
【０００４】[0004]
【課題を解決するための手段】本発明の目的は、樹脂層
と金属基材との密着が良好であり、処理工程中において
両者間で剥離の生じないパタ−ン形成方法を提供せんと
するもので、金属基材上に黒クロムめっき層、非導電性
の樹脂層を順次形成し、その後部分的に樹脂層とめっき
層を除去し部分的に金属基材を露出せしめ、その後必要
に応じ露出した金属基材上に金属層を形成するようなし
た装飾体の製造方法を要旨とするものである。SUMMARY OF THE INVENTION It is an object of the present invention to provide a pattern forming method in which adhesion between a resin layer and a metal substrate is good and peeling does not occur between the two during a treatment process. The black chrome plating layer and the non-conductive resin layer are sequentially formed on the metal base material, and then the resin layer and the plating layer are partially removed to partially expose the metal base material, and then, if necessary. The gist is a method of manufacturing a decorative body in which a metal layer is formed on an exposed metal base material.
【０００５】基材となる金属としては、種々使用可能で
あるが後述する切削工程を考慮すれば、切削性の良好な
金及び金合金、銅及び銅合金が好ましい。Although various metals can be used as the base material, gold and gold alloys and copper and copper alloys having good machinability are preferable in consideration of the cutting step described later.
【０００６】金属基材上に形成する黒クロムめっき層
は、後述する非導電性の樹脂層の接着層として形成する
ものであり、めっき法により形成される。即ち、黒クロ
ムめっき層は、黒クロムめっき液に基材金属を浸漬し、
基材を陰極としめっきすることにより得られる。The black chrome plating layer formed on the metal substrate is formed as an adhesive layer of a non-conductive resin layer described later and is formed by a plating method. That is, the black chrome plating layer, by immersing the base metal in the black chrome plating solution,
It is obtained by plating with the base material as a cathode.
【０００７】非導電性の樹脂層は、アクリル、ウレタ
ン、エポキシ、ポリエステル等の合成樹脂塗料又はイン
キにより形成される。非導電性の樹脂層は、塗装法、印
刷法など基材の形状などにより適宜選択された方法によ
り形成する。The non-conductive resin layer is formed by a synthetic resin paint or ink such as acrylic, urethane, epoxy, polyester or the like. The non-conductive resin layer is formed by a method appropriately selected depending on the shape of the base material such as a coating method and a printing method.
【０００８】次に、非導電性の樹脂層と黒クロムめっき
層とを除去し適宜のパタ−ンを形成する方法について説
明する。非導電性の樹脂層と黒クロムめっき層との除去
は、切削加工により行われるが、切削は、旋盤、フライ
ス盤などの切削装置を利用し、切削に用いる刃物として
は、ダイヤモンド、高速度工具鋼、セラミック、サ−メ
ット、超鋼材質のバイト等が使用される。工具、切削装
置の種類は、素材の材質、要求される外観により適宜選
択し使用する。Next, a method of removing the non-conductive resin layer and the black chrome plating layer to form an appropriate pattern will be described. The non-conductive resin layer and the black chrome plating layer are removed by cutting, and the cutting uses a cutting device such as a lathe or a milling machine, and the cutting tool used is diamond or high-speed tool steel. , Ceramic, cermet, and bite made of super steel are used. The types of tools and cutting equipment are selected and used according to the material and the required appearance.
【０００９】適宜のパタ−ンに非導電性の樹脂層と黒ク
ロムめっき層とを除去することにより、パタ−ン形状に
基づき金属基材が露出することとなり、パタ−ン形成が
完了するが、露出した金属基材パターンを保護するた
め、表面にクリア−塗料、インクによるコ−ティング層
を形成してもよい。By removing the non-conductive resin layer and the black chrome plating layer in an appropriate pattern, the metal base material is exposed based on the pattern shape, and the pattern formation is completed. In order to protect the exposed metal base material pattern, a coating layer of clear paint or ink may be formed on the surface.
【００１０】又、基材の着色を保持するため又は他の着
色を施すために、露出した金属基材パターン上に基材と
同種又は異種の金属層を形成することもできる。It is also possible to form a metal layer of the same kind or different kind as the base material on the exposed metal base material pattern in order to maintain the coloration of the base material or to apply other coloring.
【００１１】[0011]
【作用】本発明は、非導電性の樹脂層と金属基材との間
に接着層となる黒クロムめっき層を介在させたので、非
導電性の樹脂層と黒クロムめっき層とが強固に密着し、
又、金属基材と黒クロムめっき層とが強固に密着し、切
削時に非導電性の樹脂層が剥離するようなことがない。In the present invention, since the black chrome plating layer serving as an adhesive layer is interposed between the non-conductive resin layer and the metal base material, the non-conductive resin layer and the black chrome plating layer are firmly formed. Close contact,
Further, the metal base material and the black chrome plating layer are firmly adhered to each other, and the non-conductive resin layer is not peeled off during cutting.
【００１２】[0012]
実施例１ 肉厚０．５ｍｍの黄銅リングを溶剤脱脂し、その後浸
漬、電解脱脂、酸活性を行い、２０℃の黒クロムめっき
液（日本Ｍ＆Ｔ（株）製）に浸漬し、４０Ａ／ｄｍ2の
電流密度で２分間めっきを行った。めっきしたリングを
乾燥した後、黒のアクリル系塗料（ユニパ−ル、大橋化
学（株）製）で塗装を行い、１８０℃、３０分間乾燥し
完全硬化させた。その後エポキシ系のインキ（セイコ−
１０００、セイコ−アドバンス（株）製）でパタ−ン印
刷を行い１３０℃、１０分間乾燥した。その後金色箔を
用いてホットスタンプを行い金色のパタ−ンを形成し
た。その後アクリル系のクリア−塗装を行い１８０℃、
３０分間乾燥した。その後ダイヤバイトと旋盤を用いて
リングの両端をカットし、リングの上下にライン状に素
材を露出させた。その後アクリル系のクリア−塗料（ユ
ニパ−ル、大橋化学（株）製）を用いて塗装を行い１８
０℃、３０分間乾燥し金色のラインが上下に入った金色
のホットスタンプパタ−ンが形成された黒のリングを得
た。Brass ring of Example 1 thickness of 0.5mm and solvent degreasing, then immersed, electrolytic degreasing performs acid activity, was immersed in 20 ° C. black chromium plating solution (manufactured by Nippon M & T (Ltd.)), 40A / dm 2 Plating was performed for 2 minutes at the current density of. After the plated ring was dried, it was painted with a black acrylic paint (Unipar, Ohashi Chemical Co., Ltd.) and dried at 180 ° C. for 30 minutes to completely cure it. After that, epoxy type ink (Seiko-
Pattern printing was performed with 1000, manufactured by Seiko Advance Co., Ltd., and dried at 130 ° C. for 10 minutes. After that, hot stamping was performed using a gold foil to form a gold pattern. After that, apply acrylic clear-paint at 180 ℃,
It was dried for 30 minutes. After that, both ends of the ring were cut using a diamond bite and a lathe to expose the material in a line above and below the ring. After that, an acrylic clear paint (Unipar, manufactured by Ohashi Chemical Co., Ltd.) was used to paint 18
After drying at 0 ° C. for 30 minutes, a black ring having a gold hot stamp pattern with gold lines above and below was formed.
【００１３】実施例２ 肉厚０．５ｍｍの黄銅リングを溶剤脱脂し、その後浸
漬、電解脱脂、酸活性を行い、２０℃の黒クロムめっき
液（日本Ｍ＆Ｔ（株）製）に浸漬し、４０Ａ／ｄｍ2の
電流密度で２分間めっきを行った。めっきしたリングを
乾燥した後、黒のアクリル系塗料（ユニパ−ル、大橋化
学（株）製）で塗装を行い、１８０℃、３０分間乾燥し
完全硬化させた。その後エポキシ系のインキでパタ−ン
印刷を行い１３０℃、１０分間乾燥した。その後金色箔
を用いてホットスタンプを行い金色のパタ−ンを形成し
た。その後アクリル系のクリア−塗装を行い１８０℃、
３０分間乾燥した。その後ダイヤバイトと旋盤を用いて
リングの両端をカットし、リングの上下にライン状に素
材を露出させた。その後溶剤脱脂、浸漬、電解脱脂、酸
活性を行い、ワット浴で電流密度４Ａ／ｄｍ2で１０分
間ニッケルめっきを行い、その後電流密度１Ａ／ｄｍ2
で１０分間金めっきを行うことにより、金色のラインが
上下に入った金色のホットスタンプパタ−ンが形成され
た黒のリングを得た。Example 2 A brass ring having a thickness of 0.5 mm was degreased with a solvent, then immersed, electrolytically degreased and acid-activated, and immersed in a black chrome plating solution (manufactured by Japan M & T Co., Ltd.) at 20 ° C. for 40 A. The plating was performed for 2 minutes at a current density of / dm 2 . After the plated ring was dried, it was painted with a black acrylic paint (Unipar, Ohashi Chemical Co., Ltd.) and dried at 180 ° C. for 30 minutes to completely cure it. After that, pattern printing was performed with an epoxy ink and dried at 130 ° C. for 10 minutes. After that, hot stamping was performed using a gold foil to form a gold pattern. After that, apply acrylic clear-paint at 180 ℃,
It was dried for 30 minutes. After that, both ends of the ring were cut using a diamond bite and a lathe to expose the material in a line above and below the ring. After that, solvent degreasing, dipping, electrolytic degreasing and acid activation are performed, nickel plating is performed in a Watt bath at a current density of 4 A / dm 2 for 10 minutes, and then a current density of 1 A / dm 2
Gold plating was performed for 10 minutes to obtain a black ring in which a gold hot stamp pattern having gold lines in the upper and lower sides was formed.
【００１４】実施例３ 肉厚０．５ｍｍの黄銅リングを溶剤脱脂し、その後浸
漬、電解脱脂、酸活性を行い、２０℃の黒クロムめっき
液（日本Ｍ＆Ｔ（株）製）に浸漬し、４０Ａ／ｄｍ2の
電流密度で２分間めっきを行った。めっきしたリングを
乾燥した後、黒のアクリル系塗料（ユニパ−ル、大橋化
学（株）製）で塗装を行い、１８０℃、３０分間乾燥し
完全硬化させた。その後ダイヤバイトとＮＣフライス旋
盤を用いてリングの表面をパタ−ン状に切削し、パタ−
ン状に金属基材を露出させた。その後アクリル系のクリ
ア−塗装を行い１８０℃、３０分間乾燥し金色のパタ−
ンが形成された黒のリングを得た。Example 3 A brass ring having a thickness of 0.5 mm was degreased with a solvent, then immersed, electrolytically degreased and acid-activated, and immersed in a black chrome plating solution (manufactured by Japan M & T Co., Ltd.) at 20 ° C. for 40 A. The plating was performed for 2 minutes at a current density of / dm 2 . After the plated ring was dried, it was painted with a black acrylic paint (Unipar, Ohashi Chemical Co., Ltd.) and dried at 180 ° C. for 30 minutes to completely cure it. After that, the surface of the ring is cut into a pattern using a diamond bite and NC milling lathe, and the pattern is cut.
The metal substrate was exposed in the shape of a ring. Acrylic clear coating is then applied and dried at 180 ° C for 30 minutes to give a golden pattern.
I got a black ring with a ring formed.
【００１５】実施例４ 肉厚０．５ｍｍの黄銅リングを溶剤脱脂し、その後浸
漬、電解脱脂、酸活性を行い、２０℃の黒クロムめっき
液（日本Ｍ＆Ｔ（株）製）に浸漬し、４０Ａ／ｄｍ2の
電流密度で２分間めっきを行った。めっきしたリングを
乾燥した後、黒のアクリル系塗料（ユニパ−ル、大橋化
学（株）製）で塗装を行い、１８０℃、３０分間乾燥し
完全硬化させた。その後ダイヤバイトとＮＣフライス旋
盤を用いてリングの表面をパタ−ン状に切削し、パタ−
ン状に金属基材を露出させた。その後溶剤脱脂、浸漬、
電解脱脂、酸活性を行い、ワット浴で電流密度４Ａ／ｄ
ｍ2で１０分間ニッケルめっきを行い、その後電流密度
１Ａ／ｄｍ2で１０分間金めっきを行うことにより、金
色のパタ−ンが形成された黒のリングを得た。Example 4 A brass ring having a thickness of 0.5 mm was degreased with a solvent, then immersed, electrolytically degreased and acid-activated, and immersed in a black chrome plating solution (manufactured by Japan M & T Co., Ltd.) at 20 ° C. for 40 A. The plating was performed for 2 minutes at a current density of / dm 2 . After the plated ring was dried, it was painted with a black acrylic paint (Unipar, Ohashi Chemical Co., Ltd.) and dried at 180 ° C. for 30 minutes to completely cure it. After that, the surface of the ring is cut into a pattern using a diamond bite and NC milling lathe, and the pattern is cut.
The metal substrate was exposed in the shape of a ring. Then solvent degreasing, dipping,
Electrolytic degreasing and acid activation, current density 4A / d in Watt
Nickel plating was performed at m 2 for 10 minutes, and then gold plating was performed at a current density of 1 A / dm 2 for 10 minutes to obtain a black ring on which a gold pattern was formed.
【００１６】比較例１ 肉厚０．５ｍｍの黄銅リングを溶剤脱脂し、乾燥した
後、黒のアクリル系塗料（ユニパ−ル、大橋化学（株）
製）で塗装を行い、１８０℃、３０分間乾燥し完全硬化
させた。その後ダイヤバイトと旋盤を用いてリングの両
端をカットし、リングの上下にライン状に素材を露出さ
せた。その後アクリル系のクリア−塗料（ユニパ−ル、
大橋化学（株）製）を用いて塗装を行い１８０℃、３０
分間乾燥し金色のパタ−ンが形成された黒のリングを得
た。Comparative Example 1 A brass ring having a thickness of 0.5 mm was solvent-degreased and dried, and then black acrylic paint (Unipar, Ohashi Chemical Co., Ltd.) was used.
Coating), dried at 180 ° C. for 30 minutes and completely cured. After that, both ends of the ring were cut using a diamond bite and a lathe to expose the material in a line above and below the ring. After that, acrylic clear paint (Unipar,
Painted using Ohashi Chemical Co., Ltd. 180 ° C, 30
After drying for a minute, a black ring having a golden pattern was obtained.
【００１７】比較例２ 肉厚０．５ｍｍの黄銅リングを溶剤脱脂し、乾燥した
後、黒のアクリル系塗料（ユニパ−ル、大橋化学（株）
製）で塗装を行い、１８０℃、３０分間乾燥し完全硬化
させた。その後ダイヤバイトと旋盤を用いてリングの両
端をカットし、リングの上下にライン状に素材を露出さ
せた。その後溶剤脱脂、浸漬、電解脱脂、酸活性を行
い、ワット浴で電流密度４Ａ／ｄｍ2で１０分間ニッケ
ルめっきを行い、その後電流密度１Ａ／ｄｍ2で１０分
間金めっきを行うことにより、金色のパタ−ンが形成さ
れた黒のリングを得た。Comparative Example 2 A brass ring having a thickness of 0.5 mm was solvent-degreased and dried, and then black acrylic paint (Unipar, Ohashi Chemical Co., Ltd.) was used.
Coating), dried at 180 ° C. for 30 minutes and completely cured. After that, both ends of the ring were cut using a diamond bite and a lathe to expose the material in a line above and below the ring. After that, solvent degreasing, dipping, electrolytic degreasing and acid activation are performed, nickel plating is performed in a Watt bath at a current density of 4 A / dm 2 for 10 minutes, and then gold plating is performed at a current density of 1 A / dm 2 for 10 minutes to obtain a golden color. A black ring having a pattern formed was obtained.
【００１８】以上の実施例１〜４、比較例１、２により
得られたリングについて、カット部の外観、樹脂層の密
着性の評価結果を表１に示す。尚、樹脂の密着性は９５
℃以上の沸騰水に２５分間浸漬した後密着状態を観察し
た。Table 1 shows the evaluation results of the appearance of the cut portion and the adhesiveness of the resin layer for the rings obtained in Examples 1 to 4 and Comparative Examples 1 and 2. The adhesiveness of the resin is 95
After being immersed in boiling water at a temperature of ℃ or more for 25 minutes, the close contact state was observed.
【００１９】[0019]
【表１】 [Table 1]
【００２０】[0020]
【発明の効果】表１でも明らかなように、本発明の装飾
体は、樹脂層と金属基材との密着が良好であり、切削工
程において両者間で剥離が生じない。よって鮮明なパタ
−ンを形成することができるものである。As is apparent from Table 1, the decorative body of the present invention has good adhesion between the resin layer and the metal base material, and peeling does not occur between the two in the cutting process. Therefore, a clear pattern can be formed.
Claims (1)
性の樹脂層を順次形成し、その後部分的に樹脂層とめっ
き層を除去し部分的に金属基材を露出せしめ、その後必
要に応じ露出した金属基材上に金属層を形成するような
した装飾体の製造方法。1. A black chrome plating layer and a non-conductive resin layer are sequentially formed on a metal substrate, and then the resin layer and the plating layer are partially removed to partially expose the metal substrate, which is then required. A method for producing a decorative body, in which a metal layer is formed on a metal substrate exposed according to the above.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP23742593A JP3177869B2 (en) | 1993-08-30 | 1993-08-30 | Method of manufacturing decorative body |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP23742593A JP3177869B2 (en) | 1993-08-30 | 1993-08-30 | Method of manufacturing decorative body |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0761199A true JPH0761199A (en) | 1995-03-07 |
| JP3177869B2 JP3177869B2 (en) | 2001-06-18 |
Family
ID=17015170
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP23742593A Expired - Fee Related JP3177869B2 (en) | 1993-08-30 | 1993-08-30 | Method of manufacturing decorative body |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3177869B2 (en) |
-
1993
- 1993-08-30 JP JP23742593A patent/JP3177869B2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JP3177869B2 (en) | 2001-06-18 |
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